JP2014533907A5 - - Google Patents

Download PDF

Info

Publication number
JP2014533907A5
JP2014533907A5 JP2014541778A JP2014541778A JP2014533907A5 JP 2014533907 A5 JP2014533907 A5 JP 2014533907A5 JP 2014541778 A JP2014541778 A JP 2014541778A JP 2014541778 A JP2014541778 A JP 2014541778A JP 2014533907 A5 JP2014533907 A5 JP 2014533907A5
Authority
JP
Japan
Prior art keywords
region
cell
electrode
collapse
membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014541778A
Other languages
English (en)
Japanese (ja)
Other versions
JP6265906B2 (ja
JP2014533907A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2012/056152 external-priority patent/WO2013072803A1/en
Publication of JP2014533907A publication Critical patent/JP2014533907A/ja
Publication of JP2014533907A5 publication Critical patent/JP2014533907A5/ja
Application granted granted Critical
Publication of JP6265906B2 publication Critical patent/JP6265906B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014541778A 2011-11-17 2012-11-05 円環形状の崩壊領域を持つ崩壊前の静電容量型トランスデューサーセル Expired - Fee Related JP6265906B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161560836P 2011-11-17 2011-11-17
US61/560,836 2011-11-17
PCT/IB2012/056152 WO2013072803A1 (en) 2011-11-17 2012-11-05 Pre-collapsed capacitive micro-machined transducer cell with annular-shaped collapsed region

Publications (3)

Publication Number Publication Date
JP2014533907A JP2014533907A (ja) 2014-12-15
JP2014533907A5 true JP2014533907A5 (https=) 2015-12-17
JP6265906B2 JP6265906B2 (ja) 2018-01-24

Family

ID=47324242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014541778A Expired - Fee Related JP6265906B2 (ja) 2011-11-17 2012-11-05 円環形状の崩壊領域を持つ崩壊前の静電容量型トランスデューサーセル

Country Status (9)

Country Link
US (2) US9762148B2 (https=)
EP (1) EP2747905B1 (https=)
JP (1) JP6265906B2 (https=)
CN (1) CN103958079B (https=)
BR (1) BR112014011644A2 (https=)
IN (1) IN2014CN03656A (https=)
MX (1) MX2014005795A (https=)
RU (1) RU2609917C2 (https=)
WO (1) WO2013072803A1 (https=)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2771132B1 (en) * 2011-10-28 2018-08-29 Koninklijke Philips N.V. Pre-collapsed capacitive micro-machined transducer cell with stress layer
JP6513674B2 (ja) * 2013-08-27 2019-05-15 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. デュアルモードcmutトランスデューサ
EP3038763A1 (en) * 2013-08-30 2016-07-06 Koninklijke Philips N.V. Capacitive micro-machined ultrasound transducer cell
US10743840B2 (en) 2013-09-27 2020-08-18 Koninklijke Philips N.V. Ultrasound transducer assembly and method for transmitting and receiving ultrasound waves
WO2017001636A1 (en) 2015-06-30 2017-01-05 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10656255B2 (en) * 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
JP6835954B2 (ja) * 2016-08-30 2021-02-24 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 超音波トランスデューサアレイを備える撮像装置
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
WO2019109010A1 (en) 2017-12-01 2019-06-06 Invensense, Inc. Darkfield tracking
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
EP3533386A1 (en) * 2018-02-28 2019-09-04 Koninklijke Philips N.V. Pressure sensing with capacitive pressure sensor
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
CN108793061B (zh) * 2018-05-25 2020-11-27 岭南师范学院 一种全电极凸纹结构cmut器件的制备方法
WO2020030776A1 (en) * 2018-08-09 2020-02-13 Koninklijke Philips N.V. Intraluminal device with capacitive pressure sensor
CN109530194B (zh) * 2018-10-18 2020-07-14 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
CN109909140B (zh) * 2019-03-06 2021-06-04 中国工程物理研究院电子工程研究所 一种压电微机械超声换能器及其制备方法
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
US12416807B2 (en) 2021-08-20 2025-09-16 Tdk Corporation Retinal projection display system
US12260050B2 (en) 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer
TWI814403B (zh) * 2022-05-26 2023-09-01 佳世達科技股份有限公司 超聲波換能器
DE102022120750A1 (de) * 2022-08-17 2024-02-22 Infineon Technologies Ag Vorrichtung mit Ultraschallwandler und Verfahren zur Herstellung derselben

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1407464B1 (en) * 2001-07-17 2011-03-09 SMC Kabushiki Kaisha Micro-electromechanical sensor
WO2005084284A2 (en) * 2004-02-27 2005-09-15 Georgia Tech Research Corporation Multiple element electrode cmut devices and fabrication methods
US20060004289A1 (en) * 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
JP4724505B2 (ja) * 2005-09-09 2011-07-13 株式会社日立製作所 超音波探触子およびその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US8203912B2 (en) * 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US10092270B2 (en) 2007-09-17 2018-10-09 Koninklijke Philips Electronics N.V. Pre-collapsed CMUT with mechanical collapse retention
CN101969856B (zh) * 2007-09-17 2013-06-05 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用
JP5408935B2 (ja) 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
US8559274B2 (en) 2007-12-03 2013-10-15 Kolo Technologies, Inc. Dual-mode operation micromachined ultrasonic transducer
CN101896288B (zh) * 2007-12-14 2013-03-27 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
WO2010032156A2 (en) 2008-09-16 2010-03-25 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasound transducer
EP2269746B1 (en) * 2009-07-02 2014-05-14 Nxp B.V. Collapsed mode capacitive sensor
JP2012095112A (ja) * 2010-10-27 2012-05-17 Olympus Corp 超音波発生ユニット

Similar Documents

Publication Publication Date Title
JP2014533907A5 (https=)
RU2014124363A (ru) Предварительно прижатая ячейка емкостного преобразователя, получаемого путем микрообработки, с прижатой областью кольцевой формы
JP2015526885A5 (https=)
JP2015529003A5 (https=)
WO2014037921A3 (en) A capacitor component
MX2018013327A (es) Microcapsulas recargables.
WO2015103244A3 (en) Flextensional transducers and related methods
JP2012169828A5 (https=)
WO2018021973A3 (en) Metamaterial split ring resonator, metamaterial split ring resonator array and energy harvesting apparatus
JP2015501537A5 (https=)
WO2012164053A3 (en) Plugging device
WO2012058543A3 (en) Drum assembly and method of assembling the drum assembly
JP2015186128A5 (https=)
WO2019056978A3 (zh) 一种片簧插孔接插件
JP2018037906A5 (https=)
WO2013020835A3 (en) Capsule formation
JP2018071724A5 (https=)
AU2018201705A1 (en) Diaphragm assembly, transducer and method of manufacture
WO2015110890A3 (en) Stator
CN103801502B (zh) 超声圆管换能器
JP2017139327A5 (https=)
TWI584525B (zh) 近場通訊天線
RU2017106322A (ru) Способ изготовления кольцевого формованного изделия и кольцевой материал для изготовления такого изделия
CN204784217U (zh) 可强化结构的伸缩式护套
CN204449146U (zh) 一种偏心式双环轧纹模具