JP2014523107A5 - - Google Patents

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Publication number
JP2014523107A5
JP2014523107A5 JP2014515327A JP2014515327A JP2014523107A5 JP 2014523107 A5 JP2014523107 A5 JP 2014523107A5 JP 2014515327 A JP2014515327 A JP 2014515327A JP 2014515327 A JP2014515327 A JP 2014515327A JP 2014523107 A5 JP2014523107 A5 JP 2014523107A5
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JP
Japan
Prior art keywords
assembly structure
housing
structure according
fixing
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014515327A
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English (en)
Japanese (ja)
Other versions
JP6001061B2 (ja
JP2014523107A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2012/052979 external-priority patent/WO2012172493A1/en
Publication of JP2014523107A publication Critical patent/JP2014523107A/ja
Publication of JP2014523107A5 publication Critical patent/JP2014523107A5/ja
Application granted granted Critical
Publication of JP6001061B2 publication Critical patent/JP6001061B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014515327A 2011-06-17 2012-06-13 固定装置及び組立構造体 Expired - Fee Related JP6001061B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11170300 2011-06-17
EP11170300.5 2011-06-17
PCT/IB2012/052979 WO2012172493A1 (en) 2011-06-17 2012-06-13 A fixation device and an assembly structure

Publications (3)

Publication Number Publication Date
JP2014523107A JP2014523107A (ja) 2014-09-08
JP2014523107A5 true JP2014523107A5 (enExample) 2015-07-30
JP6001061B2 JP6001061B2 (ja) 2016-10-05

Family

ID=44872122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014515327A Expired - Fee Related JP6001061B2 (ja) 2011-06-17 2012-06-13 固定装置及び組立構造体

Country Status (5)

Country Link
US (1) US9273832B2 (enExample)
EP (1) EP2721343B1 (enExample)
JP (1) JP6001061B2 (enExample)
CN (1) CN103635743B (enExample)
WO (1) WO2012172493A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5982752B2 (ja) * 2011-08-09 2016-08-31 セイコーエプソン株式会社 光源装置及びプロジェクター
CN104508366A (zh) * 2012-08-09 2015-04-08 普司科Led股份有限公司 Led照明装置
JP5927568B2 (ja) * 2012-11-28 2016-06-01 パナソニックＩｐマネジメント株式会社 照明装置及びホルダ
US10030853B2 (en) 2014-06-13 2018-07-24 Martin Professional Aps. LED screen comprising spring retainers for LED modules
AT517467B1 (de) * 2015-09-11 2017-02-15 Zkw Group Gmbh Lagereinrichtung für flächige Leuchten
CN109790970B (zh) 2016-08-09 2021-03-23 昕诺飞控股有限公司 可配置的光学模块和led组件
JP6803415B2 (ja) * 2019-01-30 2020-12-23 Hoya株式会社 回路基板固定構造、及びこれを備える光照射装置
US11032882B2 (en) 2019-09-06 2021-06-08 Robe Lighting S.R.O. Removable LED module with zonal intensity control
CN114667004B (zh) * 2020-12-23 2024-04-05 Abb瑞士股份有限公司 控制系统中的多模块组件以及固定多个模块的方法
TWI885993B (zh) * 2024-07-19 2025-06-01 宏碁股份有限公司 彈片元件、散熱模組及電子裝置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600298Y2 (ja) * 1992-06-22 1999-10-04 ローム株式会社 Ｌｅｄアレイプリントヘッドの構造
US6641284B2 (en) * 2002-02-21 2003-11-04 Whelen Engineering Company, Inc. LED light assembly
US7284881B2 (en) * 2004-03-31 2007-10-23 Ledo Co., Ltd. LED fixing device of a pixel module and method for manufacturing the same
JP3851911B2 (ja) 2004-05-26 2006-11-29 株式会社アドバネクス 発光ダイオードの固定装置及び固定構造
JP5103175B2 (ja) * 2004-11-01 2012-12-19 パナソニック株式会社 照明装置及び表示装置
US7918591B2 (en) * 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7744256B2 (en) 2006-05-22 2010-06-29 Edison Price Lighting, Inc. LED array wafer lighting fixture
WO2007128070A1 (en) * 2006-05-10 2007-11-15 Spa Electrics Pty Ltd Assembly including a fastening device
JP2008016362A (ja) * 2006-07-07 2008-01-24 Koito Mfg Co Ltd 発光モジュール及び車輌用灯具
US7938558B2 (en) * 2007-05-04 2011-05-10 Ruud Lighting, Inc. Safety accommodation arrangement in LED package/lens structure
EP2294620B1 (en) * 2008-05-27 2017-08-02 Cree, Inc. Method for led-module assembly
CN101629710A (zh) 2008-07-18 2010-01-20 富士迈半导体精密工业（上海）有限公司 照明装置
TWI407043B (zh) * 2008-11-04 2013-09-01 Advanced Optoelectronic Tech 發光二極體光源模組及其光學引擎
JP5282953B2 (ja) * 2008-11-21 2013-09-04 東芝ライテック株式会社 照明装置
TWM387195U (en) 2010-04-08 2010-08-21 Ge Investment Co Ltd LED illumination apparatus

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