JP2014240762A - Physical quantity detection sensor, acceleration sensor, electronic apparatus, and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a physical quantity detection sensor with shock resistance.SOLUTION: A physical quantity detection sensor includes: a cantilever part 101 having a base part 10, a movable part 14 connected to the base part 10 via a joint part 12, arm parts 20 extended from the base part 10, first fixing parts 30 provided on the arm parts 20, and a second fixing part 30d provided on the base part 10; a physical quantity detection element 70 connected to the base part 10 and the movable part 14; and a base substrate 102 to which the first fixing parts 30 and the second fixing part 30d are connected.

Description

  The present invention relates to a physical quantity detection sensor, an acceleration sensor, an electronic device, and a moving object.

Conventionally, an acceleration sensor that converts a physical quantity into an electrical signal has been used in electronic devices, moving objects, and the like. Along with the digitization of automobiles, robots, and various precision devices, development of a wide variety of monitoring, judgment, control, and the like has progressed, and applications for acceleration sensors are expanding. In automobiles, development using acceleration sensors is progressing in order to pursue safety and steering stability (body control).
As an example of the acceleration sensor, a bending portion provided with a strain gauge (piezoresistive element) inside a rectangular frame-shaped frame portion, and a rectangular plate-like weight portion connected to and supported by the bending portion are provided. A semiconductor acceleration sensor (acceleration sensor) is disclosed (see Patent Document 1). In this acceleration sensor, the weight portion is moved in a predetermined direction by the acceleration, so that the bending portion is distorted. Since this flexible part is easily damaged by strain, a countermeasure for reinforcing the flexible part has been proposed.

JP 2003-156510 A

However, the substrate of the semiconductor acceleration sensor described in Patent Document 1 is made of silicon (Si) and is formed by etching. In the semiconductor acceleration sensor substrate, there is a possibility that an etching residue is generated due to anisotropic etching to silicon in the manufacturing process.
For example, when a large impact is applied to this semiconductor acceleration sensor, stress concentrates at the intersection of etching residues, which may cause cracks in the substrate. Moreover, when the etching residue has arisen in the bending part connected with the weight part, operation | movement of the bending part became dull and it became impossible for a strain gauge to measure an acceleration with high detection accuracy.
That is, the conventional semiconductor acceleration sensor has a problem that the substrate is damaged due to stress concentration and the acceleration cannot be measured.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A physical quantity detection sensor according to this application example includes a base part, a movable part connected to the base part via a joint part, an arm part extending from the base part, A cantilever part having a first fixed part provided in the arm part and a second fixed part provided in the base part, a physical quantity connected to the base part and the movable part A detection element, and a base substrate to which the first fixing portion and the second fixing portion are connected are provided.

According to this application example, the base portion to which the physical quantity detection element is connected is directly connected to the base substrate by the second fixing portion, thereby improving the connection strength. Thereby, even when subjected to an impact or the like, the base portion and the base substrate are not easily peeled off, and a strong connection can be maintained. In other words, the connection strength between the cantilever part and the base substrate can be improved, and the impact resistance of the physical quantity detection sensor can be improved.
Further, the base part to which the physical quantity detection element is connected is connected to the base substrate by a first fixing part provided on an arm part extending from the base part. The arm portion is easily deformed (easy to bend), and this deformation (deflection) relieves stress generated due to a difference in thermal expansion coefficient between the base portion and the base substrate, and the influence of the stress affects the physical quantity detection element. This can be suppressed. Thereby, the physical quantity detection element can measure a physical quantity with high detection accuracy.
Accordingly, it is possible to provide a physical quantity detection sensor that has impact resistance and can measure a physical quantity with high detection accuracy.

  Application Example 2 In the physical quantity detection sensor according to the application example, the physical quantity detection element includes two base portions and a vibrating beam portion provided between the two base portions and disposed across the joint portion. The one base is connected to the base, and the other base is connected to the movable part.

  According to this application example, the physical quantity detection element is provided with the vibrating beam portion between the two base portions, one base portion is connected to the base portion, and the other base portion is connected to the movable portion. When added, the movable part is displaced, whereby stress is generated in the vibrating beam part, and the vibration frequency of the vibrating beam part is changed. As described above, since there is a physical quantity detection element connected between the base part and the movable part, the physical quantity can be measured as a change in the vibration frequency.

  Application Example 3 In the physical quantity detection sensor according to the application example, the first fixing part and the second fixing part are orthogonal to a first center line passing through the centers of the two base parts in plan view, And it is arrange | positioned in the asymmetrical position with respect to the 2nd centerline which passes along the center of the said cantilever part.

  According to this application example, the position of the first fixing portion of the arm portion connected to the base substrate and the position of the second fixing portion of the base portion are the first passing through the centers of the two base portions in plan view. Since the second center line that is orthogonal to the center line and passes through the center of the cantilever part is provided asymmetrically, the vibration of the physical quantity detection element is propagated to the first fixed part via the arm part. It is possible to suppress so-called vibration leakage and perform physical quantity measurement with high detection accuracy.

  Application Example 4 In the physical quantity detection sensor according to the application example described above, the arm part provided in the cantilever part located in the first region on one side with respect to the second center line in a plan view. And the number of the arm portions provided in the cantilever portion located in the second region on the other side are different from each other.

  According to this application example, the base part of the cantilever part located in the second region is provided with the second fixing part having a larger area than the first fixing part of the arm part. That is, when a physical quantity is applied to the physical quantity detection sensor by connecting the cantilever part and the base substrate, it is possible to suppress the influence of distortion of the cantilever part due to the rotational motion, ensuring the strength of the cantilever part, and It is possible to suppress damage due to stress concentration. Thereby, a physical quantity with high detection accuracy can be measured.

  Application Example 5 In the physical quantity detection sensor according to the application example described above, the cantilever part is made of quartz and is subjected to a wet etching process.

  According to this application example, since the cantilever part is made of quartz, there is little secular change and high reproducibility due to mechanical deformation (less hysteresis). Further, it is easy to strictly manage the thickness of the cantilever part, and a cantilever part having a uniform plate thickness can be obtained. Since the crystal is subjected to anisotropic wet etching, the base portion, the movable portion, the joint portion, and the arm portion constituting the cantilever portion can be precisely formed.

  Application Example 6 In the physical quantity detection sensor according to the application example, the crystal is cut out by a Z cut.

  According to this application example, the quartz crystal has an X axis called an electric axis, a Y axis called a mechanical axis, and a Z axis called an optical axis from a rough stone (Lambert) or the like, and an X axis orthogonal to the crystal crystal axis And a Z-cut quartz crystal substrate cut out along a plane defined by the Y axis and processed into a flat plate shape. A Z-cut quartz substrate can be easily etched due to its characteristics, and components and the like constituting a physical quantity detection sensor can be precisely formed. For example, the linear expansion coefficient (thermal expansion coefficient) can be approximated by making the cut-out angle in the thickness direction of the cantilever part and the cut-out angle in the thickness direction of the physical quantity detection element the same Z-cut. By using a material having an approximate linear expansion coefficient, thermal stress between the cantilever part and the physical quantity detection element due to a change in the ambient temperature is suppressed. That is, it is possible to provide a physical quantity detection sensor capable of measuring a physical quantity with high detection accuracy while suppressing thermal stress.

  Application Example 7 In the physical quantity detection sensor according to the application example described above, the joint portion includes a groove portion provided along the direction of the second center line in a plan view, and intersects with the direction in which the groove portion extends. The vibrating beam portion is arranged along the direction of the movement.

  According to this application example, the groove portion of the joint portion of the cantilever portion is provided along the direction of the second center line in plan view. In the physical quantity detection element, the vibrating beam portion is arranged along the direction intersecting the direction in which the groove portion extends. Thereby, for example, when a physical quantity is applied to the physical quantity detection sensor, it is possible to transmit the bending of the movable part of the cantilever part to the vibrating beam part of the physical quantity detection element as it is. Therefore, even a slight deflection of the movable part can be measured as a change in the resonance frequency of the vibrating beam part, and a decrease in detection sensitivity can be prevented.

  Application Example 8 In the physical quantity detection sensor according to the application example, the second fixing portion is provided in a third region on one side with respect to the first center line in a plan view, The number of the arm portions in the region is smaller than the number of the arm portions provided in the fourth region on the other side.

  According to this application example, the cantilever portion is provided in the fourth region with the second fixing portion and the arm portion provided in the third region with respect to the first center line in plan view. The number of arm portions provided in the third region is smaller than the number of arm portions. If the number of arm portions provided in the third region is small, the area of the base portion can be increased. The area of the base portion in the third region can be larger than the area of the base portion in the fourth region. Accordingly, the area of the second fixing portion in the third region can be increased, the cantilever portion can be connected to the base substrate in a large area, the strength of the cantilever portion can be ensured, and damage due to stress concentration can be prevented. Suppression is possible. Thereby, a physical quantity with high detection accuracy can be measured.

  Application Example 9 An acceleration sensor according to this application example includes the physical quantity detection sensor described in Application Examples 1 to 8, and is characterized in that acceleration is measured.

  According to this application example, the acceleration sensor described in the application example includes the physical quantity detection sensor of the application example. The physical quantity detection sensor can accurately detect the physical quantity by accurately displacing the movable part according to the physical quantity to which the movable part is added. An acceleration sensor equipped with such a physical quantity detection sensor can improve the reliability of measured acceleration.

  Application Example 10 An electronic device according to this application example is characterized in that the acceleration sensor described in Application Example 9 is mounted.

  According to this application example, the electronic device described in the application example includes the acceleration sensor of the application example. This acceleration sensor can accurately detect the applied acceleration. An electronic device equipped with such an acceleration sensor can improve the characteristics and reliability of the device.

  Application Example 11 A moving object according to this application example is characterized in that the acceleration sensor described in Application Example 9 is mounted.

  According to this application example, the mobile body described in the application example includes the acceleration sensor of the application example. This acceleration sensor can accurately detect the applied acceleration. A moving body equipped with such an acceleration sensor can surely grasp the moving state, posture, and the like by the detection function of the acceleration sensor, and can move safely and stably.

The top view of the physical quantity detection sensor concerning 1st Embodiment. FIG. 3 is a partial cross-sectional view taken along line B-B ′ in FIG. 1. Sectional drawing in line segment A-A 'of FIG. The perspective view which shows the physical quantity detection device with which the physical quantity detection sensor of FIG. 1 is provided. Sectional drawing in line segment C-C 'of FIG. (A), (b) is sectional drawing which shows operation | movement of the physical quantity detection device in line segment C-C 'of FIG. (A), (b) is a top view of the cantilever with which the physical quantity detection sensor is provided. The top view which shows an example of the cantilever part with which the physical quantity detection sensor of FIG. 1 is provided. Sectional drawing in line segment A-A 'of the state with which the physical quantity detection sensor of FIG. 1 is equipped with the electronic circuit. The top view of the physical quantity detection sensor concerning 2nd Embodiment. FIG. 11 is a cross-sectional view taken along line D-D ′ in FIG. 10. (A) Perspective view showing a video camera which is an electronic device equipped with a physical quantity detection sensor, (b) Perspective view showing a mobile phone which is an electronic equipment equipped with a physical quantity detection sensor, (c) Physical quantity detection sensor The perspective view which shows the motor vehicle which is a moving body by which is mounted.

  Hereinafter, an embodiment according to the present invention will be described with reference to the drawings. In each figure shown below, the size and ratio of each component may be described differently from the actual component in order to make each component large enough to be recognized on the drawing. is there.

(First embodiment)
[Physical quantity detection sensor]
A physical quantity detection sensor according to the first embodiment will be described with reference to FIGS. 1 and 3.
FIG. 1 is a plan view showing a configuration of a physical quantity detection sensor 100 according to the first embodiment. FIG. 3 is a cross-sectional view showing a configuration of the physical quantity detection sensor 100, and is a cross-sectional view of a portion indicated by a line segment AA ′ in FIG. 1 and 3 show the X axis, the Y axis, and the Z axis as three axes orthogonal to each other. The Z axis is an axis indicating the direction in which gravity acts.
For convenience of explanation, the lid 103 is not shown in FIG.
In the present embodiment, viewing the physical quantity detection sensor 100 from the Z-axis direction will be described as a planar view.

As shown in FIGS. 1 and 3, the physical quantity detection sensor 100 includes a physical quantity detection device 110 and a package 120. The package 120 includes a base substrate 102 and a lid 103.
The base substrate 102 has a recess 106, and the physical quantity detection device 110 is accommodated in the recess 106. The shape of the base substrate 102 is not particularly limited as long as the physical quantity detection device 110 can be accommodated in the recess 106.
In this embodiment, the base substrate 102 is formed of a material having a thermal expansion coefficient that matches or is as close as possible to that of the cantilever portion 101 and the lid 103, and in this example, ceramic is used. However, the present invention is not limited to this, and materials such as quartz, glass, and silicon may be used.

  The base substrate 102 of the present embodiment includes an inner bottom surface 109a that is a bottom surface inside the recess 106, and a stepped portion 108 (108a, 108b) that protrudes from the inner bottom surface 109a to the lid 103 side.

The step portions 108 a and 108 b are provided to fix a physical quantity detection device 110 described later to the base substrate 102, and are provided in, for example, a substantially L shape along two directions of the inner wall of the recess 106. Specifically, the stepped portion 108a is continuously provided with a predetermined width along the inner wall in the −X-axis direction and the inner wall in the −Y-axis direction of the recess 106 in plan view. The step 108b is continuously provided with a predetermined width along the inner wall in the + X-axis direction and the inner wall in the −Y-axis direction of the recess 106 in plan view.
In plan view, an internal terminal 34a included in a first fixing portion 30a described later is provided on the surface in the + Z-axis direction of the step portion 108a, and a surface in the + Z-axis direction of the step portion 108b is provided on the surface in the + Z-axis direction. An internal terminal 34b included in a first fixing portion 30b described later is provided.

  External terminals 107 (107a, 107b) used for mounting on external members are provided on the outer bottom surface 109b, which is the surface opposite to the inner bottom surface 109a of the base substrate 102. The external terminal 107 is electrically connected to the internal terminals 34a and 34b via internal wiring (not shown). For example, the external terminal 107a is electrically connected to the internal terminal 34a, and the external terminal 107b is electrically connected to the internal terminal 34b.

  The internal terminals 34a and 34b and the external terminals 107a and 107b are, for example, metal films formed by coating a metallized layer such as tungsten (W) with a thin film such as nickel (Ni) or gold (Au) by a method such as plating. It consists of

  The base substrate 102 is provided with a through hole 92 penetrating from the outer bottom surface 109b to the inner bottom surface 109a, and the inside (cavity) of the package 120 is sealed in the through hole 92 formed in the base substrate 102. The sealing part 90 which stops is provided. In the example shown in FIG. 3, the through hole 92 has a stepped shape in which the hole diameter on the outer bottom surface 109 b side is larger than the hole diameter on the inner bottom surface 109 a side. The sealing part 90 can be provided in the through-hole 92 by placing a sealing material made of, for example, an alloy of gold (Au) and germanium (Ge), solder, or the like, solidified after heating and melting. The sealing unit 90 is provided to hermetically seal the inside of the package 120.

  The lid 103 is provided so as to cover the concave portion 106 of the base substrate 102. The shape of the lid 103 is, for example, a plate shape. As the lid 103, the same material as the base substrate 102, a metal such as Kovar or stainless steel, or the like is used. The lid 103 is bonded to the base substrate 102 via a lid bonding material 105. As the lid bonding material 105, for example, a seal ring, a low melting point glass, an inorganic adhesive, or the like may be used.

  The interior of the package 120 is sealed after the base substrate 102 and the lid 103 are joined. The air in the recess 106 is extracted from the through-hole 92 and decompressed, and the through-hole 92 is sealed by a method of closing with a sealing portion 90 such as a sealing material, whereby the physical quantity detection device 110 is decompressed and airtight. Is placed in the concave portion 106. Note that the inside of the recess 106 may be filled with an inert gas such as nitrogen, helium, or argon. Further, the lid 103 may be formed in a concave shape, and the base substrate 102 may be a flat plate.

[Physical quantity detection device]
Next, the physical quantity detection device 110 will be described with reference to FIGS. FIG. 2 is an enlarged cross-sectional view of a portion indicated by a line segment BB ′ in FIG. FIG. 4 is a perspective view showing the configuration of the physical quantity detection device 110 provided in the physical quantity detection sensor 100 of FIG. FIG. 5 is a cross-sectional view of a portion indicated by a line segment CC ′ in FIG. 6A and 6B are cross-sectional views of a portion indicated by a line segment CC ′ in FIG. 4, and an operating state when a physical quantity is applied to the physical quantity detection device 110 in the Z-axis direction. Is shown. FIG. 7A and FIG. 7B are plan views showing the cantilever unit 101 provided in the physical quantity detection device 110. FIG. 8 is a plan view illustrating an example of the cantilever unit 101 included in the physical quantity detection device 110.
2 and FIGS. 4 to 8 illustrate the X axis, the Y axis, and the Z axis as three axes orthogonal to each other. The Z axis is an axis indicating the direction in which gravity acts.

As shown in FIGS. 3 and 4, the physical quantity detection device 110 is a cantilever part 101 fixed to the base substrate 102, and a physical quantity detection element that is fixed to the cantilever part 101 and detects a physical quantity, for example, acceleration. 70 and mass parts 80 and 82 which are fixed to the cantilever part 101 and serve as weights.
The physical quantity detection element 70 is disposed on the inner bottom surface 109 a side of the cantilever part 101.

First, the cantilever part 101 is demonstrated using FIG.1, FIG.4, FIG.7 and FIG.
The cantilever part 101 includes a base part 10, a joint part 12, a movable part 14, a flat part 15, an arm part 20 (20a, 20b, 20c), a first fixing part 30 (30a, 30b, 30c), It has the 2nd fixing | fixed part 30d and the suppression parts 40a and 40b.

  The base portion 10 has a plate shape and has a gap in the center portion in plan view. Similarly, a plate-like movable portion 14 is provided in the gap, and the movable portion 14 and the base portion 10 are connected via the joint portion 12. Arms 20 (20a, 20b, 20c) are provided at the corners of the base 10. Moreover, the base part 10 has the main surfaces 10a and 10b (refer FIG. 4) which are mutually opposed and are the front and back relationship. Specifically, the main surface 10 a faces the lid 103 side with respect to the base portion 10, and the main surface 10 b faces the inner bottom surface 109 a side with respect to the base portion 10.

  The joint portion 12 is provided between the base portion 10 and the movable portion 14 and is connected to the base portion 10 and the movable portion 14. The thickness of the joint portion 12 (length in the Z-axis direction) is thinner (shorter) than the thickness of the base portion 10 and the thickness of the movable portion 14. For example, the joint portion 12 has bottomed groove portions 12a and 12b (see FIG. 5) formed by a so-called half-etching process from a main surface 14a and a main surface 14b described later.

  In the present embodiment, the groove portions 12a and 12b are provided extending along the X-axis direction. When the movable part 14 is displaced (rotated) with respect to the base part 10, the joint part 12 serves as a rotation axis along the X-axis direction as a fulcrum (intermediate hinge).

The movable part 14 extends from the base part 10. Specifically, the movable portion 14 is provided along the Y-axis direction from the base portion 10 through the joint portion 12. The movable portion 14 has a plate shape, and has main surfaces 14a and 14b (see FIG. 5) that face each other and have a front-back relationship. Further, the main surface 14 a faces the lid 103 side with respect to the movable portion 14, and the main surface 14 b faces the inner bottom surface 109 a side with respect to the movable portion 14.
The movable portion 14 has a principal surface with the joint portion 12 as a fulcrum (rotation axis) according to a physical quantity applied in a direction (Z-axis direction) intersecting the principal surfaces 14a and 14b, for example, accelerations α1 and α2 (see FIG. 6). Displacement is possible in the direction intersecting 14a and 14b (Z-axis direction).

The movable portion 14 is provided with mass portions 80 and 82 that function as weights. Specifically, the mass portion 80 is provided on the main surface 14a via the mass bonding material 86, and the mass portion 82 is provided on the main surface 14b via the mass bonding material 86 so as to overlap the mass portion 80 in plan view. It has been.
The shape of the mass portions 80 and 82 is a plate shape. For example, as shown in FIG. 1, a concave shape in which a part of one side in the longitudinal direction is recessed on the opposite side in plan view is used. It is preferable. The shapes of the mass portions 80 and 82 are not limited to the shapes described above as long as the movable portion 14 can perform a predetermined operation.

  For example, phosphor bronze (Cu—Sn—P) is preferably used as the material of the mass parts 80 and 82. In addition, the material of the mass parts 80 and 82 is not limited to phosphor bronze. For example, a metal such as copper (Cu) or gold (Au) may be used. Moreover, as a material of the mass bonding material 86, for example, a thermosetting adhesive containing a silicone resin may be used.

  In the present embodiment, each of the main surfaces 14 a and 14 b of the movable portion 14 is provided with one mass portion 80 and 82. However, the present invention is not limited to this, and one or a plurality of mass parts 80, 82 may be provided on either one of the main surfaces 14a, 14b, or a plurality of mass parts may be provided on each of the main surfaces 14a, 14b. 80 and 82 may be provided.

  Here, the arm portions 20a, 20b, and 20c of the cantilever portion 101 will be described. The arm portions 20a, 20b, and 20c are substantially L-shaped in a plan view and are provided with a predetermined width.

The arm portion 20a is provided to extend in the −X axis direction from the + Y direction end of the base portion 10 in plan view, and is provided to extend along the outer periphery of the base portion 10 in the −Y axis direction. ing.
The arm portion 20a has an installation area for the first fixing portion 30a on the main surface 10b side at a position where the tip of the arm portion 20a and the stepped portion 108a overlap in plan view. The first fixing portion 30a includes a fixing portion connecting terminal 36a, a bonding material 35, and an internal terminal 34a of the step portion 108a on the main surface 10b side (see FIG. 2). Further, the fixed portion connection terminal 36a is connected so as to overlap the internal terminal 34a via the bonding material 35 in a plan view.
Accordingly, the arm portion 20a (cantilever portion 101) is connected to the step portion 108a (base substrate 102) via the first fixing portion 30a.

The arm portion 20b is provided to extend in the + X-axis direction from the end portion in the + Y direction of the base portion 10 in plan view, and is provided to extend along the outer periphery of the base portion 10 in the -Y-axis direction. Yes.
The arm portion 20b has an installation area for the first fixing portion 30b on the main surface 10b side where the tip of the arm portion 20b and the stepped portion 108b overlap in plan view. The first fixing portion 30b is configured to include the fixing portion connecting terminal 36b, the bonding material 35, and the internal terminal 34b of the stepped portion 108b on the main surface 10b side (the configuration is substantially the same as FIG. (See FIG. 2). Further, the fixed portion connection terminal 36b is connected so as to overlap the internal terminal 34b through the bonding material 35 in plan view.
Thus, the arm portion 20b (cantilever portion 101) is connected to the step portion 108b (base substrate 102) via the first fixing portion 30b.

  As the bonding material 35, for example, a silicone resin-based conductive adhesive containing a conductive material such as a metal filler may be used.

The arm portion 20c is provided so as to extend in the −Y axis direction from a substantially central portion of the end portion in the −X axis direction of the base portion 10 in plan view, and further along the outer periphery of the base portion 10 in the + X axis direction. It is extended and provided.
The arm portion 20c has a base joint portion 50b that is an installation region of the base joint material 52 on the main surface 10b side at a position where the tip of the arm portion 20c and the stepped portion 108a overlap in plan view. The 1st fixing | fixed part 30c is comprised including the base joining material 52 and the base joining part 50b provided in the base joining part 50b.
Accordingly, the arm portion 20c (cantilever portion 101) is connected to the step portion 108a (base substrate 102) via the first fixing portion 30c.

The base portion 10 has a base joint portion 50a that is an installation region of the base joint material 52 on the main surface 10b side at a position where the flat portion 15 of the base portion 10 and the stepped portion 108b overlap in a plan view. ing. The second fixing portion 30d includes the base bonding material 52 and the base bonding portion 50a provided in the base bonding portion 50a.
Thus, the base portion 10 (cantilever portion 101) is connected to the step portion 108b (base substrate 102) through the second fixing portion 30d.

  For the base bonding material 52, for example, a bismaleimide resin is preferably used.

Here, the configuration of the arm portion 20 and the like of the cantilever portion 101 will be described with reference to FIGS. 7A and 7B.
In this description, in plan view, the first center line L1 passing through the centers of the two bases 72 of the physical quantity detection element 70 and the second center line orthogonal to the first center line L1 and passing through the center of the cantilever part 101 are shown. This will be described using the center line L2.
For convenience of explanation, the + Y direction side of the first center line L1 in FIG. 7 is “upper”, the −Y direction side is “lower”, the −X direction side of the second centerline L2 is “left”, + X The direction side is called “right”.
In the cantilever portion 101, the upper region is the first region S1, the lower region is the second region S2, and the right region is the right region with respect to the first center line L1. The third region S3 and the left region are referred to as a fourth region S4.
The first region S1 is provided with an arm portion 20a, a first fixing portion 30a, an arm portion 20b, and a first fixing portion 30b. In the second region S2, the arm portion 20c, the first fixing portion 30c, and the first fixing portion 30b are provided. 2 fixing | fixed part 30d is provided (refer Fig.7 (a)).
Further, the arm portion 20b, the first fixing portion 30b, and the second fixing portion 30d are provided in the third region S3, and the arm portion 20a, the first fixing portion 30a, and the arm portion 20c are provided in the fourth region S4. The 1st fixing | fixed part 30c is provided (refer FIG.7 (b)).

  Here, each arm part which each area | region of the cantilever part 101 has and each fixing | fixed part are demonstrated.

First, each fixing part in each region will be described with reference to FIG. In a plan view of the cantilever part 101, the first fixing part 30a of the arm part 20a in the first area S1 (upper side), the first fixing part 30b of the arm part 20b, and the second area S2 (lower side). The first fixing portion 30c and the second fixing portion 30d of the arm portion 20c are disposed at asymmetric positions with respect to the second center line L2. The second fixing portion 30d has a larger area in the base portion 10 than the first fixing portion 30c.
Since the first fixed portion 30 and the second fixed portion 30d of the arm portion 20 are disposed at asymmetric positions with respect to the second center line L2, the vibration of the physical quantity detection element 70 is transmitted via the arm portion 20. Therefore, it is possible to suppress so-called vibration leakage and to measure a physical quantity, for example, acceleration.
When acceleration is applied to the physical quantity detection sensor 100, the second fixed portion 30d of the second region S2 has a large area and is connected to the base portion 10, so that distortion of the cantilever portion 101 due to rotational movement is suppressed. can do.

Next, each arm part in each region will be described with reference to FIG.
In plan view of the cantilever portion 101, the arm portion 20a and the arm portion 20b in the first region S1 (upper side) and the arm portion 20c in the second region S2 (lower side) have a second center line L2. On the other hand, the number of arms 20 is different. The number of the arm portions 20 including the first fixing portions 30 connected to the base substrate 102 is different between the first region S1 and the second region S2 with respect to the second center line L2 in plan view. It is provided as follows.
Since the number of the arm portions 20 in the second region S2 is smaller than that of the arm portions 20 in the first region S1, the area of the second fixing portion 30d of the base portion 10 increases, and the base substrate 102 is increased. This means that the area to connect with increases. When a physical quantity, for example, acceleration is applied to the physical quantity detection sensor 100, the second fixing portion 30d of the base portion 10 is provided on the side where the number of the arm portions 20 including the first fixing portion 30 is small. Thus, the influence of the distortion of the cantilever portion 101 due to the rotational motion can be suppressed by the second fixing portion 30 d of the base portion 10.

The number of arms in each area will be described with reference to FIG.
In this description, the description will be made using the third region S3 (right side) and the fourth region S4 (left side) with respect to the first center line L1 in plan view. The number of arm portions 20 in the third region S3 is smaller than the number of arm portions 20 in the fourth region S4. In the third region S3, a second fixing portion 30d is provided instead of a small number of arm portions 20. By reducing the number of arm portions 20 in the third region S3 and eliminating the gaps in which the arm portions 20 are formed, the base portion 10 in the third region S3 can be expanded. By expanding the base portion 10 in the third region S3, the rigidity of the base portion 10 is increased and the area of the second fixing portion 30d is widened, so that the connection between the base substrate 102 and the cantilever portion 101 is achieved. The strength of is maintained.

  For example, the cantilever portion 101 is subjected to a process such as wet etching on a quartz substrate or the like, so that the base portion 10, the movable portion 14, the joint portion 12, and the arm portion 20 (20a, 20b, 20c) are formed. . As the material, a plate-shaped quartz substrate (also referred to as “Z cut plate”) positioned along the XY plane is used.

  The above-described quartz substrate is subjected to wet etching and is provided with an arm portion 20 and the like. When the quartz substrate is subjected to wet etching, etching proceeds along the Z-axis. Since the crystal has an etching anisotropy peculiar to the crystal in which the etching speed changes depending on the direction of each crystal axis, the etching residue 140 (so-called “so-called“ Fin ") occurs (see FIG. 8). For example, when the quartz substrate is a Z-cut plate, the etching residue 140 is generated from the intersection of the + X axis direction and the ± Y axis direction toward the −X axis direction.

  For example, when an impact is applied to the cantilever portion 101 where the etching residue 140 is generated, the stress of the impact is concentrated at a location where the etching residue 140 is generated. Due to this stress concentration, the cantilever portion 101 may be damaged.

  Therefore, the cantilever part 101 as described above needs to increase the rigidity of the portion where the etching residue 140 is generated. For example, the arm portions 20a, 20b, and 20c of the cantilever portion 101 are widened, and the base portion 10 in which the etching residue 140 is easily generated is solidified.

In the cantilever part 101, the part where the etching residue 140 is likely to be generated will be described.
In this description, in the plan view from the lid 103 side, the third region S3 in the + X axis direction and the fourth region S4 in the −X axis direction are described with respect to the first center line L1. .
As described above, the etching residue 140 is generated in the −X axis direction from the intersection between the + X axis direction and the ± Y axis direction when the quartz substrate is a Z-cut plate. Accordingly, the etching residue 140 is likely to be generated in the base portion 10 in the third region S3 of the cantilever portion 101.

In the present embodiment, since the flat portion 15 is provided in the base portion 10 in the third region S3, the etching residue 140 generated in the base portion 10 is reduced, and the cantilever portion 101 is not damaged due to stress concentration. It is suppressed. Further, since the base portion 10 in the third region S3 is provided with the flat portion 15 and the second fixing portion 30d, the number of arm portions provided in the fourth region S4 and the third portion This is different from the number of arms provided in the region S3.
In the present embodiment, the flat portion 15 is provided in the base portion 10 in the third region S3. However, both sides of the fourth region S4 or the third region S3 and the fourth region S4 are provided. A flat portion 15 may be provided on the base portion 10.

The physical quantity detection device 110 of this embodiment detects, for example, physical quantities applied to the physical quantity detection device 110, for example, accelerations α1 and α2 (see FIG. 6). It is repeating. The vibration is propagated as parasitic vibration (spurious) to the base portion 10 to which the physical quantity detection element 70 is connected and the arm portion 20a, and reaches the first fixed portion 30a.
Here, the 1st fixing | fixed part 30a is provided in the main surface 10b side connected with the level | step-difference part 108a (base substrate 102). The fixed portion connection terminal 36a of the first fixed portion 30a is connected via the bonding material 35 so as to overlap with the internal terminal 34a of the stepped portion 108a in plan view. Therefore, when the step portion 108a and the first fixing portion 30a are connected, the first fixing portion 30a can selectively connect the main surface 10b side and the step portion 108a.

Therefore, when spurious (parasitic vibration) generated from the physical quantity detection element 70 is propagated to the arm portion 20a via the base portion 10, the position where the arm portion 20a is fixed to the step portion 108a is constant. The spurious resonance frequency at 20a is kept constant.
In addition, since the structure of the arm part 20b is the same as the arm part 20a, detailed description of the arm part 20b is abbreviate | omitted. Moreover, since the structure of the 1st fixing | fixed part 30b is also the same as the 1st fixing | fixed part 30a, detailed description of the 1st fixing | fixed part 30b is abbreviate | omitted.

  In the arm portion 20 c, the first fixing portion 30 c is selectively connected to the main surface 10 b side and the stepped portion 108 b (base substrate 102) via the base bonding material 52 as described above. Accordingly, when spurious (parasitic vibration) generated from the physical quantity detection element 70 is propagated to the arm portion 20c via the base portion 10, the position where the arm portion 20c is fixed to the stepped portion 108b is constant. The spurious resonance frequency at 20c is kept constant.

  In addition, a distortion stress generated due to a difference in thermal expansion coefficient between the base unit 10 and the base substrate 102 may be transmitted to the physical quantity detection element 70. In that case, the elastic structure of the arm portions 20a, 20b, 20c extending from the base portion 10 makes it easy to be deformed (easy to bend), and the stress can be relieved by this deformation (deflection).

  Next, the suppression units 40a and 40b will be described. The base portion 10 is provided with a restraining portion 40a near the base portion 10 of the arm portion 20a, and is provided with a restraining portion 40b near the base portion 10 of the arm portion 20b. The effect | action of the suppression parts 40a and 40b is mentioned later.

[Physical quantity detection element]
As shown in FIGS. 1, 3, and 4, the physical quantity detection element 70 includes two base parts 72 (72 a, 72 b) and a vibrating beam part 71 (71 a, 71 b) provided between the base parts 72 a, 72 b. The two base portions 72 are provided across the joint portion 12 by being connected to the base portion 10 (main surface 10b) and the movable portion 14 (main surface 14b), respectively.
In the physical quantity detection element 70 of the present embodiment, for example, when the movable part 14 is displaced according to the physical quantity, stress is generated in the vibrating beam parts 71a and 71b, and the physical quantity detection information generated in the vibrating beam parts 71a and 71b changes. To do. In other words, the vibration frequency (resonance frequency) of the vibrating beam portions 71a and 71b changes. In the present embodiment, the physical quantity detection element 70 is a double tuning fork element (double tuning fork type vibration element) having two vibrating beam portions 71a and 71b and a pair of base portions 72a and 72b.

  The vibrating beam portions 71a and 71b are provided to extend between the base portion 72a and the base portion 72b along the Y-axis direction in which the movable portion 14 extends. The shape of the vibrating beam portions 71a and 71b is, for example, a prismatic shape. The vibration beam portions 71a and 71b are bent so as to be separated from or close to each other along the X-axis direction when a drive signal is applied to excitation electrodes (not shown) provided on the vibration beam portions 71a and 71b. Vibrate.

  The bases 72a and 72b are connected to both ends in the extending direction of the vibrating beam portions 71a and 71b. The base portion 72 a is connected to the main surface 10 b of the base portion 10 via the detection element bonding material 84. The base portion 72 b is connected to the main surface 14 b of the movable portion 14 via the detection element bonding material 84. As the detection element bonding material 84, for example, a low melting point glass or an alloy film of gold (Au) and tin (Sn) capable of eutectic bonding may be used.

  The physical quantity detection element 70 in the present embodiment is formed, for example, by patterning a quartz substrate cut out from a so-called quartz ore at a predetermined angle by a photolithography technique and an etching technique. Thereby, the vibrating beam portions 71a and 71b and the base portions 72a and 72b can be integrally formed.

Note that the material of the physical quantity detection element 70 is not limited to the above-described quartz substrate. For example, lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), lead zirconate titanate (PZT), zinc oxide (ZnO), aluminum nitride (AlN) A piezoelectric material such as) may be used. Alternatively, a semiconductor material such as silicon provided with a piezoelectric (piezoelectric material) film such as zinc oxide (ZnO) or aluminum nitride (AlN) may be used.

On the base portion 72a of the physical quantity detection element 70, for example, an extraction electrode (not shown) is provided. The extraction electrode is electrically connected to excitation electrodes (not shown) provided on the vibrating beam portions 71a and 71b.
The lead electrode is electrically connected to a connection terminal (not shown) provided on the main surface 10b of the base portion 10 by, for example, a metal wire (not shown) such as gold (Au) or aluminum (Al). Yes.

  The connection terminals are electrically connected to the fixed portion connection terminals 36a and 36b by wiring (not shown).

  As the excitation electrode, the lead electrode, the connection terminal, and the fixed portion connection terminals 36a and 36b, for example, a laminate in which a chromium (Cr) layer is used as a base and a gold (Au) layer is stacked thereon is used. The excitation electrode, the lead electrode, the connection terminal, and the fixed portion connection terminals 36a and 36b are provided by forming a conductive layer by, for example, sputtering, and patterning the conductive layer.

  In the physical quantity detection element 70 in the present embodiment, vibration beam portions 71a and 71b provided between two base portions 72a and 72b are arranged so as to intersect (orthogonal) the joint portion 12. In other words, the vibrating beam portions 71a and 71b are arranged along the direction intersecting with the extending direction of the groove portions 12a and 12b. Thereby, for example, the bending of the movable portion 14 when acceleration is applied can be transmitted to the vibrating beam portions 71a and 71b as it is. Therefore, even slight bending of the movable portion 14 can be detected as a change in the resonance frequency of the vibrating beam portions 71a and 71b, and a reduction in detection sensitivity can be prevented.

  The physical quantity detection element 70 is provided on the main surface 10b on the inner bottom surface 109a side and the main surface 14b with respect to the base portion 10, but on the main surface 10a on the lid 103 side with respect to the base portion 10, A configuration provided on the main surface 14a is also conceivable.

[Physical quantity detection device operation]
Next, the operation of the physical quantity detection device 110 will be described.
FIG. 6 is a cross-sectional view for explaining the operation of the physical quantity detection device 110. In FIG. 6, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other. The Z axis is an axis indicating the direction in which gravity acts.

  As shown in FIG. 6A, for example, when an acceleration α1 (acceleration applied in the direction of gravity) is applied to the physical quantity detection device 110 in the −Z-axis direction, the movable portion 14 is connected to the joint portion according to the acceleration α1. Displacement in the −Z-axis direction with 12 as a fulcrum. As a result, a force (tension) in the direction of arrow β1 (away from each other) is applied to the base 72a and the base 72b along the Y axis in the physical quantity detection element 70, and the direction of the arrow β1 is applied to the vibrating beam portions 71a and 71b. Tensile stress is generated. Therefore, the vibration frequency (resonance frequency) of the vibration beam portions 71a and 71b is increased.

  On the other hand, as shown in FIG. 6B, for example, when an acceleration α2 (acceleration applied in the direction opposite to the gravity direction) is applied to the physical quantity detection device 110 in the + Z-axis direction, 14 is displaced in the + Z-axis direction with the joint portion 12 as a fulcrum. Thereby, a force (compression force) in the direction of arrow β2 (approaching each other) is applied to the base 72a and the base 72b along the Y axis in the physical quantity detection element 70, and the arrow β2 is applied to the vibrating beam portions 71a and 71b. Compressive stress in the direction is generated. Therefore, the vibration frequency (resonance frequency) of the vibrating beam portions 71a and 71b is lowered.

  As shown in FIGS. 6 (a), 6 (b), the suppression units 40a, 40b (see FIGS. 1, 4, and 5), for example, have accelerations α1, α2 applied in the Z-axis direction having a predetermined magnitude. If it is larger, the movable part 14 is displaced and comes into contact with the mass parts 80 and 82 connected to the movable part 14. Therefore, the displacement of the movable part 14 in the Z-axis direction is restricted within a predetermined range by the restraining parts 40a and 40b. Thereby, damage to the physical quantity detection device 110 (cantilever part 101) caused by excessive displacement of the movable part 14 is suppressed.

  The physical quantity detection sensor 100 may be equipped with an electronic circuit 150 that processes an output signal output from the physical quantity detection device 110. Here, the physical quantity detection sensor 100 on which the electronic circuit 150 is mounted will be described with reference to FIG. FIG. 9 is a cross-sectional view of a portion indicated by line A-A ′ in FIG. 1 in a state where the electronic circuit 150 of the physical quantity detection sensor 100 of the present embodiment is mounted. In FIG. 9, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other. The Z axis is an axis indicating the direction in which gravity acts.

In the physical quantity detection sensor 100 shown in FIG. 9, an electronic circuit 150 is provided in the recess 106 of the base substrate 102.
In the physical quantity detection sensor 100, a drive signal is given from the electronic circuit 150 to the excitation electrode (not shown) of the physical quantity detection device 110 via the internal terminals 34a and 34b (not shown).
When a drive signal is given, the vibrating beam portions 71a and 71b of the physical quantity detection element 70 bend and vibrate (resonate) at a predetermined frequency. In the physical quantity detection sensor 100, the physical quantity detection element 70 changes according to the applied accelerations α1 and α2. The resonance frequency output from the physical quantity detection element 70 due to the change is amplified by the electronic circuit 150 and is output from the external terminals 107a and 107b to the outside of the physical quantity detection sensor 100 through wiring not shown.

  The physical quantity detection sensor 100 may be used as an inclination sensor in addition to the acceleration sensor capable of detecting the acceleration described above. When the direction in which gravity acceleration is applied to the physical quantity detection sensor 100 changes according to the change in posture due to the tilt, the physical quantity detection sensor 100 as the tilt sensor bends due to the weight of the mass parts 80 and 82, and the physical quantity detection sensor 100 detects the physical quantity. Tensile stress and compressive stress are generated in the vibrating beam portions 71 a and 71 b of the element 70. Then, the resonance frequencies of the vibrating beam portions 71a and 71b change. Based on the change, the posture state due to the inclination is derived.

  As described above, according to the physical quantity detection sensor 100 according to the first embodiment, the following effects can be obtained.

  According to the first embodiment, the base portion 10 is solidified (flat portion 15) where the etching residue 140 is generated in shape, whereby the rigidity of the base portion 10 can be increased. The main surface 10b of the base part 10 is provided with a second fixing part 30d (base bonding material 52), and the base part 10 and the base substrate 102 are directly connected via the second fixing part 30d. That is, the base portion 10 and the base substrate 102 are connected by the base bonding material 52. Therefore, even when an impact or the like is applied to the physical quantity detection sensor 100, the base portion 10 and the base substrate 102 are difficult to peel off, and a strong connection can be maintained. Accordingly, it is possible to provide the physical quantity detection sensor 100 that can suppress the displacement of the base substrate 102 and the moment of rotation and suppress the breakage of the cantilever portion 101 and the physical quantity detection element 70.

  Further, in the case where a strain stress caused by a difference in thermal expansion coefficient between the base portion 10 and the base substrate 102 is propagated to the physical quantity detection element 70, the arm portions 20a, It is possible to provide the physical quantity detection sensor 100 that can be easily deformed (easily bent) by the elastic structure of 20b and 20c, and that can relieve stress by the deformation (deflection).

  In addition, the physical quantity detection sensor 100 of the present embodiment is equipped with the physical quantity detection device 110 described above, so that each bonding material (30a, 30b, 30c) and each bonding material included in the second fixing part 30d ( The area where the bonding material 35 and the base bonding material 52 are connected to the base substrate 102 (steps 108a and 108b) is kept constant. In other words, the connection area between the first fixing part 30 (30a, 30b, 30c) and the second fixing part 30d and the base substrate 102 (step parts 108a, 108b) is suppressed.

  Therefore, even when the spurious generated from the physical quantity detection element 70 is propagated to the first fixing portion 30 (30a, 30b, 30c) and the second fixing portion 30d through the base portion 10, the area and position to be fixed are fixed. Therefore, the spurious resonance frequency is kept constant.

  In addition, the physical quantity detection element 70 in the physical quantity detection sensor 100 according to the present embodiment is connected (fixed) to the base unit 10 and the movable unit 14. Thereby, since both ends (bases 72a and 72b) of the physical quantity detection element 70 are fixed, the vibration other than the vibration of the physical quantity detection element 70 is prevented from being detected as noise. Further, it is possible to provide a physical quantity detection sensor 100 capable of suppressing the influence of the distortion of the detection element bonding material 84 and the distortion due to the difference in the thermal expansion coefficient from the base substrate 102 and suppressing the damage of the physical quantity detection element 70. Can do.

  The physical quantity detection sensor 100 is a sensor with high detection accuracy that allows the movable portion 14 to be displaced according to the applied physical quantity and the physical quantity detection element 70 to detect the displacement.

  In addition, according to the physical quantity detection sensor 100 in which the physical quantity detection device 110 is housed in the package 120, the physical quantity can be detected while suppressing the influence of disturbance factors such as the atmosphere and temperature outside the package 120, and the stability as a detection sensor. Detection performance can be maintained.

(Second Embodiment)
First, the physical quantity detection sensor according to the second embodiment will be described with reference to FIGS. 10 and 11.
FIG. 10 is a plan view showing a configuration of a physical quantity detection sensor 200 according to the second embodiment, and FIG. 11 is a cross-sectional view of a portion indicated by a line segment DD ′ in FIG.

The physical quantity detection sensor 200 of this embodiment will be described. In the description, the same components as those of the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified or omitted. 10 and 11, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. The Z axis is an axis indicating the direction in which gravity acts.
For convenience of explanation, the lid 103 is not shown in FIG.
In the present embodiment, viewing the physical quantity detection sensor 200 from the Z-axis direction will be described as a planar view.

  As shown in FIGS. 10 and 11, the physical quantity detection sensor 200 includes a physical quantity detection device 113 and a package 120. The package 120 includes a base substrate 102 and a lid 103. The physical quantity detection device 113 includes a cantilever part 112, a physical quantity detection element 70, and mass parts 80 and 82.

  The base substrate 102 of the present embodiment includes an inner bottom surface 109a that is a bottom surface inside the recess 106, and a stepped portion 108 (108a, 108b, 108c) protruding from the inner bottom surface 109a to the lid 103 side. .

The step portions 108 a, 108 b and 108 c are provided for fixing the physical quantity detection device 113, and are provided along the inner wall of the recess 106, for example.
More specifically, the step portion 108a has a substantially L shape in plan view, and has a predetermined width along the inner wall in the −X axis direction and the inner wall in the −Y axis direction of the recess 106. Is provided continuously. The stepped portion 108b has a substantially L shape in plan view, and is continuous with a predetermined width along the inner wall in the + X-axis direction and the inner wall in the -Y-axis direction of the recess 106. Is provided. The step part 108c is provided with a predetermined width along the inner wall in the −Y-axis direction of the recess 106 so that the step part 108a and the step part 108b are connected in plan view.

Here, the cantilever part 112 of this embodiment will be described.
The shape of the cantilever part 112 is substantially the same as that of the cantilever part 101 of the first embodiment, except that a base extension part 18 described later is provided in the −Y-axis direction of the base part 72a of the physical quantity detection element 70. Since the arm part 20 (20a, 20b, 20c) of the cantilever part 112 has the same configuration and shape as the arm part 20 (20a, 20b, 20c) of the cantilever part 101 of the first embodiment, the description thereof is omitted. . Further, the first fixing part 30 (30a, 30b, 30c) of the cantilever part 112 has the same configuration and shape as the first fixing part 30 (30a, 30b, 30c) of the cantilever part 101 of the first embodiment. Therefore, explanation is omitted.

  The base extending portion 18 is provided on the base portion 10 of the cantilever portion 112 so that the base extending portion 18 overlaps the stepped portion 108c in a plan view in the −Y-axis direction of the base portion 72a of the physical quantity detection element 70 attached to the main surface 10b. ing.

  A second fixing portion 30d is provided at a position where the base extending portion 18 and the stepped portion 108c overlap each other in plan view. On the main surface 10b side of the second fixing portion 30d, there is a base joint portion 52a that is an installation region of the base joint material 52, and the step portion 108c (base substrate) is formed by the base joint material 52 provided in the base joint portion 52a. 102) and the cantilever part 112 are connected.

  The physical quantity detection device 113 (cantilever part 112) is connected to the base substrate 102 (step part 108 (108a, 108b, 108c)) via the first fixing part 30 (30a, 30b, 30c) and the second fixing part 30d. It is connected.

  Since the operation of the physical quantity detection device 113 is the same as that of the physical quantity detection device 110 of the first embodiment, description thereof is omitted.

  For example, when a physical quantity, for example, acceleration is applied to the physical quantity detection sensor 200, stress is generated on the physical quantity detection device 113 (cantilever portion 112). The second fixing portion 30d is provided on the main surface 10b of the base extending portion 18 and is connected via the base bonding material 52, so that the base portion 10 and the base substrate 102 (stepped portion 108c) are strengthened. It is fixed. Thus, the displacement (swing) of the base portion 10 of the cantilever portion 112 and the moment of rotation that occur when a physical amount, for example, acceleration is applied to the physical amount detection sensor 200 are suppressed.

  The physical quantity detection sensor 200 is used not only as an acceleration sensor capable of detecting acceleration described in the first embodiment but also as a tilt sensor.

  As described above, according to the physical quantity detection sensor 200 according to the second embodiment, the following effects can be obtained.

According to the second embodiment, the second fixing part 30d of the cantilever part 112 (base part 10) in the physical quantity detection device 113 is disposed on the main surface 10b of the base extension part 18 of the cantilever part 112, and the base substrate 102 ( The step part 108 c) is connected to the base bonding material 52. Even when an impact or the like is applied to the physical quantity detection device 113, the arm portions 20a, 20b, and 20c of the base portion 10 and the first fixing portions 30a, 30b, and 30c have the same configuration and shape as in the first embodiment. Therefore, the same effect as the first embodiment can be obtained.
Therefore, the physical quantity detection sensor 200 that can relieve stress is obtained by fixing the cantilever part 112 at the position of the second fixing part 30d.

  In addition, the connection part (2nd fixing | fixed part 30d) of the cantilever part 112 and the base board | substrate 102 is provided in the main surface 10b of the base extension part 18 of the cantilever part 112, and shock resistance is provided. The physical quantity detection sensor 200 is obtained.

In the above-described embodiment, an example in which a double tuning fork element is used as the physical quantity detection element 70 has been described. However, if the vibration quantity changes based on the displacement of the movable portion 14 and the physical quantity can be detected, the physical quantity detection is performed. The form of the element 70 is not particularly limited.
Further, as the physical quantity detection element 70, a so-called strain gauge that detects the physical quantity by changing the electric resistance based on the displacement of the movable portion 14 may be used. In the case where a strain gauge is used, the description of the physical quantity detection based on the change in the vibration frequency according to the above-described embodiment can be replaced with the detection of the physical quantity based on the change in the resistance value.

(Example)
Next, an example in which the physical quantity detection sensor 100 according to an embodiment of the present invention is applied will be described with reference to FIG.
12A is a perspective view showing a video camera on which the physical quantity detection sensor 100 is mounted, and FIG. 12B is a perspective view showing a mobile phone on which the physical quantity detection sensor 100 is mounted. (C) is a perspective view showing an automobile which is a moving body on which the physical quantity detection sensor 100 is mounted.

[Electronics]
As shown in FIGS. 12A and 12B, a video camera 500 as an electronic device and a mobile phone 600 are equipped with the physical quantity detection sensor 100 according to this embodiment.
First, a video camera 500 shown in FIG. 12A is equipped with an image receiving unit 501, an operation unit 502, an audio input unit 503, and a display unit 504. The video camera 500 includes a physical quantity detection sensor 100. For example, if the three physical quantity detection sensors 100 are provided, physical quantities in three directions of the X axis, the Y axis, and the Z axis (not shown), for example, acceleration Alternatively, it is possible to exhibit the function of detecting camera tilt and correcting camera shake. Thereby, the video camera 500 can record a clear moving image.

  A cellular phone 600 illustrated in FIG. 12B includes a plurality of operation buttons 601, a display unit 602, a camera mechanism 603, and a shutter button 604, and functions as a telephone and a camera. This mobile phone 600 is equipped with a physical quantity detection sensor 100. For example, if three physical quantity detection sensors 100 are installed, physical quantities in three directions of the X axis, the Y axis, and the Z axis (not shown), for example, By detecting acceleration, inclination, or the like, a function of correcting camera shake or the like of the camera mechanism 603 can be exhibited. Thereby, the mobile phone 600 can record a clear image by the camera mechanism 603.

  Note that the physical quantity detection sensor 100 according to the embodiment of the present invention includes, for example, a personal computer (mobile personal computer), digital, in addition to the video camera of FIG. 12A and the mobile phone of FIG. Still camera, inkjet discharge device (for example, inkjet printer), television, video recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, television Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, Instruments (eg, vehicle, aircraft, ship meter) S), can be applied to electronic equipment such as a flight simulator.

[Moving object]
Next, a moving body using the physical quantity detection sensor 100 will be described. As shown in FIG. 12C, the moving body 700 is an automobile, and the physical quantity detection sensor 100 is mounted thereon. In the moving body 700, the physical quantity detection sensor 100 is built in an electronic control unit (ECU) 703 mounted on the vehicle body 701. The electronic control unit 703 detects, for example, the state of the vehicle body 701 by the physical quantity detection sensor 100 as an acceleration sensor or an inclination sensor, so as to grasp the posture or movement state of the moving body 700, and the suspension 704, the tire 702, and the like. Control can be performed accurately. Thereby, the moving body 700 can move safely and stably.

  The physical quantity detection sensor 100 is not only mounted on the electronic devices and moving objects described above, but also includes a keyless entry, immobilizer, car navigation system, car air conditioner, antilock brake system (ABS), air It can be installed in electronic control units such as the back, tire pressure monitoring system (TPMS), engine control, battery monitors for hybrid and electric vehicles, and body posture control systems, and can be applied to a wide range of fields. is there.

  DESCRIPTION OF SYMBOLS 10 ... Base part, 10a, 10b ... Main surface, 12 ... Joint part, 12a, 12b ... Groove part, 14 ... Movable part, 14a, 14b ... Main surface, 15 ... Flat part, 18 ... Base extension part, 20a, 20b , 20c ... arm part, 30a, 30b, 30c ... first fixing part, 30d ... second fixing part, 34a, 34b ... internal terminal, 35 ... bonding material, 36a, 36b ... fixing part connecting terminal, 40a, 40b ... deterrence 50a, 50b ... base joint, 52 ... base joint, 70 ... physical quantity detection element, 71a, 71b ... vibrating beam, 72a, 72b ... base, 80,82 ... mass part, 84 ... detection element joint, 86 ... Mass bonding material, 90 ... Sealing part, 92 ... Through hole, 100, 200 ... Physical quantity detection sensor, 101, 112 ... Cantilever part, 102 ... Base substrate, 103 ... Lid, 105 ... Lid bonding material, 106 Recesses, 107a, 107b ... external terminals, 108a, 108b, 108c ... stepped portions, 109a ... inner bottom surface, 109b ... outer bottom surface, 110 ... physical quantity detection device, 113 ... physical quantity detection device, 120 ... package, 140 ... etching residue, 150 DESCRIPTION OF SYMBOLS ... Electronic circuit 500 ... Video camera 501 ... Image receiving unit 502 ... Operation unit 503 ... Audio input unit 504 ... Display unit 600 ... Mobile phone 601 ... Multiple operation buttons 602 ... Display unit 603 ... Camera Mechanism, 604 ... shutter button, 700 ... moving body, 701 ... vehicle body, 702 ... tire, 703 ... electronic control unit, 704 ... suspension, L1 ... first center line, L2 ... second center line, S1 ... first Region S2, second region, S3, third region, S4, fourth region.

Claims (11)

A base part, a movable part connected to the base part via a joint part, an arm part extending from the base part, a first fixed part provided on the arm part, and the base A cantilever part having a second fixing part provided in the part,
A physical quantity detection element connected to the base part and the movable part;
A physical quantity detection sensor comprising: a base substrate to which the first fixing portion and the second fixing portion are connected.   The physical quantity detection element includes two base portions and a vibrating beam portion disposed between the two base portions and straddling the joint portion, and one of the base portions is connected to the base portion. The physical quantity detection sensor according to claim 1, wherein the other base portion is connected to the movable portion.   The first fixing part and the second fixing part are perpendicular to a first center line passing through the centers of the two base parts in a plan view, and with respect to a second center line passing through the center of the cantilever part. The physical quantity detection sensor according to claim 2, wherein the physical quantity detection sensor is disposed at an asymmetric position.   The number of the arm portions provided in the cantilever portion located in the first region on one side with respect to the second center line in a plan view, and the second region located on the other side The physical quantity detection sensor according to claim 3, wherein the number of the arm portions provided in the cantilever portion is different.   5. The physical quantity detection sensor according to claim 1, wherein the cantilever part is made of quartz and is subjected to a wet etching process. 6.   The physical quantity detection sensor according to claim 5, wherein the crystal is cut out by Z cut. The joint has a groove provided along the direction of the second center line in plan view,
The physical quantity detection sensor according to claim 3, wherein the vibrating beam portion is arranged along a direction intersecting with a direction in which the groove portion extends.   The second fixing portion is provided in a third region on one side with respect to the first center line in a plan view, and the number of the arm portions in the third region is on the other side. The physical quantity detection sensor according to claim 1, wherein the physical quantity detection sensor is smaller than the number of the arm portions provided in the region of 4.   An acceleration sensor comprising the physical quantity detection sensor according to claim 1, wherein acceleration is measured.   An electronic device, wherein the acceleration sensor according to claim 9 is mounted.   A moving body on which the acceleration sensor according to claim 9 is mounted.

Images