JP2014240100A - Cutting tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting tool which can smoothly grind a diamond chip.SOLUTION: A cutting tool comprises a shank and a cutting blade body which is detachably installed to the shank. The cutting blade body comprises a base which is detachably installed to the shank, and a diamond chip as a cutting blade which is brazed to a tip of the base. The base includes an installation part having an installation surface which is detachably installed to the shank, and a chip attachment part having a chip attachment surface onto which the diamond chip is brazed. The chip installation part is so formed as to project from a front face on a side opposite to the installation surface of the installation part.

Description

  The present invention relates to a bite tool for turning a workpiece.

A semiconductor wafer in which a plurality of semiconductor chips are formed is divided into individual semiconductor chips by a dicing apparatus or the like, and the divided semiconductor chips are widely used in electric devices such as mobile phones and personal computers.
In recent years, in order to reduce the weight and size of electrical equipment, a bump having a protrusion of 50 to 100 μm is formed on an electrode of a semiconductor chip, and this bump is directly bonded to an electrode formed on a mounting substrate. A semiconductor chip called a flip chip has been developed and put into practical use. In addition, a technique for reducing the size by mounting a plurality of semiconductor chips on a substrate called an interposer or stacking them has been developed and put into practical use.

  However, each of the above-described technologies forms a plurality of protruding bumps (electrodes) on the surface of a substrate such as a semiconductor chip and bonds the substrates to each other via the protruding electrodes. ) Must be the same height. In order to make the heights of the bumps (electrodes) of the protrusions uniform, there has been proposed a machining device that performs turning with a bite tool (see, for example, Patent Document 1).

  Further, the cutting tool mounted on the machining apparatus is configured by detachably mounting a cutting blade body, which has a diamond tip brazed to a base as a cutting blade, at the tip of the shank. Since the cutting blade body of the bite tool configured in this way is expensive as a consumable, when the sharpness deteriorates, the tip of the diamond tip is polished to regenerate the cutting blade.

JP 2009-12105 A

  Thus, when the diamond chip is polished, there is a problem that the base on which the diamond chip is brazed prevents it from being smoothly polished.

  This invention is made | formed in view of the said fact, The main technical subject is to provide the bite tool which can implement the grinding | polishing of a diamond chip | tip smoothly.

In order to solve the above main technical problem, according to the present invention, a bite tool comprising a shank and a cutting blade body detachably attached to the shank,
The cutting blade body is composed of a base that is detachably attached to the shank, and a diamond tip that becomes a cutting edge brazed to the tip of the base,
The base includes a mounting portion having a mounting surface that is detachably mounted on the shank, and a chip mounting portion having a chip mounting surface to which the diamond chip is brazed.
The chip mounting portion is formed to protrude from the front surface of the mounting portion opposite to the mounting surface.
A bite tool characterized by the above is provided.

  In the cutting tool according to the present invention, the cutting blade body that is detachably attached to the shank includes a base that is detachably attached to the shank, and a diamond tip that serves as a cutting blade brazed to the tip of the base. The base includes a mounting portion having a mounting surface that is detachably mounted on the shank, and a chip mounting portion having a chip mounting surface to which the diamond chip is brazed. Since it is formed so as to protrude from the front surface opposite to the mounting surface of the mounting part, the front surface of the mounting part of the base does not interfere with polishing the diamond chip, and even if the diamond chip becomes thinner Can be polished.

The perspective view of the processing apparatus with which the bite tool comprised according to this invention was mounted | worn. 1 is a perspective view of a bite tool constructed in accordance with the present invention. FIG. The disassembled perspective view of the structural member of the bite tool shown in FIG. The top view and principal part enlarged view of the semiconductor wafer as a to-be-processed object. Explanatory drawing of the turning process implemented using the processing apparatus shown in FIG. FIG. 6 is an explanatory diagram showing a state in which bumps (electrodes) formed on the semiconductor wafer device shown in FIG. 4 are turned by the turning process shown in FIG. 5.

  Hereinafter, a preferred embodiment of a bite tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus equipped with a bite tool constructed according to the present invention.
The processing apparatus 1 in the illustrated embodiment includes an apparatus housing generally indicated by numeral 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

  The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion eccentric from the rotation axis, and the tool mounting is performed from the outer peripheral surface corresponding to the tool mounting hole 324a. A female screw hole 324b reaching the hole 324a is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 having the above-described configuration, and the tightening bolt 330 is screwed into the female screw hole 324b to be tightened. Removably attached to the.

Next, the cutting tool 33 will be described with reference to FIGS.
FIG. 2 shows a perspective view of a cutting tool 33 constructed in accordance with the present invention, and FIG. 3 shows an exploded perspective view of the components of the cutting tool 33.
The cutting tool 33 shown in FIGS. 2 and 3 includes a shank 34 and a cutting blade body 35 that is detachably attached to the shank 34. The shank 34 is formed in a quadrangular prism shape from stainless steel, and a mounting portion 341 having a tapered tip is provided at the tip (lower end) thereof. A female screw hole 343 is formed in the mounting surface 342 of the mounting portion 341 as shown in FIG.

  A cutting blade main body 35 constituting the cutting tool 33 includes a base 36 that is detachably mounted on the shank 34 and a diamond tip 37 that is a cutting blade brazed to the tip of the base 36. Yes. The base 36 is formed of tungsten carbide, and includes a mounting portion 361 having a mounting surface 361a that is detachably mounted on the shank 34, and a chip mounting portion 362 to which the diamond chip 37 is brazed. ing. In the illustrated embodiment, the mounting part 361 and the chip mounting part 362 constituting the base 36 are integrally molded. However, the mounting part 361 and the chip mounting part 362 are formed separately, and both parts are formed. You may braze. The base 36 formed in this manner has a chip mounting portion 362 to which the diamond chip 37 is brazed so as to protrude from the front surface 361b of the mounting portion 361, and a chip mounting surface which is the front surface of the chip mounting portion 362. A diamond chip 37 is brazed to 362a with a brazing material such as silver tin. In the illustrated embodiment, the distance between the front surface 361b of the mounting portion 361 constituting the base 36 and the chip mounting surface 362a is set to 5 mm. The thickness of the diamond chip 37 is set to 2 mm in the illustrated embodiment. The mounting portion 361 of the base 36 configured as described above is provided with a bolt insertion hole 363, and the fastening bolt 38 is inserted into the bolt insertion hole 363 to the female screw hole 343 formed in the shank 34. The base 36 can be attached to the shank 34 by screwing.

  As shown in FIG. 1, the tool tool 33 configured as described above has a shank 34 inserted into a tool tool mounting hole 324 a provided in the tool tool mounting member 324, and a female screw hole provided in the tool tool mounting member 324. By screwing and tightening the tightening bolt 330 to 324b, the bite tool mounting member 324 is detachably mounted.

  Referring back to FIG. 1, the machining apparatus in the illustrated embodiment moves the turning unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a holding surface of a chuck table described later). A turning unit feed mechanism 4 is provided. The turning unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending in the vertical direction. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and an output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the central portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole extending in the vertical direction is formed in the connecting portion. The male screw rod 41 is screwed into the female screw hole. Accordingly, when the pulse motor 44 is rotated forward, the moving base 31 and the turning unit 3 mounted on the moving base 31 are lowered or advanced, and when the pulse motor 44 is rotated reversely, the moving base 31 and the moving base 31 are mounted. The turned unit 3 is raised or retracted.

  The description will be continued with reference to FIG. 1. A substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the chuck table 5 is disposed in the machining work portion 211. Has been. The chuck table 5 includes a chuck table main body 51 formed in a cylindrical shape by a metal material such as stainless steel, and an adsorption chuck 52 disposed on the upper surface of the chuck table main body 51. The suction chuck 52 is made of an appropriate porous material such as porous ceramics and communicates with a suction means (not shown). Therefore, by selectively communicating the suction chuck 52 with a suction means (not shown), the workpiece placed on the holding surface which is the upper surface is sucked and held. The chuck table 5 configured as described above is configured to be movable in a direction indicated by arrows 23a and 23b in FIG. 1 by a chuck table moving mechanism (not shown). It is moved between the carry-out area 24 and a machining area 25 indicated by a solid line facing the cutting tool 33 constituting the spindle unit 32.

The machining apparatus to which the cutting tool is mounted in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
FIG. 4 shows a plan view of a semiconductor wafer 10 as a workpiece and a sectional view showing an enlarged main part. As shown in FIG. 4A, the semiconductor wafer 10 shown in FIG. 4 has a plurality of devices 110 formed in a lattice pattern on the surface, and a plurality of studs are formed on the surface 10a of the plurality of devices 110, respectively. Bumps (electrodes) 120 are formed. For example, as shown in FIG. 4B, the stud bump (electrode) 120 is mounted by heating and melting a gold wire on an electrode plate 111 made of, for example, aluminum or the like formed on the device 110. The plurality of stud bumps (electrodes) 120 formed in this way are in a state in which the needle-like ridges 121 remain as shown in FIG. 4B and the heights thereof vary.

  In order to align the heights of the plurality of stud bumps (electrodes) 120 formed on the surfaces 10a of the plurality of devices 110 of the semiconductor wafer 10 described above, they are positioned in the work-in / out area 24. The back surface is placed on the holding surface which is the upper surface of the chuck table 5 with the front surface 10a of the semiconductor wafer 10 facing up. Then, the semiconductor wafer 10 is sucked and held on the chuck table 5 by operating a suction means (not shown).

  Referring to FIG. 1, when the semiconductor wafer 10 is sucked and held on the chuck table 5, the chuck table moving mechanism (not shown) is operated to move the chuck table 5 in the direction indicated by the arrow 23a. The chuck table 5 holding is positioned in the machining area 25. When the chuck table 5 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 provided on the semiconductor wafer 10 are provided. Perform a turning process to turn and align the height.

  First, the rotary spindle 322 is rotationally driven, and the tool tool mounting member 324 to which the tool tool 33 is attached is rotated in the direction indicated by the arrow 300 in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, the chuck table 5 holding the semiconductor wafer 10 is moved to the right at a predetermined feed speed as indicated by an arrow 23a from the position indicated by the solid line in FIG. As a result, the upper ends of a plurality of stud bumps (electrodes) 120 formed on the surface of the device 110 provided on the semiconductor wafer 10 by the diamond chip 37 constituting the bite tool 33 that rotates with the rotation of the rotary spindle 322. Is scraped off. Then, as indicated by a two-dot chain line in FIG. 5, the center of the semiconductor wafer 10 held on the chuck table 5 moves to the center position of the tool tool mounting member 324, whereby the surface of the device 110 provided on the semiconductor wafer 10. As shown in FIG. 6, all of the plurality of stud bumps (electrodes) 120 formed on the tip are removed by turning, and the heights are made uniform.

When the turning operation described above is repeatedly performed, the sharpness of the diamond tip 37 which is the cutting edge of the cutting tool 33 is deteriorated. In order to restore the sharpness of the diamond tip 37, the front surface of the diamond tip 37 is polished. However, in the conventional bite tool, the diamond tip is brazed to the front surface of the base. There is a problem that the diamond chip cannot be smoothly polished when the thickness of the diamond chip is reduced.
However, in the bite tool 33 in the above-described embodiment, the base 36 is formed with the tip mounting portion 362 to which the diamond tip 37 is brazed projecting from the front surface 361 b of the mounting portion 361, thereby constituting the base 36. Since the distance between the front surface 361b of the mounting portion 361 and the chip mounting surface 362a is set to 5 mm in the illustrated embodiment, the front surface 361b of the mounting portion 361 of the base 36 hinders the polishing of the diamond chip 37. Therefore, even if the diamond tip 37 becomes thin, it can be polished smoothly.

2: Device housing 3: Turning unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324: Tool tool mounting member 33: Tool tool 34: Shank 35: Cutting blade body 36: Base Table 361: Mounting portion 362: Chip mounting portion 4: Turning unit feed mechanism 5: Chuck table 10: Semiconductor wafer 110: Device 120: Stud bump (electrode)

Claims (1)

A bite tool comprising a shank and a cutting blade body detachably attached to the shank,
The cutting blade body is composed of a base that is detachably attached to the shank, and a diamond tip that becomes a cutting edge brazed to the tip of the base,
The base includes a mounting portion having a mounting surface that is detachably mounted on the shank, and a chip mounting portion having a chip mounting surface to which the diamond chip is brazed.
The chip mounting portion is formed to protrude from the front surface of the mounting portion opposite to the mounting surface.
A bite tool characterized by that.

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