JP2014235072A5 - - Google Patents

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JP2014235072A5
JP2014235072A5 JP2013116421A JP2013116421A JP2014235072A5 JP 2014235072 A5 JP2014235072 A5 JP 2014235072A5 JP 2013116421 A JP2013116421 A JP 2013116421A JP 2013116421 A JP2013116421 A JP 2013116421A JP 2014235072 A5 JP2014235072 A5 JP 2014235072A5
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heat
copper foil
sealing liquid
temperature
plate
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JP2013116421A
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JP2014235072A (en
JP5931004B2 (en
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ここで、被測定流体の温度が変化して隔膜25を介して熱が伝わる封入液Lと検出部24との温度差が大きくなる。あるいは、変換回路素子50から発生した熱が接続ピン32、ASIC回路部5、リードピン31を介して封入液Lに伝達されて封入液Lと検出部24との温度差が部分的に大きくなることがある。封入液Lが熱膨張あるいは熱収縮し、封入液Lが収納される領域の圧力が変化する。すると、検出部24の板部241に設けられた検知部から出力信号が出力され、この信号は、ボンディングワイヤ240及びリードピン31を介してASIC回路部4のASIC40に送られる。ASIC40からは温度補正された信号が接続ピン32、変換回路部5及び接続ピン33を介して端子部7から外部に出力される。
封入液Lの温度と検出部24の温度とは常に同じになるとは限らず、周囲温度や変換回路素子50の発熱の影響により、温度差が生じてしまう。また、圧力センサの電源投入後の時間経過によって温度差が生じることもある。
しかし、本実施形態では、リードピン31から封入液Lに伝わる熱がリードピン接合部91を介して均熱板8に伝達されるので、封入液Lでの熱分布の偏在が少なくなり、封入液Lの温度が部位にかかわらず均一となるので、検出部24と封入液Lとの温度差が小さくなる。
Here, the temperature of the fluid to be measured changes, and the temperature difference between the sealed liquid L, through which heat is transmitted through the diaphragm 25, and the detection unit 24 increases. Alternatively, heat generated from the conversion circuit element 50 is transmitted to the sealing liquid L via the connection pin 32, the ASIC circuit unit 5, and the lead pin 31, and the temperature difference between the sealing liquid L and the detection unit 24 is partially increased. There is. The sealing liquid L is thermally expanded or contracted, and the pressure in the region where the sealing liquid L is stored changes. Then, the detection unit or RaIzuru force signal in a plate portion 241 of the detecting section 24 is output, this signal is sent to ASIC40 the ASIC circuit portion 4 via a bonding wire 240 and the lead pin 31. From the ASIC 40, a temperature-corrected signal is output from the terminal unit 7 to the outside via the connection pin 32, the conversion circuit unit 5, and the connection pin 33.
The temperature of the filled liquid L and the temperature of the detection unit 24 are not always the same, and a temperature difference is generated due to the influence of the ambient temperature and the heat generation of the conversion circuit element 50. In addition, a temperature difference may occur with the passage of time after the pressure sensor is turned on.
However, in the present embodiment, the heat transmitted from the lead pin 31 to the sealing liquid L is transmitted to the heat equalizing plate 8 via the lead pin joint portion 91, so that the uneven distribution of heat distribution in the sealing liquid L is reduced, and the sealing liquid L Therefore, the temperature difference between the detection unit 24 and the sealed liquid L becomes small.

さらに、均熱板8は、単一の材料から形成されるものに限らず、プリント基板の材料から形成されるものでもよい。例えば、図6に示される通り、均熱板8を、ガラスエポキシやポリイミドからなる複数層の板部80の間に銅箔パターン81を設け、ベース本体231とは反対側の板部80の表面に銅箔パターン82を設け、銅箔パターン82の表面にソルダレジスト83を設けた構成としてもよい。ここで、銅箔パターン81はベース接合部92と接続され、銅箔パターン82はリードピン接合部91と接続されている。銅箔パターン81,82を互いに近くに配置することで、絶縁性を確保しつつ熱の移動を促進させることができるので、高い均熱効果を得る。図6の構成の均熱板8では、一般的なプリント基板と同様の構成であるため、圧力センサの製造コストを低いものにできる。
また、リードピン31の本数は6本に限定されるものではなく、リードピン31の均熱板8への取付位置も限定されるものではない。すなわち、リードピン31はリードピン接合部91で均熱板8と接合しているものであれば、その具体的な構成は限定されるものではない。
Furthermore, the soaking plate 8 is not limited to being formed from a single material, but may be formed from a material of a printed circuit board. For example, as shown in FIG. 6, the soaking plate 8 is provided with a copper foil pattern 81 between a plurality of plate portions 80 made of glass epoxy or polyimide, and the surface of the plate portion 80 on the side opposite to the base body 231. Alternatively, the copper foil pattern 82 may be provided, and the solder resist 83 may be provided on the surface of the copper foil pattern 82. Here, the copper foil pattern 81 is connected to the base joint 92, and the copper foil pattern 82 is connected to the lead pin joint 91. By disposing the copper foil patterns 81 and 82 close to each other, heat transfer can be promoted while ensuring insulation, so that a high soaking effect is obtained. Since the soaking plate 8 having the configuration shown in FIG. 6 has the same configuration as that of a general printed board, the manufacturing cost of the pressure sensor can be reduced.
Further, the number of lead pins 31 is not limited to six, and the mounting position of the lead pins 31 on the heat equalizing plate 8 is not limited. That is, the lead pin 31 is re long as bonded to the soaking plate 8 Dopin junction 91, its concrete configuration is not limited.

JP2013116421A 2013-05-31 2013-05-31 Physical quantity measurement sensor Active JP5931004B2 (en)

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Application Number Priority Date Filing Date Title
JP2013116421A JP5931004B2 (en) 2013-05-31 2013-05-31 Physical quantity measurement sensor

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Application Number Priority Date Filing Date Title
JP2013116421A JP5931004B2 (en) 2013-05-31 2013-05-31 Physical quantity measurement sensor

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JP2014235072A JP2014235072A (en) 2014-12-15
JP2014235072A5 true JP2014235072A5 (en) 2015-05-28
JP5931004B2 JP5931004B2 (en) 2016-06-08

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Publication number Priority date Publication date Assignee Title
JP6841794B2 (en) 2018-06-26 2021-03-10 長野計器株式会社 Physical quantity measuring device and manufacturing method of physical quantity measuring device
JP2024006068A (en) * 2022-06-30 2024-01-17 株式会社鷺宮製作所 pressure sensor

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JP3838070B2 (en) * 2001-10-23 2006-10-25 Nok株式会社 Pressure sensor

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