JP2014232641A - Illumination device using semiconductor light-emitting element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illumination device using a semiconductor light-emitting element which makes it possible to obtain excellent light scattering properties, expect excellent light emission due to light scattering, protect light emitting elements from impact, and keep excellent watertightness.SOLUTION: An illumination device comprises a plurality of semiconductor light-emitting elements, a translucent gel layer sealingly surrounding the plurality of semiconductor light-emitting elements, and translucent birefringent fine particles dispersed in the gel layer.

Description

  The present invention relates to a lighting device using a semiconductor light emitting element such as a light emitting diode (LED) element.

  Patent Document 1 discloses a planar lighting device in which a plurality of white LEDs are stored in a storage space formed by notches or recesses, and the storage space is filled with a filling resin such as silicon gel. It is also disclosed that the radiation angle of light from the white LED is changed by adjusting the refractive index of the filling resin.

  Patent Document 2 includes an LED light source and a surface light emitter in which light scattering agent fine particles are dispersed in a light-transmitting resin. Light from the LED light source is guided and scattered in the surface light emitter to emit light. There has been disclosed a display body configured to be made to do so. As the light scattering agent, inorganic fine particles, organic fine particles, hollow cross-linked fine particles made of a highly transparent resin material, or hollow fine particles made of glass are used.

JP 2004-241237 A JP 2007-273309 A

  In the planar illumination device described in Patent Document 1, no light scattering agent is dispersed in the filling resin. Therefore, light could not be emitted by causing light scattering at the filling resin portion.

  On the other hand, in the LED lighting device described in Patent Document 2, light scattering is generated by fine particles dispersed in a light-transmitting resin. However, the light scattering fine particles are inorganic fine particles such as calcium carbonate, barium sulfate, alumina, titanium dioxide, silicon dioxide or glass beads, organic fine particles such as styrene crosslinked beads, MS crosslinked beads or siloxane crosslinked beads, methacrylic resin, polycarbonate. Because it is composed of hollow cross-linked fine particles made of resin materials such as resin, MS resin or cyclic olefin resin, or hollow fine particles made of glass, etc., there is a limit to light scattering characteristics, and the brightness of fine particles is not so high It was difficult to obtain sufficient light divergence characteristics and to provide a good light emitter.

  Further, in the planar lighting device described in Patent Document 1, the white LED storage space is filled with a filling resin such as silicon gel, but the other parts of the lighting device are filled with this kind of resin. In addition, no impact resistance and watertightness were given to the entire lighting device.

  On the other hand, in the LED lighting device described in Patent Document 2, the lamp house of the LED light source is not filled with resin, and therefore the LED light source is not given impact resistance and water tightness.

  Accordingly, an object of the present invention is to provide an illuminating device using a semiconductor light-emitting element that can obtain excellent light scattering characteristics and can be expected to emit light by light scattering.

  Another object of the present invention is to provide an illumination device using a semiconductor light emitting element that can protect the light emitting element from an impact and can maintain excellent water tightness.

  According to the present invention, comprising: a plurality of semiconductor light emitting elements; a light-transmitting gel layer that hermetically surrounds the plurality of semiconductor light-emitting elements; and light-transmitting birefringent fine particles dispersed in the gel layer. An illumination device using the semiconductor light emitting element is provided. It is desirable that the birefringent fine particles have a refractive index different from that of the gel layer.

  Since light-transmitting birefringent fine particles (having a refractive index different from that of the gel layer) are dispersed in the gel layer, the light emitted from the semiconductor light emitting element is optically reflected by the birefringent fine particles. Since the light beam is divided into light beams having different polarization directions with respect to the axis (normal light beam and extraordinary light beam), very excellent light scattering characteristics can be obtained, and very good light emission by light scattering can be performed. In addition, since the semiconductor light emitting device is hermetically surrounded by the light-transmitting gel layer, sufficient impact resistance and excellent water tightness can be obtained.

  The birefringent fine particles preferably contain calcite grains. In this case, it is more preferable that the calcite grains contain crystal powder having a diameter of about 5 to 6 μm.

  It is also preferable to further include a housing in which a plurality of semiconductor light emitting elements and a gel layer are provided.

  One surface of the housing is open, a plurality of semiconductor light emitting elements are arranged in the housing so as to emit light toward the opening, and the housing opening is sealed only with a gel layer Is also preferable. In this case, it is further provided with a transparent cover member that hermetically seals one open surface of the housing, or a lattice-like structure provided on the one open surface of the housing. More preferably, a guard member is further provided.

  A power supply wiring electrically connected to the plurality of semiconductor light emitting elements; and an external connection terminal connected to one end of the power supply wiring and provided on a surface different from one surface of the housing. It is also preferable that the gel layer seals the external connection terminal portion.

  It is also preferable to further include a heat sink mechanism for heat radiation fixed to the outer surface (for example, the back surface) of the housing. In this case, in the heat sink mechanism for heat dissipation, the winding unit in which the metal wire is wound in a coil shape is displaced with respect to the adjacent winding unit to form a gap portion and a contact portion, and the whole is substantially cylindrical. And is provided with a cylindrical fin fixed to a thermally conductive substrate attached to the outer surface (for example, the back surface) of the housing or directly fixed to the outer surface (for example, the back surface) of the housing. It is more preferable. Further, the heat sink mechanism for heat dissipation is fixed to the thermally conductive substrate in the axial direction of the cylinder in a state where the heat sink mechanism for heat dissipation is opened from the outside of the cylinder through the gap inside the cylindrical fin, or of the housing It is more preferable to further include a block-shaped column member that is directly fixed to the outer surface (for example, the back surface).

  It is also preferable that the semiconductor light emitting element is a chip type LED element or a shell type LED element.

  According to the present invention, since the light-transmitting birefringent fine particles (having a refractive index different from the refractive index of the gel layer) are dispersed in the gel layer, very excellent light scattering characteristics can be obtained, Very good light emission by light scattering can be performed. In addition, since the semiconductor light emitting device is hermetically surrounded by the light-transmitting gel layer, sufficient impact resistance and excellent water tightness can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view schematically showing an overall configuration of a lighting device using a semiconductor light emitting element of the present invention in a first embodiment. It is a perspective view which shows roughly the whole structure of the illuminating device seen from the back side in 1st Embodiment. It is an AA partial fragmentary sectional view of Drawing 1 in a 1st embodiment. It is a top view which shows a part of heat sink mechanism for thermal radiation in 1st Embodiment. It is a fragmentary sectional view of the part except the heat sink mechanism for heat dissipation in 2nd Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a fragmentary sectional view of the part except the heat sink mechanism for heat dissipation in 3rd Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a fragmentary sectional view of the part except the heat sink mechanism for heat dissipation in 4th Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a fragmentary sectional view of the part except the heat sink mechanism for heat dissipation in 5th Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a top view which shows roughly the whole structure in 6th Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a perspective view which shows roughly the whole structure in 7th Embodiment of the illuminating device using the semiconductor light-emitting device of this invention. It is a perspective view which shows roughly the whole structure in 8th Embodiment of the illuminating device using the semiconductor light-emitting device of this invention.

  FIG. 1 schematically shows the overall configuration of a lighting device using a semiconductor light emitting element according to the first embodiment of the present invention, and FIG. 2 schematically shows the overall configuration of the lighting device viewed from the back side in this embodiment. FIG. 3 shows a partial cross section taken along line AA of FIG. 1 in the present embodiment.

  In these drawings, reference numeral 10 denotes a shallow rectangular parallelepiped housing having one surface (front surface) opened, 11 denotes a fixed rectangular LED board disposed in the housing 10, and 12 denotes an inside of the housing 10. The light-transmitting gel layer 13 is tightly filled and substantially sealed around the LED substrate 11, and is fixed to the outer surface of the housing 10 (in this embodiment, the back surface opposite to the opened front surface). Each of the heat sink mechanisms for heat dissipation is shown. However, in FIG. 2, only the innermost cylindrical fin and the column member of the heat sink mechanism 13 for heat dissipation are shown.

  In this embodiment, the housing 10 is formed in a rectangular parallelepiped shape in which the front surface, which is a light irradiation surface, is opened, for example, by die-casting aluminum. A plurality of (four in the illustrated example) metal support members 10 a for mounting the housing are provided on the rear surface of the housing 10. The casing 10 is made of a metal material other than aluminum, such as stainless steel, copper, silver, or gold, an alloy material of these with nickel, magnesium, zinc, or silicon, a carbon material, an acrylic resin, or other resin. It may be formed, or may be formed of glass or ceramic. Moreover, you may comprise only a part with a light-transmitting material.

  The LED substrate 11 is formed of an insulating material such as ceramic, and a plurality of bullet-type LED elements 11a are mounted on the LED substrate 11 in a matrix in the present embodiment. In the example shown in FIG. 1, the bullet-type LED elements 11 a are arranged and fixed on the LED substrate 11 in a 16 × 16 arrangement. This LED substrate 11 is fixedly supported on the housing 10 by bolts 11b. The LED substrate 11 and the LED element 11a mounted thereon are hermetically surrounded and supported by the gel layer 12. The shape of the LED substrate 11 may be a square shape, a rectangular shape, a circular shape, or other shapes.

  The LED element 11a may be any of a pseudo white LED element, a red LED element, a green LED element, and / or a blue LED element. Of course, the number and arrangement of the LED elements 11a are not limited to the example shown in FIG.

  As shown in FIG. 3, the electrode of the bullet-type LED element 11 a and the electrode of the resistor (not shown) are electrically connected to the power supply wiring 14 on the back surface of the LED substrate 11. These power supply wires 14 are connected to a power cable 16 outside the housing through a socket 15. Moreover, since the electrode protrudes from the back surface of the LED substrate 11, the LED substrate 11 is attached to the housing 10 with a bolt 11b via a spacer 11c in order to prevent a short circuit between the electrode and the housing 10. Furthermore, the gel sheet of the same material is inserted in the back surface of the LED board 11 as a part of the gel layer 12, and electrical insulation is improved.

  Of course, the gel layer 12 is also filled in the front surface of the LED substrate 11 so as to hermetically surround the LED substrate 11, the LED element 11 a mounted thereon, the electrode of the LED element 11 a, and the power supply wiring 14. Closely provided. In this embodiment, the gel layer 12 has a very soft gel-like substance made mainly of silicon, for example, a silicon gel having a refractive index of about 1.41 and a refractive index different from the refractive index of the silicon gel. And the light-transmitting birefringent fine particles 12a uniformly dispersed in the silicon gel. The silicon gel is preferably one that has high light transmittance and good thermal conductivity. As such a silicon gel, for example, a silicon gel having a selected light transmittance can be used. Moreover, you may use a urethane gel or another gel instead of a silicon gel.

The gel layer 12 is, for example, mixed with a proper amount of a curing agent in a main component of a silicone resin and uniformly mixed with the birefringent fine particles 12a and injected into the housing 10, and then deaerated under a vacuum pressure and then cured. By forming. In this way, by removing the air particles contained in the gel layer 12 by pulling the gel layer 12 with a vacuum pressure of about 10 ⁻⁵ Pa, the heat conduction effect and the sealing performance are further improved. Can be made.

  As the light-transmitting birefringent fine particles 12a, calcite grains having birefringence having a refractive index of about 1.65 to 1.7 are used. The diameter of each grain of calcite is about 5 to 6 μm. The light diffusion degree is adjusted depending on the degree of mixing of calcite grains into the silicon gel. The calcite grains themselves may be colored. In general, calcite is a negative uniaxial crystal having high birefringence, a wide range of wavelength transmissivity, and a relatively large rhomboid, and it is suitable for light beams with different polarization directions (normal light and extraordinary light) with respect to the optical axis. Since they are divided, very excellent light scattering characteristics can be obtained.

  The gel layer 12 seals the LED substrate 11, the LED element 11a, the electrode of the LED element 11a, the power supply wiring 14, the socket 15, and the hole through which the socket 15 penetrates as well as the front surface of the housing 10 that is open. Therefore, the lighting device has a perfect waterproof and explosion-proof function. For example, it has been confirmed that there is no problem even if it is operated by submerging it in the sea at a depth of 10 m for more than 24 hours.

  FIG. 4 shows only the innermost cylindrical fin and the column member of the heat sink mechanism 13 for heat dissipation in this embodiment, and FIG. 3 also explains the operational effects of the heat sink mechanism 13 for heat dissipation. Hereinafter, the configuration and operational effects of the heat dissipation heat sink mechanism 13 will be described with reference to FIGS. 3 and 4.

  As shown in FIG. 4, the heat sink mechanism 13 for heat dissipation includes a substrate 13a, a cylindrical fin 13b, and a column member 13c.

  The substrate 13a is a thermally conductive flat plate, and may be fixed to the outer surface of the bottom plate 10b of the housing 10 and thermally connected thereto, or may be a part of the bottom plate 10b. The substrate 13a is made of a material having high thermal conductivity, for example, a metal material such as stainless steel, aluminum, copper, silver or gold, an alloy material of these with nickel, magnesium, zinc or silicon, or a carbon material. ing.

  Although only the innermost peripheral portion of the cylindrical fin 13b is shown in the figure, five-fold fins are concentrically arranged and fixed on the substrate 13a. The fixing is thermally coupled onto the substrate 13a by various methods such as welding and various types of adhesion. For example, the lower end portion of the cylindrical fin 13b is soldered onto the substrate 13a by solder along its circumference.

The cylindrical fins 13b are arranged in a generally cylindrical shape by fin coils. The fin coil is formed of a metal wire in a flat band shape having a gap portion 13b ₁ and a contact portion 13b ₂ (see FIG. 3). In the present embodiment, the flat belt-like fin coil is bent so that the whole is annular, and both ends are connected to each other so that the whole constitutes a substantially cylindrical circumference. That is, each circumference of the cylindrical tubular fin 13b is formed by bending a flat strip-shaped fin coil of a predetermined length so that the whole is annular, and fixing both ends thereof by welding or the like. .

  The fin coil can also be made of various materials as in the case of the substrate 13a. Specifically, a metal material such as aluminum, copper, silver, or gold, or an alloy of these with nickel, magnesium, zinc, silicon, or the like can be given. In the present embodiment, the fin coil is made of aluminum having high thermal conductivity and low cost.

In the fin coil, the winding units wound in a coil shape are displaced from each other with respect to the adjacent winding units, so that a gap portion 13b ₁ and a contact portion 13b ₂ are formed. The winding unit refers to a unit of one rotation of each metal wire when the metal wire is wound in a coil shape. In this embodiment, the fin coil entirety coiled metal wire material is continuously formed to be flat, each winding units intersect misaligned in the width direction and longitudinal direction to each other, the gap portion 13b ₁ And a contact portion 13b ₂ are formed. In particular, since the winding units are displaced from each other, a large number of gap portions 13b ₁ and contact portions 13b ₂ are formed. Since the metal wire is flattened form, the contact area of the contact portion 13b ₂ of each winding unit is in contact with each other increases.

  Specifically, a coiled metal wire wound in a left-handed manner and a coiled metal wire wound in a right-handed manner are combined. And a strip-shaped fin coil is obtained by forming each metal wire flatly by means of rolling or the like. During this rolling, the central part of the strip shape of the metal wire is bent inward (inner side of the overlap), and the front side part of the overlap of the metal wire is crushed so that a flat surface is formed in the center part. It is formed. In addition, the central portion of the metal wire protruding outward is bent inward to reduce the thickness, and an uneven structure in which the metal wire is complicated and complicated is formed at the end.

Note that the contact portions 13b ₂ in which the respective winding units are in contact with each other are formed by contact between the wire rods that are in contact with each other using bonding means such as soldering, solder plating, adhesive or adhesive, or bonding means such as vibration welding or flash welding. By fixing so as not to leave, thermal coupling for reducing heat transfer resistance can be performed. By fixing the contact portion 13b ₂ , the close contact of each winding unit is surely performed, the mechanical stability of the entire fin coil is improved, and the thermal conductivity via the contact portion 13b ₂ is also improved. .

  The column member 13c is a block-like member and is fixed on the substrate 13a toward the cylindrical axial direction inside the innermost cylindrical fin 13b. In the present embodiment, the column member 13c is made of aluminum, and its longitudinal direction has a length approximately the same as the height of the cylindrical fin 13b, and is erected so that the longitudinal direction is perpendicular to the substrate 13a. The substrate 13a is fixed by soldering and thermally connected.

The column member 13c is installed on the inner side of the innermost cylindrical fin 13b so as to be separated from the inner surface of the cylindrical fin 13b. By post member 13c is disposed inside the tubular fin 13b having a gap portion 13b _1, the vent and the installed space outside of the tubular fin 13b through the gap portion 13b ₁ and the pillar member 13c is continuously It is in a state to be.

The column member 13c is configured to restrict the airflow in the cylindrical fin 13b to flow in the axial direction. That is, the pillar member 13c includes a support post 13c ₁ provided coaxially in the center of the cylindrical fin 13b, extending radially from the axial center of the support column 13c _1, a plurality of plate-like set up along the axial direction and a control wing 13c ₂ of. In the present embodiment, 12 pieces of control vane 13c ₂ are provided. Pillar member 13c has become large heat capacity by providing a control vanes 13c ₁ to columnar, lower end surface is gained great heat transfer capacity that is thermally connected by soldering to the substrate 13a.

  As shown in FIG. 3, the heat of the substrate 13a or the heat of the bottom plate 10b of the housing 10 thermally connected to the substrate 13a is thermally conducted to the cylindrical fins 13b and the column members 13c through the substrate 13a. The Since the cylindrical fins 13b are thermally coupled to the substrate 13a, and the column member 13c has a large heat transfer capacity, this heat transfer is performed quickly and efficiently.

  Here, the air in the cylindrical fin 13b is warmed through the fin coil and the surface of the column member 13c, and an air flow 30 is generated by convection in the cylindrical fin 13b.

The air flow 30 is regulated so as to flow in the axial direction. Specifically, the air flow within the tubular fin 13b is near its axial center, colliding with the post 13c ₁ of the pillar member 13c, it flows along the pillar member 13c. For this reason, the airflow 30 flows upward along the column member 13c, and is discharged from the lower end opening of the cylindrical fin 13b.

When the air flow 30 is discharged from the lower end opening of the cylindrical fin 13b, a so-called chimney effect that tries to take in air from the outside to the inside works on the cylindrical fin 13b. Therefore, through the gap portion 13b ₁ of the tubular fin 13b, the low temperature of the air flow 31 flows into the cylindrical fin 13b. The airflow 71 is in contact with the heat sink mechanism 13 for heat dissipation such as the substrate 13a, the cylindrical fin 13b, and the column member 13c to exchange heat, and becomes an airflow 30 from the lower end opening of the cylindrical fin 13b along the column member 13c. Released. By these actions, heat exchange is performed while the air in the cylindrical fins 13b is exchanged and circulated, and the heat of the substrate 13a and the bottom plate 10b of the housing 10 is efficiently exchanged.

  In particular, since the fin coil of the cylindrical fin 13b is flattened, the coil is filled in the space in the center portion of the shaft without reducing the heat exchange area, and the surface area is large, and the adjacent winding unit is closely attached. Heat is conducted quickly through the part.

  Fin coils are wound in different directions, and by combining flat coiled metal wires, the metal wires are densely formed and densely formed, so that heat is conducted between these metal wires. It is easy to conduct heat throughout the fin coil, and the heat dissipation performance is also high. The fin coil has a large contact area with air, and has a high function as an air vent. Accordingly, the air passes through the gaps of the fin coils, and the heat of the cylindrical fins 13b and the substrate 13a can be quickly removed. Moreover, since the left-handed and right-handed metal wires are intertwined well, the stability of the form is imparted. For this reason, it is easy to manufacture and is not easily damaged when in use.

  The cylindrical fin 13b in the present embodiment is a five-fold coaxial cylinder. As a result, a large amount of air is circulated to increase the efficiency of heat exchange. However, the number of cylinders of the cylindrical fin 13b may be 1 to 4 or 6 or more. Further, the column member 13c may not be present.

Since the column member 13c is made of aluminum having good thermal conductivity and is thermally connected to the substrate 13a, the column member 13c also has an action of exchanging heat with the air in contact with the heat of the substrate 13a. Control vanes 13c ₂ this time, not only controls to increase the air flow 30, to increase the efficiency of heat exchange between the air flow 30 because a large surface area of the pillar member 13c _1.

  The metal wire forming the coil shape can be a single wire or a wire. A single wire is made of a single wire, and if it is easy to bend and has a certain thickness, it is easier to arrange and maintain a certain shape than a wire. Therefore, a metal wire made of a single wire is easy to process. In addition, the cost of a metal wire made of a single wire is low. A stranded wire (or stranded wire) refers to a wire obtained by combining or twisting two or more wires. It includes those obtained by applying the above-described coating after the single wires are combined or twisted together, and those obtained by collecting or twisting the single wires subjected to the above-described coating (twisted pair wires). The stranded wire has many irregularities on the surface and has a larger surface area than the single wire, so that higher heat exchange efficiency can be obtained, and durability is higher than that of the single wire.

  In addition, by providing the heat sink mechanism 13 for heat dissipation as described above on the bottom plate 10b of the casing 10, the casing temperature could be lowered from 120 ° C to 60 ° C. When the casing temperature does not increase so much, a heat dissipation mechanism with a simple structure may be provided instead of the heat sink mechanism 13 for heat dissipation, or a heat dissipation mechanism may not be provided at all.

  Hereinafter, the operation | movement regarding the illumination of the illuminating device in this embodiment and an effect are demonstrated.

  When the LED element 11 a is caused to emit light by supplying a direct current to the LED element 11 a via the cable 16, the socket 15 and the power supply wiring 14 to drive the LED element 11 a, the emitted light enters the gel layer 12. . Incident light to the gel layer 12 is uniformly dispersed in the silicon gel, and the portion emits light by being birefringed and diffused by calcite grains having a refractive index different from that of the silicon gel. As described above, in the present embodiment, light-transmitting calcite grains having a refractive index different from that of silicon gel are uniformly dispersed in the silicon gel. As a result, the portion emits very good light. Moreover, since the LED substrate 11 and the LED element 11a are hermetically surrounded by the silicon gel, and the power supply wiring 14 and the socket 15 are also hermetically surrounded by the silicon gel, sufficient impact resistance and Excellent water tightness can also be obtained. Moreover, since the front surface of the housing | casing 10 is in the open state and is sealed only with the gel layer 12, the cover member which covers the opening becomes unnecessary. As a result, the mold cost and material cost for creating the cover member are not necessary, and the manufacturing cost can be reduced.

  FIG. 5 shows a partial cross section (a cross section taken along line AA in FIG. 1) of the portion excluding the heat sink mechanism for heat dissipation in the second embodiment of the illumination device using the semiconductor light emitting element of the present invention.

  In the present embodiment, the gel layer 52 is not filled so that the entire inside of the housing 10 is filled, and is filled only up to the partial height of the housing 10 so that the tip of the bullet-type LED element 11a is exposed. Has been.

  The configuration of other parts in the present embodiment is the same as that in the first embodiment, and therefore the same reference numerals are used for the same components.

  That is, in the present embodiment, the gel layer 52 is formed on the front surface of the LED substrate 11, the LED substrate 11, a part of the bullet-type LED element 11 a mounted thereon, the electrode of the LED element 11 a, and the power supply wiring 14. Is tightly enclosed so as to enclose it, but is filled up to the partial height of the housing 10 so that only the tip of the bullet-type LED element 11a is exposed. For example, if the total height of the bullet-type LED element 11 a is 5 to 6 mm, about 3 to 4 mm from the bottom surface is embedded in the gel layer 52, and only the remaining tip is exposed from the gel layer 52. In this embodiment, the gel layer 52 has a very soft gel-like substance made mainly of silicon, for example, a silicon gel having a refractive index of about 1.41 and a refractive index different from the refractive index of the silicon gel. In addition, it contains light-transmitting birefringent fine particles 52a uniformly dispersed in the silicon gel. The silicon gel is preferably one that has high light transmittance and good thermal conductivity. As such a silicon gel, for example, a silicon gel having a selected light transmittance can be used. Moreover, you may use a urethane gel or another gel instead of a silicon gel.

The gel layer 52 is, for example, mixed with a proper amount of a curing agent in a main component of silicon resin, and uniformly mixed with birefringent fine particles 52a and injected into the housing 10, and then deaerated under a vacuum pressure and then cured. By forming. As described above, the gel layer 52 is degassed by pulling it at a vacuum pressure of about 10 ⁻⁵ Pa, so that the heat conduction effect and the sealing performance are further improved by removing the air particles contained in the gel layer 52. Can be made.

  As the light transmissive birefringent fine particles 52a, calcite grains having birefringence having a refractive index of about 1.65 to 1.7 are used. The diameter of each grain of calcite is about 5 to 6 μm. The light diffusion degree is adjusted depending on the degree of mixing of calcite grains into the silicon gel. The calcite grains themselves may be colored. In general, calcite is a negative uniaxial crystal having high birefringence, a wide range of wavelength transmissivity, and a relatively large rhomboid, and it is suitable for light beams with different polarization directions (normal light and extraordinary light) with respect to the optical axis. Since they are divided, very excellent light scattering characteristics can be obtained.

  According to the present embodiment, the light emitted from the exposed tip of the bullet-type LED element 11a is directly irradiated without being attenuated and scattered by the gel layer 52, so that the narrow-band light distribution and high light efficiency are achieved. Can be obtained. The light emitted from other than the tip part enters the gel layer 52, is diffused by the birefringent fine particles 82a, and the gel layer 52 emits light.

  Other operations and effects in the present embodiment are the same as those in the first embodiment.

  FIG. 6 shows a partial cross section (a cross section taken along line AA in FIG. 1) of a portion excluding the heat sink mechanism for heat dissipation in the third embodiment of the illumination device using the semiconductor light emitting element of the present invention.

  In the present embodiment, an additional gel layer 62 is disposed on the front side of the bullet-type LED element 11a with the tip portion exposed.

  The configuration of other parts in the present embodiment is the same as in the first and second embodiments, and therefore the same reference numerals are used for the same components.

  That is, in the present embodiment, the gel layer 52 is formed on the front surface of the LED substrate 11, the LED substrate 11, a part of the bullet-type LED element 11 a mounted thereon, the electrode of the LED element 11 a, and the power supply wiring 14. Is tightly provided so as to enclose it in a sealed manner, but is filled so that only the tip of the bullet-type LED element 11a is exposed. For example, if the total height of the bullet-type LED element 11 a is 5 to 6 mm, about 3 to 4 mm from the bottom surface is embedded in the gel layer 82, and only the remaining tip is exposed from the gel layer 52.

  Furthermore, in this embodiment, the additional gel layer 62 is arrange | positioned at the front side (light irradiation direction side) of the LED element 11a with a gap. The gel layer 62 can be formed in the housing 10 by, for example, filling the same gel layer as the gel layer 52 on a transparent flat plate member having a high transmittance.

  In this embodiment, these gel layers 52 and 62 are very soft gel-like substances mainly made of silicon, for example, silicon gel having a refractive index of about 1.41 and a refractive index different from the refractive index of these silicon gels. And the light-transmitting birefringent fine particles 52a and 62a uniformly dispersed in the silicon gel. The silicon gel is preferably one that has high light transmittance and good thermal conductivity. As such a silicon gel, for example, a silicon gel having a selected light transmittance can be used. Moreover, you may use a urethane gel or another gel instead of a silicon gel.

The gel layers 52 and 62 are, for example, mixed with an appropriate amount of a curing agent in the main resin resin and mixed with the birefringent fine particles 52a and 62a uniformly and injected into the housing 10, and then deaerated under a vacuum pressure. Then, it forms by hardening. As described above, if the gel layers 52 and 62 are degassed by pulling them at a vacuum pressure of about 10 ⁻⁵ Pa, the heat conduction effect and the sealing performance can be improved by removing the air particles contained in the gel layers 52 and 62. It can be improved further.

  As the light-transmitting birefringent fine particles 52a and 62a, calcite grains having birefringence having a refractive index of about 1.65 to 1.7 are used. The diameter of each grain of calcite is about 5 to 6 μm. The light diffusion degree is adjusted depending on the degree of mixing of calcite grains into the silicon gel. The calcite grains themselves may be colored. In general, calcite is a negative uniaxial crystal having high birefringence, a wide range of wavelength transmissivity, and a relatively large rhomboid, and it is suitable for light beams with different polarization directions (normal light and extraordinary light) with respect to the optical axis. Since they are divided, very excellent light scattering characteristics can be obtained.

  According to this embodiment, the light emitted from the exposed tip of the bullet-type LED element 11a enters the gel layer 62, is diffused by the birefringent fine particles 62a, and is irradiated to the outside. The light emitted from other than the tip part enters the gel layer 52, is diffused by the birefringent fine particles 52a, further enters the gel layer 62, is diffused by the birefringent fine particles 62a, and is irradiated to the outside.

  Other operations and effects in the present embodiment are the same as those in the first and second embodiments.

  FIG. 7 shows a partial cross section (a cross section taken along line AA in FIG. 1) of the portion excluding the heat sink mechanism for heat dissipation in the fourth embodiment of the illumination device using the semiconductor light emitting element of the present invention.

  In the present embodiment, a chip-type LED element 71a is provided instead of the bullet-type LED element.

  The configuration of other parts in the present embodiment is the same as that in the first embodiment, and therefore the same reference numerals are used for the same components.

  That is, in this embodiment, the LED substrate 71 is formed of an insulating material such as ceramic, and a plurality of chip-type LED elements 71a are mounted thereon in a matrix form in this embodiment. As in the case of FIG. 1, for example, chip-type LED elements 71a are arranged on the LED substrate 71 in a 16 × 16 arrangement. The LED substrate 71 is fixedly supported on the housing 10 by bolts 71b. The LED substrate 71 and the LED element 71a mounted thereon are hermetically surrounded and supported by the gel layer 12. The shape of the LED substrate 71 may be a square shape, a rectangular shape, a circular shape, or other shapes.

  The LED element 71a may be any of a pseudo white LED element, a red LED element, a green LED element, and / or a blue LED element. Of course, the number and arrangement of the LED elements 71a are not limited to the example of FIG.

  As shown in FIG. 7, on the surface of the LED substrate 71, a printed wiring 74 electrically connected to the electrode of the chip-type LED element 71a and an electrode of a resistor (not shown) is formed. These printed wirings 74 are connected to the power cable 16 outside the housing via the socket 15. Further, although the printed wiring 74 is not necessarily required because it is formed on the surface of the LED substrate 71, the LED substrate 71 is attached to the housing 10 by a bolt 71b via a spacer 71c. A gel sheet is inserted as a part of the gel layer 12 on the back surface of the LED substrate 71.

  Other operations and effects in the present embodiment are the same as those in the first embodiment.

  FIG. 8 shows a partial cross section (cross section taken along the line AA in FIG. 1) of the portion excluding the heat sink mechanism for heat dissipation in the fifth embodiment of the illumination device using the semiconductor light emitting element of the present invention.

  In the present embodiment, a transparent cover member 87 is provided on the open front surface of the housing 10.

  The configuration of other parts in the present embodiment is the same as that in the first embodiment, and therefore the same reference numerals are used for the same components.

  That is, in this embodiment, a transparent cover member 87 that seals the front surface of the housing 10 that is open is provided. The cover member 87 is attached to the upper end portion of the side wall 10c of the housing 10 via a waterproof and waterproof rubber packing 87a, and the front surface of the opening is hermetically sealed. Thereby, generation | occurrence | production of the clearance gap by thermal expansion can be prevented. As the cover member 87, a transparent acrylic resin or polycarbonate (PC) resin having a good light transmittance is used. As the cover member 87, other transparent resin, transparent glass, or other transparent material may be used.

  Other operations and effects in the present embodiment are the same as those in the first embodiment.

  FIG. 9 shows a plan view of a sixth embodiment of an illuminating device using the semiconductor light emitting device of the present invention.

  In the present embodiment, a grid-like guard member 98 is provided on the front surface of the housing 10 that is open.

  The configuration of other parts in the present embodiment is the same as that in the first embodiment, and therefore the same reference numerals are used for the same components. However, in FIG. 9, the LED substrate 11 and the LED element 11a are not shown.

  That is, in the present embodiment, a lattice-like guard member 98 that protects the front surface of the housing 10 that is open is provided. The guard member 98 is fixed by some attachment member so as to cover the front surface of the housing 10 and covers the front surface of the opening to guard the inside. The guard member 98 is formed, for example, by assembling and fixing metal bars of 3 to 4 mmφ in a lattice shape. The guard member 98 may use other materials, for example, resin, or may be configured in other shapes.

  Other operations and effects in the present embodiment are the same as those in the first embodiment.

  FIG. 10 schematically shows an overall configuration of a seventh embodiment of an illumination device using the semiconductor light emitting element of the present invention.

  In the figure, 101 is an LED substrate composed of a flexible substrate, and 102 is a light-transmitting gel layer that hermetically surrounds the LED substrate 101. In the present embodiment, there is no housing, and no heat dissipation heat sink mechanism is provided.

  The LED substrate 101 is a flexible substrate formed of a flexible insulating material, and a plurality of chip-type LED elements 101a are mounted on the LED substrate 101 in a matrix form in the present embodiment. In the example shown in FIG. 10, chip-type LED elements 101a are arranged on the LED substrate 101 in a 5 × 8 arrangement. The LED substrate 101 and the LED element 101a mounted thereon are supported by being hermetically surrounded by the gel layer 102. The shape of the LED substrate 101 may be a rectangular shape or a circular shape other than a square shape, or may be another shape.

  The LED element 101a may be any of a pseudo white LED element, a red LED element, a green LED element, and / or a blue LED element. Of course, the number and arrangement of the LED elements 101a are not limited to the example shown in FIG. A bullet-type LED element may be used instead of the chip-type LED element.

  In addition, although electrical wiring is made | formed with respect to all the LED elements 101a, these are abbreviate | omitting illustration in FIG.

  In this embodiment, the gel layer 102 is made of silicon as a main raw material, and is a soft but gel-like substance that can maintain its shape to some extent, for example, a silicon gel having a refractive index of about 1.41 and a refractive index different from the refractive index of the silicon gel. The light-transmitting birefringent fine particles 102a are uniformly dispersed in the silicon gel. The silicon gel is preferably one that has high light transmittance and good thermal conductivity. As such a silicon gel, for example, a silicon gel having a selected light transmittance can be used. Moreover, you may use a urethane gel or another gel instead of a silicon gel.

The gel layer 102 is obtained by, for example, mixing a proper amount of a curing agent into the main component of the silicon resin, uniformly mixing the birefringent fine particles 102a and injecting the mixture into the container, then degassing it with a vacuum pressure, and then curing it. Form. In this way, by pulling the gel layer 102 with a vacuum pressure of about 10 ⁻⁵ Pa and degassing, the heat conduction effect and the sealing performance can be further improved by removing air particles contained in the gel layer 102. Can be made.

  As the light-transmitting birefringent fine particles 102a, calcite grains having birefringence having a refractive index of about 1.65 to 1.7 are used. The diameter of each grain of calcite is about 5 to 6 μm. The light diffusion degree is adjusted depending on the degree of mixing of calcite grains into the silicon gel. The calcite grains themselves may be colored. In general, calcite is a negative uniaxial crystal having high birefringence, a wide range of wavelength transmissivity, and a relatively large rhomboid, and it is suitable for light beams with different polarization directions (normal light and extraordinary light) with respect to the optical axis. Since they are divided, very excellent light scattering characteristics can be obtained.

  Since the gel layer 102 hermetically surrounds the LED substrate 101, the LED element 101a, and the electrical wiring (not shown), the present lighting device has a perfect waterproof and explosion-proof function. For example, it has been confirmed that there is no problem even if it is operated by submerging it in the sea at a depth of 10 m for more than 24 hours.

  Hereinafter, the operation | movement regarding the illumination of the illuminating device in this embodiment and an effect are demonstrated.

  When the LED element 101a is caused to emit light by supplying a direct current to the LED element 101a via an electric wiring (not shown) to drive the LED element 101a, the emitted light enters the gel layer 102. Incident light to the gel layer 102 is uniformly dispersed in the silicon gel, and the portion emits light by being birefringed and diffused by calcite grains having a refractive index different from that of the silicon gel. As described above, in the present embodiment, light-transmitting calcite grains having a refractive index different from that of silicon gel are uniformly dispersed in the silicon gel. As a result, the portion emits very good light. In addition, since the LED substrate 101 and the LED element 101a are hermetically surrounded by the silicon gel, sufficient impact resistance and excellent water tightness can be obtained. In particular, in this embodiment, since the housing is not provided and is mainly configured by the gel layer 102 and the LED substrate 101 included therein, the overall shape can be arbitrarily changed. For example, the shape of the illuminating device can be changed corresponding to the unevenness, curved surface, bending, or the like of the portion where the lighting device is placed.

  FIG. 11 schematically shows the overall configuration of an eighth embodiment of a lighting apparatus using the semiconductor light emitting element of the present invention.

  In the figure, 110 is a tube-shaped casing, 111a is an LED element disposed in the casing 110, 112 is a light-transmitting material that is tightly filled throughout the casing 110 and hermetically surrounds the LED element 111a. Each gel layer is shown. In this embodiment, the heat sink mechanism for heat dissipation is not provided.

  In the present embodiment, the casing 110 is configured by forming a transparent or opaque, rigid or flexible resin that is light transmissive into a tube shape. A light transmissive resin may be used for only a part of the housing 110 that emits light. Furthermore, you may comprise a part with a metal.

  The LED element 111a may be any of a pseudo white LED element, a red LED element, a green LED element, and / or a blue LED element. Of course, the number and arrangement of the LED elements 111a are not limited to the example shown in FIG. A bullet-type LED element may be used instead of the chip-type LED element.

  In addition, although electrical wiring is made | formed with respect to all the LED elements 111a, these are abbreviate | omitting illustration in FIG.

  In this embodiment, the gel layer 112 has a very soft gel-like substance made mainly of silicon, for example, a silicon gel having a refractive index of about 1.41, and a refractive index different from the refractive index of the silicon gel. The light-transmitting birefringent fine particles 112a are uniformly dispersed in the silicon gel. The silicon gel is preferably one that has high light transmittance and good thermal conductivity. As such a silicon gel, for example, a silicon gel having a selected light transmittance can be used. Moreover, you may use a urethane gel or another gel instead of a silicon gel.

The gel layer 112 is, for example, mixed with a proper amount of a curing agent in a main component of a silicone resin and uniformly mixed with the birefringent fine particles 112a and injected into the housing 110, and then deaerated under a vacuum pressure and then cured. By forming. In this way, the gel layer 112 is pulled at a vacuum pressure of about 10 ⁻⁵ Pa and deaerated, so that the heat conduction effect and the sealing performance can be further improved by removing air particles (air capsules) contained in the gel layer 112. Can be made.

  As the light transmissive birefringent fine particles 112a, calcite grains having birefringence having a refractive index of about 1.65 to 1.7 are used. The diameter of each grain of calcite is about 5 to 6 μm. The light diffusion degree is adjusted depending on the degree of mixing of calcite grains into the silicon gel. The calcite grains themselves may be colored. In general, calcite is a negative uniaxial crystal having high birefringence, a wide range of wavelength transmissivity, and a relatively large rhomboid, and it is suitable for light beams with different polarization directions (normal light and extraordinary light) with respect to the optical axis. Since they are divided, very excellent light scattering characteristics can be obtained.

  Since the gel layer 112 is filled over the entire interior of the housing 110, and the LED element 111a and an electrical wiring (not shown) are hermetically sealed, the lighting device has a perfect waterproof and explosion-proof function. ing. For example, it has been confirmed that there is no problem even if it is operated by submerging it in the sea at a depth of 10 m for more than 24 hours.

  Hereinafter, the operation | movement regarding the illumination of the illuminating device in this embodiment and an effect are demonstrated.

  When the LED element 111a is caused to emit light by supplying a direct current to the LED element 111a via an electric wiring (not shown) and driving at a constant current, the emitted light enters the gel layer 112. Incident light to the gel layer 112 is uniformly dispersed in the silicon gel, and the portion emits light by being birefringed and diffused by calcite grains having a refractive index different from the refractive index of the silicon gel. As described above, in the present embodiment, light-transmitting calcite grains having a refractive index different from that of silicon gel are uniformly dispersed in the silicon gel. As a result, the portion emits very good light. In addition, since the LED element 111a is hermetically surrounded by the silicon gel, sufficient impact resistance and excellent water tightness can be obtained.

  In addition, as a housing | casing of this invention, other shapes other than the tube shape in embodiment mentioned above, for example, a rectangular parallelepiped shape, a cylindrical shape, a rectangular tube shape, a spherical shape, or a flat spherical shape may be sufficient.

  As the semiconductor light emitting element, a semiconductor laser array element or an organic electroluminescence (EL) element may be used instead of the LED element.

  All the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

10, 110 Housing 10a Metal support member 10b Bottom plate 10c Side wall 11, 71, 101 LED substrate 11a, 71a, 101a, 111a LED element 11b, 71b Bolt 11c, 71c Spacer 12, 52, 62, 102, 112 Gel layer 12a , 52a, 62a, 102a, 112a Birefringent fine particles 13 Heat sink mechanism for heat radiation 13a Substrate 13b Cylindrical fin 13b ₁ Air gap 13b ₂ Contact portion 13c Column member 13c ₁ Post 13c ₂ Control blade 14 Power supply wiring 15 Socket 16 Power cable 30, 31 Airflow 74 Printed wiring 87 Cover member 87a Rubber packing 98 Guard member

Claims (10)

  A plurality of semiconductor light emitting elements, a light-transmitting gel layer that hermetically surrounds the plurality of semiconductor light-emitting elements, and light-transmitting birefringent fine particles dispersed in the gel layer A lighting device using a semiconductor light emitting element.   The illumination device using a semiconductor light emitting element according to claim 1, wherein the birefringent fine particles include calcite grains.   3. The illumination device using a semiconductor light emitting element according to claim 2, wherein the calcite grains contain crystal powder having a diameter of about 5 to 6 [mu] m.   The lighting device using the semiconductor light emitting element according to claim 1, further comprising a housing in which the plurality of semiconductor light emitting elements and the gel layer are provided.   One surface of the housing is open, the plurality of semiconductor light emitting elements are arranged in the housing so as to irradiate light toward the opening, and the opening of the housing is only the gel layer. The illumination device using the semiconductor light-emitting element according to claim 4, wherein the illumination device is sealed with.   6. The illumination device using a semiconductor light emitting element according to claim 5, further comprising a transparent cover member that hermetically seals the one surface of the housing that is open.   The illumination device using a semiconductor light emitting element according to claim 5, further comprising a grid-like guard member provided on the one surface having the opening of the housing.   A power supply wiring electrically connected to the plurality of semiconductor light emitting elements, and an external connection terminal connected to one end of the power supply wiring and provided on a surface different from the one surface opening of the housing The illumination device using the semiconductor light emitting element according to claim 5, wherein the gel layer seals the external connection terminal portion.   The illumination device using a semiconductor light emitting element according to claim 4, further comprising a heat sink mechanism for heat dissipation fixed to an outer surface of the housing.   The lighting device using a semiconductor light emitting element according to claim 1, wherein the semiconductor light emitting element is a chip type light emitting diode element or a bullet type light emitting diode element.

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