JP2014227697A - Heat exchange unit and human body private part washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat exchange unit which has a heat exchanger plate in the middle of a fluid flow passage with an electronic component installed in contact therewith and prevents the electronic component from being damaged by a kinetic load applied through a member to fix the electronic component to the heat exchanger plate and to provide a human body private part washing device mounted with the heat exchange unit.SOLUTION: A heat exchange unit comprises: a fluid container with a flow passage, in which fluid flows, housed therein; and heating means which is installed in the fluid container and heats the fluid flowing in the flow passage. A heat exchanger plate is arranged on a wall face of the fluid container. The heat exchanger plate contacts the fluid and transfers heat between a surface exposed to an inner side of the fluid container and the surface exposed to an external side of the same. An electronic component which generates heat is arranged on the surface exposed to the external side of the heat exchanger plate. The electronic component is attached firmly to the heat exchanger plate with a pressing member which presses the electronic component toward the heat exchanger plate.

Description

  The present invention relates to a heat exchange unit and a human body local cleaning device, and more particularly to a heat exchange unit that heats a fluid and a human body local cleaning device including such a heat exchange unit.

  A heat exchange unit (heat sensitive plate, heat radiating plate) made of a material with high thermal conductivity, such as metal, in a water flow path in a heat exchange unit that is provided in a human body local cleaning device and supplies hot water heated to a predetermined temperature. A configuration in which a heat generating electronic component such as a triac and a safety device such as a thermal fuse are provided is known. For example, in Patent Document 1, a thermal fuse is provided on such a thermal plate, the abnormal heating temperature of the fluid is instantaneously transmitted to the thermal fuse via the thermal plate, and the instantaneous heating means for heating the fluid is energized. It is intended to instantaneously turn off. Also, Patent Document 2 discloses a configuration in which a triac (64) is fixed to a heat radiating plate (64a) (see FIG. 18 in Patent Document 2). According to such a configuration, the TRIAC that generates heat to a high temperature during operation can be cooled by the water flowing through the flow path.

JP 2005-139715 A JP 2001-132061 A

  As described above, an electronic component that generates heat or an electronic component that detects the temperature of the fluid is provided in close contact with the heat transfer plate provided in the flow channel of the heat exchange unit, so that the electronic component is Cooling and transferring the heat of the fluid to the electronic component. As described above, screwing is usually used as means for fixing the electronic component in close contact with the heat transfer plate. For example, Patent Document 2 discloses a configuration in which a triac (64) is screwed to a heat radiating plate (64a) in FIG.

  As described above, when the electronic component is screwed to the heat transfer plate, the electronic component may be damaged by the fastening force of the screw. In addition to a mechanical load being applied to the inside of the element by the fastening force of the screw itself, the terminals of the electronic component are fixed to the substrate by soldering or the like, and the substrate is accommodated in a housing such as a substrate case. In some cases, when the position of the substrate in the container is deviated within the range of the play, the terminal fixing part such as a soldering part and / or the screw fastening part fixing the electronic component to the heat transfer plate is mechanically applied. This is because addition is applied.

  The problem to be solved by the present invention is to attach an electronic component to a heat transfer plate in a heat exchange unit in which a heat transfer plate is provided in the middle of a fluid flow path and the electronic component is provided in contact with the heat transfer plate To provide a heat exchange unit in which an electronic component is prevented from being damaged by a mechanical load applied from a member for the purpose, and to provide a human body local washing device having such a heat exchange unit .

  In order to solve the above-described problems, a heat exchange unit according to the present invention includes a fluid container having a flow path through which a fluid flows, and a heating unit that is provided inside the fluid container and heats the fluid that flows through the flow path. A heat transfer plate that contacts the fluid and transfers heat between a surface facing the inside of the fluid container and a surface facing the outside, on the wall surface of the fluid container, An electronic component that generates heat is disposed on a surface facing the outside of the fluid container, and the electronic component is pressed toward the heat transfer plate by a pressing member and is in close contact with the heat transfer plate. The gist.

  Here, it is preferable that the pressing member is fastened and fixed to the heat transfer plate by fastening means.

  The electronic component may be plural.

  The gist of a human body local cleaning device according to the present invention is to supply hot water heated by the heat exchange unit as described above for human body local cleaning.

  In the heat exchange unit according to the present invention, since the heat generating electronic component is in thermal contact with the fluid flowing through the flow path via the heat transfer plate, the electronic component is cooled by the fluid flowing through the flow path. receive. Here, the electronic component is mounted on the heat transfer plate by being pressed against the surface of the heat transfer plate by the pressing member, and the electronic component is in the plane of the heat transfer plate, that is, parallel to the heat transfer plate. It is not constrained in the plane direction. Therefore, the electronic component is not subjected to a mechanical load acting in the plane of the heat transfer plate. When the terminal of the electronic component is fixed to the substrate, even if the position of the substrate is displaced, the mechanical load is hardly applied to the fixed portion of the terminal due to the displacement. As described above, the electronic component can be attached to the heat exchange unit in a state of being in thermal contact with the heat transfer plate while avoiding applying an excessive mechanical load to the electronic component.

  Here, when the pressing member is fastened and fixed to the heat transfer plate by fastening means, the position of the electronic component on the heat transfer plate is specified, and the electronic component is brought into close contact with the heat transfer plate. Can be made. Further, by adjusting the force applied to the pressing member by the fastening means, the pressing force applied to the electronic component by the pressing member can be adjusted, so that it is necessary and sufficient to press and fix the electronic component on the heat transfer plate. Can be obtained.

  In addition, when there are a plurality of electronic components, if the electronic components are fixed to the heat transfer plate by screwing, it is necessary to fix each electronic component using the same number of screws as the electronic components. On the other hand, by using the pressing member, it is not necessary to use a mounting member such as a screw for each electronic component. As a result, the number of members and processes required for mounting the electronic component can be reduced, and the manufacturing cost of the heat exchange unit can be suppressed.

  The human body local cleaning apparatus according to the present invention includes the heat exchange unit as described above, and the heat-generating electronic components required for controlling the heat exchange unit are in close contact with the heat transfer plate without receiving a mechanical load. Therefore, without being affected by the damage of the electronic component due to the mechanical load applied to the electronic component, the effect of cooling the electronic component by the fluid flowing through the flow path of the heat exchange unit is obtained, and the local washing can be stably performed. Hot water can be supplied.

It is the schematic which shows the heat exchange unit concerning 1st embodiment of this invention, (a) is a side view, (b) is a bottom view. It is AA sectional drawing of FIG.1 (b). It is a figure which shows an example of the fixing structure of the board | substrate with which an electronic component is mounted, (a) is a perspective view, (b) is a side view. It is the schematic which shows the structure of the cover vicinity of the heat exchange unit concerning 2nd embodiment of this invention, (a) is a side view, (b) is a bottom view. It is a schematic side view which shows the structure of the cover vicinity of the heat exchange unit concerning 3rd embodiment of this invention. It is the schematic which shows the structure of the cover vicinity of the heat exchange unit concerning 4th embodiment of this invention, (a) is a side view, (b) is a bottom view. It is the schematic which shows the structure of the cover vicinity of the heat exchange unit concerning 5th embodiment of this invention, (a) is a perspective view, (b) is a side view. It is the schematic which shows the structure of the cover vicinity of the heat exchange unit concerning the 6th embodiment of this invention, (a) is a side view, (b) is a bottom view.

  Hereinafter, a heat exchange unit according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a side view and a bottom view, respectively, of a heat exchange unit 1 according to the first embodiment of the present invention, and FIG. The heat exchange unit is also referred to as a heat exchanger or a fluid heating device, and heats the fluid flowing into the inside to a predetermined temperature and supplies the fluid to the outside. Hereinafter, the fluid heated by the heat exchange unit will be described as water.

  In the heat exchange unit 1 according to this embodiment, a heater (heating means) 12 capable of heating water by energization is inserted into the fluid container 10. The fluid container 10 includes an inlet 13 through which water flows from a water source such as a public water supply and an outlet 14 through which hot water flows out. The low-temperature water supplied from the water source is heated by the heater 12 to continuously supply hot water. It can supply outside from the outflow port 14.

  The heater 12 is a highly insulating heater capable of heating water with electric power. In consideration of designing the heat exchange unit 1 to be small, a hollow cylindrical ceramic heater having heating portions on both the inner wall surface and the outer wall surface can be exemplified. The output of the heater 12 is controlled by adjusting the amount of current input. The adjustment of the input current amount to the heater 12 is performed by a triac provided outside the fluid container 10 as will be described later.

  Inside the fluid container 10, a heater 12 is accommodated, and a flow path C through which water flows is formed. In the present embodiment, the fluid container 10 has a substantially cylindrical shape with a bottom surface sealed. The heater 12 is attached to the fluid container 10 so that the central axis of the cylindrical heating unit is parallel to the longitudinal axis of the fluid container 10. The tip of the heater 12 is not in contact with the bottom of the fluid container 10.

  The inlet 13 is an opening at the upper end of the heater 12, and water flows from the water source through the inlet 13 into the cylindrical body of the heater 12. The outflow port 14 is an opening provided on the wall surface of the fluid container 10. As shown in FIG. 2, a flow path C through which water flows is formed inside the fluid container 10, which is partitioned by the wall surface of the fluid container 10 and the heater 12. That is, water that has entered from the inlet 13 at the end of the heater 12 flows in the cylindrical direction of the heater 12 in the axial direction of the heater 12 and reaches the tip of the heater 12. The water then moves from the tip of the heater 12 to a space between the outer wall surface of the heater 12 and the outer wall of the fluid container 10, and flows from the bottom of the fluid container 10 to the outlet 14 along the longitudinal direction of the fluid container 10. While flowing through this flow path C, the water is heated by contact with the heater 12.

  The heat exchange unit 1 can be appropriately provided with a temperature sensor that detects the temperature of heated hot water, a valve that adjusts the inflow and / or outflow of water, a water flow meter, various safety devices, and the like in addition to the above-described members. .

  As shown in FIG. 2, a through hole 15 is formed in the side wall surface 10 a of the fluid container 10, and the through hole 15 is closed by the heat transfer plate 20. That is, a part of the side wall surface 10 a of the fluid container is formed from the heat transfer plate 20. The inner surface 20 a of the heat transfer plate 20 is in contact with the fluid flowing through the flow path C in the fluid container 10, and the outer surface 20 b is exposed to the environment outside the fluid container 10. The heat transfer plate 20 is made of a plate material having a high thermal conductivity. Examples of the material of the heat transfer plate 20 include metals including copper. Due to the high thermal conductivity of the heat transfer plate 20, heat transfer occurs between the inner side surface 20 a and the outer side surface 20 b of the heat transfer plate 20. That is, the water in contact with the inner surface 20 a of the heat transfer plate 20 and the substance in contact with the outer surface 20 b are in thermal contact with each other via the heat transfer plate 20. The heat transfer plate 20 has an electronic component mounting portion 22 that does not constitute the side wall surface of the heat exchange unit 1 and is continuous with the wall surface portion 21 that constitutes the side wall surface of the fluid container 10.

  As shown in FIG. 1, the heat transfer plate 20 is provided with an electronic component 30 that generates heat in close contact with the electronic component mounting portion 22. The electronic component 30 that generates heat is, for example, a triac. As described above, the triac adjusts the temperature at which the water flowing through the flow path C is heated by controlling the input current of the heater 12. In the present embodiment, two electronic components 30 are provided, and the output of the heater 12 can be controlled stepwise by a combination of the on / off states. The electronic component 30 has a plate-shaped attachment portion 30b adjacent to the main body portion 30a in addition to the main body portion 30a having elements and the like therein. In FIG. 1 and FIGS. 4 to 8, a substrate on which the electronic component 30 is mounted is omitted.

  The electronic component 30 is attached to the electronic component attachment portion 22 of the heat transfer plate 20 by a pressing force of the cover 40 serving as a pressing member without using a fastening member such as a screw. The cover 40 has a sleeve shape with a substantially rectangular cross section. A distance Dw between the side surfaces 43 and 43 of the cover 40 facing each other is formed to be equal to or wider than the width of the heat transfer plate 20, and a distance Dh between the pressing surface 41 and the base surface 42 of the cover 40 facing each other is It is formed to be the same as or slightly smaller than the total thickness of the heat transfer plate 20 and the mounting portion 30b of the electronic component 30.

  In a state where the electronic component 30 is disposed at a predetermined position on the outer surface 20b of the heat transfer plate 20, the cover 40 is connected to the mounting portion 30b of the electronic component 30 from the edge of the electronic component mounting portion 22 of the heat transfer plate 20. It attaches so that the electronic member attaching part 22 of the heat exchanger plate 20 may be inserted | pinched. And the pressing surface 41 of the cover 40 contacts the attachment part 30b of the electronic component 30, and the base surface 42 contacts the electronic component attachment part 22 of the heat exchanger plate 20 from the back side. Since the distance Dh between the pressing surface 41 and the base surface 42 of the cover 40 is formed to be the same as or slightly smaller than the total thickness of the heat transfer plate 20 and the electronic component 30, 30 and the heat transfer plate 20 are press-fitted into a space between the pressing surface 41 and the base surface 42 of the cover 40 and receive a pressing force directed inward from the pressing surface 41 and the base surface 42 of the cover 40. As a result, the electronic component 30 is pressed against the electronic component mounting portion 22 of the heat transfer plate 20 and is brought into close contact with the heat transfer plate 20.

  In this manner, the electronic component 30 is provided in close contact with the heat transfer plate 20 that constitutes the outer wall of the flow path C and is in direct contact with the water flowing through the flow path C. Even when the flowing water is in thermal contact with the heat transfer plate 20 and the electronic component 30 generates heat during operation, the electronic component 30 can be cooled by the water flowing through the flow path C. By cooling the electronic component 30 in this way, the electronic component 30 can be continuously operated stably. A representative example of a component that generates heat during operation is a triac. The triac is a member that generates heat to a very high temperature during operation, and is easily heated to around 100 ° C. Therefore, although the water flowing through the channel C is heated by the heater 12, it is usually at a lower temperature than the triac, and the water flowing through the channel C can be used to cool the triac. In particular, when the heat exchange unit 1 is used in a human body local washing apparatus, the upper limit of the hot water temperature supplied by the heat exchange unit 1 is a temperature at which it does not feel excessively hot even when contacting the human body (for example, 40 ° C. Therefore, the temperature of the water flowing through the channel C is much lower than the heat generation temperature of the triac, and the triac can be efficiently cooled.

  In the heat exchange unit 1 according to the present embodiment, as described above, the electronic component 30 is in close contact with the heat transfer plate 20 not only in the out-of-plane direction of the heat transfer plate 20 but also in the plane. The cover 40 presses the electronic component 30 toward the surface of the heat transfer plate 20 instead of the fastening member that is firmly fixed in the direction. Thereby, the electronic component 30 is not mechanically restricted in the in-plane direction of the heat transfer plate 20. Usually, the electronic component 30 such as a triac is designed so that it can be fixed to another member by screwing using a through hole 30c formed in the mounting portion 30b, and the upper limit value of the fastening torque. However, when screwing, a fastening torque exceeding the upper limit value can be easily applied. Then, an excessive force that causes the electronic component 30 to be deformed in the in-plane direction may act, and the electronic component 30 may be damaged. On the other hand, when the electronic component 30 is brought into close contact with the heat transfer plate 20 only by being pressed against the heat transfer plate 20 by a pressing member such as the cover 40, a mechanical load that gives distortion to the electronic component 30 is given. In other words, the electronic component 30 is prevented from being damaged by a member for forming a close contact with the heat transfer plate 20. The pressing force applied to the electronic component 30 by the cover 40 is defined by the material and shape of the cover 40, particularly the distance Dh between the pressing surface 41 and the base surface 42. Since it does not depend, it is also possible to avoid applying a pressing force that damages the electronic component 30 depending on the mounting method. The cover 40 is preferably made of a resin so that the cover 40 is easily elastically deformed in the direction connecting the pressing surface 41 and the base surface 42, and the pressing force is easily applied to the electronic component 30 by press-fitting.

  In addition, when the electronic component 30 is fixed to the substrate or the like by soldering the terminal 31 or the like, the electronic component 30 is brought into close contact with the heat transfer plate 20 using a pressing member, and heat transfer The effect of not being subjected to mechanical restraint in the in-plane direction of the plate 20 is further exhibited. Since this type of substrate is provided in an environment where water is used, it is necessary to ensure insulation, so that it is accommodated in a resin substrate case, and the gap between the substrate case and the substrate is filled with potting resin. Is common. There is inevitably a gap between the substrate case or the potting resin and the substrate, and the substrate can move within the range of the gap. In this case, when the electronic component 30 is fastened with a fastening member such as a screw that gives in-plane mechanical restraint to the heat transfer plate 20, the fastening portion or a mounting portion (solder between the board 31 and the terminal 31). A mechanical load acting in the in-plane direction of the heat transfer plate 20 is applied to the attachment portion). On the other hand, when the electronic component 30 is in close contact with the heat transfer plate 20 in the state where there is no mechanical restriction in the in-plane direction of the heat transfer plate 20 by the pressing member as in the above embodiment, the electronic component 30 is movable in the in-plane direction of the heat transfer plate 20 and can absorb the movement of the substrate, and thus acts on the fixing part between the electronic component 30 main body and the substrate and the terminal 31 in the in-plane direction. It is avoided that a mechanical load is applied.

  Furthermore, since the electronic component 30 is in close contact with the heat transfer plate 20 by a pressing member such as a cover 40 instead of a fastening member such as a screw, a fastening member for fixing the electronic component 30 becomes unnecessary, and the fastening is performed. A process is also unnecessary. In the present embodiment, a plurality of electronic components 30 are provided, and they are in close contact with the heat transfer plate 20 by a single cover 40. Therefore, compared to the case where only one electronic component 30 is provided, The effect of reducing the manufacturing cost of the heat exchange unit 1 by eliminating the fastening member and eliminating the fastening process can be greatly obtained. This is because, when fastening the electronic component 30, the number of fastening means equal to the number of parts is required, and the number of fastening steps increases by that number. This is because only one cover 40 is required regardless of the number of components 30, and the process of attaching the cover 40 and pressing the electronic component 30 only needs to be performed once. In the cover 40 described above, the electronic component 30 is pressed by the pressing surface 41. Therefore, as long as the pressing surface 41 is sufficiently wide, it is possible to easily exert a pressing force on the plurality of electronic components 30 having the same shape. However, even when only one electronic component 30 is provided, although the effect of reducing the manufacturing cost by applying the pressing member is not so great, the effect of avoiding the damage of the electronic component 30 as described above can be similarly enjoyed. it can.

  When the electronic component 30 is mounted on the substrate, the substrate may be fixed to the fluid container 10 by any mechanism. As an example, a substrate fixing structure as shown in FIG. 3 can be shown. FIG. 3A is a perspective view in which only the heat transfer plate 20, the electronic component 30, the substrate case 50, and the substrate 55 are extracted. FIG. 3B shows a side view of the fluid container 10 attached to the side wall surface 10a and the cover 40 attached thereto.

  In the example of FIG. 3, the heat transfer plate 20 has a step 23 between the wall surface portion 21 and the electronic component mounting portion 22, and the surfaces of the wall surface portion 21 and the electronic component mounting portion 22 are substantially parallel. The flat bottom surface 50a of the substrate case 50 is in close contact with the wall surface portion 21 of the heat transfer plate 20 attached to the side wall surface 10a of the fluid container 10, and is fixed to the heat transfer plate 20 by screwing. The electronic component mounting portion 22 of the heat transfer plate 20 is not in contact with the side wall surface 10a of the fluid container 10, and has a distance from the side wall surface 10a.

  Here, the electronic component 30 is mounted in the vicinity of the edge 55 a of the substrate 55, and is disposed so as to protrude outside the edge 50 b of the substrate case 50. The height of the step 23 between the wall surface portion 21 of the heat transfer plate 20 and the electronic component mounting portion 22 is formed to be equal to the difference in height between the back surface 33 of the electronic component and the bottom surface 50a of the board case 50 at this time. Has been. Then, as shown in FIG. 3B, when the substrate case 50 containing the substrate 55 on which the electronic component 30 is mounted is attached in close contact with the wall surface portion 21 of the heat transfer plate 20, the effect of the step 23 is automatically applied. The back surface 33 of the electronic component 30 comes into contact with the electronic component mounting portion 22 of the heat transfer plate 20. In this state, the cover 40 is inserted into the electronic component mounting portion 22 of the heat transfer plate 20, and the electronic component 30 is pressed by sandwiching the mounting portion 30 b of the electronic component 30 and the electronic component mounting portion 22 of the heat transfer plate 20. The heat transfer plate 20 can be closely attached.

  Thus, by fixing the board | substrate 55 required for control of the heat exchange unit 1 to the side wall surface 10a of the fluid container 10, the whole heat exchange unit 1 is designed compactly especially about the direction orthogonal to a longitudinal direction. Can do. This is particularly effective when the heat exchange unit 1 is used in a human body local cleaning device that is required to be disposed in a limited space. Further, by forming the step 23 on the heat transfer plate 20 and keeping the electronic component mounting portion 22 away from the side wall surface 10a of the fluid container 10, the cover 40 can be easily attached to the electronic component mounting portion 22. It is possible to do.

  Various modifications can be considered for the heat exchange unit 1 according to the first embodiment of the present invention. In the heat exchange unit 1 according to the first embodiment, the cover 40 is positioned with respect to the heat transfer plate 20 only by the pressing force from the cover 40 to the heat transfer plate 20 and the electronic component 30. FIG. In the second embodiment showing the structure near the cover 50, the cover 50 is fastened and fixed to the heat transfer plate 20 by screws (fastening means) 54.

  Each of the pressing surface 51 and the base surface 52 of the cover 50 is formed with a through hole through which the screw 54 can be inserted. The heat transfer plate 20 is also formed with a through-hole through which the screw 54 can be inserted. When attaching the cover 50, with the electronic component 30 and the heat transfer plate 20 sandwiched between the covers 50, the positions of the through holes of the pressing surface 51 and the base surface 52 of the cover 50 and the through holes of the heat transfer plate 20 are aligned. What is necessary is just to insert the screw 54 in them and fasten it using the nut 54a.

  Thus, by fixing the cover 50 to the heat transfer plate 20 using the screws 54, the cover 50 is positioned with respect to the heat transfer plate 20, and as a result, compared with a case where such screws are not used. The electronic component 30 is pressed toward the heat transfer plate 20 in a state where the electronic component 30 is well positioned with respect to the heat transfer plate 20, and is in close contact with the heat transfer plate 20 in a state where the electronic component 30 is stably held. Further, by adjusting the degree of tightening of the screw 54 within a range in which the material constituting the cover 50 can be elastically deformed, the pressing force exerted on the electronic component 30 from the cover 50 can be adjusted. That is, as the screw 54 is tightened more deeply, the pressing surface 51 and / or the base surface 52 of the cover 50 are elastically deformed and sandwiched in the direction in which the distance Dh between the pressing surface 51 and the base surface 52 of the cover 50 is narrowed. The pressing force exerted on 30 increases. As described above, the pressing force exerted on the electronic component 30 by the cover 50 can be adjusted, so that the pressing force necessary and sufficient for the electronic component 30 to adhere to the heat transfer plate 20 can be easily realized. Even if there are some variations in the dimensions of the electronic component 30 and the thickness of the heat transfer plate 20, these variations can be absorbed by adjusting the tightening degree of the screws 54. The fastening method may be configured such that a through hole is formed in the base surface 52 and a screw is tapped on the pressing surface 51. In this case, the nut 54a can be eliminated.

  As a modification of the configuration in which the cover 50 is fixed to the heat transfer plate 20 using such screws 54 and the cover 50 is elastically deformed to adjust the pressing force, the configuration of the cover 60 is configured for the third embodiment. As shown in FIG. Here, the distance from the base surface 62 is narrower toward the area where the two electronic components 30 on both sides are disposed from the center of the cover 60 through which the screws 64 are inserted inside the pressing surface 61 of the cover 60. An inclined surface 65 is formed. Further, a thin portion 66 in which the plate thickness of the pressing surface 61 is thinner than the plate thickness of the central portion through which the screw 64 is inserted is formed in a region on both end sides from the portion where the electronic component 30 is disposed. ing. Furthermore, a protrusion 67 is provided at a portion where the electronic component 30 is not disposed so as to protrude from the pressing surface 61 toward the inside of the cover 60.

  As in the second embodiment, when the inner surface of the pressing surface 51 is flat, a screw is disposed at the center of the cover 50 and the region close to the screw when fastened to the heat transfer plate 20. The pressing surface 51 is relatively greatly elastically deformed and the distance between the pressing surface 51 and the base surface 52 is reduced. On the other hand, the pressing surface 51 in a region far from the screw has a relatively small degree of elastic deformation, and the base surface 52 And the distance is not too close. Therefore, the closer to the screw 54, the higher the pressing force is exerted on the electronic component 30. However, in the present embodiment, the inner surface of the pressing surface 61 is provided with the inclined surface 65 that is closer to the base surface 62 as the distance from the screw 64 is longer. When the electronic component 30 is arranged between them and the screw 64 at the center of the cover 60 is tightened, the electronic component 30 is easily pressed evenly on the surface. Further, since the thin portion 66 is provided at a position far from the screw 64, this portion is more easily bent than other portions. This also contributes to making the fastening force exerted on the electronic component 30 uniform when the screw 64 is tightened. With these effects, the electronic component 30 is evenly adhered to the heat transfer plate 20 and is cooled evenly.

  Furthermore, the protrusion 67 is provided on the inner side of the pressing surface 61, so that the tightening depth of the screw 64 can be regulated. This is because when the protrusion 67 contacts the base surface 62, the screw 64 cannot be tightened any further. As described above, when the electronic component 30 is brought into close contact with the heat transfer plate 20 by pressing, the mechanical load applied to the electronic component 30 can be greatly reduced as compared with the case where a fastening member such as a screw is used. If the pressure is excessively high, the mechanical load applied to the electronic component 30 may not be ignored. By restricting the tightening depth of the screw 64 by the protrusion 67, such a situation can be prevented. The protrusion 67 also serves to prevent damage to the cover 60 itself due to excessive tightening of the screw 64.

  As in the second embodiment and the third embodiment, the configuration of the fourth embodiment in FIG. 6 can be cited as a configuration that can fix the cover to the heat transfer plate 20. Here, the cover is fixed using a claw-like engaging member instead of the screw. The cover 70 in the fourth embodiment includes a pressing surface 71 and an engaging claw 72 protruding from the pressing surface 71. As in the above embodiments, the base surface that faces the pressing surface is not provided. A hook-shaped structure is formed at the distal end 72a of the engaging claw. The heat transfer plate 20 is formed with an engagement hole into which the engagement claw 72 can be inserted to engage the hook-shaped tip 72a. By inserting the engaging claw 72 of the cover 70 into the engaging hole of the heat transfer plate 20 in a state where the electronic component 30 is disposed on the electronic component mounting portion 22 of the heat transfer plate 20, the tip 72a is engaged. The electronic component 30 is sandwiched between the pressing surface 71 of the 70 and the electronic component mounting portion 22 of the heat transfer plate 20 and is in close contact with the heat transfer plate 20.

  Also in this case, the cover 70 is positioned with respect to the heat transfer plate 20 in the same manner as in the second and third embodiments in which the cover is fixed to the heat transfer plate 20 using screws, and as a result. As described above, the electronic component 30 can be brought into close contact with the heat transfer plate 20 in a stable state. Unlike the case of the second embodiment and the third embodiment, the distance between the pressing surface 71 and the heat transfer plate 20 is defined by the height of the engaging claw 72, and therefore the pressing force exerted on the electronic component 30 However, the cover 70 can be easily attached to the heat transfer plate 20 only by the process of inserting and engaging the engagement claw 72 into the engagement hole, which can be easily performed as compared with the screw fastening process. The electronic component 30 can be brought into close contact with the heat transfer plate 20 by being fixed.

  In the above four embodiments, the cover having a flat surface is used to press the electronic component 30 with the surface, and the electronic component 30 is brought into close contact with the heat transfer plate 20. The structure which presses the heat exchanger plate 20 using the cover which has can be shown. In the fifth embodiment shown in FIG. 7, the cover 80 includes a flat portion 82 and a clip portion 81. The clip part 81 has a shape in which a plate material continuous with the flat part 82 is bent into a substantially J-shaped cross section, and its tip part is bent back to the opposite side of the flat part 82 in the bent back part 81a. It is biased toward the 82 side.

  The cover 80 is fixed to the heat transfer plate 20 by screwing the flat portion 82 using screws 83. Then, the electronic component 30 is sandwiched in the gap between the clip portion 81 and the heat transfer plate 20 by bending the clip portion 81 so that the cross-section J-shaped portion is widened. As a result, the electronic component 30 comes into contact with the clip portion 81 and the bent-back portion 81a, and is pressed toward the heat transfer plate 20 by the force with which the clip portion 81 is urged toward the flat surface portion 82 side. It is in close contact with the plate 20.

  In the clip portion 81, the cover 80 according to the present embodiment is preferably made of metal so that the electronic component 30 can be pressed with a large force. This is because the metal exhibits high spring properties when used as a leaf spring. In addition, the distance between the bent-back portion 81a and the heat transfer plate 20 in a state where the electronic component 30 is not sandwiched between the clip portions 81 is the same as the thickness of the minimum electronic component 30 within the range of dimensional tolerances assumed. It should be set smaller than this. Then, the electronic component 30 can be pressed by the bent-back portion 81a of the clip portion 81 no matter what thickness the electronic component 30 is sandwiched within the range of the dimensional tolerance.

  As described above, as a modification of the embodiment including the cover 80 having the metal clip portion 81, the cover 80 is not formed as a member independent of the heat transfer plate 20, and the end of the heat transfer plate 20 is curved. The clip portion 81 can be formed integrally with the heat transfer plate 20. Then, the number of parts can be reduced.

  In each of the embodiments described above, the heat generating electronic component 30 typified by the triac is in close contact with the heat transfer plate 20 constituting a part of the wall surface of the flow path C of the fluid container 10 and cooled. On the plate 20, a safety device that operates by detecting abnormal heating of the water flowing through the channel C can be provided at the same time. An example of this type of safety device is a thermal fuse inserted in a power supply circuit to the heater 12. FIG. 8 shows a sixth embodiment in which a structure for attaching a thermal fuse 35 is added based on the configuration of the fourth embodiment. That is, a temperature fuse pressing portion 93 along the shape of the temperature fuse 35 and a guide portion 94 for positioning the temperature fuse are formed on the pressing surface 91 of the cover 90 pressing the electronic member that generates heat. The thermal fuse 35 positioned by the guide portion 94 is pressed toward the heat transfer plate 20 together with the electronic component 30 by the temperature fuse pressing portion 93 and is in close contact with the heat transfer plate 20. Thus, by arranging the thermal fuse 35 in close contact with the heat transfer plate 20, abnormal heating of water can be detected sensitively, and the power supply to the heater 12 can be quickly shut off.

  Finally, the human body local cleaning apparatus according to the embodiment of the present invention includes the heat exchange unit according to any one of the above embodiments. The human body local cleaning device is provided in the toilet seat, and performs butt cleaning or so-called bidet cleaning by ejecting hot water from a nozzle. The heat exchange unit supplies hot water heated to a predetermined temperature for ejection from the nozzle.

  As described above, the electronic component 30 that generates heat provided in the heat exchange unit is cooled by the water flowing through the flow path C, thereby preventing thermal degradation. In addition, since the electronic component 30 is brought into close contact with the heat transfer plate 20 by the pressing member and damage due to the mechanical load is avoided, the influence of the mechanical load may cause the electronic component 30 to deteriorate or become unstable. It is prevented from causing. As a result of these, the heat exchange unit including the electronic component 30 is operated stably and with a long life. The user can comfortably use the human body local cleaning device for a long period of time.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment at all, A various change is possible in the range which does not deviate from the summary of this invention. For example, the heater (heating means) of the heat exchange unit does not have to be cylindrical, and the flow path C configured in the fluid container also extends from the inner region of the hollow heater 12 as shown in FIG. It does not have to reach the area. That is, in a heat exchange unit having a heater and a flow path having an arbitrary shape, a heat transfer plate is disposed on a part of the side wall surface of the fluid container in contact with the flow path, and a pressing member as described in each of the above embodiments is used. Thus, the electronic member that generates heat can be adhered to the heat transfer plate.

DESCRIPTION OF SYMBOLS 1 Heat exchange unit 10 Fluid container 12 Heater 13 Inlet 14 Outlet 20 Heat-transfer plate 20a Inner side surface 20b (of a heat-transfer plate) Outer side surface 21 (Heat-transfer plate) Wall surface part 22 Electronic component attachment part 30 (Heat generation) Electronic component 30a Body portion 30b Mounting portion 31 Terminals 40, 50, 60, 70, 80, 90 Covers 41, 51, 61, 71, 91 Press surfaces 42, 52, 62 Base surface 54, 64 Screw 50 Substrate case 55 Substrate 65 Inclined surface 66 Thin-walled portion 67 Projection 72 Engagement claw 81 Clip portion 81a Bending portion 82 Flat portion 93 Thermal fuse pressing portion C Flow path

Claims (4)

A fluid container having a flow path through which fluid flows, and a heating unit provided inside the fluid container for heating the fluid flowing through the flow path,
The wall surface of the fluid container has a heat transfer plate that contacts the fluid and transfers heat between a surface facing the inside of the fluid container and a surface facing the outside.
On the surface facing the outside of the fluid container of the heat transfer plate, an electronic component that generates heat is disposed,
The heat exchange unit, wherein the electronic component is pressed against the heat transfer plate by a pressing member and is in close contact with the heat transfer plate.   The heat exchange unit according to claim 1, wherein the pressing member is fastened and fixed to the heat transfer plate by fastening means.   The heat exchange unit according to claim 1, wherein the electronic component includes a plurality of electronic components.   A human body local cleaning apparatus, wherein hot water heated by the heat exchange unit according to any one of claims 1 to 3 is supplied for human body local cleaning.

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