JP5261297B2 - Gas supply unit and gas supply device - Google Patents

Description

  The present invention relates to a gas supply unit and a gas supply device.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a gas supply device that supplies process gas to process equipment such as a thin film generation device and a dry etching device has been used (for example, see Patent Document 1). The gas supply device described in Patent Document 1 includes a plurality of rows of gas supply units arranged in parallel to each other. Each gas supply unit has a plurality of flow channel blocks each having a gas flow channel formed therein arranged on a straight line, and an open / close valve that opens and closes the gas flow channel of each flow channel block is provided on the flow channel block. .

JP 2003-91322 A

  By the way, in the thing of patent document 1, when a solenoid valve is employ | adopted as an on-off valve, it is thought that the heat_generation | fever in a solenoid valve becomes a problem. That is, when a plurality of solenoid valves are arranged on the flow path block to configure the gas supply unit, or when the gas supply unit is further configured by integrating the gas supply unit, heat is likely to be accumulated. At the same time, the place where heat is released is limited. In particular, when a solenoid valve having a large rated current is adopted as the gas supply device is miniaturized and highly integrated, such a tendency becomes remarkable.

  The present invention has been made in view of such circumstances, and a main object of the present invention is to provide a gas supply unit and a gas supply device that can appropriately perform heat dissipation from the electromagnetic valve.

  In order to solve the above problems, a first invention includes a flow path block provided with a flow path therein, and a plurality of electromagnetic valves that change a flow state of a gas flowing through the flow path. The valve is a gas supply unit having a coil and a case arranged on the outer periphery of the coil, wherein the flow path block is formed in a rectangular parallelepiped shape, and the plurality of electromagnetic valves are mounted. The plurality of solenoid valves are arranged in series along the longitudinal direction of the valve mounting surface, and the length of the valve mounting surface extends across each case of the plurality of solenoid valves. A heat transfer member having a case contact portion that extends along the direction and contacts the case; and a block connecting portion that connects the case contact portion to the valve mounting surface of the flow path block. Features.

  According to the said structure, gas distribute | circulates the flow path provided in the inside of a flow path block, and the distribution | circulation state of the gas is changed by several solenoid valves. Each solenoid valve has a coil, and the coil generates heat as it is driven. Then, the heat generated in the coil is transmitted to the case disposed on the outer periphery of the coil.

  The flow path block is formed in a rectangular parallelepiped shape extending in a long shape, and a plurality of electromagnetic valves are arranged in series along the longitudinal direction of the valve mounting surface. The case contact portion of the heat transfer member extends along the longitudinal direction of the valve mounting surface so as to straddle each case of the plurality of solenoid valves, and is in contact with each case of the plurality of solenoid valves. Here, when the gas supply state is controlled by the gas supply unit, a plurality of solenoid valves are rarely driven at the same time. For this reason, the heat which generate | occur | produces with the driven solenoid valve will be transmitted by the case contact part to the direction of the other solenoid valve which is not driven. And the block connection part which a heat-transfer member has has connected the case contact part to the valve mounting surface of a flow-path block. For this reason, the heat transmitted to the longitudinal direction of a valve mounting surface by a case contact part can be discharge | released to a flow path block by a block connection part. As a result, in the gas supply unit in which a plurality of solenoid valves are mounted on the flow path block, heat radiation from the solenoid valves can be appropriately performed. Furthermore, since the block connecting portion connects the case contact portion to the valve mounting surface of the flow channel block, it is not necessary to use the side surface of the flow channel block or the like, and is suitable for integration of the gas supply unit.

  Further, the heat released from the electromagnetic valve to the flow channel block can be used for heating the gas flowing through the flow channel in the flow channel block.

  In addition, the aspect in which a member or a part contacts each other includes a configuration in which the member or part is fixed to each other. In short, any structure may be used as long as the members and parts directly transfer heat to each other.

  According to a second invention, in the first invention, the case contact portion extends so as to cover all of the plurality of electromagnetic valves along the longitudinal direction of the valve mounting surface, and contacts the cases of all the electromagnetic valves. It is touched. For this reason, the heat transmitted from each case of the electromagnetic valve to the case contact portion is transmitted to the range over all of the plurality of electromagnetic valves by the case contact portion. Therefore, the heat generated in the electromagnetic valve can be diffused to a wider range, and the temperature difference between the electromagnetic valves can be reduced. As a result, heat radiation from the electromagnetic valve can be performed stably.

  According to a third invention, in the first or second invention, the case contact portion is formed in a flat plate shape, and the case of the electromagnetic valve has a case flat portion formed to form a plane, The case contact portion and the case flat portion are in contact with each other on a flat surface.

  According to the above configuration, the case contact portion formed in a flat plate shape and the case flat portion formed so as to form a flat surface are in contact with each other between the case contact portion and the case. Heat can be more reliably transferred through the plane. Therefore, the heat transfer efficiency between the case contact portion and the case of the electromagnetic valve can be improved while the case contact portion has a simple flat plate shape.

  In 4th invention, in 3rd invention, the said case plane part is arrange | positioned substantially parallel with respect to the both sides which pinch | interpose the said valve mounting surface from the width direction in the said flow-path block. For this reason, it becomes possible to extend in the direction perpendicular to the longitudinal direction of the valve mounting surface or the valve mounting surface while suppressing the case flat portion from extending in the width direction of the valve mounting surface. Therefore, the width of the case flat portion can be ensured without being limited by the width of the gas supply unit.

  When the number of the block connecting portions that connect the case contact portion to the valve mounting surface of the flow path block is small, the heat transfer efficiency from the case contact portion to the flow path block may be lowered. On the other hand, if a space for arranging the block connecting portion on the valve mounting surface is newly provided, the area of the valve mounting surface may be increased.

  In this regard, in the fifth invention, in any one of the first to fourth inventions, the block connecting portion is connected to a portion between the plurality of electromagnetic valves on the valve mounting surface. For this reason, a block joint part can be arrange | positioned to a valve mounting surface using the empty part of a valve mounting surface. Therefore, it is possible to improve the heat transfer efficiency from the case contact portion to the flow path block while suppressing an increase in the area of the valve mounting surface.

  In the gas supply unit, the number of solenoid valves is changed according to the type and number of gases used. Therefore, by providing a drive circuit board for driving each solenoid valve for each solenoid valve, it is possible to flexibly cope with a change in the number of solenoid valves. However, in order to arrange the drive circuit board corresponding to the vicinity of the electromagnetic valve, it is necessary to protect the drive circuit board from the heat generated by the electromagnetic valve.

  In this regard, in the sixth invention, on the premise of any one of the first to fifth inventions, a drive circuit board for driving each of the solenoid valves is provided for each of the solenoid valves, In the road block, the valve mounting surface is disposed substantially parallel to both side surfaces sandwiching the valve mounting surface from the width direction. For this reason, heat dissipation from the electromagnetic valve is appropriately performed by the heat transfer member, and the drive circuit board can be protected from the heat generated by the electromagnetic valve. Therefore, the drive circuit board corresponding to the vicinity of the solenoid valve can be arranged, and the change in the number of solenoid valves can be flexibly dealt with. Furthermore, since the wiring connecting the coil and the drive circuit can be shortened, power loss in the wiring can be suppressed.

  The drive circuit board is disposed substantially parallel to both side surfaces of the flow path block. For this reason, the drive circuit board can be extended in the longitudinal direction of the valve mounting surface or in a direction perpendicular to the valve mounting surface while suppressing extending in the width direction of the valve mounting surface. Therefore, it becomes easy to arrange the drive circuit board in the vicinity of the electromagnetic valve without being limited by the width of the gas supply unit.

  According to a seventh aspect, in the sixth aspect, the drive circuit board is supported by a support member connected to the valve mounting surface, and a gap is provided between the case of the electromagnetic valve and the support member. Is formed. For this reason, heat transfer from the case of the electromagnetic valve to the drive circuit board is suppressed.

  When a gas supply apparatus is configured by integrating a plurality of gas supply units, the tendency that heat is easily accumulated and a place where heat is released is limited is remarkable.

  In this regard, the eighth invention is based on any one of the first to seventh inventions, and the gas supply unit is arranged such that both side surfaces sandwiching the valve mounting surface from the width direction are adjacent to each other in the flow path block. Arranged in parallel. For this reason, it is possible to appropriately dissipate heat from the electromagnetic valve while integrating the gas supply units to configure the gas supply device.

  Furthermore, in the ninth invention, in the eighth invention, since the adjacent side surfaces of the flow path block are in contact with each other, the gap between the gas supply units is omitted, and the gas supply device is highly integrated, Heat dissipation from the solenoid valve can be performed appropriately.

  According to a tenth aspect, in the eighth aspect, the apparatus includes a heater for heating the gas flowing through the flow path, and the plurality of the plurality of heaters are sandwiched between the adjacent side surfaces of the flow path block. The flow path blocks of the gas supply unit are integrated with each other. For this reason, two adjacent flow path blocks can be heated by both surfaces of one heater. Therefore, it is not necessary to provide a heater for heating each flow path block between adjacent flow path blocks, and the space for attaching the heater can be reduced. Furthermore, since it is not necessary to set a gap between the flow path blocks, the distance between the flow path blocks can be reduced. As a result, it is possible to achieve downsizing and high integration in a gas supply device including a heater that heats the gas flowing through the flow path.

  According to an eleventh aspect, in any one of the eighth to tenth aspects, an inter-unit heat transfer member that abuts the heat transfer members of the plurality of gas supply units is provided. For this reason, the heat generated by the electromagnetic valves can be diffused between the gas supply units, and the temperature difference between the electromagnetic valves can be further reduced. As a result, heat radiation from the electromagnetic valve can be performed more stably.

The perspective view of a gas supply apparatus. Sectional drawing which cut | disconnected the gas supply unit in the width direction. FIG. 3 is a sectional view taken along line 3-3 in FIG. 2. The bottom view of a gas supply device. The front view of a gas supply apparatus. The figure which shows a case. The figure which shows a heat-transfer plate and its periphery structure. The figure which shows the modification of a heat exchanger plate and its periphery structure. The figure which shows the other modification of a heat-transfer plate and its periphery structure. The figure which shows a heat-transfer block and its periphery structure. The perspective view which shows the modification of a gas supply apparatus. The front view which shows the other modification of a gas supply apparatus. The figure which shows the other modification of a heat-transfer plate and its periphery structure.

  Hereinafter, an embodiment embodying the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the gas supply apparatus 10 includes a plurality of gas supply units 11 having the same configuration.

  The gas supply unit 11 includes a flow path block 20 formed in a rectangular parallelepiped shape extending in a long shape, and a plurality of electromagnetic valves 50 (50A). A plurality of electromagnetic valves 50 are mounted on the upper surface 20 a (valve mounting surface) of the flow path block 20. The solenoid valves 50 are arranged in series along the longitudinal direction of the upper surface 20a. The solenoid valve 50 is disposed at the center in the short side direction (width direction) of the upper surface 20a. The width of the upper surface 20a of the flow path block 20 is slightly wider than the width of the electromagnetic valve 50 in the same direction.

  The plurality of gas supply units 11 are arranged in parallel such that both side surfaces 20c sandwiching the upper surface 20a from the width direction in the flow path block 20 are in contact with each other. That is, in the plurality of gas supply units 11, the side surfaces 20 c of the flow path block 20 face each other in the width direction (direction orthogonal to the longitudinal direction) of the upper surface 20 a of the flow path block 20. No gap is formed between the flow path blocks 20 in the direction in which the gas supply units 11 are integrated, that is, in the width direction of the upper surface 20a of the flow path block 20.

  The plurality of gas supply units 11 are integrated in the width direction of the flow path block 20 (the width direction of the upper surface 20a). The plurality of flow path blocks 20 have a rectangular parallelepiped shape as a whole. Specifically, the height (position) of the upper surface 20a of each flow path block 20 matches, and the position of the end face in the longitudinal direction of each flow path block 20 matches.

  Next, the configuration of one gas supply unit 11 will be described as a representative with reference to FIGS. FIG. 2 is a cross-sectional view of the gas supply unit 11 cut in the width direction. 3 omits the electromagnetic valve 50 in the cross-sectional view taken along line 3-3 of FIG.

  Inside the flow path block 20, a carrying gas flow path 21 (main flow path) extending linearly along the longitudinal direction (longitudinal direction of the upper surface 20a) is provided. The carrying gas channel 21 has a substantially circular channel cross section, and is formed such that its thickness (diameter) is constant. Specifically, the carrying gas flow path 21 is formed by processing the end face 20d in the longitudinal direction of the flow path block 20 with a drill or the like. The processing hole is closed by a stopper 27. A carrying gas (purge gas) output port 29 is connected to the end of the carrying gas flow path 21 opposite to the plug 27.

  Inside the flow path block 20, a plurality of process gas flow paths 22 (sub-flow paths) communicating with the carrying gas flow paths 21 are provided. The process gas flow path 22 (22A) opens to the lower surface 20b (sub-flow path opening surface) of the flow path block 20. The process gas flow path 22 opens at the center in the width direction (left-right direction in FIG. 3) on the lower surface 20b. That is, the openings of the process gas flow path 22 are evenly arranged around a virtual plane F that bisects the flow path block 20 in the width direction.

  On the upper surface 20a of the flow path block 20, the valve chamber 24 of the electromagnetic valve 50 is provided at predetermined intervals along the longitudinal direction of the flow path block 20 (longitudinal direction of the upper surface 20a). Each process gas channel 22 communicates with each valve chamber 24. That is, the electromagnetic valve 50 is provided for each process gas flow path 22.

  The valve chamber 24 is provided at predetermined intervals along the direction in which the carrying gas flow path 21 extends, and is provided at the center in the width direction of the flow path block 20 (the width direction of the upper surface 20a of the flow path block 20). Yes. The valve chamber 24 is formed as a substantially circular recess. The valve chamber 24 is provided over substantially the entire length of the flow path block 20 in order to reduce the width of the flow path block 20. In other words, the width of the flow path block 20 is set to be approximately equal to or slightly wider than the diameter of the valve chamber 24.

  In the center of the valve chamber 24, a valve seat 24a is provided on which the valve body 51 of the electromagnetic valve 50 comes into contact with and leaves. The valve seat 24a is formed as a substantially annular protrusion. A connection channel 26 is communicated with the center of the valve chamber 24, that is, the portion surrounded by the valve seat 24a. The connection flow path 26 extends in a direction away from the upper surface 20 a of the flow path block 20 in the flow path block 20 and is connected to the carrying gas flow path 21. That is, the connection flow path 26 connects the valve chamber 24 and the carrying gas flow path 21. Accordingly, the process gas flow path 22 is connected to the carrying gas flow path 21 via the valve chamber 24 and the connection flow path 26.

  The carrying gas flow path 21 is disposed in the vicinity of the valve chamber 24 in order to shorten the connection flow path 26 that becomes a dead space after the process gas is shut off as much as possible. The connection channel 26 extends perpendicularly from the upper surface 20 a of the channel block 20 and is connected to the carrying gas channel 21. Specifically, the connection flow path 26 is connected to the vicinity of the end of the carrying gas flow path 21 in the width direction of the upper surface 20a. Further, the connection channel 26 is disposed at the center in the width direction of the channel block 20. For this reason, in the flow path block 20, the central axes of the plurality of connection flow paths 26 are located on a virtual plane F that bisects the flow path block 20 in the width direction.

  The carrying gas channel 21 is formed thicker than the connection channel 26 and the process gas channel 22. For this reason, even if the carrying gas channel 21 is configured to extend linearly in the longitudinal direction of the channel block 20, it can be processed relatively easily.

  The electromagnetic valve 50 includes a coil 52, a core 54, a valve body 51, and a case 53 disposed on the outer periphery of the coil 52. The coil 52 is formed in a cylindrical shape, and the core 54 is formed in a columnar shape having an outer diameter substantially equal to the inner diameter of the coil 52. A core 54 is inserted into the coil 52. The case 53 is provided so as to cover the coil 52 and constitutes a magnetic path of a magnetic field generated by the coil 52. The solenoid valve 50 (50A) is small and has a large driving force of the valve body 51 in order to narrow the width of the gas supply unit 11 (flow path block 20). Specifically, the coil 52 is configured by a rectangular conducting wire having a rectangular cross section, and the rated current is larger than that of a coil configured by a round conducting wire having a circular cross section. For this reason, the driving force of the valve body 51 can be increased while reducing the volume of the coil 52 as much as possible. In such a configuration, since the amount of heat generated in the coil 52 increases, it is important to appropriately dissipate heat from the electromagnetic valve 50. A drive circuit is connected to the coil 52.

  The drive circuit energizes the coil 52 to reciprocate the valve body 51 of the electromagnetic valve 50. When the valve body 51 abuts on and separates from the valve seat 24a provided in the valve chamber 24, the valve chamber 24 and the connection flow path 26 are blocked and communicated. In the longitudinal direction of the flow path block 20, the electromagnetic valve 50A provided at the end opposite to the output port 29 changes the flow state of the carrying gas (purge gas). That is, among the plurality of process gas flow paths 22, the process gas flow path 22 A provided at the end opposite to the carrying gas output port 29 in the longitudinal direction of the flow path block 20 is a flow path for carrying gas (purge gas). Used as The other solenoid valve 50 changes the flow state of each process gas. At this time, the plurality of solenoid valves 50 are not driven at the same time, and the respective solenoid valves 50 are driven at different times. That is, one process gas is supplied from the plurality of process gas flow paths 22 one at a time. When the carrying gas is supplied from the process gas flow path 22A, the electromagnetic valve 50A and one electromagnetic valve 50 are driven simultaneously. Note that the carrying gas may be used as a flow path for the process gas and the purge gas without passing the carrying gas through the carrying gas flow path 21. When the purge gas is supplied from the process gas flow path 22A, the solenoid valve 50A and the solenoid valve 50 are not driven simultaneously. Moreover, you may make it drive a part of several solenoid valve 50 simultaneously.

  Here, the carrying gas flow path 21 is disposed in a portion deviated from the center of the valve chamber 24 to one side with respect to the width direction of the flow path block 20, that is, a portion deviated from the virtual plane F. In other words, the central axis of the carrying gas channel 21 is deviated from the virtual plane F, and the carrying gas channel 21 is offset from the center in the width direction of the channel block 20. In other words, the carrying gas flow path 21 is disposed on one side of the both side surfaces 20c that sandwich the upper surface 20a from the width direction in the flow path block 20. For this reason, in the flow path block 20, the volume (space) for arrange | positioning another flow path to the part on the opposite side to the part which has arrange | positioned the carrying gas flow path 21 is securable. Further, the carrying gas flow path 21 can be connected to a connection flow path 26 extending perpendicularly to the upper surface 20a from the center of the valve chamber 24, and from the center of the valve chamber 24 in the width direction of the flow path block 20. It is biased to one side. The channel cross-sectional area (diameter) of the carrying gas channel 21 is set so that a necessary amount of carrying gas (purge gas) can be circulated in the gas supply unit 11.

  And the process gas flow path 22 has passed through the part ensured on the opposite side by arrange | positioning the carrying gas flow path 21 offset from the virtual plane F. As shown in FIG. The process gas flow path 22 is connected to the valve chamber 24 through a portion of the flow path block 20 that is offset from the virtual plane F to the side opposite to the carrying gas flow path 21. Therefore, it is not necessary to provide a process gas input port on the side surface 20c perpendicular to the upper surface 20a on which the electromagnetic valve 50 (valve chamber 24) is provided.

  The process gas flow path 22 has a vertical portion 22 b extending perpendicularly to the upper surface 20 a of the flow path block 20. The vertical portion 22 b passes by the side of the carrying gas channel 21. For this reason, in the flow path block 20, the vertical part 22b can be arrange | positioned so that the space | interval of the carrying gas flow path 21 and the side surface 20c may be kept constant. In the process gas flow path 22, a vertical portion 22 b that passes by the side of the carrying gas flow path 21 is formed narrower than the inclined portion 22 a that is the other portion. With these configurations, even when the width of the flow path block 20 is limited, the process gas flow path 22 (vertical portion 22b) is arranged in the flow path block 20 so as not to interfere with the carrying gas flow path 21. It becomes easy. The process gas flow path 22 opens to the center in the width direction on the lower surface 20 b of the flow path block 20 and is bent so as to avoid the carrying gas flow path 21 and connected to the valve chamber 24.

  Next, the configuration of the supply block 41 that distributes and supplies the carrying gas to the carrying gas passage 21 (process gas passage 22A) of each gas supply unit 11 will be described with reference to FIGS. 4 is a bottom view of the gas supply device 10, and FIG. 5 is a front view of the gas supply device 10.

  The openings of the process gas flow paths 22A of all the flow path blocks 20 are aligned on a straight line when viewed in the width direction of the gas supply device 10 (width direction of the flow path block 20). A supply block 41 (supply member) is provided at the opening of the process gas flow path 22A arranged in a straight line on the lower surface 20b of the flow path block 20 arranged in parallel. The supply block 41 includes a flow channel portion 41a in which a carrying gas introduction flow channel 42 (schematically indicated by a broken line in FIG. 5) is provided, and an attachment portion 41b in which a through hole is provided. The channel portion 41a is formed in a rectangular parallelepiped shape, and a rectangular parallelepiped mounting portion 41b is provided so as to project from both side surfaces thereof. The two attachment portions 41b extend along the side surface of the flow path portion 41a. The attachment portion 41 b of the supply block 41 is fixed to the flow path block 20 by a bolt 43.

  A carrying gas input port 28 is attached to the flow path portion 41a. The input port 28 is attached to the end surface in the longitudinal direction in the flow path portion 41a. The upstream end of the introduction flow channel 42 inside the flow channel 41 a communicates with the input port 28. The introduction flow path 42 extends downstream from the communication portion with the input port 28 and is branched into a plurality of branches. Each end portion on the downstream side of the introduction flow path 42 is open at the surface on the lower surface 20b side of the flow path block 20 in the flow path portion 41a. In each opening, each downstream end of the introduction flow path 42 is connected to a process gas flow path 22 </ b> A opened in the lower surface 20 b of each flow path block 20. The connection portion between each end portion on the downstream side of the introduction flow channel 42 and each process gas flow channel 22A is sealed by a seal member. Then, a common carrying gas (purge gas) is distributed and supplied from the input port 28 to each process gas flow path 22A of all flow path blocks 20.

  The gas supply units 11 arranged in parallel are fixed to each other and integrated as a whole. Specifically, the flow path blocks 20 arranged in parallel are fixed using the bracket 46 and the supply block 41.

  Bolt holes 47 are provided in the lower surface 20b of each flow path block 20 at predetermined intervals along the longitudinal direction. The bolt hole 47 is provided at the center in the width direction on the lower surface 20 b of each flow path block 20.

  The bracket 46 is formed in a substantially rectangular plate shape. The length of the bracket 46 in the longitudinal direction is set to be approximately equal to the total length of the plurality of flow path blocks 20 provided in the gas supply device 10. The bracket 46 is disposed across the lower surfaces 20b of the plurality of flow path blocks 20 so that the longitudinal direction of the bracket 46 is aligned with the width direction of the gas supply device 10 (the width direction of the flow path block 20). The bracket 46 is disposed at a position where the bolt hole 47 is provided at the end of the flow path block 20 in the longitudinal direction. The bracket 46 is provided with a through hole at a position corresponding to the bolt hole 47. Bolts 43 are inserted into these through holes, and the bolts 43 are fastened to the bolt holes 47. A connecting member is provided for each process gas flow path 22 on the lower surface 20 b of the flow path block 20. The connecting member is fixed to the flow path block 20 with bolts in the bolt holes 47 other than the end portions. The connecting member is provided with a linear introduction flow channel penetrating from the lower surface to the upper surface. The connection portion between the introduction flow path and the process gas flow path 22 is sealed with a gasket.

  The length in the longitudinal direction of the supply block 41 (the length in the longitudinal direction of the flow path portion 41 a and the attachment portion 41 b) is set to the same length as the bracket 46. The supply block 41 is arranged across the lower surfaces 20 b of the plurality of flow path blocks 20 so that the longitudinal direction of the supply block 41 coincides with the width direction of the gas supply device 10. The supply block 41 is arranged so that the position of the attachment portion 41 b matches the position of the bolt hole 47 in the longitudinal direction of the flow path block 20. The attachment portion 41 b is provided with a through hole at a position corresponding to the bolt hole 47. Bolts 43 are inserted into these through holes, and the bolts 43 are fastened to the bolt holes 47.

  Next, the case 53 of the electromagnetic valve 50 will be described with reference to FIG. 6A is a perspective view of the case 53, FIG. 6B is a front view of the case 53, and FIG. 6C is a side view of the case 53. In FIG. 6, the coil 52 and the flow path block 20 are omitted.

  The coil 52 and the core 54 have a cylindrical outer shape when assembled with each other. The case 53 is provided on the outer periphery of the coil 52 and the core 54. The case 53 substantially covers the coil 52 and the core 54 and is partially open. That is, the case 53 is formed in a bottomed cylindrical shape in which a part of the side surface portion is opened. The case 53 is assembled to the coil 52 and the like, and is arranged so that the bottom surface portion 53b is on the upper side. The bottom surface portion 53 b is disposed so as to be adjacent to the end surface of the coil 52 in the axial direction.

  The case 53 constitutes a magnetic path of a magnetic field generated by the coil 52. For this reason, the case 53 needs to ensure the cross-sectional area of a magnetic path. On the other hand, the case 53 needs to fit within the width of the flow path block 20. Therefore, the case 53 has a shape obtained by cutting out portions disposed at both ends in the width direction of the flow path block 20 from the cylindrical shape. That is, when viewed from the axial direction of the coil 52, the bottom surface portion 53b (upper surface portion) of the case 53 is formed to have a flat surface and has a shape in which both circular end portions are cut away.

  In other words, the electromagnetic valve 50 is disposed in the flow path block 20 so that the linear portions of the outer periphery of the bottom surface portion 53 b are disposed at both ends in the width direction of the flow path block 20 when viewed from the axial direction of the coil 52. . The side surface portion of the case 53 is provided with a flat surface portion 53a (case flat surface portion) formed so as to form a flat surface as a portion corresponding to the linear portion of the outer periphery of the bottom surface portion 53b. The flat surface portion 53a is disposed in parallel to both side surfaces 20c (side surfaces 20c of the flow path block 20) sandwiching the upper surface 20a from the width direction in the flow path block 20.

  An opening 53c is provided on the side surface of the case 53 at a position facing the flat portion 53a. When viewed in the longitudinal direction of the flow path block 20, the vicinity of one end of the opening 53 c extends in the width direction of the flow path block 20. The vicinity of one end of the opening 53c extends to substantially the center in the width direction of the flow path block 20. The opening 53c is used for passing a wiring connecting the coil 52 and the drive circuit.

  The inner peripheral surface of the case 53 is in contact with or close to the outer peripheral surface of the coil 52. In other words, the outer peripheral surface of the coil 52 is covered with the case 53 except for the portion where the opening 53c is provided. For this reason, most of the heat generated in the coil 52 is transmitted to the case 53.

  Next, a heat transfer plate 30 (heat transfer member) that transfers heat generated by the electromagnetic valve 50 to the flow path block 20 will be described with reference to FIG. The heat transfer plate 30 is provided independently for each gas supply unit 11. 7 is a view showing the heat transfer plate and its peripheral configuration, FIG. 7 (a) is a plan view, and FIG. 7 (b) is a view seen from the longitudinal direction of the flow path block 20. 7 (c) is a view as seen from the width direction of the flow path block 20.

  The heat transfer plate 30 has a flat plate portion 31 (case contact portion) formed in a flat plate shape and a fixing portion 32 (block connecting portion) fixed to the flow path block 20. The flat plate portion 31 and the fixed portion 32 are integrally formed. The heat transfer plate 30 is made of metal such as stainless steel or aluminum alloy. The heat transfer plate may be formed of other metals or non-metals as long as the material has high thermal conductivity.

  The flat plate portion 31 is formed in a rectangular shape. The length in the longitudinal direction of the flat plate portion 31 is set to be longer than the interval between the electromagnetic valves 50 (50A) arranged at both ends in the longitudinal direction on the upper surface 20a of the flow path block 20. The length in the short direction of the flat plate portion 31 is set to be approximately equal to the length of the case 53 in the axial direction of the coil 52 of the electromagnetic valve 50. As described above, the electromagnetic valve 50 is disposed at the center in the short side direction (width direction) of the upper surface 20a of the flow path block 20. The thickness of the flat plate portion 31 is set substantially equal to the distance between the side surface 20 c of the flow path block 20 and the flat portion 53 a of the case 53 in the width direction of the flow path block 20. In other words, the thickness of the flat plate portion 31 is set to approximately half the length obtained by subtracting the width of the case 53 in the width direction of the flow path block 20 from the width of the flow path block 20 (width of the upper surface 20a). .

  Fixing portions 32 are provided at one end in the short direction of the flat plate portion 31 at predetermined intervals along the longitudinal direction of the flat plate portion 31. The interval at which the fixed portion 32 is arranged (pitch of the fixed portion 32) is set to be approximately equal to the interval at which the electromagnetic valve 50 is arranged (pitch of the electromagnetic valve 50). The fixing portion 32 extends from the one surface of the flat plate portion 31 in the thickness direction of the flat plate portion 31. The fixing portion 32 is formed in a rectangular flat plate shape, and is provided perpendicular to the surface of the flat plate portion 31. The flat plate portion 31 and the fixed portion 32 are formed to be perpendicular to each other by bending a flat plate member. The length of the fixed portion 32 protruding from one surface of the flat plate portion 31 is set to be shorter than the width of the flow path block 20. The width of the fixed portion 32 (length in the longitudinal direction of the flat plate portion 31) is set to be narrower than the gap between the electromagnetic valves 50. The fixing part 32 is provided with a through hole through which the screw 61 is inserted.

  The heat transfer plate 30 having such a shape is fixed to the upper surface 20 a of the flow path block 20. On the upper surface 20a of the flow path block 20, screw holes are provided in portions between the electromagnetic valves 50 and in the vicinity of both ends in the longitudinal direction. These screw holes are formed at a depth that does not reach the carrying gas flow path 21 provided in the flow path block 20. The interval at which these screw holes are arranged (the pitch of the screw holes) and the interval at which the fixing portions 32 are arranged in the heat transfer plate 30 (the pitch of the fixing portions 32) are set equal. Then, screws 61 are respectively inserted into the through holes of the fixing portion 32, and the screws 61 are respectively tightened into the screw holes of the flow path block 20. That is, a part of the plurality of fixing portions 32 is fixed to a portion between the plurality of electromagnetic valves 50 on the upper surface 20 a of the flow path block 20. Since each fixing portion 32 is pressed against the upper surface 20a by tightening the screw 61, the heat transfer efficiency from each fixing portion 32 to the upper surface 20a can be improved.

  In this fixed state, the flat plate portion 31 of the heat transfer plate 30 is disposed so as to face the flat portion 53 a of the case 53 in the electromagnetic valve 50. The flat plate portion 31 of the heat transfer plate 30 extends along the longitudinal direction of the flow path block 20 (longitudinal direction of the upper surface 20a). Specifically, the flat plate portion 31 extends over all of the plurality of electromagnetic valves 50 (50 </ b> A) along the longitudinal direction of the flow path block 20. The flat plate portion 31 is disposed in parallel to the side surface 20c of the flow path block 20, and is in contact with the flat portion 53a of each case 53 of the electromagnetic valve 50 (50A). Therefore, the flat plate portion 31 is in contact with each case 53 of the plurality of electromagnetic valves 50. Specifically, all cases 53 of the plurality of solenoid valves 50 are in contact with the common flat plate portion 31. The flat surface portion 53a of the case 53 is in contact with the flat plate portion 31 over the entire surface. The fixed portion 32 connects the flat plate portion 31 to the upper surface 20 a of the flow path block 20. Furthermore, since the flat plate portion 31 and the flat surface portion 53a of the case 53 are in contact with each other on a flat surface, formation of a gap between them is suppressed, and the contacted state can be stabilized. The flat plate portion 31 and the flat portion 53a of the case 53 may be bonded (fixed) with an adhesive or the like. In short, any configuration that directly transfers heat between the flat plate portion 31 and the case 53 may be used.

  In the state where one surface of the flat plate portion 31 is in contact with the flat portion 53 a of the case 53, the position of the other surface of the flat plate portion 31 is the position of the side surface 20 c of the flow channel block 20 in the width direction of the flow channel block 20. Is consistent with That is, the heat transfer plate 30 is within the width range of the flow path block 20. For this reason, when the gas supply units 11 are integrated in the width direction of the flow path block 20, it is possible to avoid the gap between the gas supply units 11 from being increased by the heat transfer plate 30.

  As described above, the central axis of the carrying gas channel 21 is deviated from the virtual plane F. The flat plate portion 31 of the heat transfer plate 30 is disposed on the same side as the carrying gas flow path 21 with respect to the virtual plane F. For this reason, the distance between the flat plate portion 31 and the carrying gas channel 21 is reduced. And the fixing | fixed part 32 of the heat-transfer plate 30 is extended with respect to the virtual plane F from the side in which the carrying gas flow path 21 was provided to the opposite side. Accordingly, the temperature of the fixed portion 32 is higher in the portion where the carrying gas flow path 21 is provided with respect to the virtual plane F than in the portion on the opposite side. Thereby, the heat transmitted to the heat transfer plate 30 can be efficiently transmitted to the carrying gas channel 21.

  In the gas supply apparatus 10 including the gas supply unit 11 configured as described above, a carrying gas (purge gas) is supplied from the input port 28. The carrying gas is distributed and supplied to the carrying gas channel 21 (process gas channel 22A) of each gas supply unit 11 by the supply block 41. The carrying gas (purge gas) is shut off and distributed by the electromagnetic valve 50A corresponding to the process gas flow path 22A. In each gas supply unit 11, each process gas is supplied to each process gas flow path 22, and each process gas is blocked and circulated by a corresponding electromagnetic valve 50. Note that the carrying gas may be used as a flow path for the process gas and the purge gas without passing the carrying gas through the carrying gas flow path 21.

  Here, the plurality of solenoid valves 50 are not driven simultaneously, and each solenoid valve 50 is driven at a different time. The solenoid valve 50 generates heat as it is driven, and rises in temperature to, for example, 60 to 70 ° C., which is higher than the gas target temperature of 50 to 60 ° C. Most of the heat generated in the coil 52 of the electromagnetic valve 50 being driven is transmitted to the case 53, and toward the electromagnetic valve 50 that is not driven via the flat plate portion 31 of the heat transfer plate 30 in contact with the case 53. Communicated. The heat transferred to the flat plate portion 31 is transferred to the flow path block 20 via the fixed portion 32. The heat transmitted to the flow path block 20 heats the gas flowing through the gas flow paths 21 and 22 provided in the flow path block 20 and is arranged in parallel so that both side surfaces 20c come into contact with each other. It is further transmitted to the flow path block 20.

  The embodiment described above has the following advantages.

  The flow path block 20 is formed in a rectangular parallelepiped shape extending in a long shape, and a plurality of electromagnetic valves 50 are arranged in series along the longitudinal direction of the upper surface 20a. The flat plate portion 31 of the heat transfer plate 30 extends along the longitudinal direction of the upper surface 20a so as to straddle the cases 53 of the plurality of solenoid valves, and is in contact with the cases 53 of the plurality of solenoid valves 50. Yes. Here, when the gas supply state is controlled by the gas supply unit 11, the plurality of solenoid valves 50 are not driven simultaneously. For this reason, the heat generated by the driven solenoid valve 50 is transmitted by the flat plate portion 31 toward the other solenoid valves 50 that are not driven. The fixing portion 32 of the heat transfer plate 30 connects the flat plate portion 31 to the upper surface 20a of the flow path block 20. For this reason, the heat transmitted to the longitudinal direction of the upper surface 20 a by the flat plate portion 31 can be released to the flow path block 20 by the fixing portion 32. As a result, in the gas supply unit 11 in which the plurality of electromagnetic valves 50 are mounted on the flow path block 20, heat radiation from the electromagnetic valves 50 can be appropriately performed. Furthermore, since the fixing portion 32 connects the flat plate portion 31 to the upper surface 20a of the flow path block 20, it is not necessary to use the side surface 20c of the flow path block 20 or the like, and is suitable for integration of the gas supply unit 11.

  Further, the heat released from the electromagnetic valve 50 to the flow path block 20 can be used for heating the gas flowing through the carrying gas flow path 21 and the process gas flow path 22 in the flow path block 20.

  The flat plate portion 31 of the heat transfer plate 30 extends across the plurality of electromagnetic valves 50 along the longitudinal direction of the upper surface 20 a of the flow path block 20, and is in contact with the cases 53 of all the electromagnetic valves 50. For this reason, the heat transmitted from each case 53 of the electromagnetic valve 50 to the flat plate portion 31 is transmitted by the flat plate portion 31 to a range over all of the plurality of electromagnetic valves 50. Therefore, the heat generated in the electromagnetic valve 50 can be diffused to a wider range, and the temperature difference between the electromagnetic valves 50 can be reduced. As a result, heat radiation from the electromagnetic valve 50 can be stably performed.

  Since the flat plate portion 31 formed in a flat plate shape and the flat portion 53a formed so as to form a flat surface are in contact with each other, the heat is more reliably transmitted between the flat plate portion 31 and the case 53 through the flat surface. Can be transmitted. Therefore, the heat transfer efficiency between the flat plate portion 31 and the case 53 of the electromagnetic valve 50 can be improved while making the flat plate portion 31 a simple flat plate shape.

  The flat portion 53a of the case 53 is arranged in parallel to both side surfaces 20c that sandwich the upper surface 20a from the width direction in the flow path block 20. Therefore, the flat portion 53a can extend in the longitudinal direction of the upper surface 20a or in a direction perpendicular to the upper surface 20a while suppressing extending in the width direction of the upper surface 20a. Therefore, the width of the flat portion 53a can be ensured without being limited by the width of the gas supply unit 11.

  When the number of the fixing portions 32 that connect the flat plate portion 31 to the upper surface 20a of the flow channel block 20 is small, the heat transfer efficiency from the flat plate portion 31 to the flow channel block 20 may be lowered. On the other hand, if a space for arranging the fixing portion 32 is newly provided on the upper surface 20a, the area of the upper surface 20a may be increased.

  In this regard, the fixed portion 32 is connected to a portion between the plurality of electromagnetic valves 50 on the upper surface 20 a of the flow path block 20. For this reason, the fixing | fixed part 32 can be arrange | positioned on the upper surface 20a using the empty part of the upper surface 20a. Therefore, it is possible to improve the heat transfer efficiency from the flat plate portion 31 to the flow path block 20 while suppressing an increase in the area of the upper surface 20a. Furthermore, since heat is radiated from the fixed portions 32 respectively connected to the portions between the solenoid valves 50 to the upper surface 20a, the carrying gas passage extending along the longitudinal direction of the upper surface 20a can be easily heated evenly in the longitudinal direction. Become.

  Since the gas supply apparatus 10 is configured by accumulating a plurality of gas supply units 11, the tendency that heat is easily accumulated and a place where the heat is released is restricted becomes remarkable.

  In this respect, the gas supply units 11 are arranged in parallel so that both side surfaces 20c sandwiching the upper surface 20a of the flow path block 20 from the width direction are adjacent to each other with the above-described configurations. For this reason, it is possible to appropriately dissipate heat from the electromagnetic valve 50 while integrating the gas supply unit 11 to configure the gas supply device 10.

  Further, since the adjacent side surfaces 20c of the flow path block 20 are in contact with each other, the gap between the gas supply units 11 is omitted and the gas supply device 10 is highly integrated, and heat is radiated from the electromagnetic valve 50 appropriately. be able to.

  It is not limited to the said embodiment, For example, it can also implement as follows.

  The flow path block 20 may be a rectangular parallelepiped shape in which the divided flow path blocks are integrated to extend in a long shape. According to such a configuration, it is possible to flexibly cope with a change in the number of process gases to be used (number of solenoid valves 50).

  A plurality of gas supply units 11 may be arranged in parallel without bringing the gas supply units 11 (flow channel blocks 20) into contact with each other. Even in this case, in each gas supply unit 11, heat can be appropriately radiated from the electromagnetic valve 50 by the heat transfer plate 30. Moreover, you may make it provide the heat-transfer plate 30 with respect to the structure where the gas supply unit 11 is used independently.

  In the longitudinal direction of the upper surface 20a of the flow path block 20, the fixing part 32 of the heat transfer plate 30 provided near both ends is omitted, and only the fixing part 32 provided in the portion between the electromagnetic valves 50 is provided. May be. In this case, since the fixing portion 32 can be disposed on the upper surface 20a using only the empty portion of the upper surface 20a, it is possible to more reliably suppress the area of the upper surface 20a from being increased. That is, since gas ports and other parts are often provided near both ends in the longitudinal direction of the upper surface 20a, it is desirable to fix the heat transfer plate 30 to the upper surface 20a without using the vicinity of both ends.

  As shown in FIG. 8, flat plate portions 31 (case contact portions) are provided on both sides in the width direction of the flow path block 20 (width direction of the upper surface 20a) for each case 53 of the plurality of solenoid valves 50. A heat transfer plate 130 (heat transfer member) may be employed. Other configurations of the heat transfer plate 130 are the same as those of the heat transfer plate 30 of the above embodiment. In this case, it is desirable to employ a case 153 having two flat portions 53a corresponding to the two flat plate portions 31. That is, in the case 153, the opening 153 c through which the wiring connecting the coil 52 and the drive circuit passes is open in the longitudinal direction of the flow path block 20 in the side surface portion of the case 153, and in the width direction of the flow path block 20. There is no opening. The two flat portions 53 a of the case 153 are arranged in parallel to the both side surfaces 20 c of the flow path block 20. The other configuration of the case 153 is the same as the case 53 of the above embodiment. According to such a configuration, since the area where the heat transfer plate 130 and the case 153 abut can be increased, the heat transfer efficiency between the heat transfer plate 130 and the case 153 can be further improved. Even in this case, the heat transfer plate 130 is accommodated within the width of the flow path block 20.

  As shown in FIG. 9, a heat transfer plate 230 (heat transfer member) having a contact piece 33 that is in contact with the bottom surface portion 53 b (upper surface portion) of each case 53 in a plurality of electromagnetic valves 50 is adopted. May be. Other configurations of the heat transfer plate 230 are the same as those of the heat transfer plate 30 of the above embodiment. The contact piece 33 has an interval (pitch) equal to the interval (the pitch of the electromagnetic valve 50) provided with the electromagnetic valve 50 along the longitudinal direction of the flat plate portion 31 at one end in the short direction of the flat plate portion 31. Is provided. The contact piece 33 protrudes from one surface of the flat plate portion 31 in the thickness direction of the flat plate portion 31. The contact piece 33 is formed in a rectangular flat plate shape, and is provided perpendicular to the surface of the flat plate portion 31. The contact piece 33 is formed in a size substantially equal to the bottom surface portion 53 b of the case 53. For this reason, the contact piece 33 is in contact with the bottom surface portion 53b of the case 53 over substantially the entire surface. The flat plate portion 31 and the contact piece 33 are formed to be perpendicular to each other by bending a flat plate member. The fixing portion 32 of the heat transfer plate 230 is fixed to the upper surface 20 a of the flow path block 20, and the contact piece 33 is pressed against the bottom surface portion 53 b of the case 53.

  According to such a configuration, the area where the heat transfer plate 230 and the case 53 abut can be increased. Furthermore, since the contact piece 33 is pressed against the bottom surface portion 53 b of the case 53, the heat transfer efficiency between the heat transfer plate 230 and the case 53 can be further improved.

  Further, as the case of the electromagnetic valve 50, the cases 53 and 153 provided with the flat surface portion 53a (case flat surface portion) are adopted, but a case where the flat surface portion 53a is not provided can also be adopted. Even in this case, the case of the electromagnetic valve 50 and the heat transfer plates 30, 130, 230 may be in contact with each other. That is, the shape of the case of the electromagnetic valve 50 can be changed as appropriate, and the heat transfer plate may be formed corresponding to the shape of the case.

  Although the heat transfer plate 30 extending so as to extend over all of the plurality of solenoid valves 50 (50A) along the longitudinal direction of the flow path block 20 is employed, a heat transfer plate divided in the longitudinal direction of the flow path block 20 is employed. You can also That is, if the heat transfer plate has a flat plate portion (case contact portion) that is in contact with each case 53 of at least two electromagnetic valves 50, the heat generated by the driven electromagnetic valve 50 is transferred to another drive. It can be transmitted in the direction of the solenoid valve 50 that is not performed.

  As shown in FIG. 10, a heat transfer block 330 formed in a block shape may be employed. The heat transfer block 330 is made of metal such as stainless steel or aluminum alloy. The heat transfer block 330 is formed in a rectangular parallelepiped shape and extends over substantially the entire length in the longitudinal direction of the flow path block 20. The width of the heat transfer block 330 is set equal to the width of the flow path block 20. The height of the heat transfer block 330 (the length in the lateral direction of the side surface) is set to be approximately equal to the height of the cases 53 and 153 of the electromagnetic valve 50. The heat transfer block 330 is provided with through holes 330a at intervals (pitch) equal to the intervals (pitch of the electromagnetic valves 50) at which the electromagnetic valves 50 are arranged along the longitudinal direction. The through hole 330a is provided so as to extend along the height direction of the heat transfer block 330 (the lateral direction of the side surface). The cross-sectional shape of the through hole 330 a is equal to the shape of the bottom surface portion 53 b of the cases 53 and 153. And case 53,153 is inserted in each through-hole 330a, and the outer peripheral surface of case 53 is in contact with the inner peripheral surface of through-hole 330a. The lower surface of the heat transfer block 330 is bonded to the upper surface 20 a of the flow path block 20. Note that an opening through which the wiring connecting the coil 52 and the drive circuit passes is desirably provided in the bottom surface portion 53b of the cases 53 and 153.

  According to such a configuration, since the entire side surfaces of the cases 53 and 153 of the electromagnetic valve 50 abut on the heat transfer block 330, the heat transfer efficiency between the heat transfer block 330 and the cases 53 and 153 can be improved. . Furthermore, since the heat transfer block 330 is provided over substantially the entire length in the longitudinal direction of the flow path block 20, it is possible to secure the maximum bonding area between the heat transfer block 330 and the upper surface 20 a of the flow path block 20. For this reason, the heat transfer efficiency between the heat transfer block 330 and the upper surface 20a of the flow path block 20 can be improved. Since the heat transfer block 330 is accommodated within the range of the width of the flow path block 20, it is possible to suppress an increase in the width of the gas supply unit 11. Note that the heat transfer block 330 may be placed on the upper surface 20 a of the flow path block 20 without bonding the lower surface of the heat transfer block 330 to the upper surface 20 a of the flow path block 20.

  You may make it provide the inter-unit heat-transfer member which contact | abuts each heat-transfer member of the some gas supply unit 11. FIG. Specifically, the widths of the heat transfer plate 130 and the heat transfer block 330 are set equal to the width of the flow path block 20. For this reason, when the gas supply units 11 are arranged in parallel so that the side surfaces 20c of the flow path block 20 are in contact with each other, the flat plate portions 31 of the heat transfer plate 130 and the side surfaces of the heat transfer block 330 are in contact with each other. Become. For this reason, the heat generated in the electromagnetic valve 50 can be diffused between the gas supply units 11, and the temperature difference between the electromagnetic valves 50 can be further reduced. As a result, heat dissipation from the electromagnetic valve 50 can be performed more stably. Further, as the inter-unit heat transfer member, a flat plate heat transfer plate extending along the width direction of the gas supply device 10 and connecting the heat transfer plates 30 of all the gas supply units 11 may be provided. According to such a configuration, the heat generated by the electromagnetic valve 50 can be diffused among all the gas supply units 11.

  As shown in FIG. 11, it is also possible to employ a gas supply device 110 in which a plurality of flow path blocks 20 are integrated with a heater 71 sandwiched between adjacent side surfaces 20c of the plurality of flow path blocks 20. it can. The other configuration of the gas supply device 110 is the same as that of the gas supply device 10 of the above embodiment. Here, the solenoid valve 50 generates heat as it is driven, and the temperature rises to 60 to 70 ° C., which is higher than the gas target temperature of 50 to 60 ° C., for example. For this reason, it is possible to reduce the capacity of the heater 71 by using heat radiation from the electromagnetic valve 50 for heating the gas.

  The heater 71 is formed in a film shape (for example, a thickness of about 0.3 mm) and has flexibility. The shape of the heater 71 is maintained in a state where no force is applied, and the shape of the heater 71 is maintained. The heater 71 extends along the longitudinal direction of the flow path block 20. The heater 71 is formed in a rectangular shape. The length of the long side of the heater 71 (length in the longitudinal direction) is set slightly longer than the length of the flow path block 20 in the longitudinal direction. The length of the short side of the heater 71 (length in the short direction) is equal to the length of the flow path block 20 in the height direction (length in the short direction of the side surface 20c).

  The heater 71 is disposed so as to cover the entire side surface 20c. Specifically, both ends of the heater 71 in the short direction coincide with both ends of the side surface 20c in the short direction. One end in the longitudinal direction of the heater 71 coincides with the end in the longitudinal direction of the side surface 20c, and the other end in the longitudinal direction of the heater 71 projects slightly from the end in the longitudinal direction of the side surface 20c. For this reason, the heater 71 is disposed so that the substantially entire surface is along the side surface 20c. In the heater 71, a wiring for supplying electric power to the heater 71 is connected to a portion protruding from the side surface 20c. The heater 71 generates heat on both sides by the supplied electric power and heats the flow path block 20.

  According to such a configuration, the carrying gas channel 21 (purge gas channel) and the process gas channel 22 are not opened on the side surface 20 c of the channel block 20, and the gas channel 21 of each channel block 20. , 22 are independent for each gas supply unit 11. And since the several flow path block 20 is integrated in the state by which the heater 71 was inserted | pinched between the adjacent side surfaces 20c of the several flow path block 20, two flow paths adjacent by both surfaces of one heater 71 are used. Block 20 can be heated. Therefore, it is not necessary to provide a heater for heating each flow path block 20 between the adjacent flow path blocks 20, and the space for attaching the heater 71 can be reduced.

  The heater 71 is formed in a film shape, and both surfaces thereof extend along the longitudinal direction of the flow path block 20 so as to face the side surface 20 c of the flow path block 20. For this reason, the thickness of the heater 71 itself is reduced, and the heater can be placed along the side surface 20c of the flow path block 20. Therefore, even when the heater 71 is provided in the gas supply unit 11, it is possible to suppress the interval between the flow path blocks 20 from being widened, and heat from the heater 71 to the side surface 20 c of the flow path block 20. Transmission efficiency can be improved. In addition, while the distance from the carrying gas flow path 21 arrange | positioned in the part biased from the virtual plane F to the heater 71 becomes short, it passes the part biased from the virtual plane F to the opposite side to the carrying gas flow path 21. The distance from the gas flow path 22 to the heater 71 is shortened. Therefore, the gas flowing through the carrying gas channel 21 and the process gas channel 22 can be efficiently heated by the heater 71.

  As a modification of the configuration including the heater, a recess extending in the longitudinal direction may be provided on the side surface 20c of the flow path block 20, and the heater may be accommodated in the recess. FIG. 12 is a front view of the gas supply device 210 including the flow path block 120 obtained by modifying the flow path block 20 in this manner. In FIG. 12, the supply block 41 and the like are omitted. In the gas supply device 210, grooves 121 (concave portions) are provided on the side surfaces 120 c adjacent to each other of the plurality of flow path blocks 120 over the entire length in the longitudinal direction. Each of the grooves 121 accommodates approximately half of a rectangular plate heater 171 in the thickness direction. Both sides of the heater 171 generate heat, and both sides are in contact with the grooves 121. Adjacent side surfaces 120 c are in contact with portions other than the groove 121.

  According to such a configuration, since the thickness of the heater 171 can be absorbed by the groove 121, the interval between the flow path blocks 120 can be reduced. Further, the heaters 171 are accommodated approximately half in the thickness direction in the respective grooves 121, whereby the depth of the grooves 121 can be reduced. As a result, it becomes easy to arrange the carrying gas passage 21 (purge gas passage) and the process gas passage 22 in the passage block 120. Further, since the adjacent side surfaces 120c are in contact with each other except the groove 121, the relative positions of the flow path blocks 120 can be made constant regardless of the arrangement state of the heater 171 in the groove 121. Therefore, even when both the heat transfer plate 30 and the heater 171 are provided in the gas supply device 210, it is possible to suppress an increase in the width of the gas supply device 210.

  In the gas supply unit 11, the number of solenoid valves 50 is changed according to the type and number of gases used. Therefore, by providing a drive circuit board for driving each solenoid valve 50 for each solenoid valve, it is possible to flexibly cope with a change in the number of solenoid valves 50. However, in order to arrange the drive circuit board corresponding to the vicinity of the electromagnetic valve 50, it is necessary to protect the drive circuit board from the heat generated in the electromagnetic valve 50.

  On the other hand, as shown in FIG. 13, in the gas supply unit 11 including the heat transfer plate 30, a drive circuit board 81 that drives each electromagnetic valve 50 (50 </ b> A) is provided for each electromagnetic valve 50 (50 </ b> A). It is effective to adopt the configuration. The drive circuit board 81 is formed in a rectangular plate shape, and the drive circuit and electronic elements of the electromagnetic valve 50 are provided on the surface thereof. The drive circuit board 81 drives the corresponding solenoid valve 50 (50A), and the coil 52 of the solenoid valve 50 is directly connected to the electronic circuit pattern on the drive circuit board 81. For this reason, the wiring which connects the coil 52 and an electronic circuit pattern can be abbreviate | omitted, and power loss can be reduced in the coil 52 with a large rated current.

  Support members 82 for supporting the drive circuit board 81 are fixed (connected) to both ends in the longitudinal direction on the upper surface 20a of the flow path block 20. In this case, the downstream end of the carrying gas channel 21 (purge gas channel) penetrates in the longitudinal direction of the channel block 20, and an output port 129 is provided on the end surface 20 d of the channel block 20. It has been. The support member 82 is formed by bending a rectangular plate material, and has a “L” cross section. The portion that forms the short side of the “L” shape is fixed to the upper surface 20a of the flow path block 20 to form a fixed portion 82b. The fixing portion 82 b is disposed so as to extend in the width direction of the upper surface 20 a of the flow path block 20 and is accommodated within the range of the width of the flow path block 20. The portion having the long side of the “L” shape extends perpendicularly to the upper surface 20a of the flow path block 20 and constitutes a vertical portion 82a. The vertical portion 82 a is disposed in parallel to the side surface 20 c of the flow path block 20, and is disposed at substantially the same position as the flat plate portion 31 of the heat transfer plate 30 in the width direction of the flow path block 20.

  A rectangular plate-shaped connecting plate 83 is stretched between the two support members 82. The connecting plate 83 is fixed to the support member 82 at both ends in the longitudinal direction. The connecting plate 83 is disposed in parallel to the side surface 20 c of the flow path block 20. The connecting plate 83 is accommodated within the width of the flow path block 20. The connecting plate 83 is farther from the upper surface 20 a of the flow path block 20 than the bottom surface portion 53 b of the case 53 of the electromagnetic valve 50. That is, a gap is formed between the case 53 and the heat transfer plate 30 of the electromagnetic valve 50 and the connecting plate 83. For this reason, the transfer of heat from the case 53 of the electromagnetic valve 50 and the heat transfer plate 30 to the connecting plate 83 is suppressed.

  Each drive circuit board 81 of the electromagnetic valve 50 (50A) is attached to the surface on the center side in the width direction of the flow path block 20 in the connecting plate 83. The width of the drive circuit board 81 in the longitudinal direction of the flow path block 20 is made equal to the interval (the pitch of the electromagnetic valves 50) in which the electromagnetic valves 50 are arranged in the same direction. For this reason, when the solenoid valves 50 are arranged in series along the longitudinal direction of the flow path block 20, the drive circuit boards 81 are arranged without gaps, thereby arranging the intervals between the solenoid valves 50 (the pitch of the solenoid valves 50). ) And the interval at which the drive circuit board 81 is disposed (pitch of the drive circuit board 81) is equal. Therefore, the drive circuit board 81 can be arranged corresponding to any number of electromagnetic valves 50.

  The drive circuit board 81 is farther from the upper surface 20 a of the flow path block 20 than the bottom surface portion 53 b of the case 53 of the electromagnetic valve 50. That is, a gap is formed between the case 53 and the heat transfer plate 30 of the electromagnetic valve 50 and the drive circuit board 81. For this reason, heat transfer from the case 53 and the heat transfer plate 30 of the electromagnetic valve 50 to the drive circuit board 81 is suppressed. In addition, the drive circuit board 81 including the electronic elements arranged on the drive circuit board 81 is housed within the width of the flow path block 20.

  According to such a configuration, heat radiation from the electromagnetic valve 50 is appropriately performed by the heat transfer plate 30, and the drive circuit board 81 can be protected from the heat generated by the electromagnetic valve 50. Therefore, the drive circuit board 81 corresponding to the vicinity of the electromagnetic valve 50 can be disposed, and the change in the number of the electromagnetic valves 50 can be flexibly dealt with. Furthermore, since the wiring for connecting the coil 52 and the electronic circuit pattern can be omitted, power loss in the wiring can be suppressed. In addition, the drive circuit board 81 is disposed substantially parallel to the both side surfaces 20 c of the flow path block 20. For this reason, the drive circuit board 81 can extend in the longitudinal direction of the flow path block 20 and the direction perpendicular to the upper surface 20a while suppressing the width of the flow path block 20 from extending. Therefore, the drive circuit board 81 can be disposed in the vicinity of the electromagnetic valve 50 without being limited by the width of the gas supply unit 11.

  In FIG. 13, a heat insulating member may be provided between the connecting plate 83 and the drive circuit board 81 and the case 53 and the heat transfer plate 30 of the electromagnetic valve 50. The connecting plate 83 and the drive circuit board 81 can be supported by the heat insulating member. According to such a configuration, it is possible to stabilize the support of the drive circuit board 81 while suppressing the transfer of heat from the case 53 and the heat transfer plate 30 of the electromagnetic valve 50 to the connecting plate 83 and the drive circuit board 81. Further, as shown in FIG. 9, in the heat transfer plate 230 having the contact piece 33 that comes into contact with the case 53, a heat insulating member is provided between the connection plate 83 and the drive circuit board 81 and the contact piece 33. May be. Note that if the heat insulating member can stably support the drive circuit board 81, the support member 82 that supports the drive circuit board 81 via the connecting plate 83 can be omitted.

  1 and 11, the output ports 29 of the plurality of gas supply units 11 can be connected, and the type and flow rate of the gas can be controlled by the combination of the plurality of gas supply units 11.

  DESCRIPTION OF SYMBOLS 11 ... Gas supply unit, 20 ... Flow path block, 20a ... Upper surface as a valve mounting surface, 30 ... Heat transfer plate as a heat transfer member, 31 ... Flat plate part as a case contact part, 32 ... As a block connection part Fixed part, 50, 50A ... Solenoid valve, 52 ... Coil, 53 cases.

Claims (11)

A flow path block provided with a flow path therein, and a plurality of electromagnetic valves that change the flow state of the gas flowing through the flow path, each electromagnetic valve being disposed on a coil and an outer periphery of the coil; A gas supply unit comprising:
The flow path block is formed in a rectangular parallelepiped shape extending in a long shape, and has a valve mounting surface on which the plurality of electromagnetic valves are mounted,
The plurality of solenoid valves are arranged in series along the longitudinal direction of the valve mounting surface,
A case abutting portion extending along the longitudinal direction of the valve mounting surface so as to straddle each case of the plurality of solenoid valves, and the valve mounting surface of the flow path block on the valve mounting surface A gas supply unit comprising a heat transfer member having a block connecting portion that connects the case contact portions.   2. The case contact portion extends along the longitudinal direction of the valve mounting surface so as to cover all of the plurality of electromagnetic valves, and is in contact with the cases of all the electromagnetic valves. The gas supply unit described in 1. The case contact portion is formed in a flat plate shape,
The case of the electromagnetic valve has a case plane portion formed so as to form a plane,
The gas supply unit according to claim 1, wherein the case contact portion and the case flat portion are in contact with each other on a flat surface.   4. The gas supply unit according to claim 3, wherein the case flat surface portion is disposed substantially parallel to both side surfaces sandwiching the valve mounting surface in the width direction in the flow path block.   The gas supply unit according to any one of claims 1 to 4, wherein the block connection portion is connected to a portion between the plurality of electromagnetic valves on the valve mounting surface. A drive circuit board that drives each of the solenoid valves is provided for each solenoid valve,
The said drive circuit board is arrange | positioned substantially parallel with respect to the both sides which pinch | interpose the said valve mounting surface from the width direction in the said flow-path block, The any one of Claims 1-5 characterized by the above-mentioned. Gas supply unit. The drive circuit board is supported by a support member connected to the valve mounting surface,
The gas supply unit according to claim 6, wherein a gap is formed between the case of the electromagnetic valve and the support member. A plurality of the gas supply units according to any one of claims 1 to 7,
The gas supply device, wherein the gas supply units are arranged in parallel so that both side surfaces sandwiching the valve mounting surface from the width direction are adjacent to each other in the flow path block.   The gas supply device according to claim 8, wherein the adjacent side surfaces of the flow path block are in contact with each other. A heater for heating the gas flowing through the flow path;
9. The flow path blocks of the plurality of gas supply units are integrated with each other in a state where the heater is sandwiched between the adjacent side surfaces of the flow path block. Gas supply device.   The gas supply device according to any one of claims 7 to 10, further comprising an inter-unit heat transfer member that causes the heat transfer members of the plurality of gas supply units to contact each other.

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