JP2014213899A - Packing body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packing body provided with a buffer that can cope even when wafer storage containers are placed either flatly or vertically for storage.SOLUTION: A packing body for packing one or a plurality of wafer storage containers is provided with a buffer for protecting the wafer storage containers against vibration. The buffer includes: an outer peripheral wall 31; a first storage recess 32 surrounded by the outer peripheral wall 31 that is formed so as to store a first surface part of the wafer storage container; a support part formed in the first storage recess for supporting the wafer storage container stored in the first storage recess 32; and a plurality of second storage recesses 33 surrounded by the outer peripheral wall 31 which are formed with the support part in between, and formed so as to store a second surface part adjacent to the first surface part of the wafer storage container.

Description

  The present invention relates to a packaging body, and more particularly to a packaging body for packaging a wafer storage container.

As this type of package, for example, those disclosed in Patent Documents 1 to 3 are known.
Patent document 1 has a description of a packaging body having a configuration in which a substrate storage container is stored in a packaging box via a buffer at the upper and lower portions thereof. An uneven surface that can be fitted to the substrate storage container is formed on the surface of each buffer body facing the substrate storage container.
Patent Document 2 has a description of a configuration in which a wafer container is housed in an outer box via a buffer at the upper and lower portions thereof. An annular buffer projection is formed on the surface of each buffer body facing the exterior box.
Patent Document 3 describes a configuration in which a wafer cassette case is housed in a cardboard box via cushioning members at the upper and lower portions thereof. A plurality of shock absorbing blocks are formed on the surface of each shock absorber facing the cardboard box.

JP 2007-137454 A JP 2004-168324 A JP 2008-94417 A

However, all of the buffer bodies (buffer members) disclosed in Patent Documents 1 to 3 described above are provided with unevenness according to the shape of the contact surface of the wafer storage container or the like to be stored, and have been specified. The packaging mode (packing direction) of the wafer storage container or the like has been specified for the type of buffer.
Here, in the case of so-called flat placement of the wafer storage container, a large number of semiconductor wafers to be stored are arranged in the vertical direction in a horizontal state, but avoiding the bending of each semiconductor wafer. For this reason, there is often a case where the semiconductor wafers are placed vertically so that the stored semiconductor wafers are in a vertical state.
In this case, when the buffer body is formed so as to correspond to the wafer storage container for flat placement, when the wafer storage container is to be stored vertically, the buffer body cannot be used. There arises a disadvantage that a buffer formed for placement must be prepared in advance.

  This invention is made | formed in view of such a situation, The objective is to provide a package body provided with the buffer body which can respond even when accommodating a wafer storage container flatly or vertically.

The present invention is grasped by the following composition.
(1) The packing body of the present invention is a packing body for packing one or a plurality of wafer storage containers, and includes a buffer body that protects the wafer storage container from vibration, the buffer body includes an outer peripheral wall, A first storage recess that is surrounded by an outer peripheral wall and that is capable of storing the first surface portion of the wafer storage container, and the wafer storage container that is formed in the first storage recess and stored in the first storage recess And a second storage that is surrounded by the outer peripheral wall and formed between the support portions so as to be capable of storing a second surface portion adjacent to the first surface portion of the wafer storage container. And a recess.
(2) In the package of the present invention, in the configuration of (1), the first storage recess stores the wafer storage container so that a wafer incorporated therein is in a horizontal state, and the second storage recess The wafer storage container is stored so that a wafer incorporated therein is in a vertical state.
(3) The packaging body of the present invention may be configured in any one of (1) and (2), wherein the support portion includes a first support portion formed between the adjacent second storage recesses, And a second support portion extending in a direction crossing the longitudinal direction of the first support portion.
(4) In the package of the present invention, in the configuration of (3), the first support portion is formed by a rib that partitions the adjacent second storage recess, and the second support portion is formed on the outer peripheral wall. It is formed by the shelf part provided in the internal peripheral surface, It is characterized by the above-mentioned.
(5) In the package of the present invention, in the configuration of (4), the outer peripheral wall has a positioning projection for placing the wafer storage container on the shelf on the inner peripheral surface facing the shelf. It is characterized by having.

  According to the packaging body configured as described above, even when the wafer storage container is stored in a flat position or a vertical position, it can sufficiently cope with the case.

It is a block diagram of the packaging body of this invention, and is a sectional view at the time of accommodating a wafer storage container in a so-called flat state. BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram of the buffer body comprised by the package of this invention, (a) is a top view, (b) is sectional drawing in the bb line of (a), (c) is cc of (a). It is sectional drawing in a line. It is a block diagram of the wafer storage container accommodated in the package of this invention, (a) is a perspective view, (b) is sectional drawing. It is a block diagram of the packaging body of this invention, and is a case where the wafer storage container is stored in a so-called vertical state.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the accompanying drawings. Note that the same number is assigned to the same element throughout the description of the embodiment.
(Embodiment 1)
FIG. 1 is a cross-sectional view showing a package of the present invention, showing a state in which a wafer storage container is stored.
In FIG. 1, the wafer storage container 10 is disposed so as to be sandwiched between a first buffer 301 disposed on the bottom surface in the packaging box 20 and a second buffer 302 disposed on the top surface in the packaging box 20. ing.

  The packaging box 20 is made of, for example, cardboard or resin. As the first buffer body 301 and the second buffer body 302, for example, those manufactured by a heating / vacuum forming method of a resin sheet made of polyolefin resin such as polypropylene are used. The first buffer body 301 and the second buffer body 302 have concave and convex portions 51 and 52 formed on the surfaces that contact the wafer storage container 10, respectively. The buffer performance of the first buffer body 301 and the second buffer body 302 is The concavo-convex portions 51 and 52 are exhibited by bending or denting at the time of impact.

In the case of FIG. 1, the wafer storage container 10 is stored in the packaging box 20 in a so-called flat state.
Here, the configuration of the wafer storage container 10 will be schematically described with reference to FIGS. The wafer storage container 10 shown in FIGS. 3A and 3B is drawn in a flat state.
As shown in FIG. 3A, the wafer storage container 10 is configured by a combination of a bottomed cylindrical container body 10A and a lid body 10B that covers the container body 10A.

  In the container body 10A, a container cylindrical portion 12 projects from the center of a square plate-shaped base portion 11, and a slit 13 reaching the base end from the distal end of the container cylindrical portion 12 has a predetermined width along the circumferential direction. A plurality are formed. The lid 10 </ b> B has a regular quadrangular prism shape having substantially the same side as the one side of the base portion 11 of the container body 10 </ b> A, and includes a lid cylindrical portion 14 and a rectangular tube portion 15 that circumscribes the lid cylindrical portion 14. The lid cylindrical portion 14 covers the container cylindrical portion 12 of the container main body 10A, and the lower end thereof is seated on the upper surface of the base portion 11 of the container main body 10A. The container body 10A and the lid body 10B are made of, for example, a conductive plastic to which a conductive filler is added or a polymer plastic-treated conductive plastic.

FIG. 3B is a cross-sectional view taken along the line bb of FIG. 3A and also shows a semiconductor wafer W and the like to be accommodated.
As shown in FIG. 3B, the semiconductor wafers W are accommodated in the tray 17 sandwiched between the upper and lower surfaces of the spacer sheet 16, and the trays 17, 17,... Has been placed. Further, the stacked body of the trays 17, 17,... Containing the semiconductor wafers W is sandwiched between the cushion 18 disposed on the container body 10A side and the cushion 19 disposed on the lid body 10B side. The cushions 18 and 19 are protected from damage due to weight or tightening force.

2A, 2 </ b> B, and 2 </ b> C are configuration diagrams illustrating the configuration of the first buffer body 301, FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along line bb in FIG. (C) is sectional drawing in the cc line of (a). The second buffer 302 has the same configuration as that of the first buffer 301 and can be used by inverting the first buffer 301 by 180 °. Note that the uneven portion 52 of the second buffer body 302 may have a different shape from the uneven portion 51 of the first buffer body 301.
As described above, the first buffer 301 is manufactured by, for example, a resin sheet heating / vacuum molding method.

The first buffer 301 has, for example, a square shape in plan view, and an outer peripheral wall 31 made of a protrusion is formed along the periphery thereof.
Due to the formation of the outer peripheral wall 31 of the first buffer body 301, the first storage recess 32, the first storage area in the depth direction (α direction in FIGS. 2A and 2B) are sequentially formed in the region surrounded by the outer peripheral wall 31. Two storage recesses 33 are formed.

That is, the first support portion 34 formed of a plurality of protrusions (ribs) that divide the region surrounded by the outer peripheral wall 31 of the first buffer body 301 into, for example, three equal parts in one direction (for example, β direction in the figure) is formed. The height h of the first support portion 34 is formed to be smaller than the height H (> h) of the outer peripheral wall (see FIG. 2C), so that the first support portion 34 can be removed from the top of the outer peripheral wall 31. First storage recesses 32 are formed in the region up to the top, and three second storage recesses separated by the first support 34 in the region from the top of the first support 34 to the bottom surface of the first buffer 301. 33 is formed.
In addition, a shelf 35 is formed on the wall surface of the outer peripheral wall 31 on one end side of each of the first support portions 34 so as to extend in the circumferential direction, and this shelf has a height of the first support portion 34. By being the same as the height h, it functions as the second support portion 36. In this case, the second support portion 36 is formed to extend in a direction intersecting the first support portion 34.

Both the first support portion 34 and the second support portion 36 can support the wafer storage container (in a flat state) 10 stored in the first storage recess 32, and the wafer is supported only by the first support portion 34. Compared with the case where the storage container 10 is supported, by supporting the storage container 10 together with the second support portion 36, the reliability of the support is improved. The flatly placed wafer storage container 10 is configured such that the semiconductor wafers W incorporated therein are arranged in a horizontal state.
The outer peripheral wall 31 has a positioning projection 37 on the inner peripheral surface (wall surface) facing the shelf 35 for placing the wafer storage container 10 on the shelf 35 in the longitudinal direction of the first support 34. Is formed to protrude. Thereby, the wafer storage container 10 stored in the first storage recess 32 can be reliably placed on the shelf 35 which is the second support portion 36 and is supported together with the first support portion 34. When there is no positioning projection 37, the second storage recess 33 having the same width as the first storage recess 32 is formed, so that the backlash when the wafer storage container 10 is mounted in the first storage recess 32 is increased. Since the wafer storage container 10 may be supported only by the one support portion 34, the load increases and the wafer storage container 10 cannot be stably supported. Therefore, the first support portion 34 is shifted by the positioning protrusion 37 so that the center (O in the drawing) of the first storage recess 32 is displaced from the center (O ′ in the drawing) of the second storage recess 33. And the second support portion 36 can support the wafer storage container 10.

FIG. 4 is a view corresponding to FIG. 1 and shows a case where three wafer storage containers 10 are stored in a so-called vertical state.
In this case, the first buffer body 301 and the second buffer body 302 are the same as those shown in FIG. 1, and the packaging box 20 ′ has a height higher than that of the packaging box 20 shown in FIG. Is used. This is in order to correspond to the height dimension when the wafer storage container 10 is in a vertically placed state. The vertically placed wafer storage container 10 is configured such that the semiconductor wafer W incorporated therein is arranged in a vertical state.
As shown in FIG. 4, each wafer storage container 10 is stored in the second storage recess 33 of the first buffer 301 and the second buffer 302.

  The packaging body configured as described above includes a first storage recess 32 formed so that the buffer bodies 301 and 302 can store the first surface portion (having a relatively large area) of the wafer storage container 10, and the wafer storage container. And the second storage recess 33 formed so as to be capable of storing a second surface portion (having a relatively small area) adjacent to the first surface portion of the wafer 10. Even when it is stored vertically, it is possible to cope with it sufficiently.

As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. For example, the concavo-convex portions 51 and 52 provided in the first buffer body 301 and the second buffer body 302 are formed so as to be located above the lower end portion of the outer peripheral wall, and between the opposing surfaces of the packaging box 20. A gap can be provided, and a buffer step can be provided on the surface opposite to the packaging box. In these cases, the buffer performance can be further improved.
The first support rib 34 and the second support rib 36 are described as one continuous rib and one shelf, respectively, but may be a plurality of ribs and shelves each divided into a plurality of ribs.
The number of the second storage recesses 33 is not limited to three, and can be any number according to the dimensions of the wafer storage container. The wafer storage container may be one in which wafers are stacked via a spacer sheet 16 without using a tray, and a wafer supported on a film attached to a hollow dicing frame is replaced with a spacer sheet 16. It may also be a laminate.
In addition to these, it will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiments. Further, it is apparent from the description of the scope of claims that embodiments with such changes or improvements can also be included in the technical scope of the present invention.

10: Wafer storage container,
10A: Container body,
10B: lid,
11 …… Base,
12 …… Cylinder part of container,
13 …… Slit,
14 …… Cylinder part of the lid,
15 ... Square tube,
16 …… Spacer sheet,
17 …… Tray,
18, 19 …… Cushion,
20 ... Packing box,
301 …… first buffer 302 …… second buffer,
31 …… Outer wall,
32 …… First storage recess,
33 …… Second storage recess,
34 …… First support part,
35 …… Shelves,
36 …… Second support part,
37 …… Positioning protrusion,
51, 52 ...... Uneven portions.

Claims (5)

A packing body for packing one or a plurality of wafer storage containers,
A shock absorber for protecting the wafer storage container from vibrations,
The buffer is
An outer wall,
A first storage recess surrounded by the outer peripheral wall and capable of storing the first surface portion of the wafer storage container;
A support part formed in the first storage recess and supporting the wafer storage container stored in the first storage recess;
A second storage recess surrounded by the outer peripheral wall and formed with a plurality of the support portions in between so as to store a second surface portion adjacent to the first surface portion of the wafer storage container;
A packaging body comprising: The first storage recess stores the wafer storage container so that a wafer incorporated therein is in a horizontal state,
The second storage recess stores the wafer storage container so that a wafer incorporated therein is in a vertical state.
The package according to claim 1. The support part is
A first support formed between the adjacent second storage recesses;
A second support portion extending in a direction intersecting the longitudinal direction of the first support portion;
The package according to any one of claims 1 and 2, characterized by comprising: The first support portion is formed of a rib that partitions the adjacent second storage recess,
The second support part is formed by a shelf provided on the inner peripheral surface of the outer peripheral wall.
The package according to claim 3. The outer peripheral wall has a positioning projection for placing the wafer storage container on the shelf on the inner peripheral surface facing the shelf.
The package according to claim 4.

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