JP2014201012A - Laminate film composed of substrate film with fine structure formed on surface thereof and resin for transfer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate film which follows a three dimensional solid surface by plastic deformation and forms a fine structure.SOLUTION: A laminate film comprises: a fine structure 4 whose level difference between the bottom part and the upper part adjacent to each other is 5 μm or less formed on a substrate film 1; and a layer 5 composed of a thermoplastic resin formed on the fine structure 4, in which breaking elongation of the substrate at a predetermined temperature is 100% or more.

Description

  The present invention is a laminated film comprising a substrate film having a microstructure and a thermoplastic resin or a thermosetting resin transfer resin coated on the microstructure, and more specifically, forming a microstructure of a molded body The present invention relates to a laminated film assuming that the surface has a curved shape.

  Since a fine structure composed of fine irregularities having a period smaller than the wavelength of light exhibits an antireflection function, it has been proposed to form such a fine structure on the curved surface of a lens (Patent Document 1). As a method of manufacturing a molded body in which a microstructure is formed on a three-dimensional curved surface such as a lens surface, a flexible film made of a metal, oxide, or resin having a microstructure formed in advance along the curved surface of the molded body. A manufacturing method for joining is known (Patent Document 2). In this method, since a flexible film having a thickness of 10 to 100 μm is bonded to the product surface, a dimensional error occurs in a product that requires a dimensional accuracy of 10 μm or less for the concavo-convex structure, which is difficult to apply. is there. Moreover, when the thickness of the flexible film is 10 μm or less, the handling property of the flexible film is extremely deteriorated, so that it is not practical to use it.

  On the other hand, there is nanoimprint as a method for forming a fine structure on a substrate. Nanoimprint uses a fine structure formed on a substrate or molded body as a mold, and the mold is peeled off by curing the transfer resin with the mold attached to the substrate via a transfer resin that is cured by heat or ultraviolet rays. This is a method of forming a fine structure inversion structure on the substrate. When forming a fine structure on a curved surface using nanoimprint, it has been proposed to use a flexible film mold such as PET (polyethylene terephthalate) (Non-Patent Document 1). However, this manufacturing method requires the film to be elastically deformed and follow the curved surface of the molded body. Therefore, there is a problem that the film cannot follow and the microstructure cannot be formed due to the curvature of the molded body.

JP 2006-171219 A JP 2004-361635 A

Lithographic Mold: A Convenient Route to Structures with Sub-Micrometer Dimensions, James L. Wilbur, Enoch Kim, Younan Xia, and George M. Whitesides

  In order to solve the above problems, an object of the present invention is to provide a laminated film that plastically deforms to follow a three-dimensional solid surface and forms a fine structure.

In the present invention for solving the above-mentioned problems, a fine structure having an elevation difference of 5 μm or less between the adjacent bottom and top is formed on a base film, and a layer made of a thermoplastic resin is formed on the fine structure. A laminated film, wherein the glass transition temperature of the thermoplastic resin is T1 ° C., a temperature at which the storage elastic modulus of the substrate is 300 Ma, T 2 ° C., and a temperature at which the storage elastic modulus of the substrate is 0.1 MPa is T 3 ° C. When T1 + 20 ° C. is T2 ° C. or lower, the breaking elongation of the substrate is 100% or higher at T2 ° C., or when T1 + 20 ° C. is T2 ° C. or higher and T3 ° C. or lower, T1 + 20 ° C. It is a laminated film.
Here, the “microstructure” in the present invention is a concavo-convex structure in which the difference in height between the adjacent top and bottom is 0.05 μm to 5 μm or less, and the distance between the adjacent tops is 0.05 μm to 10 μm. It is.

  Further, the microstructure formed on the base film is composed of a layer made of an ultraviolet curable resin, and the peeling force between the base film and the ultraviolet curable resin is a microstructure and a thermoplastic resin made of the ultraviolet curable resin. It is preferable that it is relatively higher than the peeling force with the layer.

  Furthermore, the storage elastic modulus of the ultraviolet curable resin is 0.1 to 300 MPa at T2 ° C when T1 + 20 ° C is T2 ° C or lower, or at T1 + 20 ° C when T1 + 20 ° C is T2 ° C or higher and T3 ° C or lower. Is preferred.

  Another aspect of the present invention is a laminated film in which a fine structure having an elevation difference of 5 μm or less between an adjacent bottom and top is formed on a base film, and an uncured thermosetting resin is applied on the fine structure. And when the hardening start temperature of the said thermosetting resin is set to T4 degreeC, the storage elastic modulus of the base film in the glass transition temperature of the said base material and below T4 degreeC is in the range of 0.1-300 MPa. It is a laminated film.

  Further, the microstructure formed on the base film is composed of a layer made of an ultraviolet curable resin, and the peeling force between the base film and the layer made of the ultraviolet curable resin is cured with the microstructure made of the ultraviolet curable resin. It is preferable that it is relatively higher than the peel strength from the thermosetting resin.

  Furthermore, it is preferable that the storage elastic modulus of the ultraviolet curable resin at the glass transition temperature or higher and T4 ° C. or lower of the substrate is 0.1 to 300 MPa.

  Since the fine structure formed on the base film can be produced using a known lithography technique, fine structures having various shapes can be produced and used. The laminated film follows the three-dimensional solid surface of the molding while being plastically deformed, and forms a fine structure made of a thermoplastic resin or a thermosetting resin on the three-dimensional solid surface. Therefore, by considering the stretch distribution when the laminated film follows the molded body, it is possible to obtain a molded body having a desired microstructure.

It is a figure which shows the process of providing resin for transcription | transfer on a fine structure, and the laminated | multilayer film of this invention. It is a figure which shows the formation process of the fine structure using ultraviolet curable resin. It is a figure which shows the formation process of the microstructure by hot press. It is a cross-sectional SEM photograph of the reversal structure of the moth eye structure formed on the base film in an Example. 6 is a cross-sectional SEM photograph of a moth-eye structure formed on an acrylic lens in Example 4. It is a figure which shows the reflectance measurement result of the acrylic lens before and after formation of the moth-eye structure in Example 4. It is a figure which shows the reflectance measurement result of the nickel plate before and behind formation of the moth-eye structure in Example 9.

Hereinafter, the present invention will be described based on the illustrated embodiments.
The present invention includes a step of forming a fine structure on a base film, and a step of forming a thermoplastic resin layer serving as a transfer resin 5 on the fine structure or a step of applying an uncured thermosetting resin. The obtained laminated film, for example, the storage elastic modulus and elongation at break of the base film are specified within a specific range in order to bond the film along a stretched body having a three-dimensional solid surface as a stretch. It is a thing. FIG. 1 shows the structure of the laminated film of the present invention and the manufacturing process described later. In the present invention, a fine structure 4 having a difference in height of 5 μm or less between adjacent bottom and upper portions is formed on a base film 1, and a layer made of a thermoplastic resin as a transfer resin 5 on the fine structure 4 or It is a laminated film in which a layer coated with an uncured thermosetting resin is formed. The fine structure 4 may be provided directly on the base film 1 or may be provided, for example, in a layer made of the ultraviolet curable resin 2 described later. FIG. 1 illustrates the latter mode.
It should be noted that the size, thickness, dimensions, etc. of each part shown in these drawings are different from the size, thickness, dimensions in the actual fine structure forming process.

  In the present invention, the base film 1 has different characteristics depending on whether the transfer resin 5 is a thermoplastic resin or an uncured thermosetting resin.

First, when the transfer resin is a thermoplastic resin, the glass transition temperature of the thermoplastic resin is T1 ° C., the temperature at which the storage elastic modulus of the substrate is 300 MPa, T2 ° C., and the storage elastic modulus of the substrate is 0. When T1 + 20 ° C. is T2 ° C. or lower when T1 ° C. is set to T3 ° C., or T1 + 20 ° C. is T2 ° C. or higher and T3 ° C. or lower at T1 + 20 ° C., the elongation at break of the substrate is 100 % Or more is necessary. When a laminated film is attached to a molded body at T2 ° C. or lower, the laminated film cannot be sufficiently stretched when applied to the molded body, and the microstructure 4 cannot be adhered to the molded body. There is. On the other hand, when pasting at T3 ° C. or higher, the base film 1 of the laminate softened by heating may not be able to maintain the film shape.
When using the above laminated film, it is not always necessary to perform the attaching step at T1 + 20 ° C. However, if the laminated film satisfies the above conditions at the temperature, the fine shape can be imparted to many molded bodies. It can be expected to be done easily.

  On the other hand, in the case where the transfer resin is an uncured thermosetting resin, the base film at the glass transition temperature of the base material to T4 ° C. or less when the curing start temperature of the thermosetting resin is T4 ° C. It is necessary that the storage elastic modulus is in the range of 0.1 to 300 MPa. In this case, it is a matter of course that the attachment to the molded body is performed at a temperature not lower than the glass transition temperature of the substrate and not higher than T4 ° C. If the temperature is lower than the glass transition temperature, the substrate cannot be stretched. If the temperature is higher than T4 ° C., the curing reaction of the thermosetting resin proceeds during bonding, and the fine shape is formed on the surface of the molded body. Can not be bonded. In addition, it is necessary that the storage elastic modulus of the base film is in the range of 0.1 to 300 MPa in the temperature range. If the storage elastic modulus of the base film is less than 0.1, the base film 1 of the laminate may be too soft to maintain the film shape. When the storage elastic modulus of the base film exceeds 300 MPa, the laminated film cannot be sufficiently stretched when being applied to the molded body, and the microstructure 4 cannot be bonded to the molded body 7. There is.

  The base film 1 is preferably an unstretched film. This is because, when a laminated film having a fine structure is attached to the molded body, the base film 1 is stretched to follow the surface of the molded body having a three-dimensional solid surface. In the case of using a film that has already been stretched before the attaching step, the crystallinity of the material of the film generally increases, so that the base film 1 is difficult to stretch and it is difficult to follow the molded body. Furthermore, since the elongation rates in the stretching direction and the non-stretching direction of the base film 1 are different, problems such as difficulty in stretching the base film 1 is likely to occur.

  Examples of the material for the base film 1 include acrylic resin, polyvinyl chloride, polystyrene, and polycarbonate. What is necessary is just to select the material of the base film 1 suitably according to the magnitude | size and shape of a to-be-molded body. When the transfer resin 5 is a thermoplastic resin, it is preferable to use a rubber-containing acrylic resin from the viewpoint of workability. When the transfer resin 5 is an uncured thermosetting resin, it is preferable to use soft polyvinyl chloride because the thermosetting resin can be easily stretched at a lower temperature, which is a curing start temperature T4 ° C. or lower.

  FIG. 2 shows a process of forming the microstructure 4 on the base film 1 using an ultraviolet curable resin. This step is a so-called optical nanoimprint method. The fine structure 4 on the base film 1 can be obtained by applying the ultraviolet curable resin 2 on the base film 1, pressing the reverse structure 3 of the fine structure from the ultraviolet curable resin 2 side, and curing by ultraviolet irradiation. it can. Irradiation with ultraviolet rays may be performed from one or both of the base film 1 and the inversion mold 3 having high transmittance with respect to the wavelength contributing to curing.

  Moreover, the formation process of the fine structure on the base film by a hot press is shown in FIG. This step is a so-called thermal nanoimprint method. The fine structure 4 can be formed on the base film 1 by applying pressure after heating the reverse mold 3 having the reverse shape of the fine structure 4 from the base film 1. Furthermore, when producing the base film 1 by extrusion molding, the microstructure 4 can be formed on the surface of the base film 1 at the time of extrusion molding by setting the roll surface shape to the inverted shape of the microstructure 4. The method for forming the microstructure 4 on the surface of the base film 1 may be appropriately selected in view of the required area, the size of the structure, the physical properties of the film, and the like.

  The reversal mold 3 having the reversal shape of the fine structure 4 can be manufactured using a known technique. For example, there are a mask exposure method, an electron beam lithography method, an interference exposure method and the like. In addition, aluminum anodization, which is known as self-organization, and fine particle arrangement, which can deal with a large area, can be used. The fine structure inversion mold 3 may be appropriately selected according to the required area and the size of the fine structure.

When the ultraviolet curable resin 2 is used for forming the fine structure, the storage elastic modulus after curing of the ultraviolet curable resin is preferably 0.1 to 300 MPa, more preferably 0.1 to 10 MPa. This is because when the laminated film having a fine structure is attached to the molded body, the ultraviolet curable resin 2 and the base film 1 are peeled off by making the elastic modulus of the ultraviolet curable resin 2 and the base film 1 close to each other. This is because it can be prevented. When the storage elastic modulus of the ultraviolet curable resin 2 is outside the above range, the base film 1 and the ultraviolet curable resin are caused by a difference in stress applied to the base film 1 and the ultraviolet curable resin 2 in the step of attaching the fine structure to the molded body. The problem that 2 peels easily occurs.
Moreover, before apply | coating the ultraviolet curable resin 2 on the base film 1, you may give easy adhesion processing, such as a corona treatment, to the surface of the base film 1 which apply | coats the ultraviolet curable resin 2. FIG. Thereby, peeling of the ultraviolet curable resin 2 and the base film 1 can be further prevented.

  Examples of the fine structure to be formed include a moth-eye structure, a line and space structure, a pillar structure, a hole structure, and other photonic crystals, a diffraction grating, and the like. Here, the fine structure is a concavo-convex structure in which the difference in height between the top and bottom adjacent to each other is 0.05 μm to 5 μm or less, and the distance between the tops adjacent to each other is 0.05 μm to 10 μm.

  Next, the process of providing the transfer resin 5 on the fine structure will be described. As shown in FIG. 1, the process of providing the transfer resin 5 on the microstructure 4 is different depending on whether the transfer resin 5 is a thermoplastic resin or an uncured thermosetting resin.

  When the transfer resin 5 is a thermoplastic resin, a solution 6 is first prepared by using a solvent that is soluble in the thermoplastic resin. After uniformly applying the solution 6 onto the microstructure 4 using a spin coater, bar coater, spray coater or the like, the solvent is evaporated from the solution 6 to fill the unevenness of the microstructure 4 with the transfer resin 5. Thus, a smooth thin film of the transfer resin 5 is obtained. Further, it is necessary to select an unnecessary solvent for the material forming the microstructure 4 as the solvent. This is to prevent the solvent in the solution 6 from dissolving the fine structure 4. Examples of the thermoplastic resin include acrylic resin, polyvinyl chloride, polystyrene, and polycarbonate, and ketone, ester, chlorinated solvent, and the like can be used as a solvent for dissolving the thermoplastic resin.

  When the transfer resin 5 is an uncured thermosetting resin, a solution 6 having a reduced viscosity by adding a diluent is prepared. After the solution 6 is uniformly applied on the microstructure 4 using a spin coater, bar coater, spray coater, or the like, the solvent is evaporated from the solution 6 to fill the unevenness of the microstructure 4 with the transfer resin 5. Thus, a smooth thin film of the transfer resin 5 is obtained. Examples of the thermosetting resin include an epoxy resin, a phenol resin, and a melamine resin. As the diluent, a solution that does not react with the thermosetting resin such as methanol can be used.

  The peeling force between the base film 1 and the ultraviolet curable resin 2 needs to be higher than the peeling force between the microstructure 4 made of the ultraviolet curable resin and the transfer resin 5. Therefore, before the transfer resin 5 is applied on the microstructure 4, a fluorine-based release agent may be applied on the microstructure 4, and the solution 6 to which the release agent is added is applied on the microstructure 4. It may be applied. This is to improve the releasability of the base film 1 of the laminated film and the transfer resin 5 in the step of peeling the base film 1 on which the fine structure 4 is formed from the laminated film attached to the molded body.

  Nickel type with a moth-eye structure with a period of 300 nm and a height of 300 nm for fine structure (manufactured by Kyodo International), polyvinyl chloride film (Tough Neil, manufactured by Nippon Wavelock Co., Ltd., hereinafter PVC) and rubber-containing acrylic film (Hereinafter RT) was used. As the acrylic film containing rubber, the same film as that described in Example 1 disclosed in JP-A-2009-228000 was used except that the thickness was 150 μm.

  A nickel mold was attached to the substrate film via an acrylic ultraviolet curable resin (UVX4332, manufactured by Toagosei Co., Ltd.), and irradiated with ultraviolet rays. When the nickel mold was peeled from the base film, an inverted structure of a moth-eye structure made of a cured UV curable resin could be obtained on the base film (see FIG. 4).

<When the transfer resin is a thermoplastic resin>
PMMA (parapet GH, manufactured by Kuraray Co., Ltd.) diluted to 5 wt% with methyl isobutyl ketone as a solvent was applied by spin coating on the fine structure of the base film having the inverted structure of the moth-eye structure obtained as above. The laminated film was obtained by heating to 70 ° C. and evaporating the solvent. The glass transition temperature of PMMA used as the transfer resin is 90 ° C.

  A laminate composed of a base film and a thermoplastic resin that forms a reverse structure of the moth-eye structure on the surface is heated to 100 to 180 ° C. in a vacuum / pressure forming machine (made by Fuse Vacuum), and is made into an acrylic lens (φ60 mm) at 300 kPa. Pasted. After cooling the acrylic lens to which the laminate was attached to room temperature, when the base film was peeled off, it was confirmed that a moth-eye structure made of PMMA was formed on the surface of the acrylic lens. The results are shown in Table 1.

<Comparative example>
Vacuum pressure forming at 100 to 180 ° C. using a PET film (Toyobo Ester, A4300, manufactured by Toyobo Co., Ltd.) biaxially stretched on the base film 1 using the same microstructure, UV curable resin and acrylic lens as in Example 1. Carried out. The elongation at break at the temperature was 95% at the maximum in the MD direction and 60% at the maximum in the TD direction. As a result, the base film was broken at any temperature, and a fine structure could not be formed.

  As a result of observing the molded body in which the moth-eye structure (FIG. 5) was formed on the surface of the acrylic lens obtained in Example 4, the moth-eye structure was stretched by 0 to 30% from the top to the bottom of the lens. Further, as shown in FIG. 6, the surface reflectance of the acrylic lens before and after the formation of the moth eye was measured with a microspectroscope (manufactured by Lambda Vision), and the reduction of the reflectance due to the formation of the moth eye structure was confirmed.

<When the transfer resin is an uncured thermosetting resin>
An epoxy resin (jER828, manufactured by Mitsubishi Chemical) diluted to 30 wt% with methanol is applied by spin coating on the microstructure of the base film having the inverted structure of the moth-eye structure obtained as described above at 20 ° C. The methanol was allowed to evaporate. The polymerization start temperature of the epoxy resin is 70 ° C.

  A laminated film made of an uncured thermosetting resin and a base film that forms an inverted structure of the moth-eye structure on the surface is heated to 60, 80 ° C. in a vacuum / pressure forming machine (NGF-0406-T, manufactured by FVF), It affixed on the to-be-molded body at 300 kPa. Glass, silicon wafer, stainless steel plate, nickel plate, and acrylic lens were used for the molded body. The laminated film was heated at 80 ° C. for 3 hours in a state where the laminated film was attached to the molded body. The base film was peeled off from the molded body, and it was confirmed whether or not a moth-eye structure made of an epoxy resin cured on the fine structure forming surface of the molded body was formed. The results are shown in Table 2.

  FIG. 7 shows the results of measuring the surface reflectance before and after the formation of the moth-eye structure with a microspectroscope (made by Lambda Vision) for the molded body in which the moth-eye structure was formed on the nickel substrate obtained in Example 9. From this, the reduction of the reflectance by moth eye structure formation was confirmed.

DESCRIPTION OF SYMBOLS 1 Base film 2 Ultraviolet curable resin 3 Micro structure reversal type 4 Micro structure 5 Transfer resin 6 Transfer resin diluted solution 7 Molded object 8 Vacuum / pressure forming machine 9 Micro structure reversal structure

Claims (6)

A laminated film in which a fine structure having an elevation difference of 5 μm or less between an adjacent bottom part and an upper part is formed on a base film, and a layer made of a thermoplastic resin is formed on the fine structure, wherein the thermoplastic resin T1 + 20 ° C. is T2 ° C. or lower when the glass transition temperature of T1 ° C., the temperature at which the storage elastic modulus of the base material is 300 Ma is T2 ° C., and the temperature at which the storage elastic modulus of the base material is 0.1 MPa is T3 ° C. In the case of T2, the laminated film is characterized in that the elongation at break of the substrate is 100% or more at T1 + 20 ° C when T1 + 20 ° C is T2 ° C or more and T3 ° C or less. The microstructure formed on the base film consists of a layer made of an ultraviolet curable resin, and the peeling force between the base film and the layer made of the ultraviolet curable resin is such that the microstructure made of the ultraviolet curable resin and the heat The laminated film according to claim 1, wherein the laminated film is relatively higher in peeling force than a layer made of a plastic resin. The storage elastic modulus of the ultraviolet curable resin is 0.1 to 300 MPa at T2 ° C when T1 + 20 ° C is T2 ° C or lower, and at T1 + 20 ° C when T1 + 20 ° C is T2 ° C or higher and T3 ° C or lower. The laminated film according to claim 2. A laminated film in which a microstructure having an elevation difference of 5 μm or less between adjacent bottom and top is formed on a base film, and an uncured thermosetting resin is applied on the microstructure, the thermosetting When the curing start temperature of the conductive resin is T4 ° C., the storage elastic modulus of the base film at the glass transition temperature to T4 ° C. of the base material is in the range of 0.1 to 300 MPa. . The microstructure formed on the base film is made of a layer made of an ultraviolet curable resin, and the peeling force between the base film and the layer made of the ultraviolet curable resin is a microstructure made of the ultraviolet curable resin and the cured heat. The laminated film according to claim 4, wherein the laminated film is relatively higher than a peeling force with the curable resin. 6. The laminated film according to claim 5, wherein the storage elastic modulus of the ultraviolet curable resin at the glass transition temperature to T4 ° C. is 0.1 to 300 MPa.