JP2014193624A - Support body, glass substrate laminated body, display device panel with support body and method for manufacturing display device panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass substrate laminated body which suppresses glass defects caused by foreign matters such as air bubbles or dust incorporated between glass substrates, can be subjected to treatment in an existing manufacturing line without generating an etch pit, has good heat resistance, prevents an increase in peeling strength over time and can easily separate the glass substrates and a resin layer which are tightly adhered to each other in a short time without damaging the resin layer.SOLUTION: There are provided: a support body composed of a support substrate having a cured silicone resin layer having a peelable surface which is formed by curing a curable silicone resin composition containing an organoalkenyl polysiloxane and an organohydrogen polysiloxane having a hydrogen atom boded to a silicon atom at the molecular terminal on the surface of the support substrate; and a grass substrate laminated body formed by laminating the glass substrate on a cured silicone resin layer surface of the support body.

Description

  The present invention relates to a support for supporting a glass substrate used in a liquid crystal display device, an organic EL display device and the like, a method for producing the support, a method for producing a glass substrate laminate using the support, and a glass containing the support The present invention relates to a substrate laminate, a display device panel with a support for producing a display device panel using the glass substrate laminate, and a method for producing a display device panel using the glass substrate laminate.

In the field of liquid crystal display devices (LCD), organic EL display devices (OLED), especially portable display devices such as digital cameras and mobile phones, weight reduction and thinning of display devices are important issues.
In order to cope with this problem, it is desired to further reduce the thickness of the glass substrate used in the display device. As a general method for reducing the thickness of the glass substrate, the glass substrate is etched using chemical etching before or after the display device member is formed on the surface of the glass substrate, and further if necessary. A method of thinning by physical polishing is performed.

However, if the thickness of the glass substrate is reduced by performing an etching process or the like before forming the display device member on the surface of the glass substrate, the strength of the glass substrate is lowered and the amount of deflection is increased. Therefore, there arises a problem that it becomes difficult to perform processing in the existing display device panel production line.
In addition, if the thickness of the glass substrate is reduced by performing an etching process after forming the display device member on the surface of the glass substrate, it is formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate. There arises a problem that the formed fine scratches are manifested, that is, a problem of generation of etch pits.

Therefore, for the purpose of solving such problems, a predetermined process for manufacturing a display device in that state by laminating a thin glass substrate and a supporting substrate together through a resin layer. After that, a method of peeling the glass substrate surface and the peelable surface of the resin layer has been proposed.
For example, Patent Document 1 discloses a glass substrate laminate obtained by laminating a glass substrate and a support substrate, and the glass substrate and the support substrate have a peelable surface and are non-adhesive. A glass substrate laminate is described which is laminated via a silicone resin layer shown.

International Publication No. 2007/018028 Pamphlet

  In Patent Document 1, a silicone resin layer having a peelable surface and exhibiting non-adhesive properties is an addition reaction type curable silicone between a polysiloxane having an alkenyl group in the main chain structure and methylhydrogenpolysiloxane. It is disclosed that it consists of the hardened | cured material of a resin composition. Further, as the structure of the polysiloxane having an alkenyl group used, a compound represented by the following composition formula (3) or (4) is disclosed. In the composition formulas (3) and (4), m represents an integer of 2 or more, and n represents an integer including 0.

  Further, as methyl hydrogen polysiloxane, a compound represented by the following composition formula (5) is disclosed. In the general formula (5), a represents an integer including 0, and b represents an integer of 1 or more.

However, the present inventors have studied using these compounds described in Patent Document 1, and as a result, a glass substrate laminate in which a support substrate having a resin layer and a glass substrate are laminated is left for a long period after production. After that, when the glass substrate is peeled off from the resin layer surface, the glass substrate is not peeled off from the resin layer surface, part of which is destroyed, or part of the resin of the resin layer remains on the glass substrate. In some cases, the yield is extremely lowered.
In addition, when the glass substrate laminate is applied for manufacturing a display device member such as a TFT array in which the manufacturing process is performed in a high temperature environment of about 400 ° C., the resin layer or between the resin layer and both substrates is used. There is a problem that foaming occurs at the interface, and further improvement is required.

  Therefore, in order to solve the above problems, the present invention is excellent in heat resistance, suppresses an increase in peel strength over time with a laminated glass substrate, and further destroys the laminated glass substrate. An object of the present invention is to provide a support for supporting a glass substrate that can be peeled off in a short time and can be applied to a manufacturing process under a high temperature condition such as a TFT array, and a manufacturing method thereof. Furthermore, the present invention provides a glass substrate laminate using the support, a method for producing a glass substrate laminate including the support, a display device panel with a support for producing a display device panel, and a glass substrate laminate. Another object of the present invention is to provide a method for manufacturing a panel for a display device using the above.

As a result of intensive studies on the prior art, the present inventors have found that the crosslinking reaction between the compounds constituting the cured silicone resin layer in the support has not sufficiently progressed. Furthermore, as a result, the heat resistance of the cured silicone resin layer becomes insufficient, and the hydrosilyl group remaining on the surface of the resin layer after curing becomes a silanol group through a hydrolysis reaction, and the silanol group of the glass substrate at the time of lamination It has been found that there is a problem in that the peel strength increases due to the condensation reaction.
Based on the above knowledge, the present inventors can solve the above problems by using an addition reaction type curable silicone resin composition containing an organohydrogenpolysiloxane having a specific structure. As a result, the present invention has been completed.

That is, in order to achieve the above object, the first aspect of the present invention provides:
A support substrate and a cured silicone resin layer having a peelable surface provided on one side of the support substrate, a support for laminating a glass substrate on the surface of the cured silicone resin layer, wherein the cured silicone resin is: A cured product of a curable silicone resin composition comprising a linear organopolysiloxane (a) and the following linear organopolysiloxane (b), wherein the cured silicone resin layer supports the curable silicone resin composition. The support is a cured silicone resin layer formed by curing on a substrate surface.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.

  In the first embodiment, the molar ratio of hydrogen atoms bonded to all silicon atoms to all alkenyl groups in the curable silicone resin composition (hydrogen atom / alkenyl group) is preferably 0.7 to 1.05. Moreover, it is preferable that the material of the support substrate is made of a material having a 5% heating weight loss temperature of 300 ° C. or higher. The support substrate is preferably a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate.

A second aspect of the present invention comprises a support for laminating a glass substrate on the surface of the cured silicone resin layer, comprising a support substrate and a cured silicone resin layer having a peelable surface provided on one side of the support substrate, A curable silicone resin composition containing the following linear organopolysiloxane (a) and linear organopolysiloxane (b) is applied to one side of a support substrate to form a layer of the curable silicone resin composition: And forming the cured silicone resin layer by curing the curable silicone resin composition.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.

The third aspect of the present invention provides a method for producing a glass substrate laminate, comprising laminating a glass substrate on the surface of the cured silicone resin layer of the support.
In the 3rd aspect of this invention, it is preferable that the thickness of the said glass substrate is 0.05-0.4 mm.

4th aspect of this invention is a glass substrate laminated body which has a support substrate, a glass substrate, and the cured silicone resin layer which exists among them, and the said cured silicone resin layer is the following linear organopolysiloxane (a ) And the following linear organopolysiloxane (b): a cured product of a curable silicone resin composition, the peel strength between the glass substrate and the cured silicone resin layer being the support substrate and the cured silicone resin layer Provided is a glass substrate laminate characterized by being lower than the peel strength between.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.

  In a fourth aspect, the curable silicone resin composition is cured by curing the curable silicone resin composition in a state where the cured silicone resin layer is in contact with the support substrate surface and not in contact with the glass substrate surface. A layer formed by contacting the surface of the glass substrate after curing is preferable. Moreover, it is preferable that the molar ratio (hydrogen atom / alkenyl group) of hydrogen atoms bonded to all silicon atoms to all alkenyl groups in the curable silicone resin composition is 0.7 to 1.05. Moreover, it is preferable that the material of the support substrate is made of a material having a 5% heating weight loss temperature of 300 ° C. or higher. The support substrate is preferably a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate. Moreover, it is preferable that the thickness of a glass substrate is 0.05-0.4 mm.

  According to a fifth aspect of the present invention, there is provided a display device with a support for manufacturing a panel for a display device, wherein at least a part of the constituent members of the display device panel is formed on the glass substrate surface of the glass substrate laminate. Panels are provided.

  In the sixth aspect of the present invention, at least a part of the constituent members of the display device panel is formed on the glass substrate surface of the glass substrate laminate, and then the glass substrate and the support substrate with a cured silicone resin layer are formed. Disclosed is a method for manufacturing a panel for a display device having a glass substrate.

  According to the present invention, the heat resistance is excellent, the increase in peel strength over time with a laminated glass substrate is suppressed, and further, the laminated glass substrate can be peeled off in a short time without breaking. In addition, it is possible to provide a support for supporting a glass substrate that can be applied to a manufacturing process under a high temperature condition such as manufacturing a TFT array, and a manufacturing method thereof. Furthermore, according to the present invention, a glass substrate laminate obtained using the support, a method for producing the glass substrate laminate, and a support for manufacturing a panel for a display device obtained using the glass substrate laminate. A panel for a display device with a body and a method for manufacturing a panel for a display device using the glass substrate laminate can also be provided.

More specifically, the resin of the resin layer of the support in the present invention comprises a cured silicone resin that is a cured product of a specific addition reaction type curable silicone resin composition, and this specific curable silicone resin composition. Is characterized in that one of the raw material components is an organohydrogenpolysiloxane having a linear structure and having a silicon atom having a hydrogen atom bonded to at least one terminal. This organohydrogenpolysiloxane is more reactive than other organohydrogenpolysiloxanes and has few hydrogen atoms bonded to silicon atoms remaining in the cured silicone resin after the curing reaction. As a result, the time-dependent hydrolysis reaction of the cured silicone resin hardly occurs, and there is a feature that changes in physical properties such as peel strength with time are small. For this reason, in this invention, it has the characteristics that the change of the peeling strength between a resin layer and a glass substrate at the time of a glass substrate lamination | stacking and after a lamination | stacking, especially a raise of a peeling strength do not occur easily. Further, since the reactivity of the organohydrogenpolysiloxane is high, the degree of completion of the curing reaction is increased, and the heat resistance of the resulting cured silicone resin is improved. And, since the appropriate low peel strength can be stably maintained for a long time, the resin layer is hardly destroyed during the peeling of the glass substrate, and in the glass substrate laminate, the glass substrate surface and the peelable surface of the resin layer are in close contact with each other. Can be peeled easily and in a short time.
Furthermore, according to the method for producing a glass substrate laminate using the support of the present invention, generation of glass defects due to foreign matters such as bubbles and dust mixed between the glass substrate and the resin layer, and generation of etch pits Can be suppressed.

It is typical sectional drawing of one Embodiment of the panel for display apparatuses with a support which concerns on this invention.

  Below, the support body which concerns on this invention, the glass substrate laminated body containing a support body, the panel for display apparatuses with a support body, and the panel for display apparatuses are demonstrated in detail based on suitable embodiment shown on drawing.

FIG. 1 is a schematic cross-sectional view of an embodiment of a display panel with a support according to the present invention.
A display device panel 10 with a support shown in FIG. 1 includes a support 20 according to the present invention. A support substrate 12, a resin layer 14, a glass substrate 16, and a component 18 of the display device panel are connected to the support substrate 12. It has a layered structure in which layers are stacked in order. Note that the thickness of each layer is not limited by the drawing.
The support substrate 12 and the resin layer 14 constitute the support 20 according to the present invention, the support 20 and the glass substrate 16 constitute the glass substrate laminate 30 according to the present invention, and the glass substrate 16 and the display device. The panel structural member 18 constitutes the display device panel 40 (without the support 20) according to the present invention.
First, each layer which comprises the support body 20, the glass substrate laminated body 30, the display apparatus panel 40, and the display apparatus panel 10 with a support body which concern on this invention is demonstrated.

<Support substrate>
The support substrate 12 used in the present invention is not particularly limited as long as it supports the glass substrate 16 through a resin layer 14 described later and reinforces the strength of the glass substrate 16.
Although it does not restrict | limit especially as a material of the support substrate 12, Glass, a silicon | silicone, a synthetic resin, a metal, etc. are illustrated as a suitable example from a viewpoint of industrial availability. Among these, the support substrate 12 is preferably a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate.

When glass is employed as the material of the support substrate 12, glass having various compositions such as glass containing alkali metal oxide (such as soda lime glass) and non-alkali glass can be used. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
The difference in coefficient of linear expansion between the glass substrate 16 and the glass used for the support substrate 12 is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × More preferably, it is 10 ⁻⁷ / ° C. or less. The glass of the glass substrate 16 and the glass of the support substrate 12 may be made of the same material. In this case, the difference between the linear expansion coefficients of both glasses is zero.

  When plastic (synthetic resin) is adopted as the material of the support substrate 12, the type is not particularly limited. For example, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyethersulfone resin, Examples include polyether ketone resins, polyether ether ketone resins, polyethylene naphthalate resins, polyacrylic resins, various liquid crystal polymer resins, and silicone resins.

  When a metal is adopted as the material of the support substrate 12, the type is not particularly limited, and examples thereof include stainless steel and copper.

The heat resistance of the support substrate 12 is not particularly limited. However, when a glass substrate 16 is laminated on the support substrate 12 and a TFT array of a display device member is formed, the heat resistance is preferably high. Specifically, the temperature at which the weight loss when the material sample is heated at 10 ° C./min in an air atmosphere exceeds 5% of the sample weight is defined as the 5% heating weight loss temperature. The temperature is preferably 300 ° C. or higher. Furthermore, it is more preferable that it is 350 degreeC or more.
In this case, any of the above glasses is applicable in terms of heat resistance.
Preferred plastic materials from the viewpoint of heat resistance include polyimide resins, fluororesins, polyamide resins, polyaramid resins, polyethersulfone resins, polyetherketone resins, polyetheretherketone resins, polyethylene naphthalate resins, and various liquid crystal polymer resins. Illustrated.

Although the thickness of the support substrate 12 is not specifically limited, It is preferable that it is the thickness which can process the glass substrate laminated body of this invention with the manufacturing line of the present panel for display apparatuses. For example, the thickness of a glass substrate currently used in a liquid crystal display device is mainly in the range of 0.5 to 1.2 mm, and particularly 0.7 mm. In the present invention, it is mainly assumed that a thinner glass substrate is used. At this time, if the thickness of the glass substrate laminate is about the same as that of the current glass substrate, it can be easily adapted to the current production line.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm, and the thickness of the glass substrate is 0.1 mm, the thickness of the support substrate and the thickness of the resin layer Is 0.4 mm. The current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the glass substrate has a thickness of 0.4 mm, the supporting substrate And the thickness of the resin layer is 0.3 mm.

  The glass substrate in the present invention is not limited to the liquid crystal display device, and the present invention is not only intended to adapt the glass substrate laminate to the current display panel production line. Therefore, the thickness of the support substrate 12 is not limited, but is preferably 0.1 to 1.1 mm. Further, the thickness of the support substrate 12 is preferably thicker than the glass substrate 16. Moreover, when the support substrate 12 is a glass plate, it is preferable that it is especially 0.3 mm or more. When the support substrate 12 is a glass plate, the thickness is more preferably 0.3 to 0.8 mm, and further preferably 0.4 to 0.7 mm.

  When a glass substrate is used as the support substrate, the surface of the support substrate 12 made of the various materials described above may be a polished surface that has been polished or a non-etched surface (fabric surface) that has not been polished. May be. From the viewpoint of productivity and cost, a non-etched surface (fabric surface) is preferable.

The support substrate 12 has a first main surface and a second main surface, and the shape thereof is not limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape obtained by cutting off the corners of the peripheral portion (corner cut).
Although the magnitude | size of the support substrate 12 is not limited, For example, in the case of a rectangle, it may be 100-2000 mm x 100-2000 mm, and it is preferable that it is 500-1000 mm x 500-1000 mm.

<Resin layer (cured silicone resin layer)>
The resin layer 14 according to the present invention is fixed on the first main surface of the support substrate 12 described above, and in the glass substrate laminate in which the glass substrate 16 is laminated, the glass having the first main surface and the second main surface. The substrate 16 is in close contact with the first main surface. The peel strength between the first main surface of the glass substrate 16 and the resin layer 14 needs to be lower than the peel strength between the first main surface of the support substrate 12 and the resin layer 14. That is, when separating the glass substrate 16 and the support substrate 12, the glass substrate 16 is peeled off at the interface between the first main surface of the glass substrate 16 and the resin layer 14, and the first main surface of the support substrate 12 and the resin layer 14 are separated. It must be difficult to peel off at the interface. For this reason, although the resin layer 14 adheres to the 1st main surface of the glass substrate 16, it has the surface characteristic which can peel the glass substrate 16 easily. That is, the resin layer 14 is bonded to the first main surface of the glass substrate 16 with a certain bonding force to prevent the glass substrate 16 from being displaced, and at the same time, when the glass substrate 16 is peeled off. The glass substrate 16 is bonded with a bonding force that can be easily peeled without breaking the glass substrate 16. In this invention, the property which can peel this resin layer surface easily is called peelability. On the other hand, the first main surface of the support substrate 12 and the resin layer 14 are bonded with a bonding force that is relatively difficult to peel.

In the glass substrate laminate 30 of the present invention, the resin layer 14 and the glass substrate 16 are not attached by the adhesive force that the adhesive has, and the force caused by the van der Waals force between the solid molecules, that is, the adhesion It is preferable that it is attached by force.
On the other hand, the bonding force of the resin layer 14 to the first main surface of the support substrate 12 is relatively higher than the bonding force of the glass substrate 16 to the first main surface. In the present invention, the bonding of the glass substrate 16 to the first main surface is referred to as adhesion, and the bonding of the support substrate 12 to the first main surface is referred to as fixing.
Further, since the resin layer 14 is highly flexible, even if foreign matter such as bubbles or dust is mixed between the glass substrate 16 and the resin layer 14, it is possible to suppress the occurrence of distortion defects in the glass substrate 16. .

  In order to make the peel strength of the resin layer 14 with respect to the first main surface of the glass substrate 16 relatively low and to make the peel strength of the resin layer 14 with respect to the first main surface of the support substrate 12 relatively high, a curable silicone resin is used. The composition is cured on the first main surface of the support substrate 12 to form a resin layer 14 made of a cured silicone resin, and then a glass substrate 16 is laminated and adhered to the resin layer 14 made of a cured silicone resin. preferable. The cured silicone resin in the present invention is the same resin as the non-adhesive cured silicone resin used for release paper and the like, and even if it is in close contact with the glass substrate 16, the peel strength is low. However, when the curable silicone resin composition to be a cured silicone resin is cured on the surface of the support substrate 12, it adheres by interaction with the surface of the support substrate during the curing reaction, and the cured silicone resin and the support substrate surface after curing are bonded. The peel strength is considered to be high. Therefore, even if the glass substrate 16 and the support substrate 12 are made of the same material, a difference can be provided between the resin layer and the peel strength between them.

  The formation of the resin layer 14 with a difference between the peel strength with respect to the first main surface of the glass substrate 16 and the peel strength with respect to the first main surface of the support substrate 12 is not limited to the above method. For example, when the support substrate 12 made of a material having higher adhesion to the cured silicone resin surface than the glass substrate 16 is used, the glass substrate 16 and the support substrate 12 can be laminated simultaneously with a cured silicone resin film interposed. . Moreover, when the adhesiveness by hardening of a curable silicone resin composition is low enough with respect to the glass substrate 16, and the adhesiveness is high enough with respect to the support substrate 12, it is sclerosis | hardenability between the glass substrate 16 and the support substrate 12. The resin layer 14 can be formed by curing the silicone resin composition. Even when the support substrate 12 is made of the same glass material as that of the glass substrate 16, it is possible to increase the peel strength with respect to the resin layer 14 by performing a process for improving the adhesion of the surface of the support substrate 12. For example, the surface of the support substrate 12 made of a glass material can be treated to increase the concentration of silanol groups to increase the bonding force with the resin layer 14.

  The addition reaction type curable silicone resin composition is a curable composition containing a linear organoalkenylpolysiloxane, a linear organohydrogenpolysiloxane, and an additive such as a catalyst. It becomes a silicone resin. Specifically, the resin layer 14 in the present invention comprises a linear organopolysiloxane (a) which is a linear organoalkenylpolysiloxane and a linear organopolysiloxane (b) which is a specific organohydrogenpolysiloxane. It is a layer of a cured silicone resin obtained by curing the contained addition reaction type curable silicone resin composition. In general, compared to other curable silicone resins, addition reaction type curable silicone resins are more susceptible to curing reaction, have lower curing shrinkage, and have a good degree of peelability of the cured product. The cured product of the addition reaction type curable silicone resin composition according to the present invention is particularly excellent in heat resistance with little change in the peel strength with time. In general, solvent-type, emulsion-type, and solventless-type compositions are used as addition reaction type curable silicone resin compositions. As the curable silicone resin composition in the present invention, any type of composition can be used.

As the addition reaction type curable silicone resin composition containing the linear organopolysiloxane (a) and the linear organopolysiloxane (b), known ones can be used. For example, in Japanese translations of PCT publication No. 2005-509711 (International publication number: WO2003 / 044084) and the cited references, addition reaction type curable for forming a water-repellent and peelable silicone film on paper or plastic film is disclosed. A silicone resin composition is described. However, the cured silicone resin obtained from these known addition reaction type curable silicone resin compositions is used for applications such as release paper, and there is no suggestion about the application of the present invention. In addition, although the effect of high releasability is common with the use of the present invention, there is no suggestion about the effects required for the present invention such as heat resistance.
The curable silicone resin composition used for forming the resin layer 14 will be described in detail below.

<Linear organopolysiloxane (b)>
The curable silicone resin composition in the present invention contains a linear organopolysiloxane (a) and a linear organopolysiloxane (b). Of these, the linear organopolysiloxane (b) is one type of organohydrogenpolysiloxane. The linear organopolysiloxane (b) is a linear organopolysiloxane having at least 3 hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. It is a linear organopolysiloxane present in the silicon atom.

In general, monofunctional units at both ends of a linear organopolysiloxane are called M units, difunctional units other than both ends are called D units, and linear organopolysiloxanes having n D units are used. The structure of polysiloxane is represented by M (D) _n M. Moreover, when expressing the average composition of each unit, it may be represented by M ₂ (D) _n .
The linear organopolysiloxane (b) in the present invention is characterized in that a hydrogen atom bonded to a silicon atom is present in at least one of two M units. More preferable linear organopolysiloxane (b) has a hydrogen atom bonded to a silicon atom in each of two M units, and a part of D units of n D units are also bonded to a silicon atom. It is a linear organopolysiloxane in which hydrogen atoms are present. The linear organopolysiloxane (b) can also be used in combination with other linear organohydrogenpolysiloxanes. Other linear organohydrogenpolysiloxanes include linear organohydrogenpolysiloxanes in which there are no hydrogen atoms bonded to silicon atoms in M units, and hydrogen atoms bonded to silicon atoms are present only in part of D units. Siloxane.

Examples of the linear organopolysiloxane (b) or a mixture of the linear organopolysiloxane (b) and another linear organohydrogenpolysiloxane include linear organopolysiloxanes having an average composition represented by the following formula (1). preferable. Hereinafter, the organohydrogenpolysiloxane represented by this average composition formula is referred to as organohydrogenpolysiloxane (1).
(M ¹ ) _α (M ² ) _β (D ¹ ) _γ (D ² ) _δ (1)
Where M ¹ is an M unit in which no hydrogen atom bonded to a silicon atom is present, M ² is an M unit in which a hydrogen atom bonded to a silicon atom is present, D ¹ is a D unit in which no hydrogen atom bonded to a silicon atom is present, And D ² represents a D unit in which a hydrogen atom bonded to a silicon atom is present, α is a number of 0 or more and less than 2, β is a number of 2 or less that is not 0, α + β = 2, γ is a number greater than 0, and δ is Γ + δ = n for numbers greater than or equal to zero. More preferable organohydrogenpolysiloxane (1) is such that α is a number of 0 or more and less than 1, β is a number of 1 or more and 2 or less, γ is a number of 1 or more, and δ is a number of 1 or more. The organohydrogenpolysiloxane represented by the formula (5) described in International Publication No. 2007/018028 pamphlet is a compound with β = 0.

The linear organopolysiloxane (b) is a compound in which β is a number of 1 or more and 2 or less in the above formula (1). A preferred linear organopolysiloxane (b) is a compound in which α is a number of 0 or more and less than 1, β is a number of 1 or more and 2 or less, γ is a number of 1 or more, and δ is a number of 1 or more.
The M ² unit may have two or three hydrogen atoms bonded to a silicon atom, but preferably has one. The D ² unit may have two hydrogen atoms bonded to a silicon atom, but preferably has one. The M ¹ unit, D ¹ unit, preferred M ² unit, and preferred D ² unit are preferably those represented by the following formula. R ^{1 to} R ⁵ each independently represents an alkyl group having 4 or less carbon atoms, a fluoroalkyl group, or a phenyl group. R ^{1 to} R ⁵ are preferably all methyl groups.

When D ² units are present (when δ is not 0), γ / δ, which is the abundance ratio between D ¹ and D ² , is an index representing the density of hydrogen atoms bonded to silicon atoms in the molecule. The abundance ratio (γ / δ) is preferably 0.2 to 30, and particularly preferably 0.5 to 20. If this abundance ratio is too small, the residual amount of hydrogen atoms bonded to unreacted silicon atoms in the cured silicone resin increases, so that the change in peel strength of the cured silicone resin with respect to the glass substrate increases with time, and heat resistance is increased. There is a risk of deteriorating sex. On the other hand, if the abundance ratio is too large, the crosslink density of the cured silicone resin decreases, which may cause a decrease in heat resistance.

Β / δ representing the abundance ratio of M ² units and D ² units is preferably 15 ≦ (β / δ) × 1000 ≦ 1500. More preferably, 15 ≦ (β / δ) × 1000 ≦ 1000, and particularly preferably 15 ≦ (β / δ) × 1000 ≦ 500. When (β / δ) × 1000 is less than 15, the molecular weight increases, or the steric hindrance of the functional group increases and the reactivity decreases, so that the change in the peel strength of the cured silicone resin with respect to the glass substrate with time is changed. May grow. On the other hand, if (β / δ) × 1000 is larger than 1500, the crosslink density becomes small, so that a cured silicone resin having sufficient physical properties such as strength may not be obtained.

The above formula (1) represents the average composition of the organosiloxane units in the organohydrogenpolysiloxane, and each molecule of the linear organopolysiloxane (b) is an integer in which α is 0 or 1, β is An integer of 1 or 2, α + β = 2, γ is an integer of 1 or more, and δ is an integer of 0 or more.
The individual molecules of the organohydrogenpolysiloxane other than the linear organopolysiloxane (b) are organohydrogenpolysiloxanes in which α is 2, β is 0, γ is an integer of 0 or more, and δ is an integer of 1 or more. is there. In the case where D ¹ and D ² in these molecules exist many none, the sequence of D ¹ and D ² may be a block copolymer chain structure may be a random copolymer chain structure. Usually, a copolymer chain is formed by ring-opening polymerization of a cyclic siloxane, so that it is considered that the ring-opened cyclic siloxane block has a random copolymerized structure.

  As described above, the linear organopolysiloxane (b) includes not only the organohydrogenpolysiloxane whose individual molecule is the linear organopolysiloxane (b), but also the linear organopolysiloxane (b) and other organohydrosiloxanes. It may be a mixture of genpolysiloxane (the average composition of which is represented by the above formula (1)). In that case, it is preferable that 20 mol% or more of linear organopolysiloxane (b) is contained among the total number of moles of the organohydrogenpolysiloxane used. If it is less than 20 mol%, hydrogen atoms bonded to silicon atoms tend to remain, and the peel strength at the interface between the resin layer 14 and the glass substrate 16 tends to increase with time, which is not preferable. The content of the linear organopolysiloxane (b) is preferably 50 mol% or more, more preferably 80 mol% in that the heat resistance of the cured silicone resin and the temporal stability of the peel strength between the resin layer 14 and the glass substrate are more excellent. The above is more preferable.

<Linear organopolysiloxane (a)>
The curable silicone resin composition in the present invention contains a linear organopolysiloxane (a) that reacts with the linear organopolysiloxane (b). The linear organopolysiloxane (a) is a linear organopolysiloxane having at least two alkenyl groups per molecule. The linear organopolysiloxane having an alkenyl group is hereinafter also referred to as an organoalkenyl polysiloxane.

  Although it does not specifically limit as an alkenyl group, For example, a vinyl group (ethenyl group), an allyl group (2-propenyl group), a butenyl group, a pentenyl group, a hexynyl group etc. are mentioned, Among these, it is vinyl from the point which is excellent in heat resistance. Groups are preferred.

  In the linear organopolysiloxane (a), the alkenyl group is present in the M unit or D unit, and may be present in both the M unit and D unit. From the viewpoint of curing speed, it is preferably present at least in M units, and preferably present in both two M units. In addition, organoalkenylpolysiloxanes having alkenyl groups only in M units have a higher molecular weight, the lower the alkenyl group concentration per molecule and the lower the crosslinking density of the cured silicone resin, which may lead to a decrease in heat resistance. Therefore, it is preferable that some of the D units have an alkenyl group together with the M unit.

As the linear organopolysiloxane (a), a linear organopolysiloxane having an average composition represented by the following formula (2) is preferable.
(M ¹ ) _a (M ³ ) _b (D ¹ ) _c (D ³ ) _d (2)
However, M ¹ is M units having no alkenyl group (same as the M ¹ unit), M ³ and M units, D ¹ D units having no alkenyl group (wherein D ¹ having alkenyl groups bonded to silicon atoms And D ³ represents a D unit having an alkenyl group bonded to a silicon atom, a is a number from 0 to 2, b is a number from 0 to 2, a + b = 2, c is a number of 0 or more, d is a number of 0 or more and c + d = n (where b + d is 2 or more). In the more preferred organoalkenylpolysiloxane represented by the formula (2), a is a number of 0 or more and less than 1, b is a number of 1 or more and 2 or less, c is a number of 1 or more, and d is a number of 1 or more.

The M ³ unit may have two or three alkenyl groups bonded to a silicon atom, but preferably has one. The D ³ unit may have two alkenyl groups bonded to a silicon atom, but preferably has one. The alkenyl group is preferably a vinyl group. The M ¹ unit, D ¹ unit, preferred M ³ unit, and preferred D ³ unit are preferably those represented by the following formulae. R ^{1 to} R ⁵ each independently represents an alkyl group, a fluoroalkyl group or a phenyl group having 4 or less carbon atoms, as described above. R ^{1 to} R ⁵ are preferably all methyl groups.

The above formula (2) shows the average composition of the organosiloxane units in the organoalkenylpolysiloxane, and each molecule of the linear organopolysiloxane (a) is an integer where a is 0 or 1, and b is 1. Alternatively, an integer of 2 and a + b = 2, c is an integer of 1 or more, and d is an integer of 0 or more. Since the linear organopolysiloxane (a) has two or more alkenyl groups per molecule, b + d is 2 or more. The organoalkenyl polysiloxane (a) may be a mixture with another organoalkenyl polysiloxane, but usually only the organoalkenyl polysiloxane (a) is used. However, the organoalkenyl polysiloxane (a) may be a mixture of two or more organoalkenyl polysiloxanes (a). In addition, when two types of organoalkenylpolysiloxanes having different La values are used in combination, a more advantageous effect can be obtained.
Further, as in the case of the organohydrogenpolysiloxane, the formula (2) is an organoalkenylpolysiloxane in which both D ¹ and D ³ are present, and the arrangement of D ¹ and D ³ is a random copolymer chain. It may be a structure or a block copolymer chain structure. As the organoalkenyl polysiloxane (a), organoalkenyl polysiloxanes represented by the formula (3) and the formula (4) described in International Publication No. 2007/018028 pamphlet can be used.

The weight average molecular weight Mw of the organoalkenyl polysiloxane (a) is preferably in the range of 1,000 ≦ Mw ≦ 5,000,000. More preferable Mw is 2,000 ≦ Mw ≦ 3,000,000, and more preferably 3,000 ≦ Mw ≦ 1,000,000. By setting Mw within this range, volatilization does not occur at the time of heat curing, and workability is improved without becoming too high viscosity.
Furthermore, it is preferably in the range of 0.001 ≦ La ≦ 1.0 in terms of the number of equivalents of alkenyl groups per 100 grams of organoalkenylpolysiloxane (a). More preferable La is 0.0015 ≦ La ≦ 0.9, and further preferably 0.002 ≦ La ≦ 0.9. By setting La within this range, the heat resistance of the cured silicone resin is improved, and the temporal stability of the peel strength between the cured silicone resin layer and the glass substrate is improved.

  The content ratio of the linear organopolysiloxane (a) and the linear organopolysiloxane (b) in the curable silicone resin composition is not particularly limited, but hydrogen bonded to silicon atoms in the linear organopolysiloxane (b) It is preferable to adjust the molar ratio (hydrogen atom / alkenyl group) of atoms to all alkenyl groups in the linear organopolysiloxane (a) to be 0.7 to 1.05. Especially, it is preferable to adjust a content ratio so that it may become 0.8-1.0. When the molar ratio between the hydrogen atom bonded to the silicon atom and the alkenyl group exceeds 1.05, the peel strength of the cured silicone resin after standing for a long time tends to increase, and the peelability may not be sufficient. In particular, when manufacturing an LCD or the like, the support is often peeled off after a considerable period of time after the glass substrate is laminated, and the peelability after standing for a long period of time becomes a serious problem. Moreover, when the molar ratio of the hydrogen atom bonded to the silicon atom and the alkenyl group is less than 0.7, the crosslink density of the cured silicone resin is lowered, which may cause a problem in chemical resistance.

  When the molar ratio between the hydrogen atom bonded to the silicon atom and the alkenyl group exceeds 1.05, it is not clear why the peeling force increases after standing for a long period of time. It is considered that some moisture is gradually infiltrated, the unreacted hydrosilyl group (Si—H group) in the cured silicone resin is hydrolyzed, and some reaction is involved with the silanol group on the glass substrate surface. Therefore, it is preferable that hydrogen atoms bonded to substantially unreacted silicon atoms do not remain in the resin layer 14.

<Other components>
Various additives may be contained in the curable silicone resin composition in the present invention as long as the effects of the present invention are not impaired as necessary. As an additive, it is usually preferable to use a catalyst (addition reaction catalyst) that promotes the reaction between a hydrogen atom bonded to a silicon atom and an alkenyl group. As this catalyst, a platinum group metal catalyst is preferably used. Examples of the platinum group metal-based catalyst include platinum-based, palladium-based, and rhodium-based catalysts, and it is particularly preferable to use as a platinum-based catalyst from the viewpoint of economy and reactivity. A known catalyst can be used as the platinum-based catalyst. Specifically, platinum fine powder, platinum black, chloroplatinic acid such as chloroplatinic acid, chloroplatinic acid, platinum tetrachloride, alcohol compounds of chloroplatinic acid, aldehyde compounds, platinum olefin complexes, alkenyls Examples thereof include siloxane complexes and carbonyl complexes.
The catalyst is preferably a mass ratio of 2 to 400 ppm with respect to the total mass of the linear organopolysiloxane (a) and the linear organopolysiloxane (b). More preferably, it is 5-300 ppm, More preferably, it is 8-200 ppm.

In the curable silicone resin composition of the present invention, an activity inhibitor (compound also called a reaction inhibitor, a retarder, etc.) having an action of suppressing the catalyst activity is used together with the catalyst for the purpose of adjusting the catalyst activity. Is preferred. Examples of the activity inhibitor include various organic nitrogen compounds, organic phosphorus compounds, acetylene compounds, oxime compounds, and organic chloro compounds. Furthermore, if necessary, inorganic fillers such as various silicas, calcium carbonates, iron oxides and the like may be contained within a range not impairing the effects of the present invention.
In addition, organic solvents such as hexane, heptane, octane, toluene and xylene, and dispersion media such as water are components that do not constitute a cured silicone resin, but include improved workability for application of the curable silicone resin composition. For the purpose, it can be used by blending with the curable silicone resin composition of the present invention.

<Formation of resin layer>
As described above, it is preferable to cure the curable silicone resin composition on the first main surface of the support substrate 12 to form the resin layer 14 made of a cured silicone resin. For this purpose, a curable silicone resin composition is applied to one side of a support substrate to form a layer of the curable silicone resin composition, and then the curable silicone resin composition is cured to form a cured silicone resin layer. When the curable silicone resin composition is a fluid composition, the layer of the curable silicone resin composition is applied as it is, and the curable silicone resin composition has a low fluidity or a non-fluid composition. In the case of a product, an organic solvent is blended and applied. Moreover, the emulsion liquid of a curable silicone resin composition, a dispersion liquid, etc. can also be used. The coating film containing a volatile component such as an organic solvent is then evaporated to remove the volatile component to form a curable silicone resin composition layer. Curing of the curable silicone resin composition can be performed continuously with evaporation removal of volatile components.

Curing of the curable silicone resin composition is not limited to the above method. For example, a curable silicone resin composition can be cured on some peelable surface to produce a cured silicone resin film, and this film can be laminated with a support substrate to produce a support. Also,
When the curable silicone resin composition does not contain a volatile component, it can be cured by being sandwiched between the glass substrate 16 and the support substrate 12 as described above.

  When a curable silicone resin composition is applied to one side of a support substrate to form a layer of the curable silicone resin composition, the application method is not particularly limited, and conventionally known methods can be mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to the kind of composition. For example, when a volatile component is not blended in the curable silicone resin composition, a die coating method, a spin coating method, or a screen printing method is preferable. In the case of a composition containing a volatile component such as a solvent, the composition is cured after removing the volatile component by heating or the like before curing.

The conditions for curing the curable silicone resin composition vary depending on the type of organopolysiloxane used and the optimum conditions are appropriately selected. Usually, the heating temperature is preferably 50 to 300 ° C., and the treatment time is preferably 5 to 300 minutes.
More specific heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of a platinum-based catalyst is blended with respect to 100 parts by weight of the total resin contained in the curable silicone resin composition And curing in the air at 50 ° C. to 300 ° C., preferably 100 ° C. to 270 ° C. In this case, the reaction time is 5 to 180 minutes, preferably 60 to 120 minutes.

  If the resin layer has low silicone migration, when the glass substrate is peeled off, the components in the resin layer are difficult to migrate to the glass substrate. In order to obtain a resin layer having a low silicone migration property, it is preferable to proceed the curing reaction as much as possible so that an unreacted silicone component does not remain in the resin layer. The reaction temperature and reaction time as described above are preferable because substantially no unreacted organosilicone component remains in the resin layer. If the reaction time is too long or the reaction temperature is too high, the organosilicone component and the cured silicone resin are simultaneously oxidized and decomposed to produce a low molecular weight organosilicone component, resulting in high silicone migration. There is a possibility. It is also preferable to allow the curing reaction to proceed as much as possible so that no unreacted organosilicone component remains in the resin layer, in order to improve the peelability after the heat treatment.

  In addition, in order to provide a high fixing force (high peel strength) between the resin layer and the support substrate, a surface modification process (priming process) may be performed on the support substrate surface. For example, a chemical method (primer treatment) that improves the fixing force chemically such as a silane coupling agent, a physical method that increases surface active groups such as a flame (flame) treatment, or a surface such as a sandblast treatment Examples of such a mechanical processing method increase the catch by increasing the roughness of the material.

The thickness of the resin layer 14 made of the cured silicone resin is not particularly limited, and an optimal thickness is appropriately selected depending on the type of the glass substrate 16 and the like. Especially, it is preferable that it is 5-50 micrometers, it is more preferable that it is 5-30 micrometers, and it is further more preferable that it is 7-20 micrometers. When the thickness of the resin layer is within such a range, the adhesion between the surface of the glass substrate 16 and the resin layer 14 becomes better. Moreover, even if air bubbles or foreign substances are present, the occurrence of distortion defects in the glass substrate 16 can be further suppressed. In addition, if the thickness of the resin layer 14 is too thick, it takes time and materials to form the resin layer 14 and is not economical.
The resin layer 14 may be composed of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when the resin layer 14 consists of two or more layers, the kind of resin which forms each layer may differ.

The resin layer 14 preferably has a peelable surface tension of 30 mN / m or less, more preferably 25 mN / m or less, and even more preferably 22 mN / m or less. Although there is no limitation in particular about a minimum, it is preferred that it is 15mN / m or more.
With such surface tension, it can be more easily peeled off from the surface of the glass substrate 16, and at the same time, adhesion to the surface of the glass substrate is sufficient.

  The resin layer 14 is preferably made of a material having a glass transition point lower than room temperature (about 25 ° C.) or having no glass transition point. If the glass transition point is as described above, it can have moderate elasticity while maintaining non-adhesiveness, and can be more easily peeled off from the surface of the glass substrate 16, and at the same time adheres to the surface of the glass substrate. It will be enough.

Moreover, it is preferable that the resin layer 14 has the outstanding heat resistance. For example, when forming the structural member 18 of the panel for display devices on the 2nd main surface of the glass substrate 16, the glass substrate laminated body 30 of this invention can be used for the heat processing on high temperature conditions. The cured silicone resin in the present invention has sufficient heat resistance to withstand this heat treatment.
More specifically, the thermal decomposition start temperature of the resin layer 14 made of the cured silicone resin in the present invention can be set to 400 ° C. or higher in the glass substrate laminated state. The heat resistant temperature is more preferably 420 ° C. or higher, and particularly preferably 430 ° C. to 450 ° C. If it is in the said range, decomposition | disassembly of a resin layer will be suppressed also under high temperature conditions (about 400 degreeC or more), such as a manufacturing process of a TFT array, and generation | occurrence | production of the foaming in a glass substrate laminated body will be suppressed more.

The thermal decomposition start temperature is expressed by the following measurement method.
A resin layer (thickness = about 15-20 μm) is formed on a 50 mm square support substrate (thickness = about 0.4-0.6 mm), and a 50 mm square glass substrate (thickness = about 0.1-0.1 mm). An evaluation sample is obtained by further stacking 0.4 mm). Then, the sample is placed on a hot plate heated to 300 ° C., heated at a heating rate of 10 ° C. per minute, and the temperature at which the foaming phenomenon is confirmed in the sample is defined as the thermal decomposition start temperature.

  Moreover, when the elasticity modulus of the resin layer 14 is too high, it exists in the tendency for adhesiveness with the glass substrate 16 surface to become low. On the other hand, if the elastic modulus is too low, the peelability may be lowered. The cured silicone resin in the present invention has an elastic modulus that satisfies this required performance.

<Support>
In the illustrated example, the support 20 according to the present invention includes the support substrate 12 and the resin layer 14 described above. Since the surface of the resin layer 14 exhibits good peeling performance, it can be peeled without destroying the laminated glass substrate thereon. Therefore, it can be suitably used as a support for supporting the glass substrate. Moreover, as another use, the support body of the glass substrate for organic EL lighting, etc. are mentioned.

<Glass substrate>
The glass substrate 16 is a glass substrate for producing a display device panel by forming a constituent member 18 of the display device panel, which will be described later, on the glass substrate 16.
The manufacturing method of the glass substrate 16 used by this invention is not specifically limited, It can manufacture by a conventionally well-known method. For example, it can be obtained by melting a conventionally known glass raw material into a molten glass and then forming it into a plate shape by a float method, a fusion method, a slot down draw method, a redraw method, a pulling method or the like. Commercial products can also be used.

  The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the glass substrate 16 are not particularly limited. For example, a glass substrate for a display device such as a conventional LCD or OLED It may be the same.

  The thickness of the glass substrate 16 is not particularly limited, but is preferably less than 0.7 mm, more preferably 0.5 mm or less, and even more preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

  The glass substrate 16 has the 1st main surface and the 2nd main surface, Although the shape is not limited, It is preferable that it is a rectangle. Here, the rectangle is substantially a rectangle and includes a shape obtained by cutting off the corners of the peripheral portion (corner cut).

  Although the magnitude | size of the glass substrate 16 is not limited, For example, in the case of a rectangle, it may be 100-2000 mm x 100-2000 mm, and it is preferable that it is 500-1000 mm x 500-1000 mm.

  With such a preferable thickness and preferable size, the glass substrate laminate 30 of the present invention can easily peel the glass substrate 16 and the support 20 from each other.

Properties of the glass substrate 16 such as heat shrinkage, surface shape, chemical resistance, etc. are not particularly limited, and vary depending on the type of display device panel to be manufactured.
However, the thermal contraction rate of the glass substrate 16 is preferably small. Specifically, the linear expansion coefficient, which is an index of the thermal shrinkage rate, is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 45 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C. This is because it is difficult to produce a high-definition display device when the thermal shrinkage rate is large.
In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).
The glass substrate 16 is made of, for example, alkali glass or non-alkali glass. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

  The surface of the glass substrate 16 described above may be a polished surface that has been subjected to polishing treatment, or may be a non-etched surface (fabric surface) that has not been subjected to polishing treatment. That is, a material that satisfies flatness may be selected as appropriate in accordance with the required accuracy of the display panel to be manufactured.

<Glass substrate laminate>
In the illustrated example, the glass substrate laminate 30 according to the present invention includes the support substrate 12, the resin layer 14, and the glass substrate 16 described above.
As described above, the resin layer 14 has a peelable surface, and can easily peel off the glass substrate 16 and the display device panel 40 (the glass substrate 16 on which the constituent member 18 of the display device panel is formed). . More specifically, the peel strength between the surface of the resin layer 14 and the surface of the glass substrate 16 is preferably 8.5 N / 25 mm or less, more preferably 7.8 N / 25 mm or less, and 4.5 N / 25 mm. The following are particularly preferred: If it is in the said intensity | strength, destruction of the resin layer at the time of peeling, destruction of a glass substrate, etc. hardly occur, and it is preferable. About a minimum, what is necessary is just to have the adhesive force of the grade which a glass substrate does not raise | generate a position shift on a resin layer, and it is preferable that it is 1.0 N / 25mm or more normally.
In addition, it is preferable that the peel strength after evaluation of the stability over time of the adhesion strength, which is an adhesion index shown in the Examples column described later, is also within the above range.

The peel strength between the resin layer surface and the glass substrate surface is represented by the following measurement method.
A resin layer (thickness = about 15 to 20 μm) is formed on the entire surface of a 25 × 50 mm square support substrate (thickness = about 0.4 to 0.6 mm), and a 25 × 75 mm square glass substrate (thickness = An evaluation sample is obtained by laminating about 0.1 to 0.4 mm). Then, after fixing the non-adsorption surface of the support substrate of the sample to the end of the table with double-sided tape, the center part of the protruding glass substrate (25 × 25 mm) is pushed up vertically using a digital force gauge and peeled off. Measure strength.

On the other hand, the peel strength between the resin layer 14 surface and the support substrate 12 surface is preferably 9.8 N / 25 mm or more, more preferably 14.7 N / 25 mm or more, and particularly preferably 19.6 N / 25 mm or more. . In the case of having the above-mentioned peel strength, when the glass substrate or the like is peeled from the resin layer, the separation of the support substrate and the resin layer hardly occurs, and the glass substrate or the like and the support (laminated body of the support substrate and the resin layer) Can be easily separated. As described above, this peel strength can be easily achieved by curing the curable silicone resin composition on the support substrate. Also, if the peel strength between the surface of the resin layer 14 and the surface of the support substrate 12 is too high, when the support substrate and the resin layer need to be peeled off due to reuse of the support substrate, the peel off may occur. May be difficult. Therefore, the peel strength between the resin layer 14 surface and the support substrate 12 surface is preferably 29.4 N / 25 mm or less.
Further, the peel strength between the resin layer 14 surface and the support substrate 12 surface is preferably 10 N / 25 mm or more higher than the peel strength between the resin layer 14 surface and the glass substrate 16 surface, and 15 N / 25 mm or more. High is preferred.

<Method for producing glass substrate laminate>
For the production of the glass substrate laminate, a method of laminating a glass substrate on the surface of the resin layer 14 of the support (lamination method) is preferable. However, as described above, the manufacturing method of the glass substrate laminate is not limited to this lamination method. In the laminating method, the first main surface of the glass substrate and the peelable surface of the resin layer can be bonded together by a force caused by van der Waals force between adjacent solid molecules, that is, an adhesion force. It is considered possible. Therefore, in this case, the support substrate and the glass substrate can be held in a state of being laminated via the resin layer. Hereinafter, the manufacturing method of the glass substrate laminated body by the method of laminating | stacking a glass substrate on the surface of the resin layer of the said support body is demonstrated.

  The method for laminating the glass substrate on the surface of the resin layer fixed to the support substrate is not particularly limited, and can be carried out using a known method. For example, after a glass substrate is stacked on the surface of the resin layer under a normal pressure environment, a non-contact pressure bonding method using a pressure chamber, a method of pressure bonding the resin layer and the glass substrate using a roll or a press, and the like can be mentioned. . It is preferable that the resin layer and the glass substrate are more closely adhered to each other by pressure bonding with a pressure chamber, a roll, a press or the like. Further, it is preferable because air bubbles mixed between the resin layer and the glass substrate are relatively easily removed by pressurization with a gas and pressure bonding with a roll or a press. When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because the suppression of the mixing of bubbles and the securing of good adhesion are performed better. By press-bonding under vacuum, there is an advantage that even if minute bubbles remain, the bubbles do not grow by heating, and it is difficult to cause a distortion defect of the glass substrate.

  When laminating the support and the glass substrate, it is preferable that the surface of the glass substrate is sufficiently washed and laminated in an environment with a high degree of cleanliness. Even if a foreign substance is mixed between the resin layer and the glass substrate, the resin layer is deformed and thus does not affect the flatness of the surface of the glass substrate. However, the higher the cleanness, the better the flatness. Therefore, it is preferable.

<Components of display panel>
In the present invention, the constituent member 18 of the display device panel refers to a member formed on the glass substrate or a part thereof in a display device such as an LCD or an OLED using the glass substrate. For example, in display devices such as LCD and OLED, various circuit patterns such as a TFT array (hereinafter simply referred to as “array”), a protective layer, a color filter, a liquid crystal, and a transparent electrode made of ITO are provided on the surface of a glass substrate. A member or a combination of these is formed. Further, for example, in a display device made of OLED, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like formed on a glass substrate can be used. The display device panel 40 including the glass substrate and the constituent member 18 is a glass substrate on which at least a part of the above members is formed. Therefore, for example, the display device panel 40 is a glass substrate on which an array is formed or a glass substrate on which a transparent electrode is formed.

<Panel for display with support>
In the illustrated example, the support-equipped display device panel 10 includes a support substrate 12, a resin layer 14, a glass substrate 16, and a component 18 of the display device panel.
The display device panel with support 10 includes, for example, an array formation surface of the support device display panel in which the array is formed on the second main surface of the glass substrate, and a color filter is the second main surface of the glass substrate. A form in which the color filter forming surface of the display device panel with another support formed on the surface is bonded via a sealing material or the like is also included.

Further, the display device panel 40 can be obtained from the support-equipped display device panel 10. That is, the glass substrate 16 and the resin layer 14 fixed to the support substrate 12 are peeled from the display device panel 10 with the support, and the display device panel component member 18 and the glass substrate 16 are used. A panel 40 can be obtained.
Further, a display device can be obtained from such a display device panel. Examples of the display device include an LCD and an OLED. Examples of LCD include TN type, STN type, FE type, TFT type, and MIM type.

<Method for producing panel for display device with support>
Although the manufacturing method of the panel for display apparatuses with a support mentioned above is not specifically limited, It is preferable to form at least one part of the structural member of the panel for display apparatuses on the glass substrate surface of an above-described glass substrate laminated body.

The method of forming at least a part of the constituent members of the display device panel on the glass substrate surface of the glass substrate laminate is not particularly limited, and a conventionally known method is carried out according to the type of constituent members of the display device panel. Is done.
For example, taking the case of manufacturing an OLED as an example, a transparent electrode on the second main surface of the glass substrate is formed in order to form the organic EL structure on the second main surface of the glass substrate of the glass substrate laminate. Further, various layers such as vapor-injecting a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, etc. on the surface on which the transparent electrode is formed, forming a back electrode, and sealing with a sealing plate, etc. Formation and processing are performed. Specific examples of the layer formation and processing include film formation processing, vapor deposition processing, sealing plate adhesion processing, and the like. The formation of these constituent members may be part of the formation of all the constituent members necessary for the display device panel. In that case, after peeling the glass substrate which formed the one part structural member from the resin layer, the remaining structural members are formed on a glass substrate, and the panel for display apparatuses is manufactured.

<Method for Manufacturing Display Panel>
After obtaining the display panel with a support described above, the first main surface of the glass substrate and the peelable surface of the resin layer in the display panel with a support are further peeled to obtain a display panel. be able to. As described above, when the constituent members on the glass substrate at the time of peeling are part of the formation of all the constituent members necessary for the display device panel, the remaining constituent members are then formed on the glass substrate for display. Manufacture panels for equipment.

  The method of peeling the 1st main surface of a glass substrate and the peelable surface of a resin layer is not specifically limited. Specifically, for example, a sharp blade-like object is inserted into the interface between the glass substrate and the resin layer, and after peeling is given, a mixed fluid of water and compressed air is sprayed to peel off. Can do. Preferably, the support substrate of the display device panel with support is placed on the surface plate so that the support substrate is on the upper side and the panel side is on the lower side, and the panel side substrate is vacuum-adsorbed on the surface plate (the support substrate is laminated on both sides). In this state, the blade is first inserted into the glass substrate-resin layer interface. After that, the support substrate side is sucked by a plurality of vacuum suction pads, and the vacuum suction pads are raised in order from the vicinity of the place where the blade is inserted. Then, an air layer is formed at the interface between the resin layer and the panel side glass substrate, and the air layer spreads over the entire surface of the interface, and the support substrate can be easily peeled (supported on both sides of the display device panel with support). When the substrates are stacked, the above peeling process is repeated one side at a time).

  In addition, after obtaining the above-described display device panel, a display device can be manufactured using the obtained display device panel. Here, the operation for obtaining the display device is not particularly limited. For example, the display device can be manufactured by a conventionally known method.

  For example, when manufacturing a TFT-LCD as a display device, a step of forming an array on a conventionally known glass substrate, a step of forming a color filter, a glass substrate on which an array is formed, and a glass substrate on which a color filter is formed May be the same as various steps such as a step of bonding together through a sealing material or the like (array / color filter bonding step). More specifically, examples of the processing performed in these steps include pure water cleaning, drying, film formation, resist solution application, exposure, development, etching, and resist removal. Furthermore, as a process performed after implementing an array color filter bonding process, there exists a liquid-crystal injection | pouring process and the sealing process of the injection port performed after implementation of this process, The process implemented by these processes is mentioned.

  The following items were evaluated for the glass substrate laminates produced in the following examples.

[Peelability evaluation]
After preparing 10 sets of glass substrate laminates and vacuum-adsorbing the second main surface of the glass substrate to the surface plate, a thickness is formed at the interface between the glass substrate and the resin layer at one corner of the glass substrate laminate. A 0.1 mm stainless steel blade was inserted to give a trigger for peeling between the first main surface of the glass substrate and the peelable surface of the resin layer. Then, after the second main surface of the support substrate of the glass substrate laminate is adsorbed by a plurality of vacuum suction pads at a pitch of 90 mm, the first main surface of the glass substrate is raised in order from the suction pads close to the corner portion. And the peelable surface of the resin layer were peeled off. This treatment was continuously performed 10 times for 10 sets of glass substrate laminates prepared, and it was evaluated how many sets of laminates could be peeled without breaking the glass or breaking the adsorption layer.

[Heat resistance evaluation]
A sample of 50 mm square was cut out from the glass substrate laminate, and this sample was placed on a hot plate heated to 300 ° C., heated at a heating rate of 10 ° C. per minute, and the temperature at which the foaming phenomenon was confirmed in the sample. It was defined as the thermal decomposition onset temperature, and was evaluated based on the level of this temperature.

[Evaluation of adhesion strength over time]
In order to reproduce in a short time the hydrolysis phenomenon of the remaining hydrosilyl groups in the resin layer that proceeds in the long-term standing state of the glass substrate laminate, it is exposed to high temperatures and high humidity, and then exposed to high temperatures again to ensure durability. (Stability with time) was evaluated.
Specifically, a 25 × 75 mm square sample was cut out from the glass substrate laminate, and an evaluation sample was obtained by cutting out a 25 × 25 mm square only on the support substrate side of this sample. This evaluation sample was kept in a constant temperature / humidity oven maintained at 80 ° C. and 95% relative humidity for 20 hours, and then further maintained in a constant temperature oven maintained at 210 ° C. for 4 hours. Then, after cooling to room temperature, the non-adsorption surface of the support substrate of the evaluation sample is fixed to the end of the table with double-sided tape, and the center part of the protruding thin glass substrate (25 × 25 mm) is attached to the digital force gauge. Used to push vertically and measure the peel mode and peel strength.
On the other hand, an evaluation sample was prepared separately, and the peeling mode and the peeling strength were measured without performing the above test, and recorded as initial values.

(Synthesis Example 1) Synthesis of organohydrogensiloxane A A mixture of 5.4 g of 1,1,3,3-tetramethyldisiloxane, 96.2 g of tetramethylcyclotetrasiloxane, and 118.6 g of octamethylcyclotetrasiloxane was obtained at 5 ° C. Then, 11.0 g of concentrated sulfuric acid was slowly added with stirring, and 3.3 g of water was further added dropwise over 1 hour. After stirring for 8 hours while maintaining the temperature at 10 to 20 ° C., toluene was added, and water washing and waste acid separation were performed until the siloxane layer became neutral. The neutralized siloxane layer was heated and concentrated under reduced pressure to remove low-boiling fractions such as toluene, and organohydrogensiloxane A with k = 40 and l = 40 in the following formula (6) was obtained.

(Synthesis Example 2) Synthesis of Organohydrogensiloxane B Other than using 5.4 g of 1,1,3,3-tetramethyldisiloxane, 19.2 g of tetramethylcyclotetrasiloxane, and 296.6 g of octamethylcyclotetrasiloxane as raw materials In the same manner as in Synthesis Example 1, an organohydrogensiloxane B with k = 100 and l = 8 in the above formula (6) was obtained.

(Comparative Synthesis Example 1) Synthesis of Organohydrogensiloxane C The same method as in Synthesis Example 1 except that 6.5 g of hexamethyldisiloxane and 192.4 g of tetramethylcyclotetrasiloxane are used as raw materials. , A = 0, b = 80 organohydrogensiloxane C was obtained.

Synthesis Example 3 Synthesis of Alkenyl Group-Containing Siloxane D 3.7 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5 , 7-Tetravinylcyclotetrasiloxane 41.4g, octamethylcyclotetrasiloxane 355.9g, potassium hydroxide siliconate was added in an amount of Si / K = 20000/1 (mol ratio), and nitrogen atmosphere was maintained at 150 ° C for 6 hours. After the equilibration reaction, 2 mol of ethylene chlorohydrin was added to K and neutralized at 120 ° C. for 2 hours. Then, the volatile content was cut by heating and bubbling at 160 ° C. and 666 Pa for 6 hours to obtain an alkenyl group-containing siloxane D having an alkenyl equivalent number La per 0.9 g of La = 0.9 and Mw: 26,000.

(Synthesis Example 4) Synthesis of alkenyl group-containing siloxane E Synthesis was performed except that 1.9 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 889.8 g of octamethylcyclotetrasiloxane were used as raw materials. In the same manner as in Example 3, an alkenyl group-containing siloxane E having an alkenyl equivalent number La per 100 g of La = 0.002 and Mw: 91,000 was obtained.

Example 1
First, a polyimide resin sheet (Upilex AD sheet AD110 manufactured by Ube Industries Co., Ltd.) having a length of 280 mm, a width of 280 mm, a thickness of 0.5 mm, and a linear expansion coefficient of 480 × 10 ⁻⁷ / ° C., 5% weight loss temperature of 560 ° C. Prepared and cleaned the surface by pure water cleaning and UV cleaning.
Next, after the surface is activated by the remote plasma method, the organohydrogensiloxane A and the alkenyl group-containing siloxane D are mixed in a molar ratio of all alkenyl groups to hydrogen atoms bonded to all silicon atoms (hydrogen atoms / alkenyls). Group) is mixed so that 0.9 part of the siloxane mixture is mixed with 1 part by mass of a silicon compound having an acetylenically unsaturated group represented by the following formula (8), and the platinum metal concentration is 100 ppm. A platinum-based catalyst was added so that a curable silicone resin composition was obtained. This composition was applied on the first main surface of the support substrate by screen printing in a size of 278 mm in length and 278 mm in width (coating amount: 15 g / m ² ). Further, it was cured by heating at 210 ° C. for 60 minutes in the air to form a cured silicone resin layer having a thickness of 15 μm, whereby Support A was obtained. The surface tension of the silicone resin layer of the support A was 20.5 N / m.
HC≡C—C (CH ₃ ) ₂ —O—Si (CH ₃ ) ₃ (8)

A peelable surface of the cured silicone resin layer of the support A and a glass substrate (“AN100”) having the same size as the cured silicone resin layer and a thickness of 0.4 mm (an alkali-free glass plate having a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. : Asahi Glass Co., Ltd.) and the first main surface of the two substrates are superposed at room temperature using a vacuum superposition apparatus so that the centers of gravity of both substrates overlap, and then left in a pressure chamber for 0.49 MPa × 5 minutes. Then, a glass substrate laminate A (a glass substrate laminate of the present invention) was obtained.

The glass substrate laminate A was subjected to the above-described removability evaluation, heat resistance evaluation, and stability evaluation of adhesion strength over time. The peel strength between the glass substrate and the cured silicone resin layer indicates that the peel strength between the glass substrate and the cured silicone resin layer is between the support substrate and the cured silicone resin layer. It was confirmed that it was lower than the peel strength.
Removability: 10/10 (all 10 groups can be peeled)
Heat resistance (thermal decomposition start temperature): 430 ° C
Stability over time of adhesion strength: initial value = 2.9 N / 25 mm, after acceleration = 3.2 N / 25 mm

(Example 2)
First, a glass plate (“AN100” manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is prepared as a support substrate. To clean the surface.
Next, the organohydrogensiloxane B and the alkenyl group-containing siloxane D are mixed so that the molar ratio (hydrogen atom / alkenyl group) of all alkenyl groups to hydrogen atoms bonded to all silicon atoms is 0.9, Further, the siloxane mixture and n-heptane were mixed at a 1/1 weight ratio to obtain a solution of the siloxane mixture. 1 part by mass of a silicon compound having an acetylenically unsaturated group represented by the above formula (8) is mixed with 100 parts by mass of the siloxane mixture in the solution, and a platinum-based catalyst is added so that the platinum metal concentration becomes 100 ppm. Thus, an addition reaction type curable silicone resin composition solution was obtained.
This solution was applied on the first main surface of the support substrate in a size of 718 mm length and 598 mm width by a die coater (coating amount 20 g / m ² ). Next, the support B having a cured silicone resin layer having a thickness of 15 μm was obtained by heat curing in the air at 210 ° C. for 60 minutes. The surface tension of the cured silicone resin layer of the support B was 20.5 N / m.

Next, a first main surface (later cured silicone resin layer and later) of a glass substrate (“AN100” manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. The surface on the side to be contacted) was cleaned with pure water and UV.
Then, the peelable surface of the silicone resin layer on the first main surface of the support substrate and the first main surface of the glass substrate are overlapped at room temperature so that the centers of gravity of both substrates overlap with each other at a room temperature. And it left still in a pressurization chamber for 0.49 Mpa * 5 minutes, and obtained the glass substrate laminated body B (glass substrate laminated body of this invention).
In such a glass substrate laminate B according to Example 2, the glass substrate and the support substrate were in close contact with the cured silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

The glass substrate laminate B was also subjected to the above removability evaluation, heat resistance evaluation, and adhesion strength evaluation over time. The peel strength between the glass substrate and the cured silicone resin layer indicates that the peel strength between the glass substrate and the cured silicone resin layer is between the support substrate and the cured silicone resin layer. It was confirmed that it was lower than the peel strength.
Removability: 10/10 (all 10 groups can be peeled)
Heat resistance (pyrolysis start temperature): 440 ° C
Stability of adhesion strength with time: initial value = 3.9 N / 25 mm, after acceleration = 4.0 N / 25 mm

(Example 3)
First, a glass plate (“AN100” manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is prepared as a support substrate. To clean the surface.
Next, as a resin for forming a resin layer, a mixture of 95% by mass / 5% by mass of organohydrogensiloxane A, alkenyl group-containing siloxane D and alkenyl group-containing siloxane E was bonded to all alkenyl groups and all silicon atoms. A silicon compound 1 having an acetylenically unsaturated group represented by the above formula (8) is mixed with 100 parts by mass of the siloxane mixture in such a manner that the molar ratio (hydrogen atom / alkenyl group) with a hydrogen atom is 0.9. Mass parts were mixed, a platinum-based catalyst was added so that the platinum metal concentration was 100 ppm, and an addition reaction type curable silicone resin composition containing no solvent was obtained.
And this composition was coated on the 1st main surface of the support substrate by the screen printing apparatus with the magnitude | size of 718 mm long and 598 mm wide (coating amount 20g / m < ² >). Next, the support C having a cured silicone resin layer having a thickness of 20 μm was obtained by heat curing at 180 ° C. for 60 minutes in the air. The surface tension of the cured silicone resin layer of the support C was 20.0 N / m.

Next, a glass substrate (“AN100” manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is used as the glass substrate. The peelable surface of the cured silicone resin layer on the main surface and the first main surface of the glass substrate were bonded together at room temperature by a vacuum press so that the centers of gravity of both the substrates overlap, and the glass substrate laminate C (of the present invention) A glass substrate laminate) was obtained.
In such a glass substrate laminate C according to Example 3, the glass substrate and the support substrate were in close contact with the cured silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

The glass substrate laminate C was also subjected to the above removability evaluation, heat resistance evaluation, and stability evaluation of adhesion strength over time. The peel strength between the glass substrate and the cured silicone resin layer indicates that the peel strength between the glass substrate and the cured silicone resin layer is between the support substrate and the cured silicone resin layer. It was confirmed that it was lower than the peel strength.
Removability: 10/10 (all 10 groups can be peeled)
Heat resistance (pyrolysis start temperature): 440 ° C
Stability over time of adhesion strength: initial value = 3.6 N / 25 mm, after acceleration = 3.6 N / 25 mm

Example 4
In this example, an LCD is manufactured using the glass substrate laminate C obtained in Example 3.
Two glass substrate laminates C are prepared, and one is subjected to an array forming process to form an array on the second main surface of the glass substrate. The remaining one sheet is subjected to a color filter forming step to form a color filter on the second main surface of the glass substrate.
The support C substrate (display device-equipped panel with support of the present invention) in which the array is formed and the laminate C2 (display device-equipped panel with support of the present invention) in which the color filter is formed are respectively supported on the outside. Thus, an LCD empty cell having a laminate on both sides is obtained.

  Subsequently, the second main surface of the laminate C1 is vacuum-sucked on a surface plate, and a stainless steel knife having a thickness of 0.1 mm is inserted into the interface between the glass substrate and the resin layer at the corner of the laminate C2, and the glass substrate This provides a trigger for peeling between the first main surface and the peelable surface of the resin layer. And after adsorbing the 2nd main surface of the support substrate of layered product C2 with 24 vacuum suction pads, it raises in order from the suction pad near the corner part of layered product C2. As a result, it is possible to peel off the support substrate to which the resin layer is fixed, leaving only the empty cells of the LCD with the support substrate of the laminate C1 on the surface plate.

  Next, the second main surface of the glass substrate on which the color filter is formed on the first main surface is vacuum-adsorbed on the surface plate, and a thickness of 0. 0 is formed at the interface between the glass substrate and the resin layer at the corner portion of the laminate C1. A 1 mm stainless steel blade is inserted to give a trigger for peeling between the first main surface of the glass substrate and the peelable surface of the resin layer. And after adsorbing the 2nd main surface of the support substrate of layered product C1 with 24 vacuum suction pads, it raises in order from the suction pad near the corner part of layered product C1. As a result, only the LCD cell is left on the surface plate, and the support substrate to which the resin layer is fixed can be peeled off. In this way, an empty cell of the LCD composed of a glass substrate having a thickness of 0.1 mm is obtained.

  Subsequently, the empty cell of the LCD is cut and divided into 168 empty cells of 51 mm long × 38 mm wide, and then a liquid crystal injection step and an injection port sealing step are performed to complete the LCD cell. A step of attaching a polarizing plate to the completed LCD cell is performed, and then a module forming step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 5)
In this example, an LCD is manufactured using the glass substrate laminate B obtained in Example 2.
Two glass substrate laminates C are prepared, and one is subjected to an array forming process to form an array on the second main surface of the glass substrate. The remaining one sheet is subjected to a color filter forming step to form a color filter on the second main surface of the glass substrate.
The support B is the outer side of the laminate B1 (display panel with support according to the present invention) in which the array is formed and the laminate B2 (display panel with support according to the present invention) in which the color filter is formed. Thus, an LCD cell having a laminate on both sides is obtained. Thereafter, the first main surface of each glass substrate and the peelable surface of the resin layer are peeled in the same procedure as in Example 4.
In this way, an empty cell of LCD composed of a glass substrate having a thickness of 0.3 mm is obtained.
Subsequently, the thickness of each glass substrate is set to 0.15 mm by chemical etching. Etch pits that cause optical problems are not observed on the surface of the glass substrate after the chemical etching process.
Thereafter, the empty cells of the LCD are cut and divided into 168 empty cells of 51 mm long × 38 mm wide, and then a liquid crystal injection step and an injection port sealing step are performed to form the LCD cells. A step of attaching a polarizing plate to the formed LCD cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 6)
In this example, an OLED is manufactured using the glass substrate laminate C obtained in Example 3.
The layered product C3 (present invention) was subjected to a step of forming a transparent electrode, a step of forming an auxiliary electrode, a step of depositing a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like, and a step of sealing them. The organic EL structure is formed on the thin glass substrate of the display panel with support.
Subsequently, after the sealing body side is vacuum-adsorbed on the surface plate, a stainless steel blade with a thickness of 0.1 mm is inserted into the interface between the glass substrate and the resin layer at the corner of the laminate C3, 1 It gives the trigger of peeling with the main surface and the peelable surface of a resin layer. And after adsorbing the 2nd main surface of the support substrate of a laminated body with 24 vacuum suction pads, it raises in an order from the suction pad near the corner part of laminated body C3. As a result, only the glass substrate on which the organic EL structure is formed on the surface plate is left, and the support substrate to which the resin layer is fixed can be peeled off.
Subsequently, the glass substrate is cut using a laser cutter or a scribe-break method, and divided into 288 cells of 41 mm length × 30 mm width, and then the glass substrate on which the organic EL structure is formed and the counter substrate are assembled. Then, the module forming process is performed to create the OLED. The OLED obtained in this way does not have a problem in characteristics.

(Comparative Example 1)
Organohydrogensiloxane C and alkenyl group-containing siloxane D are mixed so that the molar ratio (hydrogen atom / alkenyl group) of all alkenyl groups to hydrogen atoms bonded to all silicon atoms is 0.9. The mixture and n-heptane were mixed at a 1/1 weight ratio to obtain a solution of a siloxane mixture. 1 part by mass of a silicon compound having an acetylenically unsaturated group represented by the above formula (8) is mixed with 100 parts by mass of the siloxane mixture in the solution, and a platinum-based catalyst is added so that the platinum metal concentration becomes 100 ppm. Thus, an addition reaction type curable silicone resin composition solution was obtained. A laminate D was produced in the same procedure as in Example 3 except that this solution was used.

Using the obtained laminate D, the re-peelability evaluation, the heat resistance evaluation, and the temporal stability evaluation of the adhesion strength were performed.
Removability: 10/10 (all 10 groups can be peeled)
Heat resistance (thermal decomposition start temperature): 390 ° C
Stability over time of adhesion strength: initial value = 3.4 N / 25 mm, after acceleration = 8.8 N / 25 mm (destruction was observed in some resin layers)

DESCRIPTION OF SYMBOLS 10 Display device panel with support body 12 Support substrate 14 Resin layer 16 Glass substrate 18 Component member of display device panel 20 Support body 30 Glass substrate laminated body 40 Display device panel

Claims (15)

A support for laminating a glass substrate on the surface of the cured silicone resin layer, comprising a support substrate and a cured silicone resin layer having a peelable surface provided on one side of the support substrate;
The cured silicone resin is a cured product of a curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b),
The support is characterized in that the cured silicone resin layer is a cured silicone resin layer formed by curing the curable silicone resin composition on the surface of the support substrate.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.   The support according to claim 1, wherein the molar ratio of hydrogen atoms bonded to all silicon atoms to all alkenyl groups in the curable silicone resin composition (hydrogen atom / alkenyl group) is 0.7 to 1.05.   The support according to claim 1 or 2, wherein the material of the support substrate is made of a material having a 5% heating weight loss temperature of 300 ° C or higher.   The support body in any one of Claims 1-3 whose support substrate is a glass plate, a silicon wafer, a synthetic resin board, or a metal plate. In a method for producing a support for laminating a glass substrate on the surface of the cured silicone resin layer, comprising a support substrate and a cured silicone resin layer having a peelable surface provided on one side of the support substrate,
A curable silicone resin composition containing the following linear organopolysiloxane (a) and linear organopolysiloxane (b) is applied to one side of a support substrate to form a layer of the curable silicone resin composition, and then the cured A method for producing a support, comprising: curing a curable silicone resin composition to form the cured silicone resin layer.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.   A method for producing a glass substrate laminate, comprising laminating a glass substrate on the surface of the cured silicone resin layer of the support according to claim 1.   The manufacturing method of Claim 6 whose thickness of a glass substrate is 0.05-0.4 mm. A glass substrate laminate having a supporting substrate, a glass substrate and a cured silicone resin layer present between them,
The cured silicone resin layer comprises a cured product of a curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b), and the glass substrate, the cured silicone resin layer, A glass substrate laminate, wherein the peel strength between the layers is lower than the peel strength between the support substrate and the cured silicone resin layer.
Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.
Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.   The cured silicone resin layer cures the curable silicone resin composition in contact with the support substrate surface and not in contact with the glass substrate surface, and is cured on the glass substrate surface after the curable silicone resin composition is cured. The glass substrate laminate according to claim 8, which is a layer formed by contact.   The glass according to claim 8 or 9, wherein a molar ratio of hydrogen atoms bonded to all silicon atoms to all alkenyl groups in the curable silicone resin composition (hydrogen atom / alkenyl group) is 0.7 to 1.05. Board laminate.   The glass substrate laminate according to any one of claims 8 to 10, wherein the material of the support substrate is a material having a 5% heating weight loss temperature of 300 ° C or higher.   The glass substrate laminate according to any one of claims 8 to 11, wherein the support substrate is a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate.   The glass substrate laminate according to any one of claims 8 to 12, wherein the glass substrate has a thickness of 0.05 to 0.4 mm.   A display with a support for manufacturing a panel for a display device, wherein at least a part of the constituent members of the panel for a display device is formed on the glass substrate surface of the glass substrate laminate according to any one of claims 8 to 13. Panel for equipment.   On the glass substrate surface of the glass substrate laminated body in any one of Claims 8-13, at least one part of the structural member of the panel for display apparatuses is formed, and a glass substrate and a support substrate with a cured silicone resin layer are made after that. A method for manufacturing a panel for a display device having a glass substrate, wherein the glass substrate is separated.