JP2014192797A - Vibration piece, vibration element, vibrator, electronic apparatus, and mobile device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration element which achieves cost reduction by simplifying separation of the vibration element coupled on a single crystal silicon substrate into segmented pieces and stabilizes characteristics.SOLUTION: A vibration piece includes, on a single crystal silicon substrate 85 with surface orientation (1,0,0) as a main surface: a gyroscope element 2 as a vibration element including a vibrator 3; holding parts 78, 79; and outer frames 80, 81 as a frame part. The gyroscope element 2 is coupled to the outer frames 80, 81 via the holding parts 78, 79, and cutting planes of the holding parts 78, 79 are planes with a plane orientation (0,1,1) or planes vertical to the plane orientation (0,1,1).

Description

  The present invention relates to a resonator element, a resonator element, a vibrator using the resonator element, an electronic device, and a moving body.

  As a vibration element, a vibration element formed by laminating a metal, a dielectric, a semiconductor, or the like on a flat substrate surface such as a silicon substrate and patterning an outer shape, an electrode, or the like is known. For example, Patent Document 1 discloses an angular velocity sensor element (vibration element) in which a buffer layer, a lower electrode layer, a piezoelectric layer, an upper electrode layer, and the like are provided on a tuning fork-shaped substrate as an example of a vibration element. . In this angular velocity sensor element, a plurality of connected angular velocity sensor elements are formed on a single substrate using a photolithography method or the like. For the separation of the plurality of angular velocity sensor elements, the surface of the substrate having the plurality of connected angular velocity sensor elements is bonded to the dummy substrate via an adhesive layer, and then the angular velocity sensor element A method for removing a connecting portion by grinding a back surface of a substrate having a substrate is disclosed.

JP 2003-218420 A

  However, in the angular velocity sensor element (vibration element) of Patent Document 1 described above, when the angular velocity sensor elements connected on a single substrate are separated, the substrate on which the angular velocity sensor elements are formed is attached to a dummy substrate. After the alignment, the back surface of the substrate is ground to remove the connecting portion. As described above, since the angular velocity sensor elements are separated into pieces through a number of processes, the number of steps for the separation is increased, which contributes to the cost increase of the angular velocity sensor elements. In addition, an adhesive is used for bonding the substrates, and it is necessary to remove this adhesive after singulation. However, the adhesive remains without being removed, and the characteristics of the angular velocity sensor element are reduced. It also had the problem of affecting it.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] A resonator element according to this application example includes a vibrating element including a vibrating body, which is formed by processing a single crystal silicon substrate having a plane direction (1, 0, 0) as a main surface; And a frame portion,
The vibration element is connected to the frame portion through the breaker portion,
The split section of the break-off portion is a plane having a plane orientation (0, 1, 1) or a plane having a plane direction (0, 1, 1).

  Single crystal silicon has different cleaving properties, in other words, crackability, depending on the crystal orientation. In the resonator element of this application example, the plane of the plane orientation (0, 1, 1) in which the single crystal silicon is easily cleaved or the plane in the vertical direction of the plane orientation (0, 1, 1) is a split section. The main surface is formed as a surface having a plane orientation (1, 0, 0). For this reason, the vibration element separated into pieces by folding the breaker part from the vibration piece (frame part) formed on the single crystal silicon substrate reduces the remaining unfolded part of the breaker part, It is possible to prevent problems related to folding, such as a decrease in the progression to the vibration element. As a result, the defective rate of dividing (breaking) the vibration elements decreases, in other words, the non-defective product ratio increases, which can contribute to the cost reduction of the vibration elements.

  Application Example 2 In the resonator element according to the application example described above, the folding portions are arranged in a direction <1, 1, 0> or in a direction perpendicular to the direction <1, 1, 0>. And

  According to this application example, by setting the arrangement of the folding portions to the direction <1, 1, 0> or the direction perpendicular to the direction <1, 1, 0>, the plane orientation in which the single crystal silicon is easily cleaved ( The plane of 0,1,1) or the plane in the vertical direction of the plane orientation (0,1,1) can be a split section.

[Application Example 3] The resonator element according to the above application example includes a vibrating element including a vibrating body formed by processing a single crystal silicon substrate having a plane orientation (0, 0, 1) as a main surface, a folding element. A handle and a frame,
The vibration element is connected to the frame portion through the breaker portion,
The fractured section of the break-off portion is a plane having a plane orientation (1, 1, 0) or a plane having a plane direction (1, 1, 0).

  In the resonator element of this application example, the plane of the plane orientation (1, 1, 0) where the single crystal silicon is easy to cleave, or the plane in the vertical direction of the plane orientation (1, 1, 0) is a split section. The main surface is formed as a plane having a plane orientation (0, 0, 1). For this reason, the vibration element separated into pieces by folding the breaker part from the vibration piece (frame part) formed on the single crystal silicon substrate reduces the remaining unfolded part of the breaker part, It is possible to prevent problems related to folding, such as a decrease in the progression to the vibration element. As a result, the defective rate of dividing (breaking) the vibration elements decreases, in other words, the non-defective product ratio increases, which can contribute to the cost reduction of the vibration elements.

  Application Example 4 In the resonator element according to the application example described above, the breaking portions are arranged in a direction <0, 1, 1> or a direction perpendicular to the direction <0, 1, 1>. And

  According to this application example, by setting the arrangement of the folding portions to the direction <0, 1, 1> or the direction perpendicular to the direction <0, 1, 1>, the plane orientation ( The plane of (1, 1, 0) or the plane in the vertical direction of the plane orientation (1, 1, 0) can be a split section.

  [Application Example 5] In the resonator element according to the application example described above, a vibration element including a vibrating body formed by processing a single crystal silicon substrate having a plane orientation (0, 1, 0) as a main surface; And the vibration element is connected to the frame part via the breaker part, and the fractured section of the breaker part is a plane having a plane orientation (1, 0, 1). Or a surface in the vertical direction of the plane orientation (1, 0, 1).

  According to this application example, the surface of the resonator element having a plane orientation (1, 0, 1) in which the single crystal silicon is easily cleaved or a plane in the vertical direction of the plane orientation (1, 0, 1) is a split section. As described above, the main surface is formed as a plane having a plane orientation (0, 1, 0). For this reason, the vibration element separated into pieces by folding the breaker part from the vibration piece (frame part) formed on the single crystal silicon substrate reduces the remaining unfolded part of the breaker part, It is possible to prevent problems related to folding, such as a decrease in the progression to the vibration element. As a result, the defective rate of dividing (breaking) the vibration elements decreases, in other words, the non-defective product ratio increases, which can contribute to the cost reduction of the vibration elements.

  Application Example 6 In the resonator element according to the application example described above, the folding portions are arranged in a direction <1, 0, 1> or a direction perpendicular to the direction <1, 0, 1>. And

  According to this application example, by setting the arrangement of the broken portions to the direction <1, 0, 1> or the direction perpendicular to the direction <1, 0, 1>, the plane orientation ( The plane of (1, 0, 1) or the plane in the vertical direction of the plane orientation (1, 0, 1) can be a split section.

  Application Example 7 In the resonator element according to the application example described above, the breaker portion includes a wide portion having a wide width in a direction intersecting a direction from the vibrating body toward the frame portion, and the width in plan view. And a narrow portion smaller than the wide portion.

  According to this application example, when the vibration element is folded, the stress applied to the folded portion is concentrated on the narrow portion, so that the folding at the narrow portion can be selectively performed. Further, it is possible to fold off with a slight force, and in addition, it is possible to reduce the unfolded portion.

  Application Example 8 In the resonator element according to the application example described above, the width of the breaker portion in the plan view is continuously changed.

  According to this application example, it is possible to selectively perform folding at the narrow portion, and it is possible to improve the strength of the portion other than the narrow portion at the folded portion. As a result, it is possible to prevent the vibration element from being broken at a portion other than the narrow portion.

  Application Example 9 In the resonator element according to the application example described above, the breaker portion is provided with a groove portion extending from an end in a direction intersecting a direction from the vibrating body toward the frame portion to the other end. It is characterized by.

  According to this application example, the stress applied to the breaker when the vibrating element is folded from the resonator element is concentrated on the groove, so that the groove can be selectively folded. Further, it is possible to fold off with a slight force, and in addition, it is possible to reduce the unfolded portion.

  Application Example 10 A vibration element according to this application example is characterized in that it is broken from the resonator element according to any one of the application examples.

  According to this application example, since it is cut off from the low-cost vibrating piece by reducing the variation of the broken-off portion and reducing the unfolded portion, a low-cost vibrating element can be realized. In addition, since the folding is stable, the vibration characteristics as the vibration element can be stabilized.

  Application Example 11 A vibrator according to this application example includes the vibration element that is broken off from the resonator element according to any one of the application examples, and a package in which the vibration element is stored. It is characterized by that.

  According to this application example, since a vibration element that is broken from a low-cost vibrating piece by reducing the variation in the broken portion and reducing the unfolded portion is used, a low-cost vibrator is realized. be able to. In addition, since the folding is stable, the vibration characteristics as the vibrator can be stabilized.

  Application Example 12 An electronic apparatus according to this application example includes a vibration element that is folded from the resonator element according to any one of the application examples.

  According to this application example, the use of a vibration element that is broken from a low-cost vibrating piece by reducing the variation in the broken-off part and reducing the unfolded part contributes to lowering the cost of electronic equipment. It becomes possible to do. In addition, since the folding is performed reliably, the vibration characteristics of the vibration element are stable, and the characteristics can be stabilized even in an electronic device using the vibration element.

  Application Example 13 A moving body according to this application example includes a vibration element that is broken from the resonator element according to any one of the application examples described above.

  According to this application example, the vibration element that is broken from the low-cost vibration piece by reducing the variation of the broken portion and reducing the unfolded portion contributes to the cost reduction of the moving body. It becomes possible to do. In addition, since the folding is performed reliably, the vibration characteristics of the vibration element are stable, and it is possible to stabilize the characteristics even in a moving body using the vibration element.

1A and 1B are a schematic diagram illustrating a first embodiment of a resonator element according to the invention and a vibrator using the resonator element, wherein FIG. The top view which shows the gyro element as a vibration piece and vibration element of 1st Embodiment. The resonator element of the first embodiment and the gyro element as the vibration element are shown, wherein (a) is a cross-sectional view taken along line AA in FIG. 2, and (b) is a cross-sectional view taken along line BB in FIG. 3A and 3B are diagrams for explaining the operation of the gyro element shown in FIG. 2, in which FIG. 3A is a plan view for explaining driving, and FIG. The top view and front view explaining arrangement | positioning of the gyro element on a silicon substrate. It is a figure explaining connection with a gyro element and a frame part (outer frame), (a)-(c) is a top view showing form 1-form 3, and (d) is a plane enlarged view of a connection part. The top view explaining the unfolded remainder of a folding part. (A)-(i) is a top view explaining the modification of a folding part. The top view which shows the outline of 2nd Embodiment (gyro element) of the vibration piece and vibration element concerning this invention. The top view for demonstrating the drive of the gyro element shown in FIG. The top view which shows the outline of the gyro element as a vibration piece and vibration element of 3rd Embodiment concerning this invention. The top view for demonstrating the drive of the gyro element shown in FIG. The perspective view which shows the structure of the mobile type personal computer as an example of an electronic device. The perspective view which shows the structure of the mobile telephone as an example of an electronic device. The perspective view which shows the structure of the digital still camera as an example of an electronic device. The perspective view which shows the structure of the motor vehicle as an example of a mobile body.

Hereinafter, a resonator element and a resonator element according to the present invention, a vibrator using the resonator element, an electronic device, and a moving body will be described in detail with reference to the accompanying drawings.
<First Embodiment>
(Vibrator)
First, a resonator including the resonator element and the gyro element as the resonator element according to the first embodiment of the invention will be described.

  FIG. 1 shows a schematic configuration of a vibrator (gyro sensor) using a vibrating piece and a gyro element as a vibrating element according to the first embodiment of the present invention, (a) is a plan view, and (b) is a front cross section. FIG. FIG. 2 is a plan view of the gyro element shown in FIG. 3A and 3B schematically show a cross section of the gyro element, wherein FIG. 3A is a cross-sectional view taken along line AA in FIG. 2, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 4A and 4B are schematic diagrams for explaining the operation of the gyro element. FIG. 4A is a plan view for explaining the driving of the gyro element shown in FIG. 2, and FIG. 4B is a detection of the gyro element shown in FIG. It is a top view for demonstrating. FIG. 5 is a plan view and a front view for explaining the arrangement of the gyro element on the single crystal silicon substrate. 6A and 6B are diagrams for explaining the connection between the gyro element and the frame portion (outer frame). FIGS. 6A to 6C are plan views showing the first to third embodiments, and FIG. It is an enlarged view. FIG. 7 is a plan view for explaining the unfolded portion at the break-off portion of the gyro element. FIGS. 8A to 8I are plan views for explaining modifications of the breaker.

  1 to 4 and 6, for convenience of explanation, the x axis, the y axis, and the z axis are illustrated as three axes orthogonal to each other, and the tip side of the illustrated arrow is “+ side”. The base end side is defined as “− side”. In the following, a direction parallel to the x-axis is referred to as “x-axis direction”, a direction parallel to the y-axis is referred to as “y-axis direction”, and a direction parallel to the z-axis is referred to as “z-axis direction”. The + z side (the upper side in FIG. 1 (b) and FIG. 3) is referred to as “upper”, and the −z side (the lower side in FIG. 1 (b) and FIG. 3) is referred to as “lower”.

  A vibrator 1 shown in FIG. 1 is a gyro sensor that detects an angular velocity as an example of the vibrator 1. The vibrator 1 includes a gyro element (vibration element) 2 as a vibration element that is broken from the vibration piece into individual pieces, and a package 9 that houses the gyro element 2.

[Gyro element]
The gyro element 2 is an “out-of-plane detection type” gyro element that detects an angular velocity around the z-axis with respect to the main surface (xy plane) of the gyro element 2. As shown in FIG. 2, the gyro element 2 includes a vibrating body 3 having a plurality of vibrating arms, a plurality of piezoelectric elements 41 to 44, 51 to 58 provided on the surface of the vibrating body 3, and a plurality of mass adjustments. Parts 61 to 66 and a plurality of terminals 71 to 76.

Hereinafter, each part which comprises the gyro element 2 is demonstrated in detail sequentially.
The gyro element 2 includes a base 31, a support part 32 that supports the base 31, two detection vibrating arms (second vibrating arms) 33 and 34 that extend from the base 31, and four driving vibrating arms (first 1 vibrating arm) 35-38. Of these, the base 31, the two detection vibrating arms (second vibrating arms) 33 and 34 extending from the base 31, and the four driving vibrating arms (first vibrating arms) 35 to 38 are used as a vibrating body. 3 is called. The vibrating body 3 has a structure called a so-called double T type.

  The base 31 includes a main body 311 and a pair of connecting arms 312 and 313 extending from the main body 311 to opposite sides along the x-axis direction. The support portion 32 includes a pair of fixing portions 321 and 322 that are fixed to the package 9, a pair of beam portions 323 and 324 that connect the fixing portion 321 and the main body portion 311 of the base portion 31, and a fixing portion 322. And a pair of beam portions 325 and 326 that connect the main body portion 311 of the base portion 31.

  In the fixing parts 321 and 322, in the manufacturing process of the gyro element 2, which will be described later, the folding parts 78 and 79 which are cleavage surfaces that are broken when the single crystal silicon substrate 85 (see FIG. 5) is separated. The remaining unfolded portions 78a and 79a (see FIGS. 5 and 6A) remain. In this embodiment, there are three unfolded portions 78a arranged along the x-axis on the outer side of the fixed part 321 and 2 arranged along the y-axis on the side of the fixed part 322 in the x-axis direction. There are two unfolded portions 79a.

  The detection vibrating arms 33 and 34 extend from the main body 311 of the base 31 to opposite sides along the y-axis direction. The drive vibrating arms 35 and 36 extend from the distal end portion of the connecting arm 312 of the base portion 31 to opposite sides along the y-axis direction. The driving vibrating arms 37 and 38 extend in the opposite directions along the y-axis direction from the distal end portion of the connecting arm 313 of the base portion 31.

  In the present embodiment, a weight portion (hammer head) 331 having a width larger than that of the proximal end portion is provided at the distal end portion of the detection vibrating arm 33. Similarly, a weight 341 is provided at the tip of the detection vibrating arm 34, a weight 351 is provided at the tip of the driving vibrating arm 35, and a tip of the driving vibrating arm 36 is provided at the tip of the driving vibrating arm 36. A weight portion 361 is provided, a weight portion 371 is provided at the tip of the driving vibration arm 37, and a weight portion 381 is provided at the tip of the driving vibration arm 38. By providing such a weight portion, the detection sensitivity of the gyro element 2 can be improved.

  The constituent material of the gyro element 2 is not particularly limited as long as it can exhibit desired vibration characteristics, and various piezoelectric materials and various non-piezoelectric materials can be used.

  For example, examples of the piezoelectric material constituting the gyro element 2 include crystal, lithium tantalate, lithium niobate, lithium borate, and barium titanate. In particular, the piezoelectric material constituting the gyro element 2 is preferably quartz (X-cut plate, AT-cut plate, Z-cut plate, etc.). When the gyro element 2 is made of quartz, the gyro element 2 can have excellent vibration characteristics (particularly frequency temperature characteristics). Further, the gyro element 2 can be formed with high dimensional accuracy by etching.

  In addition, examples of the non-piezoelectric material constituting the gyro element 2 include silicon and quartz. In particular, silicon is preferable as the non-piezoelectric material constituting the gyro element 2. If the gyro element 2 is made of silicon, the gyro element 2 having excellent vibration characteristics can be realized at a relatively low cost. Further, the gyro element 2 can be formed with high dimensional accuracy by etching using a known fine processing technique.

[Piezoelectric element]
Next, the piezoelectric elements 41 to 44 and 51 to 58 will be described.
The piezoelectric elements 41 and 42 are respectively provided on the detection vibrating arms 33 of the vibrating body 3 described above. The piezoelectric elements 43 and 44 are provided on the detection vibrating arm 34 of the vibrating body 3, respectively.

  The pair of piezoelectric elements 41 and 42 detect bending vibration (so-called in-plane vibration) in the x-axis direction of the detection vibrating arm 33. Similarly, the pair of piezoelectric elements 43 and 44 detect bending vibrations in the x-axis direction of the detection vibrating arm 34. More specifically, the pair of piezoelectric elements 41 and 42 is provided with the piezoelectric element 41 on one side (right side in FIG. 2) in the width direction (x-axis direction) of the detection vibrating arm 33. A piezoelectric element 42 is provided on the other side (left side in FIG. 2). Similarly, in the pair of piezoelectric elements 43 and 44, the piezoelectric element 43 is provided on one side (right side in FIG. 2) in the width direction (x-axis direction) of the vibrating arm 34 for detection, and the other side (FIG. A piezoelectric element 44 is provided on the left side in FIG.

  The piezoelectric elements 41 to 44 are configured to output charges by expanding and contracting in the y-axis direction. Each of the piezoelectric elements 41 and 42 outputs an electric charge with the vibration of the detection vibrating arm 33 (bending vibration in the x-axis direction). Similarly, each of the piezoelectric elements 43 and 44 outputs an electric charge with the vibration of the detection vibrating arm 34 (bending vibration in the x-axis direction).

  By using such piezoelectric elements 41 to 44, even if the vibrating arms 33 and 34 for detection themselves do not have piezoelectricity, or the vibrating arms 33 and 34 for detection themselves have piezoelectricity, Even when the direction of the polarization axis or the crystal axis is not suitable for the detection of bending vibration in the x-axis direction, the bending of the detection vibrating arms 33 and 34 in the x-axis direction is relatively simple and efficient. Vibration can be detected. In addition, since the presence or absence of the piezoelectricity of the detection vibrating arms 33 and 34 and the direction of the polarization axis and the crystal axis are not questioned, the range of selection of the constituent materials of the detection vibrating arms 33 and 34 is widened. Therefore, the vibrating body 3 having desired vibration characteristics can be realized relatively easily.

  On the other hand, the piezoelectric elements 51 and 52 are provided on the driving vibrating arm 35 of the vibrating body 3. The piezoelectric elements 53 and 54 are provided on the driving vibrating arm 36 of the vibrating body 3. The piezoelectric elements 55 and 56 are provided on the driving vibrating arm 37 of the vibrating body 3. The piezoelectric elements 57 and 58 are provided on the driving vibrating arm 38 of the vibrating body 3.

  The pair of piezoelectric elements 51 and 52 are for bending and vibrating the driving vibrating arm 35 in the x-axis direction. Similarly, the pair of piezoelectric elements 53 and 54 causes the driving vibrating arm 36 to bend and vibrate in the x-axis direction. In addition, the pair of piezoelectric elements 55 and 56 are for bending and vibrating the driving vibrating arm 37 in the x-axis direction. In addition, the pair of piezoelectric elements 57 and 58 are for bending and vibrating the driving vibrating arm 38 in the x-axis direction.

  More specifically, the pair of piezoelectric elements 51 and 52 is provided with the piezoelectric element 51 on one side (right side in FIG. 2) in the width direction (x-axis direction) of the driving vibrating arm 35. A piezoelectric element 52 is provided on the other side (left side in FIG. 2). Similarly, in the pair of piezoelectric elements 53 and 54, the piezoelectric element 53 is provided on one side (right side in FIG. 2) in the width direction (x-axis direction) of the driving vibrating arm 36, and the other side (FIG. A piezoelectric element 54 is provided on the left side in FIG. The pair of piezoelectric elements 55 and 56 are provided with a piezoelectric element 55 on one side (right side in FIG. 2) in the width direction (x-axis direction) of the driving vibration arm 37 and on the other side (FIG. 2). A piezoelectric element 56 is provided on the middle left side. The pair of piezoelectric elements 57 and 58 are provided with a piezoelectric element 57 on one side (right side in FIG. 2) in the width direction (x-axis direction) of the driving vibration arm 38 and on the other side (FIG. 2). A piezoelectric element 58 is provided on the middle left side.

  The piezoelectric elements 51 to 58 are each configured to expand and contract in the y-axis direction when energized. Each of the piezoelectric elements 51 and 52 causes the drive vibrating arm 35 to drive and vibrate (bend vibration in the x-axis direction) when energized. Similarly, the piezoelectric elements 53 and 54 cause the drive vibrating arm 36 to drive and vibrate (bend and vibrate in the x-axis direction) when energized. In addition, the piezoelectric elements 55 and 56 cause the drive vibrating arm 37 to drive and vibrate (bend and vibrate in the x-axis direction) when energized. The piezoelectric elements 57 and 58 cause the drive vibrating arm 38 to drive and vibrate (bend and vibrate in the x-axis direction) when energized.

By using such piezoelectric elements 51 to 58, even if the driving vibrating arms 35 to 38 themselves do not have piezoelectricity, or the driving vibrating arms 35 to 38 themselves have piezoelectricity, Even when the directions of the polarization axis and the crystal axis are not suitable for bending vibration in the x-axis direction, the vibration arms for driving 35 to 38 are bent and driven in the x-axis direction (driving) relatively easily and efficiently. Vibration). In addition, since the presence or absence of the piezoelectricity of the driving vibration arms 35 to 38 and the direction of the polarization axis and the crystal axis are not questioned, the range of selection of the constituent material of each of the driving vibration arms 35 to 38 is widened. Therefore, the vibrating body 3 having desired vibration characteristics can be realized relatively easily.
Such piezoelectric elements 41 to 44 and 51 to 58 each have a laminated structure in which a plurality of layers are laminated in the z-axis direction.

  Hereinafter, the configuration of the piezoelectric elements 51 and 52 will be described in detail. The configuration of the piezoelectric elements 41 to 44 and 53 to 58 is the same as that of the piezoelectric elements 51 and 52 (having the same laminated structure), and thus the description thereof is omitted.

  As shown in FIG. 3A, the piezoelectric element 51 includes a first base layer 511, a first electrode layer 512, a piezoelectric layer (piezoelectric thin film) 513, and an insulator layer on the driving vibration arm 35. 514, a second base layer 515, and a second electrode layer 516 are stacked in this order. Similarly, the piezoelectric element 52 includes a first base layer 521, a first electrode layer 522, a piezoelectric layer (piezoelectric thin film) 523, an insulator layer 524, and a second base layer on the driving vibrating arm 35. 525 and the second electrode layer 526 are stacked in this order.

  The first base layer 511 is provided between the driving vibration arm 35 and the first electrode layer 512 and has a function of preventing the first electrode layer 512 from being peeled off from the driving vibration arm 35. Similarly, the first base layer 521 is provided between the driving vibration arm 35 and the first electrode layer 522, and has a function of preventing the first electrode layer 522 from peeling from the driving vibration arm 35. Have

  The first foundation layers 511 and 521 are made of, for example, titanium (Ti), chromium (Cr), or the like. Moreover, the average thickness of the first underlayers 511 and 521 is not particularly limited, but is preferably about 1 to 300 nm, for example. Note that the first base layers 511 and 521 can be omitted depending on the combination of the constituent material of the first electrodes 512 and 522 and the constituent material of the driving vibrating arm 35. A first electrode layer 512 is provided on the first base layer 511, and similarly, a first electrode layer 522 is provided on the first base layer 521.

  The first electrode layer 512 is provided between the driving vibration arm 35 and the piezoelectric layer 513, and the first electrode layer 522 is provided between the driving vibration arm 35 and the piezoelectric layer 523. It has been. The first electrode layers 512 and 522 are, for example, gold (Au), gold alloy, platinum (Pt), aluminum (Al), aluminum alloy, silver (Ag), silver alloy, chromium (Cr), and chromium alloy, respectively. Metal materials such as copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium (Zr) It can be formed of a transparent electrode material such as indium tin oxide (ITO) or zinc oxide (ZnO).

  Among these, as the constituent material of the first electrode layers 512 and 522, it is preferable to use a metal (gold, gold alloy) or platinum mainly made of gold, and a metal (especially gold) mainly made of gold. Is more preferable. Gold (Au) is suitable as an electrode material because it has excellent conductivity (low electrical resistance) and excellent resistance to oxidation. Further, gold (Au) can be easily patterned by etching compared to platinum (Pt). Furthermore, the orientation of the piezoelectric layers 513 and 523 can be enhanced by forming the first electrode layers 512 and 522 from gold or a gold alloy.

  The average thickness of the first electrode layers 512 and 522 is not particularly limited, but is preferably about 1 to 300 nm, and more preferably 10 to 200 nm, for example. This prevents the first electrode layers 512 and 522 from adversely affecting the drive characteristics of the piezoelectric elements 51 and 52 and the vibration characteristics of the drive vibrating arm 35, while preventing the first electrode layer 512 as described above. The conductivity of 522 can be made excellent. A piezoelectric layer 513 is provided on the first electrode layer 512, and similarly, a piezoelectric layer 523 is provided on the first electrode layer 522.

Examples of the constituent material (piezoelectric material) of the piezoelectric layers 513 and 523 include zinc oxide (ZnO), aluminum nitride (AlN), lithium tantalate (LiTaO ₃ ), lithium niobate (LiNbO ₃ ), and niobium, respectively. Examples include potassium acid (KNbO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), barium titanate (BaTiO ₃ ), and PZT (lead zirconate titanate).

  Among these, PZT is preferably used as a constituent material of the piezoelectric layers 513 and 523. PZT (lead zirconate titanate) is excellent in c-axis orientation. Therefore, the CI value of the vibrating body 3 can be reduced by configuring the piezoelectric layers 513 and 523 using PZT as a main material. Moreover, these materials can be formed into a film by the reactive sputtering method.

  In addition, the average thickness of the piezoelectric layers 513 and 523 is preferably 50 to 3000 nm, and more preferably 200 to 2000 nm. Accordingly, it is possible to improve the drive characteristics of the piezoelectric elements 51 and 52 while preventing the piezoelectric layers 513 and 523 from adversely affecting the vibration characteristics of the drive vibrating arm 35. An insulator layer 514 is provided on the piezoelectric layer 513 (on the side of the piezoelectric layer 513 opposite to the driving vibration arm 35), and similarly, on the piezoelectric layer 523 (piezoelectric layer 523). An insulating layer 524 is provided on the surface opposite to the driving vibration arm 35 of FIG.

The insulating layer (insulating protective layer) 514 has a function of protecting the piezoelectric layer 513 and preventing a short circuit between the first electrode layer 512 and the second electrode layer 516. Similarly, the insulating layer (insulating protective layer) 524 has a function of protecting the piezoelectric layer 523 and preventing a short circuit between the first electrode layer 522 and the second electrode layer 526. The insulator layers 514 and 524 are made of, for example, SiO ₂ (silicon oxide), AlN (aluminum nitride), SiN (silicon nitride), or the like.

  The average thickness of the insulator layers 514 and 524 is not particularly limited, but is preferably 50 to 500 nm. When the thickness is less than the lower limit value, the effect of preventing the short circuit as described above tends to be reduced. On the other hand, when the thickness exceeds the upper limit value, the characteristics of the piezoelectric elements 51 and 52 are adversely affected. There is a risk of giving.

  Note that the insulating layers 514 and 524 can be omitted depending on the thickness, constituent material, film formation state, and the like of the piezoelectric layers 513 and 523. A second base layer 515 is provided over the insulator layer 514, and similarly, a second base layer 525 is provided over the insulator layer 524.

  The second base layer 515 has a function of preventing the second electrode layer 516 from being separated from the insulator layer 514 (the piezoelectric layer 513 when the insulator layer 514 is omitted). Similarly, the second base layer 525 has a function of preventing the second electrode layer 526 from being separated from the insulator layer 524 (the piezoelectric layer 523 when the insulator layer 524 is omitted). The second underlayers 515 and 525 are made of, for example, titanium (Ti), chromium (Cr), or the like.

  In addition, the average thickness of each of the second underlayers 515 and 525 is not particularly limited, but is preferably about 1 to 300 nm, for example. Note that the second base layers 515 and 525 include the constituent materials of the second electrode layers 516 and 526 and the insulator layers 514 and 524 (the piezoelectric layers 513 and 523 when the insulator layers 514 and 524 are omitted). Depending on the combination with the constituent materials, it can be omitted. A second electrode layer 516 is provided on the second base layer 515 (on the side of the piezoelectric layer 513 opposite to the driving vibration arm 35), and similarly, the second base layer 525 is provided. A second electrode layer 526 is provided above (on the side of the piezoelectric layer 523 opposite to the driving vibrating arm 35).

  The second electrode layers 516 and 526 are, for example, gold (Au), gold alloy, platinum (Pt), aluminum (Al), aluminum alloy, silver (Ag), silver alloy, chromium (Cr), and chromium alloy, respectively. Metal materials such as copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium (Zr) It can be formed of a transparent electrode material such as ITO or ZnO.

  Further, the average thickness of the second electrode layers 516 and 526 is not particularly limited, but is preferably about 1 to 300 nm, and more preferably 10 to 200 nm, for example. This prevents the second electrode layers 516 and 526 from adversely affecting the drive characteristics of the piezoelectric elements 51 and 52 and the vibration characteristics of the drive vibrating arm 35, while maintaining the conductivity of the second electrode layers 516 and 526. The property can be made excellent.

  In such a piezoelectric element 51, when a voltage is applied between the first electrode layer 512 and the second electrode layer 516, an electric field in the z-axis direction is generated in the piezoelectric layer 513, and the piezoelectric layer 513 expands or contracts in the y-axis direction. Similarly, in the piezoelectric element 52, when a voltage is applied between the first electrode layer 522 and the second electrode layer 526, an electric field in the z-axis direction is generated in the piezoelectric layer 523, and the piezoelectric layer 523 expands or contracts in the y-axis direction.

  At this time, when one of the piezoelectric elements 51 and 52 is expanded in the y-axis direction, the other piezoelectric element is contracted in the y-axis direction, whereby the drive vibrating arm 35 is moved in the x-axis direction. It can be bent and vibrated in the direction. Similarly, the driving vibration arm 36 can be bent and vibrated in the x-axis direction by the piezoelectric elements 53 and 54. Further, the driving vibration arm 37 can be bent and vibrated in the x-axis direction by the piezoelectric elements 55 and 56. In addition, the driving vibration arm 38 can be bent and vibrated in the x-axis direction by the piezoelectric elements 57 and 58.

  On the other hand, in the piezoelectric elements 41 and 42 for detecting the vibration of the detection vibrating arm 33, when the detection vibrating arm 33 is flexibly vibrated in the x-axis direction, one piezoelectric element expands in the y-axis direction and the other piezoelectric element. The body element contracts in the y-axis direction and outputs a charge. Similarly, in the piezoelectric elements 43 and 44, when the vibrating vibrating arm 34 is bent and vibrated in the x-axis direction, one piezoelectric element expands in the y-axis direction and the other piezoelectric element contracts in the y-axis direction. , Output charge.

  In such a piezoelectric element 51, the first electrode layer 512 is electrically connected to the terminal 71 via a wiring (not shown), and the second electrode layer 516 is connected via a wiring (not shown). The terminal 74 is electrically connected. In the piezoelectric element 52, the first electrode layer 522 is electrically connected to the terminal 74 via a wiring (not shown), and the second electrode layer 526 is a terminal via the wiring (not shown). 71 is electrically connected.

  Similarly, in the piezoelectric element 53, the first electrode layer is electrically connected to the terminal 71, the second electrode layer is electrically connected to the terminal 74, and the piezoelectric element 54 is The electrode layer is electrically connected to the terminal 74, and the second electrode layer is electrically connected to the terminal 71. The piezoelectric element 55 has a first electrode layer electrically connected to the terminal 74, a second electrode layer electrically connected to the terminal 71, and the piezoelectric element 56 has a first electrode The layer is electrically connected to the terminal 71, and the second electrode layer is electrically connected to the terminal 74.

The piezoelectric element 57 has a first electrode layer electrically connected to the terminal 74, a second electrode layer electrically connected to the terminal 71, and the piezoelectric element 58 has a first electrode The layer is electrically connected to the terminal 71, and the second electrode layer is electrically connected to the terminal 74.
In the piezoelectric element 41, the first electrode layer is electrically connected to the terminal 72, the second electrode layer is electrically connected to the terminal 73, and the piezoelectric element 42 includes the first electrode layer. The layer is electrically connected to the terminal 73, and the second electrode layer is electrically connected to the terminal 72.

  The piezoelectric element 43 has a first electrode layer electrically connected to the terminal 75, a second electrode layer electrically connected to the terminal 76, and the piezoelectric element 44 has a first electrode The layer is electrically connected to the terminal 76, and the second electrode layer is electrically connected to the terminal 75. Such terminals 71 to 73 are provided on the fixing portion 321 of the support portion 32 described above, and the terminals 74 to 76 are provided on the fixing portion 322 of the support portion 32.

  The terminals 71 to 76 and the wiring (not shown) are, for example, gold (Au), gold alloy, platinum (Pt), aluminum (Al), aluminum alloy, silver (Ag), silver alloy, chromium (Cr ), Chromium alloy, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium (Zr) Or a transparent electrode material such as ITO or ZnO. Moreover, these can be collectively formed simultaneously with the first electrode layer or the second electrode layer of the piezoelectric elements 41 to 44 and 51 to 58.

[Mass adjustment unit]
Next, the mass adjusting units 61 to 66 will be described. As shown in FIG. 2, the mass adjusting unit 61 is provided on the distal end portion (the weight portion 331) of the detection vibrating arm 33. The mass adjusting unit 61 is a weight for adjusting the resonance frequency of the vibration arm for detection 33 by reducing the mass by removing a part or all of the mass adjusting unit 61 by, for example, irradiation with energy rays.

  Similarly, the mass adjusting unit 62 is provided on the distal end portion (the weight portion 341) of the detection vibrating arm 34. Further, the mass adjusting parts 63, 64, 65, 66 are provided on the tip parts (weight parts 351, 361, 371, 381) of the driving vibrating arms 35, 36, 37, 38, respectively. Since such mass adjusting units are provided in the detection vibrating arms 33 and 34 and the driving vibrating arms 35 to 38, respectively, the resonance frequencies of the detection vibrating arms 33 and 34 and the driving vibrating arms 35 to 38 are respectively set. Can be adjusted.

  Hereinafter, the mass adjusting unit 63 will be described in detail. In addition, since it is the same as that of the mass adjustment part 63 about the mass adjustment parts 61, 62, and 64-66, the description is abbreviate | omitted. As shown in FIG. 3B, the mass adjusting unit 63 includes a first layer 631, a second layer 632, and a third layer (mass adjusting layer) 633 on the weight 351 of the driving vibrating arm 35. Are stacked in this order.

  The first layer 631 and the second layer 632 have a function of preventing the third layer 633 from being separated from the driving vibrating arm 35. The first layer 631 is made of the same material as the first base layers 511 and 521 of the piezoelectric elements 51 and 52. Since the first layer 631 is provided between the second layer 632 and the driving vibrating arm 35, the second layer 632 is used for driving while simplifying the manufacturing process of the gyro element 2. Separation from the vibrating arm 35 can be prevented.

  The second layer 632 is made of the same material as the first electrode layers 512 and 522 of the piezoelectric elements 51 and 52. Since the second layer 632 is provided between the third layer 633 and the driving vibrating arm 35, the third layer 633 is used for driving while simplifying the manufacturing process of the gyro element 2. Separation from the vibrating arm 35 can be prevented.

  The third layer 633 is made of the same material as the piezoelectric layers 513 and 523 of the piezoelectric elements 51 and 52. Thereby, when forming the 3rd layer 633 (mass adjustment layer) so that it may mention later, the thickness can be controlled with high precision and the mass adjustment part 63 of desired mass can be obtained. Therefore, frequency adjustment can be performed easily and with high accuracy. In addition, the third layer 633 can be formed together with the formation of the piezoelectric layers 513 and 523. Therefore, the manufacturing process of the gyro element 2 can be simplified.

  There is no layer made of the same material as the second electrode layers 516 and 526 of the piezoelectric elements 51 and 52 described above on the surface of the third layer 633 opposite to the driving vibrating arm 35. That is, the surface of the third layer 633 (mass adjusting layer) opposite to the driving vibrating arm 35 is exposed. Thereby, at least a part of the mass adjusting unit 63 can be easily and accurately removed by the laser or the electron beam.

  Further, there is no layer made of the same material as the insulator layers 514 and 524 of the piezoelectric elements 51 and 52 described above on the side of the third layer 633 opposite to the driving vibration arm 35. Thereby, at least a part of the mass adjusting unit 63 can be easily and accurately removed by the laser or the electron beam.

  The gyro element 2 configured as described above detects the angular velocity ω around the z-axis as follows. First, by applying a voltage (drive signal) between the terminal 71 and the terminal 74, as shown in FIG. 4A, the drive vibration arm 35 and the drive vibration are moved in the direction indicated by the arrow A in the figure. The arm 37 is bent and vibrated (drive vibration) so as to approach and separate from each other, and the drive vibration arm 36 and the drive vibration arm 38 are bent and vibrated so as to approach and separate from each other in the same direction as the bending vibration. Drive vibration).

  At this time, if no angular velocity is applied to the gyro element 2, the driving vibrating arms 35 and 36 and the driving vibrating arms 37 and 38 perform plane-symmetric vibration with respect to the yz plane passing through the center point (center of gravity G). Therefore, the base 31 (the main body 311 and the connecting arms 312 and 313) and the detection vibrating arms 33 and 34 hardly vibrate. When the angular velocity ω around the normal line (z axis) passing through the center of gravity G is applied to the gyro element 2 with the drive vibrating arms 35 to 38 being driven to vibrate in this way, , Each has Coriolis power. As a result, as shown in FIG. 4B, the connecting arms 312 and 313 bend and vibrate in the direction indicated by the arrow B in the figure, and the vibration of the detection vibrating arms 33 and 34 is canceled so as to cancel this bending vibration. Bending vibration (detection vibration) in the direction indicated by arrow C in the figure is excited.

  Then, the charges generated in the piezoelectric elements 41 and 42 due to the bending vibration of the detection vibrating arm 33 are output from the terminals 72 and 73. Further, electric charges generated in the piezoelectric elements 43 and 44 due to the bending vibration of the detection vibrating arm 34 are output from the terminals 75 and 76. As described above, the angular velocity ω applied to the gyro element 2 can be obtained based on the charges output from the terminals 72, 73, 75, and 76.

[Gyro element manufacturing method]
Here, an example of a manufacturing method of the above-described gyro element 2 will be briefly described. The manufacturing method of the gyro element 2 includes [A] a step of forming the outer shape of the gyro element 2 on a single crystal silicon substrate, and [B] a first underlayer of the piezoelectric elements 41 to 44 and 51 to 58 and mass adjustment. Forming the first layer of the parts 61 to 66, [C] forming the first electrode layers of the piezoelectric elements 41 to 44, 51 to 58 and the second layer of the mass adjusting parts 61 to 66. A step of forming [D] the piezoelectric layers of the piezoelectric elements 41 to 44 and 51 to 58 and the third layer of the mass adjusting units 61 to 66; [E] the piezoelectric elements 41 to 44; A step of forming insulating layers 51 to 58, a step of forming a second underlayer of [F] piezoelectric elements 41 to 44 and 51 to 58, and a step [G] piezoelectric elements 41 to 44, 51 to 51 58 second electrode layer forming steps, and [H] the gyro element 2 is folded from the single crystal silicon substrate into individual pieces It has a that step. Hereinafter, each step will be described.

  [A] First, a single crystal silicon substrate 85 as shown in FIG. 5 for forming the gyro element 2 is prepared. This single crystal silicon substrate 85 is a wafer having a plane orientation (1, 0, 0) as a main surface, and the gyro element 2 including the vibrator 3 is formed by etching the single crystal silicon substrate 85. A plurality of gyro elements 2 are arranged on the single crystal silicon substrate 85, and are supported by outer frames 80 and 81 as frame portions by folding portions 78 and 79 to constitute a vibrating piece.

  Here, the gyro element 2 formed on the single crystal silicon substrate 85 will be described with reference to FIGS. Each gyro element 2 has its fixing portions 321 and 322 and the outer frame 80 and / or the outer frame 81 connected by the folding portions 78 and 79, and is supported by the outer frame 80 and / or the outer frame 81. . The outer frame 80 is provided along the direction <1,1,0>, and the outer frame 81 is along the direction <-1,1,0> which is the vertical direction of the direction <1,1,0>. Is provided.

  A plurality of the folding parts 78 are arranged along the direction <1, 1, 0>, and three folding parts 78 are provided in this embodiment. In addition, a plurality of folding portions 79 are arranged along the direction <-1, 1, 0>, and in this embodiment, two folding portions 79 are provided. Thus, since the folding part 78 and the folding part 79 are provided in the mutually perpendicular direction, there is an advantage that the way of applying force at the time of folding is dispersed and the folding is easy to perform.

  As shown in FIG. 6D, the folding part 78 is provided so that the width continuously narrows from the side on the gyro element 2 side of the outer frame 80 toward the fixing part 321 of the gyro element 2. . In other words, the width dimension L1 of the connection part between the breaker part 78 and the outer frame 80 is formed larger than the width dimension L2 of the connection part between the breaker part 78 and the fixing part 321. The folding part 79 is also formed with the same configuration as described above.

  Note that the breakers 78 and 79 are not limited to the above-described forms, but may be forms as shown in the modified examples of FIGS. 6B and 6C. In the modification shown in FIG. 6B, three folding portions 78 are arranged along the direction <1, 1, 0> between the outer frame 80 facing the fixing portion 321, and the folding portions 78 are folded. One take-up portion 79 is disposed between the outer frame 80 a facing the fixed portion 322. Further, in the modification shown in FIG. 6C, three folding portions 78 are arranged along the direction <1, 1, 0> between the outer frame 80 facing the fixing portion 321. The gyro element 2 is supported by the outer frame 80 only by the folding part 78.

  [B] Thereafter, the first underlayer of the piezoelectric elements 41 to 44 and 51 to 58 and the first layer of the mass adjusting units 61 to 66 are formed on the vibrating body 3. As a method for forming the first underlayer and the first layer, a physical film formation method such as a sputtering method or a vacuum vapor deposition method, a vapor phase film formation method such as a chemical vapor deposition method such as CVD (Chemical Vapor Deposition), or the like And various coating methods such as an ink jet method, but a vapor phase film forming method (particularly, a sputtering method or a vacuum evaporation method) is preferably used. In forming (patterning) the first underlayer and the first layer, it is preferable to use a photolithography method. Note that the first underlayer and the first layer are collectively formed in the same film formation step.

  [C] Next, a first electrode layer is formed on the first underlayer, and a second layer is formed on the first layer. As a method for forming the first electrode layer and the second layer, the same method as the method for forming the first electrode layer and the second layer described above can be used. In forming (patterning) the first electrode layer and the second layer, it is preferable to use a photolithography method. Note that the first electrode layer and the second layer are collectively formed in the same film formation step. If necessary, the wiring and the like are formed at the same time in the steps [A] and [B].

  [D] Next, a piezoelectric layer is formed on the first electrode layer, and a third layer is formed on the second layer. As a method for forming the piezoelectric layer and the third layer, the same method as that for forming the first electrode layer and the second layer described above can be used. Further, when patterning the piezoelectric layer and the third layer, it is preferable to use wet etching to remove unnecessary portions. The piezoelectric layer and the third layer are collectively formed in the same film forming process.

  [E] Next, an insulator layer is formed on the piezoelectric layer. As a method for forming this insulator layer, the same method as the method for forming the first electrode layer and the second layer described above can be used. Further, when patterning the insulator layer, it is preferable to use wet etching to remove unnecessary portions.

  [F] Next, a second underlayer is formed on the insulator layer. As a method for forming the second underlayer, the same method as the method for forming the first electrode layer and the second layer described above can be used. In forming (patterning) the second underlayer, it is preferable to use a photolithography method.

  [G] Next, a second electrode layer is formed on the second underlayer. As a method for forming the second electrode layer, the same method as the method for forming the first electrode layer and the second layer described above can be used. In forming (patterning) the second electrode layer, it is preferable to use a photolithography method.

  [H] Next, the gyro elements 2 arranged on the single crystal silicon substrate are broken into single crystal silicon substrate pieces. In this way, the cleavage planes (split sections) of the folding portions 78 and 79 are planes with the plane orientation (0, 1, 1) or planes with the plane orientation (0, 1, 1) in the vertical direction. Thus, the gyro element 2 that is broken is formed.

In the above description, a plurality of folding parts 78 are arranged along the direction <1,1,0>, and a plurality of folding parts 79 are arranged along the direction <-1,1,0>. As described in the example, if there is a slight amount, a deviation may occur in each direction. When the shift occurs, as shown in FIG. 7, the unfolded portion when the gyro element 2 is separated tends to be large. For example, when the deviation is about 30 degrees, a slightly large unfolded portion 78b (79b) is generated as indicated by β in the figure. This level is a practically acceptable range. In addition, it is desirable that this deviation is about 10 degrees. In this case, a slight unfolded portion 78a (79a) is generated as indicated by α in the figure. If the unfolded portion 78a (79a) is of this level, it can be used without any problem.
As described above, the gyro element 2 can be manufactured.

  In the above-described manufacturing method of the gyro element 2, the piezoelectric elements 41 to 44, 51 to 58 and the mass adjusting units 61 to 66 are formed after the outer shape of the gyro element 2 is formed. However, the piezoelectric element is formed on the single crystal silicon substrate. After forming the body elements 41 to 44, 51 to 58 and the mass adjusting parts 61 to 66, the outer shape of the gyro element 2 may be formed by etching the substrate. In this case, the first base layer, the first electrode layer, the piezoelectric layer, the insulator layer, the second base layer, and the first base layer of the piezoelectric elements 41 to 44 and 51 to 58 are formed on the single crystal silicon substrate. After a plurality of layers made of the same material as the electrode layers of 2 are formed and laminated uniformly in this order to form a laminated body, piezoelectric elements 41 to 44, 51 to 58 of the laminated body are formed. For the portion other than the portion to be, the layer made of the same material as the insulator layer, the second base layer, and the second electrode layer is removed by etching, and the layer made of the same material as the piezoelectric layer is removed. A part is exposed, and thereafter the piezoelectric elements 41 to 44, 51 to 58 and the parts other than the parts to be the mass adjusting parts 61 to 66 are the same as the first underlayer, the first electrode layer, and the piezoelectric layer. By removing the layer made of the material by etching, the piezoelectric element 41 44,51～58 and mass adjuster 61 to 66 may be formed.

Further, in the above-described example, the wafer having the main surface of the plane orientation (1, 0, 0) of the single crystal silicon substrate has been described, but the present invention is not limited to this.
For example, the gyro element 2 can also be formed using a wafer having the main surface of the plane orientation (0, 0, 1) of the single crystal silicon substrate. In this case, the folding parts are arranged in the direction <0, 1, 1> or in the direction perpendicular to the direction <0, 1, 1>, and the fractured cross-section has a plane orientation of (1, 1, 0). It becomes a surface or a surface in the direction perpendicular to the surface orientation (1, 1, 0).

  In addition, the gyro element 2 can be formed using a wafer whose main surface is the plane orientation (0, 1, 0) of the single crystal silicon substrate. In this case, the folding portions are arranged in the direction <1, 0, 1> or in the direction perpendicular to the direction <1, 0, 1>, and the fractured cross-section has a plane orientation (1, 0, 1). It is a plane or a plane in the vertical direction of plane orientation (1, 0, 1).

[package]
Returning to FIG. 1, the package 9 will be described. The package 9 stores the gyro element 2. In addition to the gyro element 2, an IC chip that drives the gyro element 2 and the like may be stored in the package 9. Such a package 9 has a substantially rectangular shape in plan view (xy plan view).

  The package 9 has a base 91 having a recess opened on the upper surface, and a lid (lid body) 92 joined to the base 91 so as to close the opening of the recess. The base 91 has a plate-like bottom plate 911 and a frame-like side wall 912 provided on the peripheral edge of the upper surface of the bottom plate 911. Such a package 9 has a storage space S inside thereof, and the gyro element 2 is stored and installed in the storage space S in an airtight manner.

  Further, on the upper surface of the bottom plate 911, six connection pads 10 corresponding to the terminals 71 to 76 of the gyro element 2 are provided, and solder, silver paste, conductive adhesive (conductive material such as metal particles in the resin material) is provided. Each of the connection pads 10 and one of the corresponding terminals are electrically connected via a conductive fixing member 8 such as an adhesive in which a conductive filler is dispersed. Further, the gyro element 2 is fixed to the bottom plate 911 by the conductive fixing member 8.

  The conductive fixing member 8 also functions as a gap material that forms a gap (gap) between the gyro element 2 and the bottom plate 911 and prevents these contacts. Thereby, destruction / breakage of the gyro element 2 due to contact with the bottom plate 911 can be prevented, and the vibrator (gyro sensor) 1 capable of detecting an accurate angular velocity and exhibiting excellent reliability can be obtained.

  Each connection pad 10 is drawn out of the package 9 through a conductor post (not shown). When an IC chip or the like is stored in the package 9, each connection pad 10 may be electrically connected to the IC chip.

  The constituent material of the base 91 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 92 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 91. For example, when the constituent material of the base 91 is ceramic as described above, an alloy such as Kovar is preferable. The joining of the base 91 and the lid 92 is not particularly limited, and for example, the base 91 and the lid 92 may be joined via an adhesive or may be joined by seam welding or the like.

  According to the vibrator (gyro sensor) 1 including the gyro element 2 according to the first embodiment as described above, the unfolded portions of the folding portions 78 and 79 are reduced, and the folding proceeds to the vibrating element. It is possible to prevent problems related to folding, such as a decrease in the number. As a result, the defective rate of the singulation (breaking) of the gyro element 2 is lowered, in other words, the non-defective product rate is increased and the cost of the gyro element 2 is reduced. Therefore, the gyro sensor using the gyro element 2 is reduced. The cost can be reduced. Further, since the folding is stable, the vibration characteristics of the gyro element are stabilized, so that the characteristics as the gyro sensor can be stabilized and the reliability can be improved.

  Further, the folding parts 78 and 79 are provided with grooves extending at both ends in the direction intersecting the direction from the outer frames 80 and 81 of the folding parts 78 and 79 to the fixing parts 321 and 322 of the gyro element 2. It may be. In addition, this groove | channel is a groove part with a bottom in the thickness direction from the main surface, and either the structure provided in the surface, the structure provided in the back surface, or the structure provided from both the surface and the back surface may be sufficient. By providing the groove in this way, the force (stress) at the time of folding is concentrated on the groove portion, and the folding at this portion (connection portion with the fixing portions 321 and 322) can be easily performed. .

(Modification of the breaker)
The shape of the breakers 78 and 79 in plan view is not limited to the above example. A modification showing another shape will be described with reference to FIG. FIGS. 8A to 8I are plan views for explaining modifications of the breaker.

  The shape shown in FIG. 8A is the same as the shape described in the first embodiment. The folding part 78 is configured to have a linear outer shape so that the width continuously decreases from the outer frame 80 toward the fixing part 321 of the gyro element 2. By adopting such a shape, the force (stress) at the time of folding concentrates on the connection portion with the fixing portion 321 where the width of the folding portion 78 is the narrowest, and this portion (connection portion with the fixing portion 321). Can be broken at

  The folding part 78 shown in FIG. 8B is linear so that the width continuously decreases from both the outer frame 80 and the fixing part 321 of the gyro element 2 toward the center side of the folding part 78. It has an outer shape. That is, a narrow portion is formed at the center of the breaker portion 78. By adopting such a shape, the force (stress) at the time of folding is concentrated on the narrow width portion where the width of the folding portion 78 is the narrowest, and the folding at the narrow width portion can be performed.

  The folding part 78 shown in FIG. 8C is configured to have a linear outer shape so that the width continuously decreases from the fixing part 321 of the gyro element 2 toward the outer frame 80. By adopting such a shape, the force (stress) at the time of folding concentrates on the connecting portion with the outer frame 80 where the width of the folding portion 78 is the narrowest, and this portion (the connecting portion with the outer frame 80). Can be broken at

  The folding part 78 shown in FIG. 8D is configured to have a curved outer shape so that the width continuously narrows from the outer frame 80 toward the fixing part 321 of the gyro element 2. Even if such an outline is a curved folding part 78, the force (stress) at the time of folding concentrates on the connection part with the fixed part 321 where the width of the folding part 78 is the narrowest, and this part Folding can be performed at (the connection portion with the fixed portion 321).

  The folding part 78 shown in FIG. 8 (e) has r1 so that the width continuously decreases from both the outer frame 80 and the fixing part 321 of the gyro element 2 toward the center side of the folding part 78. , R2 having a curved outer shape. That is, a narrow portion is formed at the center of the breaker portion 78. Even if such a contour line is a curved folding part 78, the force (stress) at the time of folding concentrates on the narrow part where the width of the folding part 78 is the narrowest, It can be folded.

  The folding part 78 shown in FIG. 8F has a curved outer shape so that the width continuously narrows from the fixing part 321 of the gyro element 2 toward the outer frame 80. By adopting such a shape, the force (stress) at the time of folding concentrates on the connecting portion with the outer frame 80 where the width of the folding portion 78 is the narrowest, and this portion (the connecting portion with the outer frame 80). Can be broken at

  8 (g) includes a wide portion 78c extending from the outer frame 80 and a narrow portion 78d having a smaller width than the wide portion 78c extending from the fixing portion 321 of the gyro element 2. The wide part 78c and the narrow part (narrow part) 78d are connected. By adopting such a shape, folding can be performed at the narrow portion 78d having low rigidity. It is desirable that the wide portion 78c and the narrow portion 78d are connected as close to the fixed portion 321 as possible. By doing in this way, the part in which the narrow part 78d is formed becomes the fixed part 321, and the folded part can be brought close to the fixed part 321. As a result, it is possible to reduce the unfolded portion.

  8 (h) includes a wide portion 78c extending from each of the outer frame 80 and the fixing portion 321 of the gyro element 2, and a wide portion provided at a connecting portion between the wide portions 78c. A narrow portion (narrow portion) 78d having a smaller width than 78c. By adopting such a shape, folding can be performed at the narrow portion 78d having low rigidity. The wide portion 78c is preferably as short as possible. By doing in this way, the position where folding occurs can be limited.

  8 (i) is configured with substantially the same width from the outer frame 80 to the fixing portion 321 of the gyro element 2. Even in the case of the outer shape of the broken portion 78, the plane of the plane orientation (1, 1, 0) or the plane in the vertical direction of the plane orientation (1, 1, 0) is easy for the single crystal silicon to cleave. Since it has a split section, it can be folded. In this example, it is desirable to make the gap between the outer frame 80 and the fixed portion 321 as small as possible. That is, the length of the folding part 78 is shortened, and thereby the position where the folding occurs can be limited.

Second Embodiment
Next, the resonator element and the gyro element as the resonator element according to the second embodiment of the invention will be described. FIG. 9 is a plan view of the gyro element according to the second embodiment, and FIG. 10 is a plan view for explaining driving of the gyro element shown in FIG. Hereinafter, the gyro element according to the second embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.

  The gyro element according to the second embodiment of the present invention is the same as that of the first embodiment described above, except that the present invention is applied to a gyro element including a so-called H-type vibrating body. A gyro element 2B illustrated in FIG. 9 includes a vibrating body 3B, and piezoelectric elements 41B, 43B, 51B to 54B, mass adjusting units 61B to 64B, and terminals 71B to 76B provided on the vibrating body 3B.

  The vibrating body 3B has a so-called H-type structure. The vibrating body 3B includes a base portion 31B, a support portion 32B, a pair of detection vibrating arms 33B and 34B, and a pair of driving vibrating arms 35B and 36B. The base portion 31B is supported by the support portion 32B. The support portion 32B includes a frame-shaped fixing portion 321B that is fixed to a package (not shown), and four beam portions 323B, 324B, 325B, and 326B that connect the fixing portion 321B and the base portion 31B.

  In the fixing portion 321B, the cleaved portion that is broken when being separated from the single crystal silicon substrate 85 (see FIG. 5), similar to the manufacturing process of the gyro element 2 and the gyro element 2 of the first embodiment described above. Remaining unfolded portions 78a and 79a of the broken portions 78 and 79 (see FIGS. 5 and 6A) that are surfaces remain. In this embodiment, there are three unfolded portions 78a arranged on the x-axis on the outer side along the x-axis of the fixed part 321B, and 2 arranged on the side along the y-axis direction of the fixed part 321B. There are two unfolded portions 79a.

  The detection vibrating arms 33B and 34B respectively extend from the base portion 31B in the y-axis direction (−y direction side). The drive vibrating arms 35B and 36B respectively extend in the y-axis direction (+ y direction side) from the base portion 31B. Such a vibrating body 3B can be configured using the same material as that of the vibrating body 3 of the first embodiment described above.

  A piezoelectric element 41B and a mass adjusting unit 61B are provided on the detection vibrating arm 33B of the vibrating body 3B configured as described above. Similarly, a piezoelectric element 43B and a mass adjusting unit 62B are provided on the detection vibrating arm 34B. In addition, a pair of piezoelectric elements 51B and 52B and a mass adjusting unit 63B are provided on the driving vibrating arm 35B. In addition, a pair of piezoelectric elements 53B and 54B and a mass adjusting unit 64B are provided on the driving vibrating arm 36B.

  The piezoelectric element 41B detects bending vibration in the z-axis direction of the detection vibrating arm 33B. Similarly, the piezoelectric element 43B detects bending vibration in the z-axis direction of the detection vibrating arm 34B. On the other hand, the pair of piezoelectric elements 51B and 52B flexurally vibrate the driving vibrating arm 35B in the x-axis direction. Similarly, the pair of piezoelectric elements 53B and 54B flexurally vibrate the driving vibrating arm 36B in the x-axis direction.

  Such piezoelectric elements 41B, 43B, 51B to 54B are configured similarly to the piezoelectric elements 41 to 44 and 51 to 58 of the first embodiment described above. The piezoelectric element 41B is electrically connected to terminals 72B and 75B via wiring (not shown), and the piezoelectric element 43B is electrically connected to terminals 73B and 76B via wiring (not shown). It is connected to the.

  The piezoelectric elements 51B to 54B are electrically connected to the terminals 71B and 74B via wiring (not shown). These terminals 71B to 76B are respectively provided on the fixing portion 321B of the vibrating body 3B. The mass adjusting unit 61B is provided on the tip of the detection vibrating arm 33B. The mass adjusting unit 61B is a weight for adjusting the resonance frequency of the detection vibrating arm 33B by reducing the mass by removing part or all of the mass adjusting unit 61B by irradiation with energy rays, for example.

  Similarly, the mass adjusting unit 62B is provided on the tip of the detection vibrating arm 34B. In addition, the mass adjusting units 63B and 64B are provided on the tip portions of the driving vibrating arms 35B and 36B, respectively. Such mass adjustment parts 61B-64B are comprised similarly to the mass adjustment parts 61-66 of 1st Embodiment mentioned above.

  In the gyro element 2B configured as described above, when a driving signal is applied between the terminal 71B and the terminal 74B, the driving vibrating arm 35B and the driving vibrating arm 36B approach each other as shown in FIG.・ Bend vibration (drive vibration) so as to be separated. That is, the drive vibrating arm 35B is bent in the direction of the arrow A1 shown in FIG. 10, the drive vibrating arm 36B is bent in the direction of the arrow A2 shown in FIG. 10, and the driving vibrating arm 35B is shown in FIG. The state in which the driving vibrating arm 36B is bent in the direction of the arrow B2 shown in FIG.

  If the angular velocity ω around the y-axis is applied to the gyro element 2B in the state where the drive vibrating arms 35B and 36B are driven to vibrate in this way, the drive vibrating arms 35B and 36B are mutually moved in the z-axis direction by Coriolis force. Bend and vibrate on the opposite side. Along with this, the vibrating arms for detection 33B, 34B undergo bending vibration (detection vibration) on the opposite sides in the z-axis direction. That is, the detection vibrating arm 33B is bent in the direction of the arrow C1 shown in FIG. 10, the detection vibrating arm 34B is bent in the direction of the arrow C2 shown in FIG. 10, and the detection vibrating arm 33B is shown in FIG. The state where the detection vibrating arm 34B is bent in the direction of the arrow D2 shown in FIG.

  The angular velocity ω applied to the gyro element 2B can be obtained by detecting the charges generated in the piezoelectric elements 41B and 43B by the detection vibration of the detection vibrating arms 33B and 34B.

  Even with the gyro element 2B according to the second embodiment as described above, it is possible to prevent problems related to folding, such as a decrease in the unfolded portion of the folding portion and a decrease in the progress of the folding to the vibration element. Can do. As a result, the defective rate of singulation (breaking) of the gyro element 2B decreases, in other words, the non-defective product ratio increases, so that the cost of the gyro element 2B is reduced. Therefore, the gyro sensor using the gyro element 2B The cost can be reduced. Further, since the folding is stable and the vibration characteristic of the gyro element is stable, the characteristic as the gyro sensor can be stabilized and the reliability can be improved.

  In addition, the structure of the folding parts 78 and 79 that are torn off when separated from the single crystal silicon substrate 85 (see FIG. 5) in the second embodiment has been described in the first embodiment. Configuration can be applied.

<Third Embodiment>
Next, the resonator element and the gyro element as the resonator element according to the third embodiment of the invention will be described. FIG. 11 is a plan view showing an outline of the gyro element according to the third embodiment and showing a state in which the gyro element is provided on the single crystal silicon substrate. FIG. 12 is a plan view for explaining driving of the gyro element shown in FIG. In addition, about the structure similar to 1st Embodiment mentioned above, the same code | symbol may be attached | subjected and description may be abbreviate | omitted.

  A gyro element 401 according to the third embodiment shown in FIG. 11 includes an external connection portion 415 and a support portion 416 extending from the central portion thereof toward the central portion of the gyro element 401, and a weight portion so as to sandwich the support portion 416. 417 are arranged symmetrically, and the respective weight portions 417 are connected by a pair of drive vibration portions 405. On the drive vibration unit 405, a drive unit, a drive electrode, a detection unit, and a detection electrode are arranged and connected via an electrode pad provided on the external connection unit 415 and a wiring electrode. Omitted. Each drive vibration part 405 that connects the tip part of the support part 416 and the weight part 417 has a folded structure in which a plurality of drive vibration arms 405a and 405b extending in the Y-axis direction are connected in a folded manner.

  Then, by applying a drive signal output from a control circuit (not shown) to a drive electrode (not shown), the weight 417 is fundamentally vibrated so as to expand and contract in the X-axis direction as shown in FIG. Coriolis force is generated by receiving an angular velocity around the Z-axis. Due to this Coriolis force, the drive vibration unit 405 vibrates in the Y-axis direction. The deformation of the drive vibration unit 405 due to the vibration in the Y-axis direction is detected by a detection electrode (not shown), converted into an electric signal, and the detection signal is output to the control circuit.

  Note that the gyro element 401 is arranged on a single crystal silicon substrate having a plane direction (1, 0, 0) as a main surface, as in the first embodiment. The gyro element 401 is connected to and supported by outer frames 80 and 80a formed on a single crystal silicon substrate via a plurality of breakers 78 and 79. The folding portions 78 and 79 are provided so that the width dimension continuously decreases from one outer frame 80 or the other outer frame 80a toward the external connection portion 415. A connection unit 415 is connected. A plurality of the folding parts 78 and 79 are arranged along the direction <1, 1, 0>. In this embodiment, three folding parts 78 and 79 are provided, respectively.

  Note that the single crystal silicon substrate may be a single crystal silicon substrate having a plane orientation (0, 0, 1) as a principal plane, and is arranged on the single crystal silicon substrate having a plane orientation (0, 0, 1) as a principal plane. A plurality of the folding parts 78 and 79 are arranged along the direction <0, 1, 1>.

  In the gyro element 2 arranged on the single crystal silicon substrate having the plane orientation (1, 0, 0) as the principal plane, the cleavage planes (split sections) of the folding portions 78 and 79 are in the plane orientation (0, 1, 0). 1), or a surface in the direction perpendicular to the plane orientation (0, 1, 1), is broken and separated into individual pieces. In the case of the gyro element 2 arranged on the single crystal silicon substrate having the plane orientation (0, 0, 1) as the principal plane, the cleavage planes (split sections) of the folding portions 78 and 79 are the plane orientation ( 1, 1, 0), or a surface in the direction perpendicular to the plane orientation (1, 1, 0), and is broken into pieces.

  Even with the gyro element 401 according to the third embodiment as described above, it is possible to prevent problems related to folding, such as a decrease in the unfolded portion of the folding portion and a decrease in the progress of the folding to the vibration element. Can do. As a result, the defective rate of singulation (breaking) of the gyro element 401 is reduced, in other words, the non-defective product rate is increased, and thus the cost of the gyro element 401 is reduced. Therefore, a gyro sensor using the gyro element 401 is used. The cost can be reduced. Further, since the folding is stable, the vibration characteristics of the gyro element are stabilized, the characteristics as the gyro sensor are stabilized, and the reliability can be improved.

  Note that the configuration described in the above first embodiment can be applied to the configuration of the breakers 78 and 79 that are torn off when separated from the single crystal silicon substrate in the third embodiment. .

[Electronics]
Next, electronic devices to which the gyro element 2, 2B, 401 as the vibration element according to the embodiment of the present invention or the vibrator (gyro sensor) 1 using the gyro element 2, 2B, 401 are applied will be described with reference to FIGS. This will be described in detail with reference to FIG. In the description, an example in which a vibrator (gyro sensor) 1 using the gyro element 2 is applied is shown.

  FIG. 13 is a perspective view schematically illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the vibrator (gyro sensor) 1 according to an embodiment of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator (gyro sensor) 1 using a gyro element 2 having a function of detecting angular velocity.

  FIG. 14 is a perspective view schematically illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the vibrator (gyro sensor) 1 according to the embodiment of the invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates a vibrator (gyro sensor) 1 using a gyro element 2 that functions as an angular velocity sensor or the like.

  FIG. 15 is a perspective view schematically illustrating a configuration of a digital still camera as an electronic apparatus including the vibrator (gyro sensor) 1 according to an embodiment of the present invention. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 100 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 100 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a vibrator (gyro sensor) 1 using a gyro element 2 that functions as an angular velocity sensor or the like.

  The vibrator (gyro sensor) 1 according to an embodiment of the present invention includes, for example, a personal computer (mobile personal computer) in FIG. 13, a mobile phone in FIG. 14, and a digital still camera in FIG. Inkjet ejection device (for example, inkjet printer), laptop personal computer, TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, Word processor, workstation, videophone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish finder , Various measuring instruments, instruments For example, gages for vehicles, aircraft, and ships), can be applied to electronic devices such as flight simulators.

[Moving object]
FIG. 16 is a perspective view schematically showing an automobile as an example of a moving body. The automobile 106 is equipped with a vibrator (gyro sensor) 1 using the gyro element 2 according to the present invention. For example, as shown in the figure, an automobile 106 as a moving body is equipped with a vehicle body 107 with an electronic control unit 108 that controls a tire 109 and the like by incorporating a vibrator (gyro sensor) 1 using a gyro element 2. Has been. In addition, the vibrator (gyro sensor) 1 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring). System), engine control, battery monitors of hybrid vehicles and electric vehicles, vehicle body attitude control systems, and other electronic control units (ECUs) can be widely applied.

  DESCRIPTION OF SYMBOLS 1 ... Vibrator, 2 ... Gyro element as vibration element, 3, 3B ... Vibrating body, 8 ... Conductive fixing member, 9 ... Package, 10 ... Connection pad, 31, 31B ... Base part, 32, 32B ... Support part , 33, 33B, 34, 34B ... vibrating arm for detection, 35, 35B, 36, 36B, 37, 38 ... vibrating arm for driving, 41, 41B, 42, 43, 43B, 44, 51, 51B, 52, 52B 53, 53B, 54, 54B, 55, 56, 57, 58 ... Piezoelectric element, 61, 61B, 62, 62B, 63, 63B, 64, 64B, 65, 66, ... Mass adjustment part, 71, 71B, 72, 72B, 73, 73B, 74, 74B, 75, 75B, 76, 76B ... Terminal, 78, 79 ... Folding part, 78a, 78b, 79a, 79b ... Folding remaining part, 80, 81 ... Frame part Outer frame, 85 Single crystal silicon substrate, 91 ... base, 92 ... lid, 100 ... display unit, 106 ... automobile as a moving body, 311 ... main body, 312, 313 ... connecting arm, 321, 321B, 322 ... fixing unit, 323, 324 325, 326, 323B, 324B, 325B, 326B ... beam, 331, 341, 351, 361, 371, 381 ... weight, 511 ... first underlayer, 512 ... first electrode layer, 513 ... piezoelectric Body layer, 514... Insulator layer, 515... Second base layer, 516... Second electrode layer, 521... First base layer, 522. ... insulator layer, 525 ... second underlayer, 526 ... second electrode layer, 631 ... first layer, 632 ... second layer, 633 ... third layer (mass adjusting layer), 911 ... bottom plate , 912 ... side walls, 1100 ... electronic equipment A mobile-type personal computer as a, 1200 ... mobile phone as an electronic device, 1300 ... digital still camera as an electronic device.

Claims (13)

A vibration element including a vibrating body formed by processing a single crystal silicon substrate having a plane orientation of (1, 0, 0) as a main surface, a break portion, and a frame portion;
The vibration element is connected to the frame portion through the breaker portion,
The resonator element according to claim 1, wherein the fractured surface of the broken portion is a plane having a plane orientation (0, 1, 1) or a plane having a plane direction (0, 1, 1).   2. The resonator element according to claim 1, wherein the folding portions are arranged in a direction <1, 1, 0> or a direction perpendicular to the direction <1, 1, 0>. A vibration element including a vibrating body formed by processing a single crystal silicon substrate having a plane orientation (0, 0, 1) as a main surface, a breaker portion, and a frame portion;
The vibration element is connected to the frame portion through the breaker portion,
The resonator element according to claim 1, wherein the fractured surface of the break portion is a plane having a plane orientation (1, 1, 0) or a plane having a plane direction (1, 1, 0).   4. The resonator element according to claim 3, wherein the folding portions are arranged in a direction <0, 1, 1> or a direction perpendicular to the direction <0, 1, 1>. A vibrating element including a vibrating body, a breaker part, and a frame part, which are formed by processing a single crystal silicon substrate having a plane orientation (0, 1, 0) as a main surface. , Connected to the frame part through the breaker part,
The resonator element according to claim 1, wherein the fractured surface of the break portion is a plane having a plane orientation (1, 0, 1) or a plane having a plane direction (1, 0, 1).   6. The resonator element according to claim 5, wherein the folding portions are arranged in a direction <1, 0, 1> or a direction perpendicular to the direction <1, 0, 1>.   The folding part includes a wide part having a wide width in a direction intersecting a direction from the vibrating body toward the frame part in a plan view, and a narrow part having the width smaller than the wide part. The resonator element according to claim 1, wherein:   6. The resonator element according to claim 1, wherein the width of the folded portion continuously changes in a plan view.   The groove portion extending from an end in a direction intersecting a direction from the vibrating body toward the frame portion to the other end is provided in the breaker portion. The resonator element according to item.   A vibrating element that is broken from the vibrating piece according to claim 1. A vibration element broken from the vibration piece according to any one of claims 1 to 9,
And a package in which the vibration element is housed.   An electronic apparatus comprising: a vibration element that is folded from the vibration piece according to claim 1.   A moving body comprising a vibration element folded from the vibration piece according to any one of claims 1 to 9.

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