JP2015128266A - Manufacturing method of vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a vibrator capable of efficiently and accurately performing a frequency adjustment.SOLUTION: A manufacturing method of a vibrator includes: a mounting step of mounting a vibration element 2 having a weight portion 5 on a base 91; a lid bonding step of bonding a lid 92 to the base 91 and forming an accommodation space S for accommodating the vibration element 2 by the base 91 and the lid 92; and an adjustment step of irradiating a laser beam LL to the weight portion 5 via the lid 92 and sucking a weight material B removed while adjusting a resonant frequency of the vibration element 2 by removing at least a part of the weight portion 5.

Description

  The present invention relates to a method for manufacturing a vibrator.

Conventionally, a vibration element using quartz is known. Such a vibration element is widely used as a reference frequency source, a transmission source, and the like of various electronic devices because of excellent frequency temperature characteristics. As a method for adjusting the frequency of such a vibration element, for example, a method as disclosed in Patent Document 1 is known.
The frequency adjustment method described in Patent Document 1 is a method performed in a state where the vibration element is housed in a package. More specifically, weight portions (metal films) are provided on both surfaces of the distal end portion of the vibration arm included in the vibration element. Further, the lid of the package can transmit laser light. Then, the frequency of the vibration element is adjusted by irradiating the weight part with laser light through the lid and removing at least a part of the weight part provided on both surfaces of the vibration arm to reduce the mass of the vibration arm. It is a method to do. However, such a frequency adjustment method has the following problems.

  In the frequency adjusting method described in Patent Document 1, since the weight portion is removed after sealing the package, the weight material evaporated by laser irradiation is scattered and attached to the inner surface of the lid. Furthermore, the weight material adhering to the inner surface of the lid is evaporated again by the heat of the laser irradiated through the lid, and the evaporated weight material is scattered and adheres to the lid-side weight portion again. As described above, in the frequency adjustment method described in Patent Document 1, since a part of the weight removed with great effort is reattached, the efficiency of the frequency adjustment is poor and the accuracy of the frequency adjustment is also poor.

JP 2009-207186 A

  An object of the present invention is to provide a method of manufacturing a vibrator that can perform frequency adjustment efficiently and accurately.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
[Application Example 1]
The manufacturing method of the vibrator of this application example includes a mounting step of mounting a vibration element having a weight portion on a base,
An adjustment step of adjusting the resonance frequency of the vibration element by removing at least a part of the weight portion by irradiating energy rays, and sucking debris generated by the removal,
A lid joining step of joining a lid to the base and forming an accommodation space for accommodating the vibration element by the base and the lid;
It is characterized by including.
Thereby, since reattachment of the removed weight material to the vibration element is reduced, the frequency can be adjusted efficiently and accurately.

[Application Example 2]
The manufacturing method of the vibrator of this application example includes a mounting step of mounting a vibration element having a weight portion on a base,
A lid joining step of joining a lid to the base and forming an accommodation space for accommodating the vibration element by the base and the lid;
Adjustment that irradiates the weight part through the lid body with energy rays, adjusts the resonance frequency of the vibration element by removing at least a part of the weight part, and sucks debris generated by the removal Process,
It is characterized by including.
Thereby, since reattachment of the removed weight material to the vibration element is reduced, the frequency can be adjusted efficiently and accurately.

[Application Example 3]
In the method for manufacturing a vibrator according to this application example, it is preferable that the lid includes a transparent region.
Thereby, irradiation of energy rays through the lid can be performed efficiently.
[Application Example 4]
In the method for manufacturing a vibrator according to this application example, the adjustment step includes:
It is preferable to carry out under reduced pressure.
Thereby, the reattachment of the removed weight material to the vibration element can be more effectively reduced.

[Application Example 5]
In the method for manufacturing a vibrator according to this application example, the base substrate is provided with a through-hole penetrating in the thickness direction,
It is preferable that the said adjustment process attracts | sucks the said waste through the said through-hole.
This through-hole is a through-hole for vacuum-sealing an internal space of the package formed by the base and the lid (accommodating space for accommodating the vibration element). By using this through hole, the removed weight member can be sucked easily.

[Application Example 6]
In the method for manufacturing a vibrator according to this application example, the vibration element is
The base,
A vibrating arm extending from the base in plan view and provided with a weight;
Including
The length of the vibration element along the extending direction is L1,
When the length along the extending direction between the through hole and the removed portion of the weight portion is L2 in a plan view,
0 ≦ L2 / L1 ≦ 0.5
It is preferable to satisfy the following relationship.
Thereby, the removed weight material can be sucked more effectively.

[Application Example 7]
In the method for manufacturing a vibrator according to this application example, after the adjustment step,
It is preferable to include a sealing step for sealing the through hole.
Thereby, the internal space (accommodating space for accommodating the vibration element) of the package formed by the base and the lid can be maintained in a desired environment (for example, in a vacuum state).

It is a top view of the vibrator manufactured by the vibrator manufacturing method of the present invention. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is sectional drawing which shows the vibrating arm formed by wet etching. It is sectional drawing which shows a weight part. It is sectional drawing which illustrates the specific structure of the weight part shown in FIG. FIG. 7 is a cross-sectional view illustrating a method for manufacturing the vibrator shown in FIG. 1. FIG. 7 is a cross-sectional view illustrating a method for manufacturing the vibrator shown in FIG. 1. FIG. 7 is a cross-sectional view illustrating a method for manufacturing the vibrator shown in FIG. 1. FIG. 7 is a cross-sectional view illustrating a method for manufacturing the vibrator shown in FIG. 1. FIG. 7 is a cross-sectional view illustrating a method for manufacturing the vibrator shown in FIG. 1. It is a top view for demonstrating the position of a through-hole. It is a top view for demonstrating the position of a through-hole. It is sectional drawing which shows suitable embodiment of an oscillator. It is sectional drawing which shows suitable embodiment of a physical quantity sensor. FIG. 11 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic device is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device is applied. It is a perspective view which shows the structure of the digital still camera to which an electronic device is applied. It is a perspective view which shows the motor vehicle which applied the mobile body.

Hereinafter, a method for manufacturing a vibrator according to the present invention will be described in detail based on a preferred embodiment shown in the drawings.
1. Method for Manufacturing Vibrator <First Embodiment>
FIG. 1 is a plan view of a vibrator manufactured by the vibrator manufacturing method of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a cross-sectional view showing a vibrating arm formed by wet etching. FIG. 5 is a cross-sectional view showing the weight portion. FIG. 6 is a cross-sectional view illustrating a specific configuration of the weight portion illustrated in FIG. 5. 7 to 11 are cross-sectional views illustrating a method for manufacturing the vibrator shown in FIG. 12 and 13 are plan views for explaining the positions of the through holes, respectively. In the following, for convenience of explanation, the upper side in FIG. 2 is “upper” and the lower side is “lower”. Further, the upper side in FIG. 1 is referred to as “tip”, and the lower side is referred to as “base end”.
The vibrator 1 shown in FIG. 1 includes a vibration element 2 and a package 9 that houses the vibration element 2.

−Package−
As shown in FIGS. 1 and 2, the package 9 includes a box-shaped base 91 having a recess 911 that opens to the upper surface, and a plate-shaped lid 92 that closes the opening of the recess 911 and is joined to the base 91. Have. The package 9 has an accommodation space S formed by closing the recess 911 with the lid 92, and the vibration element 2 is accommodated in the accommodation space S in an airtight manner. The atmosphere in the accommodation space S is not particularly limited, but is preferably in a reduced pressure state (vacuum state). Thereby, since the air resistance with respect to the drive of the vibration element 2 is reduced, excellent vibration characteristics can be exhibited. The degree of vacuum in the accommodation space S is not particularly limited, but is preferably about 100 Pa or less, and more preferably about 10 Pa or less. Further, in the accommodation space S, an inert gas such as nitrogen, helium, or argon may be sealed. The base 91 and the lid 92 can be bonded via, for example, a low-melting glass, various adhesives, a metallized layer, or the like.

  The base 91 is formed with a through hole (sealing hole) 912 that penetrates the bottom surface and the lower surface of the recess 911, and the through hole 912 is hermetically sealed by the sealing material 6. . The through hole 912 is a hole used to make the inside of the accommodation space S in a reduced pressure state. The constituent material of the base 91 is not particularly limited, but various ceramics such as aluminum oxide, various glass materials such as borosilicate glass, quartz glass, and alkali-free glass, and single crystals such as quartz are used. it can.

Further, the lid 92 has a transparency that allows the laser beam LL (energy beam) to pass therethrough. The material of the lid 92 is not particularly limited as long as it can transmit the laser beam LL. For example, various types of glass materials such as borosilicate glass, quartz glass, and alkali-free glass, and transparent materials such as quartz are used. A single crystal can be used. Thereby, the lid 92 which is substantially colorless and transparent and has a high laser transmittance can be obtained.
In the present embodiment, the lid 92 can transmit the laser beam LL (energy beam), and the laser beam LL is irradiated from the lid 92 side. However, the base 91 is made of borosilicate glass, quartz glass, or nothing. In the case of using various glass materials such as Alri glass or a transparent single crystal such as quartz, the base 91 can transmit the laser light LL, and therefore the laser light LL may be irradiated from the base 91 side. .

  In addition, connection terminals 951 and 961 are formed on the bottom surface of the recess 911 of the base 91. Further, the conductive adhesive 11 is provided on the connection terminal 951, and the conductive adhesive 12 is provided on the connection terminal 961. The vibration element 2 is fixed to the base 91 by the conductive adhesives 11 and 12, the connection terminal 951 is electrically connected to a first drive electrode 84 described later, and the connection terminal 961 is a second drive described later. The electrode 85 is electrically connected.

  The conductive adhesives 11 and 12 are not particularly limited as long as they have conductivity and adhesiveness. For example, epoxy-based, acrylic-based, silicon-based, polyimide-based, bismaleimide-based, polyester-based Further, a conductive adhesive in which a conductive filler such as silver particles is mixed with polyurethane resin can be used. Thus, by using a relatively soft adhesive, for example, the thermal stress generated due to the difference in thermal expansion coefficient between the base 91 and the vibration element 2 can be absorbed and relaxed by the conductive adhesives 11 and 12. A reduction or change in the vibration characteristics of the vibration element 2 can be reduced. If the vibration element 2 can be fixed to the base 91, gold bumps, solder, or the like may be used instead of the conductive adhesives 11 and 12.

  The connection terminal 951 is electrically connected to an external terminal 953 provided on the lower surface of the base 91 through a through electrode 952 that penetrates the bottom of the base 91. Similarly, the connection terminal 961 is connected to the bottom of the base 91. Is electrically connected to an external terminal 963 provided on the lower surface of the base 91 through a through electrode 962 penetrating through the base 91. The configurations of the connection terminals 951 and 961, the through electrodes 952 and 963, and the external terminals 953 and 963 are not particularly limited as long as they have electrical conductivity. For example, Cr (chromium), Ni (nickel), A plating layer such as Au (gold), Ag (silver), or Cu (copper) may be formed on a base layer such as W (tungsten) or molybdenum (Mo).

-Vibration element-
As shown in FIGS. 1 to 3, the resonator element 2 includes a crystal vibrating piece (vibrating piece) 3, first and second driving electrodes 84 and 85 provided on the crystal vibrating piece 3, and a crystal vibrating piece. 3 and a weight portion 5 provided on 3. In FIGS. 1 and 2, the first and second drive electrodes 84 and 85 and the weight portion 5 are not shown for convenience of explanation.

  The crystal vibrating piece 3 is composed of a Z-cut crystal plate. A Z-cut quartz plate is a quartz substrate whose Z-axis is approximately the thickness direction. In addition, although the thickness direction of the quartz crystal vibrating piece 3 may coincide with the Z axis, the Z axis is slightly inclined with respect to the thickness direction from the viewpoint of reducing the frequency temperature change in the vicinity of normal temperature. May be. When the angle of inclination is θ degrees (−5 ° ≦ θ ≦ 15 °), the X of the orthogonal coordinate system including the X axis as the electric axis of the crystal, the Y axis as the mechanical axis, and the Z axis as the optical axis. With the axis as the rotation axis, the Z-axis is tilted by θ degrees so that the + Z side rotates in the −Y direction of the Y axis, the Z ′ axis, and the Y axis rotates in the + Z direction of the Z axis. When the axis tilted at θ degrees is the Y ′ axis, the thickness along the Z ′ axis is the thickness, and the crystal vibrating piece 3 has a main surface that includes the X axis and the Y ′ axis. In each figure, the X axis, the Y axis, and the Z axis are illustrated as the case of θ = 0 °.

  The crystal vibrating piece 3 has the Y-axis direction in the length direction, the X-axis direction in the width direction, and the Z-axis direction in the thickness direction. Further, the crystal vibrating piece 3 has substantially the same thickness over almost the entire region (except for a region where grooves 323, 324, 333, and 334 described later are formed). The thickness T of the crystal vibrating piece 3 is not particularly limited, but is preferably about 60 μm or more and 300 μm or less. As a result, as described later, the area of the first and second drive electrodes 84 and 85 disposed on the side surfaces of the vibrating arms 32 and 33 can be sufficiently widened, so that the CI value can be sufficiently reduced. Can do. In addition, since the heat transmission path between the side surfaces of the vibrating arms 32 and 33 can be secured sufficiently long, the thermoelastic loss can be sufficiently reduced in the adiabatic region. In addition, when the acceleration (impact) in the thickness direction (Z-axis direction) is applied to the vibrator 1 if it is less than the above lower limit value, the crystal vibrating piece 3 is greatly bent, so that the bending vibrating arm 32, 33 is easy to contact the base 91 and the lid 92, and since the speed at the time of contact is high, there is a possibility that the impact will be great and the vibrating arms 32 and 33 may be damaged. It becomes difficult to create the shape, which leads to excessive enlargement of the vibration element 2.

  Such a crystal vibrating piece 3 is arranged on the base 31, a pair of vibrating arms 32 and 33 extending in the + Y-axis direction from the + Y-axis side end (one end) of the base 31, and the −Y-axis side of the base 31. And a connecting portion 35 that is located between the base portion 31 and the connecting portion 34 and connects the base portion 31 and the connecting portion 34 to each other. The base 31, the vibrating arms 32 and 33, the connecting portion 34, and the connecting portion 35 are integrally formed from a quartz substrate.

The base 31 has a plate shape having a spread in the XY plane and having a thickness in the Z-axis direction. A connecting portion 35 extends in the −Y axis direction from the end of the base portion 31 on the −Y axis side (the other end side). A connecting portion 34 is connected to the end of the connecting portion 35 on the −Y axis side, and the connecting portion 34 extends from the connecting portion 35 to both sides in the X-axis direction.
In such a vibration element 2, the connection portion 34 is attached to the base 91 by the conductive adhesives 11 and 12. Thus, by using the two conductive adhesives 11 and 12, the vibration element 2 can be attached to the base 91 in a stable state.

  Here, the connecting portion 35 is smaller in width than the base portion 31. In other words, the connecting portion 35 is contracted with respect to the base portion 31. In addition, the connecting portion 35 is partially reduced in width in the width direction of the base portion 31 at both side edges at a position sufficiently away from the end of the base portion 31 on the vibrating arms 32 and 33 side (+ Y axis side). It can also be said that it is formed by forming the formed cut portions 31a and 31b. By providing such a connecting portion 35, it is possible to suppress propagation of vibration leakage to the connecting portion 34 when the vibrating arms 32 and 33 bend and vibrate, and to reduce the CI value of the vibration element 2. That is, by providing the connecting portion 35, the vibration element 2 having excellent vibration characteristics is obtained.

  In particular, in the present embodiment, a reduced width portion 311 is provided at the end portion of the base portion 31 on the −Y axis side. The reduced width portion 311 has a width (length in the X-axis direction) along the center line Ly (Y-axis) between the vibrating arms 32 and 33 toward the −Y-axis side (+ Y of the base portion 31). It decreases continuously (as it goes away from the shaft end). Further, the reduced width portion 311 is provided symmetrically with respect to the center line Ly. By providing such a reduced width portion 311, displacement (vibration) in the Y-axis direction of the base portion 31 due to bending vibration of the vibrating arms 32 and 33 can be suppressed. As a result, the vibration element 2 with small vibration leakage can be obtained. Furthermore, by providing the reduced width portion 311, compared to the case where the reduced width portion 311 is not provided, the + Y-axis side end of the base portion 31 sandwiched between the vibrating arms 32 and 33 and the cut portion 31 a (or the cut portion). 31b) and the connecting portion 35, the distance between the ends on the −Y-axis side of the reduced width portion 311 can be increased. For this reason, when the vibration element 2 performs bending vibration, the path of heat transfer generated between them becomes long, and accordingly, the thermoelastic loss can be reduced. For example, when the two vibrating arms 32 and 33 are bent and deformed in a plane (in the XY plane) so as to be separated from each other, the end on the + Y-axis side of the base 31 sandwiched between the vibrating arms 32 and 33 is accordingly Since the temperature is lowered due to the expansion, the end on the −Y-axis side of the reduced width portion 311 adjacent to the cut portion 31a (or the cut portion 31b) and the connecting portion 35 is compressed and thus the temperature rises. The heat moves from the region where the temperature has increased to the region where the temperature has decreased. Further, when the vibrating arms 32 and 33 are bent and deformed in a plane so as to approach each other, the above-described region where the temperature rises and the region where the temperature decreases are switched, and the heat moves in the opposite direction. Thermoelastic loss occurs due to heat moving alternately at a predetermined cycle due to bending vibration, and in the adiabatic region to be described later, the longer the heat transfer path, the smaller the loss, so the above-mentioned effect is obtained. It is done.

  In the present embodiment, the outline of the reduced width portion 311 has an arch shape, but the present invention is not limited to this as long as it exhibits the above-described action. For example, the outline of the reduced width portion 311 is formed in a step shape by a plurality of straight lines, that is, the width (length in the X-axis direction) is stepped toward the −Y-axis side along the center line Ly. The outline of the reduced width portion 311 may be formed by imitating an arch shape by a plurality of straight lines.

The vibrating arms 32 and 33 are aligned in the X-axis direction and extend in the + Y-axis direction from the + Y-axis side end of the base 31 so as to be parallel to each other. Each of the vibrating arms 32 and 33 has a longitudinal shape, and a base end (end on the −Y axis side) is a fixed end, and a tip end (end on the + Y axis side) is a free end.
In addition, the vibrating arms 32 and 33 are respectively positioned as arm portions 321 and 331 extending from the base portion 31 and the weight portions that are positioned on the distal end sides of the arm portions 321 and 331 and wider than the arm portions 321 and 331. Hammer heads (wide portions) 322 and 332. As described above, by providing the hammer heads 322 and 332 at the distal ends of the vibrating arms 32 and 33, the vibrating arms 32 and 33 can be shortened, and the vibration element 2 can be downsized. In addition, since the vibration arms 32 and 33 can be shortened, the vibration speed of the vibration arms 32 and 33 when the vibration arms 32 and 33 are vibrated at the same frequency can be reduced as compared with the conventional case. The air resistance when 32 and 33 vibrate can be reduced, the Q value is increased correspondingly, and the vibration characteristics can be improved. Further, when the predetermined length (the length in the Y-axis direction) and the predetermined vibration frequency are fixed, the arm portion is arranged so as to restore the vibration frequency that is lowered by providing the hammer heads 322 and 332. Since the width (length in the X-axis direction) of 321 and 331 can be increased, the movement path of heat generated by bending vibration can be lengthened, so that thermoelastic loss is reduced in the adiabatic region described later. Therefore, the Q value is increased correspondingly, and the vibration characteristics can be improved.

  Here, the separation distance W7 between the hammer heads 322 and 333 is not particularly limited. For example, 0.033T (μm) ≦ W7 ≦ 0.33T (with respect to the thickness T (μm) of the crystal vibrating piece 3) It is preferable that the relationship (μm) is satisfied. Thus, when the crystal vibrating piece 3 is formed using the photolithography technique and the wet etching technique, the separation distance W7 between the hammer heads 322 and 332 and the thickness of the vibrating arms 32 and 33 (hammer heads 322 and 332). The relationship with the thickness T is optimized, and as a result, the quartz crystal resonator element 3 that is ultra-small is formed.

Hereinafter, the vibrating arms 32 and 33 will be described in detail. Since the vibrating arms 32 and 33 have the same configuration, the vibrating arm 32 will be described below as a representative, and the vibrating arm 33 will be described. Omitted.
As shown in FIG. 3, the arm portion 321 is configured by an XY plane and has a pair of main surfaces 32 a and 32 b and a YZ plane that are in a front-back relationship with each other, and connects the pair of main surfaces 32 a and 32 b. A pair of side surfaces 32c and 32d. The arm portion 321 includes a bottomed groove 323 that opens to the main surface 32a and a bottomed groove 324 that opens to the main surface 32b. Thus, by forming the grooves 323 and 324 in the vibrating arm 32, it is possible to reduce the thermoelastic loss and to exhibit excellent vibration characteristics. The lengths of the grooves 323 and 324 are not particularly limited, and the distal ends may extend to the hammer head 322, and the proximal ends may extend to the base 31. With such a configuration, the stress concentration on the boundary between the arm 321 and the hammer head 322 and the boundary between the arm 321 and the base 31 is alleviated, and there is a risk of bending or chipping that occurs when an impact is applied. Decrease. In addition, the groove | channel may be provided only in either one of main surface 32a, 32b, and may be abbreviate | omitted.

  The depth t of the grooves 323 and 324 preferably satisfies the relationship 0.292 ≦ t / T ≦ 0.483. By satisfying such a relationship, the heat transfer path becomes longer, so that the thermoelastic loss can be more effectively reduced. The depth t more preferably satisfies the relationship of 0.455 ≦ t / T ≦ 0.483. By satisfying such a relationship, it is possible to reduce the thermoelastic loss by further increasing the heat transfer path. Therefore, the Q value is improved and the CI value is reduced accordingly. The CI value can be reduced by making the electrode area for applying an electric field larger.

  When the quartz crystal vibrating piece 3 is manufactured by patterning the quartz substrate by wet etching, the cross-sectional shape of the arm portion 321 is such that the crystal plane of the quartz is exposed as shown in FIG. Specifically, since the etching rate in the −X-axis direction is lower than the etching rate in the + X-axis direction, the side surface in the −X-axis direction has a relatively gentle slope, and the side surface in the + X-axis direction has a slope that is nearly vertical. . In this case, the depth t of the grooves 323 and 324 is the depth at the deepest position as shown in FIG. Here, as shown in FIG. 4, the grooves 323 and 324 preferably have bottom surfaces 323 a and 324 a configured by an XY plane. As a result, the heat transfer path can be made longer, and the thermoelastic loss can be effectively reduced in the adiabatic region.

  The grooves 323 and 324 are preferably formed by adjusting the position in the X-axis direction with respect to the vibrating arm 32 so that the cross-sectional center of gravity of the vibrating arm 32 coincides with the center of the cross-sectional shape of the vibrating arm 32. By doing so, unnecessary vibration of the vibrating arm 32 (specifically, vibration having an out-of-plane direction component) is reduced, so that vibration leakage can be reduced. Further, in this case, since driving of extra vibration is reduced, the driving range is relatively increased, and the equivalent series resistance (CI value) can be reduced.

  The width (length in the X-axis direction) W4 of the arm portion 321 is not particularly limited, but is preferably about 13 μm to 300 μm, and more preferably about 30 μm to 150 μm. If the width W4 is less than the above lower limit value, it may be difficult to form the grooves 323 and 324 in the arm portion 321 depending on the manufacturing technique, and the vibration arm is in the range of the vibration frequency of 32.768 kHz ± 1 kHz. 32 may not be a heat insulating region, and the formation of the grooves 323 and 324 may increase the thermoelastic loss. On the other hand, when the width W4 exceeds the upper limit, depending on the thickness T of the crystal vibrating piece 3, the arm portion 321 becomes too rigid, and the arm portion is reduced along with a decrease in excitation power due to low power consumption. 321 bending vibration may not be performed smoothly. Further, since the vibrating arm 32 becomes heavy, the fixing strength by the conductive adhesives 11 and 12 is insufficient, and the vibrating element 2 may fall off the base 91 when an impact is applied. Note that the width W4 referred to here is the width of the portion located at the central portion of the arm portion 321 and extending at a substantially constant width, and is not the width of the tapered portion located at both ends.

  Further, when the total length (length in the Y-axis direction) of the vibrating arm 32 is L1, and the total length (length in the Y-axis direction) of the hammer head 322 is H, 0.183 ≦ H / L1 ≦ 0.597. It is preferable to satisfy the relationship, and it is more preferable to satisfy the relationship 0.238 ≦ H / L1 ≦ 0.531. Thereby, the vibration element 2 that achieves both miniaturization and improvement of vibration characteristics is obtained. Furthermore, since the area of the hammer head 322 can be sufficiently secured, the weight portion 5 having a sufficient mass can be disposed on the hammer head 322.

  Further, the width (length in the X-axis direction) W5 of the hammer head 322 is not particularly limited, but is preferably about 1.5 to 10 times the width W4 of the arm portion 321. That is, it is preferable to satisfy the relationship of 1.5W4 ≦ W5 ≦ 10W4. Thereby, the width of the hammer head 322 can be secured sufficiently wide. Therefore, even if the length H of the hammer head 322 is relatively short, the mass effect by the hammer head 322 can be sufficiently exhibited. Therefore, the total length L of the vibrating arm 32 is suppressed, and the size of the vibrating element 2 can be reduced. Furthermore, since the area of the hammer head 322 can be sufficiently secured, the weight portion 5 having a sufficient mass can be disposed on the hammer head 322. Further, since the bending vibration is not pure in-plane vibration, if W5 is too wide, the hammer head 322 may be greatly twisted when the vibrating arm 32 bends and vibrates, and vibration leakage may increase. can do.

<< First and second driving electrodes >>
As shown in FIG. 3, a pair of first driving electrodes 84 and a pair of second driving electrodes 85 are formed on the vibrating arm 32 of the crystal vibrating piece 3. One of the first drive electrodes 84 is formed on the inner surface of the groove 323, and the other is formed on the inner surface of the groove 324. One of the second drive electrodes 85 is formed on the side surface 32c, and the other is formed on the side surface 32d. Similarly, a pair of first drive electrodes 84 and a pair of second drive electrodes 85 are also formed on the vibrating arm 33. One of the first drive electrodes 84 is formed on the side surface 33c, and the other is formed on the side surface 33d. One of the second drive electrodes 85 is formed on the inner surface of the groove 333, and the other is formed on the inner surface of the groove 334.

Each first drive electrode 84 is drawn to a connection electrode 86 provided on the lower surface of the connection portion 34 by a wiring (not shown), and is electrically connected to the connection terminal 951 through the conductive adhesive 11 at the connection electrode 86. It is connected to the. Similarly, each second driving electrode 85 is drawn to a connection electrode 87 provided on the lower surface of the connection portion 34 by a wiring (not shown), and the connection electrode 96 is connected to the connection terminal 961 via the conductive adhesive 12. And are electrically connected. When an alternating voltage is applied between the first and second drive electrodes 84 and 85, X is a flexural vibration mode in which the X-axis direction is mainly displaced so that the vibrating arms 32 and 33 repeat approaching and separating from each other. Vibrates in reverse phase mode.
The constituent material of the first and second driving electrodes 84 and 85 is not particularly limited as long as it has conductivity. For example, Cr (chromium), Ni (nickel), W (tungsten), molybdenum ( A coating layer of Au (gold), Ag (silver), Cu (copper), or the like can be formed on a base layer such as Mo).

  As a specific configuration of the first and second driving electrodes 84 and 85, for example, a configuration in which an Au layer of 700 mm or less is formed on a Cr layer of 700 mm or less can be used. In particular, since Cr and Au have a large thermoelastic loss, the Cr layer and the Au layer are preferably 200 mm or less. In order to increase the dielectric breakdown resistance, the Cr layer and the Au layer are preferably 1000 mm or more. Furthermore, since Ni has a thermal expansion coefficient close to that of quartz, by using a Ni layer as a base instead of a Cr layer, a thermal element caused by an electrode can be reduced, and a vibration element with good long-term reliability (aging characteristics) can be obtained. Can be obtained.

-Weight part-
Weight portions 5 are provided on the hammer heads 322 and 332 of the vibrating arms 32 and 33, respectively. The weight portion 5 is used to adjust the resonance frequency of the vibration element 2. Since the configuration of the weight portion 5 is the same for the vibrating arms 32 and 33, the weight portion 5 provided on the vibrating arm 32 will be described below as a representative, and is provided on the vibrating arm 33. The description of the weight portion 5 is omitted.

  As shown in FIG. 5, the weight 5 is provided on both main surfaces 32 a and 32 b of the hammer head 322. The configuration of the weight portion 5 is not particularly limited, but in the present embodiment, the first weight layer 5A, the second weight layer 5B, and the third weight layer 5C are stacked from both the main surfaces 32a and 32b of the hammer head 322. It is composed of a laminate. A method for forming the first, second, and third weight layers 5A, 5B, and 5C is not particularly limited, and for example, a sputtering method, a vapor deposition method, or the like can be used. In the present embodiment, the first weight layer 5A and the second weight layer 5B are formed by sputtering, and the third weight layer 5C is formed by vapor deposition.

  Since the film is formed in a high vacuum state when the film is formed by the vapor deposition method, the film formed by the vapor deposition method is more outgas generated when being removed by irradiation with the laser beam LL than the film formed by the sputtering method. The amount of (degas) is small. Therefore, as will be described later, when the resonance frequency of the vibration element 2 is adjusted in a state of being accommodated in the package 9, it is possible to reduce a decrease in the degree of vacuum of the package accommodation space S due to outgas. Similar to the third weight layer 5C, if the first and second weight layers 5A and 5B are also formed by the vapor deposition method, the above-described effect is further improved. However, the first weight layer is formed on the surface of the crystal vibrating piece 3 by the vapor deposition method. In the case of forming 5A, it takes more time for the process than the sputtering method, and generally the film thickness accuracy is low. Therefore, in view of ease of formation, the first weight layer 5A is formed by sputtering in this embodiment.

  Here, as a specific configuration of the first, second, and third weight layers 5A, 5B, and 5C, as shown in FIG. 6, for example, the first weight layer 5A is formed of Cr (chromium) and formed by sputtering. A first weight layer 5A, a second weight layer 5B made of Au (gold) and formed by sputtering, and a third weight made of Au (gold) and made of vapor deposition by using this as a base layer. The layer 5C may be stacked. In this case, although not particularly limited, the thickness of the first weight layer 5A is preferably about 200 to 700 mm, for example, and the thickness of the second weight layer 5B is about 400 to 1200 mm, for example. The thickness of the third weight layer 5C is preferably, for example, about 1 μm to 3 μm. With such a configuration, the first weight layer 5A can be formed of the same layer as the base layer of the first and second drive electrodes 84 and 85, and the second weight layer 5B is formed in the first and second drive layers. It can be formed of the same layer as the covering layer of the electrodes 84 and 85 for use. However, the configuration of the weight portion 5 is not limited to the above-described configuration. For example, the second weight layer 5B of the first, second, and third weight layers 5A, 5B, and 5C may be omitted. The third weight layer 5C may be omitted.

≪Method of manufacturing vibrator≫
Next, a method for manufacturing the above-described vibrator 1 will be described with reference to FIGS. In the following, for convenience of explanation, the case where the weight portion 5 provided on the vibrating arm 32 is removed will be described as a representative. However, the weight portion 5 provided on the vibrating arm 33 is also removed in the same manner. .
The method for manufacturing the vibrator 1 includes a rough adjustment process for coarsely adjusting the resonance frequency of the vibration element 2 before mounting on the base 91, a mounting process for mounting the vibration element 2 on the base 91, and a lid 92 on the base 91. A lid joining step in which the accommodation space S is formed by the base 91 and the lid 92, an adjustment step in which the resonance frequency of the vibration element 2 is adjusted by removing at least a part of the weight 5, and a through hole 912. And a sealing step for sealing. The adjustment process includes a first adjustment process and a second adjustment process.

-Coarse adjustment process-
First, in a state where the vibration element 2 is driven, as shown in FIG. 7, the tip side of the weight part 5 is irradiated with the laser light LL, and a part of the weight part 5 is removed. Thereby, the resonance frequency of the vibration element 2 is roughly adjusted to the target value. That is, rough adjustment is performed. Since the front end side of the weight portion 5 has a large ratio of frequency change with respect to the irradiation time of the laser light LL (the removal amount of the weight portion), the resonance frequency can be adjusted more efficiently. In FIG. 7, the laser beam LL is irradiated from the main surface 32 b side of the hammer head 322, but conversely, the laser beam LL may be irradiated from the main surface 32 a side of the hammer head 322. Further, this step can be performed in a state where the vibration element 2 is held on the wafer. That is, it can be performed before the vibration element 2 is folded from the wafer. Moreover, this process may be performed in the state exposed to air | atmosphere, and may be performed in the state reduced pressure. In particular, in the former case, the resonance frequency shifts due to air resistance, but the resonance frequency can be adjusted more easily.

-Mounting process and lid bonding process-
Next, the coarsely tuned vibration element 2 is fixed to the base 91 via the conductive adhesives 11 and 12, and then the lid 92 is joined to the base 91 as shown in FIG. In this state, the accommodation space S of the package 9 communicates with the outside through the through hole 912. As described above, the lid 92 is configured to transmit the laser beam LL. Thereby, the laser beam LL can be irradiated to the weight part 5 through the lid 92 in the next adjustment step.

-1st adjustment process (adjustment process)-
Next, while the vibration element 2 is driven, the weight 5 is irradiated with the laser beam LL through the lid 92 while sucking the accommodation space S through the through hole 912 as shown in FIG. At least a part of the weight part 5 is removed. At this time, it is preferable that the region irradiated with the laser beam LL is located on the base end side with respect to the region irradiated with the laser beam LL in the above-described coarse adjustment step. Thereby, the ratio of the frequency change with respect to the irradiation time (the removal amount of the weight portion) of the laser light LL is smaller than that in the coarse adjustment step. By such a first adjustment step, the resonance frequency of the vibration element 2 is further adjusted to the target value. In this way, the weight portion 5 can be easily removed by irradiating the weight portion 5 with the laser light LL via the lid 92.

  The weight material B as waste generated by being removed from the weight portion 5 is sucked through the through hole 912. That is, it is excluded to the outside through the through hole 912. Therefore, the scattered weight material B is prevented from going around the vibration element 2 and adhering to the inner surface of the lid 92. As a result, as described in the background art described above, it is possible to effectively suppress the weight material B adhering to the inner surface of the lid 92 from being evaporated by the laser light LL and adhering to the vibrating arm 32 again. . Further, it is possible to effectively suppress the scattered weight material B from reattaching to the vibrating arm 32 as it is. Therefore, according to this process, frequency adjustment can be performed efficiently and accurately.

-Second adjustment step (adjustment step)-
Next, with the vibration element 2 driven, the laser beam LL is irradiated from the lid 92 side toward the weight portion 5 while sucking the accommodation space S through the through hole 912 as shown in FIG. Then, at least a part of the weight part 5 is removed. At this time, it is preferable that the region irradiated with the laser beam LL is located on the proximal end side with respect to the region irradiated with the laser beam LL in the first adjustment step described above. Thereby, the ratio of the frequency change with respect to the irradiation time of the laser beam LL (the removal amount of the weight portion) is smaller than that in the first adjustment step. By such a second adjustment step, the resonance frequency of the vibration element 2 is further matched with the target value, and preferably matched. Moreover, it is preferable that the weight part irradiated with the laser beam LL in the second adjustment process is thinner than the weight part irradiated in the above-described coarse adjustment process or the first adjustment process. Thereby, the ratio of the frequency change with respect to the irradiation time (the removal amount of the weight portion) of the laser light LL becomes smaller than the coarse adjustment step and the first adjustment step, and the frequency adjustment with high accuracy is possible.

  The weight material B ′ removed from the weight portion 5 is sucked through the through hole 912. That is, it is excluded to the outside through the through hole 912. For this reason, the scattered weight material B ′ is prevented from flowing around the vibration element 2 and adhering to the inner surface of the lid 92. As a result, it is possible to effectively suppress the weight material B ′ adhering to the inner surface of the lid 92 from being scattered by the laser light LL and adhering to the vibrating arm 32 again. Further, it is possible to effectively suppress the scattered weight material B ′ from adhering to the vibrating arm 32 as it is. Therefore, according to this process, frequency adjustment can be performed efficiently and accurately.

-Sealing process-
Next, as shown in FIG. 11, after the accommodation space S of the package 9 is in a vacuum state, the through hole 912 is sealed with a metal material such as an Au—Ge alloy.
Thus, the vibrator 1 is obtained. According to such a manufacturing method, since the reattachment of the weight materials B and B ′ once removed to the vibrating arm 32 can be reduced, the resonance frequency of the vibrating element 2 can be adjusted efficiently and accurately. Can do. Further, since the reattachment of the weight materials B and B ′ to the vibrating arm 32 can be reduced, the weight materials B and B ′ are not peeled off from the vibrating arm 32 and the resonance frequency is maintained over time. Can do. Moreover, since the accommodation space S is sealed after the outgas generated when removing the weight portion 5 is removed, the accommodation space S can have a high degree of vacuum and the Q value can be further increased.

  Here, it is preferable that the first and second adjustment processes (adjustment processes) described above be performed in a reduced pressure in the housing space S. Thereby, the highly reliable vibrator 1 is obtained. That is, if the weight 5 is removed by irradiating the laser beam LL in a state where the pressure is not reduced, the removed weight materials B and B ′ may become cotton-like foreign matters and adhere to the vibrating arm 32. This is because the weight materials B and B 'removed and evaporated immediately solidify due to the cooling effect of the atmosphere in a state where the pressure is not reduced. If such foreign matter adheres to the vibrating arm 32, the first and second drive electrodes 84 and 85 may be short-circuited, and the reliability may be reduced. Moreover, such a foreign substance is easily peeled off from the vibrating arm 32, and if it is peeled off from the vibrating arm 32, a frequency change accompanying a change in mass occurs. Further, the peeled foreign matter may collide with the vibration element 2 and damage the vibration element 2 in some cases. On the other hand, when the weight part 5 is removed by irradiating the laser beam LL in a decompressed state, the cooling effect of the atmosphere is reduced, and solidification of the removed weight materials B and B ′ can be suppressed. . Therefore, the foreign matter does not adhere to the vibrating arm 32 and is effectively removed through the through hole 912.

  Also, as shown in FIG. 12, in the second adjustment step, the irradiation position (removed part) of the laser beam LL onto the weight part 5 is P1, and in plan view (plan view seen from the Z-axis direction), When the distance between the central axis of the through-hole 912 and the position P1 along the Y-axis direction is L2, it is preferable that the relationship 0 ≦ L2 / L1 ≦ 0.5 is satisfied. Furthermore, in the first adjustment step, the irradiation position (the part to be removed) of the laser beam LL onto the weight portion 5 is P2, and the separation distance along the Y-axis direction between the central axis of the through hole 912 and the position P2 is L3. It is preferable that the relationship 0 ≦ L3 / L1 ≦ 0.5 is satisfied. Thereby, since the weight materials B and B ′ removed from the weight part 5 can be quickly removed outside the accommodation space S, the adhesion of the cotton-like foreign matter as described above is effectively suppressed. Can do.

In the present embodiment, the through hole 912 is located closer to the base end side (−Y axis side) of the vibrating arm 32 than the position P1, but the position of the through hole 912 is not particularly limited. As shown in FIG. 13, the vibration arm 32 may be located on the distal end side (+ Y axis side) of the position P. Thereby, in addition to the above effects, the weight materials B and B ′ can be removed without passing the vicinity of the grooves 323 and 324. Thereby, the adhesion of the foreign matter to the vicinity of the grooves 323 and 324 can be prevented, and a short circuit between the first and second drive electrodes 84 and 85 via the foreign matter can be effectively suppressed.
In this embodiment, the laser beam LL is used as the energy beam. However, the energy beam is not particularly limited as long as the weight portion 5 can be removed, and for example, an electron beam or the like may be used.

Second Embodiment
Hereinafter, the vibrator manufacturing method according to the second embodiment will be described focusing on differences from the vibrator manufacturing method according to the above-described embodiment, and description of similar matters will be omitted.
The vibrator manufacturing method of the present embodiment is the same as the vibrator manufacturing method of the first embodiment described above, except that the order of the lid bonding process is different.

  The manufacturing method of the vibrator 1 according to the present embodiment includes a rough adjustment step of coarsely adjusting the resonance frequency of the vibration element 2 before mounting on the base 91, a mounting step of mounting the vibration element 2 on the base 91, and the weight portion 5. An adjustment step of adjusting the resonance frequency of the vibration element 2 by removing at least a part of the above, a lid joining step of joining the lid 92 to the base 91 and forming the accommodation space S by the base 91 and the lid 92, and a penetration And a sealing step for sealing the hole 912. The adjustment process includes a first adjustment process and a second adjustment process.

-Coarse adjustment process-
Since it is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
-Mounting process-
Next, the coarsely tuned vibration element 2 is fixed to the base 91 via the conductive adhesives 11 and 12.

-1st adjustment process (adjustment process)-
Since it is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
In the case of the present embodiment, instead of sucking the weight material B through the through hole 912, for example, the weight material B may be sucked from the upper surface side (the side opposite to the through hole 912) of the base 91.
-Second adjustment step (adjustment step)-
Since it is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
In the case of the present embodiment, instead of sucking the weight material B ′ through the through hole 912, for example, the weight material B ′ may be sucked from the upper surface side (the side opposite to the through hole 912) of the base 91. .

-Lid bonding process-
Next, the lid 92 is joined to the base 91. In this state, the accommodation space S of the package 9 communicates with the outside through the through hole 912.
-Sealing process-
Since it is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
Thus, the vibrator 1 is obtained.
Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Hereinafter, the vibrator manufacturing method according to the third embodiment will be described focusing on differences from the vibrator manufacturing method according to the above-described embodiment, and description of similar matters will be omitted.
The method for manufacturing the vibrator of the present embodiment is the same as the method for manufacturing the vibrator of the first embodiment described above except that the order of the sealing steps is different.

The manufacturing method of the vibrator 1 according to the present embodiment includes a rough adjustment process for coarsely adjusting the resonance frequency of the vibration element 2 before mounting on the base 91, a mounting process for mounting the vibration element 2 on the base 91, A lid joining step of joining the lid 92 and forming the accommodation space S with the base 91 and the lid 92; a first adjustment step of adjusting the resonance frequency of the vibration element 2 by removing at least a part of the weight portion 5; The sealing step for sealing the through-hole 912 and the second adjustment step for adjusting the resonance frequency of the vibration element 2 by removing at least a part of the weight portion 5 are included. In addition, since the content of each process is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
According to such a manufacturing method, since the second adjustment step (fine adjustment step) can be performed while the vibration element 2 is in a vacuum state, the resonance frequency can be adjusted more accurately. Further, since the removal amount of the weight portion 5 in the package 9 is relatively small, the generation of outgas in the package 9 can be reduced.

<Fourth embodiment>
Hereinafter, the vibrator manufacturing method according to the fourth embodiment will be described focusing on differences from the vibrator manufacturing method according to the above-described embodiment, and description of similar matters will be omitted.
The method for manufacturing the vibrator of the present embodiment is the same as the method for manufacturing the vibrator of the first embodiment described above except that the order of the sealing steps is different.

The manufacturing method of the vibrator 1 according to the present embodiment includes a rough adjustment step of coarsely adjusting the resonance frequency of the vibration element 2 before mounting on the base 91, a mounting step of mounting the vibration element 2 on the base 91, and the weight portion 5. A first adjustment step of adjusting the resonance frequency of the vibration element 2 by removing at least a part of the above, a lid joining step of joining the lid 92 to the base 91 and forming the accommodation space S by the base 91 and the lid 92; The sealing step for sealing the through-hole 912 and the second adjustment step for adjusting the resonance frequency of the vibration element 2 by removing at least a part of the weight portion 5 are included. In addition, since the content of each process is the same as that of 1st Embodiment mentioned above, the description is abbreviate | omitted.
According to such a manufacturing method, since the lid 92 is joined and the through-hole 912 is sealed, the resonance frequency of the vibration element 2 fluctuates after the second adjustment step (fine adjustment step) performed thereafter. Basically does not exist. Therefore, the resonance frequency can be adjusted more accurately than in the second embodiment.

2. Oscillator Next, an oscillator including the vibrator 1 will be described.
FIG. 14 is a cross-sectional view showing a preferred embodiment of the oscillator. In FIG. 14, illustration of the first and second driving electrodes and the weight portion of the vibration element 2 is omitted for convenience of explanation.
An oscillator 100 illustrated in FIG. 14 includes a vibrator 1 and an IC chip 110 for driving the vibration element 2. Hereinafter, the oscillator 100 will be described with a focus on differences from the above-described vibrator, and description of similar matters will be omitted.

  As shown in FIG. 14, in the oscillator 100, the IC chip 110 is fixed to the recess 911 of the base 91. The IC chip 110 is electrically connected to a plurality of internal terminals 120 formed on the bottom surface of the recess 911. The plurality of internal terminals 120 include those connected to the connection terminals 951 and 961 and those connected to the external terminals 953 and 963. The IC chip 110 has an oscillation circuit (circuit) for controlling the driving of the vibration element 2. When the vibration element 2 is driven by the IC chip 110, a signal having a predetermined frequency can be extracted.

3. Physical Quantity Sensor Next, a physical quantity sensor including the vibrator 1 will be described.
FIG. 15 is a cross-sectional view showing a preferred embodiment of a physical quantity sensor. In FIG. 15, the first and second driving electrodes and the weight portion of the vibration element 2 are not shown for convenience of explanation.
A physical quantity sensor 200 shown in FIG. 15 is an angular velocity sensor (gyro sensor) that can detect an angular velocity around the Y axis, and includes a vibrator 1 and an IC chip 110 for driving the vibration element 2. Yes. Hereinafter, the physical quantity sensor 200 will be described focusing on differences from the vibrator described above, and description of similar matters will be omitted.

  As shown in FIG. 15, in the physical quantity sensor 200, the IC chip 210 is fixed to the recess 911 of the base 91. The IC chip 210 is electrically connected to a plurality of internal terminals 220 formed on the bottom surface of the recess 911. The plurality of internal terminals 220 include those connected to the connection terminals 951 and 961 and those connected to the external terminals 953 and 963. The IC chip 210 has an oscillation circuit (circuit) for controlling driving of the vibration element 2 and a detection circuit for detecting angular velocity.

In such a physical quantity sensor, when the vibrating arms 32 and 33 are excited and vibrated in the driving vibration mode which is the X anti-phase mode, if an angular velocity around the Y-axis is applied, the Z-axis anti-phase is applied to the vibrating arms 32 and 33. A detection vibration mode that is a mode is generated. The electrode voltage (the voltage between the first and second drive electrodes 84 and 85) is changed by this detection vibration mode, and the angular velocity can be detected based on this change.
The physical quantity sensor is not limited to the angular velocity sensor, and can be used for an acceleration sensor or a pressure sensor.

4). Next, an electronic device including the vibrator 1 will be described.
FIG. 16 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic device is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates a vibrator 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 17 is a perspective view illustrating a configuration of a mobile phone (including PHS) to which an electronic device is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates a vibrator 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 18 is a perspective view illustrating a configuration of a digital still camera to which an electronic device is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a vibrator 1 that functions as a filter, a resonator, a reference clock, and the like.

  In addition to the personal computer (mobile personal computer) in FIG. 16, the mobile phone in FIG. 17, and the digital still camera in FIG. 18, the electronic device including the vibrator is, for example, an ink jet type ejection device (for example, an ink jet printer). , Laptop personal computers, TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (eg, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various measuring devices, instruments (eg, , Vehicle, aircraft, ship total S), it can be applied to a flight simulator or the like.

5. Next, the moving body provided with the vibrator 1 will be described.
FIG. 19 is a perspective view showing an automobile to which a moving body is applied. The automobile 1500 is equipped with a vibrator 1 (vibration element 2). The vibrator 1 includes, for example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), an engine control, and a hybrid. The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for automobiles and electric vehicles, and vehicle body attitude control systems.

As mentioned above, although the manufacturing method of the vibrator | oscillator of this invention was demonstrated based on illustration embodiment, this invention is not limited to this, The structure of each part is the thing of arbitrary structures which have the same function Can be substituted. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment suitably.
In the embodiment described above, one groove is provided on each main surface of each vibrating arm, but the number of grooves is not particularly limited, and may be two or more. For example, two grooves arranged in the X-axis direction may be provided on each main surface. Further, the groove may be omitted.

  In the above-described embodiment, the vibration element has a base, two vibration arms, a connection part, and a connection part. However, the structure of the vibration element is not limited to this. For example, the connecting part and the connecting part may be omitted. Further, two holding arms may be added. The two holding arms have a shape extending in the X-axis direction from both ends of the connecting portion in the X-axis direction, bent in the + Y-axis direction, and then extending in the + Y-axis direction. In the case of such a configuration, the vibration element is attached to the base via the conductive adhesive at the distal ends of both holding arms. Further, the configuration of the vibration element is not limited to the tuning fork type, but may be an AT-cut quartz crystal vibration element (including a flat type, a mesa type, an inverted mesa type, etc.) driven by thickness shear vibration.

In the above-described embodiment, crystal is used as the constituent material of the resonator element. However, the constituent material of the resonator element is not limited to this. For example, aluminum nitride (AlN) or lithium niobate (LiNbO _3). ), Lithium tantalate (LiTaO ₃ ), lead zirconate titanate (PZT), lithium tetraborate (Li ₂ B ₄ O ₇ ), langasite (La ₃ Ga ₅ SiO ₁₄ ) and other oxide substrates, glass A laminated piezoelectric substrate configured by laminating a piezoelectric material such as aluminum nitride or tantalum pentoxide (Ta ₂ O ₅ ) on the substrate, piezoelectric ceramics, or the like can be used.

  In addition, the resonator element can be formed using a material other than the piezoelectric material. For example, the resonator element can be formed using a silicon semiconductor material or the like. Further, the vibration (drive) method of the resonator element is not limited to piezoelectric drive. In addition to the piezoelectric drive type using the piezoelectric substrate, the configuration and the effect of the present invention can be exhibited also in an electrostatic drive type using an electrostatic force or a Lorenz drive type using a magnetic force. it can. In addition, a term described together with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term anywhere in the specification or the drawings.

DESCRIPTION OF SYMBOLS 1 ... Vibrator 11, 12 ... Conductive adhesive material 2 ... Vibrating element 3 ... Quartz vibration piece 31 ... Base part 31a, 31b ... Notch part 311 ... Reduced width part 32 ... Vibrating arm 32a, 32b …… Main surface 32c, 32d …… Side surface 321, 331 …… Arm portion 322, 332 …… Hammer head 323, 324 …… Groove 323a, 324a …… Bottom surface 33 …… Vibrating arm 33c, 33d …… Side surface 333,334 ...... groove 34 ...... connector 35 ...... connecting portion 5 ...... weight portion 5A ...... first weight layer 5B ...... second weight layer 5C ...... third deadweight layer 84 ...... first driving electrode 85 ...... Second drive electrode 86, 87 ... Connection electrode 9 ... Package 91 ... Base 92 ... Lid 911 ... Recess 912 ... Through hole 951, 961 ... Connection terminal 952, 962 ... Through electrode 953, 963 ... External terminal 1 00 …… Oscillator 110 …… IC chip 120 …… Internal terminal 200 …… Physical quantity sensor 210 …… IC chip 220 …… Internal terminal 1100 …… Personal computer 1102 …… Keyboard 1104 …… Main body 1106 …… Display unit 1108… Display unit 1200 …… Cellular phone 1202 …… Operation buttons 1204 …… Earpiece 1206 …… Speaker 1208 …… Display unit 1300 …… Digital still camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer 1500 …… Automobile B, B ′ …… Weight material L1, L2 …… Length LL ... Za light Ly ...... centerline S ...... accommodating space P1, P2 ...... position T, t ...... thickness W4, W5 ...... width L3, W7 ...... distance

Claims (7)

A mounting process for mounting the vibration element having the weight portion on the base;
An adjustment step of adjusting the resonance frequency of the vibration element by removing at least a part of the weight portion by irradiating energy rays, and sucking debris generated by the removal,
A lid joining step of joining a lid to the base and forming an accommodation space for accommodating the vibration element by the base and the lid;
A method for manufacturing a vibrator, comprising: A mounting process for mounting the vibration element having the weight portion on the base;
A lid joining step of joining a lid to the base and forming an accommodation space for accommodating the vibration element by the base and the lid;
Adjustment that irradiates the weight part through the lid body with energy rays, adjusts the resonance frequency of the vibration element by removing at least a part of the weight part, and sucks debris generated by the removal Process,
A method for manufacturing a vibrator, comprising:   The method for manufacturing a vibrator according to claim 2, wherein the lid includes a transparent region. The adjustment step includes
The method for manufacturing a vibrator according to any one of claims 1 to 3, wherein the method is performed in a reduced pressure state. The base substrate is provided with a through-hole penetrating in the thickness direction,
5. The method for manufacturing a vibrator according to claim 1, wherein the adjusting step sucks the waste through the through hole. 6. The vibrating element is
The base,
A vibrating arm extending from the base in plan view and provided with a weight;
Including
The length of the vibration element along the extending direction is L1,
When the length along the extending direction between the through hole and the removed portion of the weight portion is L2 in a plan view,
0 ≦ L2 / L1 ≦ 0.5
The method for manufacturing a vibrator according to claim 5, wherein the following relationship is satisfied. After the adjustment step,
The method for manufacturing a vibrator according to claim 5, further comprising a sealing step for sealing the through hole.

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