JP2014188608A - Dicing device and base for dicing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a panel of high cracking resistance by suppressing occurrence of micro cracking at a cutting surface.SOLUTION: A dicing device cuts a glass substrate in a state in which two glasses are laminated and a panel whose front and rear surfaces are pasted with a polarizing plate is arranged in a plurality of pieces in two-dimension, along a plurality of dicing lines for separating into respective panels. On one main surface in which the glass substrate is placed, there are provided a base 200 on which dicing grooves 210(211, 212, 213, 214) along the dicing line and a plurality of vacuum sucking holes 220 are provided, and a blade for cutting the glass substrate along the dicing line. The vacuum sucking holes 220 are arranged line symmetry about the dicing groove 210, at least near the dicing groove 210.

Description

  Embodiments described herein relate generally to a dicing apparatus and a dicing base for cutting out individual panels from a large panel substrate.

  A display panel used for a mobile phone, a smartphone, or the like, for example, a liquid crystal panel, has a fundamental requirement for a larger screen in a size that can be operated with one hand. For this reason, panel manufacturers are required to manufacture and provide narrow frame panels with a narrower frame.

  Such a narrow frame panel is required to have good flatness on the side surface in consideration of setting a bezel on the panel. This means that the front and back glass cutting positions and the position of the end face of the polarizing plate are within ± 50 μm, for example. However, a structure with high flatness on the side surface is in principle difficult to realize by a method in which polarizing plates are attached to both the front and back surfaces of a panel cut using a conventional scribe device.

  Therefore, a method has been proposed in which the entire glass substrate is cut in a state where the front and back polarizing plates are attached to a glass substrate on which two pieces of glass are bonded. Specifically, it is a method of cutting a panel by scraping a part of a large panel substrate using a grindstone called a blade with a dicing apparatus.

  In this method, the panel substrate must be fixed by some method so that the panel substrate to be cut does not deviate from the stage or the jig installed on the stage. As this fixing method, there are two methods, that is, a tape fixing method using a double-sided tape, or a jig fixing method using a vacuum adsorption force. When cutting the liquid crystal panel, the jig fixing method is empirically selected.

  In the jig fixing system, a large number of circular or polygonal vacuum suction holes are provided on a stage of a dicing apparatus or a jig installed on the stage for vacuum suction of the panel. In addition, the jig is provided with a plurality of grooves used when cutting the glass substrate with a blade.

  As a hole for vacuum suction, it is necessary to hold the panel to be cut with a sufficient force, and in order to increase the holding force, it is necessary to increase the total area of the hole. However, regarding the outermost dicing line, there is a case where a sufficient holding force may not be obtained because the area of the region serving as the end material is small. Furthermore, there is a case where an unbalance of the attractive force occurs between the panel side and the end material side of the dicing line. These cause microcracking and lead to a decrease in cracking strength.

Japanese Patent Laid-Open No. 10-13222

  As described above, in the method of adsorbing the glass substrate by the jig fixing method and cutting it to the panel, sufficient adsorbing power cannot be obtained for the outermost dicing line, and the panel side and the end material side of the dicing line In this case, an unbalance of the adsorption force occurs, and microcracks are generated on the cut surface, which causes a problem of reducing the crack strength.

  The problem to be solved by the present invention is to provide a dicing apparatus and a dicing base that can suppress the generation of microcracks on a cut surface and contribute to the realization of a panel having high crack strength.

  In this embodiment, two or more glass substrates are laminated, and a plurality of two-dimensionally arranged glass substrates each having a polarizing plate attached to the front and back surfaces thereof are separated into a plurality of panels. A dicing apparatus for cutting along a dicing line, wherein a plurality of vacuum suctions for holding and fixing the dicing groove along the dicing line and the glass substrate on one main surface on which the glass substrate is placed A base provided with a hole, and a blade for cutting the glass substrate along the dicing line, wherein the vacuum suction hole is at least in the vicinity of the dicing groove with respect to the dicing groove. It is characterized by being arranged in line symmetry.

A sectional view showing a schematic structure of a dicing machine concerning a 1st embodiment. The top view which shows the glass substrate used as the object of dicing. The top view which shows schematic structure of the jig | tool for dicing concerning 1st Embodiment. The top view which shows schematic structure of the jig | tool for dicing concerning 2nd Embodiment. The top view which shows schematic structure of the jig | tool for dicing concerning 3rd Embodiment. The top view which shows schematic structure of the jig | tool for dicing concerning a modification. The top view which shows schematic structure of the jig | tool for dicing concerning a reference example.

  Hereinafter, a dicing apparatus and a dicing base of an embodiment will be described with reference to the drawings.

(First embodiment)
1 to 3 are diagrams for explaining the first embodiment. FIG. 1 is a sectional view showing a schematic configuration of a dicing apparatus, FIG. 2 is a plan view showing a configuration of a glass substrate, and FIG. It is a top view which shows the structure of the base for dicing to be used.

  As shown in FIG. 1, a jig (a dicing base) 200 is set on a stage 100 capable of vacuum suction. Then, the glass substrate 300 is placed on the jig 200, and the glass substrate 300 is diced by the blade 400.

  The stage 100 has a recess for fitting the jig 200, and further has one or more suction ports 101 connected to a vacuum pump or the like.

  The glass substrate 300 is in a state in which a plurality of liquid crystal panels in which two pieces of glass are bonded are two-dimensionally arranged, and a polarizing plate or the like is attached to the front and back surfaces. As shown in FIG. 2, the glass substrate 300 is provided with dicing lines 320 (321, 322, 323, 324) for cutting out into individual panels 310 (311, 312, 313).

  Here, paying attention to the structure of the glass substrate 300 in FIG. 2, there are end materials 331 and 332 which are unnecessary portions that are not used as panels on the left and right. The end materials 331 and 332 correspond to regions existing at the ends of the original large format glass substrate. In a large-sized glass substrate, a region of about 10 to 20 mm from the end edge is a region outside the guarantee of the film forming process, and thus a panel cannot be designed there. In other words, when a panel is manufactured using a large-sized glass substrate, an end material region of about 10 mm is inevitably generated in the vertical and horizontal directions.

  The jig 200 has a structure in which a SUS is cut into only a portion on which the glass substrate 300 is placed and a hard rubber 202 is fitted into the structure 201 cut out from a SUS flat plate. The hard rubber 202 is preferably made of a material that does not easily swell. Further, the step of cutting SUS may be eliminated, that is, a state in which SUS remains instead of hard rubber may be used. In the following, we will talk about an example using hard rubber.

  As shown in FIG. 3, the hard rubber 202 of the jig 200 has four dicing grooves 210 (211, 212, 213, 214) that are holes through which the blade 400 passes when the glass substrate 300 is cut. Is provided. In FIG. 1, an example of the dicing groove 210 is shown for ease of explanation.

  The hard rubber 202 of the jig 200 is provided with a plurality of fine holes 220 for vacuum suction, and these fine holes 220 are connected to the suction port 101 of the stage 100. Here, in particular, the circular fine holes 220 for vacuum suction are arranged in line symmetry in three rows on the left and right sides of all four dicing grooves 210. That is, in the vicinity (approximately ± 10 mm) of each dicing groove 210, circular fine holes 220 are provided in line symmetry with respect to the dicing groove 210. Further, the fine holes 220 are arranged not only in the three rows near the dicing grooves 210 but also substantially uniformly in the region sandwiched between the dicing lines 210.

  Although the fine hole 220 for vacuum suction is circular here, the diameter may be in the range of 1 to 10 mm. However, if the hole is too small, debris due to dicing is likely to be clogged. 5 mm is preferable. Further, although it is circular here, it is not necessary to be circular, and the same effect can be obtained even if it is elliptical or polygonal if all have the same shape.

  Although FIG. 3 shows an example of a jig having four dicing grooves 210, the present embodiment is naturally applicable to the case where there are two, three, five or more grooves 210. It is.

  In the present embodiment, a glass substrate 300 as shown in FIG. 2 cut out in a strip shape from a large glass substrate is set on the jig 200 and then sucked from the fine hole 220 of the jig 200, whereby the glass substrate is obtained. 300 is fixed on the jig 200. In this state, the glass substrate 300 is cut by the blade 400 along the dicing line 320.

  At this time, the circular vacuum holes 220 for vacuum suction are arranged in line symmetry in the jig 200 in three rows on the left and right sides of all four dicing grooves 210. For this reason, during the cutting, the vacuum adsorbing force becomes equal to the left and right regions of the end members 331, 332 or the panels 311, 312, 313 located on the left and right of the dicing line 320, for example, within 10 mm.

  Here, it is most desirable that the fine hole 220 provided in the vicinity of the dicing groove 210 is line-symmetrical up to a range farther from the dicing groove 210, but according to the experiments by the present inventors, It has been confirmed that if the line symmetry is within a range of ± 10 mm, the vacuum suction force can be made sufficiently equal on the left and right of the dicing line 320.

  Therefore, cross-sections forming pairs of end members 331 and 332 or panels 311, 312, and 313 cut along each dicing line 320 (in this example, there are four pairs, respectively, right side of the end member 331 in FIG. 3. Surface and left side of panel 311, right side of panel 311 and left side of panel 312, right side of panel 312 and left side of panel 313, left side of panel 313 and right side of end material 332). Compared to the case where is not evenly applied, the left and right have the same clean cross section. Thereby, since there are relatively few microcracks, panels 311, 312, and 313 that are relatively strong with respect to the cracking strength are obtained.

  Microcracks referred to here are micro-chips, defects and scratches of up to several hundred microns or less, which are present on the glass end face, which is likely to be the starting point of glass breakage of the panel when the crack strength is inspected. .

  As described above, according to the present embodiment, since the vacuum suction minute holes 220 are arranged symmetrically with respect to the dicing groove 210 in the vicinity of the dicing groove 210, the blade 400 cuts the glass substrate 300. The vacuum suction force applied to the left and right sides of the glass substrate 300 that is cut during the process is even.

  Accordingly, the frictional force generated between the side surface of the blade 400 and the end surface of the dicing line 320 of the glass substrate 300 is uniform on the left and right side surfaces of the dicing line 320. As a result, for example, the state of the left side surface of the outermost panel 311 and the state of the right side surface of the end member 331 have the same cross section. Thereby, generation | occurrence | production of the micro crack in a cut surface can be suppressed, and it becomes possible to implement | achieve a panel with big crack strength. This is effective in manufacturing a narrow frame liquid crystal panel.

  In the above description, the jig 200 installed on the stage 100 of the dicing apparatus has been described. Instead of using the jig 200, the vacuum suction fine holes 220 having the same layout as the upper surface of the jig 200 are provided on the stage 100. The present embodiment can also be applied to the case where it is directly opened. At this time, it has been confirmed that the panel cut from the glass substrate 300 set on the stage 100 has a crack strength that is not different from that of the jig 200.

(Second Embodiment)
Although it depends on the size of the end material, the total area of the end material is smaller than the total area of the panel. May not be sufficient. In this case, the suction force can be increased if the vacuum suction hole provided in the end material is a large line-shaped hole instead of a fine hole.

  However, in this case, since the vacuum suction holes are not arranged symmetrically with respect to the dicing line on the left and right sides of the dicing line, the vacuum suction force applied to the panel 211 and the end material 231 is not uniform. When the glass substrate is cut in that state, the frictional force generated between the side surface of the blade and the end surface of the cut line of the glass substrate becomes unbalanced on the left and right side surfaces of the cut line, and as a result, the state of the left side surface of the panel 211 Unlike the state of the right side surface of the end member 231, in many cases, many microcracks are generated and the cross-sectional shape is apparently rough.

  Therefore, in this embodiment, the vacuum suction hole provided in the end material is a large line-shaped hole, and in the outermost dicing line, the vacuum suction hole on the panel side is also a large line-shaped hole.

  FIG. 4 is a plan view showing a schematic configuration of a dicing jig according to the second embodiment. Note that the same parts as those in FIG.

  The difference between the present embodiment and the first embodiment described above is that the vacuum suction hole is formed into a large line-shaped hole near the dicing line with respect to the outermost dicing line. In other words, among the four dicing grooves 210, the central two 212 and 213 have vacuum suction circular fine holes 220 arranged in line symmetry in a region about 10 mm on the left and right. On the other hand, with respect to the left end 211 and the right end 214, rectangular vertically elongated vacuum suction line-shaped holes 230 are arranged in an area of about 10 mm on the left and right. In this case, the shape of the vacuum suction holes arranged symmetrically with respect to the dicing groove 210 is different between those for 212 and 213 and those for 211 and 214. The vacuum suction holes 220 and 230 are arranged symmetrically with respect to the groove. Therefore, the same effect as described in the first embodiment can be obtained for a panel cut using this jig.

  In the present embodiment, it is important to provide line-shaped holes on both sides of the outermost dicing line, not on one side, for the following reason.

  As a reference example, as shown in FIG. 7, it is compared with an example in which a line-shaped hole is provided only on the end material side.

  When attention is paid to the structure of the glass substrate in FIG. 2, when the glass substrate 300 is cut along the dicing line 321, the end material 331 located on the left and right and the vacuum adsorption force applied to the entire panel 311 are equalized. Since the total area of 331 is smaller than the total area of the panel 311, it is necessary to increase the total area of the vacuum suction holes below the end members 311. Therefore, in FIG. 7, the vacuum suction holes 230 located under the end members 331 and 332 on the left and right have a large rectangular line shape in order to increase the area.

  Consider a situation in which the glass substrate 300 is diced using such a jig.

  At this time, for example, when cutting along the dicing line 321, the vacuum suction holes 220 and 230 are not arranged symmetrically with respect to the dicing groove 211, so the vacuum suction force applied to the panel 311 and the end material 331. Are not even. When the glass substrate 300 is cut in this state, the frictional force generated between the side surface of the blade 400 and the end surface of the dicing line 321 of the glass substrate 300 becomes unbalanced on the left and right side surfaces of the dicing line 321, and as a result, the left side of the panel 311 The state of the surface is different from the state of the right side surface of the end material 331, and in each case, many microcracks are generated, and the cross-sectional shape is apparently rough.

  On the other hand, when attention is paid to the dicing line 322, a plurality of open vacuum suction holes 220 are arranged symmetrically with respect to the dicing line 322. Accordingly, when the panel 300 is cut along the dicing line 322, the vacuum suction force applied to the panels 311 and 312 in FIG. Cleaner than the left side of

  When the left side surface and the right side surface of the cut-out panel 311 were observed with a microscope, the result was that there were more small glass scratches called microcracks on the left side surface. It is empirically known that such a scratch is likely to become a starting point of cracks when the strength of the panel is evaluated. That is, it becomes a panel which is easy to break.

  If attention is paid to the dicing line 322, the vacuum suction holes 220 have the same layout on the left and right with respect to the dicing groove 212, so that the left and right side surfaces of the panel 312 have the same clean sectional shape. Since the number of microcracks as seen on the left side of the panel 311 is also relatively small, the panel is strong against cracking.

  In summary, in the panel manufactured by cutting the glass substrate 300 shown in FIG. 2, the panels 311 and 313 in which the vacuum suction holes are not arranged symmetrically with respect to the dicing line 320 are arranged symmetrically. Compared with the panel 312 that is present, either the left or right cross section is rough, resulting in a panel that is relatively weak against cracking. This means that the crack strength of the panel depends on the position in the glass substrate. In the panel cut out from the glass substrate 300, the presence of a panel that is weak against cracking is a serious problem in terms of quality assurance.

  On the other hand, as in the present embodiment, with respect to the outermost dicing line, by arranging line-shaped grooves 230 on the left and right sides of the dicing grooves 211 and 214, the glass substrate along the dicing lines 321 and 324 is arranged. When cutting 300, the vacuum suction force applied to the end material 331 located on the left and right and the panel 311 as a whole can be made equal, and a sufficient suction force can be obtained. For this reason, regarding the outermost panels 311 and 313, the state of the left and right side surfaces can be similarly maintained in the region. Therefore, it is possible to suppress the occurrence of microcracks on the cut surface and realize a panel having a high cracking strength.

(Third embodiment)
FIG. 5 is a plan view showing a schematic configuration of a dicing jig according to the third embodiment. In addition, the same code | symbol is attached | subjected to the same part as FIG. 4, and the detailed description is abbreviate | omitted.

  This embodiment is different from the second embodiment described above in that not only the outermost dicing line but all the dicing grooves 210 are provided with line-shaped holes 230 in the vicinity of the dicing grooves 210. That is.

  That is, for the four dicing grooves 210, a vacuum suction line-shaped hole 230 is arranged in a region about 10 mm on the left and right instead of the circular vacuum suction micro-hole 220. Further, the line-shaped holes 230 are arranged symmetrically (line symmetric) with respect to the dicing groove 210.

  When the jig of this embodiment is used, the vacuum suction force can be made equal on the left and right sides of the dicing line, regardless of which of the dicing lines 321, 322, 323, and 324 is diced. Therefore, the same effect as described in the second embodiment can be obtained.

(Modification)
The present invention is not limited to the above-described embodiments.

  In the embodiment, the example of the glass substrate in which a plurality of panels are arranged in the left-right direction has been described, but as shown in FIG. Is possible. In this case, for example, a vacuum suction line-shaped hole 240 is arranged symmetrically with respect to the dicing groove 250 (251, 252, 253, 254) for cutting in the vertical direction in the vicinity of the groove 250. Good.

  In the embodiment, the case where a jig is used as a base and a jig having a vacuum suction hole and a dicing groove is set on the stage has been described. However, the vacuum suction hole and the dicing groove are formed on the stage itself. It is also possible to omit the jig by providing.

  Further, the object to be diced by the present apparatus is not necessarily limited to the liquid crystal panel, and may be any object in which two glasses are bonded together.

  Further, the fine hole for vacuum suction is not necessarily limited to a circle, and may be an ellipse or a polygon. Furthermore, the number of line-shaped holes is not necessarily limited to one, and a plurality of lines may be used as long as they are line-symmetric with respect to the dicing line.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

100 ... Stage 101 ... Suction port 200 ... Jig (base for dicing)
201 ... Structure 202 ... Hard rubber 210 (211 to 214), 250 (251 to 254) ... Dicing groove 220 ... Fine hole (vacuum suction hole)
230, 240 ... Line-shaped holes (vacuum suction holes)
300 ... Glass substrate 310 (311 to 313) ... Panel 320 (312 to 324) ... Dicing line 331, 332 ... End material 400 ... Blade

Claims (10)

A glass substrate in which a plurality of glass panels are laminated and a plurality of panels each having a polarizing plate attached to the front and back surfaces is two-dimensionally cut along a plurality of dicing lines for separating each panel. A dicing machine,
A base provided with a plurality of vacuum suction holes for holding and fixing the dicing groove along the dicing line and the glass substrate on one main surface on which the glass substrate is placed;
A blade for cutting the glass substrate along the dicing line;
Comprising
2. The dicing apparatus according to claim 1, wherein the vacuum suction holes are arranged symmetrically with respect to the dicing grooves at least in the vicinity of the dicing grooves.   When the width in the direction orthogonal to the dicing line of the end material cut out by the dicing line is A, the vacuum suction hole is ± A in the direction orthogonal to the dicing groove with respect to the dicing groove. 2. The dicing apparatus according to claim 1, wherein the dicing apparatus is line-symmetric within a range.   The vacuum suction holes are the same shape of fine holes regularly arranged on the surface on which the glass substrate of the base is placed, and the outermost of the plurality of dicing grooves. The dicing apparatus according to claim 1, further comprising: a line-shaped hole disposed in a line symmetry in the vicinity of the dicing groove.   The vacuum suction hole is in the vicinity of the dicing groove with respect to each of the fine holes having the same shape regularly arranged on the surface on which the glass substrate of the base is placed and each of the plurality of dicing grooves. The dicing apparatus according to claim 1, further comprising a line-shaped hole arranged in line symmetry in the dicing groove.   5. The hard rubber is provided on a portion of the base on which the glass substrate is placed, and the dicing groove and the vacuum suction hole are provided on the hard rubber. The dicing apparatus according to any one of the above. A base on which a glass substrate in which a plurality of panels in which two sheets of glass are laminated and a polarizing plate is pasted on the front and back surfaces is two-dimensionally placed;
Dicing grooves provided along a plurality of dicing lines for separating the glass substrate into respective panels on the surface of the base on which the glass substrate is placed;
A plurality of vacuum suction holes provided on a surface on which the glass substrate of the base is placed and provided in line symmetry with respect to the dicing grooves at least in the vicinity of the dicing grooves;
A base for dicing characterized by comprising:   When the width in the direction orthogonal to the dicing line of the end material cut out by the dicing line is A, the vacuum suction hole is ± A in the direction orthogonal to the dicing groove with respect to the dicing groove. 7. The dicing base according to claim 6, which is line symmetric within a range.   The vacuum suction holes are arranged in the vicinity of the dicing grooves with respect to the fine holes having the same shape regularly arranged on the surface on which the glass substrate is placed and the outermost sides of the plurality of dicing grooves. The dicing base according to claim 6 or 7, further comprising a line-shaped hole arranged symmetrically in the dicing groove.   The vacuum suction hole is formed in the vicinity of the dicing groove with respect to each of the fine holes of the same shape regularly arranged on the surface on which the glass substrate is placed and each of the plurality of dicing grooves. The dicing base according to claim 6, further comprising a line-shaped hole arranged in line symmetry in the work groove.   The hard rubber is provided in a portion where the glass substrate is placed, and the dicing groove and the vacuum suction hole are provided in the hard rubber. Dicing base.

Images