JP2014187108A - Method for producing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing an electronic component capable of reducing kinds of masks used in the production of the electronic component.SOLUTION: A group created by disposing a first conductor layer and a third conductor layer at opposite angles of a square shape and disposing a second conductor layer and a fourth conductor layer at remaining other angles of the square shape is arrayed in matrix form, which is then formed into a first to a fourth ceramic green sheet. The first to fourth ceramic green sheets are laminated so that the first conductor layer of the first ceramic green sheet, the second conductor layer of the second ceramic green sheet, the third conductor layer of the third ceramic green sheet, and the fourth conductor layer of the fourth ceramic green sheet are stacked in the direction of lamination in the order stated. In each group, the first conductor layer and the second conductor layer have a line-symmetrical relation, and the third conductor layer and the fourth conductor layer have a line-symmetrical relation.

Description

  The present invention relates to a method for manufacturing an electronic component, and more specifically, to a method for manufacturing an electronic component including a laminate in which insulator layers are stacked.

  As an invention relating to a conventional method for manufacturing an electronic component, for example, a method for manufacturing a common mode choke coil described in Patent Document 1 is known. The common mode choke coil includes a first coil conductor layer, a second coil conductor layer, a first lead electrode layer, and a second lead electrode layer. The first coil conductor layer and the second coil conductor layer have a spiral shape. The first lead electrode layer is connected to the first coil conductor layer. The second lead electrode layer is connected to the second coil conductor layer. The first coil conductor layer, the second coil conductor layer, the first lead electrode layer, and the second lead electrode layer are formed on different insulator layers.

  By the way, when the common mode choke coil is manufactured, four types of insulator layers on which the first coil conductor layer, the second coil conductor layer, the first lead electrode layer, and the second lead electrode layer are formed are prepared. These need to be laminated. Therefore, the method for manufacturing the common mode choke coil requires four types of masks for forming the first coil conductor layer, the second coil conductor layer, the first lead electrode layer, and the second lead electrode layer on the insulator layer. It becomes. Thus, when many masks are required, the manufacturing cost of the common mode choke coil increases.

JP 2005-116647 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component manufacturing method capable of reducing the types of masks used for manufacturing electronic components.

  An electronic component manufacturing method according to an aspect of the present invention includes a stacked body in which a plurality of insulator layers including a first insulator layer to a fourth insulator layer are stacked, and the first insulator layer. Or a method of manufacturing an electronic component comprising a first conductor layer to a fourth conductor layer provided on each of the fourth insulator layers, wherein the first conductor layer and the third conductor layer are provided. A group in which a conductor layer is arranged on a diagonal of a quadrangle, and the second conductor layer and the fourth conductor layer are arranged on a diagonal of the remaining square is arranged in a matrix. A conductor forming step formed on the first ceramic green sheet to the fourth ceramic green sheet, the first conductor layer of the first ceramic green sheet, and the second conductor of the second ceramic green sheet. Layer and said third ceramic green sheet Lamination for laminating the first ceramic green sheet to the fourth ceramic green sheet so that the third conductor layer and the fourth conductor layer of the fourth ceramic green sheet overlap in this order in the laminating direction. And within each of the groups, the first conductor layer and the second conductor layer have a line-symmetric relationship, and the third conductor layer and the fourth conductor layer The conductive layer has a line-symmetric relationship.

  According to the present invention, the types of masks used for manufacturing electronic components can be reduced.

It is an external appearance perspective view of the electronic component manufactured in the manufacturing method of the electronic component which concerns on one Embodiment. It is a disassembled perspective view of the laminated body of an electronic component. It is the perspective view which showed a mode that the mother green sheet was laminated | stacked. It is the figure which planarly viewed the mother green sheet used in the manufacturing method of an electronic component. It is the figure which planarly viewed the mother green sheet used in the manufacturing method of an electronic component.

  Below, the manufacturing method of the electronic component which concerns on one Embodiment of this invention is demonstrated. FIG. 1 is an external perspective view of an electronic component 10a manufactured in the method for manufacturing an electronic component 10a according to an embodiment. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10a. Hereinafter, the stacking direction of the electronic components 10a is defined as the z-axis direction, and the directions in which two sides extend when the electronic component 10a is viewed in plan from the z-axis direction are defined as the x-axis direction and the y-axis direction. . The x-axis direction, the y-axis direction, and the z-axis direction are orthogonal to each other. In addition, about the external appearance perspective view of the electronic component 10a, FIG. 1 is used.

  As shown in FIGS. 1 and 2, the electronic component 10a includes a multilayer body 12, external electrodes 14a to 14d, coil conductor layers 30a to 30d, lead conductor layers 32a to 32d, and via-hole conductors b21 and b22. The electronic component 10a is used as a common mode choke coil, for example. Since the common mode choke coil is a general electronic component, detailed description thereof is omitted.

  The laminated body 12 has a rectangular parallelepiped shape, and the insulating layers 16a to 16j are laminated in this order from the positive side in the z-axis direction to the negative side. As shown in FIG. 2, the insulator layers 16a to 16c and 16g to 16j have a square shape, and are made of, for example, Ni—Cu—Zn based magnetic ferrite. As shown in FIG. 2, the insulator layers 16 d to 16 f have a square shape, and are made of, for example, Cu—Zn-based nonmagnetic ferrite. Hereinafter, the surface on the positive direction side in the z-axis direction of the insulator layers 16a to 16j is referred to as a front surface, and the surface on the negative direction side in the z-axis direction of the insulator layers 16a to 16j is referred to as a back surface.

  The coil conductor layer 30a is provided on the surface of the insulating layer 16d, and has a spiral shape that goes to the center while rotating in the clockwise direction. The coil conductor layer 30b is provided on the surface of the insulator layer 16e, and has a spiral shape that goes to the center while rotating in the counterclockwise direction. The coil conductor layer 30c is provided on the surface of the insulator layer 16f, and has a spiral shape that goes to the center while rotating in the counterclockwise direction. The coil conductor layer 30d is provided on the surface of the insulator layer 16g, and has a spiral shape that goes to the center while rotating in the clockwise direction.

  The lead conductor layer 32a is provided on the surface of the insulator layer 16d, and is drawn from the outer end of the coil conductor layer 30a to the side on the positive side in the y-axis direction of the insulator layer 16d. The end on the positive direction side in the y-axis direction of the lead conductor layer 32a is located on the positive direction side in the x-axis direction from the center of the side on the positive direction side in the y-axis direction of the insulator layer 16d.

  The lead conductor layer 32b is provided on the surface of the insulator layer 16e, and is drawn from the outer end of the coil conductor layer 30b to the negative side of the insulator layer 16e in the y-axis direction. The end of the lead conductor layer 32b on the negative side in the y-axis direction is located on the positive direction side in the x-axis direction from the center of the side on the negative direction side in the y-axis direction of the insulator layer 16e.

  The lead conductor layer 32c is provided on the surface of the insulator layer 16f, and is drawn from the outer end of the coil conductor layer 30c to the negative side of the insulator layer 16f in the y-axis direction. The end portion on the negative direction side in the y-axis direction of the lead conductor layer 32c is located on the negative direction side in the x-axis direction from the center of the side on the negative direction side in the y-axis direction of the insulator layer 16f.

  The lead conductor layer 32d is provided on the surface of the insulator layer 16g, and is led out from the outer end of the coil conductor layer 30d to the positive side of the insulator layer 16g in the y-axis direction. The end of the lead conductor layer 32d on the positive side in the y-axis direction is located on the negative side in the x-axis direction from the center of the side on the positive direction side in the y-axis direction of the insulator layer 16g.

  The via-hole conductor b21 penetrates the insulator layer 16d in the z-axis direction, and connects the inner end of the coil conductor layer 30a and the inner end of the coil conductor layer 30b. Thereby, the coil conductor layers 30a and 30b are connected to each other to constitute the coil L1. The via-hole conductor b22 penetrates the insulator layer 16f in the z-axis direction, and connects the inner end of the coil conductor layer 30c and the inner end of the coil conductor layer 30d. Thereby, the coil conductor layers 30c and 30d are connected to each other to constitute the coil L2. The coil L1 and the coil L2 constitute a common mode choke coil by being magnetically coupled to each other.

  The external electrodes 14a and 14d extend in the z-axis direction on the side surface of the laminate 12 on the positive direction side in the y-axis direction. Further, both ends of the external electrodes 14a and 14d in the z-axis direction in the z-axis direction are folded back to the upper surface on the positive side in the z-axis direction and the bottom surface on the negative direction side in the z-axis direction. The external electrode 14a is connected to the lead conductor layer 32d. The external electrode 14d is connected to the lead conductor layer 32a.

  The external electrodes 14 b and 14 c extend in the z-axis direction on the negative side surface of the laminate 12 in the y-axis direction. Further, both ends of the external electrodes 14b, 14c in the z-axis direction in the z-axis direction are folded back to the upper surface on the positive side in the z-axis direction and the bottom surface on the negative direction side in the z-axis direction. The external electrode 14b is connected to the lead conductor layer 32c. The external electrode 14c is connected to the lead conductor layer 32b.

  A method for manufacturing the electronic component 10a configured as described above will be described with reference to the drawings. FIG. 3 is a perspective view showing how the mother green sheets 116i to 116l are stacked. FIG. 4 is a plan view of the mother green sheets 116i and 116k used in the method for manufacturing the electronic component 10a. FIG. 5 is a plan view of the mother green sheets 116j and 116l used in the method for manufacturing the electronic component 10a.

  In the manufacturing method of the electronic component 10a, as shown in FIG. 3, the mother green sheets 116i to 116l are stacked in this order from the positive side to the negative side in the z-axis direction. In addition, although mother green sheets (not shown) are laminated | stacked also on the positive direction side and negative direction side of the z-axis direction from the mother green sheets 116i-116l, the description is abbreviate | omitted below.

  First, mother green sheets 116i to 116l are prepared. Each of the mother green sheets 116i to 116l is an unfired sheet in which the groups G including the insulator layers 16d to 16g are arranged in a matrix. The insulator layer 16d and the insulator layer 16f are disposed on the remaining diagonal diagonal of the square, and the insulator layer 16e and the insulator layer 16g are disposed on the diagonal of the square. In the present embodiment, the insulator layer 16g is disposed on the positive side in the x-axis direction of the insulator layer 16d, and the insulator layer 16e is disposed on the negative direction side in the y-axis direction of the insulator layer 16d. Furthermore, the insulator layer 16f is disposed on the positive side in the x-axis direction of the insulator layer 16e. In FIGS. 4 and 5, the group G composed of the insulator layers 16d to 16g is arranged in a matrix of 2 rows and 2 columns, but actually, it is arranged in a matrix of more rows and columns. ing.

  Next, in the mother green sheets 116i and 116k, the via hole is formed by irradiating the laser beam to the position where the via hole conductors b21, b22, b31, b32, b41, b42, b51, and b52 are formed. The via-hole conductor b31 connects the inner end of the coil conductor layer 30b and the inner end of the coil conductor layer 30a. The via-hole conductor b32 connects the inner end of the coil conductor layer 30d and the inner end of the coil conductor layer 30c. The via-hole conductor b41 connects the inner end of the coil conductor layer 30c and the inner end of the coil conductor layer 30d. The via-hole conductor b42 connects the inner end of the coil conductor layer 30a and the inner end of the coil conductor layer 30b. The via-hole conductor b51 connects the inner end of the coil conductor layer 30d and the inner end of the coil conductor layer 30c. The via-hole conductor b52 connects the inner end of the coil conductor layer 30b and the inner end of the coil conductor layer 30a. Further, the via hole conductors b21, b22, b31, b32, b41, b42, b51, b52 are formed by filling the formed via holes with a conductive paste.

  Next, as shown in FIG. 4, a plurality of coil conductor layers 30a and lead conductor layers 32a (first conductor layers), a plurality of coil conductor layers 30b and lead conductor layers 32b on the surfaces of the mother green sheets 116i and 116k. (Second conductor layer), a plurality of coil conductor layers 30c and a lead conductor layer 32c (third conductor layer), and a plurality of coil conductor layers 30d and a lead conductor layer 32d (fourth conductor layer) are formed.

  Specifically, the coil conductor layer 30a, the lead conductor layer 32a, the coil conductor layer 30c, and the lead conductor layer 32c are arranged on the diagonal of the square, and the coil conductor layer 30b, the lead conductor layer 32b, and the coil conductor layer are arranged. A plurality of groups G in which 30d and the lead conductor layer 32d are arranged on the remaining diagonal corners of the square are arranged in a matrix and formed on the surfaces of the mother green sheets 116i and 116k. In the present embodiment, the coil conductor layer 30d and the lead conductor layer 32d are disposed on the positive side in the x-axis direction of the coil conductor layer 30a and the lead conductor layer 32a, and the coil conductor layer 30a and the lead conductor layer 32a in the y-axis direction are arranged. The coil conductor layer 30b and the lead conductor layer 32b are disposed on the negative direction side. Further, the coil conductor layer 30c and the lead conductor layer 32c are disposed on the positive side in the x-axis direction of the coil conductor layer 30b and the lead conductor layer 32b.

  Here, in the group G, the coil conductor layer 30a and the lead conductor layer 32a (first conductor layer) and the coil conductor layer 30b and the lead conductor layer 32b (second conductor layer) have a line-symmetric relationship. Have. That is, when the coil conductor layer 30a and the lead conductor layer 32a (first conductor layer) are folded back with respect to the boundary between the insulator layers 16d and 16e, the coil conductor layer 30b and the lead conductor layer 32b (second conductor layer) Overlap. The coil conductor layer 30c and the lead conductor layer 32c (third conductor layer) and the plurality of coil conductor layers 30d and the lead conductor layer 32d (fourth conductor layer) have a line-symmetric relationship. . That is, when the coil conductor layer 30c and the lead conductor layer 32c (third conductor layer) are folded with respect to the boundary between the insulator layers 16f and 16g, the coil conductor layer 30d and the lead conductor layer 32d (fourth conductor layer) Overlap.

  Next, as shown in FIG. 5, a plurality of coil conductor layers 30a and lead conductor layers 32a (first conductor layers), a plurality of coil conductor layers 30b and lead conductor layers 32b on the surfaces of the mother green sheets 116j and 116l. (Second conductor layer), a plurality of coil conductor layers 30c and a lead conductor layer 32c (third conductor layer), and a plurality of coil conductor layers 30d and a lead conductor layer 32d (fourth conductor layer) are formed. However, in this step, a plurality of coil conductor layers 30a and lead conductor layers 32a, a plurality of coil conductor layers 30b and lead conductor layers 32b, a plurality of coil conductor layers 30c and lead conductor layers are provided on the surfaces of the mother green sheets 116i and 116k. Since it is the same as the process of forming 32c and the plurality of coil conductor layers 30d and the lead conductor layer 32d, the description thereof is omitted.

  Next, the mother green sheets 116i to 116l are stacked in this order from the positive direction side to the negative direction side in the z-axis direction. Below, the lamination | stacking process of the mother green sheets 116i-116l is demonstrated, referring FIG.

  Specifically, in the stacking step, as will be described below, the coil conductor layer 30a and the lead conductor layer 32a (first conductor layer) of the mother green sheet 116i and the coil conductor layer 30b and the lead of the mother green sheet 116j are extracted. The conductor layer 32b (second conductor layer), the coil conductor layer 30c and the lead conductor layer 32c (third conductor layer) of the mother green sheet 116k, and the coil conductor layer 30d and the lead conductor layer 32d of the mother green sheet 116l ( The mother green sheets 116i to 116j are laminated so that the fourth conductor layer) and the fourth conductor layer overlap in this order in the z-axis direction.

  First, the mother green sheet 116i is set so that the surface faces downward. Then, the mother green sheet 116j is laminated on the mother green sheet 116i so that the surface faces downward. At this time, the mother green sheet 116j is moved to the positive direction side in the y-axis direction by the width in the y-axis direction of the insulator layer 16d and stacked on the mother green sheet 116i.

  Next, the mother green sheet 116k is laminated on the mother green sheet 116j so that the surface faces downward. At this time, the mother green sheet 116k is moved to the positive side in the y-axis direction by the width in the y-axis direction of the insulator layer 16d, and at the negative side in the x-axis direction by the width in the x-axis direction of the insulator layer 16d. The mother green sheet 116k is moved and stacked on the mother green sheet 116j.

  Next, the mother green sheet 116l is laminated on the mother green sheet 116k so that the surface faces downward. At this time, the mother green sheet 116l is moved to the negative direction side in the x-axis direction by the width in the x-axis direction of the insulator layer 16d and stacked on the mother green sheet 116k.

  Note that three layers of mother green sheets to be the insulator layers 16a to 16c are stacked on the positive side of the mother green sheet 116i in the z-axis direction. Further, on the negative side of the mother green sheet 116l in the z-axis direction, three layers of mother green sheets serving as the insulator layers 16h to 16j are stacked. However, the mother green sheet stacking process is a general process and will not be described. At the end of the laminating step, a hydrostatic press is performed on the mother laminated body constituted by the mother green sheets 116i to 116l.

  Next, the mother laminated body is cut into a laminated body 12 having a predetermined size with a cutting blade. Thereafter, the unfired laminate 12 is subjected to binder removal processing and firing.

  Next, external electrodes 14a to 14d are formed. First, an electrode paste made of a conductive material containing Ag as a main component is applied to the surface of the laminate 12. Next, the applied electrode paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the base electrodes of the external electrodes 14a to 14d are formed.

  Finally, Ni / Sn plating is applied to the surface of the base electrode. Thereby, the external electrodes 14a to 14d are formed. Through the above steps, the electronic component 10a is completed.

(effect)
According to the method for manufacturing the electronic component 10a according to the present embodiment, the types of masks used for manufacturing the electronic component 10a can be reduced. More specifically, the coil conductor layer 30a and the lead conductor layer 32a (first conductor layer) of the mother green sheet 116i, the coil conductor layer 30b and the lead conductor layer 32b (second conductor layer) of the mother green sheet 116j, and The coil conductor layer 30c and the lead conductor layer 32c (third conductor layer) of the mother green sheet 116k and the coil conductor layer 30d and the lead conductor layer 32d (fourth conductor layer) of the mother green sheet 116l are in the z-axis direction. The mother green sheets 116i to 116j are stacked so as to overlap in this order. Thereby, the four types of laminated bodies 12 of the 1st pattern thru | or 4th pattern demonstrated below can be obtained. Hereinafter, the stacking order of the first conductor layer to the fourth conductor layer of the multilayer body 12 of the first pattern to the fourth pattern is shown.

First pattern: first conductor layer, second conductor layer, third conductor layer, fourth conductor layer Second pattern: second conductor layer, first conductor layer, fourth conductor layer Third conductor layer Third pattern: third conductor layer, fourth conductor layer, first conductor layer, second conductor layer Fourth pattern: fourth conductor layer, third conductor layer , Second conductor layer, first conductor layer

  Here, the first conductor layer and the second conductor layer have a line-symmetric relationship. Therefore, the second conductor layer is referred to as a first 'conductor layer. Further, the third conductor layer and the fourth conductor layer are in a line-symmetric relationship. Therefore, the fourth conductor layer is referred to as a 3 ′ conductor layer. In this case, the stacking order of the first conductor layer to the fourth conductor layer of the laminated body 12 of the first pattern to the fourth pattern is shown as follows.

First pattern: first conductor layer, first 'conductor layer, third conductor layer, third' conductor layer Second pattern: first 'conductor layer, first conductor layer, third 'Conductor layer, third conductor layer third pattern: third conductor layer, third' conductor layer, first conductor layer, first 'conductor layer fourth pattern: third' conductor Layer, third conductor layer, first 'conductor layer, first conductor layer

  As described above, any laminate 12 of the first pattern to the fourth pattern includes the coil including the first conductor layer and the first ′ conductor layer, the third conductor layer, and the third ′ conductor layer. And a coil made up of. That is, any laminate 12 of the first pattern to the fourth pattern has substantially the same internal structure. Therefore, according to the method for manufacturing the electronic component 10a according to the present embodiment, the electronic component 10a can be manufactured using one type of mask.

(Other embodiments)
In addition, the manufacturing method of the electronic component which concerns on this invention is not restricted to the manufacturing method of the said electronic component 10a, It can change within the range of the summary.

  Although the electronic component 10a is used as a common mode choke coil, it may be used as another circuit element. Moreover, the electronic component 10a may incorporate circuit elements other than the coil.

  As described above, the present invention is useful for a method for manufacturing an electronic component, and is particularly excellent in that the types of masks used for manufacturing an electronic component can be reduced.

G group L1, L2 Coil 10a Electronic component 12 Laminated body 14a-14d External electrode 16a-16j Insulator layer 18a, 18b, 30a-30d Coil conductor layer 20a-20d, 32a-32d Lead conductor layer 116i-116l Mother green sheet

Claims (2)

Provided in each of a stacked body in which a plurality of insulator layers including a first insulator layer to a fourth insulator layer are stacked, and each of the first insulator layer to the fourth insulator layer. A method of manufacturing an electronic component comprising the first conductor layer to the fourth conductor layer,
The first conductor layer and the third conductor layer are disposed on a diagonal of the quadrangle, and the second conductor layer and the fourth conductor layer are on the remaining diagonal of the quadrangle. A conductor forming step of arranging the arranged groups in a matrix and forming the first ceramic green sheet or the fourth ceramic green sheet;
The first conductor layer of the first ceramic green sheet, the second conductor layer of the second ceramic green sheet, the third conductor layer of the third ceramic green sheet, and the fourth ceramic. A laminating step of laminating the first ceramic green sheet or the fourth ceramic green sheet so that the fourth conductor layer of the green sheet overlaps in this order in the laminating direction;
With
Within each group, the first conductor layer and the second conductor layer have a line-symmetric relationship, and the third conductor layer and the fourth conductor layer have a line-symmetric relationship. Having
A method of manufacturing an electronic component characterized by the above. The first conductor layer to the fourth conductor layer are spiral coil conductor layers,
The first conductor layer and the second conductor layer are connected to each other to form a first coil,
The third conductor layer and the fourth conductor layer are connected to each other to form a second coil,
The first coil and the second coil constitute a common mode choke coil;
The manufacturing method of the electronic component of Claim 1 characterized by these.

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