JP2014179234A - Method for forming conductive pattern, and transparent conductive sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a conductive pattern, by which favorable adhesiveness is obtained in a transparent conductive film to a resist film and a conductive pattern with high accuracy can be easily and inexpensively formed.SOLUTION: The method for forming a conductive pattern comprises forming a conductive pattern on a substrate and includes steps of: forming a transparent conductive film by applying a coating composition comprising a conductive polymer and an alkoxysilane on one major surface of the substrate; forming a resist film at a position where the conductive pattern is to be formed on the transparent conductive film; deactivating conductivity in an exposed portion of the transparent conductive film through the resist film as a mask by using a deactivating agent that deactivates the conductive polymer; and peeling the resist film by using a pressure-sensitive adhesive sheet to obtain the conductive pattern. The alkoxysilane comprises an alkoxysilane having an organic functional group; and the proportion of the organic functional group is 1 mol% or more and 20 mol% or less in the whole alkoxysilane.

Description

  The present invention relates to a conductive pattern forming method and a transparent conductive sheet.

  For transparent electrodes used in various devices such as liquid crystal displays and transparent touch panels, oxide-based conductive materials such as tin-containing indium oxide (ITO) are often used. For example, a conductive pattern formed by forming an ITO film on a substrate and patterning the ITO film into a desired shape is used as the transparent electrode. Etching methods are the mainstream patterning method for ITO films, but the problems with the etching methods are that the manufacturing cost is high and the difference in refractive index between the substrate and the ITO film is large, so that patterning can be seen. In the point. Further, since the ITO film is formed by sputtering, the manufacturing cost is increased.

  Therefore, a conductive polymer obtained by adding a dopant to a thiophene-based or aniline-based polymer having excellent stability and conductivity instead of ITO is attracting attention as a conductive material.

  As a method for forming a conductive pattern using a conductive polymer as a conductive material, a conductive film is formed on a substrate using a coating composition containing the conductive polymer, and the conductive pattern is not formed on the conductive film. There is known a method in which the remaining conductive film is dissolved and removed with an etching solution to make the remaining conductive film a conductive pattern. However, since this method uses an etching method, there are problems as described above.

  On the other hand, an inactive portion (hereinafter referred to as a non-conductive portion) is inactivated by extremely lowering the conductivity of the portion other than the conductive pattern formation position of the conductive film (increasing the resistance) without using the etching method. There is also known a method of forming a conductive pattern by giving a difference in surface resistance value between a non-inactivated portion (hereinafter referred to as a conductive portion). The advantage of this method is that it is not necessary to remove the non-conductive portion by etching, so that the patterning is not visible (the bone is not visible) and the conductive pattern forming surface is not uneven, and sufficient hardness is obtained. is there.

  The inactivation mentioned here means that the conductive film is brought into contact with a processing solution (deactivator) to break the double bond of the conductive polymer involved in the conductivity, thereby increasing the conductivity. Deactivating the conductivity of molecules.

  For example, in Patent Document 1, a film pattern is formed on a base material using an inactivating agent, and the base material is brought into contact with a conductive film, whereby the conductivity of a portion corresponding to the film pattern is increased. A conductive pattern forming method is proposed in which a non-conductive portion is formed by deactivation and the remaining conductive portion is a wiring portion. According to Patent Document 1, the conductivity of a conductive film is selectively deactivated, and a conductive pattern having a desired shape can be formed inexpensively, simply, and reliably. Stabilization can be realized.

JP 2011-054617 A

  However, in the method described in Patent Document 1, the difference in surface resistance value between the conductive part and the non-conductive part is not sufficient, and in order to function as a circuit, the difference in surface resistance value between the conductive part and the non-conductive part. Need to be larger.

  Furthermore, further examination is necessary for the adhesion of the conductive film to the resist film. That is, if the adhesiveness of the conductive film to the resist film is insufficient, there arises a problem that the deactivator erodes between the conductive film and the resist film and the formation accuracy of the conductive pattern is deteriorated. On the other hand, if the adhesion of the conductive film to the resist film is too strong, it becomes difficult to completely remove the resist film from the conductive film.

  The present invention has been made in order to solve the above-described problems. The conductive pattern formation is capable of easily and inexpensively forming a highly accurate conductive pattern with good adhesion of the transparent conductive film to the resist film. A method and an inexpensive transparent conductive sheet having a conductive pattern excellent in transparency and conductivity, having a smooth conductive pattern forming surface and excellent in hardness are provided.

  In order to solve the above problems, a conductive pattern forming method of the present invention is a conductive pattern forming method for forming a conductive pattern on a base material, wherein a conductive polymer and an alkoxy are formed on one main surface of the base material. Applying a coating composition containing silane to form a transparent conductive film; forming a resist film at a position where the conductive pattern is formed on the transparent conductive film; and losing the conductive polymer. Deactivating the conductivity of the exposed portion of the transparent conductive film using the resist film as a mask, using an inactivating agent to be activated, and peeling the resist film using an adhesive sheet, and the conductive pattern The alkoxysilane contains an alkoxysilane having an organic functional group, and the ratio of the organic functional group is 1 mol% or more and 20 mol% or less in all alkoxysilanes. It is characterized in.

  The transparent conductive sheet of the present invention has a transparent substrate and a conductive pattern formed on at least one main surface of the substrate by using the conductive pattern forming method of the present invention. .

  According to the conductive pattern forming method of the present invention, it is possible to improve the adhesion of the transparent conductive film to the resist film, and to form a highly accurate conductive pattern easily and inexpensively.

  According to the transparent conductive sheet of the present invention, an inexpensive transparent conductive sheet having a conductive pattern excellent in transparency and conductivity, having a smooth conductive pattern forming surface and excellent in hardness can be provided.

FIG. 1 is a diagram showing an example of a conductive pattern forming method of the present invention.

  The conductive pattern forming method of the present invention is a conductive pattern forming method for forming a conductive pattern on a substrate, and a coating composition comprising a conductive polymer and an alkoxysilane on one main surface of the substrate. A step of forming a transparent conductive film by applying a resist, a step of forming a resist film at a position where the conductive pattern is formed on the transparent conductive film, and a deactivator for deactivating the conductive polymer. And using the resist film as a mask to deactivate the conductivity of the exposed portion of the transparent conductive film, and peeling the resist film using an adhesive sheet to obtain the conductive pattern. The alkoxysilane contains an alkoxysilane having an organic functional group, and the ratio of the organic functional group is 1 mol% or more and 20 mol% or less in the total alkoxysilane. Thereby, the adhesiveness of the transparent conductive film to the resist film is improved, and a highly accurate conductive pattern can be formed easily and inexpensively.

  Hereinafter, the conductive pattern forming method of the present invention will be described in detail with reference to FIG. FIG. 1 is a diagram for explaining an example of the conductive pattern forming method of the present invention.

<Formation of transparent conductive film>
First, as shown in FIG. 1A, a transparent conductive film 12 is formed by applying a coating composition on one main surface (upper surface in FIG. 1) of a substrate 11 and drying the coating composition. Form.

  The coating composition includes a conductive polymer and an alkoxysilane.

  The conductive polymer constituting the coating composition is a polymer called Conductive Polymers (CPs), and in a state where a polyradical cationic salt or a polyradical anionic salt is formed by doping with a dopant. A polymer that itself can exhibit electrical conductivity.

  As the conductive polymer, for example, a polymer containing a polythiophene compound and a dopant can be used. Specifically, a mixture (hereinafter also referred to as PEDOT / PSS) containing poly (3,4-ethylenedioxythiophene) as a polythiophene compound and polystyrene sulfonic acid as a dopant can be used.

  The alkoxysilane constituting the coating composition preferably contains at least one polyfunctional alkoxysilane selected from the group consisting of tetraalkoxysilane, trialkoxysilane, dialkoxysilane and alkoxy oligomer.

  Examples of the tetraalkoxysilane include silane tetrasubstituted with an alkoxy group having 1 to 4 carbon atoms such as tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraiso-propoxysilane, and tetra-t-butoxysilane. It is done. Specific examples include “KBE-04” manufactured by Shin-Etsu Chemical Co., Ltd.

  Examples of the trialkoxysilane include trimethoxysilane, triethoxysilane, tripropoxysilane, tributoxysilane, triiso-propoxysilane, tri-L-butoxysilane, and the like. Silane.

  Examples of the dialkoxysilane include dimethyldimethoxysilane, diphenyldimethoxysilane, dimethyldiethoxysilane, and diphenyldiethoxysilane.

  The alkoxy oligomer is a relatively low-molecular resin having both an organic group and an alkoxysilyl group. Specific examples include “X-40-2308”, “X-40-9238”, “X-40-9247”, “KR-401N”, “KR-510”, “KR-9218” manufactured by Shin-Etsu Chemical Co., Ltd. ".

  Among the specific examples of the alkoxysilane, tetraalkoxylane is preferable for forming a transparent conductive film with higher hardness. In order to form a high-quality film in a more stable state with good reproducibility, tetraalkoxylane is preferable. It is preferable to use together alkoxysilane and trialkoxysilane.

  When tetraalkoxysilane and trialkoxysilane are used in combination as the alkoxysilane, the molar ratio of tetraalkoxysilane to trialkoxysilane is preferably 9: 1 to 5: 5, more preferably 8: 2. ~ 6: 4. The reason why this molar ratio relationship is preferable is that while preventing a decrease in the hardness of the transparent conductive film, the risk of cracking in the transparent conductive film due to changes over time is further reduced, and the adhesion to the substrate is further improved. This is because it can be increased. It is considered that the tetraalkoxysilane acts on the expression of high film hardness, and the trialkoxysilane acts on prevention of cracking of the film and adhesion to the substrate.

  The content of the alkoxysilane is preferably 100 to 900% by weight, more preferably 200 to 600% by weight with respect to the conductive polymer. If the alkoxysilane content is too low, a transparent conductive film having sufficient hardness tends to be difficult to obtain. When there is too much content of alkoxysilane, it exists in the tendency for a film to become cloudy and for optical characteristics to deteriorate.

  The alkoxysilane which comprises the said coating composition contains the alkoxysilane which has an organic functional group, and the ratio of an organic functional group is 1 mol% or more and 20 mol% or less in all the alkoxysilanes. By containing an organic functional group, the adhesiveness of the transparent conductive film to the resist film can be improved. That is, it is possible to prevent the deactivator from eroding between the transparent conductive film and the resist film in the subsequent step of using the deactivator, and to form the conductive pattern with high accuracy. However, if the ratio of the organic functional group becomes too large, the adhesion of the transparent conductive film to the resist film becomes strong, and it becomes difficult to remove the resist film using the adhesive sheet in the process of peeling the resist film later. Therefore, the proportion of the organic functional group is preferably 20 mol% or less in the total alkoxysilane.

  As the organic functional group, a stable and water-repellent functional group that does not react with an organic substance or an inorganic substance can be used. For example, a methyl group, an ethyl group, a phenyl group, an aliphatic long-chain alkyl group, and the like can be mentioned. In consideration of compatibility with a conductive polymer, a methyl group and an ethyl group are more preferable.

  In addition, the alkoxysilane constituting the coating composition tends to be difficult to obtain a film having sufficient strength (hardness, solvent resistance) when all of the alkoxysilanes have an organic functional group. It is preferable to use together an alkoxysilane having a group and an alkoxysilane having no organic functional group. The proportion of the alkoxysilane having an organic functional group is preferably 1 mol% or more and 80 mol% or less in all alkoxysilanes.

  In addition to the above, a mixed solvent of alcohol (ethanol, methanol, isopropyl alcohol, etc.) and water is added to the coating composition. By the addition of a mixed solvent of alcohol and water, the alkoxysilane is slightly hydrolyzed, but a hydrosol solution is obtained without substantially proceeding to the gel. The content of water is preferably 1 to 4.5 mol, more preferably 2 to 4 mol, with respect to 1 mol of alkoxysilane, and the content of alcohol is 5 to 40 mol with respect to 1 mol of alkoxysilane. Is more preferable, and more preferably 10 to 30 mol. The reason why the water content is preferably within the above numerical range is as follows. Water not only affects the reaction rate of the hydrolysis reaction but also affects the quality of the transparent conductive film. That is, when there is too much content of water, there exists a tendency for adhesiveness with a base material to fall, and it may become impossible to obtain the transparent conductive film of uniform film thickness. On the other hand, if the water content is too small, there may be a case where a transparent conductive film with sufficient hardness cannot be obtained, for example, the reaction rate of the hydrolysis reaction becomes slow or unreacted substances are likely to remain. On the other hand, since alcohol is not directly related to the hydrolysis reaction, the alcohol content is not so severely limited. However, if the alcohol content is too high, the reaction rate of the hydrolysis reaction is slow. Or the thickness of the transparent conductive film is reduced. Therefore, it is necessary to adjust appropriately.

  Moreover, generally used acid catalysts (hydrochloric acid, sulfuric acid, acetic acid, etc.) can be further added to the coating composition. In this case, it is possible to form a high-quality transparent conductive film with more reproducibility with more stable performance.

  The preparation method of the said coating composition is not specifically limited, What is necessary is just to mix suitably by a well-known method.

  As the coating method of the coating composition, for example, a known coating method such as a bar coating method, a reverse method, a gravure printing method, a micro gravure printing method, a dipping method, a spin coating method, or a spray method can be used.

  The method for drying the coating composition is not particularly limited as long as the solvent in the coating composition can be removed. For example, the coating composition can be dried by heat drying, vacuum drying, natural drying, or the like.

  Various materials such as plastic, rubber, glass, metal, ceramics, and paper can be used as the substrate.

  Although the film thickness of the said transparent conductive film is suitably set according to a use, it is about 0.01-10 micrometers normally. If the film thickness is too thin or too thick, it becomes difficult to form a uniform transparent conductive film. Depending on the proportion of the conductive polymer contained in the coating composition, if the film thickness is thin, the surface resistance tends to increase, and if the film thickness is too thick, the total light transmittance tends to decrease. is there.

  The total light transmittance in the wavelength range of 380 to 780 nm of the transparent conductive film is preferably 85% or more, and more preferably 88% or more. The higher the total light transmittance, the better the optical properties. The total light transmittance can be measured with an ultraviolet-visible near-infrared spectrophotometer, for example, “V-570” manufactured by JASCO Corporation.

  The surface hardness of the transparent conductive film is determined by the pencil hardness measurement method defined in Japanese Industrial Standard (JIS) K5400, and is preferably H or more, more preferably 2H or more. The higher the pencil hardness, the better the hardness.

<Formation of resist film>
After the formation of the transparent conductive film 12, a resist film 13 is formed at a conductive pattern formation position on the transparent conductive film 12, as shown in FIG. As a method for forming the resist film, for example, the resist film is formed by screen printing a resist agent. As the resist agent, for example, known ones such as “Clvious SET S” manufactured by Heraeus can be used.

<Decrease in conductivity>
After the formation of the resist film 13, as shown in FIG. 1C, the conductivity of the exposed portion of the transparent conductive film 12 is lowered using the resist film 13 as a mask. Specifically, the exposed portion of the transparent conductive film 12 is brought into contact with an inactive agent that deactivates the conductive polymer, thereby deactivating (decreasing) the conductivity of the exposed portion and increasing the surface resistance value. . That is, the surface resistance value between the portion where the conductive polymer is deactivated (hereinafter referred to as a non-conductive portion) 12a and the portion where the conductive polymer is not deactivated (hereinafter referred to as a conductive portion) 12b. You can make a difference. Then, when the resist film 13 as a mask is peeled off in a later step, the conductive portion 12b functions as a conductive pattern. As described above, in the present invention, since the conductive pattern can be formed by selectively reducing the conductivity of the transparent conductive film without etching the non-conductive portion, the manufacturing cost can be suppressed. Further, since the conductive pattern forming surface is smooth, it is possible to prevent the problem of bone appearance and to obtain a transparent conductive film having high hardness.

Here, the surface resistance value of the conductive portion 12b is preferably 5 × 10 ² Ω / square or less. The smaller the surface resistance value, the higher the conductivity and the better the electrical characteristics. The surface resistance value can be measured by a surface resistivity measuring device such as a resistivity meter “Loresta-GP” (MCP-T610 type) manufactured by Mitsubishi Chemical Analytech.

The surface resistance value of the non-conductive portion 12a is preferably 1 × 10 ⁶ Ω / square or more larger than the surface resistance value of the conductive portion 12b. In this case, a satisfactory electrical contrast can be obtained by adding a difference in surface resistance between the conductive portion 12b and the nonconductive portion 12a to the extent that it functions as a circuit. The surface resistance value can be measured by a surface resistivity measuring device such as a resistivity meter “Hiresta-UP” (MCP-HT450 type) manufactured by Mitsubishi Chemical Analytech.

  The deactivator is not particularly limited as long as it can deactivate the conductive polymer, and examples thereof include an oxidizing compound and a basic compound, but an acidic compound is more preferable. This is because the oxidizing compound has a large increase in the surface resistance value compared to the basic compound, and the variation in the surface resistance value after the deactivation treatment is small.

  Examples of the oxidizing compound include hydrogen peroxide compounds, perchloric acid compounds, hypochlorous acid compounds, peracetic acid compounds, metachlorobenzoic acid compounds, sulfite compounds, and the like.

  Examples of the basic compound include ammonia, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, pyridine, 4-methylpyridine, and tetramethylammonium hydroxide.

<Removal of resist film>
After selectively reducing the conductivity of the transparent conductive film 12, the resist film 13 is peeled off using an adhesive sheet 14 as shown in FIGS. 1 (d) and 1 (e). Specifically, as shown in FIG. 1 (d), the surface on the adhesive layer 14 b side of the adhesive sheet 14 in which the adhesive layer 14 b is formed on one main surface of the base material 14 a is placed on the transparent conductive film 12. After pasting, as shown in FIG. 1E, the pressure-sensitive adhesive sheet 14 is peeled off, whereby the pressure-sensitive adhesive sheet 14 and the resist film 13 are integrally peeled off. Then, as shown in FIG.1 (f), the conductive pattern which consists of the electroconductive part 12b is obtained in the position in which the resist film 13 of the transparent conductive film 12 was formed. The laminated body of the transparent conductive film 12 and the base material 11 patterned in this way is used as the transparent conductive sheet 15. Thus, in this invention, since a resist film can be easily peeled with an adhesive sheet, the yield of a product can be improved.

  Next, the transparent conductive sheet of the present invention will be described.

  The transparent conductive sheet of this invention has a transparent base material and the conductive pattern formed in the at least one main surface of the base material using the said conductive pattern formation method of this invention. Thereby, the transparent conductive sheet which has the conductive pattern excellent in transparency and electroconductivity, the conductive pattern formation surface is smooth, and was excellent in hardness can be provided at low cost.

In the conductive pattern forming surface of the transparent conductive sheet, the surface resistance value of the portion where the conductive pattern is not formed is 1 × 10 ⁶ Ω / square than the surface resistance value of the portion where the conductive pattern is formed. It is preferable that it is larger. In this case, a good electrical contrast that can function as a circuit is obtained.

  Hereinafter, the present invention will be described in detail based on examples. However, the present invention is not limited to the following examples. In addition, unless otherwise indicated, in the following, “part” means “part by mass”. In the following, the “conductive polymer dispersion” means an aqueous solution containing the conductive polymer of the present invention.

Example 1
<Formation of transparent conductive film>
First, the following composition was added and mixed to prepare a hydrosol solution.
(1) Alkoxysilane: Tetraethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name “KBE-04”): 19.2 mmol (4.0 parts)
(2) Alkoxysilane having an organic functional group: methyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name “KBM-13”): 2.9 mmol (0.4 parts)
(3) Ethanol: 27.8 parts (4) Nitric acid aqueous solution (concentration: 1% by weight): 4.5 parts

Next, the following composition was added to the hydrosol solution and mixed to obtain a coating composition. In the present Example 1, the ratio of the organic functional group was 3.3 mol% in all alkoxysilanes.
(5) Conductive polymer dispersion (conductive polymer: PEDOT-PSS, manufactured by Heraeus, trade name “PH-1000”, solid content concentration: 1.2%): 100.0 parts (6) ethylene glycol : 11.1 parts (7) Hydrosol solution: 36.7 parts

  Next, a 10 cm square non-alkali glass film having a thickness of 0.7 mm was used as a base material, and the coating composition was applied to one main surface of the base material by a spin coating method at a rotational speed of 800 rpm for 30 seconds, and then 150 ° C. For 10 minutes. Thereby, the laminated body which consists of a base material and the transparent conductive film formed in one main surface of a base material was obtained. The film thickness of the transparent conductive film was 0.6 μm.

<Formation of resist film>
Next, using a # 400 plate, a resist agent (trade name “Clvious SET S”, manufactured by Heraeus Co., Ltd.) is applied to the central portion of the main surface of the laminate on the transparent conductive film side by screen printing at an area of 5 cm square. Screen-printed and then heated at 100 ° C. for 5 minutes. Thereby, the laminated body in which the resist film was formed on the transparent conductive film was obtained.

<Decrease in conductivity>
Next, the laminate in which the resist film is formed on the transparent conductive film is dipped in a solution prepared by adding 10% aqueous solution of an inert agent (trade name “Clvious Etch” manufactured by Heraeus) for 30 minutes, and then distilled. Wash with water and heat at 100 ° C. for 5 minutes. Thereby, the conductivity of the exposed portion of the transparent conductive film was lowered.

<Removal of resist film>
Next, a peeling operation in which the adhesive layer side surface of an adhesive sheet (trade name “Cellotape (registered trademark)” manufactured by Nichiban Co., Ltd.) is attached to the main surface on the transparent conductive film side of the laminate and peeled off. As a result, the pressure-sensitive adhesive sheet and the resist film were integrally peeled and removed to obtain a transparent conductive sheet having a conductive pattern. When the conductive pattern forming surface of the obtained transparent conductive sheet was observed with a microscope, no residue of the resist film was observed, and it was found that the resist film was completely removed.

  Next, the electrical characteristics of the obtained transparent conductive sheet were evaluated. The evaluation method will be described below.

<Electrical characteristics>
First, on the conductive pattern forming surface of the transparent conductive sheet, the surface resistance value of the conductive part on which the conductive pattern is formed is measured by a resistivity meter “Loresta-GP” (MCP-T610 type) manufactured by Mitsubishi Chemical Analytech. And LSP probe. In addition, on the conductive pattern forming surface of the transparent conductive sheet, the surface resistance value of the non-conductive portion where the conductive pattern is not formed is determined as a resistivity meter “Hiresta-UP” (MCP-HT450 type) manufactured by Mitsubishi Chemical Analytech. ) And a URS probe. Here, when the difference in surface resistance between the conductive portion and the non-conductive portion is 1 × 10 ⁶ Ω / square or more, it is evaluated that a good electrical contrast is obtained. In the case of Example 1, the surface resistance value of the conductive portion is 1 × 10 ² Ω / square, and the surface resistance value of the non-conductive portion is 1 × 10 ⁹ Ω / square, and good electrical contrast is obtained. I found out.

(Comparative Example 1)
The composition component (2) methyltrimethoxysilane was changed from 2.9 mmol to 22.1 mmol, and the composition component (1) tetraethoxysilane was used in the same manner as in Example 1 except that it was not used. A transparent conductive sheet of Comparative Example 1 was produced. The ratio of the organic functional group contained in the coating composition of Comparative Example 1 was 25 mol% in all alkoxysilanes.

About the transparent conductive sheet of the comparative example 1, when the conductive pattern formation surface was observed with the microscope, it was confirmed that a part of the residue of the resist film remained, and the resist film was not completely peeled and removed. It was. When the electrical characteristics were evaluated in the same manner as in Example 1, the surface resistance value of the conductive part was 1 × 10 ⁹ Ω / square and the surface resistance value of the non-conductive part was 1 × 10 ⁹ Ω / square. It was found that good electrical contrast was not obtained.

(Comparative Example 2)
Comparison was made in the same manner as in Example 1 except that the composition component (1) tetraethoxysilane was changed from 19.2 mmol to 22.1 mmol and the composition component (2) methyltrimethoxysilane was not used. The transparent conductive sheet of Example 2 was produced. The ratio of the organic functional group contained in the coating composition of Comparative Example 2 was 0 mol% in all alkoxysilanes.

When the conductive pattern forming surface of the transparent conductive sheet of Comparative Example 2 was observed with a microscope, no residue of the resist film was observed, and it was found that the resist film was completely peeled and removed. Further, when the electrical characteristics were evaluated in the same manner as in Example 1, the surface resistance value of the conductive part was 1 × 10 ⁷ Ω / square, and the surface resistance value of the non-conductive part was 1 × 10 ⁹ Ω / square. And good electrical contrast was not obtained.

  INDUSTRIAL APPLICATION This invention can provide the transparent conductive sheet which can be utilized suitably as transparent electrodes, such as a liquid crystal display, a touch panel, an organic electroluminescent element, and an electromagnetic shielding material.

DESCRIPTION OF SYMBOLS 11 Base material 12 Transparent conductive film 12a Non-conductive part 12b Conductive part 13 Resist film 14 Adhesive sheet 14a Base material 14b Adhesive layer 15 Transparent conductive sheet

Claims (5)

A conductive pattern forming method for forming a conductive pattern on a substrate,
Applying a coating composition containing a conductive polymer and an alkoxysilane on one main surface of the substrate to form a transparent conductive film;
Forming a resist film at a position where the conductive pattern is formed on the transparent conductive film;
Using a deactivator that deactivates the conductive polymer, using the resist film as a mask, and deactivating the conductivity of the exposed portion of the transparent conductive film; and
Peeling the resist film using an adhesive sheet to obtain the conductive pattern,
The alkoxysilane includes an alkoxysilane having an organic functional group,
The ratio of the said organic functional group is 1 mol% or more and 20 mol% or less in all the alkoxysilanes, The conductive pattern formation method characterized by the above-mentioned.   The conductive pattern forming method according to claim 1, wherein the alkoxysilane includes at least one polyfunctional alkoxysilane selected from the group consisting of tetraalkoxysilane, trialkoxysilane, dialkoxysilane, and alkoxy oligomer.   The conductive pattern forming method according to claim 1, wherein the conductive polymer includes a polythiophene compound and polystyrene sulfonic acid.   A transparent substrate and a conductive pattern formed using the conductive pattern forming method according to any one of claims 1 to 3 on at least one main surface of the substrate. Transparent conductive sheet. In the conductive pattern forming surface of the transparent conductive sheet, the surface resistance value of the portion where the conductive pattern is not formed is 1 × 10 ⁶ Ω / square than the surface resistance value of the portion where the conductive pattern is formed. The transparent conductive sheet according to claim 4, which is larger than the above.

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