JP2014176151A - Coil drive apparatus and transformer and motor using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil drive apparatus capable of reducing the size and weight of a transformer and a motor.SOLUTION: The coil drive apparatus includes a circuit board 50A having an electric circuit 51A containing power modules P1, P2, a coil 411 electrically coupled to the power modules P1, P2, and a substrate 52 to which the power modules P1, P2 are mounted and the coil 411 is fixed.

Description

  The present invention relates to a coil driving device including a semiconductor element and a coil, and a transformer and an electric motor using the same.

  In order to shorten the wiring between the motor and the control device and reduce the size and weight, a technique for fixing a cover for housing the control device to a blanket for housing the motor is known (for example, see Patent Document 1). ).

JP 2003-267233 A

  In the above technique, since the mutually independent blanket and cover are integrated, means for radiating heat generating parts (for example, a stator coil) of a motor and means for radiating heat generating parts (for example, a power module) of a control device There is a problem that there is a limit to miniaturization and weight reduction.

  The problem to be solved by the present invention is to provide a coil driving device capable of reducing the size and weight of a transformer and an electric motor, and a transformer and an electric motor using the same.

  In the present invention, the above problem is solved by providing a semiconductor element and at least a part of a coil electrically connected to the semiconductor element on the same substrate.

  According to the present invention, since the semiconductor element and at least a part of the coil are provided on the same substrate, the semiconductor element and the coil can be cooled by the same heat dissipating means via the substrate. The electric motor can be reduced in size and weight.

FIG. 1 is a circuit diagram of a DC / DC converter according to a first embodiment of the present invention. FIG. 2 is a top view showing the overall configuration of the DC / DC converter in the first embodiment of the present invention. FIG. 3A to FIG. 3C are a top view, a front view, and a side view of the circuit board according to the first embodiment of the present invention. FIG. 4A and FIG. 4B are a front view and a side view showing a first modification of the circuit board in the first embodiment of the present invention. FIGS. 5A to 5C are a front view, a side view, and a rear view showing a second modification of the circuit board in the first embodiment of the present invention. FIG. 6A to FIG. 6C are a top view, a front view, and a side view showing a third modification of the circuit board in the first embodiment of the present invention. FIG. 7A and FIG. 7B are a front view and a side view showing a circuit board to which a heat dissipation member is attached in the first embodiment of the present invention. FIG. 8A is a diagram showing a process of laminating a circuit board in the first embodiment of the present invention, and FIG. 8B is a diagram showing a core protrusion on the circuit board in the first embodiment of the present invention. It is a figure which shows the process of inserting. FIG. 9 is a cross-sectional view of a portion A in FIG. FIG. 10A and FIG. 10B are a rear view and a front view showing a fourth modification of the circuit board in the first embodiment of the present invention. FIG. 11A to FIG. 11C are a top view, a front view, and a side view showing a circuit board to which a capacitor is attached in the first embodiment of the present invention. 12A and 12B are a front view and a side view showing a state in which the circuit board shown in FIGS. 7A and 7B is incorporated in a DC / DC converter. FIG. 13: is a front view which shows the 5th modification of the circuit board in 1st Embodiment of this invention. FIG. 14 is a top view showing a modification of the DC / DC converter in the first embodiment of the present invention. FIG. 15 is a front view showing a motor according to the second embodiment of the present invention. FIG. 16 is a diagram illustrating a process of inserting stator teeth into a circuit board in the second embodiment of the present invention. 17 is a cross-sectional view taken along line BB in FIG. FIG. 18 is a partial perspective view showing a modification of the stator in the second embodiment of the present invention. FIG. 19 is a circuit diagram of the circuit board shown in FIG. FIG. 20 is a timing chart showing control by the drive circuit in the second embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< first embodiment >>
Below, the example which applied the coil drive device which concerns on this invention to DC / DC converter is demonstrated, referring FIGS.

  FIG. 1 is a circuit diagram of a DC / DC converter according to the present embodiment, FIG. 2 is a diagram illustrating an overall configuration of the DC / DC converter according to the present embodiment, and FIGS. It is a figure showing a circuit board in one embodiment.

  As shown in FIG. 1, the DC / DC converter 10 according to the present embodiment includes a primary circuit 20 and a secondary circuit 30, and converts the input DC power into DC power having a desired voltage. It is. For example, the DC power supply 11 is connected between the terminals 21 and 22 of the primary circuit 20, and the load 12 is connected between the terminals 31 and 32 of the secondary circuit 30.

  The primary side circuit 20 includes four power modules P1 to P4, a capacitor C1, and a primary coil 41 of the transformer 40, and constitutes a so-called full bridge circuit (H bridge circuit).

  Specifically, the series circuit of the first and second power modules P1 and P2, the series circuit of the third and fourth power modules P3 and P4, and the capacitor C1 are connected in parallel between the terminals 21 and 22. It is connected. One end of the primary coil 41 is connected between the first power module P1 and the second power module P2, and the other end of the primary coil 41 is between the third power module P3 and the fourth power module P4. It is connected to the.

  The secondary side circuit 30 also includes four power modules P <b> 5 to P <b> 8, a capacitor C <b> 2, and a secondary coil 42 of the transformer 40, and constitutes a full bridge circuit similar to the primary side circuit 20. Specifically, a series circuit of fifth and sixth power modules P5 and P6, a series circuit of seventh and eighth power modules P7 and P8, and a capacitor C2 are connected in parallel between terminals 31 and 32. It is connected. One end of the secondary coil 42 is connected between the fifth power module P5 and the sixth power module P6, and the other end of the secondary coil 42 is connected to the seventh power module P7 and the eighth power module P8. Connected between.

  The circuit configurations of the primary side circuit 20 and the secondary side circuit 30 are not particularly limited to this, and may be, for example, a forward method, a flyback method, a push-pull method, or a half bridge method.

  The power modules P1 to P8 include switching elements S1 to S8 and diodes D1 to D8 connected in antiparallel to the switching elements S1 to S8, respectively. In this example, IGBTs (Insulated Gate Bipolar Transistors) are used as the switching elements S1 to S8, but the present invention is not particularly limited thereto. For example, MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) or bipolar transistors may be used as the switching elements S1 to S8.

  In the present embodiment, as shown in FIG. 2, the primary circuit 20 is formed by two circuit boards 50A and 50B, and the secondary circuit 30 is also formed by two circuit boards 50C and 50D.

  The first circuit board 50A has a first electric circuit 51A including first and second power modules P1 and P2 and a first coil 411 (upper portion of the primary coil 41 in FIG. 1). ing. The second circuit board 50B includes a second electric circuit 51B including third and fourth power modules P3 and P4 and a second coil 412 (a lower portion of the primary coil 41 in FIG. 1). have. The primary circuit 20 is configured by electrically connecting the first coil 411 of the first circuit board 50A and the second coil 412 of the second circuit board 50B.

  Similarly, the third circuit board 50C is a third electric circuit including fifth and sixth power modules P5 and P6 and a third coil 421 (upper portion of the secondary coil 42 in FIG. 1). 51C. The fourth circuit board 50D is a fourth electric circuit including the seventh and eighth power modules P7 and P8 and the fourth coil 422 (the lower portion of the secondary coil 42 in FIG. 1). 51D. The secondary circuit 30 is configured by electrically connecting the third coil 421 of the third circuit board 50C and the fourth coil 422 of the fourth circuit board 50D.

  Since all of the first to fourth circuit boards 50A to 50D have the same configuration, the configuration of the first circuit board 50A will be described in detail below, and the configurations of the second to fourth circuit boards 50B to 50D will be described. The description of is omitted.

  As shown in FIGS. 3A to 3C, the first circuit board 50A includes a first electric circuit 51A and a board 52, and the two power modules P1 and P2 are provided. It is mounted on the first main surface 52a of the substrate 52, and the first coil 411 is also provided on the first main surface 52a.

The substrate 52 is, for example, an IMS (Insulated Metal Substrate) in which resin insulating films are laminated on both sides of an aluminum layer, a ceramic plate mainly composed of aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (AlN). Or it is comprised from the insulated substrate comprised from a resin material. The substrate 52 has an opening 52c penetrating the substantial center thereof, and the first coil 411 is provided on the substrate 52 so that the winding portion 411a of the first coil 411 surrounds the opening 52c. It has been.

  An AC terminal 511, a high potential terminal 512, and a low potential terminal 513 are provided on the upper end portion of the substrate 52. One end of the first coil 411 is connected to the AC terminal 511. On the other hand, the first power module P1 is connected to the high potential terminal 512, the second power module P2 is connected to the low potential terminal 513, and the first power module P2 is connected to the first coil. The other end of 411 is connected.

  Although not particularly illustrated, at least one of the AC terminal 511, the high potential terminal 512, and the low potential terminal 513 may be provided at the lower end portion of the substrate 52 or may be provided at the periphery of the opening 52c of the substrate 52. . When the terminals 511 to 513 are provided on the periphery of the opening 52c, bus bars 541 to 543 described later are also disposed in the opening 52c.

  The first coil 411 may be a wiring pattern formed by patterning a metal layer laminated on the substrate 52, or may be one in which an insulated wire is wound.

  When the first coil 411 is configured with a wiring pattern, as shown in FIG. 3B, the winding portion 411a is wound in a spiral shape from the outside to the inside on the first main surface 52a of the substrate 52. And a lead wiring portion 411b extending from the inner end of the winding portion 411a to the second power module P2. The lead-out wiring part 411b has a jumper part 411c that gets over the winding part 411a (see FIG. 9).

  4A and 4B are diagrams showing a first modification of the circuit board in the present embodiment, and FIGS. 5A to 5C are second modifications of the circuit board in the present embodiment. FIGS. 6A to 6C are diagrams showing a third modification of the circuit board in the present embodiment.

  As shown in FIGS. 4A and 4B, instead of the lead wiring portion 411b, an internal wiring 411d is formed inside the substrate 52, and the inside of the winding portion 411a is formed via the internal wiring 411d. The end and the second power module P2 may be connected. Thereby, when the 1st and 2nd circuit boards 50A and 50B are laminated | stacked, the fall of the coil occupation rate by the jumper part 411c can be prevented.

  Alternatively, as shown in FIGS. 5A to 5C, in addition to the first winding portion 411a, a second winding portion 411e is provided on the second main surface 52b of the substrate 52. The inner end of the first winding portion 411a and the inner end of the second winding portion 411e may be connected via a through hole 411f. Thereby, when the 1st and 2nd circuit boards 50A and 50B are laminated | stacked, the fall of the coil occupation rate by the jumper part 411c can be prevented. In this case, the first and second power modules P1 and P2 are mounted on the second main surface 52b of the substrate 52.

  On the other hand, when the first coil 411 is formed of an insulated wire, a support wall 521 is erected around the periphery of the opening 52 c of the substrate 52, and the insulated wire is wound around the support wall 521. Note that in the case where the first coil 411 is configured by a wiring pattern, the support wall 521 may be omitted.

  Further, when the first coil 411 is formed of an insulated wire, as shown in FIGS. 6A to 6C, the substrate 52 is made small, and the lead wiring portion 411b of the first coil 411 is used. May be bonded and fixed to the substrate 52, and the winding portion 411a may not be fixed to the substrate 52. Thereby, a coil occupation rate improves further.

  FIG. 7A and FIG. 7B are diagrams showing a circuit board to which a heat dissipation member is attached in the present embodiment.

  The first circuit board 50A described above is thermally connected to air-cooled or water-cooled heat radiating means. For example, as shown in FIGS. 7A and 7B, a plate-like heat radiating member 53 made of a high thermal conductivity material is thermally connected to the end of the first circuit board 50A. Also good. As a specific example of the high thermal conductivity material constituting the heat radiating member 53, graphite can be exemplified, but it is not particularly limited thereto.

  In this case, it is preferable that the projection 523 is formed at the end portion of the first circuit board 50 </ b> A, the insertion hole 531 is formed in the heat dissipation member 53, and the projection 523 is inserted into the insertion hole 531. Since graphite has a particularly high heat conduction performance along the planar direction, by inserting the protrusion 523 into the insertion hole 531, the contact area along the planar direction can be increased, and the heat dissipation effect can be improved. In order to avoid interference with the terminals 511 to 513 and the bus bars 541 to 543, a notch 532 is formed at the end of the heat dissipation member 53.

  As described above, in this embodiment, since the power modules P1 and P2 and the coil 411 are provided on the same substrate 52, the power modules P1 and P2 and the coil 411 are connected by the same heat dissipation member 53 via the substrate 52. It can cool, and the DC / DC converter 10 can be reduced in size and weight.

  FIG. 8A is a diagram illustrating a process of laminating a circuit board in the present embodiment, and FIG. 8B is a diagram illustrating a process of inserting a convex portion of the core into the circuit board in the present embodiment.

  As shown in FIG. 8A, the first circuit board 50A and the second circuit board 50B are stacked on each other. Further, as shown in FIG. 8B, the stacked bodies 50A and 50B are stacked. The convex portion 431 of the first core 43 of the transformer 40 is inserted into the opening 52c. Similarly, the third and fourth circuit boards 50C and 50D are stacked on each other, and the convex portion 441 of the second core 44 of the transformer 40 is inserted into the opening 52c of the stacked bodies 50C and 50D. And as shown in FIG. 2, the 1st core 43 and the 2nd core 44 are combined so that convex part 431,441 may oppose.

  At this time, as shown in the figure, in the first and second circuit boards 50A and 50B, the AC terminals 511 are electrically connected to each other via the AC bus bar 541, and the high potential terminals 512 are connected to each other. And the low potential terminals 513 are also electrically connected via the low potential bus bar 543.

  Similarly, in the third and fourth circuit boards 50C and 50D, the AC terminals 511 are electrically connected to each other via the AC bus bar 541, and the high potential terminals 512 are electrically connected to each other via the high potential bus bar 542. The low potential terminals 513 are also electrically connected via the low potential bus bar 543.

  9 is a cross-sectional view of a portion A in FIG. 3B, FIGS. 10A and 10B are diagrams showing a fourth modification of the circuit board in the present embodiment, and FIGS. (C) is a figure which shows the circuit board which attached the capacitor | condenser in this embodiment.

  As shown in FIG. 9, a recess 522 may be provided in a portion corresponding to the jumper portion 411c of the second circuit board 50B on the second main surface 52b of the first circuit board 50A. Thereby, when the 1st and 2nd circuit boards 50A and 50B are laminated | stacked, the fall of the coil occupation rate by the jumper part 411c can be prevented.

  Also, as shown in FIGS. 10A and 10B, high potential terminals 512 and low potential terminals 513 and wiring patterns 514 to 516 are provided on the second main surface 52b of the first circuit board 50A. Then, the second coil 412 on the second circuit board 50B and the power module P0 are connected via the wiring pattern 514, the power module P0 and the high potential terminal 512 are connected via the wiring pattern 515, and the wiring pattern 516 is connected. The power module P0 and the low-potential terminal 513 may be connected via

  Thereby, by laminating the first and second circuit boards 50A and 50B, the second coil 412, the power module P0, and the terminals 512 and 513 can be connected, so that the bonding work is unnecessary. Man-hours can be reduced and space can be saved. The power module P0 shown in the figure is a lateral type in which the first power module P1 and the second power module P2 described above are integrated into one chip and the high potential electrode and the low potential electrode are led out in the same direction. It is a module.

  Further, as shown in FIGS. 11A to 11C, the capacitor C1 is disposed in the vicinity of the upper ends of the circuit boards 50A and 50B, and the capacitor C1 is connected to the high potential terminal 512 of the circuit boards 50A and 50B. And may be connected to the low potential terminal 513. As the capacitor C1, a multilayer ceramic capacitor or a film capacitor can be used.

  When the circuit boards 50A and 50B are stacked, a certain amount of space is secured at the end portions. In the present embodiment, by disposing the capacitor C1 in such a space, it is possible to save space and stabilize electrical operation by shortening the wiring. Instead of the capacitor C1 or in addition to the capacitor C1, a drive circuit for controlling the first to fourth power modules P1 to P4 may be disposed in the vicinity of the upper ends of the circuit boards 50A and 50B. .

  FIGS. 12A and 12B are views showing a state where the circuit board shown in FIGS. 7A and 7B is incorporated in a DC / DC converter.

  When the heat dissipation member 53 is attached to the first to fourth circuit boards 50 </ b> A to 50 </ b> D, as shown in FIGS. 12A and 12B, the casing 13 of the DC / DC converter 10 is attached. A through hole 131 is formed, and the heat radiating member 53 is projected from the through hole 131 to the outside of the housing 13. Note that a sealing material is filled between the heat dissipation member 53 and the inner wall surface of the through hole 131.

  In the above-described embodiment, the primary circuit 20 is configured by the two circuit boards 50A and 50B, but the number of circuit boards configuring the primary circuit 20 is not particularly limited. Similarly, the number of circuit boards constituting the secondary circuit 30 is not particularly limited.

  FIG. 13 is a diagram showing a fifth modification of the circuit board in the present embodiment, and FIG. 14 is a diagram showing a modification of the DC / DC converter in the present embodiment.

  For example, the primary circuit 20 may be configured by a single circuit board 50E as shown in FIG. In the circuit board 50E, the first to fourth power modules P1 to P4 are mounted on the same board 52.

  Or as shown in FIG. 14, you may comprise a primary side circuit by the six circuit boards 50F-50K. The circuit boards 50F, 50H, and 50J have the same configuration as the above-described first circuit board 50A, and the circuit boards 50G, 50I, and 50K have the same configuration as the above-described second circuit board 50B. In the example shown in FIG. 14, the three primary side circuits 20 shown in FIG. 1 are provided, and the three primary side circuits 20 are connected in parallel.

  Thus, in this embodiment, since the coil and the power module corresponding to it are unitized by each circuit board, the capacity of the coil can be easily increased. In addition, since the connection points of the coil and the power module are independent from each other, the problem of current balance due to parallelization does not occur. Furthermore, by stacking a plurality of circuit boards, it is possible to dissipate the heat generated by the coil and the power module and to easily increase the heat dissipation area.

  The DC / DC converter 10 in the present embodiment corresponds to an example of a transformer in the present invention, and the first to eighth power modules P1 to P8 in the present embodiment correspond to an example of a semiconductor element in the present invention. The capacitor C1 and the drive circuit in the embodiment correspond to an example of the electronic component in the present invention, and the bus bars 541 to 543 in the present embodiment correspond to an example of the electrical connection member in the present invention.

<< Second Embodiment >>
Next, an example in which the coil driving device according to the present invention is applied to the motor 60 will be described with reference to FIGS. In the following description, an example in which the present invention is applied to a radial gap type motor will be described. However, the present invention is not particularly limited thereto, and the present invention may be applied to an axial gap type motor.

  15 is a front view showing the motor in the present embodiment, FIG. 16 is a diagram showing a process of inserting stator teeth into the circuit board in the present embodiment, FIG. 17 is a cross-sectional view taken along line BB in FIG. FIG. 19 is a partial perspective view showing a modification of the stator in this embodiment, FIG. 19 is a circuit diagram of the circuit board shown in FIG. 18, and FIG. 20 is a timing chart showing control by the drive circuit in this embodiment.

  As shown in FIG. 15, the motor 60 in this embodiment is a three-phase dielectric motor including a cylindrical stator 61 and a rotor 62 inserted into the stator 61. A plurality (six in this example) of teeth 611 protrude from the inner periphery of the stator 61. As shown in FIG. 16, the circuit boards 50 are attached to the respective teeth 611 by inserting the teeth 611 into the openings 52 c of the circuit board 50.

  In this example, as shown in FIG. 15, two laminated circuit boards 50 are attached to one tooth 611, and these two circuit boards 50 provide an electrical one-phase circuit. Forming.

  Since the circuit board 50 has the same configuration as the circuit board 50A described in the first embodiment, the same reference numerals are given to the portions of the circuit board 50 that have the same configuration as the first embodiment. Thus, the description of the configuration of the circuit board 50 is omitted. Further, although not particularly illustrated, the end portion of the circuit board 50 is thermally connected to the heat radiating means such as the above-described heat radiating member 53 similarly to the circuit board 50A of the first embodiment.

  Thus, in this embodiment, since the power modules P1 and P2 and the coil 411 are provided on the same substrate 52 as in the first embodiment, the power modules P1 and P2 and the coil are provided via the substrate 52. Since 411 can be cooled by the same heat dissipation means, the motor 60 can be reduced in size and weight.

  Similarly to the first embodiment, the projection 523 is formed on the circuit board 50, the insertion hole 531 is formed in the heat dissipation member 53, and the projection 523 is inserted into the insertion hole 531, thereby improving the heat dissipation effect. (See FIG. 7 (a) and FIG. 7 (b)).

  Similarly to the first embodiment, an internal wiring 411d may be formed inside the substrate 52 instead of the lead-out wiring portion 411b (see FIGS. 4A and 4B). Alternatively, as in the first embodiment, in addition to the first winding portion 411a, a second winding portion 411e is provided on the second main surface 52b of the substrate 52, and the inside of the first winding portion 411a. You may connect an end and the inner side end of the 2nd coil | winding part 411e via the through hole 411f (refer Fig.5 (a)-FIG.5 (c)). Thereby, when the circuit board 50 is laminated | stacked, the fall of the coil occupation rate by the jumper part 411c can be prevented.

  Similarly to the first embodiment, it is not necessary to make the substrate 52 small and to bond and fix only the lead wiring portion 411 b of the first coil 411 to the substrate 52 and not to fix the winding portion 411 a to the substrate 52. (Refer to Drawing 6 (a)-Drawing 6 (c)). Thereby, a coil occupation rate improves further.

  Similarly to the first embodiment, a recess 522 may be provided in a portion corresponding to the jumper portion 411c of another circuit board 50 on the first main surface 52b of the circuit board 50 (see FIG. 9). Thereby, when the circuit board 50 is laminated | stacked, the fall of the coil occupation rate by the jumper part 411c can be prevented.

  Similarly to the first embodiment, high potential terminals 512 and low potential terminals 513 and wiring patterns 514 to 516 may be provided on the second main surface 52b of the circuit board 50 (FIG. 10A and FIG. 10). 10 (b)). This eliminates the need for bonding work, thereby reducing man-hours and saving space.

  In the present embodiment, since the teeth 611 are inserted into the openings 52 c of the circuit board 50, a part of the circuit board 50 protrudes above the teeth 611. On the other hand, the back yoke 612 adjacent to the teeth 611 is lower and flatter than the circuit board 50. In this embodiment, as shown in FIG. 15, the back yoke 612 is provided with a high potential bus bar 641 and a low potential bus bar 642. Each of the bus bars 641 and 642 has an annular shape, and a low potential bus bar 642 is laminated on the high potential bus bar 641 with an insulating material 643 interposed therebetween as shown in FIG.

  Further, in the present embodiment, a capacitor 65 is mounted on the bus bars 641 and 642. Specifically, the high potential terminal 651 of the capacitor 65 is connected to the high potential bus bar 641. The high potential terminal 651 is connected to the high potential terminals 512 of the two circuit boards 50 via the wiring 66.

  Similarly, the low potential terminal 652 of the capacitor 65 is also connected to the low potential bus bar 642. Although not particularly illustrated, the low potential terminal 652 is connected to the low potential terminals 513 of the two circuit boards 50 through wiring. Incidentally, the AC terminals 511 of all the circuit boards 50 included in the motor 60 are electrically connected via a connection member (not shown).

  As described above, in the present embodiment, by arranging the bus bars 641 and 642 and the capacitor 65 on the back yoke 612 of the stator 61, the space can be saved and the electrical operation can be stabilized by shortening the wiring. Can do. Instead of the capacitor 65 or in addition to the capacitor 65, a drive circuit described later may be disposed in the back yoke 611.

  The number of circuit boards 50 attached to one tooth 611 is not particularly limited. For example, as shown in FIG. 18, four circuit boards 50 may be attached to one tooth 611. In this case, as shown in FIG. 19, the electric circuit 51A of the four circuit boards 50 is connected in parallel to form a circuit for one electrical phase.

  As described above, in this embodiment, as in the first embodiment, the coils and the power modules corresponding to the coils are unitized by the individual circuit boards, so that the capacity of the coils can be easily increased. In addition, since the connection points of the coil and the power module are independent from each other, the problem of current balance due to parallelization does not occur. Further, by stacking a plurality of circuit boards, it is possible to disperse the heat generated by the coil and the power module and to easily increase the heat dissipation area.

  In the example shown in FIG. 19, since the plurality of electric circuits 51A are connected in parallel, the drive circuit controls the switching elements of the electric circuit 51A to reduce the ripple current as follows. Can do.

  Specifically, as shown in FIG. 20, the drive circuit operates a switching element mounted on one circuit board 50 and a switching element mounted on another circuit board 50 in opposite phases. In this way, when a certain switching element is turned on, the other switching element is turned off, so that the ripple current can be canceled out. As a result, the capacitor 65 can be reduced in size.

  Incidentally, although not particularly illustrated, a power module in which a DC power source or a smoothing capacitor is connected between the high potential terminal and the low potential terminal in FIG. 19 and the DC power supplied from the DC power source is mounted on the circuit board 50. It is converted into AC power by switching.

  The motor 60 in the present embodiment corresponds to an example of the electric motor in the present invention, the power modules P1 and P2 in the present embodiment correspond to an example of the semiconductor element in the present invention, and the capacitor 65 and the drive circuit in the present embodiment correspond to the present invention. The bus bars 641 to 643 in this embodiment correspond to an example of the electrical connection member in the present invention.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  In the above-described embodiment, the example in which the coil driving device according to the present invention is applied to a DC / DC converter or a motor has been described. However, the present invention is not particularly limited thereto. For example, the coil drive device according to the present invention may be applied to a solenoid valve (electromagnetic valve) or an electric pump.

DESCRIPTION OF SYMBOLS 10 ... DC / DC converter 20 ... Primary side circuit P1-P4 ... 1st-4th power module C1 ... Capacitor 30 ... Secondary side circuit P5-P8 ... 5th-8th power module C2 ... Capacitor 40 ... Transformer DESCRIPTION OF SYMBOLS 41 ... Primary coil 411 ... 1st coil 412 ... 2nd coil 42 ... Secondary coil 43 ... 1st core 44 ... 2nd core 50, 50A-50K ... Circuit board 51A-51D ... Electric circuit 511 ... AC Terminal 512: High potential terminal 513: Low potential terminal 52 ... Substrate 52c ... Opening 523 ... Projection 53 ... Heat dissipation member 541 ... AC bus bar 542 ... High potential bus bar 543 ... Low potential bus bar 60 ... Motor 61 ... Stator 611 ... Teeth 612 ... Back Yoke 641 ... High potential bus bar 642 ... Low potential bus bar 643 ... Insulating material 65 ... Capacitor

Claims (13)

An electrical circuit including a semiconductor element and a coil electrically connected to the semiconductor element;
A coil drive device comprising: a circuit board having a substrate on which the semiconductor element is mounted and at least a part of the coil is fixed. The coil drive device according to claim 1,
The coil driving device includes heat radiating means thermally connected to the substrate,
The substrate has an opening penetrating the substrate;
The coil drive device according to claim 1, wherein the coil is provided on at least one main surface of the substrate so as to surround the opening. The coil drive device according to claim 2,
The heat dissipating means has a heat dissipating member composed of a high thermal conductivity material,
The substrate has a protrusion at an end of the substrate;
The coil drive device, wherein the protrusion is inserted into the heat dissipation member. The coil drive device according to any one of claims 1 to 3,
A plurality of the circuit boards stacked on each other;
The coil drive device, wherein the electrical circuits of the plurality of circuit boards are electrically connected in parallel. The coil drive device according to any one of claims 1 to 4,
The coil is
A winding portion wound from the outside to the inside on the main surface of the substrate;
An internal wiring which passes through the inside of the substrate from the inner end of the winding portion and is drawn out to the end portion of the substrate. The coil drive device according to any one of claims 1 to 4,
The coil is
A first winding portion wound from the outside to the inside on one main surface of the substrate;
A second winding portion wound from the inside to the outside on the other main surface of the substrate;
A coil driving apparatus comprising: a through-wiring that penetrates the substrate and electrically connects an inner end of the first winding portion and an inner end of the second winding portion. The coil drive device according to any one of claims 1 to 4,
The coil is
A winding portion wound from the outside to the inside on the main surface of the substrate;
A lead-out wiring part drawn from the inner end of the winding part to the end of the substrate,
The lead-out wiring portion includes a jumper portion overcoming the winding portion,
The other circuit board laminated on the circuit board has a recess in a portion corresponding to the jumper part. The coil drive device according to any one of claims 1 to 7,
The other circuit board laminated on the circuit board has a wiring pattern at a position corresponding to the semiconductor element of the circuit board,
A coil driving apparatus characterized in that the semiconductor elements and the wiring pattern are electrically connected by stacking the circuit boards. The core,
A coil drive device according to any one of claims 2 to 8,
The transformer, wherein the convex part of the core is inserted into the opening of the substrate. The transformer according to claim 9, wherein
The transformer includes at least one of an electronic component or an electrical connection member,
The circuit board has terminals to which at least one of the electronic component or the electrical connection member is electrically connected at an end of the board,
At least one of the electronic component or the electrical connection member is disposed in the vicinity of an end of the substrate. An electric motor including a stator and a rotor,
The electric motor includes the coil driving device according to any one of claims 2 to 8,
An electric motor, wherein teeth of the stator are inserted into the opening of the substrate. The electric motor according to claim 11,
The electric motor includes at least one of an electronic component or an electrical connection member,
At least one of the electronic component or the electrical connection member is disposed on a back yoke of the stator. The electric motor according to claim 11 or 12,
The electric motor includes a drive circuit that operates the semiconductor element mounted on the circuit board and the conductive element mounted on another circuit board in opposite phases.

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