JP2014174253A - Protection plate manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a protection plate manufacturing method capable of improving the quality of products.SOLUTION: A protection plate manufacturing method includes: a process for cutting off a protection substrate 1 having a printing layer 2 formed thereon along a peripheral direction of the printing layer 2 to form a prescribed shape; and a process for forming an adhesive layer by applying an adhesive agent on the printing layer 2 formed on the protection substrate 1 cut off in the prescribed shape.

Description

  The present invention relates to a method for manufacturing a protective plate used for a display such as an image display liquid crystal panel used in a mobile phone, a digital camera, or the like.

  Conventionally, for example, a protection plate used for a display such as an image display liquid crystal panel as shown in Patent Document 1 is known. This protective plate is manufactured in a state in which a gap formed when printing ink is formed on the substrate surface is filled with a transparent resin and there is no step. The protective plate manufactured in this way is attached to the display with a double-sided tape.

JP 2010-176111 A

  However, when the double-sided tape is used as described above, there is a possibility that a sticking position shift or a foreign matter may be attached, and the quality may be deteriorated. Therefore, in order to solve the problem, it is conceivable to apply glue instead of the double-sided tape.

  However, if the double-sided tape is simply replaced with glue, there is a problem that when the substrate is cut to a predetermined size, chips adhere to the glue and the quality cannot be improved.

  Then, in view of the said problem, this invention aims at providing the manufacturing method of the protection board which can improve quality.

  Means for solving the above-described problems can be achieved by the following means. In addition, although the code | symbol in a parenthesis attaches the referential mark of embodiment mentioned later, this invention is not limited to this.

According to the method for manufacturing a protective plate according to claim 1, the step of cutting the protective substrate (1) on which the printed layer (2) is formed into a predetermined shape along the circumferential direction of the printed layer (2);
A step of applying an adhesive to the printed layer (2) formed on the protective substrate (1) cut into the predetermined shape to form an adhesive layer (5).

Moreover, according to the manufacturing method of the protection board which concerns on Claim 2, in the manufacturing method of the protection board of the said Claim 1, it is on the opposite side to the printing layer surface of the protection board | substrate (1) cut | disconnected by the said predetermined shape. Further including a step of attaching a back side protective tape (4) to the back side of the protective substrate (1) located;
After the back-side protective tape (4) is attached to the back side of the protective substrate (1), an adhesive is applied to the printed layer (2) formed on the protective substrate (1), and the adhesive layer (5 ).

And according to the manufacturing method of the protection board which concerns on Claim 3, in the manufacturing method of the protection board of the said Claim 2, it prints on the printing layer surface side of the protection board (1) in which the printing layer (2) was formed. A step of attaching the surface-side protective tape (3);
A process of cutting the protective substrate (1) into a predetermined shape along the circumferential direction of the printing layer (2) after the printing surface side protective tape (3) is attached to the printing layer surface side of the protective substrate (1). When,
Attaching a back side protective tape (4) to the back side of the protective substrate (1) located on the opposite side of the printed layer surface of the protective substrate (1) cut into the predetermined shape;
After the back side protective tape (4) is attached to the back side of the protective substrate (1), the back side of the protective substrate (1) is brought into contact with the suction table (T) to thereby apply the suction table (T And a step of peeling the printing surface side protective tape (3) from the printing layer surface side of the protective substrate (1),
After peeling off the printing surface side protective tape (3) from the printing layer surface side of the protective substrate (1), an adhesive is applied to the printing layer (2) formed on the protective substrate (1), and the adhesive layer ( 5) is formed.

  On the other hand, according to the method for producing a protective plate according to claim 4, in the method for producing a protective plate according to any one of claims 1 to 3, the printed layer formed on the protective substrate (1). In forming the adhesive layer (5) by applying an adhesive to (2), the protective substrate (1) is positioned at a predetermined position by the positioning control means (positioning frame W) and then applied to the printed layer (2). A pressure-sensitive adhesive is applied to form a pressure-sensitive adhesive layer (5).

  On the other hand, according to the method for manufacturing a protective plate according to claim 5, in the method for manufacturing a protective plate according to any one of claims 1 to 4, printing formed on the protective substrate (1). After the adhesive is applied to the layer (2) to form the adhesive layer (5), the protective substrate (1) is heated by the heating means (plate heater H), vibrated by the vibrating means, or by the rocking means. It is characterized by an amplitude motion.

  Next, effects of the present invention will be described with reference numerals in the drawings. In addition, although the code | symbol in a parenthesis attaches the referential mark of embodiment mentioned later, this invention is not limited to this.

  According to the invention according to claim 1, the protective substrate (1) is cut into a predetermined shape along the circumferential direction of the printed layer (2) of the protective substrate (1) on which the printed layer (2) is formed, and then An adhesive layer (5) is formed on the print layer (2). Therefore, it is possible to prevent a situation in which chips generated when the protective substrate (1) is cut into a predetermined shape adhere to the adhesive layer (5), thereby improving the quality.

  Moreover, according to the invention which concerns on Claim 2, after the back surface side protection tape (4) is stuck on the back surface side of the protection substrate (1), the printed layer (2) formed on the protection substrate (1) ) Is applied to form a pressure-sensitive adhesive layer (5). Therefore, when the pressure-sensitive adhesive layer (5) is formed on the printed layer (2), the protective substrate (1) cut into a predetermined shape moves. The situation can be prevented. Therefore, the adhesive layer (5) can be reliably formed on the printed layer (2).

  Furthermore, according to the invention which concerns on Claim 3, after the back side protective tape (4) is stuck on the back side of the protective substrate (1), the back side of the protective substrate (1) is attached to the suction table (T). The printing surface side protective tape (3) is peeled off from the printing layer surface side of the protective substrate (1). Therefore, the elongation that occurs when the printing surface side protective tape (3) is peeled off is prevented, and the slight deviation of the printing layer (2) caused by the elongation of the printing surface side protection tape (3) (for example, several tens of microns). ) Can be prevented.

  On the other hand, according to the invention which concerns on Claim 4, when apply | coating an adhesive to the printing layer (2) currently formed in the protective substrate (1) and forming an adhesive layer (5), the said protective substrate (1) is used. After positioning at a predetermined position by the positioning control means (positioning frame W), an adhesive is applied to the printed layer (2) to form an adhesive layer (5). For this reason, since the adhesive layer (5) can be formed on the printed layer (2) after fixing the protective substrate (1) to the optimum position, the adhesive layer (5) is securely attached to the printed layer (2). Can be formed.

  On the other hand, according to the invention which concerns on Claim 5, after apply | coating an adhesive to the printing layer (2) currently formed in the protective substrate (1) and forming an adhesive layer (5), the said protective substrate (1) is attached. Since it is heated by the heating means (plate heater H), vibrated by the vibrating means, or is oscillated by the swinging means, the adhesive layer (5) is flattened, so that the adhesion area is increased, and the adhesive Will be improved. Furthermore, since the defoaming treatment can also be performed by this heating, vibration, or amplitude motion, the adhesiveness can be further improved.

The manufacturing process of the protection board which concerns on one Embodiment of this invention is shown, (a) is a partial longitudinal cross-sectional view which shows the raw material of the protection board which concerns on the embodiment, (b) is the upper surface of the protection board shown to (a) (C) shows the state which has stuck the printing surface side protective tape on the surface of the protective substrate in which the printing layer shown in (b) was formed in (b). It is a partial longitudinal cross-sectional view, (d) is a partial longitudinal cross-sectional view showing a state in which the protective substrate to which the printing surface side protective tape is attached is cut. The manufacturing process of the protection board which concerns on the embodiment is shown, (a) is a part which shows the state which has stuck the back side protection tape on the back side of the protection board cut | disconnected as shown in FIG.1 (d). A longitudinal sectional view, (b) is a partial longitudinal sectional view showing a state in which the printing surface side protective tape is peeled off in a state where the protective substrate with the back side protective tape attached is adsorbed to the adsorption table, (c) ) Is a partial longitudinal sectional view showing a state in which an adhesive layer is formed on the printed layer of the protective substrate from which the printing surface side protective tape has been peeled off. (A) is a front view of the protective substrate shown in FIG. 1 (b), (b) is a printing surface side protective tape affixed on the surface of the protective substrate on which the printed layer is formed as shown in FIG. 1 (c). It is a front view after being done. (A) is a perspective view of FIG.1 (d), (b) is a perspective view of FIG.2 (b). (A) is a perspective view of FIG.2 (c), (b) is a perspective view which shows the state which has heated the protective substrate in which the adhesion layer was formed with the plate heater. (A) is a perspective view after manufacturing a plurality of protective plates, (b) is a longitudinal sectional view showing a state in which one of the protective plates shown in (a) is attached to a liquid crystal panel for image display.

  Hereinafter, an embodiment of a method for producing a protective plate according to the present invention will be specifically described with reference to FIGS. In addition, in the following description, when showing the direction of up, down, left and right, it means up, down, left and right when viewed from the front of the figure.

  When manufacturing the protective plate according to this embodiment, a protective substrate 1 as shown in FIG. The protective substrate 1 is transparent and formed in a rectangular shape in cross section, and is formed of polyethylene terephthalate or the like. The upper and lower surfaces of the protective substrate 1 are attached with peelable transparent upper and lower resin films 1a and 1b.

  Then, printing is performed on the upper surface of the protective substrate 1 by screen printing or the like. Specifically, the upper resin film 1a of the protective substrate 1 is peeled, and then the upper surface of the protective substrate 1 is printed by screen printing or the like, so that the printed layer 2 as shown in FIG. It is formed. As shown in FIG. 3A, the print layer 2 is formed in a rectangular shape, and a plurality of print layers 2 are formed at predetermined intervals over the entire surface of the protective substrate 1.

  Subsequently, as shown in FIG.1 (c), the resinous printing surface side protective tape 3 which can be peeled is affixed on the surface of the protection substrate 1 in which the printing layer 2 was formed. Specifically, as shown in FIG. 1 (c), the protective substrate 1 on which the printing layer 2 is formed is moved in the direction of the arrow S1, and an upper and lower roll Ra made of a metal roll such as chrome plating or a rubber roll such as butyl rubber. , Rb, the resinous printed surface side protective tape 3 that can be peeled off is attached to the surface of the protective substrate 1 on the side where the printed layer 2 is formed. As a result, the printing surface side protective tape 3 is adhered over the entire surface of the protective substrate 1 as shown by the hatched portion in FIG. By doing so, it is possible to prevent a situation in which foreign matter is mixed into the printing layer 2 and the quality is deteriorated.

  Next, a plurality of printed layers 2 (see FIG. 3) formed at predetermined intervals over the entire surface of the protective substrate 1 are individually separated using a machine tool such as an NC (Numerical Control) lathe. The protective substrate 1 is cut into a predetermined shape. Specifically, as shown in FIG. 1D, from the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed), as shown in FIG. A cutting tool C such as a wheel provided in a machine tool (not shown) is moved in the directions of arrows P1 and P2 along the circumferential direction 2 to make the protective substrate 1 have a predetermined shape, that is, a plurality of rectangular shapes. Cut to form. As a result, as shown in FIG. 1 (d), a cut hole 10 having a rectangular shape in cross section is formed in the protective substrate 1 along the end face of the printed layer 2. In this embodiment, the protective substrate 1 is cut using the cutting tool C from the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed). The protective substrate 1 may be cut into a predetermined shape from the printing surface (the surface on which the printing layer 2 is formed) of the protective substrate 1. However, it is preferable to cut the protective substrate 1 into a predetermined shape using the cutting tool C from the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed). This is because the end surface of the printing layer 2 may become rough due to cutting and the quality may be deteriorated.

  Next, as shown in FIG. 2 (a), the back side of the protective substrate 1 (the side opposite to the side on which the printing layer 2 is formed), that is, the resinous resin that can be peeled off on the surface of the lower resin film 1b. Adhere the back side protective tape 4. Specifically, as shown in FIG. 2 (a), the protective substrate 1 in the state shown in FIG. 1 (d) is moved in the direction of the arrow S2, and is made up and down of a metal roll such as chrome plating or a rubber roll such as butyl rubber. A resin property that can be peeled off on the surface of the lower resin film 1b provided on the back side of the protective substrate 1 (on the side opposite to the surface on which the printing layer 2 is formed) by passing between the rolls Ra and Rb. The back side protective tape 4 is attached.

  Next, as shown in FIGS. 2B and 4B, the printing surface side protective tape 3 adhered to the surface of the protective substrate 1 on the side where the printing layer 2 is formed is peeled off. Specifically, as shown in FIGS. 2B and 4B, the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed), that is, the lower resin film 1b. The back side protective tape 4 stuck on the surface is brought into contact with the suction table T and sucked. The suction table T is formed in a rectangular thick plate shape as shown in FIG. 4B, and is arranged in the thickness direction (shown in FIG. 2B and FIG. 4B) with a predetermined interval. A plurality of intake holes Ta are provided in the vertical direction on the front side. Then, using a vacuum device (not shown) from the suction holes Ta, air between the back side protective tape 4 and the suction table T is sucked, and the back side of the protective substrate 1 (the surface on which the printing layer 2 is formed) Is the opposite surface side), that is, the back side protective tape 4 adhered on the surface of the lower resin film 1b is adsorbed to the adsorption table T. And in this state, as shown in FIG.2 (b) and FIG.4 (b), the printing surface side protective tape 3 is peeled. In this way, the elongation that occurs when the printing surface side protective tape 3 is peeled off is prevented, and a slight deviation (for example, several tens of microns) of the printing layer 2 caused by the elongation of the printing surface side protective tape 3 is prevented. Can be prevented.

  Next, as shown in FIGS. 2C and 5A, the adhesive layer 5 is formed on the printed layer 2. Specifically, as shown in FIGS. 2 (c) and 5 (a), a plurality of pneumatic or mechanical dispensers D (four in the drawing) are used, and the dispensers D are arranged in the directions of arrows P3 and P4. And an adhesive such as an ultraviolet curable pressure sensitive type is applied to the upper surface of the printing layer 2 to form the adhesive layer 5. At this time, before forming the adhesive layer 5 on the printing layer 2 with the dispenser D, the protective substrate 1 (see FIGS. 2B and 4B) after peeling the printing surface side protective tape 3 is used. As shown in FIG. 5A, the protective substrate 1 is positioned at a predetermined position by being applied to an L-shaped positioning frame W. Thereafter, the adhesive layer 5 is formed on the printing layer 2. In this way, the adhesive layer 5 can be formed on the printed layer 2 after the protective substrate 1 is fixed at an optimal position, and therefore the adhesive layer 5 can be reliably formed on the printed layer 2. . Furthermore, since the back side protective tape 4 is stuck on the surface of the lower resin film 1b provided on the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed). When the adhesive layer 5 is formed on the printing layer 2, it is possible to prevent the protective substrate 1 cut by the machine tool from moving. Therefore, the adhesive layer 5 can be more reliably formed on the print layer 2. In the present embodiment, the protective substrate 1 is placed against the L-shaped positioning frame W for positioning. However, the present invention is not limited to this, and positioning may be performed by fixing with a pin. Any method may be used. In the present embodiment, the adhesive layer 5 is formed using a plurality of pneumatic or mechanical dispensers D. However, the present invention is not limited to this, and the adhesive layer 5 is formed using a printing method such as screen printing. You may make it do.

  Next, after forming the adhesive layer 5 on the printed layer 2, as shown in FIG. 5B, on the thick plate heater H, the back side of the protective substrate 1 (the surface on which the printed layer 2 is formed) Is the opposite surface side), that is, the back side protective tape 4 adhered on the surface of the lower resin film 1b is brought into contact with the back side of the protective substrate 1 to be heated. As a result, the pressure-sensitive adhesive layer 5 is flattened, so that the adhesion area is increased, thereby improving the adhesiveness. Furthermore, since the defoaming treatment can be performed by this heating, the adhesiveness can be further improved. In this embodiment, the thick plate-like plate heater H is used to heat the back side of the protective substrate 1. However, the present invention is not limited to this, and a vibrator (for example, On the plate device with a built-in vibrator having a frequency range of 5 to 10,000 Hz), the back side of the protective substrate 1 (the side opposite to the surface on which the printing layer 2 is formed), that is, the lower resin film 1b The protective substrate 1 may be vibrated by abutting the back side protective tape 4 adhered on the surface. Even if it does in this way, the adhesion layer 5 will be planarized, an adhesion area will spread, and, thereby, adhesiveness will improve. Furthermore, since the defoaming treatment can be performed by this vibration, the adhesiveness can be further improved. On the other hand, on the oscillating plate device that vibrates the thick plate itself in a predetermined direction, the back side of the protective substrate 1 (the side opposite to the side on which the printing layer 2 is formed), that is, the lower resin film The protective substrate 1 may be moved in an amplitude manner by contacting the back side protective tape 4 adhered on the surface 1b. Even if it does in this way, the adhesion layer 5 will be planarized, an adhesion area will spread, and, thereby, adhesiveness will improve. Furthermore, since the defoaming process can be performed by this amplitude motion, the adhesiveness can be further improved.

  Thus, after the above processing is completed, the back side of the protective substrate 1 (on the side opposite to the surface on which the printing layer 2 is formed) from the thick plate heater H, that is, the lower resin film 1b. If the back side protective tape 4 stuck on the surface is separated and the lower resin film 1b and the back side protective tape 4 are peeled off, as shown in FIG. 16 pieces) will be manufactured. As shown in FIG. 6A, the protective plate K is formed by forming a printing layer 2 on the upper surface of a rectangular protective substrate 1 and forming an adhesive layer 5 on the upper surface of the printing layer 2. . The protective plate K manufactured in this way is used by being attached to the image display liquid crystal panel PD via the adhesive layer 5 as shown in FIG. 6B.

  Thus, according to this embodiment described above, when the protective plate K is manufactured, after the printing layer 2 is formed on the protective substrate 1, the protective substrate 1 is formed in a predetermined shape along the circumferential direction of the printing layer 2. Then, since the adhesive layer 5 is formed on the printed layer 2, it is possible to prevent a situation where chips generated when the protective substrate 1 is cut into a predetermined shape are attached to the adhesive layer 5. . Thereby, quality can be improved.

DESCRIPTION OF SYMBOLS 1 Protective substrate 2 Printing layer 3 Printing surface side protection tape 4 Back side protection tape 5 Adhesive layer K Protection plate T Suction stand Ta Intake hole H Plate heater (heating means)
W Positioning frame (positioning control means)
C Cutting tool

Claims (5)

Cutting the protective substrate on which the printing layer is formed into a predetermined shape along the circumferential direction of the printing layer;
And a step of applying a pressure-sensitive adhesive to a printed layer formed on the protective substrate cut into the predetermined shape to form a pressure-sensitive adhesive layer. The method further includes a step of attaching a back side protective tape to the back side of the protective substrate located on the side opposite to the printed layer surface of the protective substrate cut into the predetermined shape,
The adhesive layer is formed by applying an adhesive to a printed layer formed on the protective substrate after a back protective tape is attached to the back side of the protective substrate. The manufacturing method of the protection board of description. A step of attaching a printing surface side protective tape to the printing layer surface side of the protective substrate on which the printing layer is formed;
After the printing surface side protective tape is attached to the printing layer surface side of the protective substrate, the step of cutting the protective substrate into a predetermined shape along the circumferential direction of the printing layer;
A step of attaching a back side protective tape to the back side of the protective substrate located on the side opposite to the printed layer surface of the protective substrate cut into the predetermined shape;
After the back side protective tape is attached to the back side of the protective substrate, the back side of the protective substrate is brought into contact with the suction stand to be sucked to the suction stand, and the printing surface side protective tape is attached to the protective substrate. And a step of peeling from the printed layer surface side of
3. The adhesive layer is formed by peeling off the printing surface side protective tape from the printed layer surface side of the protective substrate and then applying an adhesive to the printed layer formed on the protective substrate. The manufacturing method of the protection board as described in 2.   In forming an adhesive layer by applying an adhesive to the printed layer formed on the protective substrate, the protective substrate is positioned at a predetermined position by the positioning control means, and then the adhesive is applied to the printed layer. The method for producing a protection plate according to any one of claims 1 to 3, wherein the protective plate is formed.   After an adhesive is applied to the printing layer formed on the protective substrate to form an adhesive layer, the protective substrate is heated by a heating means, vibrated by a vibrating means, or subjected to an amplitude motion by a rocking means. The manufacturing method of the protection board of any one of Claims 1-4 characterized by the above-mentioned.

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