JP2014170842A - Led module and lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module from which different light fluxes can be emitted without change of a board design and a lighting system including the LED module installed therein.SOLUTION: An LED module 1 includes: an LED chip group Cg having a plurality of LED chips 3, 4, 5 which are different in a structure or a shape and emit the same color light; a substrate 2 on which a mounting region 7 where the LED chip group Cg is mounted and wiring bodies 10, 11 electrically connected with the LED chips 3, 4 5 are provided on one surface 2a side thereof; and a translucent sealing resin 6 provided on the one surface 2a side of the substrate 2 so as to cover the LED chip group Cg and the mounting region 7.

Description

  Embodiments described herein relate generally to an LED module in which an LED chip as a light source is sealed with a sealing resin, and an illumination device in which the LED module is disposed.

  In the lighting device, a plurality of LED chips are arranged side by side on one side of the substrate and a bank (frame portion) surrounding the LED chips is provided, and the bank is filled with a translucent resin mixed with phosphors, A COB (chip on board) type LED module in which each LED chip is embedded with this translucent resin is used (see, for example, Patent Document 1). The peripheral side of the transparent resin easily flows along the surface of the substrate, and the predetermined stable shape is not formed in the translucent resin by flowing.

  However, if a bank is provided, the cost of the LED module increases due to the time and effort required for the material and formation of the bank. In addition, there is a problem that the appearance of the LED module is impaired by the bank that does not emit light. Furthermore, in recent years, large luminaires such as base lights for facilities have become widespread, and the enlargement of LED modules used in these luminaires is accompanied by difficulty in manufacturing.

  For this reason, some LED modules directly seal the LED chip with a translucent resin without forming a bank (see, for example, Patent Document 2). That is, LED chips are mounted on a substrate at regular intervals, and a thixotropic sealing resin containing a phosphor is applied to cover the LED chips.

  The LED module is used not only for lighting equipment but also for various LED lamps such as a bulb-type LED lamp, a straight tube LED lamp, and a ring-shaped LED lamp.

JP 2011-60961 A (page 6, FIG. 3) JP2013-4941A (page 4, FIG. 1)

  In the LED module formed by directly applying the sealing resin to the LED chip, the emitted light beam is determined on the same substrate depending on the mounting interval of the LED chip and the size of the mounting range. However, in recent years, in the illumination design of lighting fixtures, there is a demand for diversity of emitting various luminous fluxes for LED modules having substrates of the same size.

  An object of the present invention is to provide an LED module from which different luminous fluxes are emitted without changing the substrate design, and an illumination device in which the LED module is disposed.

The LED module of the embodiment includes an LED chip group, a substrate, and a sealing resin.
The LED chip group has a plurality of LED chips that have different structures or shapes and emit the same kind of colored light.
The substrate is provided with a mounting area and a wiring body on one surface side. An LED chip group is mounted in the mounting area, and a plurality of LED chips are connected to the wiring body.
The sealing resin has translucency and is provided on one surface side of the substrate so as to cover the LED chip group and the mounting region of the substrate.

  According to this embodiment, in the plurality of LED chips that emit the same kind of colored light mounted on the mounting area of the substrate, the substrate design is changed by changing the structure or shape of the plurality of LED chips. Instead, it is possible to form an LED module that emits different luminous fluxes of the same kind of color light.

It is a schematic top view of the LED module which shows the 1st Embodiment of this invention. It is a partial schematic top view which saw through the sealing resin of the LED module same as the above. It is an enlarged view of the A part of FIG. 2 same as the above. It is a schematic sectional drawing of the BB arrow direction of FIG. 3 same as the above. It is the partial schematic top view which saw through the sealing resin of the LED module which shows the 2nd Embodiment of this invention. It is an illuminating device which shows the 3rd Embodiment of this invention, (a) is a schematic perspective view, (b) is a partially notched schematic side view.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, a first embodiment of the present invention will be described.
The LED module 1 of the present embodiment is configured as shown in FIGS. In addition, in each figure, the same code | symbol is attached | subjected to the same part and the overlapping description is abbreviate | omitted. The LED module 1 includes a substrate 2, LED chip groups Cg of a plurality of LED chips 3, 4 and 5, and a sealing resin 6.

  In FIG. 1, a substrate 2 is made of a synthetic resin, for example, a glass epoxy material, and is formed into a long rectangle whose one surface 2a and the other surface 2b (shown in FIG. 4) are planar. For example, the long dimension is 280 to 300 mm, and the short dimension (width) is 15 to 20 mm. Further, the substrate 2 having a thickness of 0.5 to 1.8 mm is used, and a substrate having a thickness of 1.2 mm is used here.

  As shown in FIG. 3, the substrate 2 is provided with a mounting portion 9 having a mounting region 7 and connecting bodies 8 and 8, and a pair of wiring bodies 10 and 11 on one surface 2 a side. . LED chips 3, 4 and 5 constituting the LED chip group Cg are mounted on the mounting portion 9, and a sealing resin 6 is provided. The mounting portion 9 serves as a light emitting portion of the LED module 1 and is provided at equal intervals along the longitudinal direction of the substrate 2 as shown in FIG. 1 and has a predetermined interval in the short direction. In two rows.

  The substrate 2 is provided with an input terminal 12 and a connection terminal 13 on both ends 2c and 2d in the longitudinal direction. The substrate 2 is provided with a plurality of mounting holes 14 and the like. As shown in FIG. 4, for example, the copper foil 15 and the resist layer 16 are formed on the copper foil 15 over the entire other surface 2 b of the substrate 2. The copper foil 15 and the resist layer 16 reinforce the substrate 2 in cooperation with each other in order to prevent the substrate 2 from warping.

  The mounting area 7 has a three-layer structure of first to third metal layers 17, 18 and 19 formed on the one surface 2 a of the substrate 2. The first metal layer 17 is formed, for example, by etching a copper foil formed on the one surface 2a of the substrate 2 into a predetermined shape. The second metal layer 18 is made of, for example, nickel plated on the first metal layer 17, and the third metal layer 19 is made of, for example, silver or gold plated on the second metal layer 18. Yes. The first to third metal layers 17, 18, and 19 are each formed to a thickness of 10 μm, for example.

  Further, the connecting bodies 8 are formed in a three-layer structure as in the mounting region 7. That is, it consists of a metal layer 20 made of, for example, nickel plated on the wiring bodies 10, 11 made of copper foil, and a metal layer 21 made of, for example, silver or gold plated on this metal layer 20. The wiring bodies 10 and 11 and the metal layers 20 and 21 are each formed to a thickness of 10 μm, for example.

  The mounting region 7 is also referred to as a mounting pad, and as shown in FIG. 3, the upper surface 7a is formed in a substantially ax shape in which both sides in the minor axis direction of an ellipse are cut out in an arc shape. The connection bodies 8 and 8 are also called wiring pads, and the upper surfaces 8a and 8a are formed in an elliptical shape. The connecting bodies 8 are formed on both sides of the mounting area 7 in the short axis direction while securing a predetermined insulation distance from the mounting area 7.

  On the one surface 2a side of the substrate 2, a white resist 22 is formed by, for example, screen printing so that the upper surface 7a of the mounting region 7 and the upper surfaces 8a and 8a of the connection bodies 8 and 8 are exposed. The white resist 22 has an electrical insulating property and a function as a light reflecting layer. Further, as shown in FIG. 4, the white resist 22 is applied to the one surface 2 a of the substrate 2 so as to protrude outward from the upper surface 7 a of the mounting region 7 and the upper surfaces 8 a and 8 a of the connectors 8 and 8. ing. The white resist 12 prevents the pair of wiring bodies 10 and 11 from being exposed to air, thereby preventing the pair of wiring bodies 10 and 11 from being deteriorated.

  An LED chip group Cg composed of a plurality of LED chips 3, 4, 5 is mounted on the upper surface 7 a of the mounting area 7. The LED chips 3, 4, and 5 are bonded to the upper surface 7 a of the mounting region 7 using a die bond material 23 having translucency.

  The LED chips 3, 4, and 5 emit the same kind of colored light, but have different structures or shapes. Here, the same kind of colored light means that the wavelength difference between the colored lights emitted from the LED chips 3, 4, and 5 allows a maximum of 15 nm. The LED chips 3, 4, and 5 having different structures or shapes have different light emission amounts. And in this embodiment, while radiating | emitting blue light, respectively, as shown in FIG. 3, the thing from which size (shape) differs is used. The LED chips 3, 4, and 5 are each formed in a substantially rectangular parallelepiped shape, for example, with a known configuration.

  The LED chip 3 becomes a maximum size LED chip, and the ratio of the total maximum dimension length of the maximum dimension lengths L2 and L3 of the remaining LED chips 4 and 5 to the maximum dimension length L1 is less than 2.0. The LED chips 4 and 5 are formed in a shape having a larger size. The lower limit of the ratio is inevitably determined according to the allowable size of the LED chips 3, 4, and 5, and is 0.2 in this embodiment. The LED chip 3 is larger in size than the LED chips 4 and 5 because of its maximum size.

  The LED chip 3 is mounted on the central portion of the upper surface 7 a of the mounting region 7. The LED chips 4 and 5 are arranged side by side on both sides of the LED chip 3 with the LED chip 3 interposed therebetween, and are mounted with 180 ° rotational symmetry. That is, the LED chips 3, 4, and 5 are arranged so that their longitudinal directions are along the minor axis direction of the mounting region 7. The LED chips 4 and 5 may be arranged on both sides of the LED chip 3 so as to be 90 ° rotationally symmetric.

  And each 1st electrode 3a, 4a, 5a of LED chip 3, 4, 5 is electrically connected to the upper surface 8a of one connection body 8 by the bonding wire 24, respectively, and each 2nd electrode 3b, 4b and 5b are electrically connected to the upper surface 8a of the other connecting body 8 by bonding wires 24, respectively. The first electrodes 3a, 4a and 5a are on the anode side, and the second electrodes 3b, 4b and 5b are on the cathode side. The first electrodes 3a, 4a, 5a and the second electrodes 3b, 4b, 5b are connected to the pair of wiring bodies 10, 11 via the connecting bodies 8, 8.

  The pair of wiring bodies 10 and 11 are formed, for example, by etching a copper foil formed on one surface 2a of the substrate 2 into a predetermined wiring pattern, and are formed in a predetermined width having a thickness of 10 μm, for example. Yes. And as shown in FIG. 2, a pair of wiring bodies 10 and 11 connect several LED chips 3, 4, and 5 (LED chip group Cg) in parallel every 4 sets, and connect in series for every said 4 sets. doing. The wiring bodies 10 and 10 on one end side 2 c of the substrate 2 are electrically connected to the input terminal 12, and the wiring bodies 11 and 11 on the other end side 2 d of the substrate 2 are electrically connected to the connection terminal 13.

  The plurality of LED chips 3, 4, 5 have the first electrodes 3 a, 4 a, 5 a and the first electrodes 3 a, 4 a, 5 a and the second electrodes 3 b, 4 b, 5 b so that current flows between the first electrodes 3 a, 4 a, 5 a and the second electrodes 3 b, 4 b, 5 b. Two electrodes 3 b, 4 b, 5 b are connected to a pair of wiring bodies 10, 11 via connection bodies 8, 8.

  Note that the number of sets of the plurality of LED chips 3, 4, 5 (LED chip group Cg) connected in parallel by the pair of wiring bodies 10, 11 is not limited to four, and may be any number. .

  The connection terminal 13 is electrically connected to the input terminal 12 of the LED module 1 adjacent to the LED module 1 arranged in parallel by an electric connection means (not shown) such as a lead wire. The connection terminals 13 of the single LED module 1 or the rearmost LED module 1 arranged side by side are electrically connected to the wiring bodies 11 and 11 so as to electrically connect the two rows of wiring bodies 11 and 11 together. A connected terminal (not shown) is short-circuited by a short-circuit means such as a lead wire.

  When a predetermined power is supplied to the input terminal 12 from a lighting device (not shown), the LED module 1 is applied with a predetermined voltage between the wiring bodies 10 and 10 electrically connected to the input terminal 12, and a plurality of LEDs A predetermined current flows through the chips 3, 4, and 5. Thus, the plurality of LED chips 3, 4, 5 (LED chip group Cg) emit light (light on) and emit blue light.

  In FIG. 4, the sealing resin 6 is provided on the white resist 22 so as to cover the LED chip group Cg composed of the plurality of LED chips 3, 4, 5, the mounting region 7, and the connecting bodies 8, 8. . The sealing resin 6 includes, for example, a resin-based silicone resin or a hybrid-type silicone resin having translucency as a main component, and a predetermined amount of phosphor particles 25 and a filler (not shown) are mixed. The phosphor particles 25 have a particle size of 1 μm or more and are dispersed substantially uniformly in the sealing resin 6. As the phosphor particles 25, yellow phosphor particles that are excited by blue light emitted from the LED chips 3, 4, 5 and emit yellow light are used.

  The sealing resin 6 is molded into a semispherical cross section by providing and solidifying a predetermined amount of the cross sectional shape in a predetermined dome shape, for example, a hemispherical shape, in the mounting portion 9. Here, the sealing resin 6 is formed so that the ratio of the height from above the white resist 22 to the maximum bottom diameter on the white resist 22, that is, the aspect ratio is 0.2 or more and 1.0 or less.

  In the sealing resin 6, blue light emitted from the LED chips 3, 4, and 5 and yellow light emitted from the phosphor particles 25 are mixed, and white light is emitted from the outer surface 6 a of the sealing resin 6. Is done. When the sealing resin 6 is formed with the above aspect ratio, it is possible to suitably mix blue light and yellow light, and thereby, white light in which variation in chromaticity is suppressed can be obtained.

When the LED module 1 emits blue light, the phosphor particles 25 are not mixed with the sealing resin 6. Further, the cross-sectional shape of the sealing resin 6 may be triangular.
Next, the operation of the first embodiment of the present invention will be described.

  When predetermined power is supplied to the input terminal 12 of the substrate 2, the LED module 1 supplies a predetermined amount to the LED chip group Cg composed of the plurality of LED chips 3, 4, 5 via the pair of wiring bodies 10, 11. Current flows. The LED chips 3, 4 and 5 each emit blue light. A part of the blue light is wavelength-converted to yellow light by the yellow phosphor 25 mixed in the sealing resin 6. Then, white light in which blue light and yellow light are mixed is emitted outward from the outer surface 6 a of the sealing resin 6. Since the cross-sectional shape of the sealing resin 6 is formed in a predetermined shape, for example, a hemispherical shape, variation in chromaticity of white light emitted from each mounting portion 9 of the substrate 2 is suppressed, and the white light is It is emitted in the direction.

  The largest size LED chip 3 is mounted at the center of the upper surface 7a of the mounting area 7, and the remaining LED chips 4 and 5 are arranged on both sides of the LED chip 3 with the LED chip 3 in between, and rotated 180 °. Since it is mounted on the upper surface 7a of the mounting region 7 so as to be symmetrical, the central portion of the mounting region 7 has the maximum luminous intensity through the sealing resin 6, and a substantially uniform luminous intensity can be obtained around the circumference. Thereby, in the LED module 1, the brightness dispersion | variation of the emitted light radiate | emitted in the predetermined direction from the outer surface 6a of each sealing resin 6 is suppressed.

  The ratio of the total maximum dimension length of the maximum dimension lengths L2 and L3 of the LED chips 3 and 4 to the maximum dimension length L1 of the LED chip 3 of the plurality of LED chips 3, 4, and 5 is less than 2.0. Therefore, the luminous intensity of the circumference of the central portion of the mounting region 7 can be made smaller than that of the central portion of the mounting region 7, thereby suppressing the luminance variation and chromaticity variation on the outer surface 6a of the sealing resin 6. .

  The LED module 1 emits the same type of color light (for example, blue light). By appropriately using LED chips having different structures or shapes, different light beams can be emitted without changing the substrate 2. Can be formed.

  According to the LED module 1 of this embodiment, the LED chip group Cg has a plurality of LED chips 3, 4, 5 that have different structures or shapes and emit the same kind of colored light (blue light). By changing the structure or shape of the LED chips 3, 4, 5 mounted in the mounting area 7 of 2, the amount of light emitted from the LED chips 3, 4, 5 can be changed, thereby changing the board design Without having to, the same kind of color light can be formed so that different light beams can be emitted.

  The LED chip 3 is mounted at the center of the upper surface 7a of the mounting area 7, the remaining LED chips 4 and 5 are arranged side by side on both sides of the LED chip 3 with the LED chip 3 interposed therebetween, and are 180 ° rotationally symmetric. Thus, the central portion of the mounting region 7 has the maximum luminous intensity, and a substantially uniform luminous intensity can be obtained in the circumference thereof, thereby suppressing the luminance variation of the emitted light emitted from the LED module 1. It has the effect of being able to.

  The ratio of the total maximum dimension length of the maximum dimension lengths L2 and L3 of the LED chips 3 and 4 to the maximum dimension length L1 of the LED chip 3 of the plurality of LED chips 3, 4, and 5 is less than 2.0. Therefore, the central portion of the mounting region 7 has the maximum luminous intensity, and the circumferential luminous intensity can be made smaller than that of the central portion of the mounting region 7, whereby the light is emitted from the outer surface 6 a of each sealing resin 6. This has the effect that the luminance variation and chromaticity variation of the emitted light can be suppressed.

  In the present embodiment, the LED chip group Cg has three LED chips 3, 4, and 5 having different sizes, but is not limited to this, and has two or four or more LED chips. It may be. That is, the LED chip group Cg may have at least two LED chips that have different structures or shapes and emit the same kind of colored light. Therefore, the LED chip group Cg may include two or more identical LED chips. For example, in FIG. 3, two LED chips 3 may be juxtaposed in the same direction, and LED chips 4 and 5 may be juxtaposed in the same direction on both sides of the two LED chips 3.

  In the present embodiment, the plurality of LED chips 3, 4, 5 have different sizes (dimensions) in a substantially rectangular parallelepiped shape. However, the present invention is not limited thereto, and the height dimensions may be different. The shape may be different depending on the difference in the main body shape such as a cubic shape, a cylindrical shape or a prismatic shape, or a difference in the size or size thereof. Moreover, not only a shape but a structure may differ. For example, the material of the main body and the position of the light emitting unit may be different. In other words, the LED chip group Cg emits the same kind of colored light, and is formed by appropriately combining a plurality of LED chips having different light emission amounts.

In the present embodiment, the plurality of LED chips 3, 4, and 5 are face-up types having both electrodes 3 a to 5 a and 3 b to 5 b on the upper surface side of the main body, but are not limited thereto. An up-and-down type having one electrode 3a to 5a on the upper surface side of the main body and another electrode 3b to 5b on the lower surface side, and a face-down type having both electrodes 3a to 5a and 3b to 5b on the lower surface side of the main body It may be. In the vertical type, for example, one electrode 3 a to 5 a is connected to one connection body 8 by a bonding wire 24, and the other electrode 3 b to 5 b is directly connected to the other connection body 8. A pair of wiring bodies 10 and 11 are provided. In the face-down type, a pair of wiring bodies 10 and 11 are provided so that both electrodes 3a to 5a and 3b to 5b are directly connected to the connecting bodies 8 and 8. In these cases, the connection body 8 is included in the mounting area 7 of the plurality of LED chips 3, 4, 5 (LED chip group Cg).
Next, a second embodiment of the present invention will be described.
The LED module 1A of the present embodiment is configured as shown in FIG. 3 that are the same as those in FIG. 3 are assigned the same reference numerals, and redundant descriptions are omitted.

  The LED module 1A is the LED module 1 shown in FIG. 3, in which the LED chips 4 and 5 are arranged in a straight line in the short axis direction of the mounting region 7 and the LED of the maximum size in the long axis direction of the mounting region 7 It is mounted so as to be juxtaposed with the chip 3. The ratio of the mounting area length L5 of the LED chips 4 and 5 to the mounting area length L4 of the LED chip 3 is less than 2.0. Further, the LED chip 3 and the LED chips 4 and 5 are provided in the central portion of the mounting region 7 so that the distance between them is as small as possible.

  Since the LED chip 3 and the LED chips 4 and 5 are provided in the central portion of the mounting region 7, the luminous intensity in the central portion of the mounting region 7 is maximized. Further, radiated light is emitted centering on the central portion of the mounting region 7 through the sealing resin 6, thereby suppressing variations in luminance and chromaticity of the radiated light emitted from the outer surface 6 a of each sealing resin 6. Is done.

According to the LED module 1A of the present embodiment, the LED chip group Cg is mounted with the LED chip 3 having the maximum size and the remaining LED chips 4 and 5 arranged in a straight line in parallel in the same direction. Since it is mounted on the mounting region 7 so that the luminous intensity at the center of the region 7 is maximized, it is possible to suppress the luminance variation and chromaticity variation of the emitted light emitted from the outer surface 6a of each sealing resin 6. It has the effect.
Next, a third embodiment of the present invention will be described.
The lighting fixture 31 of this embodiment is comprised as shown in FIG. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  The lighting fixture 31 is a lighting device (ceiling light) that is directly attached to the ceiling surface. As shown in FIG. 6B, the lighting fixture 31 is a fixture main body 32, the LED module 1 and the lighting device 33 shown in FIG. It is comprised. The instrument main body 32 is formed in the rectangular plate shape which has the standing part 32a with low height on four sides, for example with a cold rolled steel plate. As shown in FIG. 6A, the instrument main body 32 is provided with a V cover 34 in the longitudinal direction at the center in the lateral direction, and a diffusion cover on both sides of the V cover 34 in the longitudinal direction. 35 is disposed.

  The V cover 34 is formed of a thin steel plate into a substantially V-shaped cylindrical shape, and the outer surface 34a is formed in white. Further, the diffusion cover 35 is formed in a substantially concave cylindrical shape with, for example, translucent polycarbonate (PC) resin, and is whitened. End plates 36 and 36 are attached to both ends of the V cover 34 in the longitudinal direction, and caps 37 and 37 are attached to both ends of the diffusion cover 35 in the longitudinal direction. The end plate 36 and the cap 37 are each formed of polycarbonate resin.

  As shown in FIG. 6B, the LED module 1 is attached to a mounting plate 38 fixed to the instrument body 32 by screws (not shown) in the diffusion cover 35. A plurality of, for example, four LED modules 1 are provided in each diffusion cover 35. Within each diffusion cover 35, the plurality of LED modules 1 are connected in series. The LED module 1 is connected to the lighting device 33 by a lead wire (not shown).

  The lighting device 33 is attached to the instrument main body 32 in the V cover 34. In the lighting device 33, an input line (not shown) is connected to an external commercial AC power source, and a lead wire (output line) (not shown) is connected to the LED module 1 in each diffusion cover 35. The lighting device 33 is formed by a known configuration that supplies a predetermined current to the LED module 1 to light the LED chips 3, 4, and 5 of the LED chip group Cg.

  Since the lighting fixture 31 of this embodiment arrange | positions the several LED module 1 which can radiate | emit a desired light beam using the same board | substrate 2, it has the effect that a to-be-irradiated surface side can be illuminated with desired illumination light. .

  The above-described embodiment of the present invention has been presented as an example, and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... LED module, 2 ... Board | substrate, 3, 4, 5 ... LED chip, 6 ... Sealing resin, 7 ... Mounting area | region, 10, 11 ... Wiring body, 31 ... Lighting fixture as lighting apparatus, 32 ... As apparatus main body Instrument body, 33 ... lighting device, Cg ... LED chip group

Claims (5)

An LED chip group having a plurality of LED chips of different structure or shape and emitting the same kind of colored light;
A substrate provided with a mounting area on which the LED chip group is mounted and a wiring body electrically connected to the plurality of LED chips;
A translucent sealing resin provided on one side of the substrate so as to cover the LED chip group and the mounting region;
An LED module comprising:   The LED chip group is composed of three or more LED chips, and is mounted in the mounting region such that the remaining LED chips are arranged on both sides of the maximum size LED chip. LED module.   The LED chip group is composed of three or more LED chips, and is mounted in the mounting region so that the LED chip of the maximum size and the remaining LED chips arranged in a straight line are arranged in parallel in the same direction. The LED module according to claim 1, wherein:   4. The LED according to claim 1, wherein the LED chip group has a ratio of a total maximum dimension length of the remaining LED chips to a maximum dimension length of the LED chip of the maximum size being less than 2.0. 5. module. An LED module according to any one of claims 1 to 4;
An apparatus main body in which the LED module is disposed;
A lighting device for lighting the LED chip group;
An illumination device comprising:

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