JP2015072965A - Led module and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a linearly mounted LED module capable of improving the brightness at both sides in a shorter direction of a luminaire and a luminaire with the LED module disposed thereon.SOLUTION: An LED module 1 includes: a long-shaped base plate 2; LED chips mounted on one face 2a of the base plate 2 in plural rows along the longitudinal direction; and light transmissive encapsulation resins 4, 5 formed at one face 2a of the base plate 2 so as to seal each of the LED chips in a dome-like shape. The shape and size of the encapsulation resin 5 positioned at the outer-most rows of the base plate 2 are different from the shape and the size of the encapsulation resin 4 positioned in a row neighboring the outer-most row.

Description

Embodiments described herein relate generally to an LED module in which an LED chip as a light source is sealed with a translucent sealing resin, and an illumination device in which the LED module is disposed.

In the lighting device, a plurality of LED chips are arranged side by side on one side of the substrate and a bank (frame portion) surrounding the LED chips is provided, and the bank is filled with a translucent resin mixed with phosphors, A COB (chip on board) type LED module in which each LED chip is embedded with this translucent resin is used (see, for example, Patent Document 1). The peripheral side of the transparent resin easily flows along the surface of the substrate, and the predetermined stable shape is not formed in the translucent resin by flowing.

However, if a bank is provided, the cost of the LED module increases due to the time and effort required for the material and formation of the bank. In addition, there is a problem that the appearance of the LED module is impaired by the bank that does not emit light. Furthermore, in recent years, large luminaires such as base lights for facilities have become widespread, and the enlargement of LED modules used in these luminaires is accompanied by difficulty in manufacturing.

For this reason, some LED modules have a linear mounting type in which the LED chip is directly sealed with a translucent resin without forming a bank (see, for example, Patent Document 2). That is, LED chips are mounted on a substrate at regular intervals, and a thixotropic sealing resin containing a phosphor is applied to cover the LED chips.

JP 2011-60961 A (page 6, FIG. 3) JP2013-4941A (page 4, FIG. 1)

In the linear mounting type LED module, since illumination light is emitted from the sealing resin that individually seals the LED chips, uneven illumination easily occurs between the adjacent sealing resins. For this reason, when the illuminance at the extreme end side in the short side direction of the substrate decreases in the longitudinal direction and is incorporated in a large lighting device such as a base light for facilities, the short direction (width direction) of the lighting device is concerned. There is a problem in that both ends of the screen become dim over the longitudinal direction, giving a sense of incongruity to people.

An object of the embodiment of the present invention is to provide a linear mounting type LED module capable of improving the brightness of both ends in the short direction of a lighting fixture, and a lighting device in which the LED module is disposed.

The LED module of the embodiment includes a substrate, an LED chip, and a sealing resin.

The substrate is formed in a long shape, and LED chips are mounted on a surface of the substrate in a plurality of rows along the longitudinal direction. The sealing resin has translucency and is provided on the one surface side of the substrate so as to individually seal the LED chips in a dome shape. In the sealing resin, the shape or size of the sealing resin in the outermost row of the substrate is different from the shape or size of the sealing resin in the row adjacent to the outermost row.

According to the LED module of the present embodiment, the shape or size of the sealing resin in the outermost row of the substrate is different from the shape or size of the sealing resin in the row adjacent to the outermost row. It can be expected that light is emitted outward from the end portion on the outermost side and the end portion, and the outermost side in the short direction of the substrate is brightly illuminated in the longitudinal direction.

It is a schematic top view of the LED module which shows the 1st Embodiment of this invention. It is a partial schematic top view which saw through the sealing resin of the LED module same as the above. It is an enlarged view of the A part of FIG. 2 same as the above. It is a schematic sectional drawing in the BB arrow direction of FIG. 3 same as the above. It is explanatory drawing which shows the shape and magnitude | size of sealing resin in the longitudinal direction of an LED module same as the above. FIG. 3 is a layout view of LED modules in the illumination device. It is a schematic top view of the LED module which shows the 2nd Embodiment of this invention. FIG. 3 is a schematic side view of the LED module in the short direction. It is an illuminating device which shows the 3rd Embodiment of this invention, (a) is a schematic perspective view, (b) is a partially notched schematic side view.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, a first embodiment of the present invention will be described. The LED module 1 of the present embodiment is configured as shown in FIGS. In addition, in each figure, the same code | symbol is attached | subjected to the same part and the overlapping description is abbreviate | omitted. The LED module 1 includes a substrate 2, an LED chip 3, and sealing resins 4 and 5.

In FIG. 1, a substrate 2 is made of a synthetic resin, for example, a glass epoxy material, and is formed into a long rectangle (long shape) having one surface 2a and another surface 2b (shown in FIG. 4) that are planar. For example, the long dimension is 280 to 300 mm, and the short dimension (width) is 15 to 20 mm. Further, the substrate 2 having a thickness of 0.5 to 1.8 mm is used, and a substrate having a thickness of 1.2 mm is used here.

As shown in FIG. 3, the substrate 2 is provided with a mounting portion 9 having a mounting region 7 and connecting bodies 8 and 8, and a pair of wiring bodies 10 and 11 on one surface 2 a side. . The LED chip 3 is mounted on the mounting area 7, and the sealing resin 4 or the sealing resin 5 is provided on the mounting portion 9. The mounting portion 9 serves as a light emitting portion of the LED module 1 and is provided at equal intervals along the longitudinal direction of the substrate 2 as shown in FIG. 1 and has a predetermined interval in the short direction. In two rows.

The substrate 2 is provided with an input terminal 12 and a connection terminal 13 on both end sides 2c and 2d in the longitudinal direction. The substrate 2 is provided with a plurality of mounting holes 14 and the like. As shown in FIG. 4, for example, the copper foil 15 and the resist layer 16 are formed on the copper foil 15 over the entire other surface 2 b of the substrate 2. The copper foil 15 and the resist layer 16 reinforce the substrate 2 in cooperation with each other in order to prevent the substrate 2 from warping.

The mounting area 7 has a three-layer structure of first to third metal layers 17, 18 and 19 formed on the one surface 2 a of the substrate 2. The first metal layer 17 is formed, for example, by etching a copper foil formed on the one surface 2a of the substrate 2 into a predetermined shape. The second metal layer 18 is made of, for example, nickel plated on the first metal layer 17, and the third metal layer 19 is made of, for example, silver or gold plated on the second metal layer 18. Yes. The first to third metal layers 17, 18, and 19 are each formed to a thickness of 10 μm, for example.

Further, the connecting bodies 8 are formed in a three-layer structure as in the mounting region 7. That is, it consists of a metal layer 20 made of, for example, nickel plated on the wiring bodies 10, 11 made of copper foil, and a metal layer 21 made of, for example, silver or gold plated on this metal layer 20. The wiring bodies 10 and 11 and the metal layers 20 and 21 are each formed to a thickness of 10 μm, for example.

The mounting region 7 is also referred to as a mounting pad, and as shown in FIG. 3, the upper surface 7a is formed in a substantially ax shape in which both sides in the minor axis direction of an ellipse are cut out in an arc shape. The connection bodies 8 and 8 are also called wiring pads, and the upper surfaces 8a and 8a are formed in an elliptical shape. The connecting bodies 8 are formed on both sides of the mounting area 7 in the short axis direction while securing a predetermined insulation distance from the mounting area 7.

On the one surface 2a side of the substrate 2, a white resist 22 is formed by, for example, screen printing so that the upper surface 7a of the mounting region 7 and the upper surfaces 8a and 8a of the connection bodies 8 and 8 are exposed. The white resist 22 has an electrical insulating property and a function as a light reflecting layer. Further, as shown in FIG. 4, the white resist 22 is applied to the one surface 2 a of the substrate 2 so as to protrude outward from the upper surface 7 a of the mounting region 7 and the upper surfaces 8 a and 8 a of the connectors 8 and 8. ing. The white resist 12 prevents the pair of wiring bodies 10 and 11 from being exposed to air, thereby preventing the pair of wiring bodies 10 and 11 from being deteriorated.

The LED chip 3 is mounted on the upper surface 7 a of the mounting area 7. The LED chip 3 is bonded to the upper surface 7a of the mounting region 7 using a die bond material 23 having translucency. The LED chip 3 emits blue light, and has a known configuration, for example, a face-up type substantially rectangular parallelepiped shape.

As shown in FIG. 3, the LED chip 3 is mounted on the central portion of the upper surface 7 a of the mounting region 7. Further, the LED chip 3 is arranged so that its longitudinal direction is along the short axis direction of the mounting region 7. The electrode 3a of the LED chip 3 is electrically connected to the upper surface 8a of one connecting body 8 by a bonding wire 24, and the electrode 3b is electrically connected to the upper surface 8a of the other connecting body 8 by a bonding wire 24. Has been. The electrode 3a is on the anode side, and the electrode 3b is on the cathode side. The electrodes 3 a and 3 b are connected to the pair of wiring bodies 10 and 11 through the connection bodies 8 and 8.

The pair of wiring bodies 10 and 11 are formed, for example, by etching a copper foil formed on one surface 2a of the substrate 2 into a predetermined wiring pattern, and are formed in a predetermined width having a thickness of 10 μm, for example. Yes. And as shown in FIG. 2, a pair of wiring bodies 10 and 11 connect the LED chip 3 in parallel for every 4 sets, and are connected in series for every said 4 sets. The wiring bodies 10 and 10 on one end side 2 c of the substrate 2 are electrically connected to the input terminal 12, and the wiring bodies 11 and 11 on the other end side 2 d of the substrate 2 are electrically connected to the connection terminal 13.

In the LED chip 3, the electrode 3a and the electrode 3b are connected to the pair of wiring bodies 10 and 11 via the connection bodies 8 and 8 so that a current flows between the electrode 3a and the electrode 3b. Note that the number of LED chips 3 connected in parallel by the pair of wiring bodies 10 and 11 is not limited to four, and may be an arbitrary number.

The connection terminal 13 is electrically connected to the input terminal 12 of the LED module 1 adjacent to the LED module 1 arranged in parallel by an electric connection means (not shown) such as a lead wire. The connection terminals 13 of the single LED module 1 or the rearmost LED module 1 arranged side by side are electrically connected to the wiring bodies 11 and 11 so as to electrically connect the two rows of wiring bodies 11 and 11 together. A connected terminal (not shown) is short-circuited by a short-circuit means such as a lead wire.

In the LED module 1, when a predetermined power is supplied to the input terminal 12 from a lighting device (not shown), a predetermined voltage is applied between the wiring bodies 10, 10 electrically connected to the input terminal 12, and the LED chip 3 is applied. A predetermined current flows. Thereby, each LED chip 3 emits light (lights up) and emits blue light.

In FIG. 4, the sealing resin 4 is provided on the white resist 22 so as to cover the LED chip 3, the mounting region 7, and the connection bodies 8 and 8. The same applies to the sealing resin 5. The sealing resins 4 and 5 are mainly composed of, for example, a translucent resin-based silicone resin or a hybrid-based silicone resin, and a predetermined amount of phosphor particles 25 and a filler (not shown) are mixed. The phosphor particles 25 have a particle size of 1 μm or more and are dispersed substantially uniformly in the sealing resins 4 and 5. As the phosphor particles 25, yellow phosphor particles that are excited by blue light emitted from the LED chip 3 to emit yellow light are used.

The sealing resins 4 and 5 are molded into a semispherical cross section by providing a predetermined amount in the mounting portion 9 and solidifying the dome shape, for example, a semispherical cross section. Then, as shown in FIG. 1, the sealing resin 4 seals the LED chips 3 mounted in a row along the longitudinal direction of the substrate 2 on one end side 2 e in the short direction of the substrate 2. Further, the sealing resin 5 seals the LED chips 3 mounted in a row along the longitudinal direction of the substrate 2 on the other end side 2f of the substrate 2 in the short direction.

As shown in FIG. 5, the sealing resin 4 has a ratio of the height H1 from the surface 2a side of the substrate 2 to the maximum diameter D1 of the sealing bottom surface 26 on the surface 2a side of the substrate 2 from the surface 2a side of the substrate 2. (Hereinafter referred to as the aspect ratio) is 0.2 or more and 1.0 or less. Strictly speaking, the height H1 is a height from the white resist 22 to the vertex 27.

The sealing resin 5 is a ratio of the height H2 from the surface 2a side of the substrate 2 to the maximum diameter D2 of the sealing bottom surface 28 on the surface 2a side of the substrate 2 (hereinafter referred to as an aspect ratio). In this embodiment, it is provided so as to be 5% or more higher than the aspect ratio of the sealing resin 4. Strictly speaking, the height H2 is a height from the white resist 22 to the vertex 29.

And since the sealing bottom face 26 of the sealing resin 4 and the sealing bottom face 28 of the sealing resin 5 are formed to be equivalent in this embodiment, the height H2 of the sealing resin 5 is sealed. The stop resin 4 is provided to be larger than the height H1. That is, the sealing resin 5 only needs to be provided such that its height H2 is greater than the height H1 of the sealing resin 4, even if the sizes and shapes of the sealing bottom surfaces 26 and 28 are different. It ’s good. Thus, in this embodiment, the sealing resins 4 and 5 are provided so that the size of the sealing resin 5 and the size of the sealing resin 4 are different.

The sealing resins 4 and 5 are provided so that the LED chip 3 is located immediately below the apexes 27 and 29. In the sealing resins 4 and 5, the blue light emitted from the LED chip 3 and the yellow light emitted from the phosphor particles 25 are mixed to generate white light from the outer surfaces 4 a and 5 a of the sealing resins 4 and 5. Is emitted. Since the LED chips 3 are positioned immediately below the vertices 27 and 29 of the sealing resins 4 and 5, blue light is radiated from the LED chips 3 almost uniformly over the entire area. And if sealing resin 4 and 5 is formed with the said aspect-ratio, mixing of blue light and yellow light can be performed suitably. Thereby, white light in which variation in chromaticity is suppressed is obtained.

When the LED module 1 emits blue light, the phosphor particles 25 are not mixed with the sealing resins 4 and 5. Further, the cross-sectional shape of the sealing resins 4 and 5 may be triangular.

And the LED module 1 of this embodiment is mounted in the illuminating devices 30, such as a base light, as shown in FIG. For example, two LED modules 2 are arranged along the longitudinal direction of the apparatus main body 31. In the two LED modules 1, one end side 2 c of one LED module 1 and the other end side 2 d of the other LED module 1 are positioned on one end side 31 a in the longitudinal direction of the apparatus body 31. The other end side 2b of one LED module 1 and the one end side 2c of the other LED module 1 are provided on the other end side 31b. Thus, in the lighting device 30, the sealing resins 5, 5 of the LED modules 1, 1 are positioned along the longitudinal direction of the device main body 31 on both end sides 31 c, 31 d in the short direction of the device main body 31. The sealing resins 4 and 4 are positioned along the longitudinal direction of the apparatus main body 31 on the inner side in the short direction.

Next, the operation of the first embodiment of the present invention will be described.

In the LED module 1, when a predetermined power is supplied to the input terminal 12 of the substrate 2, a predetermined current flows through the LED chip 3 through the pair of wiring bodies 10 and 11. The LED chip 3 emits blue light. A part of the blue light is wavelength-converted into yellow light by the yellow phosphor 25 mixed in the sealing resins 4 and 5. Then, white light in which blue light and yellow light are mixed is emitted outward from the outer surfaces 4a and 5a of the sealing resins 4 and 5. The sealing resins 4 and 5 are provided so that the LED chip 3 is positioned immediately below the apexes 27 and 29, and the cross-sectional shape of the sealing resins 4 and 5 is a predetermined shape such as a hemisphere. Therefore, variation in chromaticity of white light emitted from each mounting portion 9 of the substrate 2 is suppressed, and the white light is emitted in a predetermined direction.

And since the height H2 of the sealing resin 5 provided along the longitudinal direction of the substrate 2 on the other end side 2f in the short direction of the substrate 2 is larger than the height H1 of the sealing resin 4, Accordingly, the white light emitted from the outer surface 5a is emitted toward the outermost side on the outermost side of the other end 2f of the substrate 2. The outermost end portion of the other end side 2 f of the substrate 2 in the short direction is illuminated somewhat brightly over the longitudinal direction of the substrate 2. Accordingly, the lighting device 30 shown in FIG. 6 prevents both end sides 31c and 31d in the short direction of the apparatus main body 31 from being dimmed over the longitudinal direction of the apparatus main body 31, and makes it difficult for a person to feel uncomfortable. .

According to the LED module 1 of the present embodiment, the sealing resin 5 that seals the LED chips 3 in the endmost row in the short side direction of the substrate 2 is high from the one surface 2a side of the substrate 2 at the apex 29. Since the height H2 is larger than the height H1 of the sealing resin 4 adjacent to the sealing resin 5, the emitted light is emitted outward from the end of the substrate 2 in the short side direction and the end. As a result, the outermost end of the substrate 2 in the short direction can be irradiated somewhat brightly across the short direction of the substrate 2.

In addition, in this embodiment, although LED chip 3 was provided in 2 rows along the longitudinal direction of the board | substrate 2, it is not restricted to this, You may provide in 3 or more rows. In this case, the sealing resin 5 is provided along the longitudinal direction of the substrate 2 at the extreme ends of the both ends 2e and 2f in the lateral direction of the substrate 2, and in the longitudinal direction of the substrate 2 at the intermediate side in the lateral direction. The sealing resin 4 may be provided along the length, or the size (height) of the sealing resin may gradually increase from the one end side 2e in the lateral direction toward the other end side 2f. Good. In the former case, for example, one LED module is mounted on the lighting device, and in the latter case, for example, two LED modules can be mounted side by side as shown in FIG.

In the present embodiment, one LED chip 3 is provided between the connecting bodies 8, 8. However, the present invention is not limited to this, and a plurality of LED chips 3 may be provided in parallel. In addition, the LED chip 3 has a substantially rectangular parallelepiped shape, but is not limited thereto, and may be a cube shape, a columnar shape, a prismatic shape, or the like. The LED chip 3 is a face-up type having both electrodes 3a and 3b on the upper surface side of the main body. However, the present invention is not limited to this, and one electrode 3a is provided on the upper surface side of the main body portion and the other is provided on the lower surface side. It may be a top-and-bottom type having the electrode 3b, or a face-down type having both electrodes 3a and 3b on the lower surface side of the main body. In the upper and lower types, for example, one electrode 3a is connected to one connection body 8 by a bonding wire 24, and the other electrode 3b is directly connected to the other connection body 8, so that a pair of wirings Body 10,11 is provided. In the face-down type, a pair of wiring bodies 10 and 11 are provided so that both electrodes 3a and 3b are directly connected to the connection bodies 8 and 8. In these cases, the connection body 8 is included in the mounting area 7 of the LED chip 3.

Next, a second embodiment of the present invention will be described.

The LED module 35 of the present embodiment is configured as shown in FIG. In addition, the same code | symbol is attached | subjected to the part same as FIG. 1, and the overlapping description is abbreviate | omitted.

In the LED module 35, the LED chips 3 are mounted on the one surface 36a side of the substrate 36 along the longitudinal direction at equal intervals and in three rows. The substrate 36 is formed in the same manner as the substrate 2 except that the length in the lateral direction is larger than that of the substrate 2. Then, sealing resins 37, 37 are provided on the LED chips 3, 3 mounted along the longitudinal direction of the substrate 36 at both ends 36e, 36f in the short direction of the substrate 36, and the substrate is provided at the center in the short direction. The sealing resin 4 is provided on the LED chip 3 mounted along the longitudinal direction of 36.

As shown in FIG. 8, the sealing resins 37 and 37 are different in the height direction between the centers 38 c and 38 c and the apexes 39 and 39 on the sealing bottom surfaces 38 and 38. The sealing resins 37 and 37 are provided so that the positions of the vertices 39 and 39 are positioned on the outer side of the extreme ends 37e and 37f of the substrate 36 relative to the positions of the centers 38c and 38c of the sealing bottom surfaces 38 and 38. It has been. The inclination angle K1 of the vertices 39, 39 with respect to the sealing bottom surfaces 38, 38 is 5 ° to 70 ° with respect to the height direction. Further, the sealing resins 37 and 37 are provided so that the LED chips 3 and 3 are located immediately below the apexes 39 and 39. As described above, the shape of the sealing resin 37 in the outermost row of the substrate 36 is different from the shape of the sealing resin 4 in the adjacent row.

The sealing resin 37, 37 has its apexes 39, 39 displaced in the lateral direction of the opposite ends 35 e, 35 f of the substrate 35, and the LED chips 3, 3 are provided directly below the apexes 39, 39. Therefore, the outer surface 37a, 37a side facing the outermost side of the both end sides 35e, 35f is closer to the LED chip 3, 3 than the opposite outer surface 37a, 37a side, and thus emitted from the LED chip 3, 3. The blue light and the yellow light wavelength-converted by the phosphor 25 are likely to be emitted from the outer surfaces 37a and 37a facing the extreme end side. That is, a large amount of radiated light emitted from the outer surfaces 37 a and 37 a of the sealing resins 37 and 37 is emitted to the extreme end sides of the both end sides 35 e and 35 f in the short direction of the substrate 35. As a result, it is possible to illuminate the innermost space on both ends 36e and 36f in the short side direction of the substrate 36 somewhat brightly over the longitudinal direction of the substrate 36. The lighting device on which the LED module 35 is mounted can prevent both ends in the short side direction from being dimmed in the longitudinal direction, and can make it difficult for a person to feel uncomfortable.

Further, even if the sealing resins 37, 37 are inclined and the apexes 39, 39 are deviated outwardly from directly above the centers 38c, 38c of the sealing bottom surfaces 38, 38, the sealing resins 37, 37 Since the LED chips 3, 3 are located directly below the vertices 39, 39, it is possible to suppress a large variation between the LED chips 3, 3 and the entire outer surfaces 37 a, 37 a of the sealing resins 37, 37. It is possible to suppress a decrease or variation in chromaticity of white light emitted from the outer surfaces 37a and 37a.

Next, a third embodiment of the present invention will be described.

The lighting fixture 41 of this embodiment is comprised as shown in FIG. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

The lighting fixture 41 is a lighting device (ceiling light) directly attached to the ceiling surface. As shown in FIG. 9B, the fixture main body 42 as the device main body, the LED module 1 and the lighting device 43 shown in FIG. It is comprised. The instrument main body 42 is formed in a rectangular plate shape having standing portions 42a having low heights on four sides, for example, using a cold rolled steel plate. Then, as shown in FIG. 9A, the instrument main body 42 is provided with a V cover 44 in the longitudinal direction at the center in the lateral direction, and covers 45 on both sides of the V cover 44 in the longitudinal direction. Is arranged.

The V cover 44 is formed of a thin steel plate into a substantially V-shaped cylinder, and the outer surface 44a is formed in white. Further, the cover 45 is formed in a substantially concave cylindrical shape with, for example, translucent polycarbonate (PC) resin, and is whitened. The cover 45 has a low diffusibility. End plates 46 and 46 are attached to both ends of the V cover 44 in the longitudinal direction, and caps 47 and 47 are attached to both ends of the cover 45 in the longitudinal direction. The end plate 46 and the cap 47 are each formed of polycarbonate resin.

As shown in FIG. 9B, the LED module 1 is attached to a mounting plate 48 fixed to the instrument body 42 with screws (not shown) in the cover 45. In each cover 45, a plurality of, for example, four LED modules 1 are provided. Within each diffusion cover 45, the plurality of LED modules 1 are connected in series. The LED module 1 is connected to the lighting device 43 by a lead wire (not shown).

The lighting device 43 is attached to the instrument main body 42 in the V cover 44. In the lighting device 43, an input line (not shown) is connected to an external commercial AC power supply, and a lead wire (output line) (not shown) is connected to the LED module 1 in each diffusion cover 45. The lighting device 43 is formed by a known configuration that supplies a predetermined current to the LED module 1 to light the LED chip 3.

Since the lighting fixture 41 of this embodiment arrange | positions the some LED module 1 which radiates | emits the edge part side of the both ends 2e and 2f of the transversal direction of the board | substrate 2 over the longitudinal direction of the board | substrate 2, a fixture main body It is possible to prevent both end sides in the short direction of 42 from being dim over the longitudinal direction, and to illuminate the irradiated surface side with desired illumination light.

The above-described embodiment of the present invention has been presented as an example, and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... LED module, 2,36 ... Board | substrate, 3 ... LED chip, 4,5,37 ... Sealing resin, 41 ... Lighting fixture as lighting apparatus, 42 ... Appliance main body as apparatus main body, 43 ... Lighting apparatus

Claims (6)

An elongated substrate; LED chips mounted in a plurality of rows along the longitudinal direction on one surface side of the substrate; provided on the one surface side of the substrate so as to individually seal the LED chips in a dome shape And the shape or size of the sealing resin in the outermost row of the substrate is adjacent to the outermost row of the sealing resin. An LED module having a different shape or size. The sealing resin in the outermost row of the substrate is such that the height from the one surface side of the substrate at the apex is greater than the height of the sealing resin in the row adjacent to the outermost row. The LED module according to claim 1, wherein the LED module is provided. The sealing resin in the outermost row of the substrate is such that the ratio of the height from the one surface side of the substrate at the apex to the maximum diameter of the sealing bottom surface is the sealing in the row adjacent to the outermost row. 3. The LED module according to claim 1, wherein the LED module is provided so as to be larger than the ratio of the resin. The sealing resin in the row at the endmost side of the substrate is such that the center and the apex at the bottom of the sealing are different in the height direction, and the position of the apex is the end of the substrate rather than the center position. The LED module according to any one of claims 1 to 3, wherein the LED module is provided so as to be positioned in an outer side direction. 5. The LED module according to claim 1, wherein the LED chip is provided immediately below the apex of the sealing resin on one surface of the substrate. An illumination device comprising: the LED module according to any one of claims 1 to 5; an apparatus main body in which the LED module is disposed; and a lighting device that lights the LED chip.

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