CN203413435U

CN203413435U - LED (light-emitting diode) module and lighting device

Info

Publication number: CN203413435U
Application number: CN201320578396.9U
Authority: CN
Inventors: 林田裕美子; 涩沢壮一
Original assignee: Toshiba Lighting and Technology Corp
Current assignee: Toshiba Lighting and Technology Corp
Priority date: 2013-03-04
Filing date: 2013-09-17
Publication date: 2014-01-29
Anticipated expiration: 2023-09-17
Also published as: JP2014170842A

Abstract

The utility model provides an LED (light-emitting diode) module which can emit different light beams without changing a base plate design, and a lighting device. The LED module (1) is provided with an LED chipset (Cg), a base plate (2) and a light-transmitting sealing resin (6), wherein the LED chipset (Cg) is provided with multiple LED chips (3,4 and 5) which have different structures or shapes and can emit same colored light; one surface (2a) of the base plate (2) is provided with an installing region (7) for installing the LED chipset (Cg) and wiring bodies (10 and 11) which are electrically connected with the multiple LED chips (3,4 and 5); the light-transmitting sealing resin (6) is arranged on the one surface (2a) of the base plate (2) in a manner of covering the LED chipset (Cg) and the installing region (7).

Description

LED module and lighting device

Technical field

The utility model relates to the LED chip as light source with the resin-sealed LED module of sealing and sets the lighting device of this LED module.

Background technology

Lighting device use COB(chip on board) LED module of type, this module is disposed with a plurality of LED chips in the one side side of substrate, and the protrusion (frame portion) that surrounds LED chip is set, in this protrusion, filling has mixed the translucent resin of fluorophor, with this translucent resin, buries each LED chip (for example, with reference to patent documentation 1) underground.If this LED module does not have protrusion, the peripheral side of translucent resin is easy to slide along the surface of substrate, can not form the stable shape of regulation because sliding translucent resin.

But, if be provided with protrusion, because the material of protrusion or formation expend time in, make the corresponding rising of cost of LED module.In addition, there is the problem of damaging the outward appearance of LED module because of non-luminous protrusion.In addition, in recent years, the large-scale ligthing paraphernalia such as the base lighting that facility is used is popularized, and the difficulty of manufacture is followed in the maximization of the LED module that this ligthing paraphernalia is used.

Therefore, there is a kind of LED module not form protrusion, and utilize the direct sealing LED chip of translucent resin (for example, with reference to patent documentation 2.）。That is, LED chip is installed on substrate at certain intervals, and is covered and be coated with LED chip with the thixotropic sealing resin that contains fluorophor.

And LED module is not limited to ligthing paraphernalia, also can be used in the various LED lamps such as bulb-shaped LED lamp, Straight LED lamp or annular LED lamp.

Prior art document

Patent documentation

Patent documentation 1: TOHKEMY 2011-60961 communique (the 6th page, the 3rd figure)

Patent documentation 2: TOHKEMY 2013-4941 communique (the 4th page, the 1st figure)

The LED module that is directly coated with sealing resin and forms on LED chip decides the light beam of radiation in same substrate by the installation interval of LED chip and the size of fitting limit.But, in recent years, in the illuminated design of ligthing paraphernalia, for the LED module with the substrate of same size, require to penetrate the diversity of various light beams.

Utility model content

The purpose of this utility model is to provide does not carry out the change of substrate design and penetrates the LED module of different light beams and set the lighting device of this LED module.

LED module of the present utility model comprises LED chip group, substrate and sealing resin.LED chip group has structure or shape difference and sends a plurality of LED chips of coloured light of the same race.Substrate is provided with installation region and distribution body in one side side.LED chip group is installed in installation region, at distribution body, connects a plurality of LED chips.Sealing resin has light transmission, and it is located at the one side side of substrate to cover the mode of the installation region of LED chip group and substrate.

In addition,, in above-mentioned LED module, preferred described LED chip group consists of 3 above LED chips, and the mode in the both sides of maximum sized LED chip is installed on described installation region with remaining LED chip spread configuration.

In addition, in above-mentioned LED module, preferred described LED chip group consists of 3 above LED chips, and is installed on described installation region in the remaining LED chip of maximum sized LED chip and the linearity spread configuration mode of spread configuration on equidirectional.

In addition,, in above-mentioned LED module, in preferred described LED chip group, the total full-size appearance of remaining LED chip is for the long ratio less than 2.0 of the full-size of maximum sized LED chip.

In addition, the present invention also provides a kind of lighting device, and it possesses: above-mentioned LED module; Be equipped with the apparatus main body of this LED module; The lamp device that described LED chip group is lighted.

According to present embodiment, can be formed in a plurality of LED chips that send coloured light of the same race of the installation region that is installed on substrate, by making the structure of the plurality of LED chip or shape different, do not change substrate design and penetrate the LED module of the different light beam of coloured light of the same race.

Accompanying drawing explanation

Fig. 1 means the approximate vertical view of the LED module of the first embodiment of the present utility model.

Fig. 2 is the local approximate vertical view of the sealing resin of the same LED module of perspective.

Fig. 3 is the enlarged drawing of the A part of the same Fig. 2.

Fig. 4 is that the B-B of the same Fig. 3 is to the summary section of apparent direction.

Fig. 5 is the local approximate vertical view of sealing resin of the LED module of perspective representation the second embodiment of the present utility model.

Fig. 6 means the lighting device of the 3rd embodiment of the present utility model, is (a) approximate three-dimensional map, is (b) summary lateral view of partial cut.

Symbol description

1...LED module, 2... substrate, 3,4,5...LED chip, 6... sealing resin, 7... installation region, 10,11... distribution body, 31... as the ligthing paraphernalia of lighting device, 32... appliance body, 33... lamp device, the Cg...LED chipset as apparatus main body

The specific embodiment

Below, with reference to the accompanying drawings of an embodiment of the present utility model.First, the first embodiment of the present utility model is described.

The LED module 1 of present embodiment forms as shown in Figure 1 to 4.In addition, in each figure, for part mark prosign, also the repetitive description thereof will be omitted.LED module 1 comprises LED chip group Cg and the sealing resin 6 of substrate 2, a plurality of

LED chip

3,4,5.

In Fig. 1, substrate 2 is by synthetic resin, and for example glass epoxide material forms, shown in one side 2a and another side 2b(Fig. 4.) to form plane be rectangular rectangle.For example, long limit is of a size of 280-300mm, and broadside (width) is of a size of 15-20mm.In addition, substrate 2 uses the material that its thickness of slab is 0.5-1.8mm, at this, uses the material of 1.2mm.

And as shown in Figure 3, substrate 2 is provided with installation portion 9 and a pair of

distribution body

10,11 with installation region 7 and

connector

8,8 in one side 2a side.The

LED chip

3,4,5 that forms LED chip group Cg is installed at installation portion 9, and is provided with sealing resin 6.Installation portion 9 becomes the illuminating part of LED module 1, as shown in Figure 1, along the length direction of substrate 2, equally spaced arranges, and with the interval of regulation, be arranged to 2 row on width.

Substrate 2 is equipped with respectively input terminal 12 and splicing ear 13 in its length direction two

ends

2c, 2d side.In addition, substrate 2 is provided with a plurality of installing holes 14 etc.And as shown in Figure 4, substrate 2 is for example formed with Copper Foil 15 in the universe of its another side 2b, and is formed with resist layer 16 on this Copper Foil 15.Copper Foil 15 and resist layer 16, for preventing the warpage of substrate 2, are worked in coordination, and substrate 2 is strengthened.

Installation region 7 consists of the first～three

metal level

17,18,19 these the 3 layers of structures that are formed at the one side 2a of substrate 2.The first metal layer 17 for example forms by the Copper Foil that is formed at the one side 2a of substrate 2 being etched into the shape of regulation.By plating, for example nickel on the first metal layer 17 forms the second metal level 18, and by plating, for example silver or the gold on the second metal level 18 forms the 3rd metal level 19.The first～three

metal level

17,18,19 forms respectively for example thickness of 10 μ m.

In addition, to be identically formed be 3 layers of

structure connector

8,8 and installation region 7.That is the metal level 20 that for example nickel on the

distribution body

10,11, consisting of in Copper Foil plating forms, plating for example silver or the golden metal level 21 forming on this metal level 20

forms.Distribution body

10,11 and

metal level

20,21 form respectively for example thickness of 10 μ m.

Installation region 7 is also known as installation pad, and as shown in Figure 3, upper surface 7a forms circular-arc roughly axe shape is cut into in the both sides of oval-shaped short-

axis direction.Connector

8,8 is also known as distribution pad, and

upper surface

8a, 8a form Elliptical circle.And

connector

8,8 is to guarantee that with installation region 7 mode of the insulation distance of regulation is formed at the both sides of the short-axis direction of installation region 7.

And, in the one side 2a of substrate 2 side, with the upper surface 7a of installation region 7 and the upper surface 8a of

connector

8,8, mode that 8a exposes respectively, by for example screen printing, be formed with white resist layer 22.White resist layer 22 has electrical insulating property, and possesses the function as reflection layer.In addition, as shown in Figure 4, white resist layer 22 is coated the one side 2a of substrate 2 in the outstanding mode of more foreign side of upper surface 8a, the 8a of 7 upper surface 7a and from

connector

8,8 to installation region.White resist layer 22 does not contact a pair of

distribution body

10,11 with air, thereby prevents the deteriorated of a pair of

distribution body

10,11.

And 7 upper surface 7a is provided with the LED chip group Cg consisting of a plurality of

LED chips

3,4,5 in installation

region.LED chip

3,4,5 is used respectively the grafting material 23 with light transmission to be adhered to the upper surface 7a of installation region 7.

LED chip

3,4,5 sends respectively coloured light of the same race, but structure or shape are different.At this, coloured light of the same race refers to that the wavelength difference each other of the coloured light being sent by

LED chip

3,4,5 allows the coloured light of maximum 15nm.Structure or

variform LED chip

3,4,5 luminous quantity is separately different.And, in the present embodiment, use and to radiate respectively blue light and the different chip of size (shape) as shown in Figure 3.

LED chip

3,4,5 for example forms the roughly shape of cuboid by known structure respectively.

LED chip 3 is maximum sized LED chip, with the total full-size appearance of remaining LED chip 4, the 5 long L2 of full-size, L3 separately, for the mode of the ratio less than 2.0 of the long L1 of its full-size, forms the shape with the size larger than LED chip 4,5.In addition, the lower limit of above-mentioned ratio must be determined according to the tolerable size of

LED chip

3,4,5, is 0.2 in the present embodiment.LED chip 3 is owing to being full-size, thus large than

LED chip

4,5 of luminous quantity.

And LED chip 3 is installed on the central portion of the upper surface 7a of installation region 7.

LED chip

4,5 clips LED chip 3 spread configurations in the width both sides of LED chip 3, and is mounted to 180 ° of Rotational Symmetries.That is,

LED chip

3,4,5 length directions with them set along the mode of the short-axis direction of installation region 7.In addition,

LED chip

4,5 also can be with rotational symmetric mode spread configuration in 90 ° in the both sides of LED chip 3.

And,

LED chip

3,4,5 the first electrode 3a, 4a, 5a is separately electrically connected to the upper surface 8a of a connector 8 respectively by closing line 24, and the second electrode 3b separately, 4b, 5b are electrically connected to the upper surface 8a of another connector 8 by closing line 24 respectively.The first electrode 3a, 4a, 5a become anode-side, and the second electrode 3b, 4b, 5b become cathode side.The first electrode 3a, 4a, 5a and the second electrode 3b, 4b, 5b are connected with a pair of

distribution body

10,11 via

connector

8,8.

A pair of

distribution body

10,11 is for example the Copper Foil of the etching one side 2a that is formed at substrate 2 and form the distribution body of the Wiring pattern of regulation, for example, form the Rack of the thickness with 10 μ m.And as shown in Figure 2, a pair of

distribution body

10,11 is by a plurality of

LED chips

3,4,5(LED chipset Cg) every 4 groups be connected in parallel, and these every 4 groups be connected in series.And the

distribution body

10,10 of a distolateral 2c of substrate 2 is electrically connected to input terminal 12, the

distribution body

11,11 of another distolateral 2d of substrate 2 is electrically connected to splicing ear 13.

A plurality of

LED chips

3,4,5 are connected via

connector

8,8 the first electrode 3a, 4a, 5a and the second electrode 3b, 4b, 5b in the mode of circulating current between the first electrode 3a, 4a, 5a and the second electrode 3b, 4b, 5b with a pair of

distribution body

10,11.

In addition, a plurality of

LED chips

3,4, the 5(LED chipset Cg that utilize a pair of

distribution body

10,11 to be connected in parallel) group number be not limited to 4 groups, can be also to organize arbitrarily number.

Splicing ear 13 utilizes the not shown arrangements of electric connections such as lead-in wire to be electrically connected to the input terminal 12 of the adjacent LED module 1 of the LED module 1 of spread configuration.And, with the splicing ear 13 of the LED module 1 of the LED module 1 of a use or the rearmost end of spread configuration, for 2

row distribution bodies

11,11 are electrically connected to each other, and utilize short-circuiting means such as lead-in wire grade to make the not shown short-circuit of terminals being electrically connected to this

distribution body

11,11.

When LED module 1 is supplied with the electric power of regulation at illustrated lamp device never to input terminal 12, to applying the voltage of regulation between the

distribution body

10,10 being electrically connected to input terminal 12, the electric current that circulation is stipulated in a plurality of

LED chips

3,4,5.Thus, a plurality of

LED chips

3,4,5(LED chipset Cg) luminous (lighting a lamp) respectively, radiation blue light.

In Fig. 4, sealing resin 6 is located on white resist layer 22 to cover the mode of the LED chip group Cg, installation region 7 and the

connector

8,8 that consist of a plurality of

LED chips

3,4,5.Sealing resin 6 is usingd and is for example had the resin system silicones of light transmission or mixed stocker silicones as principal component, and the fluorophor particle 25 that hybrid regulatory is quantitative and not shown filler form.The particle diameter of fluorophor particle 25 is more than 1 μ m, and approximate equality ground is scattered in sealing resin 6.As fluorophor particle 25, use the blue light excitation of sending by

LED chip

3,4,5 to send the yellow fluorophor particle of sodium yellow.

Sealing resin 6, by the interior for example hemispheric ormal weight solidifying of dome-shaped shape that cross sectional shape forms regulation that arranges of installation portion 9, forms the hemispheric shape in cross section.At this, sealing resin 6 take apart from the height on white resist layer 22 with respect to the ratio in the maximum sole footpath on white resist layer 22, to be length-width ratio form as more than 0.2 mode below 1.0.

In sealing resin 6, the blue light sending from

LED chip

3,4,5 and the sodium yellow sending from fluorophor particle 25 mix, and from the outer surface 6a of sealing resin 6, penetrate white light.If sealing resin 6 forms with above-mentioned length-width ratio, can carry out well the mixing of blue light and sodium yellow, obtain thus the repressed white light of inequality of colourity.

In addition, if LED module 1 is the module of radiation blue light, unmixed fluorophor particle 25 in sealing resin 6.In addition, the cross sectional shape of sealing resin 6 can be also triangle.

Secondly, the effect of the utility model the first embodiment is narrated.

When LED module 1 is supplied with the electric power of regulation at the input terminal 12 to substrate 2, the electric current via a pair of

distribution body

10,11 to the LED chip group Cg circulation regulation being formed by a plurality of

LED chips

3,4,5.

LED chip

3,4,5 radiates respectively blue light.A part for this blue light is sodium yellow by the yellow fluorophor 25 being mixed in sealing resin 6 by wavelength conversion.And the white light that blue light and sodium yellow mix penetrates from the outer surface 6aXiang foreign side of sealing resin 6.The shape that forms regulation due to the cross sectional shape of sealing resin 6 is hemispherical for example, and therefore, suppressed from the inequality of the colourity of the white light of each installation portion 9 radiation of substrate 2, this white light penetrates towards the direction of regulation.

And, maximum sized LED chip 3 is installed on to the central portion of the upper surface 7a of installation region 7, remaining

LED chip

4,5 clips LED chip 3 spread configurations in the both sides of LED chip 3, and to become 180 ° of rotational symmetric modes to be installed on the upper surface 7a of installation region 7, therefore, via sealing resin 6, the central portion of installation region 7 becomes maximum luminosity, at it, obtains the luminosity of approximate equality around.Thus, in LED module 1, suppressed to the brightness disproportionation of the radiating light of the direction ejaculation of regulation from the outer surface 6a of each sealing resin 6.

In addition, a plurality of

LED chips

3,4,5 are due to the total full-size appearance of LED chip 4, the 5 long L2 of full-size, the L3 separately ratio less than 2.0 for the long L1 of full-size of LED chip 3, so the central portion that can make installation region 7 luminosity is around less than the central portion of installation region 7, thus, the brightness disproportionation of the outer surface 6a of sealing resin 6 and colourity inequality are suppressed.

For example, and LED module 1 sends coloured light of the same race (blue light) and structure or variform LED chip by suitable use, can form and do not change substrate 2 and can penetrate different light beams.

According to the LED module 1 of present embodiment, LED chip group Cg is different and send a plurality of

LED chips

3,4,5 of coloured light of the same race (blue light) owing to having structure or shape, so different by making to be installed on structure or the shape of

LED chip

3,4,5 of installation region 7 of substrate 2, can change the luminous quantity from

LED chip

3,4,5, thus, have to form and do not change substrate design and can penetrate coloured light of the same race and the effect of different light beam.

And, LED chip 3 is installed on the central portion of the upper surface 7a of installation region 7, and remaining

LED chip

4,5 clips LED chip 3 spread configurations in the both sides of LED chip 3, and install to become 180 ° of rotational symmetric modes, therefore, the central portion of installation region 7 becomes maximum luminosity, and the luminosity that it around can obtain approximate equality has the effect of the brightness disproportionation that can suppress the radiating light that penetrates from LED module 1.

In addition, a plurality of

LED chips

3,4,5 are due to the total full-size appearance of LED chip 4, the 5 long L2 of full-size, the L3 separately ratio less than 2.0 for the long L1 of full-size of LED chip 3, so the central portion of installation region 7 becomes maximum luminosity, can make its luminosity around less than the central portion of installation region 7, thus, there is the brightness disproportionation of radiating light and the effect of colourity inequality that can suppress from the outer surface 6a ejaculation of each sealing resin 6.

In addition, in the present embodiment, LED chip group Cg has 3

LED chips

3,4,5 that size is different, but is not limited to this, also can have 2 or 4 above LED chips.That is, as long as LED chip group Cg has structure or shape is different and send at least 2 LED chips of coloured light of the same race.The LED chip that therefore, can contain more than 2 same kinds in LED chip group Cg.For example, in Fig. 3, also can be by 2 LED chips 3 at equidirectional spread configuration, in the both sides of these 2 LED chips 3 respectively along equidirectional spread

configuration LED chip

4,5.

In addition, in the present embodiment, size (size) difference of the roughly rectangular shape of a plurality of

LED chips

3,4,5, but be not limited to this, can make height dimension different, or shape can be different because of the difference of the body shape such as cube shaped, cylindrical shape or corner post shape, their size and the difference of size etc.In addition, be not shape, structure also can be different.For example, the material of main part and the position of illuminating part etc. also can be different.In other words, LED chip group Cg is the chipset that sends coloured light of the same race, and a plurality of LED chips of appropriately combined different luminous quantities form.

In addition, in the present embodiment, a plurality of

LED chips

3,4,5 have been used the chip at the upper face side of main part with the face-up type of two electrode 3a～5a, 3b～5b, but being not limited to this, can be also that upper face side at main part has an electrode 3a～5a and side has the chip of the upper Types Below of another electrode 3b～5b, side has the type that faces down of two electrode 3a～5a, 3b～5b below main part below chip.On above-mentioned, in Types Below, for example, with an electrode 3a～5a, be connected respectively by closing line 24 with a connector 8, another electrode 3b～5b and the direct-connected mode of another connector 8 arrange a pair of distribution body 10,11.In addition, in the type that faces down, with two electrode 3a～5a, 3b～5b and

connector

8,8 direct-connected modes, a pair of

distribution body

10,11 is set.In these situations, connector 8 is contained in a plurality of

LED chips

3,4,5(LED chipset Cg) installation region 7.

Secondly, the second embodiment of the present utility model is described.

The LED module 1A of present embodiment forms as shown in Figure 5.In addition also the repetitive description thereof will be omitted, for the part identical with Fig. 3, to mark identical symbol.

LED module 1A in the LED module 1 shown in Fig. 3 with

LED chip

4,5 in installation region 7 short-axis direction linearity spread configuration, and 7 long axis direction and the mode of maximum sized LED chip 3 spread configurations are installed in installation region.The long L5 in installation region of

LED chip

4,5 is with respect to the ratio less than 2.0 of the long L4 in installation region of LED chip 3.In addition, LED chip 3 and

LED chip

4,5, in the as far as possible little mode in their interval, are located at the central portion of installation region 7.

LED chip 3 and

LED chip

4,5 are located at the central portion of installation region 7, and thus, in installation region, the luminosity of 7 central portion becomes maximum.In addition, via sealing resin 6, centered by the central portion of installation region 7, penetrate radiating light, thus, brightness disproportionation and the colourity inequality of the radiating light penetrating from the outer surface 6a of each sealing resin 6 are suppressed.

According to the LED module 1A of present embodiment, LED chip group Cg with the remaining

LED chip

4,5 of maximum sized LED chip 3 and linearity spread configuration at equidirectional spread configuration, and the luminosity of the central portion of installation region 7 becomes maximum mode and is installed on installation region 7, therefore, there is the brightness disproportionation of radiating light and the effect of colourity inequality that can suppress from the outer surface 6a ejaculation of each sealing resin 6.

Secondly, the 3rd embodiment of the present utility model is described.

The ligthing paraphernalia 31 of present embodiment forms as shown in Figure 6.In addition also description thereof is omitted, for the part identical with Fig. 1, to mark identical symbol.

Ligthing paraphernalia 31 is the lighting devices (pendent lamp) that are directly installed on end face, as shown in Figure 6 (b), comprises appliance body 32, the LED module 1 shown in Fig. 1 and lamp device 33 as apparatus main body.Appliance body 32 is formed and on 4 limits, is had the rectangular tabular of the highly low 32a of the portion of standing up by for example cold-rolled steel sheet.And as shown in Figure 6 (a), appliance body 32 spreads all over length direction at width central portion and is equipped with V-type cover 34, and in the both sides of this V-type cover 34, spread all over length direction and be equipped with diffusion shell 35.

V-type cover 34 utilizes sheet metal to form the roughly tubular of V-arrangement, and outer surface 34a forms white.In addition, diffusion shell 35 utilizes for example Merlon of light transmission (PC) resin-shaped to become the roughly tubular of spill, and by whitening.At the length direction two ends of V-type cover 34,

end plate

36,36 is installed, at the length direction two ends of diffusion shell 35,

cap

37,37 is installed.End plate 36 and cap 37 are formed by polycarbonate resin respectively.

As shown in Figure 6 (b), LED module 1 utilizes on the installing plate 38 that not shown screw is installed on and is fixed on appliance body 32 diffusion shell 35 is interior.In each diffusion shell 35, being provided with a plurality of is for example 4 LED modules 1.In each diffusion shell 35, a plurality of LED modules 1 are connected in series.And LED module 1 utilizes not shown lead-in wire to be connected with lamp device 33.

Lamp device 33 is installed on appliance body 32 in V-type cover 34.And the not shown input line of lamp device 33 is connected with outside commercial ac power source, not shown lead-in wire (output line) is connected with the LED module 1 in each diffusion shell 35.The existing structure that lamp device 33 is lighted the LED chip of LED

chip group Cg

3,4,5 by supplying with the electric current of regulation to LED module 1 forms.

The ligthing paraphernalia 31 of present embodiment, owing to using same substrate 2 to set a plurality of LED modules 1 that can radiate desirable light beam, therefore, has the effect that can throw light on to plane of illumination side by desirable illumination light.

In addition, above-mentioned embodiment of the present utility model just illustrates, and does not limit the intention of the scope of utility model.These new embodiments can be implemented with other variety of way, in the scope that does not depart from utility model aim, can carry out various omissions, displacement, change.These embodiments and distortion thereof are contained in the scope and aim of utility model, and are contained in the utility model and its impartial scope that claims record.

Claims

1. a LED module, is characterized in that, possesses:

LED chip group, a plurality of LED chips that it has structure or shape difference and sends coloured light of the same race;

Substrate, its one side side is provided with installs the installation region of described LED chip group and the distribution body being electrically connected to described a plurality of LED chips;

The sealing resin of light transmission, it is located at the one side side of described substrate to cover the mode of described LED chip group and described installation region.

2. LED module as claimed in claim 1, is characterized in that,

Described LED chip group consists of 3 above LED chips, and is installed on described installation region in the mode that the arranged on both sides at maximum sized LED chip arranges remaining LED chip.

3. LED module as claimed in claim 1, is characterized in that,

Described LED chip group consists of 3 above LED chips, and is installed on described installation region in the remaining LED chip of maximum sized LED chip and the linearity spread configuration mode of spread configuration on equidirectional.

4. the LED module as described in any one in claim 1～3, is characterized in that,

In described LED chip group, except maximum sized LED chip, the total full-size appearance of remaining LED chip is for the long ratio less than 2.0 of the full-size of described maximum sized LED chip.

5. a lighting device, is characterized in that, possesses:

LED module in claim 1～4 described in any one;

Be equipped with the apparatus main body of this LED module;

The lamp device that described LED chip group is lighted.