JP2014168030A - Exposure device and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device and an exposure method, capable of exposing and transferring a fine exposure pattern to a substrate with high resolution, using a micro lens array.SOLUTION: The exposure device includes: a mask stage; a substrate stage; an illumination optical system for radiating pattern exposure light; a micro lens mounting board 62, disposed between a mask and a substrate, including a micro lens array 41 having a plurality of micro lenses disposed in alignment on a plane and extending linearly along a Y direction; and a micro lens drive mechanism for moving the micro lens mounting board 62 to an X direction. The exposure device radiates the pattern exposure light while moving the micro lens mounting board 62 to the X direction, to expose and transfer a mask pattern to the substrate through the micro lenses. By the enhanced rigidity of the micro lens mounting board 62 and a suspension frame 69, the micro lens array 41 can be adjusted to a predetermined flatness, with a prevented warp of the micro lens array 41.

Description

  The present invention relates to an exposure apparatus and an exposure method, and more particularly, to an exposure apparatus and an exposure method capable of exposing and transferring a fine exposure pattern over the entire surface of a substrate with high resolution.

  In a conventional exposure apparatus, a mask and a substrate are brought close to each other through a minute gap, light for pattern exposure is irradiated through the mask from an illumination optical system, and the pattern formed on the mask is exposed and transferred to the substrate. It was. However, in such an exposure apparatus, the mask pattern formed on the mask is transferred as it is onto the substrate by the exposure light that vertically passes through the mask, so that the viewing angle (collimation half angle) of the light source light irradiated on the mask is reduced. Due to the presence, the pattern image on the substrate is blurred and the resolution is lowered, and there is a possibility that a fine pattern cannot be exposed.

  In order to deal with such problems, exposure is performed while moving a microlens assembly formed so that an equal-size erect image of the mask pattern formed on the mask can be formed on the surface of the exposure object in parallel with the surface of the photomask. An exposure apparatus is known in which a mask pattern is imaged on an object to be exposed with high resolution (see, for example, Patent Document 1).

  In addition, a plurality of microlens arrays configured by two-dimensionally arranging a plurality of microlenses are arranged on one support plate, and three piezoelectric elements are arranged on the periphery of the holes of the support plate. A microlens array has been devised that is supported by a piezoelectric element at three points (see, for example, Patent Document 2). Then, the applied voltage of the piezoelectric element is adjusted and deformed to adjust the optical axis of the microlens array.

JP 2009-277900 A JP 2012-73298 A

  Incidentally, it is inevitable that the microlens mounting plate like the exposure apparatus described in Patent Document 1 bends due to its own weight. Similarly, it is inevitable that a microlens array, which is an assembly of microlenses mounted on the microlens mounting plate, bends due to its own weight. For this reason, when irradiating the light for pattern exposure from an irradiation means through a microlens array, there exists a concern that it may influence the exposure precision which exposed and transferred the pattern of the mask to the board | substrate.

  In Patent Document 2, since the piezoelectric element is directly applied to the microlens array, the piezoelectric element may damage the microlens array.

  The present invention has been made in view of the above-described problems. An object of the present invention is to provide an exposure apparatus and an exposure method capable of exposing and transferring a fine exposure pattern to a substrate with high resolution using a microlens array. It is to provide.

The above object of the present invention can be achieved by the following constitution.
(1) a substrate stage on which a substrate as an exposed material is placed;
A mask stage that includes a mask holding frame for holding a mask, and is disposed above the substrate stage;
A microlens mounting plate for mounting a microlens array in which a plurality of microlenses are arranged in a plane, and a microlens driving mechanism for moving the microlens mounting plate in a predetermined direction, A microlens stage disposed between a substrate stage and the mask stage;
An illumination optical system for irradiating the substrate with light for pattern exposure via the mask and the microlens array;
With
The exposure apparatus according to claim 1, wherein the microlens mounting plate is configured to adjust a flatness of the microlens array so as to suppress bending of the microlens array.
(2) The exposure apparatus according to (1), wherein the microlens mounting plate is suspended by a suspension frame.
(3) The exposure apparatus according to (2), wherein at least one of the height of the microlens mounting plate and the width of the suspension frame is changed to increase the rigidity of the microlens mounting plate.
(4) The exposure apparatus according to (2), wherein the microlens mounting plate is divided.
(5) The mask holding frame is provided with a cover glass so as to form a highly airtight space in cooperation with the mask.
The exposure apparatus according to any one of (1) to (4), wherein the cover glass is provided with a covering member that covers all surfaces thereof.
(6) The exposure apparatus according to (5), wherein the covering member is a resin film.
(7) The exposure apparatus according to (5), wherein the covering member is a wire mesh.
(8) The microlens mounting plate includes a main frame that holds the microlens array, and a subframe that supports the main frame,
The exposure apparatus according to (1), wherein the microlens mounting plate includes a height adjustment mechanism capable of adjusting a flatness of the microlens array.
(9) The exposure apparatus according to (8), wherein the height adjustment mechanism is configured by a fastening member fastened to the main frame.
(10) The exposure apparatus according to (9), wherein the fastening member includes a plurality of fastening members disposed symmetrically with respect to a longitudinal center of the main frame.
(11) The exposure apparatus according to any one of (8) to (10), wherein the height adjustment mechanism is configured by a spacer sandwiched between the main frame and the sub frame. .
(12) The exposure apparatus according to (11), wherein the spacer includes a plurality of spacers disposed symmetrically with respect to a longitudinal center of the main frame.
(13) The microlens mounting plate is suspended by a suspension frame,
The microlens mounting plate is joined to the suspension frame so that the microlens mounting plate is flattened by the weight of the microlens mounting plate and the mass of the microlens array. The exposure apparatus according to (1), wherein the exposure apparatus is flat.
(14) The exposure apparatus according to (13), wherein the microlens mounting plate is formed in a convex shape upward.
(15) The exposure apparatus according to (13) or (14), wherein a lower end surface of the suspension frame is inclined so as to become higher toward a center of the microlens mounting plate.
(16) A slider that fixes the suspension frame rotates about a guide rail straddling the slider, thereby adjusting the deflection of the microlens mounting plate, thereby flattening the microlens array. The exposure apparatus according to (2), wherein the degree can be adjusted.
(17) The exposure apparatus according to (16), wherein the slider is slidable perpendicularly to a traveling direction in order to adjust the deflection of the microlens mounting plate.
(18) The exposure apparatus according to (16) or (17), wherein the microlens mounting plate and the suspension frame are joined to each other via a rotation shaft that rotates the suspension frame.
(19) Any of (16) to (18), wherein the microlens mounting plate and the suspension frame are joined via a leaf spring for adjusting the deflection of the microlens mounting plate. An exposure apparatus according to claim 1.
(20) a gap sensor for measuring a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
The flatness of the microlens array is adjusted by adjusting the deflection of the microlens mounting plate by the attractive force generated between the magnet provided on the sensor carrier and the magnet provided on the microlens mounting plate. (1) The exposure apparatus according to (1),
(21) a gap sensor that measures a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
By adjusting the deflection of the microlens mounting plate by the repulsive force generated between the magnet provided to the work chuck of the substrate stage that holds the substrate by suction and the magnet provided to the microlens mounting plate, The exposure apparatus according to (1), wherein the flatness of the microlens array can be adjusted.
(22) a gap sensor for measuring a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
The magnetic chuck provided on the microlens mounting plate is attracted by a magnet provided on the sensor carrier, or the work chuck of the substrate stage that holds the magnetic material provided on the microlens mounting plate by suction. The exposure apparatus according to (1), wherein the flatness of the microlens array can be adjusted by adjusting the flexure of the microlens mounting plate by attracting the magnet provided in the apparatus.
(23) A gap sensor for measuring a gap between the opposing surfaces of the mask and the substrate on a mask frame supported by a common support column with the mask stage, and a relative position between the substrate and the mask can be detected. The sensor carrier is temporarily fixed with a fastening member so that the sensor carrier is not damaged when adjusting the gain of the sensor carrier driving mechanism that enables the sensor carrier for holding the alignment camera to move. The exposure apparatus according to any one of (1) to (22).
(24) An X-direction frame provided with a slit that allows the microlens mounting plate to move in a predetermined direction,
The height of the mask holding frame is ha, the width is ta, the height of the X direction frame is hb, the width is tb, and the relationship between the height of the mask holding frame and the height of the X direction frame is ha> hb. The exposure apparatus according to any one of (1) to (23), wherein the relationship between the width of the mask holding frame and the width of the X direction frame is ta> tb.
(25) The exposure apparatus according to any one of (1) to (24), wherein the microlens driving mechanism includes a ball screw nut, a ball screw shaft, and a motor.
(26) a substrate stage on which a substrate as an exposed material is placed;
A mask stage that includes a mask holding frame for holding a mask, and is disposed above the substrate stage;
A microlens mounting plate for mounting a microlens array in which a plurality of microlenses are arranged in a plane, and a microlens driving mechanism for moving the microlens mounting plate in a predetermined direction, A microlens stage disposed between a substrate stage and the mask stage;
An illumination optical system for irradiating the substrate with light for pattern exposure via the mask and the microlens array;
An exposure method for an exposure apparatus comprising:
Adjust the microlens mounting plate so that the microlens array has a predetermined flatness,
By irradiating the pattern exposure light with the illumination optical system while moving the microlens mounting plate in the predetermined direction, the mask pattern formed on the mask is passed through the plurality of microlenses. An exposure method comprising exposing and transferring to the substrate.
(27) The pattern is formed on the mask by irradiating the pattern exposure light with the illumination optical system while moving the microlens mounting plate and the illumination optical system in synchronization with the predetermined direction. The exposure method according to (26), wherein a mask pattern is exposed and transferred onto the substrate through the plurality of microlenses.
(28) Hold at least one of a gap sensor capable of measuring a gap between the substrate and the mask and an alignment camera capable of detecting a relative position between the substrate and the mask, and above the microlens mounting plate. And further comprising a plurality of sensor carriers arranged in a set for each of the plurality of masks arranged in the predetermined direction and movable in the predetermined direction,
The sensor carrier adjacent to each of the masks arranged in the predetermined direction is arranged such that the microlens mounting plate is exposed when the mask pattern is exposed and transferred to the substrate while the microlens mounting plate moves in the predetermined direction. The exposure method according to (26), wherein the exposure method moves in the same direction.
(29) Hold at least one of a gap sensor capable of measuring a gap between the substrate and the mask and an alignment camera capable of detecting a relative position between the substrate and the mask, and above the microlens mounting plate. And a plurality of sensor carriers arranged in pairs for each of the plurality of masks arranged in the predetermined direction and movable in the predetermined direction,
When the mask pattern is exposed and transferred to the substrate while the microlens mounting plate moves in the predetermined direction, each set of sensor carriers shields an area other than the microlens array in the predetermined direction. However, the exposure method according to (26), wherein the exposure method moves in synchronization with the microlens mounting plate.

  According to the exposure apparatus and the exposure method of the present invention, in order to suppress the bending of the microlens array, the microlens mounting plate can perform exposure transfer using the microlens array whose flatness is adjusted, A fine exposure pattern can be exposed and transferred onto a substrate with high resolution.

1 is a front view of an exposure apparatus according to a first embodiment of the present invention. It is a side view of the exposure apparatus shown in FIG. FIG. 2 is a plan view of a mask stage and a microlens mounting plate of the exposure apparatus shown in FIG. 1. (A) is a plan view of a microlens mounting plate on which a plurality of microlens arrays are formed, (b) is an enlarged cross-sectional view of the microlens array along the Z direction in circle IV of (a), and (c). These are the enlarged views of the micro lens array in the circle IV of (a). (A) is a figure which shows a hexagonal field stop, (b) is a figure which shows an aperture stop, (c) is a figure for demonstrating arrangement | positioning of a hexagonal field stop. It is a top view which shows the positional relationship of the mask and microlens array before exposure transfer. It is a top view which shows the positional relationship of the mask and microlens array at the time of exposure transfer. It is a top view which shows the positional relationship of the mask after exposure transfer, and a micro lens array. FIG. 7 is a plan view for explaining the operation of a sensor carrier that also serves as a masking aperture as a modification of the first embodiment. (A) is a top view of a microlens mounting board provided with a nozzle as an exposure apparatus which concerns on 2nd Embodiment of this invention, (b) is XX sectional drawing in (a). It is a front view of the exposure apparatus which concerns on 3rd Embodiment of this invention. It is a side view of the exposure apparatus shown in FIG. It is a top view of the mask stage and micro lens mounting plate of the exposure apparatus shown in FIG. It is a schematic plan view of the microlens mounting board in which the microlens array was formed. It is a perspective view of a micro lens stage. It is the cross-sectional perspective view cut along the XVI-XVI line of FIG. (A) is the perspective view of a microlens mounting board, (b) is the perspective view which divided | segmented the microlens mounting board. (A) is a top view of the height adjustment mechanism of the microlens mounting plate based on 4th Embodiment of this invention, (b) is sectional drawing cut along the XVIII-XVIII line of the height adjustment mechanism FIG. 5C is a cross-sectional view taken along the line XVIII′-XVIII ′ of the height adjustment mechanism. The modification of 4th Embodiment is shown, (a) is a top view of a height adjustment mechanism, (b) is sectional drawing cut along the XIX-XIX line of a height adjustment mechanism, (c) FIG. 4 is a cross-sectional view taken along the line XIX′-XIX ′ of the height adjusting mechanism. (A) is a perspective view which shows the microlens mounting board based on 5th Embodiment of this invention, (b) shows the state before joining a microlens mounting board to a suspension frame, (a). It is sectional drawing cut | disconnected along the XX-XX line | wire, (c) is sectional drawing corresponding to (b) which shows the state which mounts a microlens array in a microlens mounting plate, (d) These are sectional drawings corresponding to (b) showing the state after placing the microlens array on the microlens placement plate. (A) is a perspective view which shows the microlens mounting board based on the modification of 5th Embodiment, (b) shows the state before joining a microlens mounting board to a suspension frame, (a). It is sectional drawing cut along the XXI-XXI line | wire, (c) is sectional drawing corresponding to (b) which shows the state which mounts a microlens array in a microlens mounting plate, (d) FIG. 6B is a cross-sectional view corresponding to FIG. 5B showing a state after the microlens array is placed on the microlens placement plate, and FIG. 9E is a piezo effect between the suspension frame and the microlens placement plate. FIG. 5F is a cross-sectional view in which a spacer having a piezoelectric effect is disposed on a microlens mounting plate. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board in the exposure apparatus which concerns on 6th Embodiment of this invention, (b) was the flatness of the microlens array adjusted. It is the figure which showed the state. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board in the exposure apparatus which concerns on the 1st modification of 6th Embodiment, (b) is the flatness of a microlens array adjusting. It is the figure which showed the state made. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board in the exposure apparatus which concerns on the 2nd modification of 6th Embodiment, (b) is the flatness of a microlens array adjusting. It is the figure which showed the state made. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board in the exposure apparatus which concerns on the 3rd modification of 6th Embodiment, (b) is the flatness of a microlens array adjusting. It is the figure which showed the state made. In the exposure apparatus according to the seventh embodiment of the present invention, the electromagnet for adjusting the flatness of the microlens array is provided on the sensor carrier and the microlens mounting plate. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board by making the opposing surface of electromagnets different poles, (b) is the state by which the flatness of the microlens array was adjusted FIG. In the exposure apparatus which concerns on the 1st modification of 7th Embodiment of this invention, it is the figure which equipped the work chuck and the microlens mounting plate with the electromagnet which adjusts the flatness of a microlens array. (A) is the figure which showed the method of adjusting the bending of a microlens mounting board by making the opposing surface of electromagnets the same pole, (b) was the flatness of the microlens array 41 adjusted. It is the figure which showed the state. (A) is the figure which showed that the magnet with which the sensor carrier carried the magnetic body with which the microlens mounting plate was attracted in the exposure apparatus which concerns on the 2nd modification of 7th Embodiment of this invention, ( b) is a drawing showing that a magnet provided on a work chuck attracts a magnetic body provided on a microlens mounting plate in an exposure apparatus according to a third modification of the seventh embodiment of the present invention. (A) is a perspective view of a microlens stage, a mask frame, and a mask frame in an exposure apparatus according to an eighth embodiment of the present invention, (b) is a view as seen from an arrow A in (a), ( (c) is a view taken along arrow B in (a), and (d) is a view taken along the line XXXI-XXXI in (a) showing the height and width of the mask holding frame and the X direction frame. It is a perspective view of the micro lens stage in the exposure apparatus which concerns on 9th Embodiment of this invention. It is a front view of the exposure apparatus which concerns on 10th Embodiment of this invention. FIG. 34 is a side view of the exposure apparatus shown in FIG. 33. (A) shows the cover glass covered with the coating | coated member, (b) is sectional drawing which shows the state by which the cover glass covered with the coating | coated member is arrange | positioned at a mask stage.

(First embodiment)
Hereinafter, an embodiment of an exposure apparatus according to the first embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a front view of an exposure apparatus according to the present invention, and FIG. 2 is a side view. As shown in FIGS. 1 and 2, the exposure apparatus PE of the present embodiment includes a mask stage 10 that holds a mask M, a substrate stage 20 that places a glass substrate (material to be exposed) W, and a substrate stage 20. A substrate stage moving mechanism 50 that moves in the X-axis, Y-axis, and Z-axis directions and adjusts the tilt of the substrate stage 20 and a microlens array 41 are disposed between the substrate stage 20 and the mask stage 10. A microlens stage 40, and an illumination optical system 30 that irradiates the substrate W with light for pattern exposure via a mask M and a microlens array 41.

  Note that a glass substrate W (hereinafter simply referred to as “substrate W”) is disposed to face the mask M, and a surface (on the opposite surface side of the mask M) for exposing and transferring a mask pattern drawn on the mask M. ) Is coated with a photosensitive agent.

  As shown in FIGS. 1 to 3, the mask stage 10 includes a mask frame 11 in which four rectangular openings 11 a are formed, and an X axis, a Y axis, and θ axis in each of the openings 11 a of the mask frame 11. And four mask holding frames 12 mounted to be movable in the direction.

  The mask frame 11 is supported by a column 71 standing on the apparatus base 70 and is disposed above the substrate stage 20. Each mask holding frame 12 is inserted into the opening 11a of the mask frame 11 via a predetermined gap, and is movable in the X axis, Y axis, and θ directions by the gap. The mask holding frame 12 has a rectangular opening for allowing the pattern exposure light to pass through at the center, and the mask M is sucked and held at the lower part thereof.

  Further, on the upper surface of the mask frame 11, each mask holding frame 12 is moved in the X axis, Y axis, and θ directions, and a mask position (not shown) for adjusting the position of the mask M held on the mask holding frame 12 is adjusted. An adjustment mechanism is provided.

The mask position adjusting mechanism includes one Y-axis direction driving device attached to one side along the X-axis direction of the mask holding frame 12 and two X-axis directions attached to one side along the Y-axis direction of the mask holding frame 12. Each of which includes a combination of a motor and a ball screw mechanism and a linear motor. Then, by driving one Y-axis direction driving device, the mask holding frame 12 is moved in the Y-axis direction, and by driving two X-axis direction driving devices equally, the mask holding frame 12 is moved in the X-axis direction. Move to. Further, the mask holding frame 12 is moved in the θ direction (rotated about the Z axis) by driving one of the two X axis direction driving devices.
Note that the mask stage 10 may be provided with a Z-axis-tilt adjustment mechanism capable of adjusting the tilt of the mask holding frame 12 in the Z-axis direction.

  Furthermore, on the upper surface of the mask frame 11, as shown in FIG. 3, the gap sensor 15 for measuring the gap between the opposing surfaces of the mask M and the substrate W and the relative position between the substrate W and the mask M can be detected. The alignment camera 16 is provided. The gap sensor 15 and the alignment camera 16 are held by a sensor carrier 17 that can be moved in the X-axis direction by a sensor carrier driving mechanism 18 such as a linear motor provided on both sides in the Y direction. It is arranged in the holding frame 12. One set of sensor carriers 17 (sensor carriers 17a, 17b and 17c, 17d) is arranged for each of a plurality of masks M arranged in the X direction, and can move independently in the X direction.

  As shown in FIGS. 1 and 2, the substrate stage 20 includes a Z stage 21 on which a work chuck 21 a that sucks and holds a substrate W is disposed on an upper surface, and is installed on a substrate stage moving mechanism 50.

  The substrate stage moving mechanism 50 performs tilt adjustment of the substrate stage 20, an X-axis feed mechanism 22 that moves the substrate stage 20 in the X-axis direction, a Y-axis feed mechanism 23 that moves the substrate stage 20 in the Y-axis direction, and the substrate stage 20. And a Z-tilt adjustment mechanism 24 that finely moves the substrate stage 20 in the Z-axis direction.

  The X-axis feed mechanism 22 includes a pair of linear guides 25 installed on the upper surface of the apparatus base 70 along the X-axis direction, an X-axis table 26 supported by the linear guide 25 so as to be movable in the X-axis direction, An X-axis feed drive device 27 for moving the axis table 26 in the X-axis direction. The X-axis feed driving device 27 is installed on the device base 70, a ball screw nut 27a fixed to the lower surface of the X-axis table 26, a ball screw shaft 27b screwed to the ball screw nut 27a, and the ball screw shaft. A motor 27c for rotating the motor 27b. The motor 27c of the X-axis feed driving device 27 is driven to rotate the ball screw shaft 27b, whereby the X-axis table 26 and the ball screw nut 27a are moved along the linear guide 25. To move the substrate stage 20 in the X-axis direction.

  The Y-axis feed mechanism 23 includes a pair of linear guides 28 installed on the upper surface of the X-axis table 26 along the Y-axis direction, a Y-axis table 29 supported by the linear guide 28 so as to be movable in the Y-axis direction, And a Y-axis feed drive device 35 that moves the Y-axis table 29 in the Y-axis direction. The Y-axis feed driving device 35 is installed on a ball screw nut 35a fixed to the lower surface of the Y-axis table 29, a ball screw shaft 35b screwed to the ball screw nut 35a, and the X-axis table 26, and is And a motor 35c for rotating the screw shaft 35b. The motor 35c of the Y-axis feed driving device 35 is driven to rotate the ball screw shaft 35b, whereby the Y-axis table 29 is linearly guided along with the ball screw nut 35a. 28, the substrate stage 20 is moved in the Y-axis direction.

  The Z-tilt adjustment mechanism 24 includes a motor 24a installed on the Y-axis table 29, a ball screw shaft 24b that is rotationally driven by the motor 24a, and a wedge formed in a wedge shape and screwed into the ball screw shaft 24b. And a wedge portion 24d that protrudes in a wedge shape on the lower surface of the substrate stage 20 and engages with the inclined surface of the wedge nut 24c. In this embodiment, two Z-tilt adjustment mechanisms 24 are provided on one end side (front side in FIG. 1) in the Y-axis direction of the Y-axis table 29 and one set on the other end side (the rear side in FIG. A total of 3 units are installed (see FIG. 2), and each is driven and controlled independently. The number of Z-tilt adjustment mechanisms 24 installed is arbitrary.

In the Z-tilt adjustment mechanism 24, the ball screw shaft 24b is rotationally driven by the motor 24a, whereby the wedge-shaped nut 24c is horizontally moved in the Y-axis direction, and this horizontal movement is caused by the wedge-shaped nut 24c and the wedge portion 24d. The wedge portion 24d is finely moved in the Z direction by being converted into a highly accurate vertical fine movement by the action of the slope. Accordingly, by driving the three Z-tilt adjustment mechanisms 24 by the same amount, the substrate stage 20 can be finely moved in the Z-axis direction, and the three Z-tilt adjustment mechanisms 24 are independently driven. By doing so, the tilt adjustment of the substrate stage 20 can be performed. As a result, the position of the substrate stage 20 in the Z-axis and tilt directions can be finely adjusted so that the mask M and the substrate W face each other in parallel with a predetermined interval.
Note that the combination of the ball screw shaft mechanism and the motor constituting the X-axis feed mechanism 22, the Y-axis feed mechanism 23, and the Z-tilt adjustment mechanism 24 may be replaced by a linear motor.

  Further, as shown in FIGS. 1 and 2, the exposure apparatus PE of the present embodiment is provided with a laser length measuring device 36 that is a position measuring device for detecting the position of the substrate stage 20. The laser length measuring device 36 measures the moving distance of the substrate stage 20 that occurs when the substrate stage moving mechanism 50 is driven.

  The laser length measuring device 36 is disposed on the X-axis mirror 72 and the Y-axis mirror 74 disposed on the substrate stage 20 and the device base 70 and irradiates the X-axis mirror 72 with laser light (measurement light). Two X-axis length measuring devices 73 that receive the laser beam reflected by the X-axis mirror 72 and measure the position and yawing of the substrate stage 20 in the X-axis direction, and the laser beam as the Y-axis mirror 74, a single Y-axis length measuring device (length measuring device) 76 that receives the laser beam reflected by the Y-axis mirror 74 and measures the position of the substrate stage 20 in the Y-axis direction. . Then, a position detection signal in the X and Y directions of the substrate stage 20 is input to the control device.

  The illumination optical system 30 corresponds to each of a plurality of (four in the embodiment shown in FIG. 3) masks M held on the mask stage 10, and is supported by the lamp base 31 fixed to the column 71 to be mask stage 10. It is arranged above. The illumination optical system 30 includes, for example, a high-pressure mercury lamp, a concave mirror, an optical integrator, a plane and spherical mirror, an exposure control shutter (not shown), and the like. The irradiation region including the microlens array 41 of the microlens mounting plate 62 to be described later is irradiated through the mask M.

  As will be described later, since the exposure transfer is performed while moving the microlens mounting plate 62 in the X direction, the illumination optical system 30 causes the light for pattern exposure to irradiate the irradiation area including the microlens array 41. Furthermore, it is driven along the lamp base 31 by a drive mechanism (not shown), and can move in the X direction in synchronization with the movement of the microlens mounting plate 62.

  Instead of moving the illumination optical system 30 described above, the angle and / or position of a built-in plane mirror or the like is changed in synchronism with the movement of the microlens mounting plate 62, thereby allowing light for pattern exposure. May be irradiated to an irradiation region including the microlens array 41. In this case, the moving mass of the illumination optical system 30 can be reduced, and the generation of vibration and noise can be suppressed.

  The microlens stage 40 includes a microlens array 41 and moves the microlens mounting plate 62 disposed between the mask M and the substrate W and the microlens mounting plate 62 in a predetermined direction (X direction). A microlens driving mechanism 60.

As shown in FIGS. 2 and 3, the microlens mounting plate 62 is disposed between the mask M and the substrate W while holding both ends in the Y direction. The microlens mounting plate 62 includes, for example, a stator (not shown) fixed to the support column 77 and a movable member (not shown) fixed to the microlens mounting plate 62 so as to face the stator. It can be moved in the X direction by being driven by a microlens driving mechanism 60 such as a linear motor.
By moving and exposing the illumination optical system 30 while moving the microlens mounting plate 62, the tact time is shortened and reliable exposure transfer is provided.

As shown in FIG. 4A, a plurality of microlens arrays 41 provided corresponding to each mask M are arranged on the microlens mounting plate 62 so as to extend linearly along the Y direction. ing. Further, in the microlens mounting plate 62, the area other than the microlens array 41 is shielded so that unnecessary light is prevented from being irradiated onto the substrate W. As shown in FIG. 4B, each microlens array 41 is configured by superimposing four layers of microlens array substrates 41a to 41d, and each microlens array substrate 41a to 41d includes a plurality of microlens arrays. Lenses 42 are aligned on a plane. Specifically, as shown in FIG. 4C, each of the microlens array substrates 41a to 41d forms a plurality of microlens rows by arranging a plurality of microlenses 42 at predetermined intervals in the Y direction. The microlenses 42 in each row are arranged while being shifted in the Y direction so as not to be arranged in a straight line in the X direction.
The microlens stage 40 may be provided with a microlens Z-axis-tilt adjustment mechanism that can adjust the tilt of the microlens mounting plate 62 in the Z-axis direction.

  Further, in each of the microlens array substrates 41 a to 41 d, a region other than the microlens 42 is masked with an opaque chromium (Cr) film 47. In other words, the light for pattern exposure irradiated from the illumination optical system 30 passes through the microlens 42 and exposes and transfers the mask pattern region corresponding to the microlens array 41 to the substrate W.

  Further, a hexagonal field stop 43 having a hexagonal opening corresponding to each microlens 42 is disposed between the second and third microlens array substrates 41b and 41c from the top (FIG. 5A). An aperture stop 44 having a circular opening corresponding to each microlens 42 is disposed between the third and fourth microlens array substrates 41c and 41d from the top (see FIG. 5B). )reference). Thereby, the pattern exposure light irradiated from the illumination optical system 30 through the mask M is appropriately narrowed down and a clear image is formed on the substrate W.

  In addition, between each microlens array board | substrate 41a-41d, you may affix a microlens array using any one among a filler, a spacer, or an adhesive agent.

  Further, as shown in FIG. 5C, each microlens 42 has a hexagonal field stop 43 of each microlens 42 overlapping in the X direction, and the total aperture width in the X direction of each hexagonal field stop 43 is Y. It arrange | positions so that it may become substantially equal over a direction. Thereby, the joint unevenness of the microlens 42 at the time of exposure transfer is corrected, and the entire amount of the microlens array 41 is irradiated with the same amount of pattern exposure light onto the substrate W.

  Next, an exposure operation using the above-described exposure apparatus PE will be described with reference to FIGS. In the following description, a case where four step exposures are performed using four masks M and a total of 16 patterns are exposed and transferred onto the substrate W will be described as an example.

  First, in the first exposure, the first exposed area (for example, the upper right area of the substrate W) of the substrate W placed and positioned at a predetermined position of the substrate stage 20 is positioned so as to face the mask stage 10. . At this time, as shown in FIG. 6, the microlens array 41 of the microlens mounting plate 62 is positioned on one side (right side) of the corresponding mask M (mask pattern) in the X direction. The sensor carriers 17 (17a, 17b, 17c, 17d) arranged for each of the plurality of masks M arranged in the X direction are located on the left and right sides of the mask pattern P of each mask M.

  Then, a gap between the opposing surfaces of the mask M and the substrate W is measured by the gap sensor 15 mounted on the sensor carrier 17, and the Z-tilt adjustment mechanism 24 is driven to set the mask M and the substrate W at a predetermined interval. Make them face each other in parallel. During exposure transfer of the second and subsequent layers, the gap sensor 15 adjusts the gap between the opposing surfaces of the mask M and the substrate W, and the alignment mark formed on the substrate W and the mask M by the alignment camera 16. And the relative position between the substrate W and the mask M is adjusted.

Further, the relative position between the substrate W and the mask M may be adjusted by detecting an alignment mark formed on the microlens mounting plate 40.
In addition, the alignment camera 16 detects the alignment mark formed on the substrate W, the alignment mark formed on the mask M, and the alignment mark formed on the microlens mounting plate 40 by the alignment camera 16, The relative positions of the substrate W, the mask M, and the microlens mounting plate 40 may be adjusted.

Thereafter, the microlens mounting plate 62 and the illumination optical system 30 are moved in the direction of arrow A (X direction) in synchronization with each other, and the pattern exposure light from the illumination optical system 30 corresponds to the microlens array 41. Irradiate. At that time, as shown in FIG. 6, the two outer sensor carriers 17a and 17d are respectively moved in advance in the directions of arrows A and B (the direction opposite to the A direction) and moved to the retracted position separated from the mask M. .
The four illumination optical systems 30 corresponding to each microlens array 41 may move in synchronization with the two illumination optical systems 30 by a common drive mechanism (not shown). Alternatively, the four illumination optical systems 30 may be moved synchronously by a drive mechanism (not shown) common to the four illumination optical systems 30.

  On the other hand, as the micro lens mounting plate 62 moves, the sensor carrier 17b moves across the left mask M in the same direction (arrow A direction) as the micro lens mounting plate 62, and the sensor carrier 17c Then, it is moved to the middle of two masks M arranged in the X direction in the direction of arrow A (see FIG. 7). This eliminates the need to retract both the inner two sensor carriers 17b and 17c between the two masks M arranged in the X direction at the time of exposure transfer, and the two masks M arranged in the X direction can be arranged close to each other. In addition, a plurality of patterns can be efficiently exposed and transferred onto the substrate W.

  As a result, the mask pattern formed on the mask M is exposed and transferred onto the substrate W through the plurality of microlenses 42 in order from the right side portion to the left side portion in the drawing. The Thus, the first exposure transfer using the four masks M is performed.

  Note that the pattern exposure light is applied only to the region corresponding to the microlens array 41, but a masking aperture (not shown) may be used as necessary. Further, when using the microlens mounting plate 62 in which masking is applied to the area other than the microlens array 41, the pattern exposure light may be irradiated only to the area corresponding to the microlens array 41, Further, the region other than the microlens array 41 of the microlens mounting plate 62 may be irradiated.

  When the first exposure transfer is completed, as shown in FIG. 8, the sensor carriers 17a and 17b are on the left side of the left mask M, the sensor carrier 17c is in the middle of the two masks M, and the sensor carrier 17d is on the right side. It is located on the right side of the mask M.

  Next, when performing the second exposure, the substrate stage 20 is stepped in the right direction in the drawing, and the second exposed area of the substrate W (the upper left area of the substrate W) is positioned facing the mask M. At the same time, the sensor carriers 17a, 17b, 17c and 17d are returned to their original positions, and the gap between the opposing surfaces of the mask M and the substrate W is adjusted by the gap sensor 15.

  An area corresponding to the microlens array 41 while moving the microlens mounting plate 62 and the illumination optical system 30 in the first exposure transfer end position in the arrow B direction in synchronization with each other. The mask pattern in the region corresponding to the microlens array 41 is exposed and transferred onto the substrate W through the plurality of microlenses 42 sequentially from the left side to the right side in the drawing.

  In this case as well, the sensor carriers 17a and 17d are moved to the retracted position away from the mask M, and the sensor carrier 17c is moved in the B direction in accordance with the movement of the microlens mounting plate 62 (arrow B direction). The right side mask M is moved across, and the sensor carrier 17b is also moved to the middle position between the two masks M in the B direction.

  Thereafter, the substrate stage 20 is moved stepwise in the upward direction (Y direction) in the figure so that the third exposed area of the substrate W (for example, the lower left area of the substrate W) faces the mask M, and the first exposure transfer and Similarly, the third exposure transfer is performed by moving the microlens mounting plate 62, the illumination optical system 30, and the sensor carrier 17. Further, the substrate stage 20 is moved stepwise in the left direction (X direction) in the drawing so that the fourth exposed area of the substrate W (for example, the lower right area of the substrate W) faces the mask M, and the second exposure transfer. Similarly to the above, the microlens mounting plate 62, the illumination optical system 30, and the sensor carrier 17 are moved to perform the fourth exposure transfer.

  As described above, according to the exposure apparatus PE of the present embodiment, the mask that is provided above the substrate stage 20 and includes the substrate stage 20 on which the substrate W is placed and the mask holding frame 12 that holds the mask M. A stage 10, a microlens mounting plate 62 that mounts a microlens array 41 in which a plurality of microlenses 42 are arranged in a plane, and a microlens driving mechanism that moves the microlens mounting plate 62 in a predetermined direction. 60, and a microlens stage 40 disposed between the substrate stage 20 and the mask stage 10, and illumination optics for irradiating the substrate W with light for pattern exposure via the mask M and the microlens array 41 A system 30. Then, by irradiating light for pattern exposure while moving the microlens mounting plate 62 in the X direction by the microlens driving mechanism 60, the mask pattern of the mask M is exposed to the substrate W via the plurality of microlenses 42. Since the transfer is performed, it is possible to expose and transfer a fine exposure pattern over the entire surface of the substrate W with high resolution and a short tact time by a simple mechanism.

  In addition, while moving the microlens mounting plate 62 and the illumination optical system 30 in synchronization with the X direction, the mask pattern is exposed and transferred to the substrate W via the plurality of microlenses 42 by irradiating light for pattern exposure. Since it did in this way, exposure transfer can be performed in the state which irradiated the light for pattern exposure to the narrow area | region containing the microlens array 41. FIG.

  Furthermore, since the microlens mounting plate 62 is shielded so as not to transmit light to areas other than the microlens array 41, unnecessary light is prevented from being irradiated onto the substrate W. In this case, the pattern exposure light may be applied to a region other than the narrow region of the microlens array 41 of the microlens mounting plate 62. Therefore, it is not necessary to change the irradiation area of the illumination optical system 30 even when the mask M having a different size is replaced by setting the irradiation area irradiated with the light for pattern exposure in advance. The tact time can be shortened to ensure exposure.

  In addition, the microlens mounting plate 62 moves in a plurality of adjacent sensor carriers 17b and 17c of the masks M that hold at least one of the gap sensor 15 and the alignment camera 16 and are arranged in a predetermined direction (X direction). However, when the mask pattern is exposed and transferred to the substrate W, the mask pattern moves in the same direction as the microlens mounting plate 62. Therefore, at the time of exposure transfer, the two masks M in which both the inner sensor carriers 17b and 17c are arranged in the X direction. The two masks M arranged in the X direction can be disposed close to each other, and a plurality of patterns can be efficiently transferred to the substrate W by exposure.

In the present embodiment, the four microlens arrays 41 can be moved in synchronization by a single microlens mounting plate 62. Further, at least two of the four sensor carriers 17a to 17d may be moved synchronously. Furthermore, the four illumination optical systems 30 can also be moved synchronously at least two by two. In this way, by moving at least two of the plurality of sensor carriers 17a to 17d, the plurality of microlens arrays 41, and the plurality of illumination optical systems 30 in synchronization, these are compared with the case where they are moved individually. The vibration generated by the movement of can be reduced.
Further, in addition to controlling the movement direction, the sensor carriers 17a to 17d can control the movement start and the movement end so that the influence on the exposure due to these vibrations can be further suppressed.

The sensor carriers 17a to 17d, the microlens mounting plate 62, and the illumination optical system 30 can change the movement start position and the movement end position according to the size of the substrate W.
Further, the illuminance of the illumination optical system 30 and the moving speed of the sensor carriers 17a to 17d can be set in any combination according to the exposure amount.

  Next, a modification of the first embodiment in which the sensor carrier is also used as a mask aperture will be described with reference to FIG. FIG. 9 is a plan view showing the operation of the sensor carrier that also functions as a masking aperture. The sensor carriers 17a, 17b, 17c, and 17d measure the gap between the opposing surfaces of the mask M and the substrate W. After the gap adjustment (after the gap adjustment by the gap sensor 15 and the alignment adjustment by the alignment camera 16 at the time of exposure and transfer of the second layer), the gap L between the sensor carriers 17a and 17b and between 17c and 17d is formed. Each of the microlens arrays 41 is moved in synchronism with the microlens array 41 so as to be positioned above the microlens array 41 with the same width as the microlens array 41. In other words, in a plan view, the gap L between the pair of sensor carriers 17a, 17b and 17c, 17d and the width of the microlens array 41 are made to coincide with each other to shield the region excluding the microlens array 41.

  When the mask pattern is exposed and transferred to the substrate W while the microlens mounting plate 62 moves in the A direction, each pair of sensor carriers 17a, 17b, and 17c, 17d has a gap L between the sensor carriers 17. In other words, in the state of maintaining, that is, in the direction of arrow A in synchronization with the microlens mounting plate 62 while shielding the area other than the microlens array 41. Thereby, the sensor carrier 17 also functions as a masking aperture. At this time, the gap sensor 15 and the alignment camera 16 on the sensor carrier 17 are retracted on the sensor carrier 17.

  As described above, according to the exposure apparatus PE of the present embodiment, when the mask pattern is exposed and transferred to the substrate W, each set of sensor carriers 17 shields the area other than the microlens array 41 while X. Since it moves in the X direction in synchronization with the microlens mounting plate 62 that moves in the direction, the masking aperture can also be used, and the mechanism can be simplified.

(Second Embodiment)
FIGS. 10A and 10B are a plan view and a cross-sectional view of a microlens mounting plate having a nozzle as the exposure apparatus of the second embodiment. As shown in FIG. 10, a plurality of nozzles 45 are formed on the upper and lower surfaces of both sides of the microlens mounting plate 62 that extends in the Y direction and is not held by the microlens mounting plate 62. The plurality of nozzles 45 communicate with an air supply hole 46 formed in the microlens mounting plate 62. The plurality of nozzles 45 discharge air supplied from an air supply device (not shown) toward at least one of the upper side and the lower side through the air supply hole 46.

  As a result, the bending of the microlens mounting plate 62 that is bent by its own weight is corrected as indicated by the broken line in the drawing, and exposure unevenness due to the bending of the microlens mounting plate 62 can be prevented. A vacuum device is connected to the air supply hole 46 and air near the upper and lower surfaces of the microlens mounting plate 62 is sucked from the nozzle 45 to prevent the microlens mounting plate 62 from being bent. The distance from the microlens mounting plate 62 may be kept constant.

As described above, since the microlens mounting plate 62 of the present embodiment includes the nozzle 45 that discharges or sucks air on at least one of the upper surface and the lower surface thereof, by discharging or sucking air from the nozzle 45, It is possible to suppress the deflection of the microlens mounting plate 62 due to its own weight, keep the distance from the substrate W constant, and prevent the occurrence of exposure unevenness. Furthermore, the magnification of the microlens 42 can be corrected by giving an appropriate curvature to the microlens mounting plate 62 and the microlens 42. At this time, the air discharged from the plurality of nozzles 45 has a cooling effect on the substrate and the mask. In addition, there is a cooling effect on the air supplied from the vacuum apparatus.
The plurality of nozzles 45 may be designed to adjust the amount of air discharged or sucked from each nozzle 45.

(Third embodiment)
Next, an exposure apparatus according to the third embodiment of the present invention will be described in detail with reference to FIGS. Note that the same or equivalent parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  Also in the present embodiment, the exposure apparatus PE is similar to the first embodiment in that the mask stage 10 that holds the mask M, the substrate stage 20 on which the glass substrate (material to be exposed) W is placed, and the substrate stage 20 is X. A substrate stage moving mechanism 50 that moves in the directions of the axis, Y axis, and Z axis and adjusts the tilt of the substrate stage 20 and a microlens array 41 are disposed between the substrate stage 20 and the mask stage 10. A microlens stage 40 and an illumination optical system 30 that irradiates the substrate W with light for pattern exposure via a mask M and a microlens array 41 are provided.

  On the other hand, as shown in FIGS. 11 and 12, the mask frame 11 of the mask stage 10 is supported by a column 77 erected on the apparatus base 70 and disposed above the substrate stage 20.

  13, 14, and 15, the microlens stage 40 includes four microlens mounting plates 62 each having a microlens array 41 corresponding to the four mask holding frames 12. And the substrate W are supported so as to be movable with respect to the microlens frame 63.

As shown in FIG. 15, the microlens frame 63 includes two pairs of X-direction frames 64 and 65 extending in the X direction and arranged in parallel in the Y direction on both sides of the microlens mounting plate 62 in the Y direction. A Y-direction frame 66 that connects the pair of X-direction frames 64 and 65 at the X-direction ends, and a fixing member 67 that is disposed at both ends in the X-direction of the X-direction frame 64 and is connected to the Y-direction frame 66. . The microlens frame 63 is supported by a support column 77 common to the mask frame 11 via a fixing member 67.
The configuration of the microlens frame 63 is not limited to the above configuration as long as it is supported by the support column 77, and can be arbitrarily designed.

  The microlens stage 40 includes a microlens mounting plate 62 and a linear motor that is a microlens driving mechanism that moves the microlens mounting plate 62 in the X direction for each of four regions corresponding to each mask holding frame 12. 68, a cable guide 81, and the like are provided. Since the four regions have substantially the same structure, one region will be described in the following description.

  As shown in FIG. 14, on the microlens mounting plate 62, a plurality of microlens arrays 41 provided corresponding to each mask M are linearly formed along a direction (Y direction) orthogonal to a predetermined direction. It is mounted on a rectangular opening so as to extend. Further, in the microlens mounting plate 62, the area other than the microlens array 41 is shielded so that unnecessary light is prevented from being irradiated onto the substrate W.

As shown in FIG. 17A, the microlens mounting plate 62 is suspended by a suspension frame 69.
Further, the dimension relating to the height h of the microlens mounting plate 62 or the width t of the suspension frame 69 is changed. Thereby, the rigidity of the mask lens mounting plate 62 and the suspension frame 69 can be increased and adjusted to a predetermined flatness of the microlens array 41, and the deflection of the microlens array 41 can be prevented.

  Further, by increasing the rigidity of the microlens mounting plate 62 and the suspension frame 69, it is possible to suppress the vibration generated from the periphery of the exposure apparatus from being transmitted to the microlens array 41.

  As shown in FIG. 17B, the microlens mounting plate 62 is moved in the longitudinal direction of the microlens array 41 in order to prevent the microlens mounting plate 62 from resonating due to vibration generated from the periphery of the exposure apparatus. You may divide | segment at an intermediate part.

  Referring also to FIG. 16, guide rails 49a and 56a and sliders 49b and 56b slidably provided on the guide rails 49a and 56a are formed on the opposing inner walls of the X direction frames 64 and 65, respectively. Linear guides 49 and 56 are provided, respectively.

  The suspension frame 69 is fixed to the sliders 49 b and 56 b on both sides in the Y direction of the microlens array 41, and is movable in the X direction with respect to the microlens frame 63 by being guided by the pair of linear guides 49 and 56.

  The microlens mounting plate 62 is driven by a linear motor 68 and is a driving side member 51 that moves in a slit 64a provided along the X direction in the vertical direction intermediate portion of the X direction frame 64, and a fastening member. A leaf spring 52 having one end connected to the drive side member 51 via a block 53.

  The linear motor 68 includes a stator 68a fixed outside the X direction frame 64, and a mover 68b fixed to the drive side member 51 so as to face the stator 68a.

  The leaf spring 52 is a linear guide that is a guide mechanism including a guide rail 55a fixed to an L-shaped member 84 supported at both ends by a fixing member 67, and a slider 55b slidably provided on the guide rail 55a. 55 in the X direction.

  Examples of the material of the leaf spring 52 include cold rolled steel plate, electrogalvanized steel, hot dip galvanized steel plate, stainless steel plate, brass plate, copper plate, phosphor bronze plate, ribbon steel plate, bainite steel plate, beryllium steel plate and the like. In addition to these materials, carbon steel, cast iron (flaky graphite cast iron), cast steel, magnesium alloy, sirentaroi, Ni-Ti alloy, Mn-Cu alloy are made into a plate shape, and these are sandwiched with resin or rubber, It may be used as a spring. In this case, ABS resin, polyamide resin, polyacetal resin, or the like is applied as the resin, and chloropropylene rubber, styrene butadiene rubber, or the like is applied as the rubber.

  A cable (not shown) connected to a connection terminal (not shown) provided on the column 77 supplies power to the linear motor 68. The bendable cable guide 81 for guiding the cable is bent in a substantially U shape, and one end portion 81a is connected to the leaf spring 52, and the other end portion 81b is supported by the support column 77 at both ends. It is disposed on the upper surface of the tray 82. The cable guide 81 moves on the upper surface of the cable guide tray 82 while moving the position of the substantially U-shaped bent portion as the microlens mounting plate 62 moves.

On the upper surface of the cable guide tray 82, a vibration absorbing member 83 formed by joining a metal plate 83a and an elastic member 83b such as rubber is mounted. The elastic member 83b is attached so as to contact the upper surface of the cable guide tray 82, and absorbs vibration transmitted from the cable guide 81 to the cable guide tray 82 as the microlens mounting plate 62 moves.
The cable guide tray 82 has the same length as the X-direction frame 64, and is provided between the fixing members 67 so as to be separated from the X-direction frame 64 outward in the Y direction.

  Also in the exposure apparatus PE configured as described above, the mask pattern P is exposed and transferred onto the substrate W by using the four masks M and performing the operation of simultaneously exposing and transferring to the four exposed areas. Further, the gap sensor 15 mounted on the sensor carrier 17 measures the gap between the opposing surfaces of the mask M and the substrate W, and drives the Z-tilt adjustment mechanism 24 to separate the mask M and the substrate W from each other at a predetermined interval. Make them face each other in parallel. In the exposure transfer of the second and subsequent layers, the gap sensor 15 adjusts the gap between the opposing surfaces of the mask M and the substrate W, and the alignment mark formed on the substrate W and the mask M by the alignment camera 16. And the relative position between the substrate W and the mask M is adjusted.

  Then, the linear lens 68 of the microlens stage 40 and the driving mechanism of the illumination optical system 30 (not shown) are operated to move the microlens mounting plate 62 and the illumination optical system 30 in the left direction in FIG. Then, light for pattern exposure from the illumination optical system 30 is irradiated to a region corresponding to the microlens array 41.

  Since the leaf spring 52 moves as the microlens mounting plate 62 moves, the cable guide 81 moves on the upper surface of the cable guide tray 82 while changing the position of the substantially U-shaped bent portion. At this time, the vibration generated in the cable guide 81 is transmitted to the leaf spring 52 and the leaf spring 52 may vibrate.

  However, in the present embodiment, since the leaf spring 52 is guided by the linear guide 55, the vibration of the leaf spring 52 is suppressed. Further, since the vibration of the leaf spring 52 is absorbed by the linear bush 53, the vibration transmitted from the leaf spring 52 to the drive side member 51 can be reduced. Thereby, the vibration of the microlens mounting plate 62, that is, the microlens array 41 can be prevented, and exposure transfer with high accuracy is possible. Further, the linear bush 53 has an action of absorbing a deflection error of the linear guide 49 and the linear guide 55 by moving in the Z-axis direction.

Further, since vibration generated by the movement of the microlens mounting plate 62 is absorbed by the leaf spring 52, vibration transmitted to the mask stage 10 via the cable guide tray 82 and the support column 77 is prevented, and high accuracy is achieved. Can be transferred by exposure. The microlens frame 63 absorbs the bending of the linear guide 49 and the linear guide 55 by bending the leaf spring 52 in the Z direction, so that the gap between the substrate W and the microlens array 41 or the mask M And the microlens array 41 are not easily affected by the gap.
A resin or rubber may be sandwiched between the one end 81a of the cable guide 81 and the leaf spring 52 in order to suppress vibration.

In addition, since a vibration absorbing member 83 formed by joining a metal plate 83a and an elastic member 83b such as rubber is attached to the upper surface of the cable guide tray 82 on which the cable guide 81 is disposed, the cable guide 81 is connected to the cable guide 81. The vibration when contacting the guide tray 82 is absorbed by the vibration absorbing member 83 and is prevented from being transmitted to the cable guide tray 82. Thus, vibration transmitted to the mask stage 10 via the cable guide tray 82 and the support column 77 is prevented, and exposure transfer with high accuracy is possible.
The vibration absorbing member 83 can be formed by appropriately combining rubber, resin, and metal. As the rubber, chloropropylene rubber, styrene butadiene rubber or the like is applied, as the resin, ABS resin, polyamide resin, polyacetal resin or the like is applied, and as the metal plate, carbon steel, cast iron (flaky graphite cast iron), Cast steel, magnesium alloy, sirentaroy, Ni-Ti alloy, Mn-Cu alloy, stainless steel alloy and the like are applied.

  As described above, according to the exposure apparatus PE of the present embodiment, the mask frame 11 and the microlens frame 63 are supported by the common support column 77, so that the support structure is designed to be compact and the exposure is performed. The apparatus PE can be reduced in size, and the assembly is facilitated. Further, by changing at least one of the height of the microlens mounting plate 62 and the width of the suspension frame 69 and increasing the rigidity of the microlens mounting plate 62 and the suspension frame 69, the predetermined flatness of the microlens array 41 is achieved. The microlens array 41 can be prevented from bending.

  The microlens stage 40 includes a bendable cable guide 81 whose one end 81 a is connected to the microlens mounting plate 62 (plate spring 52) and supplies power to the linear motor 68, and the other end of the cable guide 81. 81b is provided, and includes a cable guide tray 82 or an L-shaped member 84 that is supported by the support column 77 apart from the microlens frame 63. Therefore, vibration accompanying the movement of the cable guide 81 occurs in the microlens frame 63. It is transmitted and it can prevent that micro lens array 41 vibrates. Thereby, a fine exposure pattern can be exposed and transferred onto the substrate W with high accuracy.

  Further, the microlens mounting plate 62 is connected to the driving side member 51 via the linear bushing 53 and the driving side member 51 driven by the linear motor 68, and the leaf spring to which the one end 81 a of the cable guide 81 is connected. 52, and the drive of the leaf spring 52 is guided by the linear guide 55, so that the vibration of the leaf spring 52 is suppressed by the linear guide 55 and is driven from the cable guide 81 via the leaf spring 52. The vibration transmitted to 51 can be prevented by the linear bush 53 as a fastening member, and the microlens array 41 can be prevented from vibrating. Further, when the linear bush 53 moves in the Z-axis direction, the deflection error between the linear guide 55 and the microlens mounting plate 62 can be absorbed and the microlens mounting plate 62 can be moved smoothly.

  Since the cable guide tray 82 includes the vibration absorbing member 83 on the upper surface where the cable guide 81 is disposed, the vibration of the cable guide 81 is prevented from being transmitted to the mask stage 10 via the cable guide tray 82. Can do.

  The vibration absorbing member 83 attached to the cable guide tray 82 is configured by joining the metal plate 83a and the elastic member 83b, and is attached so that the elastic member 83b contacts the cable guide tray 82. The vibration transmitted from 81 to the cable guide tray 82 can be absorbed.

(Fourth embodiment)
Next, an exposure apparatus according to the fourth embodiment of the present invention will be described in detail with reference to FIGS. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

  In the present embodiment, the microlens mounting plate 62 is formed in a rectangular cylindrical shape having an opening at the center, and has a main frame 62a having a flange around the upper portion, and a subframe that supports the flange of the main frame 62a. 62b, and the micro lens array 41 is placed on the main frame 62a. The sub frame 62 b is connected to the suspension frame 69.

  As shown in FIG. 18A, the microlens array 41 is adjusted by adjusting the height of the microlens mounting plate 62 in the Z-axis direction and adjusting the flatness of the microlens array 41 by the height adjusting mechanism 100. Can be adjusted. Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

  The height adjustment mechanism 100 is fastened to the main frame 62a with six fastening members 101 for height adjustment. Note that three fastening members 101 are fastened to the main frame 62a, three on each side in the X direction of the main frame 62a, symmetrically with respect to the center in the Y-axis direction of the opening.

  As shown in FIGS. 18B and 18C, the moving distance of the fastening member 101 is adjusted by tightening or loosening the fastening member 101, and the subframe 62b is deformed. The height of the main frame 62a is adjusted by the reaction force of the deformed subframe 62b. Therefore, the flatness of the micro lens array 41 placed on the main frame 62a can be adjusted. Therefore, it is possible to perform transfer exposure with high resolution while maintaining a constant gap among the macro lens array 41, the mask M, and the workpiece W. In the embodiment, six fastening members 101 are fastened to the main frame 62a and three on both sides. Not only this but the number of fastening members should just be two or more. Further, it is not necessary to fasten the same number of fastening members 101 on both sides of the main frame 62a.

  As a modification of the present embodiment, as shown in FIG. 19A, the height adjustment mechanism 100 ′ is arranged between six main frames 62a and sub-frames 62b. It consists of a seat 102.

  As shown in FIG. 19B and FIG. 19C, the height of the main frame 62a and the sub frame 62b is changed by increasing or decreasing the thickness of the spacer 102. Thereby, the flatness of the microlens array 41 placed on the main frame 62a can be adjusted. Therefore, it is possible to perform transfer exposure with high resolution while maintaining a constant gap among the macro lens array 41, the mask M, and the workpiece W. In the embodiment, three spacers 102 are disposed between the main frame 62a and the sub frame 62b on both sides of the main frame 62a and the sub frame 62b. The number of spacers 102 is not limited to this, and it is sufficient that the number of spacers is two or more. Further, it is not necessary to arrange the same number of spacers 102 on both sides of the main frame 62a. By providing the spacer 102 with a piezo effect, the thickness of the spacer can be increased or decreased without stacking the spacers 102 as shown in FIG.

  Therefore, according to the exposure apparatus of the present embodiment, the microlens mounting plate 62 is provided with the height adjusting mechanisms 100 and 100 ′ that can adjust the flatness. Thereby, by adjusting the flatness of the microlens mounting plate 62, the deflection of the microlens array mounted on the microphone lens mounting plate can be adjusted. Therefore, by improving the flatness of the bent microlens array, a fine exposure pattern can be exposed and transferred onto the substrate with high accuracy by the microlens array.

  Further, the height adjustment mechanisms 100 and 100 ′ include a fastening member 101 fastened to a main frame 62 a constituting the microlens mounting plate 62 or a main frame 62 a constituting the microphone lens mounting plate 62, The height of the microlens mounting plate 62 can be adjusted by adjusting the thickness of the spacer 102 sandwiched between the frame 62b.

  Further, a plurality of fastening members 101 are fastened to the main frame 62a on both sides in the X direction of the main frame 62a symmetrically with respect to the center of the opening in the Y-axis direction. The height of the microlens mounting plate can be adjusted axially symmetrically by arranging a plurality of main frames 62a on both sides in the X direction of the main frame 62a symmetrically with respect to the axial center.

(Fifth embodiment)
Next, an exposure apparatus according to a fifth embodiment of the present invention will be described in detail with reference to FIGS. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

  In the present embodiment, as shown in FIG. 20A, the microlens mounting plate 62 is joined to the lower end surfaces of the suspension frames 110 and 111 on both sides in the Y-axis direction.

  As shown in FIG. 20B, the microlens mounting plate 62 is convex in the upward direction (+ Z-axis direction). As shown in FIG. 20C, when the microlens mounting plate 62 is joined to the lower end surfaces of the suspension frames 110 and 111, the microlens mounting plate has a convex shape. Due to the weight of the microlens array mounting plate 62 and the mass of the microlens array, the microlens mounting plate becomes flat. The microlens array 41 is placed on the flat microlens placement plate 62. As shown in FIG. 20D, when the microlens array 41 is placed on the microlens placement plate 62, the microlens array 41 can be made flat. As a result, the gap between the macro lens array 41, the mask M, and the workpiece W can be maintained constant, and transfer exposure can be performed with high exposure accuracy.

  As a modification of the present embodiment, as shown in FIG. 21A, the microlens mounting plate 62 ′ is joined to the lower end surfaces of the suspension frames 110 ′ and 111 ′ via both sides in the Y-axis direction. .

  As shown in FIG. 21B, the lower end surfaces of the suspension frames 110 ′ and 111 ′ are inclined in the Y direction so as to become higher toward the opening. As shown in FIG. 21C, when the microlens mounting plate 62 ′ is joined to the lower end surfaces of the suspension frames 110 ′ and 111 ′, the microlens mounting plate 62 ′ protrudes upward (+ Z-axis direction). Become a mold. The microlens array 41 is mounted on the convex microlens mounting plate 62 '. As shown in FIG. 21D, when the macro lens array 41 is placed on the micro lens placing plate 62 ', the micro lens array 41 can be made flat. As a result, the gap between the macro lens array 41, the mask M, and the workpiece W can be maintained constant, and transfer exposure can be performed with high exposure accuracy.

  As shown in FIG. 21E, the microlens mounting plate 62 ′ is flattened by sandwiching the spacer 112 having the adjusted thickness between the microlens mounting plate 62 ′ and the suspension frames 110 ′ and 111 ′. Anyway. Instead of the spacer whose thickness is adjusted, a spacer having a piezo effect that can change the thickness may be held and adjusted according to the weight of the microlens array to be mounted. Also, the thickness of the spacer may be changed during exposure to change the curvature of the entire microlens array, and the magnification may be finely adjusted by bending the optical axis. Further, the magnification in the traveling direction may be finely adjusted by adjusting the thickness of the spacer between the front and rear in the traveling direction during exposure and changing the inclination of the microlens array.

  Further, as shown in FIG. 21 (f), a spacer 112a having a piezoelectric effect is provided. Further, a spacer 112b having piezo effect disposed at the four corners inside the spacer 112a having piezo effect disposed on the microlens mounting plate 62 '. By sandwiching the spacers 112a and 112b having the piezoelectric effect between the microlens mounting plate 62 ′ and the suspension frames 110 ′ and 111 ′, the microlens mounting plate 62 ′ becomes flat. The microlens array 41 is mounted on the flat microlens mounting plate 62 '. At this time, when the microlens array 41 is placed on the microlens placement plate 62 ', the microlens array 41 can be made flat. The spacers 112a and 112b having a piezo effect are not limited to being provided at the four corners of the microlens mounting plate 62 ', but may be at both ends of the microlens mounting plate 62'.

  Therefore, according to the exposure apparatus of the present embodiment, by joining the microlens mounting plate 62, the microlens mounting plate 62 has a convex shape so as to be flat due to its own weight and the mass of the microlens array 41. Yes. When the microlens array 41 is placed on the microlens placement plate 62, the microlens array 41 follows the microlens placement plate 62 by its own weight, and the microlens placement plate 62 becomes flat. 41 also becomes flat, and a fine exposure pattern can be exposed and transferred onto the substrate with high accuracy.

  Further, since the lower end surfaces of the suspension frames 110 ′ and 111 ′ are inclined, the microlens mounting plate 62 ′ has a convex shape upward. Thereafter, the microlens mounting plate 62 ′ becomes flat due to the weight of the microlens mounting plate 62 ′ and the mass of the microlens array 41. When the microlens array 41 is placed on the microlens placement plate 62 ′, the microlens array 41 becomes flat following the microlens placement plate 62 ′ due to its own weight. Thereby, a fine exposure pattern can be exposed and transferred onto the substrate with high accuracy.

(Sixth embodiment)
Next, an exposure apparatus according to the sixth embodiment of the present invention will be described in detail with reference to FIGS. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

In this embodiment, as shown in FIG. 22A, the microlens mounting plate 62 is joined to the suspension frames 120 and 121 on both sides in the Y direction. The slider 49b fixing the suspension frame 120 can rotate around a guide rail 49a slidably provided. Further, the slider 56b fixing the suspension frame 121 can rotate around a guide rail 56a slidably provided. Specifically, since the sliders 49b and 56b have low rigidity in the self-aligning DF (front combination) type, the microlens mounting plate 62 cannot maintain flatness. For this reason, the sliders 49b and 56b use a highly rigid DB (backside combination) type, and the guide rails 49a and 56a are rotated by a motor (not shown) provided at one end of the guide rails 49a and 56a, thereby microlenses. The flatness of the mounting plate 62 can be adjusted. Further, the slider itself may be rotated by a motor (not shown) provided on the sliders 49b and 56b.
As shown in FIG. 22B, the deflection of the microlens mounting plate 62 can be adjusted by rotating the slider 49b and the slider 56b. Thereby, the flatness of the microlens array 41 can be adjusted.
Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

  FIGS. 23A and 23B illustrate a first modification of the present embodiment. The microlens mounting plate 62 is joined to the suspension frames 120 and 121 via rotation shafts 122 on both sides in the Y direction. The suspension frames 120 and 121 can rotate around the rotation shaft 122. The slider 49b fixing the suspension frame 120 can rotate around a guide rail 49a slidably provided. Further, the slider 56 can be slid in the Y direction by a deflection adjusting slider 123 provided at the upper part in the Z direction.

For example, when the suspension frames 120 and 121 are inclined inward, the suspension frame 121 is moved outward by the slider 123, or the slider 49b is rotated to pull the suspension frame 120 outward, and the microlens mounting plate 62 is bent. Adjust. Further, when the suspension frames 120 and 121 are inclined outward, the suspension frame 121 is caused to travel inward by the slider 123, or the slider 59b is rotated and the suspension frame 120 is pushed inward to bend the microlens mounting plate 62. Adjust.
In this way, by rotating the slider 49b, sliding the slider 56b in a direction perpendicular to the slider traveling direction, and rotating the suspension frames 120 and 121 by the rotating shaft 122, FIG. As shown in b), the deflection of the microlens mounting plate 62 can be adjusted. Thereby, the flatness of the microlens array 41 can be adjusted.
Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

FIGS. 24A and 24B illustrate a second modification of the present embodiment. The microlens mounting plate 62 is joined to the suspension frames 120 and 121 via deflection adjusting plate springs 124 at both ends in the Y direction. The slider 49b fixing the suspension frame 120 can rotate around a guide rail 49a slidably provided.
Furthermore, the slider 56b can be slid in the Y direction by a deflection adjusting slider 123 provided in the upper part in the Z direction. The rotational motion of the slider 49b and the linear motion of the slider 56b become the elastic force of the leaf spring 124. For this reason, the elastic force of the leaf spring 124 can adjust the bending of the microlens mounting plate 62. As shown in FIG. 24B, the deflection of the microlens mounting plate 62 can be adjusted by rotating the slider 49 b, sliding the slider 56 b in the Y direction, and the leaf spring 124. . Thereby, the flatness of the microlens array 41 can be adjusted.
Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

As shown in FIG. 25A, a third modification of the present embodiment will be described. The microlens mounting plate 62 is joined to the suspension frame 120 via a rotating shaft 122 at one end in one Y direction. The suspension frame 120 can rotate about the rotation shaft 122. The microlens mounting plate 62 is joined to the suspension frame 121 via a leaf spring 124 at one end in the other Y direction. The slider 49b fixing the suspension frame 120 can rotate around a guide rail 49a slidably provided. Further, the slider 56 can be slid in the Y direction by the slider 123 provided at the upper part in the Z direction. The linear motion of the slider 56 a becomes the elastic force of the leaf spring 124.
As shown in FIG. 25B, the microlens mounting is performed by rotating the slider 49b, sliding the slider 56b in the Y direction, rotating the suspension frame 120 by the rotating shaft, and elastic force. The bending of the mounting plate 62 can be adjusted. Thereby, the flatness of the microlens array 41 can be adjusted.
Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

  Therefore, according to the exposure apparatus of the present embodiment, the sliders 49b and 56b fixing the suspension frames 120 and 121 rotate around the guide rails 49a and 56a straddling the sliders 49b and 56b. The flatness of the microlens array 41 can be adjusted by adjusting the bending of the microlens mounting plate 62. Therefore, the flatness of the microlens array 41 mounted on the microphone lens mounting plate 62 can be adjusted by adjusting the deflection of the microlens mounting plate 62. Therefore, by improving the flatness of the bent microlens array 41, a fine exposure pattern can be exposed and transferred to the substrate through the microlens array 41 with high accuracy.

  Further, by sliding the sliders 49b and 56b in a direction perpendicular to the slider traveling direction, the flatness of the microlens array 41 placed on the microphone lens array placement plate 62 can be adjusted according to the slid distance. . Therefore, by improving the flatness of the bent microlens array 41, a fine exposure pattern can be exposed and transferred to the substrate through the microlens array 41 with high accuracy.

  Further, the microlens mounting plate 62 and the suspension frame 120 are joined via a rotating shaft 122 that rotates the suspension frame 120, or the microlens mounting plate 62 and the suspension frame 121 are connected to the microlens array 41. By joining via a leaf spring 124 for adjusting the bending, the bending of the microlens mounting plate 62 can be adjusted. Therefore, by improving the flatness of the bent microlens array 41, a fine exposure pattern can be exposed and transferred to the substrate through the microlens array 41 with high accuracy.

(Seventh embodiment)
Next, an exposure apparatus according to the seventh embodiment of the present invention will be described in detail with reference to FIGS. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

  In the present embodiment, as shown in FIG. 26, an electromagnet (magnet) 130 is suspended from the sensor carrier 17. The electromagnet (magnet) 131 is embedded in the microlens mounting plate 62. The electromagnet 130 is provided so as to face the electromagnet 131. As shown in FIG. 27A, the microlens mounting plate 62 bends due to its own weight. Therefore, the microlens array 41 placed on the microlens placement plate 62 is also bent. By making the opposing surfaces of the electromagnet 130 and the electromagnet 131 have different polarities, an attractive force is generated between the sensor carrier 17 and the microlens mounting plate 62. Therefore, since the microlens mounting plate 62 is pulled in the positive Z-axis direction, the bending of the microlens mounting plate 62 can be adjusted. Thereby, the flatness of the microlens array 41 can be adjusted. Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

  Specifically, as shown in FIG. 27A, when the microlens mounting plate 62 bends due to its own weight, the pole of the electromagnet 130 and the pole of the electromagnet 131 opposite to the pole are different from each other. An attractive force is generated between the terminal 131 and the terminal 131. A control unit (not shown) that controls the magnetic force between the electromagnet 130 and the electromagnet 131 can control the magnitude of the attractive force generated between the electromagnet 130 and the electromagnet 131 by controlling the voltage or current applied to the electromagnet 131. . Thereby, as shown in FIG. 27B, the deflection of the microlens mounting plate 62 can be adjusted, and the flatness of the microlens array 41 can be adjusted.

As shown in FIG. 28, in the first modification of the present embodiment, the electromagnet (magnet) 130 is embedded in the work chuck 21a that is attracted and held by the substrate W. An electromagnet (magnet) 131 is embedded in the microlens mounting plate 62. The electromagnet 130 is provided so as to face the electromagnet 131. As shown in FIG. 29A, the microlens mounting plate 62 bends due to its own weight. Therefore, the microlens array 41 placed on the microlens placement plate 62 is also bent. By making the opposing surfaces of the electromagnet 130 and the electromagnet 131 have the same polarity , a repulsive force is generated between the sensor carrier 17 and the microlens mounting plate 62. Therefore, since the microlens mounting plate 62 can be compressed in the positive Z-axis direction, the deflection of the microlens mounting plate 62 can be adjusted. Thereby, the flatness of the microlens array 41 can be adjusted. Therefore, the gaps among the microlens array 41, the mask M, and the substrate W can be made as uniform as possible.

  Specifically, as shown in FIG. 29A, when the microlens mounting plate 62 bends due to its own weight, the pole of the electromagnet 130 and the pole of the electromagnet 131 opposite to the pole are the same, and the electromagnet 130 and the electromagnet A repulsive force is generated between the terminal 131 and the terminal 131. A control unit (not shown) that controls the magnetic force between the electromagnet 130 and the electromagnet 131 controls the magnitude of the repulsive force generated between the electromagnet 130 and the electromagnet 131 by controlling the voltage or current applied to the electromagnet 131. Can do. As shown in FIG. 29B, the flatness of the microlens array 41 can be adjusted by adjusting the bending of the microlens mounting plate 62.

  As shown in FIGS. 30A and 30B, in the second and third modifications of the present embodiment, a magnetic body such as iron is used instead of the magnet 131 provided on the microlens array mounting plate 62. 132 is used. Therefore, in FIG. 30A, the magnet 130 provided in the sensor carrier 17 attracts the magnetic body 132 provided in the microlens mounting plate 62, and in FIG. 30B, the magnet 130 provided in the work carrier 21a. By attracting the magnetic body 132 provided on the microlens mounting plate 62 by the magnet 130, the deflection of the microlens mounting plate 62 can be adjusted, and the flatness of the microlens array 41 can be adjusted.

  The electromagnet 130 or the electromagnet 131 is not limited to this embodiment, and a plurality of the electromagnets 130 or the electromagnets 131 may be provided on the sensor carrier 17, the work chuck 21a, or the microlens mounting plate 62. Further, the electromagnet 130 or the electromagnet 131 may be replaced with a permanent magnet. Further, the electromagnet 130 or the electromagnet 131 may be provided inside the mask holding frame 12 or inside the microlens mounting plate 62.

  Therefore, according to the exposure apparatus of this embodiment, the microlens mounting plate 62 is bent using the attractive force generated by the magnet 130 provided in the sensor carrier 17 and the magnet 131 provided in the microlens mounting plate 62. By adjusting, the flatness of the microlens array 41 mounted on the microlens mounting plate 62 can be adjusted. Therefore, by improving the flatness of the bent microlens array 41, a fine exposure pattern can be exposed and transferred to the substrate through the microlens array 41 with high accuracy.

  Further, the microphone lens mounting plate is adjusted by adjusting the deflection of the microlens mounting plate 62 using the repulsive force generated by the magnet 130 provided in the work chuck 21a and the magnet 131 provided in the microlens mounting plate 62. The flatness of the microlens array 41 placed on 62 can be adjusted. Therefore, by improving the flatness of the bent microlens array 41, a fine exposure pattern can be exposed and transferred to the substrate through the microlens array 41 with high accuracy.

  Further, the magnet 130 provided on the sensor carrier 17 attracts the magnetic body 132 provided on the microlens mounting plate, or the magnet 130 provided on the work chuck 21a with the magnetic body 132 provided on the microlens mounting plate 62. As a result, the deflection of the microlens mounting plate 62 can be adjusted, and the flatness of the microlens array 41 can be adjusted. Therefore, by adjusting the flatness of the bent microlens array 41, it is possible to expose and transfer to the substrate with high resolution via the microlens array 41.

(Eighth embodiment)
Next, an exposure apparatus according to an eighth embodiment of the present invention will be described in detail with reference to FIG. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

  In this embodiment, as shown in FIG. 31A, the sensor carrier driving mechanism 18 is fixed to the upper surface of a frame 11 (a mask holding frame (not shown) is provided on the lower surface of the frame) constituting the mask stage. A ball screw nut 18a, a ball screw shaft 18b screwed to the ball screw nut 18a, and a motor 18c for rotating the ball screw nut 18a are provided. The ball screw shaft 18b is supported by the fixed end 153. By driving the motor 18c of the sensor carrier driving mechanism 18 to rotate the ball screw shaft 18b, the sensor carrier 17 is moved in the Y-axis direction along the guide rail 150 disposed on the frame constituting the mask stage. Let

  When the gain of the sensor carrier drive mechanism 18 is adjusted, an excessive inertia force is applied to the bracket 147 and the sensor carrier 17, and the sensor carrier 17 may be damaged. In order to prevent such damage, as shown in FIGS. 31 (b) and 31 (c), when adjusting the gain of the sensor carrier drive mechanism 18, the four fastening members 145a and the outer sides of the fastening members 145a are used. With the two fastening members 145b arranged in the above, the sensor carrier 17 is temporarily fixed to the upper surface of the bracket 147 disposed on the ball screw nut 18a on the diagonal of the upper surface of the sensor carrier 17.

  During the gain adjustment of the sensor carrier driving mechanism 18, excessive inertial force is dispersed to the temporarily fixed fastening members 145 a and 145 b, and there is no possibility that excessive inertial force is loaded on the sensor carrier 17. When an excessive inertia force is applied to the bracket 147, the bracket 147 and the sensor carrier 17 are displaced, and an excessive shearing force is generated in the fastening members 145a and 145b. Therefore, the fastening members 145a and 145b are broken. Good. Therefore, in order to prevent damage to the bracket 147 or the sensor carrier 17 when an excessive inertia force is applied, the diameter of the fastening member 145b is preferably smaller than the diameter of the fastening member 145a.

Therefore, according to this embodiment, the alignment camera 16 that measures the gap between the opposing surfaces of the mask and the substrate on the mask frame 11 supported by the support column 77 common to the mask stage 10 and the relative relationship between the substrate and the mask. The sensor carrier 17 is fastened so that the sensor carrier 17 is not damaged when the gain of the sensor carrier driving mechanism 18 that enables the sensor carrier 17 for holding the gap sensor 15 that can detect the position to be moved is adjusted. The members 145a and 145b are temporarily fixed. Thereby, it is possible to prevent the sensor carrier 17 from being damaged during the gain adjustment of the sensor carrier driving mechanism 18. Thereby, a fine exposure pattern can be exposed and transferred onto the substrate W with high accuracy.
Note that a plurality of fastening members may be temporarily fixed diagonally to the upper surface of the sensor carrier, and at least two of the plurality of fastening members preferably have a smaller diameter than the other fastening members.

In the present embodiment, X direction frames 64 and 65 are arranged on the lower surface of the mask holding frame 12. The X-direction frames 64 and 65 are provided with slits 64a and 65a that allow the microlens mounting plate 62 to move in a predetermined direction. Here, as shown in FIG. 31D, the height of the mask holding frame 12 is ha, the width is ta, the height of the X direction frames 64 and 65 is hb, and the width is tb. In order for the mask holding frame 12 and the X direction frames 64 and 65 to suppress resonance by the movement of the microlens mounting plate 62, it is necessary to increase the rigidity of the mask holding frame 12. Therefore, it is preferable that the relationship between ha and hb, and ta and tb satisfy ha> hb and ta> tb. Thereby, it is possible to prevent the X direction frames 64 and 65 and the mask frame 11 from resonating due to vibration generated when the microlens mounting plate 62 moves.
Therefore, the relative position between the substrate W and the mask M is adjusted by detecting the alignment marks formed on the substrate W and the mask M by the alignment camera 16, but after the adjustment, the above-described resonance is prevented, and the substrate W is adjusted. There is no possibility that the relative position between the mask and the mask M is shifted. Thereby, a fine exposure pattern can be exposed and transferred onto the substrate with high accuracy.

(Ninth embodiment)
Next, an exposure apparatus according to a ninth embodiment of the present invention will be described in detail with reference to FIG. In addition, about the same or equivalent part as 3rd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.
In the above embodiment, a linear motor is used as the microlens driving mechanism 68 that moves the microlens mounting plate 62 in the X-axis direction. However, in this embodiment, as shown in FIG. 32, the microlens driving mechanism 168 includes a ball screw nut 168a fixed to the upper surface of the microlens mounting plate 62 and a ball screwed into the ball screw nut 168a. A screw shaft 168b and a motor 168c that is installed outside the Y-direction frame 63 and rotationally drives the ball screw shaft 168b are disposed, and the motor 168c of the microlens driving mechanism 168 is driven to move the ball screw shaft 168b. The microlens mounting plate 62 may be moved in the X-axis direction by rotating.

  Therefore, according to the exposure apparatus of the present embodiment, the microlens driving mechanism 168 that drives the microlens mounting plate 62 in a predetermined direction includes the ball screw nut 168a, the ball screw shaft 168b, and the motor 168c. Since the motor 168c is fixed, the wiring does not follow the microlens driving mechanism 168, so that the possibility of disconnection is reduced. Thereby, since the number of times of maintenance is reduced, the throughput can be improved. Further, since adverse effects due to the bending of the wiring are reduced, a highly reliable fine exposure pattern can be exposed and transferred onto the substrate with high accuracy.

(10th Embodiment)
Next, an exposure apparatus according to the tenth embodiment of the present invention will be described in detail with reference to FIGS. Note that the same or equivalent parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  As shown in FIGS. 33 and 34, in the present embodiment, the mask stage 10 is provided with a cover glass 90 made of glass or resin on the top of the mask holding frame 12, and the mask M and the mask holding frame 12 are provided. The cover glass 90 forms a highly airtight space, and the pressure in the highly airtight space is adjusted by a pressure control mechanism (not shown) to correct the mask deformation.

  Further, as shown in FIG. 35, a resin film 91 as a covering member is attached to all surfaces of the cover glass 90. Thus, when the cover glass 90 is held in the groove 12 a of the mask holding frame 12, the resin film 91 is sandwiched between the cover glass 90 and the mask holding frame 12, and the cover glass 90 is attached to the mask holding frame. The cover glass 90 can be prevented from being damaged when being held at 12.

  As the resin film 91, an ionomer film, a polyethylene film, a polyvinyl chloride film (PVC film), a polyvinylidene chloride film, a polyvinyl alcohol film, a polypropylene film, a polyester film, a polycarbonate film, a polystyrene film, a polyacrylonitrile film, There are ethylene vinyl acetate copolymer film, ethylene-methacrylic acid copolymer film nylon film and the like. A polyester film is preferable as the film material in consideration of brightness enhancement, compatibility with a lens by being used as a lens filter, and easy peeling of the film from the mask. In view of wear resistance, a polypropylene film is preferred. In view of ultraviolet resistance, a nylon film is preferable. In addition to the resin film 91, a wire mesh or the like may be used as the covering member in consideration of wear resistance.

  Note that the cover glass 90 of the present embodiment may be disposed under the mask M and under the microlens array 41.

  Therefore, according to the exposure apparatus of this embodiment, the mask holding frame 12 is provided with the cover glass 90 so as to form a highly airtight space in cooperation with the mask M. Since the resin film 91 covering the entire surface is provided, the cover glass 90 can be prevented from being damaged when the cover glass 90 is held on the mask holding frame 12.

In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the present invention can be applied in combination with the above-described embodiments within a practicable range.
For example, the exposure apparatus of the present invention includes a case where exposure transfer is performed by driving one microlens mounting plate using one mask.

DESCRIPTION OF SYMBOLS 10 Mask stage 12 Mask holding frame 15 Gap sensor 16 Alignment camera 17, 17a, 17b, 17c, 17d Sensor carrier (masking aperture)
20 Substrate stage 30 Illumination optical system 40 Micro lens stage 41 Micro lens array 42 Micro lens 45 Nozzle 51 Drive side member 52 Leaf spring 53 Linear bush (fastening member)
55 Linear guide (guide mechanism)
60 Microlens Drive Mechanism 62 Microlens Placement Plate 63 Microlens Frame 68 Linear Motor (Microlens Drive Mechanism)
69 Suspension frame 77 Post 81 Cable guide 81a One end 81b Other end 82 Cable guide tray 83 Vibration absorbing member 83a Metal plate 83b Elastic member 91 Resin film (covering member)
93 leaf spring 100 height adjustment mechanism 101 fastening member 102 spacer 110 tilt angle adjustment mechanism 111 suspension frame 112 spacer 120 having a piezo effect, 121 suspension frame 122 rotating shaft 123 slider 124 (for deflection adjustment) (flexure adjustment) Leaf spring 130 for electromagnet (magnet)
131 Electromagnet
132 Magnetic body 145a, 145b Fastening member 168 Micro lens driving mechanism M Mask PE Exposure apparatus W Glass substrate (material to be exposed, substrate)

Claims (29)

A substrate stage for placing a substrate as an exposed material;
A mask stage that includes a mask holding frame for holding a mask, and is disposed above the substrate stage;
A microlens mounting plate for mounting a microlens array in which a plurality of microlenses are arranged in a plane, and a microlens driving mechanism for moving the microlens mounting plate in a predetermined direction, A microlens stage disposed between a substrate stage and the mask stage;
An illumination optical system for irradiating the substrate with light for pattern exposure via the mask and the microlens array;
With
The exposure apparatus according to claim 1, wherein the microlens mounting plate is configured to adjust a flatness of the microlens array so as to suppress bending of the microlens array.   The exposure apparatus according to claim 1, wherein the microlens mounting plate is suspended by a suspension frame.   The exposure apparatus according to claim 2, wherein at least one of a height of the microlens mounting plate and a width of the suspension frame is changed to increase the rigidity of the microlens mounting plate.   The exposure apparatus according to claim 2, wherein the microlens mounting plate is divided. The mask holding frame is provided with a cover glass so as to form a highly airtight space in cooperation with the mask,
The exposure apparatus according to claim 1, wherein the cover glass is provided with a covering member that covers all surfaces thereof.   The exposure apparatus according to claim 5, wherein the covering member is a resin film.   6. The exposure apparatus according to claim 5, wherein the covering member is a wire mesh. The microlens mounting plate has a main frame that holds the microlens array, and a subframe that supports the main frame,
The exposure apparatus according to claim 1, wherein the microlens mounting plate includes a height adjusting mechanism capable of adjusting a flatness of the microlens array.   The exposure apparatus according to claim 8, wherein the height adjustment mechanism is configured by a fastening member fastened to the main frame.   The exposure apparatus according to claim 9, wherein the fastening member includes a plurality of fastening members disposed symmetrically with respect to a longitudinal center of the main frame.   The exposure apparatus according to claim 8, wherein the height adjustment mechanism is configured by a spacer sandwiched between the main frame and the sub frame.   The exposure apparatus according to claim 11, wherein the spacer includes a plurality of spacers arranged symmetrically with respect to a longitudinal center of the main frame. The microlens mounting plate is suspended by a suspension frame,
The microlens mounting plate is joined to the suspension frame so that the microlens mounting plate is flattened by the weight of the microlens mounting plate and the mass of the microlens array. The exposure apparatus according to claim 1, wherein the exposure apparatus is flat.   The exposure apparatus according to claim 13, wherein the microlens mounting plate is formed in a convex shape upward.   15. The exposure apparatus according to claim 13, wherein a lower end surface of the suspension frame is inclined so as to become higher toward the center of the microlens mounting plate.   The slider fixing the suspension frame rotates about a guide rail straddling the slider, thereby adjusting the deflection of the microlens mounting plate and adjusting the flatness of the microlens array. The exposure apparatus according to claim 2, wherein the exposure apparatus is capable of performing.   The exposure apparatus according to claim 16, wherein the slider is slidable perpendicularly to a traveling direction in order to adjust the deflection of the microlens mounting plate.   The exposure apparatus according to claim 16 or 17, wherein the microlens mounting plate and the suspension frame are joined to each other via a rotation shaft that rotates the suspension frame.   The microlens mounting plate and the suspension frame are joined to each other through a leaf spring for adjusting the bending of the microlens mounting plate. The exposure apparatus described in 1. A gap sensor for measuring a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
The flatness of the microlens array is adjusted by adjusting the deflection of the microlens mounting plate by the attractive force generated between the magnet provided on the sensor carrier and the magnet provided on the microlens mounting plate. The exposure apparatus according to claim 1, wherein the exposure apparatus is capable of performing. A gap sensor for measuring a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
By adjusting the deflection of the microlens mounting plate by the repulsive force generated between the magnet provided to the work chuck of the substrate stage that holds the substrate by suction and the magnet provided to the microlens mounting plate, The exposure apparatus according to claim 1, wherein flatness of the microlens array can be adjusted. A gap sensor for measuring a gap between opposing surfaces of the mask and the substrate;
An alignment camera capable of detecting a relative position between the substrate and the mask;
A sensor carrier for holding the gap sensor and the alignment camera;
A sensor carrier driving mechanism for moving the sensor carrier in a predetermined direction;
Further comprising
The magnetic chuck provided on the microlens mounting plate is attracted by a magnet provided on the sensor carrier, or the work chuck of the substrate stage that holds the magnetic material provided on the microlens mounting plate by suction. 2. The exposure apparatus according to claim 1, wherein the flatness of the microlens array can be adjusted by adjusting the deflection of the microlens mounting plate by being attracted by a magnet provided in the apparatus.   A gap sensor for measuring a gap between opposing surfaces of the mask and the substrate on a mask frame supported by a common support column with the mask stage; and an alignment camera capable of detecting a relative position between the substrate and the mask; The sensor carrier is temporarily fixed with a fastening member so that the sensor carrier is not damaged when adjusting the gain of the sensor carrier driving mechanism that enables the sensor carrier for holding the sensor carrier to move. Item 23. The exposure apparatus according to any one of Items 1 to 22. An X-direction frame provided with a slit that allows the microlens mounting plate to move in a predetermined direction;
The height of the mask holding frame is ha, the width is ta, the height of the X direction frame is hb, the width is tb, and the relationship between the height of the mask holding frame and the height of the X direction frame is ha> hb. The exposure apparatus according to claim 1, wherein a relationship between a width of the mask holding frame and a width of the X direction frame is ta> tb.   The exposure apparatus according to any one of claims 1 to 24, wherein the microlens driving mechanism includes a ball screw nut, a ball screw shaft, and a motor. A substrate stage for placing a substrate as an exposed material;
A mask stage that includes a mask holding frame for holding a mask, and is disposed above the substrate stage;
A microlens mounting plate for mounting a microlens array in which a plurality of microlenses are arranged in a plane, and a microlens driving mechanism for moving the microlens mounting plate in a predetermined direction, A microlens stage disposed between a substrate stage and the mask stage;
An illumination optical system for irradiating the substrate with light for pattern exposure via the mask and the microlens array;
An exposure method for an exposure apparatus comprising:
Adjust the microlens mounting plate so that the microlens array has a predetermined flatness,
By irradiating the pattern exposure light with the illumination optical system while moving the microlens mounting plate in the predetermined direction, the mask pattern formed on the mask is passed through the plurality of microlenses. An exposure method comprising exposing and transferring to the substrate.   The mask pattern formed on the mask is irradiated by irradiating the pattern exposure light with the illumination optical system while moving the microlens mounting plate and the illumination optical system in synchronization with the predetermined direction. 27. The exposure method according to claim 26, wherein exposure transfer is performed on the substrate through the plurality of microlenses. Holding at least one of a gap sensor capable of measuring a gap between the substrate and the mask and an alignment camera capable of detecting a relative position between the substrate and the mask, above the microlens mounting plate, A plurality of sensor carriers arranged in a set for each of a plurality of masks arranged in a predetermined direction and movable in the predetermined direction;
The sensor carrier adjacent to each of the masks arranged in the predetermined direction is arranged such that the microlens mounting plate is exposed when the mask pattern is exposed and transferred to the substrate while the microlens mounting plate moves in the predetermined direction. 27. The exposure method according to claim 26, wherein the exposure method moves in the same direction. Holding at least one of a gap sensor capable of measuring a gap between the substrate and the mask and an alignment camera capable of detecting a relative position between the substrate and the mask, above the microlens mounting plate, A plurality of sensor carriers arranged in a set for each of a plurality of masks arranged in a predetermined direction and movable in the predetermined direction;
When the mask pattern is exposed and transferred to the substrate while the microlens mounting plate moves in the predetermined direction, each set of sensor carriers shields an area other than the microlens array in the predetermined direction. 27. The exposure method according to claim 26, wherein the exposure method moves in synchronization with the microlens mounting plate.

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