JP2014165049A - Dye-sensitized solar cell, manufacturing method of the same and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a colorful dye-sensitized solar cell; and provide a manufacturing method of the same and an electronic apparatus.SOLUTION: A DSC 200 comprises: a first substrate 20; a first electrode 10 arranged on the first substrate 20; a first porous semiconductor layer 13 which is arranged on the first electrode 10 and includes semiconductor fine particles and dye molecules; an electrolysis solution 14 which contacts the first porous semiconductor layer 13 and in which an oxidation-reduction electrolyte is soluble in a solvent; a second porous semiconductor layer 27 which contacts the electrolysis solution 14 and includes semiconductor particles and dye molecules; a catalyst layer 19 arranged on the second porous semiconductor layer 27; a second electrode 18 arranged on the catalyst layer 19; a second substrate 22 arranged on the second electrode 18; and a seal material 16 arranged between the first substrate 20 and the second substrate 22, for sealing the electrolysis solution 14.

Description

  The present invention relates to a dye-sensitized solar cell (DSC), a method for manufacturing the same, and an electronic device, and more particularly, to a dye-sensitized solar cell rich in color, a method for manufacturing the same, and an electronic device.

  In recent years, DSC has attracted attention as an inexpensive and high-performance solar cell. DSC was developed by Grezell of Lausanne University of Technology in Switzerland, and has the advantages of high photoelectric conversion efficiency and low manufacturing cost by using titanium oxide carrying a sensitizing dye on the surface. It is expected as a solar cell of the next generation. This solar cell is also called a wet solar cell because an electrolyte is sealed inside.

  DSC is a glass substrate on which transparent electrodes such as ITO and FTO are formed. A titanium oxide having a thickness of several tens of μm on which a dye such as a red die (N719) or a black die (N749) is adsorbed, and an organic solvent such as acetonitrile. In addition, an electrolyte solution in which an electrolyte such as iodine is added to a glass substrate on which a transparent electrode such as ITO or FTO is formed is sandwiched between substrates obtained by stacking Pt.

  And in order to hold | maintain and protect the titanium oxide and electrolyte solution which adsorb | sucked the pigment | dye, the edge part of two board | substrates which opposes is covered and sealed with resin (for example, refer patent document 1). .

JP 2010-277722 A

  By the way, the dye-sensitized solar cell can be applied not only to a power source of various electronic devices such as a mobile phone, but also to a power generation element used for a building material such as a wall of a building or rain protection. Since such an electronic device has many opportunities for the user to see, development of a dye-sensitized solar cell rich in color is desired.

  An object of the present invention is to provide a dye-sensitized solar cell rich in color, a method for producing the same, and an electronic apparatus.

  According to one aspect of the present invention for achieving the above object, a first substrate, a first electrode disposed on the first substrate, a semiconductor fine particle and a dye molecule disposed on the first electrode, A first porous semiconductor layer comprising: an electrolyte solution in contact with the first porous semiconductor layer; a redox electrolyte dissolved in a solvent; and a second porous semiconductor layer comprising the semiconductor fine particles and dye molecules in contact with the electrolyte solution. A catalyst layer disposed on the second porous semiconductor layer, a second electrode disposed on the catalyst layer, a second substrate disposed on the second electrode, and the first substrate, Provided is a dye-sensitized solar cell that is disposed between the second substrate and a sealing material that seals the electrolytic solution.

  According to another aspect of the present invention, a step of forming a first electrode on a first substrate, a step of forming a first porous semiconductor layer having semiconductor fine particles on the first electrode, and the first porous A step of immersing the porous semiconductor layer in a dye solution to adsorb the dye molecules, a step of forming a second electrode on the second substrate, a step of forming a catalyst layer on the second electrode, and the catalyst layer Forming a second porous semiconductor layer having semiconductor fine particles on the substrate, immersing the second porous semiconductor layer in a dye solution to adsorb dye molecules, and the first substrate and the second substrate. Provided is a method for producing a dye-sensitized solar cell, which includes a step of facing each other and bonding using a sealing material, and a step of encapsulating an electrolyte in the DSC cell from the opening and sealing the opening. .

  According to another aspect of the present invention, an electronic apparatus equipped with the dye-sensitized solar cell is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the dye-sensitized solar cell rich in color, its manufacturing method, and an electronic device can be provided.

It is a figure which shows 1 process of the manufacturing method of DSC which concerns on a comparative example, Comprising: (a) Dye DyeA, (b) Dye DyeB, (c) Dye solution 15A, (d) Dye solution 15B, (e) Mixed dye solution 15A + 15B. The typical cross-section figure of DSC which concerns on embodiment. It is a manufacturing method of DSC concerning an embodiment, and (a) process drawing which forms the 1st electrode on the 1st substrate, (b) process drawing which forms the 1st porous semiconductor layer on the 1st electrode, (C) Process drawing which makes a pigment | dye adsorb | suck to a 1st porous semiconductor layer. It is a manufacturing method of DSC which concerns on embodiment, Comprising: (a) Process drawing which forms a 2nd electrode on a 2nd board | substrate, (b) Process drawing which forms a catalyst layer on a 2nd electrode, (c) Catalyst The process figure which forms a 2nd porous semiconductor layer on a layer, (d) The process figure which makes a 2nd porous semiconductor layer adsorb | suck a pigment | dye. It is a manufacturing method of DSC which concerns on embodiment, Comprising: Process drawing after enclosing electrolyte solution inside DSC cell from an opening part. 2 is a chemical structural formula showing a dye used in the DSC according to the embodiment, (a) a chemical structural formula showing an indoleine dye (D149), (b) a chemical structural formula showing N719, and (c) showing a D131. Chemical structural formula. The chemical structural formula which shows another pigment | dye used for DSC which concerns on embodiment, Comprising: (a) Chemical structural formula of D205 which exhibits red, (b) Chemical structural formula which shows the porphyrin pigment which exhibits green. It is a schematic plane pattern block diagram which shows the example of arrangement | positioning of the color in DSC which concerns on embodiment, (a) The figure which shows the state which formed the 2nd porous semiconductor layer in the L-shaped area | region on the 2nd board | substrate, (B) The figure which shows the state which formed the 1st porous semiconductor layer in the reverse L-shaped area | region on the 1st board | substrate, (c) The figure which shows the state which bonded the 1st board | substrate and the 2nd board | substrate. It is a typical plane pattern block diagram which shows the example of another color arrangement | positioning in DSC which concerns on embodiment, (a) The example of color arrangement | positioning in a rectangular sealing pattern, (b) The color in a flower-shaped sealing pattern An arrangement example, (c) an arrangement example of colors in a circular sealing pattern, and (d) an arrangement example of colors in a butterfly-shaped sealing pattern. The typical plane pattern block diagram which shows the example of arrangement | positioning of another color in DSC which concerns on embodiment. The typical plane pattern block diagram of DSC which concerns on embodiment. FIG. 12 is a schematic cross-sectional structure diagram taken along line II in FIG. 11. FIG. 12 is a schematic cross-sectional structure diagram taken along line II-II in FIG. 11. FIG. 13 is a schematic cross-sectional structure diagram taken along line III-III in FIG. 11. The typical plane pattern block diagram of DSC which concerns on embodiment. FIG. 16 is a schematic sectional view taken along line IV-IV in FIG. 15. The typical cross-section figure which follows the VV line of FIG. FIG. 16 is a schematic sectional view taken along line VI-VI in FIG. 15. FIG. 16 is an enlarged schematic plane pattern configuration diagram of a portion A in FIG. 15. The typical structure figure of the semiconductor fine particle of the 1st porous semiconductor layer of DSC which concerns on embodiment, and a 2nd porous semiconductor layer. Explanatory drawing of the principle of operation of the DSC according to the embodiment. The operation principle explanatory drawing based on the charge exchange reaction in the electrolyte solution of DSC which concerns on embodiment. In DSC which concerns on embodiment, the energy potential diagram between a 1st porous semiconductor layer (13) / dye molecule | numerator (32) / electrolyte solution (14). In DSC which concerns on embodiment, it is an energy potential diagram between a dye molecule (32) / electrolyte solution (14), Comprising: The enlarged view of J part of FIG. Explanatory drawing which shows the energy level and electric power generation cycle of each component material of DSC which concern on embodiment. (A) In DSC which concerns on embodiment, the schematic cross-section figure which has arrange | positioned four basic cells in series structure, (b) The typical circuit expression of Fig.26 (a). (A) In DSC which concerns on embodiment, the schematic cross-section figure which has arrange | positioned four basic cells in parallel structure, (b) The schematic circuit representation of Fig.27 (a). It is a DSC manufacturing method according to the embodiment, (a) a process diagram for pre-processing the second substrate, (b) a process diagram for forming the second electrode on the second substrate, (c) on the second electrode (D) Step diagram of forming a second porous semiconductor layer on the catalyst layer and then immersing a dye in the second porous semiconductor layer, (e) After pretreatment of the first substrate (A) A process diagram for forming a first electrode on a first substrate, (f) a process diagram for immersing a dye in the first porous semiconductor layer after forming a first porous semiconductor layer on the first electrode, (g) FIG. 28D shows a step where the second substrate after the step of FIG. 28D and the first substrate after the step of FIG. 28F are opposed to each other, and are bonded using a sealing material. Process drawing which encloses electrolyte solution, seals an opening, and forms a DSC cell. The typical plane pattern block diagram which shows the example of arrangement | positioning in the board | substrate of the sample (test cell) of DSC which concerns on embodiment, and a cut line. The typical plane pattern block diagram which shows another example of arrangement | positioning in the board | substrate of the sample (test cell) of DSC which concerns on embodiment, and a cut line. The typical plane pattern block diagram which shows another example of arrangement | positioning in the board | substrate of the sample (test cell) of DSC which concerns on embodiment, and a cut line. The top view which is 1 process of the manufacturing method of DSC which concerns on embodiment, Comprising: The state in which the some internal 1st electrode was formed on the 1st board | substrate. The top view which is 1 process of the manufacturing method of DSC which concerns on embodiment, Comprising: The several internal 2nd electrode was formed on the 2nd board | substrate. The top view which is 1 process of the manufacturing method of DSC which concerns on embodiment, and shows the state which bonded together the 1st board | substrate and the 2nd board | substrate through the sealing material. FIG. 35 is a schematic cross-sectional structure diagram taken along the line VII-VII in FIG. 34, which is a process of the DSC manufacturing method according to the embodiment. The top view which shows 1 step of the manufacturing method of DSC which concerns on embodiment, Comprising: The state which formed the scribe line of the horizontal direction. The top view which is 1 process of the manufacturing method of DSC which concerns on embodiment, and shows the state which formed the scribe line of the vertical direction further. (A) The top view which shows the structure which formed three cells of DSC which concern on embodiment, (b) The explanatory view which shows the state which connected the three cells in series. (A) Schematic diagram showing a state in which five DSC cells according to the embodiment are connected in series, (b) an explanatory diagram of FIG. 39 (a), (c) a plane showing an example of the configuration of FIG. 39 (a) Figure. (A) The schematic diagram which shows the state which laminated | stacked the cell of n of DSC which concerns on embodiment, and the tandem structure, (b) Explanatory drawing of Fig.40 (a). (A) The schematic diagram which shows the state which connected the thing which laminated | stacked the cell of n DSC which concerns on embodiment, and the tandem structure in parallel, (b) Explanatory drawing of Fig.41 (a). The graph which shows the wavelength of the light rays L1, L2, and L3. The top view which shows the structural example of the remote control device carrying DSC which concerns on embodiment. The side view of the remote control device carrying DSC which concerns on embodiment. The side view which shows the other structural example of the remote control device carrying DSC which concerns on embodiment. The bird's-eye view which shows the structural example of the desktop digital timepiece carrying DSC which concerns on embodiment. (A) Bird's-eye view which shows the state which opened the electronic notebook which mounts DSC which concerns on embodiment, (b) The bird's-eye view which shows the closed state. The bird's-eye view which shows the state which opened the electronic dictionary carrying DSC which concerns on embodiment. The typical block block diagram of the DSC drive sensor module carrying DSC which concerns on embodiment. The typical block block diagram of another DSC drive sensor module carrying DSC which concerns on embodiment. The structural example of the home energy management system (HEMS: Home Energy Management System) to which the DSC drive sensor module carrying the DSC according to the embodiment is applied.

  Next, embodiments will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention include the material, shape, structure, The layout is not specified as follows. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

  In the DSC according to the following embodiment, “transparent” is defined as a transmittance of about 50% or more. In addition, “transparent” is also used to mean colorless and transparent to visible light in the DSC according to the embodiment. Visible light corresponds to a wavelength of about 360 nm to 830 nm and an energy of about 3.45 eV to 1.49 eV, and is transparent if the transmittance is 50% or more in this region.

[Embodiment]
The color of DSC is specific to the dye used. Therefore, there are two possible methods for producing a DSC having a new color: (1) a method for developing and synthesizing a new dye, and (2) a method for adsorbing two types of existing dyes to a semiconductor electrode. .

  Among these, according to the production method (1), it is not easy to design a molecule of a dye that exhibits the ability as a solar cell. However, there is a possibility that a desired color can be obtained due to the high degree of freedom in organic molecule design.

  On the other hand, the production method (2) is inferior to the production method (1) in the degree of color freedom, but does not require complicated molecular design. Moreover, it is excellent in that a power generation capacity equivalent to that of the existing dye used may be obtained.

(Comparative example)
One step of the DSC manufacturing method according to the comparative example is expressed as shown in FIG. The DSC manufacturing method according to this comparative example corresponds to the manufacturing method of (2) described above, and is a method of adsorbing two types of existing dyes to a semiconductor electrode. According to such a manufacturing method, as will be described below, the dye is sequentially adsorbed by two kinds of dye solutions, or the dye is adsorbed by a dye solution in which two kinds of dyes are mixed.

  That is, when two types of dye solutions are sequentially adsorbed, the blue dye DyeA shown in FIG. 1 (a) is mixed with an organic solvent to prepare a blue dye solution 15A shown in FIG. 1 (c). To do. Also, a yellow dye solution 15B shown in FIG. 1 (d) is prepared by mixing the yellow dye DyeB shown in FIG. 1 (b) with an organic solvent. Next, a substrate having a porous semiconductor layer (hereinafter simply referred to as “substrate”) is immersed in the blue dye solution 15A shown in FIG. 1C to adsorb the blue dye DyeA. Thereafter, the substrate is pulled up from the blue dye solution 15A, and the substrate is immersed in the yellow dye solution 15B shown in FIG. 1 (d) to adsorb the yellow dye DyeB. According to such a manufacturing method, the yellow dye DyeB that immerses the substrate later may be contaminated by the blue dye DyeA that previously immerses the substrate, and the time required for the dye adsorption step increases.

  On the other hand, when adsorbing with a dye solution in which two kinds of dyes are mixed, the blue dye DyeA shown in FIG. 1 (a) and the yellow dye DyeB shown in FIG. 1 (b) are mixed in an organic solvent. Then, a green mixed dye solution 15A + 15B shown in FIG. 1 (e) is prepared. Next, the substrate is immersed in the mixed dye solution 15A + 15B to adsorb the blue dye DyeA and the yellow dye DyeB. According to such a production method, it is difficult to individually control the adsorption amounts of both dyes, and there is a possibility that the color may change every time the production is performed.

(DSC)
As shown in FIG. 2, the schematic cross-sectional structure of the DSC 200 according to the embodiment includes a first substrate (working electrode side) 20, a first electrode 10 disposed on the first substrate 20, and a first electrode 10. A first porous semiconductor layer 13 comprising semiconductor fine particles and pigment molecules, an electrolyte solution 14 in which a redox electrolyte is dissolved in a solvent, and an electrolyte solution 14. A second porous semiconductor layer 27 comprising semiconductor fine particles and dye molecules; a catalyst layer 19 disposed on the second porous semiconductor layer 27; a second electrode 18 disposed on the catalyst layer 19; and a second electrode. 18 includes a second substrate (counter electrode side) 22 disposed on 18, and a sealing material 16 disposed between the first substrate 20 and the second substrate 22 and sealing the electrolytic solution 14. In the following description, reference numeral 12 is used for the first porous semiconductor layer before the dye Dye1 is adsorbed, and reference numeral 13 is used for the first porous semiconductor layer after the dye Dye1 is adsorbed. Further, reference numeral 26 is used for the second porous semiconductor layer before the dye Dye2 is adsorbed, and reference numeral 27 is used for the second porous semiconductor layer after the dye Dye2 is adsorbed.

Here, the first porous semiconductor layer 12 and the second porous semiconductor layer 26 is, for _{example, TiO 2, ZnO, WO 3} , InO 3, ZrO 2, TaO 2, NbO 5, Nb 2 O 3, SnO 2 , etc. The oxide semiconductor can be used. In particular, TiO ₂ (anatase type, rutile type) which is inexpensive from the viewpoint of efficiency is mainly used. The first porous semiconductor layer 12 and the second porous semiconductor layer 26 can be formed using, for example, screen printing technology, spin coating technology, dipping, spray coating technology, or the like.

  Also, different types of dyes Dye1 and Dye2 can be adsorbed to the first porous semiconductor layer 12 and the second porous semiconductor layer 26, respectively. For example, the dye adsorbed on one of the first porous semiconductor layer 12 and the second porous semiconductor layer 26 may be D131 (yellow), and the dye adsorbed on the other may be SQ2 (blue). Alternatively, the dye adsorbed on one of the first porous semiconductor layer 12 and the second porous semiconductor layer 26 may be D205 (red), and the dye adsorbed on the other may be SQ2 (blue).

  Of course, the dyes adsorbed by the first porous semiconductor layer 12 and the second porous semiconductor layer 26 may be interchanged. However, the dye Dye1 adsorbed on the first porous semiconductor layer 12 is desirably a dye having higher power generation characteristics than the dye Dye2 adsorbed on the second porous semiconductor layer 26.

  Further, in the first porous semiconductor layer 12 or the second porous semiconductor layer 26 in one DSC cell, different types of dyes may be adsorbed in a specific region and another specific region. Alternatively, in the first porous semiconductor layer 12 or the second porous semiconductor layer 26 in one DSC cell, the film thickness may be different between a specific region and another specific region.

  As the dyes Dye1 and Dye2, red dye (N719), black dye (N749), D131, D205, SQ2, phthalocyanine dye, porphyrin dye, and the like can be applied.

  The first substrate 20 or the second substrate 22 can be formed of, for example, a glass substrate, a plastic substrate, a glass substrate with a transparent electrode having a transparent electrode formed on the entire surface, a plastic substrate, or the like. In order to irradiate light, it is desirable that the first substrate 20 and the second substrate 22 are transparent to the irradiation light (white light). An antireflection film or the like may be coated on the light incident side of the first substrate 20 and the second substrate 22.

The first electrode 10 and second electrode 18, for example, ITO, FTO, ZnO, is formed of a transparent electrode such as SnO _2. Electrodes may be processed on the first substrate 10 and the second electrode 18 to form a substrate with FTO, a substrate with a grid such as metal, or the composite substrate described above.

  Further, the catalyst layer 19 may be made of, for example, Pt, carbon, or a conductive polymer. The conductive polymer may be made of, for example, PEDOT: PSS.

  Further, as the electrolytic solution 14, γ-butyrolactone, propylene carbonate, ethylene carbonate, propylene carbonate, or the like can be used. In some cases, acetonitrile, methoxyacetonitrile, propionitrile, or the like may be used.

(Production method)
The manufacturing method of DSC 200 according to the embodiment is expressed as shown in FIGS. As shown in FIGS. 3 to 5, the manufacturing method of the DSC 200 according to the embodiment includes a step of forming the first electrode 10 on the first substrate 20 and a first porous body having semiconductor fine particles on the first electrode 10. Forming the porous semiconductor layer 12, immersing the first porous semiconductor layer 12 in the dye solution 15A to adsorb the dye molecules (dye Dye1), and forming the second electrode 18 on the second substrate 22. A step of forming a catalyst layer 19 on the second electrode 18, a step of forming a second porous semiconductor layer 26 having semiconductor fine particles on the catalyst layer 19, and a step of forming the second porous semiconductor layer 26 into a dye solution. The step of adsorbing the dye molecules (dye Dye2) by immersing in 15B, the step of adhering the first substrate 20 and the second substrate 22 together using the sealing material 16, and the inside of the DSC cell from the opening Enclose electrolyte 14 in And a step of sealing the opening. The step of adsorbing the dye Dye1 on the first porous semiconductor layer 12 and the step of adsorbing the dye Dye2 on the second porous semiconductor layer 26 may be performed simultaneously. Hereinafter, such a manufacturing method will be described in more detail with reference to the drawings.

First, as shown in FIG. 3A, the first electrode 10 is pattern-formed on the first substrate 20. The first substrate 20 can be composed of a glass substrate, a flexible plastic substrate, or the like, and a glass substrate with a transparent electrode with a transparent electrode formed on the entire surface or a flexible plastic substrate can also be used. The first electrode 10 can be formed by subjecting an ITO fine particle-containing film applied by screen printing to air sintering and heat treatment in an N ₂ atmosphere, and can be a glass substrate with a transparent electrode or a flexible plastic substrate. For example, the pattern can be formed by various etching methods.

  Next, as shown in FIG. 3B, a first porous semiconductor layer 12 is formed on the first electrode 10 after the step of FIG. The first porous semiconductor layer 12 can be formed by applying screen printing or the like.

  Next, as shown in FIG. 3C, a dye solution 15A in which the dye Dye1 is mixed with an organic solvent is accommodated in a container 23A. For example, D131 (yellow) can be used as the dye Dye1. The first porous semiconductor layer 12 after the step of FIG. 3B is immersed in such a dye solution 15A, and the dye Dye1 is adsorbed to the first porous semiconductor layer 12.

On the other hand, as shown in FIG. 4A, the second electrode 18 is patterned on the second substrate 22. Similar to the first substrate 20, the second substrate 22 can be composed of a glass substrate, a flexible plastic substrate, or the like. Similar to the first electrode 10, the second electrode 18 can be formed by subjecting an ITO fine particle-containing film applied by screen printing to air sintering and heat treatment in an N ₂ atmosphere.

  Next, as shown in FIG. 4B, a catalyst layer 19 is formed on the second electrode 18 after the step of FIG. The catalyst layer 19 can be formed by screen printing or the like.

  Next, as shown in FIG. 4C, the second porous semiconductor layer 26 is formed on the catalyst layer 19 after the step of FIG. The second porous semiconductor layer 26 can be formed by applying screen printing or the like.

  Next, as shown in FIG. 4D, a dye solution 15B in which the dye Dye2 is mixed with an organic solvent is accommodated in a container 23B. For example, SQ2 (blue) can be used as the dye Dye2. The second porous semiconductor layer 26 after the step of FIG. 4C is immersed in such a dye solution 15B, and the dye Dye2 is adsorbed to the second porous semiconductor layer 26.

  Thereafter, the first substrate 20 and the second substrate 22 are pulled up from the dye solutions 15 </ b> A and 15 </ b> B so as to face each other and are bonded together using the sealing material 16. Then, the electrolytic solution 14 is sealed inside the DSC cell from the opening, and the opening is sealed. Thereby, as shown in FIG. 5, when photons (hν) are irradiated from the outside, a new color can be expressed by a combination of two kinds of dyes Dye1 and Dye2. Here, since it is assumed that the dye Dye1 is D131 (yellow) and the dye Dye2 is SQ2 (blue), it is possible to manufacture the green DSC 200 using these two dyes.

  Here, D131 (yellow) is adsorbed on the first porous semiconductor layer 12 and SQ2 (blue) is adsorbed on the second porous semiconductor layer 26. However, there are various combinations of the dyes Dye1 and Dye2, and they are changed as appropriate. be able to. For example, D205 (red) may be adsorbed on the first porous semiconductor layer 12, and SQ2 (blue) may be adsorbed on the second porous semiconductor layer 26. In this case, the purple DSC 200 can be manufactured by a combination of D205 (red) and SQ2 (blue).

  The dye Dye1 adsorbed on the first porous semiconductor layer 12 is preferably a dye having higher power generation characteristics than the dye Dye2 adsorbed on the second porous semiconductor layer 26. That is, even if the dyes adsorbed by the first porous semiconductor layer 12 and the second porous semiconductor layer 26 are exchanged, the color expressed as the combination does not change. However, since the dye that contributes to power generation is the dye adsorbed on the first electrode 10 that is the working electrode, if a dye having higher power generation characteristics is adsorbed to the first porous semiconductor layer 12, the power generation efficiency is further improved. A good DSC 200 can be manufactured.

(Dye)
6 is a chemical structural formula showing the dye used in the DSC according to the embodiment, and the chemical structural formula showing the Indoline dye (D149) is expressed as shown in FIG. Is represented as shown in FIG. 6 (b), and the chemical structural formula showing D131 is represented as shown in FIG. 6 (c).

  7 is a chemical structural formula showing another dye used in the DSC 200 according to the embodiment, and the chemical structural formula of D205 showing a red color is expressed as shown in FIG. The chemical structural formula shown is represented as shown in FIG. Further, phthalocyanine dyes are known as general blue dyes. Of course, the dyes Dye1 and Dye2 used in the DSC 200 according to the embodiment are not limited to these, and various dyes Dye1 and Dye2 can be appropriately selected.

(Color arrangement example)
A schematic planar pattern configuration showing an example of color arrangement in the DSC 200 according to the embodiment is expressed as shown in FIG. As shown in FIG. 8A, in the L-shaped region on the second substrate 22, the second porous semiconductor layer 27 that adsorbs the B (blue) dye Dye2 may be formed. Further, as shown in FIG. 8B, in the inverted L-shaped region on the first substrate 20, the first porous semiconductor layer 13 in which the Y (yellow) dye Dye1 is adsorbed may be formed. When the first substrate 20 and the second substrate 22 are bonded to each other, as shown in FIG. 8C, G (green), and an overlapping region where the L-shaped region and the inverted L-shaped region overlap each other, B (blue) can be arranged in the L-shaped region excluding the overlapping region, and Y (yellow) can be arranged in the inverted L-shaped region excluding the overlapping region.

  Further, as shown in FIG. 8A, the red (R) dye Dye2 is adsorbed to a region other than the L-shaped region on the second substrate 22, and as shown in FIG. The R (red) dye Dye1 may also be adsorbed to regions other than the inverted L-shaped region on the substrate 20. In this case, as shown in FIG. 8C, when the first substrate 20 and the second substrate 22 are bonded together, R (red) is formed in the central region surrounded by the L-shaped region and the inverted L-shaped region. ) Can be arranged.

  In this way, when different types of dyes are adsorbed in a specific region and another specific region in the first porous semiconductor layer 12 or the second porous semiconductor layer 26 in one DSC cell, one DSC A plurality of colors can be expressed in the cell.

Alternatively, in the first porous semiconductor layer 12 or the second porous semiconductor layer 26 in one DSC cell, the film thickness may be different between a specific region and another specific region. That is, the first porous semiconductor layer 12 and the second porous semiconductor layer 26 can be formed by screen printing titanium oxide (TiO ₂ ) or the like. Therefore, if the number of screen printings is made different between a specific region and another specific region, the film thickness of titanium oxide can be made different between the specific region and the other specific region. For example, when the dye Dye1 of Y (yellow) is adsorbed to the first porous semiconductor layer 12, the yellow color becomes closer to orange as the film thickness increases. As described above, if the pigment is adsorbed by changing the film thickness, the degree of color can be changed between a specific region and another specific region.

  A schematic planar pattern configuration showing another color arrangement example in the DSC 200 according to the embodiment is expressed as shown in FIG. That is, in an actual application, there may be a complicated sealing pattern in which the sealing material 16 intersects. In such a case, if a different dye Dye is adsorbed for each cell region partitioned by the sealing material 16, a different color can be arranged for each cell region.

  For example, FIG. 9A shows a color arrangement example in a rectangular sealing pattern. As shown in FIG. 9A, the interior of the rectangular sealing pattern may be further divided into five cell regions by the sealing material 16, and different colors may be arranged in the respective cell regions.

  FIG. 9B shows an example of color arrangement in the flower-shaped sealing pattern. As shown in FIG. 9B, the shape of five petals and stems may be formed by the sealing material 16, and different colors may be arranged in the respective cell regions.

  FIG. 9C shows an example of color arrangement in a circular sealing pattern. As shown in FIG. 9C, four circles having different sizes may be formed by the sealing material 16, and different colors may be arranged in the respective cell regions.

  FIG. 9D shows an example of color arrangement in a butterfly-shaped sealing pattern. As shown in FIG. 9D, a butterfly shape composed of two wings and a body may be formed by the sealing material 16, and different colors may be arranged in the respective cell regions.

  A schematic planar pattern configuration showing still another color arrangement example in the DSC 200 according to the embodiment is expressed as shown in FIG. As shown in FIG. 10, a sealing pattern in which five rings 30 </ b> A to 30 </ b> E are connected is formed by connecting a circular sealing material 16 to another circular sealing material 16. The first porous semiconductor layer 13 (second porous semiconductor layer 27) is disposed in each cell region partitioned by the five rings 30A to 30E. If different dyes Dye1 (Dye2) are adsorbed for each cell region, different colors can be arranged for each cell region.

  The formation method of the complicated sealing pattern which has such an intersection part is not specifically limited. For example, the first substrate 20 and the second substrate 22 may be bonded together by baking the sealing material 16. In this way, heat accumulation does not occur at the intersection of the sealing material 16, and it is possible to cope with a sealing pattern with a narrow pitch.

  As described above, in the embodiment, since the different types of dyes Dye1 and Dye2 are adsorbed to the first porous semiconductor layer 12 and the second porous semiconductor layer 26, the color-rich DSC 200 is obtained. Can be manufactured. Specifically, the oxide semiconductor electrodes are provided on both the working electrode and the counter electrode, and different types of dyes Dye1 and Dye2 are adsorbed to each of the two oxide semiconductor electrodes. A new color can be expressed by combining Dye2.

  In the comparative example, two types of dye solutions 15A and 15B are sequentially adsorbed with the dye. However, in this method, the dye solutions 15A and 15B may be contaminated with each other, and the time required for the dye adsorption process is increased. become longer. On the other hand, according to this embodiment, since the working electrode and the counter electrode are immersed in the separate dye solutions 15A and 15B, there is no problem that the dye solutions 15A and 15B are contaminated with each other. In addition, since the step of adsorbing the dye Dye1 to the working electrode and the step of adsorbing the dye Dye2 to the counter electrode can be performed simultaneously, the time required for the dye adsorption step can be shortened.

  In the present embodiment, since the two types of dye solutions 15A and 15B are independent, it is easy to manage the additive concentration (co-adsorbent etc.) and the dye concentration of the dye solutions 15A and 15B. It is. Therefore, the problem that the color changes every time the product is manufactured is less likely to occur.

  Furthermore, in this embodiment, since a plurality of colors can be expressed in one DSC cell, it is possible to manufacture a DSC 200 that is rich in design. Such a DSC 200 is particularly effective when applied to an electronic device (for example, a power generation element used for a building material such as a building wall or a rain cover) that is frequently exposed to the user's eyes.

  Here, different types of dyes Dye1 and Dye2 are adsorbed to the first porous semiconductor layer 12 and the second porous semiconductor layer 26, respectively, but the present embodiment is not limited to this. Absent. That is, it goes without saying that the same dyes Dye1 and Dye2 may be adsorbed to the first porous semiconductor layer 12 and the second porous semiconductor layer 26, respectively.

〔Concrete example〕
Hereinafter, a specific example of the DSC 200 according to the embodiment will be described in detail. Of course, also in the DSC 200 exemplified below, the dyes Dye1 and Dye2 can be adsorbed to the first porous semiconductor layer 12 and the second porous semiconductor layer 26, respectively.

(Specific example 1 of DSC)
A schematic planar pattern configuration of the DSC 200 according to the embodiment is expressed as shown in FIG. 11, and a schematic cross-sectional structure taken along line II in FIG. 11 is expressed as shown in FIG. A schematic cross-sectional structure taken along line II-II is represented as shown in FIG. 13, and a schematic cross-sectional structure taken along line III-III in FIG. 11 is represented as shown in FIG.

  As shown in FIGS. 11 to 14, the DSC 200 according to the embodiment includes a first substrate 20, a first electrode 10 disposed on the first substrate 20, a semiconductor fine particle disposed on the first electrode 10. And a first porous semiconductor layer 13 having a dye molecule, an electrolyte solution 14 in contact with the first porous semiconductor layer 13 and having a redox electrolyte dissolved in a solvent, and a second electrode (counter electrode) 18 in contact with the electrolyte solution 14 The second substrate 22 disposed on the second electrode 18, the catalyst layer 19 disposed on the surface of the second electrode 18 in contact with the electrolytic solution 14, and the surface of the catalyst layer 19 in contact with the electrolytic solution 14 A second porous semiconductor layer 27 disposed between the first electrode 10 and the second electrode 18, and a sealing material 16 that seals the electrolytic solution 14.

  In the DSC 200 according to the embodiment, the sealing material 16 is in contact with the first electrode 10 and the second electrode 18 as shown in FIGS. Reference numerals 3 a and 3 b denote sealing materials 3 a and 3 b for the opening for injecting the electrolytic solution 14.

(Specific example 2 of DSC)
A schematic plane pattern configuration of the DSC 200 according to the embodiment is expressed as shown in FIG. 15, and a schematic cross-sectional structure taken along line IV-IV in FIG. 15 is expressed as shown in FIG. A schematic cross-sectional structure along the line VV is represented as shown in FIG. 17, and a schematic cross-sectional structure along the line VI-VI in FIG. 15 is represented as shown in FIG. An enlarged schematic planar pattern configuration is expressed as shown in FIG.

  As shown in FIGS. 15 to 19, the DSC 200 according to the embodiment is disposed on the first substrate 20, the internal first electrode 10 </ b> A disposed on the first substrate 20, and the internal first electrode 10 </ b> A. The first porous semiconductor layer 13, the electrolytic solution 14 in contact with the first porous semiconductor layer 13, the redox electrolyte dissolved in the solvent, the internal second electrode (counter electrode) 18 A in contact with the electrolytic solution 14, and the internal second The second substrate 22 disposed on the electrode 18A, the catalyst layer 19 disposed on the surface of the internal second electrode 18A in contact with the electrolytic solution 14, and the surface of the catalyst layer 19 disposed in contact with the electrolytic solution 14 A second porous semiconductor layer 27 and a sealing material 16 that is disposed between the first substrate 20 and the second substrate 22 and seals the electrolytic solution 14.

  In addition, as shown in FIGS. 15 to 19, the DSC 200 according to the embodiment includes an external first electrode 10 </ b> B disposed on the first substrate 20 outside the sealing material 16, and an outside of the sealing material 16. An external second electrode 18B disposed on the second substrate 22 may be provided.

  15 to 19, the DSC 200 according to the embodiment injects the electrolytic solution 14 into the cell region sandwiched between the first substrate 20 and the second substrate 22 and surrounded by the sealing material 16. The internal first electrode 10A and the external first electrode 10B may be patterned on the first substrate 20 and connected to each other at the opening.

  The internal second electrode 18A and the external second electrode 18B may be patterned on the second substrate 22 and connected to each other at the opening.

  Moreover, you may provide the opening part sealing material 3b which seals an opening part, and the cap sealing material 3a which is arrange | positioned at an opening part and couple | bonds the sealing material 16 and the opening part sealing material 3b.

  In the DSC 200 according to the embodiment, the sealing material 16 is in contact with the first substrate 20 and the second substrate 22 as shown in FIGS.

  The inner first electrode 10A and the outer first electrode 10B are electrically connected in the vicinity of the opening for injecting the electrolyte solution 14, as shown in FIGS.

  As shown in FIGS. 15 and 17 to 19, the internal second electrode 18 </ b> A and the external second electrode 18 </ b> B are in the vicinity of the opening for injecting the electrolytic solution 14 and in the vicinity of the opening for injecting the electrolytic solution 14. Electrically connected.

  Further, as shown in FIGS. 15 to 19, the sealing material 16 is not in contact with the internal first electrode 10 </ b> A and the internal second electrode 18 </ b> A. On the other hand, as shown in FIGS. 15 to 19, the sealing material 16 is in contact with the external first electrode 10 </ b> B and the external second electrode 18 </ b> B in the vicinity of the opening for injecting the electrolytic solution 14.

  Further, as shown in FIGS. 15 and 17 to 19, the cap sealing material 3 a and the opening sealing material 3 b are connected to the first electrode 10 </ b> B and the second electrode 18 </ b> B in the opening for injecting the electrolyte solution 14. In contact.

  In the DSC 200 according to the embodiment, as shown in FIGS. 15 to 19, the surface of the internal second electrode 18 </ b> A may be provided with a catalyst layer 19 in contact with the electrolytic solution 14.

  The sealing material 16, the cap sealing material 3 a, and the opening sealing material 3 b can be configured by glass frit, ultraviolet curable resin, thermosetting resin, or a structural combination thereof.

  Ultraviolet light (UV) for curing the ultraviolet curable resin is an electromagnetic wave having a short wavelength in the range of 10 to 400 nm. Moreover, ultraviolet rays (UV) are UV-A (long wavelength ultraviolet rays: wavelength 315 to 400 nm), UV-B (medium wavelength ultraviolet rays: wavelength 280 to 315 nm), UV-C (short wavelength ultraviolet rays: wavelength around 10 nm to 280 nm) depending on the wavelength. ). As an ultraviolet (UV) irradiation source, a UV lamp (mercury lamp, metal halide lamp) or the like is used. Here, examples of the ultraviolet curable resin include epoxy acrylate, urethane acrylate, polyester acrylate, unsaturated polyester, polyether acrylate, vinyl acrylate, polybutadiene acrylate, and polystyrylethyl methacrylate. In addition, acrylic ultraviolet curable resin is more preferable in terms of electrolytic solution resistance and sealing properties.

A schematic structure of the semiconductor fine particles 2 of the first porous semiconductor layer 12 and the second porous semiconductor layer 26 of the DSC 200 according to the embodiment is expressed as shown in FIG. As shown in FIG. 20, in the first porous semiconductor layer 12 and the second porous semiconductor layer 26, semiconductor fine particles 2 made of TiO ₂ or the like are bonded to each other to form a complex network. The dye molecules 4 are adsorbed on the surface of the semiconductor fine particles 2. In the first porous semiconductor layer 12 and the second porous semiconductor layer 26, there are many pores having a size of about 100 nm or less.

(Operating principle)
The operation principle of the DSC 200 according to the embodiment is expressed as shown in FIG.

  When the following reactions (a) to (d) occur continuously, an electromotive force is generated, and a current is conducted to the load 24. In addition, since the pigment | dye which contributes to an electric power generation is the pigment | dye adsorb | sucked to the 1st porous semiconductor layer 13, it abbreviate | omits illustration about the 2nd porous semiconductor layer 27 for simplicity.

(A) The dye molecule 32 absorbs a photon (hν), emits an electron (e ⁻ ), and the dye molecule 32 becomes an oxidized DO.

(B) The reduced redox electrolyte 26 represented by Re diffuses in the first porous semiconductor layer 13 and approaches the oxidized dye molecule 32 represented by DO.

(C) Electrons (e ⁻ ) are supplied from the redox electrolyte 26 to the dye molecules 32. The redox electrolyte 26 becomes an oxidized redox electrolyte 28 represented by Ox, and the dye molecule 32 becomes a reduced dye molecule 30 represented by DR.

(D) The redox electrolyte 28 diffuses in the direction of the catalyst layer 19 and is supplied with electrons from the catalyst layer 19 to become a redox electrolyte 26 of a reductant represented by Re.

  The redox electrolyte 26 needs to approach the vicinity of the dye molecules 32 while diffusing in the complicated space in the first porous semiconductor layer 13.

  Further, the principle of operation based on the charge exchange reaction in the electrolyte solution 14 of the DSC 200 according to the embodiment is expressed as shown in FIG.

First, when light is irradiated from the outside, photons (hν) react with the dye molecules 32, and the dye molecules 32 transition from the ground state to the excited state. The excited electrons (e ⁻ ) generated at this time are injected into the conduction band of the first porous semiconductor layer 13 made of TiO ₂ . The electrons (e ⁻ ) conducted in the first porous semiconductor layer 13 conduct the load 24 of the external circuit from the first electrode 10A and move to the second electrode 18A. Electrons (e ⁻ ) injected from the second electrode 18 </ b> A into the electrolytic solution 14 are charge-exchanged with the iodine redox electrolyte (I ⁻ / I ₃ ⁻ ) in the electrolytic solution 14. The iodine redox electrolyte (I ⁻ / I ₃ ⁻ ) diffuses in the electrolytic solution 14 and reacts with the dye molecules 32 again. Here, the charge exchange reaction proceeds according to 3I ⁻ → I ₃ ⁻ + 2e ^{− on the} surface of the dye molecule, and proceeds according to I ₃ ⁻ + 2e ⁻ → 3I ^{− on} the second electrode 18A.

The electrolytic solution 14 uses, for example, acetonitrile as a solvent, and as an electrolyte in this case, for example, iodine exists as an iodine redox electrolyte I ₃ ⁻ in the electrolytic solution 14. Further, as an electrolyte, for example, an iodide salt (lithium iodide, potassium iodide, etc.) exists as an iodine redox electrolyte I ⁻ in the electrolytic solution 14. Further, an additive (for example, TBP: tertiary butyl pyridine) may be applied to the electrolytic solution 14 as a reverse electron transfer inhibiting solution.

  The electrolytic solution 14 can be constituted by dissolving the above solute and additive in a solvent (acetonitrile). In addition, said material is applicable to wet DSC etc., Comprising material differs, when normal temperature molten salt (ionic liquid) and a solid electrolyte are used.

  In the DSC 200 according to the embodiment, an energy potential diagram between the first porous semiconductor layer (13) / the dye molecule (32) / the electrolyte solution (14) is expressed as shown in FIG. Moreover, it is an energy potential diagram between dye molecule (32) / electrolyte solution (14), Comprising: The enlarged view of J part of FIG. 23 is represented as shown in FIG.

When irradiated with light from the outside, the dye molecule 32 changes from the ground state HOMO to the excited state LUMO by photons (hν). The excited electrons (e ⁻ ) generated at this time are injected into the conduction band of the first porous semiconductor layer 13 made of TiO ₂ . The electrons (e ⁻ ) conducted in the first porous semiconductor layer 13 conduct the load 24 of the external circuit from the first electrode 10A and move to the second electrode 18A. Electrons (e ⁻ ) injected from the catalyst layer 19 into the electrolytic solution 14 are exchanged with the redox electrolyte in the electrolytic solution 14. The redox electrolyte diffuses in the electrolytic solution 14 and reduces the dye molecules 32.

The potential difference between the redox level E _RO of the electrolytic solution 14 and the Fermi level E _{f of} the first porous semiconductor layer 13 is the maximum electromotive force V _MAX . The value of the maximum electromotive force V _MAX varies depending on the redox electrolyte of the electrolytic solution 14. In the case of a single redox electrolyte system (iodine redox electrolyte), for example, 0.9 V (I, N719). When the electrolytic solution 14 contains a mixed redox electrolyte of iodine and bromine, as shown in FIG. 24, the redox potential of the mixed redox electrolyte is adjusted by adjusting the mixing ratio to oxidize the iodine redox electrolyte. It can be adjusted to any value between the reduction potential and the redox potential of the bromine redox electrolyte.

The energy level and power generation cycle of each constituent material of the DSC 200 according to the embodiment are expressed as shown in FIG. In FIG. 25, when irradiated with light from the outside, electrons existing in the full band S ⁰ / S ⁺ of the dye (Dye) are excited by the conduction band S ^* by the photons (hν), and the first porous semiconductor layer Electrons are injected into 13 conduction bands E _C. Some of the electrons injected into the conduction band E _C are recombined and transition to the Dye full band S ⁰ / S ⁺ . The electrons (e ⁻ ) conducted in the first porous semiconductor layer 13 conduct the load 24 of the external circuit from the first electrode 10A and move to the second electrode 18A. Electrons (e ⁻ ) injected from the catalyst layer 19 into the electrolytic solution 14 are exchanged with the redox electrolyte in the electrolytic solution 14. The redox electrolyte diffuses in the electrolyte solution 14 and reduces the dye molecules 32 in the Dye full zone S ⁰ / S ⁺ by electron injection. The potential difference V _OC between the oxidation-reduction level E _RO of the electrolytic solution 14 and the Fermi level E _{f of} the first porous semiconductor layer 13 is the maximum electromotive force V _MAX .

-Series configuration-
In DSC 200 according to the embodiment, a schematic cross-sectional structure in which four basic cells are arranged in series is represented as shown in FIG. The schematic circuit representation of FIG. 26A is expressed as shown in FIG.

As shown in FIG. 26A, the basic cell includes a first substrate 20 and internal first electrodes 10 ₁ A, 10 ₂ A, 10 ₃ A, and 10 ₄ A arranged on the first substrate 20; First porous semiconductor layers 13 ₁ , 13 ₂ , 13 _3, and 13 ₄ disposed on the internal first electrodes 10 ₁ A, 10 ₂ A, 10 ₃ A, and 10 ₄ A, and the first porous semiconductor layer 13 Electrolytic solutions 14 ₁ , 14 ₂ , 14 ₃ , 14 _{4 in contact} with ₁ , 13 ₂ , 13 ₃ , 13 ₄ and redox electrolyte dissolved in a solvent, and electrolytic solutions 14 ₁ , 14 ₂ , 14 ₃ , 14 ₄ The inner second electrodes (counter electrodes) 18 ₁ A, 18 ₂ A, 18 ₃ A, 18 ₄ A in contact with the inner second electrodes 18 ₁ A, 18 ₂ A, 18 ₃ A, 18 ₄ A The catalyst disposed on the surface of the internal second electrodes 18 ₁ A, 18 ₂ A, 18 ₃ A, and 18 ₄ A in contact with the two substrates 22 and the electrolytic solutions 14 ₁ , 14 ₂ , 14 _3, and 14 ₄ The layers 19 ₁ , 19 ₂ , 19 _3, and 19 ₄ and the electrolyte solutions 14 ₁ , 14 ₂ , 14 _3, and 14 ₄ are disposed on the surfaces of the catalyst layers 19 ₁ , 19 ₂ , 19 _3, and 19 _4. The second porous semiconductor layers 27 ₁ , 27 ₂ , 27 _3, and 27 ₄ and the first substrate 20 and the second substrate 22 are arranged to seal the electrolytic solutions 14 ₁ , 14 ₂ , 14 _3, and 14 ₄ . And a sealing material 16.

In addition, as shown in FIG. 26A, the basic cell has external first electrodes 10 ₁ B, 10 ₂ B, 10 ₃ B, and 10 ₄ arranged on the first substrate 20 outside the sealing material 16. B and external second electrodes 18 ₁ B, 18 ₂ B, 18 ₃ B, and 18 ₄ B disposed on the second substrate 22 outside the sealing material 16 may be provided.

Furthermore, the external first electrode 10 ₂ B and the external second electrode 18 ₁ B are formed between the first substrate 20 and the second substrate 22 along the external side wall of the sealing material 16 as shown in FIG. Are connected through a connection electrode 13A. Similarly, the external first electrode 10 ₃ B / external second electrode 18 ₂ B and the external first electrode 10 ₄ B / external second electrode 18 ₃ B are also connected via the connection electrode 13A. As a result, as shown in FIG. 26 (b), the four basic cells are arranged in a series configuration.

In each basic cell shown in FIG. 26, electrolytes 14 ₁ , 14 ₂ , 14 ₃ , 14 are also placed in a cell region sandwiched between the first substrate 20 and the second substrate 22 and surrounded by the sealing material 16. ₄ with an opening for injecting ₄ and the internal first electrodes 10 ₁ A, 10 ₂ A, 10 ₃ A, 10 ₄ A and the external first electrodes 10 ₁ B, 10 ₂ B, 10 ₃ B, 10 ₄ B A pattern is formed on the first substrate 20 and connected to each other at the opening.

The internal second electrodes 18 ₁ A, 18 ₂ A, 18 ₃ A, 18 ₄ A and the external second electrodes 18 ₁ B, 18 ₂ B, 18 ₃ B, 18 ₄ B are patterned on the second substrate 22. And are connected to each other at the opening.

In each basic cell shown in FIG. 26, the electrolytes 14 ₁ , 14 ₂ , 14 ₃ , 14 ₄ are formed on the surfaces of the internal second electrodes 18 ₁ A, 18 ₂ A, 18 ₃ A, 18 ₄ A. in contact with the catalyst layer 19 _1, 19 _2, 19 _3, 19 ₄ may be provided with a. Other configurations are the same as those of the DSC 200 according to the embodiment shown in FIGS.

―Parallel configuration―
In DSC 200 according to the embodiment, a schematic cross-sectional structure in which four basic cells are arranged in a parallel configuration is represented as shown in FIG. The schematic circuit representation of FIG. 27A is expressed as shown in FIG.

The external first electrode 10 ₂ B and the external second electrode 18 ₁ B are disposed between the first substrate 20 and the second substrate 22 along the outer side wall of the sealing material 16 as shown in FIG. The insulating layer 13B is insulated. Similarly, the external first electrode 10 ₃ B / external second electrode 18 ₂ B and the external first electrode 10 ₄ B / external second electrode 18 ₃ B are also insulated through the insulating layer 13B. As a result, as shown in FIG. 27B, the four basic cells are arranged in a parallel configuration. Other configurations are the same as those of the DSC 200 according to the embodiment shown in FIGS.

(Production method)
The DSC manufacturing method according to the embodiment is expressed as shown in FIGS.

(A) First, as shown in FIG. 28A, the second substrate 22 is pretreated by a cleaning process. Here, the second substrate 22 can be composed of a glass substrate, a flexible plastic substrate, or the like, and a glass substrate with a transparent electrode having a transparent electrode formed on the entire surface or a flexible plastic substrate can also be used.

(B) Next, as shown in FIG. 28 (b), the internal second electrode 18 </ b> A is patterned on the second substrate 22. The external second electrode 18B is also formed on the second substrate 22 at the same time. Here, the internal second electrode 18A and the external second electrode 18B can be formed by subjecting an ITO fine particle-containing film to be applied by screen printing to air sintering and heat treatment in an N ₂ atmosphere, and glass with a transparent electrode. A substrate or a flexible plastic substrate can be patterned by various etching methods.

(C) Next, as shown in FIG. 28C, the catalyst layer 19 is formed on the internal second electrode 18A. The catalyst layer 19 can be formed by screen printing or the like.

(D) Next, as shown in FIG. 28 (d), after forming the second porous semiconductor layer 26 on the catalyst layer 19, the dye Dye2 is immersed in the second porous semiconductor layer 26. The second porous semiconductor layer 26 can be formed by applying screen printing or the like. In the steps so far, the processing step for the second substrate 22 is performed first with respect to the processing step for the first substrate 20, but the processing step for the first substrate 20 is performed for the second substrate 22. May be performed first.

(E) Next, as shown in FIG. 28E, after the pretreatment of the first substrate 20, the internal first electrode 10 </ b> A is patterned on the first substrate 20, as with the second substrate 22. The external first electrode 10B is also formed on the first substrate 20 at the same time. Here, the 1st board | substrate 20 can be comprised with a glass substrate or a flexible plastic substrate. Here, the internal first electrode 10A and the external first electrode 10B can be formed by subjecting an ITO fine particle-containing film applied by screen printing to air sintering and heat treatment in an N ₂ atmosphere.

(F) Next, as shown in FIG. 28 (f), after forming the first porous semiconductor layer 12 on the internal first electrode 10 </ b> A, the dye Dye <b> 1 is immersed in the first porous semiconductor layer 12. The first porous semiconductor layer 12 can be formed by applying screen printing or the like. In the steps so far, the processing step for the second substrate 22 is performed first with respect to the processing step for the first substrate 20, but the processing step for the first substrate 20 is performed for the second substrate 22. May be performed first.

(G) Next, as shown in FIG. 28 (g), the second substrate 22 after the step of FIG. 28 (d) and the first substrate 20 after the step of FIG. Bonding is performed using a stopper 16.

(H) Next, as shown in FIG. 28 (h), the electrolytic solution 14 is sealed inside the opening, the opening is sealed, and a DSC cell is formed.

(DSC test cell placement example and cut line)
DSC samples (test cells) 200 ₁₁ , 200 ₁₂ ,..., 200 _1n ,..., 200 _m1 , 200 _m2 ,..., 200 _mn in the first substrate 20 and cut lines SL1 and SL2 The schematic plane pattern configuration is expressed as shown in FIG. Further, another arrangement example in the substrate and a schematic plane pattern configuration of the cut line are expressed as shown in FIG. Further, another exemplary arrangement in the substrate and a schematic plane pattern configuration showing a cut line are expressed as shown in FIG.

  On the first substrate 20, the first porous semiconductor layer 13 and the external first electrode 10B disposed on the internal first electrode 10A are disposed in a matrix. Also on the second substrate 22 facing the first substrate 20, the catalyst layer 19 and the external second electrode 18B disposed on the internal second electrode 18A are disposed in a matrix (not shown). The pattern shape of the external first electrode 10B shown in FIG. 29 corresponds to the example shown in FIG.

  The pattern shape of the external first electrode 10B shown in FIGS. 30 and 31 is a modification of the pattern shape of the external first electrode 10B shown in FIG. After the manufacturing process shown in FIG. 28, a plurality of individual DSC cells can be simultaneously formed by cutting along the cut lines SL1 and SL2. Also, a plurality of serial configurations shown in FIG. 26 or a parallel configuration shown in FIG. 27 can be simultaneously formed.

  Even in the case of applying the pattern shape of the external first electrode 10B shown in FIGS. 30 and 31, after passing through the manufacturing process shown in FIG. A plurality of DSC cells can be formed simultaneously. Also, a plurality of serial configurations shown in FIG. 26 or a parallel configuration shown in FIG. 27 can be simultaneously formed.

(Manufacturing method of a plurality of DSCs)
In the DSC according to the embodiment, a method for manufacturing a plurality of DSC cells is a manufacturing method in which a plurality of (m × n: where m and n are integers) cells are formed and separated to obtain a plurality of DSCs 200. is there.

A process of manufacturing a DSC according to the embodiment, which includes a plurality of internal first electrodes 10 ₁₁ A, 10 ₁₂ A,..., 10 _1n A, ..., 10 _m1 A, 10 _m2 on the first substrate 20. A plan view showing a state in which A _···· 10 _mn A is formed is expressed as shown in FIG. Here, the external first electrodes 10 ₁₁ B, 10 ₁₂ B,..., 10 _1n B,..., 10 _m1 B, 10 _m2 B _,.

In the DSC manufacturing method according to the embodiment, a plurality of second electrodes 18 ₁₁ A, 18 ₁₂ A,..., 18 _1n A, ..., 18 _m1 A, 18 _m2 A are formed on the second substrate 22. ... 18 A plan view showing a state in which _mn A is formed is expressed as shown in FIG. Here, the external second electrodes 18 ₁₁ B, 18 ₁₂ B,..., 18 _1n B,..., 18 _m1 B, 18 _m2 B _,.

  The top view which is 1 process of the manufacturing method of DSC which concerns on embodiment, Comprising: The 1st board | substrate (working electrode side) 20 and the 2nd board | substrate (counter electrode side) 22 bonded together through the sealing material 16 Is represented as shown in FIG. 34, and a schematic cross-sectional structure taken along line VII-VII in FIG. 34 is represented as shown in FIG. 34 and 35, the first substrate (working electrode side) 20 is arranged in the upward direction, and the second substrate (counter electrode side) is arranged in the downward direction.

  FIG. 36 is a plan view showing a state where the horizontal scribe line SL1 is formed, which is one step of the DSC manufacturing method according to the embodiment, and further forms the vertical scribe line SL2. A plan view showing this state is represented as shown in FIG.

  As shown in FIG. 35, there is a portion where only the substrate remains between the sealing materials 16, but this becomes a scribe line SL2, which is separated into each element by a break such as hitting.

  Next, in a state where a total of m × n DSCs are bonded as shown in FIG. 35, a horizontal scribe line SL1 is formed as shown in FIG.

  Specifically, each scribing line SL1 is formed by accurately aligning the scribing wheel of the scribing device at the position where the sealing material 16 is provided.

  Subsequently, as shown in FIG. 37, a vertical scribe line SL2 is formed.

  Then, when an impact is given along the scribe line SL1 and the scribe line SL2, etc., the glass material breaks along the scribe line SL1 and the scribe line SL2 and is separated into each element due to the wall opening property of the glass material.

  Although not shown in the figure, after being separated into each element, the electrolyte solution is injected, sealed by bonding of a glass plate, filling with resin, etc., and the DSC is treated by preventing the electrolyte solution from leaking out. Built.

  According to the embodiment, it is possible to provide a dye-sensitized solar cell with improved sealing adhesion and good sealing performance and a method for manufacturing the same.

(Application example)
-Battery cell-
Next, with reference to FIGS. 38 to 41, application examples of a battery cell (hereinafter simply referred to as “cell”) configured by the DSC 200 according to the embodiment will be described.

  FIG. 38A shows a state in which three cells B1 to B3 are formed. In the example of FIG. 38A, three cells B1, B2, and B3 having the same area are provided in the same substrate.

  The three cells B1 to B3 are connected in series by wiring (not shown) as shown in FIG. The total voltage V of the cells B1 to B3 is V = V1 + V2 + V3, and the total current amount I is I = I1 = I2 = I3.

  FIG. 39 shows a state in which five cells B1 to B5 are arranged in parallel.

  The five cells B1 to B5 are connected in series by wiring as shown in FIG. The total voltage V of the cells B1 to B5 is the sum 5E of the voltages of the cells B1 to B5.

  FIG. 40 schematically shows a state in which n cells are stacked in a tandem configuration. The n cells are connected in series as shown in FIG. The total cell voltage V is the total voltage nE of the cells.

  FIG. 41 schematically shows a state in which n cells stacked in a tandem configuration are connected in parallel. The total cell voltage V is the sum nE of the voltages of the cells connected in series.

  FIG. 42 shows the wavelength region of the ultraviolet light L1 (wavelength of 10 to 400 nm), the wavelength region of the white light L2 (wavelength of 400 to 800 nm), and the wavelength region of the infrared light L3 (wavelength of 600 to 1000 nm). The DSC 200 according to the embodiment can exhibit a power generation function by light rays in at least one region of L1 to L3.

-Electronics-
The DSC according to the embodiment can be mounted on various electronic devices. For example, a remote control device, a desktop digital clock, an electronic notebook, an electronic dictionary, a DSC drive sensor module, and the like can be applied.

  With reference to FIGS. 43 to 45, a configuration example of a remote control device 330 on which the DSC 200 according to the embodiment is mounted will be described.

  As shown in FIGS. 43 and 44, the remote control device 330 has an opening 41 penetrating the front and back in a casing 38 made of plastic or the like, and is provided so that the DSC 200 faces the opening 41. A solar cell unit 39 is configured.

  In addition, the remote control device 330 is driven by the solar cell unit 39 as a power source, and includes a liquid crystal unit 34 that displays, for example, date and time, a TV channel number, and an operation button 36 that performs operations such as selecting a TV channel. Is provided.

  The DSC 200 is provided in a horizontal state at a substantially central portion in the thickness direction of the remote control device 330. It should be noted that which of the first substrate 20 side and the second substrate 22 side of the DSC 200 is the front side or the back side of the remote control device 330 may be arbitrary.

  In the configuration example shown in FIG. 44, the transparent member 40 that protects the DSC 200 is fitted into the opening 41 so as to be flush with the front and back surfaces of the housing 38. This prevents dust from being attached to or damaged from the front and back surfaces of the DSC 200.

  A transparent member may be provided on the side surface of the opening 41.

  As a result, external light such as sunlight and room light enters from the front surface side, back surface side, and side surface side of the remote control device 330 via the transparent member 40, so that incident light from the first substrate 20 side of the DSC 200 and Any of the incident light from the two substrates 22 side reaches the first porous semiconductor layer 13. Therefore, the DSC 200 can stably supply power to the remote control device 330 by generating power efficiently using external light.

  In particular, the remote control device 330 such as a television or a video device may be in a state in which the front side provided with the operation buttons 36 or the like faces, for example, a table top plate or the like (inverted state). .

  In remote control device 330 equipped with DSC 200 according to the embodiment, external light such as sunlight or room light is incident from the front surface side, back surface side, and side surface side of remote control device 330 via transparent member 40. If a light beam enters from the front surface or the back surface, the DSC 200 exhibits a power generation function. Therefore, even when the remote control device 330 is placed in an upside down state, power can be stably supplied, and convenience for the user can be improved.

  The electric power generated by the DSC 200 is not directly supplied to the liquid crystal unit 34, but can be supplied from the battery after being stored in the battery.

  In the modification of the remote control device 330 shown in FIG. 45, the transparent member 40 is omitted, and the DSC 200 is supported by the support portions 38a and 38b. In addition, the side part of the solar cell part 39 is covered with a part of the housing 38.

  In the remote control device 330 shown in FIG. 45, the DSC 200 exhibits a power generation function by light rays (hνf) and (hνr) incident from the front and back of the solar cell unit 39. Two or more DSCs 200 may be overlapped and connected in series by wiring.

  With reference to FIG. 46, a configuration example of a desktop digital timepiece 50 equipped with the DSC 200 according to the embodiment will be described.

  The desktop digital timepiece 50 is provided with a timepiece unit 52 for performing digital timepiece display and a DSC 200 on one plane of a case 54 having a triangular side surface formed of a transparent acrylic plate or the like.

  The DSC 200 is provided with two openings 43 formed in the housing 54 so that the DSC 200 faces the openings 43.

  In the configuration example shown in FIG. 46, the DSC 200 attached to each opening 43 has two cells arranged in parallel via a frame 56. Although not particularly limited, each cell of the DSC 200 can be connected in series by wiring to gain voltage and current.

  As shown in FIG. 46, the DSC 200 included in the tabletop digital timepiece 50 has a power generation function by using either a light ray (hνf) incident from the front side or a light ray (hνr) incident from the back side through the transparent casing 54. It can be demonstrated.

  Accordingly, the degree of freedom of the place where the desktop digital timepiece 50 is placed is increased, and power can be stably supplied to the timepiece unit 52 by effectively using the external light.

  With reference to FIG. 47, a configuration example of an electronic notebook 80 equipped with the DSC 200 according to the embodiment will be described.

  The electronic notebook 80 includes an operation button 36 for performing various inputs and a main body 80b having a liquid crystal unit 34 for displaying various information, and a lid 80a having a DSC 200 that can be freely opened and closed via the main body 80b and the hinge 80c. It consists of and.

  The lid portion 80a is formed with an opening 45 penetrating the lid portion 80a itself on the front and back sides so that the DSC 200 faces the opening portion 45. The DSC 200 may be configured by connecting a plurality of cells.

  As shown in FIG. 47 (a), the DSC 200 provided in the electronic notebook 80 exhibits a power generation function by any of the light rays incident from both the front and back surfaces when the lid portion 80a is opened, and stable power is supplied to the main body portion 80b. Can be supplied.

  On the other hand, even when the lid 80a is closed as shown in FIG. 47 (b), the DSC 200 exhibits a power generation function by incident light from the surface side. For example, a secondary battery such as a lithium ion battery provided on the main body 80b side is provided. The battery can be charged.

  Thus, according to the electronic notebook 80 equipped with the DSC 200 according to the embodiment, the external light can be used efficiently, and the convenience for the user can be improved.

  In addition, for example, the electronic notebook 80 equipped with the DSC 200 according to the embodiment does not increase in size as compared with the case where conventional solar cells are arranged on both sides of the lid, and is manufactured because only one DSC 200 is sufficient. Cost can be reduced.

  With reference to FIG. 48, the structural example of the electronic dictionary 90 carrying DSC200 which concerns on embodiment is demonstrated.

  The electronic dictionary 90 includes an operation button 36a for performing various inputs and a main body 90b including the DSC 200, a liquid crystal unit 34 for displaying various information that can be freely opened and closed via the main body 90b and the hinge 90c, and a lid including the DSC 200. Part 90a.

  The lid portion 90a and the main body portion 90b are formed with openings 46 penetrating the front and back surfaces so that the DSC 200 faces each opening portion 46. The DSC 200 may be configured by connecting a plurality of cells.

  As shown in FIG. 48, when the lid 90a is opened, the DSC 200 on the lid 90a side exhibits a power generation function by any of the light rays incident from both the front and back surfaces, and the DSC 200 on the main body 90b side The power generation function is demonstrated by the incident light. Therefore, stable power can be supplied to the arithmetic unit and the like included in the liquid crystal unit 34 and the main body 90b.

  On the other hand, even when the lid 90a is closed, the DSC 200 on the lid 90a side exhibits a power generation function by incident light from the front side, and can charge, for example, a secondary battery provided on the main body 90b side.

  For example, even when the electronic dictionary 90 is placed with the lid 90a side down, the DSC 200 of the main body 90b exhibits a power generation function by incident light from the front side. The secondary battery provided on the 90b side can be charged.

  As described above, according to the electronic dictionary 90 equipped with the DSC 200 according to the embodiment, external light can be used efficiently, and user convenience can be improved.

  In addition, for example, the electronic dictionary 90 according to the sixth embodiment does not increase in size as compared with the case where conventional solar cells are arranged on both the lid and the main body, and a single DSC 200 is sufficient. Manufacturing cost can be reduced.

  Note that the arrangement of the DSC 200 in the electronic dictionary 90 on which the DSC 200 according to the embodiment is mounted can be applied to various electronic devices such as game machines and notebook personal computers having the same structure.

(Application to sensor network)
A sensor network combining a wireless communication module, DSC, sensor, and the like can be constructed. If the communication distance is in the range of about 30 m, for example, 315 MHz or 868 MHz can be applied as the wavelength band. Furthermore, if the communication distance is in the range of about 100 m, for example, 920 MHz can be applied as the wavelength band.

  As shown in FIG. 49, the DSC drive sensor module 800 equipped with the DSC according to the embodiment includes a DSC module 801 and a wireless communication module 805. The DSC module 801 includes DSC series or parallel cells DSC1 and DSC2 that can generate electric power with room light, and functions as a sensor driving power source. The wireless communication module 805 is equipped with a wireless sensor node 804 and can perform sensing and wireless communication.

  As shown in FIG. 50, a schematic block configuration of another DSC drive sensor module 807 equipped with the DSC according to the embodiment includes a DSC module 801, a wireless communication module 805, and a power storage unit 806. The DSC module 801 includes DSC series or parallel cells DSC1, DSC2, DSC3, and DSC4 that can generate electric power with room light, and functions as a sensor driving power source. The power storage unit 806 is equipped with an electric double layer capacitor (EDLC) 808 and a control IC 809. By accumulating the electric power generated in the DSC module 801 in the power storage unit 806, the electric power can be stably supplied to the wireless communication module 805.

  A configuration example of a home energy management system (HEMS) 900 to which the DSC drive sensor module 800 equipped with the DSC according to the embodiment is applied is expressed as shown in FIG.

  Each DSC drive sensor module 800 collects sensing information such as a temperature / humidity sensor and an illuminance sensor, and usage statuses of the PC 930, the TV 901, the air conditioner 940 (air conditioner controller 903), the solar battery 902, etc., and receives sensor information by wireless communication. Data is transmitted to the device 920. In the sensor information receiver 920, signal processing for data reception, grasping of energy usage status, and the like is performed.

  According to the home energy management system 900 to which the DSC drive sensor module 800 equipped with the DSC according to the embodiment is applied, the power supply can be controlled according to the indoor environment of the entire building 910.

  As described above, according to the present invention, it is possible to provide a dye-sensitized solar cell rich in color, a method for manufacturing the same, and an electronic device.

[Other embodiments]
As described above, the embodiments have been described. However, it should be understood that the descriptions and drawings constituting a part of this disclosure are illustrative and do not limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention includes various embodiments not described herein.

  The dye-sensitized solar cell of the present invention can be applied to a power source or an auxiliary power source of various electronic devices such as a remote controller, a watch, a mobile phone, and a sensor node of a sensor network by being applied as a small, light and highly efficient power source. Is possible. It can also be applied to power generation elements used for building materials such as building walls and rain protection.

2 ... semiconductor fine particles 4, 30, 32 ... dye molecules 10 ... first electrode 12, 13, 13 _1, 13 _2, 13 _3, 13 ₄ ... first porous semiconductor layer 14, 14 _1, 14 _2, 14 _3, 14 ₄ ... Electrolytic solution 16 ... Sealing material 18 ... Second electrode 19 · 19 ₁ · 19 ₂ · 19 ₃ · 19 ₄ · · · Catalyst layer 20 · · · First substrate 22 · · · Second substrate 26 · 27 · 27 ₁ · 27 ₂ 27 ₃ 27 ₄ Second porous semiconductor layer 200 Dye-sensitized solar cell (DSC)
Dye, Dye1, Dye2, DyeA, DyeB ... Dye

Claims (31)

A first substrate;
A first electrode disposed on the first substrate;
A first porous semiconductor layer disposed on the first electrode and comprising semiconductor fine particles and dye molecules;
An electrolytic solution in contact with the first porous semiconductor layer and having a redox electrolyte dissolved in a solvent;
A second porous semiconductor layer in contact with the electrolytic solution and comprising semiconductor fine particles and dye molecules;
A catalyst layer disposed on the second porous semiconductor layer;
A second electrode disposed on the catalyst layer;
A second substrate disposed on the second electrode;
A dye-sensitized solar cell, comprising: a sealing material disposed between the first substrate and the second substrate and sealing the electrolytic solution.   The dye-sensitized solar cell according to claim 1, wherein the first porous semiconductor layer and the second porous semiconductor layer are formed of an oxide semiconductor. The first porous semiconductor layer and the second porous semiconductor layer are formed of any one of TiO ₂ , ZnO, WO ₃ , InO ₃ , ZrO ₂ , TaO ₂ , NbO ₅ , Nb ₂ O ₃ , and SnO _2. The dye-sensitized solar cell according to claim 2.   4. The dye-sensitized solar cell according to claim 1, wherein different types of dyes are adsorbed to each of the first porous semiconductor layer and the second porous semiconductor layer. 5.   5. The dye enhancement according to claim 4, wherein the dye adsorbed on one of the first porous semiconductor layer and the second porous semiconductor layer is D131, and the dye adsorbed on the other is SQ2. Sensitive solar cell.   5. The dye enhancement according to claim 4, wherein the dye adsorbed on one of the first porous semiconductor layer and the second porous semiconductor layer is D205, and the dye adsorbed on the other is SQ2. Sensitive solar cell.   7. The dye according to claim 4, wherein the dye adsorbed on the first porous semiconductor layer is a dye having higher power generation characteristics than the dye adsorbed on the second porous semiconductor layer. Dye-sensitized solar cell.   The first porous semiconductor layer or the second porous semiconductor layer in one DSC cell adsorbs different types of dyes in a specific region and another specific region. 8. The dye-sensitized solar cell according to any one of 7 above.   The film thickness of the first porous semiconductor layer or the second porous semiconductor layer in one DSC cell is different between a specific region and another specific region. 2. The dye-sensitized solar cell according to item 1.   10. The method according to claim 1, wherein the step of adsorbing the dye to the first porous semiconductor layer and the step of adsorbing the dye to the second porous semiconductor layer are performed simultaneously. Dye-sensitized solar cell.   11. The dye according to claim 1, wherein the dye is formed of any one of a red dye (N719), a black dye (N749), D131, D205, SQ2, a phthalocyanine dye, and a porphyrin dye. 2. A dye-sensitized solar cell according to 1.   The first substrate and the second substrate are formed of a glass substrate, a plastic substrate, a glass substrate with a transparent electrode having a transparent electrode formed on the entire surface, or a plastic substrate. 2. The dye-sensitized solar cell according to item 1. The first electrode and the second electrode, ITO, FTO, ZnO, dye-sensitized solar cell according to any one of claims 1 to 12, characterized in that it is formed in one of SnO _2.   The dye-sensitized solar cell according to any one of claims 1 to 13, wherein the catalyst layer is formed of any one of Pt, carbon, and a conductive polymer.   15. The electrolyte according to claim 1, wherein the electrolyte is formed of any one of γ-butyrolactone, propylene carbonate, ethylene carbonate, propylene carbonate, acetonitrile, methoxyacetonitrile, and propionitrile. Dye-sensitized solar cell. Forming a first electrode on a first substrate;
Forming a first porous semiconductor layer having semiconductor fine particles on the first electrode;
Immersing the first porous semiconductor layer in a dye solution to adsorb dye molecules;
Forming a second electrode on the second substrate;
Forming a catalyst layer on the second electrode;
Forming a second porous semiconductor layer having semiconductor fine particles on the catalyst layer;
Immersing the second porous semiconductor layer in a dye solution to adsorb dye molecules;
A step of causing the first substrate and the second substrate to face each other and bonding using a sealing material;
A method of manufacturing a dye-sensitized solar cell, comprising: encapsulating an electrolyte in the DSC cell from the opening, and sealing the opening.   The method for producing a dye-sensitized solar cell according to claim 16, wherein the first porous semiconductor layer and the second porous semiconductor layer are formed of an oxide semiconductor. The first porous semiconductor layer and the second porous semiconductor layer are formed of any one of TiO ₂ , ZnO, WO ₃ , InO ₃ , ZrO ₂ , TaO ₂ , NbO ₅ , Nb ₂ O ₃ , and SnO _2. The method for producing a dye-sensitized solar cell according to claim 17.   19. The dye-sensitized solar cell according to claim 16, wherein different types of dye are adsorbed to each of the first porous semiconductor layer and the second porous semiconductor layer. Method.   21. The dye enhancement according to claim 19, wherein the dye adsorbed on one of the first porous semiconductor layer and the second porous semiconductor layer is D131, and the dye adsorbed on the other is SQ2. A method for producing a solar cell.   20. The dye enhancement according to claim 19, wherein the dye adsorbed on one of the first porous semiconductor layer and the second porous semiconductor layer is D205, and the dye adsorbed on the other is SQ2. A method for producing a solar cell.   The dye adsorbed on the first porous semiconductor layer is a dye having higher power generation characteristics than the dye adsorbed on the second porous semiconductor layer. A method for producing a dye-sensitized solar cell.   The first porous semiconductor layer or the second porous semiconductor layer in one DSC cell has different types of dyes adsorbed in a specific region and another specific region. 22. The method for producing a dye-sensitized solar cell according to any one of 22 above.   23. The film thickness of a specific region and another specific region in the first porous semiconductor layer or the second porous semiconductor layer in one DSC cell is different. A method for producing the dye-sensitized solar cell according to claim 1.   25. The step of adsorbing a dye on the first porous semiconductor layer and the step of adsorbing a dye on the second porous semiconductor layer are performed simultaneously. A method for producing a dye-sensitized solar cell.   The dye is formed of any one of a red dye (N719), a black dye (N749), D131, D205, SQ2, a phthalocyanine dye, and a porphyrin dye. The manufacturing method of the dye-sensitized solar cell as described in 1 above.   27. The first substrate and the second substrate are each formed of a glass substrate, a plastic substrate, a glass substrate with a transparent electrode having a transparent electrode formed on the entire surface, or a plastic substrate. A method for producing the dye-sensitized solar cell according to claim 1. The first electrode and the second electrode, ITO, FTO, ZnO, of the dye-sensitized solar cell according to any one of claims 16 to 27, characterized in that it is formed by any one of SnO ₂ Production method.   The method for manufacturing a dye-sensitized solar cell according to any one of claims 16 to 28, wherein the catalyst layer is formed of any one of Pt, carbon, and a conductive polymer.   30. The electrolyte according to any one of claims 16 to 29, wherein the electrolytic solution is formed of any one of γ-butyrolactone, propylene carbonate, ethylene carbonate, propylene carbonate, acetonitrile, methoxyacetonitrile, and propionitrile. A method for producing a dye-sensitized solar cell.   An electronic apparatus comprising the dye-sensitized solar cell according to any one of claims 1 to 15.

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