JP2014163925A - Current sensor - Google Patents

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JP2014163925A
JP2014163925A JP2013049609A JP2013049609A JP2014163925A JP 2014163925 A JP2014163925 A JP 2014163925A JP 2013049609 A JP2013049609 A JP 2013049609A JP 2013049609 A JP2013049609 A JP 2013049609A JP 2014163925 A JP2014163925 A JP 2014163925A
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case
current sensor
primary conductor
shape
core
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Junji Miyamoto
準二 宮本
Toshiyuki Harada
季之 原田
Morio Nakazumi
守夫 中住
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Kohshin Electric Corp
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Kohshin Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a substrate mounting type current sensor capable of achieving a GND connection of a core easily at low cost and high in reliability and excellent in assemblability.SOLUTION: The current sensor has an annular magnetic laminate core formed with at least one GND connection hole laminated by pressing a magnetic steel plate into an annular shape having a gap, and one of metal pins formed into a rod-like shape is press-fitted into the GND connection hole. When the annular magnetic laminate core is assembled into a case, the other of the metal pins is configured to project to the outside from a through hole provided in the case, and can be electrically connected to the GND of a mother board mounted with the current sensor. Further, a fixing piece for pressing and fixing an input/output terminal of a circuit board assembled into the case is integrally provided with the case. Furthermore, one end of a primary conductor formed into a U-shape is inserted into a primary conductor insertion hole of the current sensor main body, and a U shape intermediate side part and the other end are press-fitted to a conductor positioning recess part provided in the current sensor main body, and the primary conductor is configured to be fixed to the current sensor main body.

Description

この発明は、環状磁性体積層コアに設けたギャップ内に配置した、磁電変換素子を用いて電流を検出する基板実装タイプの電流センサに関する。  The present invention relates to a board-mounted type current sensor that detects current using a magnetoelectric transducer disposed in a gap provided in an annular magnetic laminated core.

電流の大きさを検出する電流センサとして、ホール素子などの磁電変換素子を使用したものがあり、この種の電流センサは、環状磁性体コアの一部に設けたギャップ内に磁電変換素子を配置し、環状磁性体コアを貫通する一次導体に流れる被検出電流によってギャップ内に発生した磁束を磁電変換素子で検出するとともに、後段に接続された増幅回路で所定のレベルに増幅して出力するよう構成されており、磁電変換素子でギャップ内の磁束密度を検出することにより、一次導体に流れる電流の大きさを計測することができる。  Some current sensors that detect the magnitude of current use a magnetoelectric transducer such as a Hall element. This type of current sensor has a magnetoelectric transducer placed in a gap in a part of the annular magnetic core. The magnetic flux generated in the gap by the detected current flowing through the primary conductor passing through the annular magnetic core is detected by the magnetoelectric conversion element, and amplified to a predetermined level by the amplifier circuit connected at the subsequent stage and output. It is comprised, and the magnitude | size of the electric current which flows into a primary conductor is measurable by detecting the magnetic flux density in a gap with a magnetoelectric conversion element.

この種の電流センサは、一次導体を貫通させる環状磁性体コアに設けたギャップ内に磁電変換素子を配置した構造であり、コアと磁電変換素子が近接しているため、一次導体の電位が急激に変化した場合、一次導体とコアの静電結合によりコアの電位が振られて電気回路にノイズが発生するため、コアをGNDに接続することが望ましい。
コアをGNDに接続するため、金属板で形成したGND接続部材を設けた電流センサが提案されている。(例えば、特許文献1参照)
This type of current sensor has a structure in which a magnetoelectric conversion element is arranged in a gap provided in an annular magnetic core that penetrates a primary conductor. Since the core and the magnetoelectric conversion element are close to each other, the potential of the primary conductor suddenly increases. Since the potential of the core is shaken by the electrostatic coupling between the primary conductor and the core and noise is generated in the electric circuit, it is desirable to connect the core to GND.
In order to connect the core to the GND, a current sensor provided with a GND connection member formed of a metal plate has been proposed. (For example, see Patent Document 1)

また、装置のマザー基板に搭載して使用される基板実装タイプの電流センサでは、独立した複数のコの字形状の一次導体が並列に配置されており、電流センサが搭載されるマザー基板側のパターンで複数導体を並列または直列に組み合わせ接続することで、電流センサの前記マザー基板への搭載支持と併せ、電流センサの環状磁性体コアを貫通する被測定電流のアンペアターンを一定にし、数種類の定格電流を同じ電流センサで計測できるように構成された電流センサが提案されている。(例えば、特許文献2参照)  In addition, in a board-mounted type current sensor that is used by being mounted on the mother board of the device, a plurality of independent U-shaped primary conductors are arranged in parallel, and the mother board side on which the current sensor is mounted is arranged. By combining and connecting multiple conductors in parallel or in series in a pattern, together with supporting the mounting of the current sensor on the mother board, the ampere turn of the current to be measured that penetrates the annular magnetic core of the current sensor is made constant, and several types of A current sensor configured to measure the rated current with the same current sensor has been proposed. (For example, see Patent Document 2)

特開平8−194015JP-A-8-194015 特表2002−508846Special table 2002-508846

上記特許文献1に開示されている従来例では、図4〜図6に示すように回路基板105を保持するケース103と、被測定電流を印加する一次導体102を巻回す環状磁性体コア101の一部分を絶縁樹脂によって絶縁したボビン部109とを有し、前記ケース103は環状磁性体コア101の回りを絶縁樹脂で覆うよう、環状磁性体コア101にはケース103とボビン部109とが一体に形成されている。
尚、前記ボビン部109に巻回した一次導体の両端102a,102bは、底蓋106に設けた挿入孔106a,106bに挿入し位置固定される。
In the conventional example disclosed in Patent Document 1, a case 103 for holding a circuit board 105 and an annular magnetic core 101 around which a primary conductor 102 for applying a current to be measured is wound as shown in FIGS. A bobbin portion 109 partially insulated by an insulating resin, and the case 103 and the bobbin portion 109 are integrally formed on the annular magnetic core 101 so that the case 103 covers the periphery of the annular magnetic core 101 with an insulating resin. Is formed.
Note that both ends 102 a and 102 b of the primary conductor wound around the bobbin portion 109 are inserted into insertion holes 106 a and 106 b provided in the bottom cover 106 and fixed in position.

また、ボビン部109と回路基板105との間には、これらを相互に絶縁する隔壁111が設けられ、金属板からなるシールド板104を前記隔壁111の回路基板105側に配置し、シールド板104からのびている一対の第1及び第2の突片104a,104bがコア101に接触し、環状磁性体コア101と一体に形成され固定されている。  Further, a partition wall 111 is provided between the bobbin portion 109 and the circuit board 105, and a shield plate 104 made of a metal plate is disposed on the circuit board 105 side of the partition wall 111. A pair of first and second projecting pieces 104 a and 104 b extending from the core 101 are in contact with the core 101, and are integrally formed and fixed to the annular magnetic core 101.

更に、図6に示すようにシールド板104の第三の突起104cは、L字に曲げられ回路基板105の入出力端子108のGNDと電気的に接続されている。
したがって、コア101はシールド板104を介してGNDに接続されている。
尚、回路基板105は、ケース101に設けた第1のガイド部110aと第2のガイド部110bに沿って挿入され、基板保持部110でケース101に保持されている。
Further, as shown in FIG. 6, the third protrusion 104 c of the shield plate 104 is bent into an L shape and is electrically connected to the GND of the input / output terminal 108 of the circuit board 105.
Therefore, the core 101 is connected to the GND via the shield plate 104.
The circuit board 105 is inserted along the first guide part 110 a and the second guide part 110 b provided in the case 101, and is held by the case 101 by the board holding part 110.

上記のように構成された電流センサは、回路基板を保持するケースと、一次導体を巻き回す環状磁性体コアの一部分を絶縁樹脂によって絶縁したボビン部を有し、環状磁性体コアにケースとボビン部とシールド板を一体に形成するように構成しているため、形状が小形化になるだけではなく、外部電磁ノイズに強くかつ安価な電流センサが得られるという利点がある。  The current sensor configured as described above has a case for holding a circuit board, and a bobbin portion in which a part of an annular magnetic core around which a primary conductor is wound is insulated by an insulating resin, and the case and bobbin are provided on the annular magnetic core. Since the portion and the shield plate are formed integrally, there is an advantage that not only the shape is reduced, but also a current sensor that is resistant to external electromagnetic noise and inexpensive can be obtained.

しかしながら、シールド板と環状磁性体コアを一体成形した場合、相互に電気的な導通状態を保持できるよう樹脂成型条件などの管理をしなければならず、更に回路基板をケースに組み込んだ後、シールド板の突起をL字に曲げて回路基板のGND端子へハンダ付けなどにより電気的に接続したり、一次導体の両端を底蓋の挿入孔に挿入して位置固定するなど、組み立て作業に手間がかかるという問題点がある。  However, when the shield plate and the annular magnetic core are integrally molded, the resin molding conditions must be managed so that they can maintain electrical continuity with each other, and after the circuit board is incorporated into the case, the shield Bending the protrusions of the board into an L shape and electrically connecting them to the GND terminal of the circuit board by soldering, etc., or inserting both ends of the primary conductor into the insertion holes in the bottom lid to fix the position, etc. There is a problem that it takes.

また、回路基板のケースへの保持方法は明記されていないが、回路基板をケースに挿入後、接着剤等で回路基板をケースに固定することが必要であり、組立リードタイムが延びてコストが高くなったり、更には装置のマザー基板に電流センサ搭載後、振動などにより回路基板に実装された入出力端子に外力が加わり、回路基板と入出力端子の接続部が、応力によるハンダクラック等の不具合を生じるなどの問題点がある。  Although the method for holding the circuit board in the case is not specified, it is necessary to fix the circuit board to the case with an adhesive after inserting the circuit board into the case, which increases the assembly lead time and costs. After the current sensor is mounted on the mother board of the device, external force is applied to the input / output terminals mounted on the circuit board due to vibration, etc., and the connection between the circuit board and the input / output terminals may cause solder cracks due to stress, etc. There are problems such as causing problems.

次に、特許文献2に開示されているもう一方の従来例では、図7および図8に示すように金属板を抜き加工した複数の一次導体219を、電流センサのケース216の略中央にそれぞれ独立して一体成形し、環状磁性体コア214を前記一次導体219が貫通するように、内部構成部品を前記ケース216に組込み固定した後、一次導体219の両端を同一方向に直角に曲げてコの字形状に成形している。  Next, in another conventional example disclosed in Patent Document 2, a plurality of primary conductors 219 obtained by punching a metal plate as shown in FIG. 7 and FIG. Independently integrally molded, internal components are assembled and fixed in the case 216 so that the primary conductor 219 penetrates the annular magnetic core 214, and then both ends of the primary conductor 219 are bent at right angles in the same direction. It is molded into the shape of

上記のように構成された電流センサは、複数の一次導体がケースとの一体成形により所定の位置に固定されるため、組立が容易で小形化できる利点がある。  The current sensor configured as described above has an advantage that it can be easily assembled and reduced in size because a plurality of primary conductors are fixed to a predetermined position by integral molding with the case.

しかし、複数の一次導体をケースに一体成形するためケースのコストが高くなり、更に一次導体の両端をコの字形状に折り曲げて所定の端子ピッチを得ることが難しいという問題点がある。  However, since a plurality of primary conductors are integrally formed with the case, the cost of the case is increased, and further, it is difficult to obtain a predetermined terminal pitch by bending both ends of the primary conductor into a U-shape.

本発明の目的は上記の問題点を解決するために成されたもので、信頼性の高いコアのGND接続構造を持ち、組立が容易で安価な基板実装タイプの電流センサを提供することにある。  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and is to provide a board-mount type current sensor that has a highly reliable core GND connection structure, is easy to assemble and is inexpensive. .

本発明に係わる電流センサは、一部にギャップを設けた環状磁性体コアと、前記ギャップ内に配置された磁電変換素子および前記磁電変換素子の出力を所定のレベルに増幅して出力する増幅回路などの部品や入出力端子などを実装した回路基板と、被測定電流を印加する一次導体をケースに組込んで構成した基板実装タイプの電流センサにおいて、前記環状磁性体コアは磁性材鋼板をギャップを有する環形状にプレス加工して積層した、少なくとも1つのGND接続用孔を有した環状磁性体積層コアで、該GND接続用孔に棒状に形成された金属ピンの片方が圧入され、前記ケースに環状磁性体積層コアを組み込んだ時、ケースに設けた貫通孔から前記金属ピンの他方が外側に突き出る構造とし、電流センサが搭載されるマザー基板のGNDパターンに電気的に接続できるようにした。  A current sensor according to the present invention includes an annular magnetic core provided with a gap in a part thereof, a magnetoelectric conversion element arranged in the gap, and an amplification circuit that amplifies and outputs an output of the magnetoelectric conversion element to a predetermined level Circuit board mounted with components such as I / O terminals and the like, and a board mounted type current sensor configured by incorporating a primary conductor for applying a current to be measured into a case, the annular magnetic core has a gap between magnetic steel plates. A ring-shaped magnetic core having at least one GND connection hole, which is press-processed into a ring shape having a ring shape, and one of metal pins formed in a rod shape is press-fitted into the GND connection hole, When the annular magnetic core is incorporated into the base plate, the other metal pin protrudes outward from the through hole provided in the case, and the GND of the mother board on which the current sensor is mounted And it can be electrically connected to the turn.

また、回路基板に実装された入出力端子を押圧して固定する固定片がヒンジ部を介してケースに一体に形成されており、ケースに設けた基板ガイド部に沿って回路基板を挿入後、前記ヒンジ部を折り曲げて固定片をケースに設けた凹部に嵌め込んで入出力端子をケースに上部から押圧固定し、更にケースにカバーを装着してカバー天面に設けた基板押さえが回路基板をケースに押圧固定する構造とした。  In addition, a fixed piece that presses and fixes the input / output terminal mounted on the circuit board is formed integrally with the case via the hinge part, and after inserting the circuit board along the board guide part provided on the case, The hinge part is bent and a fixing piece is fitted into a recess provided in the case to press and fix the input / output terminal to the case from above, and a circuit board holder provided on the top of the cover with a cover attached to the case is attached to the circuit board. The structure is fixed to the case by pressing.

更に、前記ケースの略中央に設けた長孔形状の一次導体挿入孔は、片端が一次導体径より広い広端部と、他端が一次導体径とほぼクリアランスゼロとなる狭端部で形成されており、ケースにカバーを装着した後、丸銅線をコの字形状に成形した一次導体の一端を前記一次導体挿入孔の広端部に挿入すると共に、前記コの字形状の中辺をカバー上面に設けたY方向導体位置決め凹部に圧入し、しかる後に一次導体を本体中心方向にスライドさせ、一次導体の他端をケース前面外壁に設けたZ方向導体位置決め凹部に圧入固定する構造とした。  Furthermore, the elongated hole-shaped primary conductor insertion hole provided in the approximate center of the case is formed with a wide end portion where one end is wider than the primary conductor diameter, and a narrow end portion where the other end is substantially zero in clearance with the primary conductor diameter. After attaching the cover to the case, one end of the primary conductor formed by round copper wire in a U shape is inserted into the wide end portion of the primary conductor insertion hole, and the middle side of the U shape is Press fit into the Y direction conductor positioning recess provided on the upper surface of the cover, then slide the primary conductor toward the center of the body, and press fit and fix the other end of the primary conductor in the Z direction conductor positioning recess provided on the outer wall of the front of the case. .

本発明の基板実装タイプの電流センサによれば、環状磁性体積層コアのGND接続構造が簡単に実現でき、接続信頼性が高く、組立が容易で安価な電流センサを得ることができる。  According to the board-mounted type current sensor of the present invention, the GND connection structure of the annular magnetic laminated core can be easily realized, and a current sensor with high connection reliability, easy assembly, and low cost can be obtained.

更に、回路基板と入出力端子をケースに短時間で確実に固定でき、回路基板と入出力端子の接続信頼性が高く、組立リードタイムの短い安価な電流センサを得ることができる。  Furthermore, the circuit board and the input / output terminal can be securely fixed to the case in a short time, and an inexpensive current sensor with high connection reliability between the circuit board and the input / output terminal and a short assembly lead time can be obtained.

更にまた、複数組込された一次導体の端子ピッチのバラツキが小さく、しかも一次導体の組込が容易で安価な電流センサを得ることができる。  Furthermore, it is possible to obtain a current sensor that has a small variation in terminal pitch of a plurality of primary conductors that are incorporated, and that is easy and inexpensive to incorporate the primary conductors.

本発明の電流センサの組立構造を示す斜視図である。It is a perspective view which shows the assembly structure of the current sensor of this invention. 本発明の電流センサの組立状態を示す斜視図である。図2(a)は、固定片のケース嵌め込み前を示す斜視図である。また、図2(b)はヒンジ部を折り曲げて固定片をケースに嵌め込みし、入出力端子をケースに固定した状態を示す斜視図である。更に、図2(c)は、一次導体挿入孔の形状を示す正面図である。It is a perspective view which shows the assembly state of the current sensor of this invention. Fig.2 (a) is a perspective view which shows before the case fitting of a fixing piece. FIG. 2B is a perspective view showing a state in which the hinge portion is bent, the fixing piece is fitted into the case, and the input / output terminals are fixed to the case. Furthermore, FIG.2 (c) is a front view which shows the shape of a primary conductor insertion hole. 本発明の電流センサの組立状態を示す斜視図である。図3(a)は、一次導体の一端を一次導体挿入孔の広端部に挿入して一次導体をY方向導体位置決め凹部に嵌め込み、ケース前面外壁に設けたZ方向導体位置決め凹部に圧入固定前の状態を示す斜視図である。また、図3(b)は、ケース前面外壁に設けたZ方向導体位置決め凹部に圧入し、一次導体を電流センサ本体に固定した状態を示す斜視図である。It is a perspective view which shows the assembly state of the current sensor of this invention. FIG. 3 (a) shows a state where one end of the primary conductor is inserted into the wide end portion of the primary conductor insertion hole, the primary conductor is fitted into the Y-direction conductor positioning recess, and press-fitted into the Z-direction conductor positioning recess provided on the front wall of the case. It is a perspective view which shows the state of. FIG. 3B is a perspective view showing a state in which the primary conductor is fixed to the current sensor body by being press-fitted into the Z-direction conductor positioning recess provided on the outer front wall of the case. 特許文献1の考案に係る電流センサの組立構造を示す斜視図である。It is a perspective view which shows the assembly structure of the current sensor which concerns on the device of patent document 1. FIG. 特許文献1の考案に係る電流センサを示す上面断面図である。It is a top surface sectional view showing the current sensor concerning the device of patent documents 1. 特許文献1の考案に係る電流センサを示す側面断面図である。It is side surface sectional drawing which shows the current sensor which concerns on the device of patent document 1. 特許文献2の考案に係る電流センサを示す正面図である。It is a front view which shows the current sensor which concerns on the device of patent document 2. FIG. 特許文献2の考案に係る電流センサを示す側面断面図である。It is side surface sectional drawing which shows the current sensor which concerns on the device of patent document 2.

以下、本発明の実施の形態について、図1〜図3を用いて説明する。
図1〜図3において、1はケース、2は回路基板で、磁電変換素子3や信号増幅器4などの部品と、回路の駆動電源入力や信号を出力する入出力端子5が実装されている。
6は環状磁性体積層コアで、一部にギャップ7が設けられており、このギャップ内に配置される磁電変換素子3の出力信号は、回路基板2の信号増幅器4で所定のレベルに増幅して、入出力端子5から出力される。
また、環状磁性体積層コア6に設けたGND接続用孔8には、棒状に形成された金属ピン9が圧入固定されている。
尚、金属ピン9の代わりにスプリングピンを用いると、より接触安定性を向上させることができ望ましい。
被測定電流を印加する一次導体10は、丸銅線をコの字形状に加工したもので、コの字形状の一端10aと他端10bは、中辺10cを境にほぼ同一形状に形成されている。
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
1 to 3, reference numeral 1 denotes a case, 2 denotes a circuit board, on which components such as a magnetoelectric conversion element 3 and a signal amplifier 4 and an input / output terminal 5 for outputting driving power and signals of the circuit are mounted.
Reference numeral 6 denotes an annular magnetic laminated core, and a gap 7 is provided in a part thereof. An output signal of the magnetoelectric conversion element 3 disposed in the gap is amplified to a predetermined level by the signal amplifier 4 of the circuit board 2. And output from the input / output terminal 5.
A metal pin 9 formed in a rod shape is press-fitted and fixed in a GND connection hole 8 provided in the annular magnetic laminated core 6.
Note that it is desirable to use a spring pin instead of the metal pin 9 because the contact stability can be further improved.
The primary conductor 10 to which the current to be measured is applied is obtained by processing a round copper wire into a U shape, and one end 10a and the other end 10b of the U shape are formed in substantially the same shape with the middle side 10c as a boundary. ing.

まず、ケース1に設けられた入出力端子孔11に、回路基板2の入出力端子5が貫通するよう回路基板2をケース1のガイド部12に沿って挿入した後、ヒンジ部13を介してケース1に一体に形成された固定片14の両端に設けた固定用凸部15を、前記ヒンジ部13を折り曲げてケース1に設けた固定用凹部16に嵌め込み、固定片14が前記入出力端子5を上部からケース1に押圧固定する。  First, after inserting the circuit board 2 along the guide portion 12 of the case 1 so that the input / output terminal 5 of the circuit board 2 penetrates into the input / output terminal hole 11 provided in the case 1, Fixing convex portions 15 provided at both ends of a fixing piece 14 formed integrally with the case 1 are fitted into fixing concave portions 16 provided in the case 1 by bending the hinge portion 13 so that the fixing piece 14 is the input / output terminal. 5 is pressed and fixed to the case 1 from above.

金属ピン9をGND接続用孔8にあらかじめ圧入固定した、前記環状磁性体積層コア6のギャップ7に、ケース1に組込された前記回路基板2の前記磁電変換素子3が位置するよう、また、前記金属ピン9がケース1の前記入出力端子孔11と同一方向に設けられた貫通孔17を貫通し突き出るよう、該環状磁性体積層コア6をケース1に挿入する。  The magnetoelectric transducer 3 of the circuit board 2 incorporated in the case 1 is positioned in the gap 7 of the annular magnetic laminated core 6 in which the metal pin 9 is press-fitted and fixed in the GND connection hole 8 in advance. The annular magnetic laminated core 6 is inserted into the case 1 so that the metal pin 9 protrudes through the through hole 17 provided in the same direction as the input / output terminal hole 11 of the case 1.

次に、ケース1にカバー18を装着し、カバー18の天面に設けた基板押さえ19が、組込された回路基板2を押圧しケース1に固定される。
更に、ケース1の略中央に設けた一次導体挿入孔20の広端部23に、コの字形状に加工された一次導体10の一端10aを挿入し、カバー18に設けたY方向導体位置決め凹部21に一次導体10の中辺10cを圧入し、しかる後に一次導体10を電流センサ本体30の中心方向にスライドさせ、一次導体10の他端10bをケース1の前面外壁に設けたZ方向導体位置決め凹部22に圧入して、一次導体10が電流センサ本体30に固定される。
尚、前記一次導体挿入孔20は片端が一次導体径より広い広端部23と、他端が一次導体径とほぼクリアランスゼロとなる狭端部24の長孔形状に形成されており、前記Z方向導体位置決め凹部22に前記他端10bを圧入した時、前記一次導体挿入孔20の広端部23に挿入した前記一端10aが狭端部24にスライドし、電流センサ本体30に固定される。
Next, the cover 18 is attached to the case 1, and the board presser 19 provided on the top surface of the cover 18 presses the assembled circuit board 2 and is fixed to the case 1.
Furthermore, a Y-direction conductor positioning recess provided in the cover 18 by inserting one end 10 a of the primary conductor 10 processed into a U-shape into the wide end portion 23 of the primary conductor insertion hole 20 provided in the approximate center of the case 1. 21. The middle side 10c of the primary conductor 10 is press-fitted into 21, and then the primary conductor 10 is slid toward the center of the current sensor body 30, and the other end 10b of the primary conductor 10 is positioned on the front outer wall of the case 1 in the Z direction conductor positioning. The primary conductor 10 is fixed to the current sensor body 30 by being press-fitted into the recess 22.
The primary conductor insertion hole 20 is formed in the shape of a long hole having a wide end portion 23 whose one end is wider than the primary conductor diameter and a narrow end portion 24 whose other end is substantially zero in clearance with the primary conductor diameter. When the other end 10 b is press-fitted into the directional conductor positioning recess 22, the one end 10 a inserted into the wide end portion 23 of the primary conductor insertion hole 20 slides to the narrow end portion 24 and is fixed to the current sensor body 30.

以上のように、本発明の電流センサによれば、入出力端子に加わる外力の影響を受けにくく、信頼性の高いコアGND接続構造を持った、組立性に優れた安価な基板実装タイプの電流センサを得ることができる。
尚、一次導体を電流センサ本体に複数組込固定し、搭載されるマザー基板側配線により一次導体を並列接続または直列接続することにより、被測定電流値に応じて一次導体の巻数を増減できることは周知の通りである。
As described above, according to the current sensor of the present invention, an inexpensive circuit board mounting type current that is less susceptible to external force applied to the input / output terminals, has a highly reliable core GND connection structure, and has excellent assemblability. A sensor can be obtained.
In addition, it is possible to increase or decrease the number of turns of the primary conductor according to the measured current value by fixing a plurality of primary conductors in the current sensor body and connecting the primary conductors in parallel or in series with the mother board side wiring mounted. As is well known.

1 ケース、2 回路基板、3 磁電変換素子、4 信号増幅器、5 入出力端子、6 環状磁性体積層コア、7 ギャップ、8 GND接続用孔、9 金属ピン、10 一次導体、10a 一端,10b 他端、10c 中辺、11 入出力端子孔、12 ガイド部、13 ヒンジ部、14 固定片、15 固定用凸部、16 固定用凹部、17 貫通孔、18 カバー、19 基板押さえ、20 一次導体挿入孔、21 Y方向導体位置決め凹部、22 Z方向導体位置決め凹部、23 広端部、24 狭端部、30 電流センサ本体DESCRIPTION OF SYMBOLS 1 Case, 2 Circuit board, 3 Magnetoelectric conversion element, 4 Signal amplifier, 5 Input / output terminal, 6 Cyclic magnetic laminated core, 7 Gap, 8 GND connection hole, 9 Metal pin, 10 Primary conductor, 10a One end, 10b etc. End, 10c Middle side, 11 Input / output terminal hole, 12 Guide part, 13 Hinge part, 14 Fixing piece, 15 Fixing convex part, 16 Fixing concave part, 17 Through hole, 18 Cover, 19 Substrate presser, 20 Primary conductor insertion Hole, 21 Y-direction conductor positioning recess, 22 Z-direction conductor positioning recess, 23 Wide end, 24 Narrow end, 30 Current sensor body

Claims (5)

一部にギャップを設けた環状磁性体コアと、前記ギャップ内に配置された磁電変換素子やその他の回路部品および入出力端子を実装した回路基板と、丸形断面形状の導電性金属材をコの字形状に成形してなる一次導体をケースに組み込み、カバーを装着してなる基板実装タイプの電流センサにおいて、前記環状磁性体コアにコアGND接続用部材を設け、前記ケースに環状磁性体コアを組み込んだ時、ケースに設けた貫通孔から前記コアGND接続用部材が突き出し、電流センサが搭載されるマザー基板のGNDに電気的に接続できるよう構成したことを特徴とする基板実装タイプの電流センサ。  A circular magnetic core having a gap in part, a circuit board on which magnetoelectric transducers and other circuit components and input / output terminals arranged in the gap are mounted, and a conductive metal material having a round cross-sectional shape are copied. In a board mounting type current sensor in which a primary conductor formed in a U-shape is incorporated in a case and a cover is attached, a core GND connection member is provided in the annular magnetic core, and the annular magnetic core is provided in the case Board mounting type current, wherein the core GND connection member protrudes from a through hole provided in the case and is electrically connected to the GND of the mother board on which the current sensor is mounted. Sensor. 前記環状磁性体コアは、磁性材鋼板をギャップを有する環形状にプレス加工して積層した、少なくとも1つのGND接続用孔を有した環状磁性体積層コアであって、前記コアGND接続用部材は棒状に成形された金属ピンからなり、環状磁性体積層コアの前記GND接続用孔に前記金属ピンの片方が圧入され、前記ケースに環状磁性体積層コアを組み込んだ時、ケースに設けた貫通孔から前記金属ピンの他方が外側に突き出る構造とした、請求項1に記載の基板実装タイプの電流センサ。  The annular magnetic core is an annular magnetic laminated core having at least one GND connection hole formed by pressing and laminating magnetic steel plates into a ring shape having a gap, and the core GND connection member is A through hole provided in the case when the annular magnetic laminated core is assembled into the case, which is made of a metal pin formed into a rod shape, and one of the metal pins is press-fitted into the GND connection hole of the annular magnetic laminated core The board-mounted type current sensor according to claim 1, wherein the other metal pin protrudes outward from the outside. 前記金属ピンは、金属薄板を円筒状に巻いたスプリングピンである、請求項2に記載の基板実装タイプの電流センサ。  The board-mounted type current sensor according to claim 2, wherein the metal pin is a spring pin obtained by winding a thin metal plate into a cylindrical shape. 前記ケースに回路基板を挿入した後、回路基板に実装された入出力端子を押圧してケースに固定する固定片が、ヒンジ部を介して前記ケースに一体に形成された、請求項1から請求項3にいずれかに記載の基板実装タイプの電流センサ。  The fixing piece for pressing the input / output terminal mounted on the circuit board and fixing the input / output terminal to the case after the circuit board is inserted into the case is formed integrally with the case via a hinge portion. Item 4. The board-mounted type current sensor according to Item 3. 前記ケースの略中央開口部に設けた一次導体挿入孔は、片端が一次導体径より広い広端部と、他端が一次導体径とほぼクリアランスゼロとなる狭端部の長孔形状に形成され、ケースにカバーを装着後に前記一次導体挿入孔の前記広端部にコの字形状に成形された一次導体の一端を挿入し、カバーに設けられたY方向導体位置決め凹部に前記コの字形状の中辺を圧入、しかる後に一次導体を電流センサ本体の中心方向にスライドさせ、一次導体の他端をケース前面の外壁に設けたZ方向導体位置決め凹部に圧入して、一次導体が電流センサ本体に固定されるよう、前記一次導体挿入孔および導体位置決め凹部が形成された、請求項1から請求項4のいずれかに記載の基板実装タイプの電流センサ。  The primary conductor insertion hole provided in the substantially central opening of the case is formed in the shape of a long hole with a wide end portion where one end is wider than the primary conductor diameter and a narrow end portion where the other end is substantially zero in clearance with the primary conductor diameter. One end of a U-shaped primary conductor is inserted into the wide end portion of the primary conductor insertion hole after the cover is attached to the case, and the U-shape is positioned in the Y-direction conductor positioning recess provided on the cover. Press the center side of the wire, then slide the primary conductor toward the center of the current sensor body, press the other end of the primary conductor into the Z-direction conductor positioning recess provided on the outer wall of the case front, and the primary conductor is the current sensor body The board mounted type current sensor according to any one of claims 1 to 4, wherein the primary conductor insertion hole and the conductor positioning recess are formed so as to be fixed to each other.
JP2013049609A 2013-02-22 2013-02-22 Current sensor Pending JP2014163925A (en)

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