JP2014161132A - Thermostatic-type piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermostatic-type piezoelectric oscillator in which a main body casing of the thermostatic-type piezoelectric oscillator can be made low and cost of manufacture can be suppressed low.SOLUTION: A thermostatic-type piezoelectric oscillator 1 comprises a piezoelectric vibrator 2, an oscillation part 31 and a thermostat 5. The piezoelectric vibrator 2 and the oscillation part 31 are disposed on one principal surface 60 of a substrate 6. Within the substrate 6, a thermostatic part 51 is provided for keeping the piezoelectric vibrator 2 at a predetermined temperature. On the one principal surface 60 of the substrate 6, a metal case 52 is provided which encapsulates the piezoelectric vibrator 2 and the oscillation part 31. The thermostat 5 is formed from the thermostatic part 51 and the metal case 52. On the substrate 6, a through hole is formed as a joint part 62 joined with the metal case 52, and in the metal case 52, a protrusion 54 is formed. A surface of the protrusion 54 outside of the case is not abutted with the joint part 62 within the joint part 62 and inside of the joint part 62, a clearance is kept between the surface of the protrusion 54 outside of the case and the joint part 62.

Description

  The present invention relates to a thermostatic chamber type piezoelectric oscillator (OCXO (Oven Controlled Crystal Oscillator)) including a piezoelectric vibrator and a thermostatic bath that maintains the piezoelectric vibrator at a predetermined temperature.

  As an example of a conventional thermostatic chamber type piezoelectric oscillator, there is one provided with a piezoelectric vibrator and a thermostatic bath for keeping the piezoelectric vibrator at a predetermined temperature.

  For example, an aluminum block is used for the thermostat, and the piezoelectric vibrator is stored in the thermostat. In addition, a sensor unit for detecting the temperature of the piezoelectric vibrator is stored in the constant temperature bath in contact with the piezoelectric vibrator. The constant temperature bath is disposed on one main surface of the circuit board, and a heater portion for heating the constant temperature bath is disposed on the other main surface of the circuit board. The heating operation by the heater unit is controlled based on temperature detection by the sensor unit.

  As an example of a thermostatic chamber type piezoelectric oscillator having such a configuration, there is a piezoelectric oscillator disclosed in Patent Document 1.

  In the piezoelectric oscillator disclosed in Patent Document 1, the aluminum block housing the piezoelectric vibrator is disposed on a circuit board, and the piezoelectric vibrator and the circuit board are electrically connected to a second circuit board. It has a configuration.

JP 2008-306480 A

  By the way, in the piezoelectric oscillator disclosed in Patent Document 1, since the temperature of the piezoelectric vibrator can be controlled by the thermostatic bath, high frequency stabilization can be realized. Since it is housed in the block, it is difficult to reduce the height of the main body casing of the piezoelectric oscillator and to reduce the manufacturing cost.

  The present invention was devised to solve such problems, and an object thereof is to provide a thermostatic chamber type piezoelectric oscillator capable of reducing the height of the main body casing of the piezoelectric oscillator and reducing the manufacturing cost. It is in.

  In order to solve the above-described problems, a thermostatic chamber type piezoelectric oscillator according to the present invention includes a piezoelectric vibrator, an oscillating unit constituting an oscillation circuit using the piezoelectric vibrator as an oscillator, and the piezoelectric vibrator maintained at a predetermined temperature. A thermostatic chamber is provided, the piezoelectric vibrator and the oscillating portion are arranged on one main surface of the substrate, and a thermostatic portion for keeping the piezoelectric vibrator at a predetermined temperature is provided inside the substrate. A thermostatic case for sealing the piezoelectric vibrator and the oscillating portion is provided on a main surface, and the thermostatic bath is constituted by the thermostatic portion and the thermostatic case, and is joined to the substrate with the thermostatic case. A joining portion is formed, and a protruding piece is formed to protrude from the thermostatic case, and a case outer surface of the protruding piece does not contact the joining portion in the joining portion, and the case outer side of the protruding piece in the joining portion. Between the surface and the joint Gap is maintained, the joint is characterized by a through hole passing through the substrate.

  According to the present invention, since the thermostat is composed of the thermostat case and the thermostat, the manufacturing procedure is simplified compared to a thermostat piezoelectric oscillator using a conventional aluminum block as the thermostat. , Manufacturing costs can be kept low. In addition, the thermostatic case that seals the piezoelectric vibrator and the oscillating portion (including the piezoelectric vibrator and the oscillating portion) is provided on one main surface of the substrate, and the thermostatic portion and the thermostatic case. Therefore, a thermostatic chamber that seals the piezoelectric vibrator and the oscillating portion is formed, so that the main body housing of the thermostatic chamber type piezoelectric oscillator is compared with a conventional thermostatic chamber type piezoelectric oscillator in which a thermostatic chamber is separately provided. Can be reduced in height and size. Further, since the gap is maintained, the heat of the constant temperature case is suppressed from being transferred from the constant temperature case to the substrate and radiated to the outside. Further, in this case, the joining portion is formed on the substrate, and the joining portion is a through-hole penetrating the substrate, and the protruding piece is provided on the thermostatic case. Suppresses heat dissipation spreading on the substrate, and as a result, power consumption can be reduced.

  Moreover, the said structure WHEREIN: The heater part which heats the said piezoelectric vibrator may be provided, and the said heater part may be distribute | arranged to the outer side of the said thermostat.

  In this case, since the heater part is arranged outside the thermostat, a steep thermal gradient is generated inside the thermostat by the heater part by arranging the heater part inside the thermostat. Can be prevented.

  Moreover, the said structure WHEREIN: The sensor part which detects the temperature of the said piezoelectric vibrator may be provided, and the said sensor part may be distribute | arranged inside the said thermostat.

  In this case, since the sensor unit is disposed inside the thermostatic chamber, the sensor unit can be disposed in the vicinity of the piezoelectric vibrator to accurately detect the temperature of the piezoelectric vibrator.

  Moreover, the said structure WHEREIN: The said junction part may be formed along the outer periphery of the area | region of planar view rectangular view of the one main surface of the said board | substrate on the said thermostat. In this case, the joint may be formed on two opposing sides of the four sides of the outer peripheral edge of the region.

  In this case, the joint portion (through hole) formed along the outer peripheral edge of the region suppresses heat radiation in which the heat in the thermostatic chamber spreads on the substrate, and as a result, power consumption can be reduced.

  Further, in the above configuration, an external connection terminal protrudes from the piezoelectric vibrator, and a rectangular region in plan view of one main surface of the substrate on the constant temperature portion is an overlapping region, and the external connection terminal is provided on the substrate. May be formed, and the joint may be disposed between the hole and the overlapping region.

  In this case, by arranging the joint between the hole into which the external connection terminal is inserted and the overlap region, the heat of the overlap region is transferred to the external connection terminal through the substrate and radiated to the outside. It is suitable for suppressing this.

  Moreover, the said structure WHEREIN: The protrusion piece of the said thermostat case may be soldered to the said board | substrate with the other main surface of the said board | substrate.

  In this case, since the protruding piece of the constant temperature case is soldered to the substrate on the other main surface of the substrate, the constant temperature case can be easily provided on the substrate.

  In the above structure, the substrate may be a resin substrate, more preferably a resin substrate having a thermal conductivity of 0.2 W / (m · K) to 0.5 W / (m · K). As a specific example, a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, a glass epoxy substrate, or a fluororesin substrate can be used as the substrate.

  In this case, since the thermal conductivity of the substrate is relatively low, heat radiation from the inside of the thermostat to the outside of the thermostat via the substrate can be reduced, and power consumption can be reduced.

  Moreover, the said structure WHEREIN: A flat pattern or a mesh pattern may be sufficient as the said thermostat.

  In this case, since the thermostat is a flat pattern or a mesh pattern, the thermostat piezoelectric oscillator can be reduced in height. Furthermore, the heat in the thermostat can be stabilized. Moreover, a solid pattern is mentioned as a specific example of a flat pattern.

  Further, in the above configuration, an external connection terminal protrudes from the piezoelectric vibrator, and a mounting portion for mounting the piezoelectric vibrator is provided on the substrate, and a distal end portion of the external connection terminal is located in the mounting portion. It may be arranged.

  In this case, the external connection terminal protrudes from the piezoelectric vibrator, the mounting portion is provided on the substrate, and the distal end portion of the external connection terminal is disposed in the mounting portion. In this state, the predetermined temperature can be maintained.

  Moreover, the said structure WHEREIN: The said mounting part may be formed in a concave shape in the one main surface of the said board | substrate on the said thermostat.

  In this case, since the mounting part is formed in a concave shape on one main surface of the substrate on the constant temperature part, the tip of the external connection terminal can be disposed in the vicinity of the constant temperature part. Heat from the thermostatic part can be directly transferred to the vibrating piece (for example, a quartz vibrating piece) of the piezoelectric vibrator via the external connection terminal.

  In the above configuration, the main body casing of the thermostatic chamber type piezoelectric oscillator may seal the piezoelectric vibrator, the oscillation circuit, the heater unit, the thermostatic chamber, and the substrate.

  In this case, the main body housing of the thermostatic chamber type piezoelectric oscillator seals the piezoelectric vibrator, the oscillating portion, the thermostatic case, the substrate, and the thermostatic bath, so the piezoelectric vibrator, the oscillating portion, The constant temperature case, the substrate, and the constant temperature bath can be protected from an external environment such as dust and a force applied from the outside such as an impact. In addition, since the said main body housing | casing can respond | correspond to EMS (Electro Magnetic Susceptibility), it is more preferable that it is formed using the metal.

  In the above-described configuration, a surface-mount type piezoelectric device may be disposed on one main surface of the substrate instead of the piezoelectric vibrator or the piezoelectric vibrator and the oscillation unit.

  In this case, since the surface-mounted piezoelectric device is a thin electronic component, the main body housing of the thermostatic chamber type piezoelectric oscillator can be reduced in height.

  The thermostatic chamber type piezoelectric oscillator according to the present invention can reduce the height of the main body housing of the thermostatic chamber type piezoelectric oscillator and can keep the manufacturing cost low.

It is a perspective view which shows schematic structure of the thermostat-type piezoelectric oscillator which concerns on this embodiment. It is a general | schematic disassembled perspective view of the main body housing | casing which comprises the thermostat-type piezoelectric oscillator of this embodiment, a board | substrate, and a metal case. It is a schematic plan view which shows the board | substrate which concerns on this embodiment. It is a schematic perspective view which shows the metal case which concerns on this embodiment. It is the schematic block diagram which showed the joining structure of the metal case and the piezoelectric vibrator to the board | substrate of the thermostat-type piezoelectric oscillator which concerns on this embodiment. It is a schematic plan view which shows the board | substrate which concerns on the other form of this embodiment. It is a schematic plan view which shows the board | substrate which concerns on the other form of this embodiment. It is a schematic plan view which shows the board | substrate which concerns on the other form of this embodiment. It is a schematic plan view which shows the board | substrate which concerns on the other form of this embodiment. It is the schematic block diagram which showed joining of the metal case to the board | substrate of the thermostat-type piezoelectric oscillator which concerns on the other form of this embodiment. It is the schematic block diagram which showed the joining structure of the metal case to the board | substrate of a thermostat-type piezoelectric oscillator when the metal case shown in FIG. 12 was joined to the junction part shown in FIG. It is a schematic perspective view which shows the metal case which concerns on the other form of this embodiment. It is a schematic plan view which shows the thermostat which concerns on the other form of this embodiment. It is a schematic block diagram which shows the heater part which concerns on the other form of this embodiment. It is a schematic block diagram which shows the heater part which concerns on the other form of this embodiment. It is a schematic perspective view which shows each structure in the thermostat which concerns on the other form of this embodiment. It is a schematic perspective view which shows each structure in the thermostat which concerns on the other form of this embodiment. It is a perspective view which shows schematic structure of the thermostat-type piezoelectric oscillator which concerns on the other form of this embodiment.

  Hereinafter, a thermostatic oven type piezoelectric oscillator according to an embodiment of the present invention (this embodiment) will be described with reference to the drawings.

  A thermostatic chamber type piezoelectric oscillator 1 according to this embodiment is shown in FIGS. FIG. 1 is a perspective view showing a schematic configuration of a thermostat-type piezoelectric oscillator 1 according to the present embodiment. FIG. 2 is a schematic exploded perspective view of the main body housing 9, the substrate 6, and the metal case 52 (constant temperature case according to the present invention) constituting the constant temperature bath type piezoelectric oscillator 1 of the present embodiment.

  As shown in FIGS. 1 and 2, the thermostatic chamber type piezoelectric oscillator 1 according to the present embodiment includes a substrate 6, a piezoelectric vibrator 2 and an oscillating unit 31 arranged on one main surface of the substrate 6, and a piezoelectric vibrator 2. And the metal case 52 which seals the oscillation part 31 is provided.

  As shown in FIGS. 1 and 2, the main body housing 9 of the thermostatic chamber type piezoelectric oscillator 1 is joined to the protective case 91 having an opening 90 formed on one surface thereof, and the protective case 91, and the thermostatic chamber type piezoelectric oscillator 1. It comprises a base 92 that seals the constituent members of the oscillator 1. An external lead terminal 93 that is electrically connected to an external electronic device is formed on the base 92 so as to protrude from the inside (inside) of the main body housing 9 to the outside (outside). The protective case 91 and the base 92 are formed using metal, and an insulating member made of glass or the like is interposed between the base 92 and the external lead terminal 93. , Because it can cope with EMS.

  Next, each structure of the thermostat type piezoelectric oscillator 1 will be described in detail with reference to FIGS. FIG. 3 is a schematic plan view showing the substrate 6 according to the present embodiment. FIG. 4 is a schematic perspective view showing the metal case 52 according to the present embodiment.

  As shown in FIG. 1, the piezoelectric vibrator 2 includes a crystal vibrating piece (not shown) such as an SC cut or an AT cut, a support base 23 that supports the crystal vibrating piece, and a crystal vibration supported by the support base 23. The cap 24 is hermetically sealed. A pair of excitation electrodes (not shown) and an extraction electrode (not shown) drawn from the pair of excitation electrodes are formed on the crystal vibrating piece. Two lead terminals 21 (external connection terminals in the present invention) are inserted and joined to the support base 23. The two lead terminals 21 include an outer lead portion extending outward from the support base 23 and an inner lead portion disposed inside the piezoelectric vibrator 2 and joined to the extraction electrode of the crystal vibrating piece. It is configured. As shown in FIG. 1, the two lead terminals 21 are arranged at the same position in the side view of the piezoelectric vibrator 2.

  As shown in FIGS. 1 and 4, the metal case 52 is a box-like body having an opening 53 formed on one end surface. When the metal case 52 is disposed on the substrate 6, the opening 53 is formed on the substrate 6. It faces the main surface 60. The metal case 52 includes a top plate 56 and four side plates 50, and the side plate 50 is suspended from the outer peripheral end of the top plate 56. Of these four side plates 50, any two opposing side plates 50 are formed with protruding pieces 54 protruding from their tips. Note that the metal case 52 is preferably formed of a material having high thermal conductivity, and brass is used in this embodiment.

  The substrate 6 is composed of a multilayer substrate in which a plurality of layers are laminated, and is, for example, a resin substrate having a thermal conductivity of 0.2 W / (m · K) to 0.5 W / (m · K). As a specific example, a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, a glass epoxy substrate, or a fluororesin substrate can be used as the substrate 6.

  As shown in FIGS. 1 and 3, a constant temperature portion 51 that keeps the piezoelectric vibrator 23 at a predetermined temperature is provided inside the substrate 6. The constant temperature portion 51 is formed in the intermediate layer of the substrate 6 and is a heat conductive layer made of a heat conductive material (copper in the present embodiment) having high heat conductivity, and is formed into a flat plate-like pattern having a rectangular shape in plan view. ing. In the present embodiment, a solid pattern is used as the constant temperature part 51.

  As shown in FIGS. 1 to 3, an oscillation circuit 3 using the piezoelectric vibrator 2 as an oscillator is formed in a pattern on the main surface 60 of the substrate 6 (not shown), and an oscillation unit that is a component of the oscillation circuit 3 31 (an integrated circuit chip, other electronic components, etc.) and a sensor unit 7 for detecting the temperature of the piezoelectric vibrator 2 are provided. In the present embodiment, for example, a thermistor is used as the sensor unit 7. Further, as shown in FIG. 3, a rectangular area in plan view of the main surface 60 of the substrate 6 on the constant temperature part 51 (area overlapping the constant temperature part 51 in plan view) is defined as an overlapping area A, and piezoelectric vibration is generated in the overlapping area A. A mounting portion 63 for electrically connecting the lead terminals 21 of the child 2 is formed. The mounting part 63 is formed in a cylindrical concave shape having a depth that does not reach the constant temperature part 51. A joining portion 62 that joins the metal case 52 is provided along the outer periphery of the overlapping region A. The joint portion 62 is formed in a rectangular parallelepiped concave shape along each side of the outer peripheral edge of the overlapping region A of the one main surface 60 of the substrate 6. The bonding portion 62 is provided with a heat conductive film 18 having a high thermal conductivity extending from the concave inner surface to one main surface 60 of the substrate 6 outside the bonding portion 62. The heat conductive film 18 is connected to the constant temperature part 51. In the present embodiment, copper is used as the heat conductive film 18.

  The other main surface 61 of the substrate 6 is provided with a heater section 4 for heating the piezoelectric vibrator 2 and a transistor 41 for the heater section 4 as shown in FIGS. In the present embodiment, a film resistor is used as the heater unit 4.

  Further, as shown in FIG. 5, a plurality of via holes 64 penetrating from the one main surface 60 of the substrate 6 on the constant temperature part 51 to the constant temperature part 51 are formed in the substrate 6. In the via hole 64, the heater part 4 is connected to the constant temperature part 51 through the via hole 64, and heat from the heater part 4 is transmitted to the constant temperature part 51. Further, a hole 65 penetrating from one main surface 60 to the other main surface 61 is formed on the outer periphery in plan view of the substrate 6, and an external lead terminal 93 is inserted into the hole 65 as shown in FIG. 1.

  In the thermostatic chamber type piezoelectric oscillator 1, the thermostatic chamber 5 is constituted by the thermostatic section 51 and the metal case 52. In the thermostatic chamber 5, the piezoelectric vibrator 2 and the oscillating portion 31 disposed on one main surface 60 of the substrate 6 are sealed, and the piezoelectric vibrator 2 is maintained at a predetermined temperature. As shown in FIG. 1, the heater unit 4 is disposed outside the thermostat 5, and the sensor unit 7 is disposed inside the thermostat 5.

  Next, the manufacturing process of the thermostat-type piezoelectric oscillator 1 will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the oscillation unit 31 and the sensor unit 7 are mounted on one main surface 60 of the substrate 6, and the heater unit 4 and the transistor 41 are mounted on the other main surface 61 of the substrate 6. After mounting these constituent members on the substrate 6, as shown in FIG. 5, the tip portion 22 of the lead terminal 21 is arranged on the mounting portion 63, and the lead is formed using the bonding material 8 (solder or conductive adhesive or the like). The terminal 21 is electrically connected to the substrate 6 and mechanically joined, and the piezoelectric vibrator 2 is mounted on the substrate 6. After mounting the piezoelectric vibrator 2, the protruding piece 54 of the metal case 52 is fitted into the joint portion 62 and joined using the joining material 28 (for example, solder or heat conductive resin). At this time, the protruding piece 54 is connected to the constant temperature part 51 through the heat conductive film 18. Then, the hole 65 of the substrate 6 is inserted into the external lead terminal 93 provided in the base 92 and the external lead terminal 93 is joined to the hole 65 using solder or the like. Thereafter, the protective case 91 is put on the base 92, and the protective case 91 and the base 92 are joined, and by this joining, the constituent members of the thermostatic chamber type piezoelectric oscillator 1 (piezoelectric vibrator 2, oscillating unit 31, substrate 6, A metal case 52 and the like) are sealed in the main body housing 9 to manufacture the thermostatic chamber type piezoelectric oscillator 1.

  According to the thermostatic chamber type piezoelectric oscillator 1 according to the present embodiment, the thermostatic chamber 5 is composed of the metal case 52 and the thermostatic section 51, so that it is compared with the thermostatic chamber type piezoelectric oscillator using a conventional aluminum block as the thermostatic chamber. Thus, the manufacturing procedure is simplified and the manufacturing cost is kept low. In addition, a metal case 52 that seals the piezoelectric vibrator 2 and the oscillating portion 31 (including the piezoelectric vibrator 2 and the oscillating portion 31) is provided on one main surface 60, and the metal case 52 and the constant temperature portion 51 Since the thermostatic chamber 5 for sealing the piezoelectric vibrator 2 and the oscillating unit 31 is configured, the main body housing of the thermostatic chamber type piezoelectric oscillator 1 is compared with a conventional thermostatic chamber type piezoelectric oscillator in which a thermostatic chamber is separately provided. It can be reduced in height and size.

  In addition, since the heater unit 4 is arranged outside the thermostat 5, the heater unit 4 is arranged inside the thermostat 5 to prevent the heater unit 4 from causing a steep thermal gradient inside the thermostat 5. it can.

  Further, since the sensor unit 7 is disposed inside the thermostatic chamber 5, the sensor unit 7 can be disposed in the vicinity of the piezoelectric vibrator 2 to accurately detect the temperature of the piezoelectric vibrator 2.

  In addition, since the joint portion 62 is formed on one main surface 60 of the substrate 6, the joint portion 62 has a concave shape, and the protruding piece 54 is provided on the metal case 52, the joint portion 62 is the other main surface of the substrate 6. Exposure to 61 can be prevented. Thereby, it can prevent reliably that the heat | fever in the thermostat 5 is discharge | released to the outer side of the thermostat 5 from the junction part 62, and the temperature in the thermostat 5 can be stabilized, As a result, power consumption is reduced. be able to.

  Moreover, since the thermostat 51 is a flat pattern, the heat in the thermostat 5 can be stabilized.

  The substrate 6 is a resin substrate. Thereby, since the heat conductivity of the board | substrate 6 is comparatively low, the thermal radiation from the inside of the thermostat 5 to the outer side of the thermostat 5 through the board | substrate 6 can be reduced, and power consumption can be reduced.

  In addition, the piezoelectric vibrator 2 is provided with a lead terminal 21, a mounting portion 63 is provided on the substrate 6, and the distal end portion 22 of the lead terminal 21 is disposed in the mounting portion 63. In this state, it can be kept at a predetermined temperature. Further, in the manufacturing process of the thermostatic chamber type piezoelectric oscillator 1 according to the present embodiment, the mounting position of the distal end portion 22 of the lead terminal 21 can be determined with reference to the mounting portion 63 of the substrate 6, and the piezoelectric vibrator 2 is mounted on the substrate. 6 is easy to position.

  Further, since the mounting portion 63 is formed in a concave shape on the one main surface 60 of the substrate 6 on the constant temperature portion 51, the tip portion 22 of the lead terminal 21 can be disposed in the vicinity of the constant temperature portion 51, and as a result, Heat from the constant temperature unit 51 can be directly transmitted to the crystal vibrating piece of the piezoelectric vibrator 2 via the lead terminal 21.

  In addition, the main body housing 9 of the thermostatic chamber type piezoelectric oscillator 1 seals the constituent members (for example, the piezoelectric vibrator 2, the oscillating portion 31, the metal case 52, the substrate 6, and the thermostatic bath 5). It can be protected from external environment such as external force and external force such as impact.

  Further, in the present embodiment, since the joint portion 62 is provided, unlike the above-described manufacturing process, a conductive joint material (not shown) is supplied to the joint portion 62 when the thermostatic oven type piezoelectric oscillator 1 is manufactured. In this state, the projecting piece 54 is inserted into the joint portion 62 to join the projecting piece 54 to the joint portion 62, and the metal case 52 is kept at constant temperature via the conductive joining material and the heat conducting film 18. It can be joined to the part 51.

  Moreover, in this embodiment, since the thermostat 51 is provided in the board | substrate 6, the temperature in the thermostat 5 can be stabilized, without releasing | emitting the heat of the thermostat 51 outside.

  In the present embodiment, the metal case 52 is used as the constant temperature case. However, this is a preferred example, and is not limited thereto. Any material can be used as long as the constant temperature bath 5 can be configured. It may be.

  Moreover, in this embodiment, although the concave junction part 62 is formed in the one main surface 60 of the board | substrate 6, the shape and arrangement | positioning of the junction part 62 are not limited to the form shown in FIG. Other forms shown in FIGS. 6 to 9 described below may be used. 6 to 9 are schematic plan views showing a substrate 6 according to another embodiment of the present embodiment.

  In the board | substrate 6 shown in FIG. 6, the junction part 62 is formed along each edge | side of the outer periphery of the duplication area | region A, respectively.

  In the board | substrate 6 shown in FIG. 7, the junction part 62 is each formed along the arbitrary two sides which oppose among the four sides of the outer periphery of the duplication area | region A. As shown in FIG. Each joint 62 is formed across adjacent sides. In other words, each of the joint portions 62 is formed along three continuous sides of the overlapping region A, and is formed in a [shape or] shape in plan view.

  In the substrate 6 shown in FIG. 8, four joint portions 62 are formed at each of the four corners of the overlapping region A. The joint portion 62 is formed across two sides adjacent to the corner, and is formed in an L shape in plan view.

  In the substrate 6 shown in FIG. 9, joint portions 62 having a circular shape in plan view are formed along the four sides of the outer peripheral edge of the overlapping region A.

  In the case shown in FIGS. 6 to 9, it goes without saying that the protruding piece 54 of the metal case 52 is formed in correspondence with the shape of the joint portion 62.

  Moreover, in this embodiment, although the junction part 62 consists of concave shape, the shape is not limited and the other form shown to FIG.

  In the other form shown in FIG. 10, the joining portion 62 is formed into a through-hole penetrating from one main surface 60 to the other main surface 61 of the substrate 6. FIG. 10 is a schematic configuration diagram showing the joining of the metal case 52 (projecting piece 54) to the substrate 6 provided with the joining portion 62 formed in the through hole. In this case, since the joining portion 62 is a through-hole penetrating the substrate 6, it is possible to suppress heat dissipation in which the heat in the thermostat 5 spreads outside the overlapping region A, and as a result, power consumption can be reduced. In the other form shown in FIG. 10, the heat conductive film 18 is provided from one main surface 60 to the other main surface 61 of the substrate 6 through the inner surface of the through hole. Further, the protruding piece 54 of the metal case 52 is soldered to the other main surface 61 of the substrate 6. Thereby, the metal case 52 can be easily provided on the substrate 6.

  In the case where the joint portion 62 is formed in a concave shape and the case where the joint portion 62 is formed into a through hole, the case outer surface of the metal case 52 (particularly, the protruding piece 54) is not illustrated. A gap may be maintained between the outer surface of the case and the joint portion 62 without contacting the surface. By maintaining the gap, the heat of the metal case 52 is suppressed from being transmitted from the metal case 52 to the outside of the overlapping region A of the substrate 6 and radiated to the outside through the external lead terminals 93.

  In another form shown in FIG. 11, the joining portion 62 is formed into a via hole that penetrates from one principal surface 60 to the thermostatic portion 51. The via hole is filled with a filler made of a conductive material. Further, in the embodiment shown in FIG. 11, the joint portion 62 and the metal case 52 are joined on one main surface 60 of the substrate 6. Therefore, the metal case 52 in which the protruding piece 54 of the present embodiment shown in FIG. 4 is formed cannot be used for the joint portion 62 shown in FIG. Therefore, in another embodiment shown in FIG. 11, a metal case 52 shown in FIG. 12 is used. FIG. 12 is a schematic perspective view of a metal case 52 having a form different from that in FIG.

  A metal case 52 shown in FIG. 12 is a box-like body having an opening 53 formed on one end surface. When the metal case 52 is disposed on the substrate 6, the opening 53 is formed on one main surface 60 of the substrate 6. Turn to. Further, the front end surfaces 55 of the four side plates 50 of the metal case 52 are formed wide. The front end surface 55 of the metal case 52 is bonded to the substrate 6 shown in FIG. As described above, since the front end surfaces 55 of the four side plates 50 are formed wide, the area of the metal case 52 in contact with the substrate 6 is increased, and the metal case 52 is securely connected to the substrate 6. . Note that it is desirable that the front end surface 55 be formed wide, but the front end surface 55 may not be formed wide.

  Moreover, the joining part 62 is not limited to the form shown in FIGS. 3 and 6 to 11 and can be appropriately changed. However, in order to arrange the metal case 52 on the substrate 6 more easily, the joining part 62 is used. It is preferable that the shape is small and the shape is simple, and in order to conduct heat conduction more efficiently between the metal case 52 and the constant temperature part 51, a plurality of joint parts 62 are formed along the outer peripheral edge of the overlapping region A without gaps. Is preferably formed.

  In addition, when the junction part 62 is shape | molded by the through-hole as shown in FIG. 10, by arrange | positioning the junction part 62 between the hole 65 and the overlap area | region A in which the external lead terminal 93 is inserted, an overlap area | region It is suppressed that the heat of A is transmitted to the external lead terminal 93 via the substrate 6 and radiated to the outside. Therefore, it is more preferable that the joining portion 62 is formed into a through hole as shown in FIG.

  In the present embodiment, a flat plate-like pattern is used as the constant temperature portion 51. However, the present invention is not limited to this, and other forms may be used, for example, the mesh pattern shown in FIG. May be. In this case, the material cost at the time of forming the constant temperature part 51 can be restrained low compared with the constant temperature part 51 of a flat pattern. FIG. 13 is a schematic plan view of a constant temperature part of a mesh pattern.

  Moreover, in this embodiment, although the film resistor is used as the heater part 4, it is not limited to this, For example, the other form shown to FIG. 14 and 15 are schematic configuration diagrams showing a heater unit 4 according to another embodiment of the present embodiment.

  In another form shown in FIG. 14, a heater wire such as a nichrome wire is used as the heater unit 4. This heater wire is wound around a metal case 52.

  In another embodiment shown in FIG. 15, a resin molded transistor is used as the heater unit 4. This transistor is provided in contact with the side plate 50 of the metal case 52.

  In the piezoelectric vibrator 2 according to the present embodiment, the cap 24 is not in contact with other members. However, as shown in FIG. 16, the inner wall of the metal case 52 and the cap 24 of the piezoelectric vibrator 2 are a metal piece or the like. The heat conduction piece 38 may be connected. In this case, heat is directly transmitted from the metal case 52 to the piezoelectric vibrator 2 via the heat conducting piece 38, and the piezoelectric vibrator 2 can be kept at a predetermined temperature in a stable state.

  In addition to the form shown in FIG. 16, as shown in FIG. 17, a jacket 48 having high thermal conductivity into which a part (tip portion) of the cap 24 can be inserted may be provided. In this case, heat from the constant temperature part 51 is transmitted to the piezoelectric vibrator 2 through the jacket 48, and the piezoelectric vibrator 2 can be kept at a predetermined temperature in a stable state. Note that the jacket 48 shown in FIG. 17 is bonded to one main surface 60 of the substrate 6 by a bonding material 58 such as solder. However, the jacket 48 may be joined to the constant temperature part 51.

  Further, in the present embodiment, the lead type piezoelectric vibrator 2 is used as the piezoelectric vibrator 2, but the present invention is not limited to this, and in another embodiment of the present embodiment, the thermostatic chamber type piezoelectric oscillator includes: Instead of the lead-type piezoelectric vibrator 2, a surface-mounted piezoelectric vibrator or the like may be disposed on one main surface of the substrate 6 as a surface-mounted piezoelectric device. In this case, the main body housing 9 of the thermostatic chamber type piezoelectric oscillator can be reduced in height.

  In another embodiment of the present embodiment, the thermostatic chamber type piezoelectric oscillator includes a surface mount type piezoelectric oscillator as a surface mount type piezoelectric device disposed on one main surface of the substrate 6 instead of the piezoelectric vibrator 2 and the oscillation unit 3. It may be what was done. In this case, since the surface-mounted piezoelectric device is a thin electronic component, the main body housing 9 of the thermostat-type piezoelectric oscillator 1 can be reduced in height.

  FIG. 18 shows the thermostatic chamber type piezoelectric oscillator 1 in which the surface mount type piezoelectric oscillator 20 is arranged on one main surface of the substrate 6. Thereby, the number of parts can be drastically reduced. Further, when a surface-mount type thermistor is used as the sensor unit 7, only the surface-mount type piezoelectric oscillator 20 and the sensor unit 7 (surface-mount type thermistor) need be disposed inside the thermostat 5. Lead parts can be eliminated from the inside. In this case, the main body housing 9 of the thermostat-type piezoelectric oscillator 1 can be further reduced in height.

  In the present embodiment, a temperature compensation circuit may be added to the oscillation circuit 3 formed on the substrate 6. Thereby, the frequency of the thermostat-type piezoelectric oscillator 1 becomes more stable.

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit, gist, or main features. Therefore, the above-mentioned embodiment is only a mere illustration in all points, and should not be interpreted limitedly. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Constant temperature chamber type piezoelectric oscillator 2 Piezoelectric vibrator 21 Lead terminal 3 Oscillation circuit 31 Oscillation unit 4 Heater unit 41 Transistor 5 Constant temperature chamber 51 Constant temperature unit 52 Metal case 6 Substrate 60 One main surface 61 Other main surface 62 Joining portion 63 Mounting portion 7 Sensor unit 8 Bonding material 18 Thermal conductive film 9 Body housing 91 Protective case 92 Base 93 External lead terminal

Claims (12)

A thermostatic chamber type piezoelectric oscillator,
A piezoelectric vibrator, an oscillating unit that constitutes an oscillation circuit using the piezoelectric vibrator as an oscillator, and a thermostatic chamber that maintains the piezoelectric vibrator at a predetermined temperature;
The piezoelectric vibrator and the oscillating portion are arranged on one main surface of the substrate,
Inside the substrate is provided a constant temperature portion for maintaining the piezoelectric vibrator at a predetermined temperature,
A thermostat case for sealing the piezoelectric vibrator and the oscillation unit is provided on one main surface of the substrate,
The thermostat is constituted by the thermostat and the thermostat case,
In the substrate, a bonding portion to be bonded to the constant temperature case is formed,
A protruding piece is formed to protrude from the constant temperature case, and a case outer surface of the protruding piece does not contact the bonding portion in the bonding portion, and the case outer surface of the protruding piece and the bonding portion in the bonding portion. A gap is kept between
The thermostatic piezoelectric oscillator, wherein the joint is a through-hole penetrating the substrate. The thermostatic chamber piezoelectric oscillator according to claim 1,
A heater for heating the piezoelectric vibrator is provided;
The thermostat piezoelectric oscillator, wherein the heater section is arranged outside the thermostat. The thermostatic chamber piezoelectric oscillator according to claim 1 or 2,
A sensor unit for detecting the temperature of the piezoelectric vibrator is provided,
The thermostat piezoelectric oscillator, wherein the sensor unit is disposed inside the thermostat. The thermostatic chamber piezoelectric oscillator according to any one of claims 1 to 3, wherein
The thermostat piezoelectric oscillator, wherein the joint is formed along an outer peripheral edge of a rectangular region in plan view of one main surface of the substrate on the thermostat. The thermostatic chamber type piezoelectric oscillator according to claim 4,
The junction is formed on two opposing sides of the four sides of the outer peripheral edge of the region. The thermostatic chamber type piezoelectric oscillator according to any one of claims 1 to 5,
An external connection terminal protrudes from the thermostatic chamber type piezoelectric oscillator,
A rectangular region in plan view of one principal surface of the substrate on the constant temperature portion is an overlapping region,
The thermostatic chamber piezoelectric oscillator, wherein a hole into which an external connection terminal is inserted is formed in the substrate, and the joint portion is disposed between the hole and the overlapping region. The thermostatic chamber piezoelectric oscillator according to any one of claims 1 to 6,
The thermostatic chamber piezoelectric oscillator, wherein the substrate is a resin substrate. The thermostatic chamber type piezoelectric oscillator according to any one of claims 1 to 7,
The thermostat is a flat plate pattern or a mesh pattern, and the thermostatic oven type piezoelectric oscillator. The thermostatic chamber piezoelectric oscillator according to any one of claims 1 to 8,
External connection terminals project from the piezoelectric vibrator,
A mounting portion for mounting the piezoelectric vibrator is provided on the substrate,
The constant temperature chamber type piezoelectric oscillator, wherein a distal end portion of the external connection terminal is disposed in the mounting portion. The thermostat piezoelectric oscillator according to claim 9,
The thermostatic chamber type piezoelectric oscillator, wherein the mounting portion is formed in a concave shape on one main surface of the substrate on the constant temperature portion. The thermostatic chamber piezoelectric oscillator according to any one of claims 1 to 10, wherein
The main body housing of the thermostatic chamber type piezoelectric oscillator seals the piezoelectric vibrator, the oscillation unit, the thermostatic case, the substrate, and the thermostatic chamber. A thermostat-type piezoelectric oscillator according to any one of claims 1 to 11,
A thermostatic chamber type piezoelectric oscillator, wherein a surface-mount type piezoelectric device is arranged on one main surface of the substrate in place of the piezoelectric vibrator or in place of the piezoelectric vibrator and the oscillating portion.

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