JP2014157982A - Group iii nitride composite substrate, method for manufacturing the same, lamination group iii nitride composite substrate, group iii nitride semiconductor device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a group III nitride composition substrate which can be manufactured at low costs and has a group III nitride film having a large diameter, a preferred thickness and high crystal quality, a method for the same, a lamination group III nitride composition substrate, a group III nitride semiconductor device and a method for manufacturing the same.SOLUTION: A group III nitride composite substrate is a group III nitride composite substrate in which a diameter where a support substrate is stuck to a group III nitride film having a thickness of ≥10 μm and ≤250 μm, is equal to or more than 75 mm, and has a bond film arranged between the support substrate and the group III nitride film and bonding the support substrate to the group III nitride film. A thickness distribution of the bond film is equal to or more than 2% and equal to or less than 40%.

Description

  The present invention relates to a group III nitride composite substrate and a manufacturing method thereof, a laminated group III nitride composite substrate, a group III nitride semiconductor device, and a manufacturing method thereof.

  Group III nitrides such as GaN are suitably used for semiconductor devices because they have excellent semiconductor properties.

  For example, Japanese Unexamined Patent Application Publication No. 2009-126722 (Patent Document 1) discloses a self-standing group III nitride substrate having a diameter of 25 mm to 160 mm and a thickness of 100 μm to 1000 μm as a semiconductor device substrate, as a specific example. A self-standing GaN substrate having a diameter of 10 mm and a thickness of 400 μm is disclosed.

  Japanese Patent Laid-Open No. 2008-010766 (Patent Document 2) discloses that a substrate for manufacturing a semiconductor device is a heterogeneous substrate having a chemical composition different from that of GaN, and 0.1 μm or more and 100 μm or less bonded to the heterogeneous substrate. A GaN thin film bonded substrate including a GaN thin film having a thickness, and as a specific example, a GaN thin film bonded to a sapphire substrate and a GaN thin film having a thickness of 0.1 μm or 100 μm is bonded to a GaN thin film having a diameter of 50.8 mm. A laminated substrate is disclosed.

JP 2009-126722 A JP 2008-010766 A

  However, the self-supporting group III nitride substrate disclosed in Patent Document 1 is very expensive. This is mainly because group III nitrides do not form a liquid phase, so a liquid phase growth method, which is an inexpensive manufacturing method, cannot be employed, and a low-yield vapor phase growth method must be employed. Because. Group III nitride is a material that has low fracture toughness and is very fragile. For this reason, it is difficult to increase the diameter of the substrate. Further, if the thickness of the substrate is reduced to, for example, about 250 μm in order to reduce the manufacturing cost, the substrate is likely to be warped, and the crystal quality is reduced in the process of growing the epitaxial layer on the substrate. In some cases, peeling occurs, and the manufacturing yield of the semiconductor device is reduced. Therefore, it has been difficult to increase the added value of the semiconductor device.

  On the other hand, a bonded substrate as shown in Patent Document 2 can reduce the amount of expensive group III nitride used, and can reduce the manufacturing cost of the semiconductor device.

  By the way, from the viewpoint of obtaining good semiconductor device characteristics, the thickness of the base group III nitride film is preferably 10 μm or more. However, in the conventional bonded substrate as disclosed in Patent Document 2, the thickness of the group III nitride film is limited to about 1 μm. In a bonded substrate as shown in Patent Document 2, after bonding a heterogeneous substrate and a GaN bulk crystal, the GaN bulk crystal is divided by an ion implantation method to form a GaN thin film. There are certain restrictions on the ion implantation depth, and when trying to obtain a group III nitride film of 10 μm or more, the ion implantation depth varies, and as a result, the thickness of the group III nitride film is reduced. This is because there is variation, and sufficient quality cannot be ensured. That is, in the conventional bonded substrate as disclosed in Patent Document 2, when the thickness of the group III nitride film is 10 μm or more, the characteristics of the semiconductor device and the manufacturing yield of the semiconductor device should be sufficient. I can't.

  Further, in the conventional bonded substrate as disclosed in Patent Document 2, a group III nitride of 10 μm or more is obtained by cutting and separating a group III nitride film using, for example, a wire saw instead of an ion implantation method. When trying to obtain a bonded substrate having a nitride film, the substrate is likely to be warped or cracked. In this case as well, it is difficult to grow a good-quality epitaxial layer on the group III nitride film. there were.

  As described above, depending on a conventionally known technique, the group III nitride film has a suitable thickness range, and it is possible to obtain good semiconductor device characteristics while reducing the amount of expensive group III nitride used. It was extremely difficult to obtain a group III nitride composite substrate.

  The present invention solves the above problems, and can be manufactured at low cost, and has a group III nitride composite substrate having a group III nitride film having a large diameter and a suitable thickness and high crystal quality, and It is an object to provide a manufacturing method thereof, a laminated group III nitride composite substrate, a group III nitride semiconductor device, and a manufacturing method thereof.

  According to an aspect of the present invention, there is provided a group III nitride composite substrate having a diameter of 75 mm or more in which a support substrate and a group III nitride film having a thickness of 10 μm or more and 250 μm or less are bonded to each other. A bonding film is provided between the substrate and the group III nitride film to bond the support substrate and the group III nitride film, and the bonding film has a thickness distribution of 2% to 40%. This is a group III nitride composite substrate.

  According to another aspect of the present invention, there is provided a group III nitride composite substrate having a diameter of 75 mm or more obtained by bonding a supporting substrate and a group III nitride film having a thickness of 10 μm or more and 250 μm or less, A bonding film that is interposed between the support substrate and the group III nitride film and bonds the support substrate and the group III nitride film; and a shear bonding between the support substrate and the group III nitride film. This is a group III nitride composite substrate having a strength of 4 MPa or more and 40 MPa or less and a bonding area ratio between the support substrate and the group III nitride film of 60% or more and 99% or less.

In the group III nitride composite substrate according to these aspects of the present invention, the ratio α _III-N / α _S of the thermal expansion coefficient α _III-N of the group III nitride film to the thermal expansion coefficient α _S of the support substrate is 0. The ratio t _III-N / t _S of the thickness t _III-N of the group III nitride film to the thickness t _S of the support substrate is 0.02 or more and 1 or less. be able to.

The thermal conductivity lambda _S of the support substrate may be a less 3W · m ^-1 · K ^-1 or more 280W · m ^-1 · K ^-1.

The Young's modulus E _S of the support substrate may be a less 500GPa least 150 GPa.

  Furthermore, the diameter of the group III nitride composite substrate may be 125 mm or more and 300 mm or less.

  According to still another aspect of the present invention, the group III nitride composite substrate according to the above aspect and at least one layer disposed on the main surface of the group III nitride composite substrate on the group III nitride film side And a group III nitride layer of the laminated group III nitride composite substrate.

  According to still another aspect of the present invention, the group III nitride film in the group III nitride composite substrate according to the above aspect and at least one layer of group III nitride disposed on the group III nitride film are provided. A group III nitride semiconductor device including a physical layer.

  According to still another aspect of the present invention, there is provided a method for producing a group III nitride composite substrate according to the above aspect, wherein a diameter of 75 mm is obtained by laminating a support substrate and a group III nitride film donor substrate. Cutting the group III nitride film donor substrate at a surface located at a predetermined distance from the bonding main surface of the group III nitride film donor substrate of the bond substrate, and the step of forming the above bonded substrate And a step of forming the group III nitride composite substrate.

  According to still another aspect of the present invention, there is provided a method for producing a group III nitride composite substrate according to the above aspect, wherein a diameter of 75 mm is obtained by laminating a support substrate and a group III nitride film donor substrate. By performing at least one of grinding, polishing, and etching from the main surface of the bonding substrate opposite to the bonding main surface of the group III nitride film donor substrate, the above-described bonding substrate is formed. Forming a group III nitride composite substrate. A method for manufacturing a group III nitride composite substrate.

  According to another aspect of the present invention, a step of preparing a group III nitride composite substrate, and at least one group III nitride layer on the group III nitride film of the group III nitride composite substrate are provided. A method for producing a group III nitride semiconductor device.

  The method of manufacturing a group III nitride semiconductor device according to this aspect of the present invention includes a step of further bonding a device support substrate on the group III nitride layer, and a step of removing the support substrate from the group III nitride composite substrate. And can be further included.

  According to the present invention, a group III nitride composite substrate having a group III nitride film having a large diameter and a suitable thickness and having a high crystal quality, a method for manufacturing the same, and a laminate can be manufactured at low cost. A group III nitride composite substrate, a group III nitride semiconductor device, and a manufacturing method thereof can be provided.

It is a schematic sectional drawing which shows an example of the group III nitride composite substrate concerning this invention. It is a schematic sectional drawing which shows an example of the laminated group III nitride composite substrate concerning this invention. It is a schematic sectional drawing which shows an example of the group III nitride semiconductor device concerning this invention. It is a schematic sectional drawing which shows an example of the group III nitride semiconductor device concerning this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the group III nitride composite substrate concerning this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the group III nitride composite substrate concerning this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the group III nitride semiconductor device concerning this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the group III nitride semiconductor device concerning this invention.

[Embodiment 1: Group III nitride composite substrate]
With reference to FIG. 1, the group III nitride composite substrate 1 which is Embodiment 1 is demonstrated. The group III nitride composite substrate 1 is a substrate having a diameter of 75 mm or more obtained by bonding a support substrate 11 and a group III nitride film 13 having a thickness of 10 μm or more and 250 μm or less. The group III nitride composite substrate 1 includes a bonding film 12 interposed between the support substrate 11 and the group III nitride film 13 and bonding the support substrate 11 and the group III nitride film 13. The bonding film 12 has a thickness distribution of 2% to 40%.

  Further, the group III nitride composite substrate 1 according to the present embodiment has a shear bonding strength between the support substrate 11 and the group III nitride film 13 bonded by the bonding film 12 of 4 MPa to 40 MPa, and the support substrate. 11 and the group III nitride film 13 have a junction area ratio of 60% to 99%.

  This embodiment is a composite substrate in which a group III nitride film 13 is bonded to a support substrate 11 unlike a conventional free-standing group III nitride substrate. By adopting such a configuration, the thickness of the expensive group III nitride film can be reduced, and the cost of the semiconductor device can be reduced.

  Furthermore, unlike the conventional bonded substrate, this embodiment has a large diameter of 75 mm or more, and the thickness of the group III nitride film 13 is 10 μm or more and 250 μm or less. Thereby, extremely good semiconductor device characteristics can be obtained using the group III nitride composite substrate of the present embodiment.

  In such a configuration, the thickness distribution of the bonding film 12 is 2% or more and 40% or less, or the shear bonding strength between the support substrate 11 and the group III nitride film 13 is 4 MPa or more and 40 MPa or less, and the support substrate 11. And the group III nitride film 13 can be realized by having a junction area ratio of 60% or more and 99% or less.

  By providing the bonding film 12 whose thickness distribution is controlled within a specific range, the thickness of the group III nitride film 13 is cut and separated by, for example, a wire saw in a large-diameter substrate having a diameter of 75 mm or more. As a result, even when the thickness is 10 μm or more and 250 μm or less, in the semiconductor device process for forming an epitaxial layer on the group III nitride film 13, heat from the susceptor on which the substrate is mounted is uniformly conducted in the film. Therefore, an epitaxial layer having a good thickness distribution and high crystal quality can be obtained, and thus the manufacturing yield of semiconductor devices can be increased.

  Further, by controlling the bonding strength and the bonding area ratio between the support substrate 11 and the group III nitride film 13 within a specific range, the stress applied to the bonding film can be relieved and the occurrence of warpage can be suppressed. Thus, the manufacturing yield of semiconductor devices can be increased.

  Note that the group III nitride composite substrate 1 according to the present embodiment has the characteristics of the thickness distribution of the bonding film 12, the bonding strength between the support substrate 11 and the group III nitride film 13, and the bonding area ratio. By having at least one of the characteristics, the manufacturing yield of the semiconductor device can be increased and the characteristics of the semiconductor device can be improved. When the group III nitride composite substrate 1 has both characteristics, these effects work synergistically and the effects of the present invention can be further enhanced, which is particularly preferable.

(Diameter of group III nitride composite substrate)
The diameter of the group III nitride composite substrate 1 is 75 mm or more, preferably 100 mm or more, more preferably 125 mm or more, and more preferably 150 mm or more from the viewpoint of increasing the number of chips of a semiconductor device from one composite substrate. preferable. Further, the diameter of the group III nitride composite substrate 1 is preferably 300 mm or less, and more preferably 200 mm or less, from the viewpoint of reducing the warpage of the composite substrate and increasing the yield of the semiconductor device.

Hereinafter, each part which comprises the group III nitride composite substrate 1 which is this embodiment is demonstrated.
(Bonding film)
The bonding film 12 of the present embodiment absorbs and relaxes the unevenness of the bonding surface of the support substrate 11 and the group III nitride film 13 and increases the bonding strength between the support substrate 11 and the group III nitride film 13. Have

The bonding film 12 is not particularly limited as long as it can bond the support substrate 11 and the group III nitride film 13, but from the viewpoint of high bondability between the support substrate 11 and the group III nitride film 13, the SiO ₂ film Si ₃ N ₄ film, TiO ₂ film, Ga ₂ O ₃ film and the like are preferable. The average thickness of the bonding film 12 is not particularly limited, but can be, for example, about 100 nm to 4 μm.

(Thickness distribution of bonding film)
In the present embodiment, the thickness distribution of the bonding film 12 is 2% or more and 40% or less. Here, the “thickness distribution” is an index indicating the uniformity of the thickness of the bonding film 12. Of the thicknesses measured over the entire surface of the main surface of the bonding film 12, the “thickness distribution” It is a value calculated by the following equation from the “maximum value t _max ” and the “minimum thickness value t _min ”.

Formula: thickness distribution (%) = {(t _max −t _min ) / (t _max + t _min )} × 100
Here, the reference surface for the thickness of the bonding film can be, for example, the main surface 11 m of the support substrate 11. The thickness measurement points are preferably at least 13, and the intervals between adjacent measurement points are preferably substantially uniform.

  The thickness of the bonding film can be measured by a conventionally known optical interference type film thickness meter, level difference meter or the like. The thickness can also be measured by observing a cross section perpendicular to the main surface of the bonding film 12 with a scanning electron microscope (SEM).

  When the thickness distribution is less than 2%, when the epitaxial layer is grown, the heat conduction from the susceptor on which the substrate is mounted becomes non-uniform, and the central portion and the outer peripheral portion are deformed by warping the substrate in a concave shape. As a result, the quality difference of the semiconductor device cannot be grown, so that a high-quality epitaxial layer cannot be grown, the manufacturing yield of the semiconductor device is lowered, and the characteristics of the semiconductor device are lowered. When the thickness distribution exceeds 40%, the thin region of the bonding film and the region where the bonding film has disappeared (that is, the non-bonded region) increase. In this case as well, a high-quality epitaxial layer can be grown. Therefore, the manufacturing yield of semiconductor devices is reduced. Therefore, the thickness distribution of the bonding film of this embodiment is 2% or more and 40% or less. When the thickness distribution of the bonding film 12 occupies this range, the temperature distribution of the entire composite substrate is made uniform during epitaxial growth, and an excellent effect that a high-quality epitaxial layer having high crystal quality can be grown is exhibited. The thickness distribution is more preferably 5% or more and 25% or less, and further preferably 7% or more and 16% or less. When the thickness distribution occupies this range, the uniformity of the thickness of the bonding film can be further increased, and the crystal quality of the epitaxial layer formed on the group III nitride film 13 can be further enhanced. .

  The thickness distribution of the bonding film is controlled within a desired range by appropriately adjusting the conditions when the surface of the bonding film is chemically mechanically polished (hereinafter also referred to as “CMP (chemical mechanical polishing)”), for example. Can do. Examples of such conditions include the material of the abrasive, the linear velocity of polishing, and the material of the polishing pad.

(Shear bond strength)
In this embodiment, the shear bonding strength between the support substrate 11 and the group III nitride film 13 bonded by the bonding film 12 is 4 MPa or more and 40 MPa or less. When the shear bonding strength occupies this range, in the semiconductor device manufacturing process, the substrate is not peeled and the warpage of the substrate is alleviated, so that the manufacturing yield of the semiconductor device is remarkably improved. Such shear bonding strength is more preferably 10 MPa or more and 30 MPa or less. In this case, it is preferable because the effect of reducing the warpage of the substrate tends to be further increased. When the shear bonding strength is less than 4 MPa, the bonding strength is not sufficient, and during the epitaxial growth, the substrate is peeled off due to the deformation of the substrate due to the heat conduction from the susceptor on which the substrate is mounted, and the manufacturing yield of semiconductor devices is reduced. descend. When the shear bonding strength exceeds 40 MPa, the stress applied to the bonding film 12 increases, and the warpage of the substrate tends to be promoted, and the manufacturing yield of the semiconductor device decreases.

In the present embodiment, the shear bond strength can be measured by a method based on JIS K 6850 “Tensile Shear Adhesive Strength Test Method for Rigid Adhering Materials” using a die shear tester, a tensile tester, or the like. . That is, a rectangular composite substrate (6 mm long × 8 mm wide) was prepared as a measurement sample, and the composite substrate was placed flat on the sample stage of the testing machine with the support substrate side down, and then 9 mm wide. Maximum shear load when a load is applied to a group III nitride film in a test jig in a direction parallel to the joint surface between the support substrate and the group III nitride film (ie, shear direction) and the joint surface is broken. Measure. Then, the shear joint strength is calculated by dividing the maximum shear load by the area of the joint surface (4.8 × 10 ⁻⁵ m ² ).

As a method for setting the shear bonding strength between the support substrate 11 and the group III nitride film 13 to 4 MPa or more and 40 MPa or less, for example, a method of performing an annealing process before and after the support substrate 11 and the group III nitride film 13 are bonded is preferable. Can be used. That is, after forming a bonding film on one main surface of each of the support substrate 11 and the group III nitride film 13, the support substrate 11 and the group III nitride film 13 are annealed, respectively, A method in which the annealing treatment is performed again after the group III nitride film 13 is bonded through the bonding film is preferable.

  The annealing conditions are preferably 400 ° C. or higher for 1 hour or longer in a nitrogen atmosphere, more preferably 600 ° C. or higher and 1 hour or longer in a nitrogen atmosphere, and particularly preferably 800 ° C. or higher in a nitrogen atmosphere. 1 hour or more.

  Here, from the viewpoint of the quality of the bonding film, the temperature condition of the annealing treatment is preferably 1200 ° C. or less, and the treatment time is preferably 48 hours or less.

  The shear bonding strength can also be controlled by the surface state (that is, surface roughness) of the bonding film before bonding.

(Joint area ratio)
As described above, the group III nitride composite substrate 1 of the present embodiment has a shear bonding strength between the support substrate 11 and the group III nitride film 13 of 4 MPa to 40 MPa, and the support substrate 11 and the group III nitride. It is necessary that the bonding area ratio with the film 13 is 60% or more and 99% or less. As described above, by defining the relationship between the support substrate 11 and the group III nitride film 13 from two viewpoints, the group III nitride composite substrate 1 of the present embodiment has a remarkable substrate warpage during epitaxial growth. Therefore, it is possible to grow a high-quality epitaxial layer with reduced flatness. Moreover, this has the outstanding effect that the frequency of occurrence of substrate peeling is extremely low and the manufacturing yield of semiconductor devices is high in the manufacturing process of semiconductor devices. When the junction area ratio is less than 60%, the frequency of occurrence of substrate peeling is high in the epitaxial growth process and the semiconductor device manufacturing process, and the manufacturing yield of the semiconductor devices is reduced. When the bonding area ratio exceeds 99%, the stress applied to the bonding film 12 is increased, and the substrate is likely to be warped. In this case also, the manufacturing yield of the semiconductor device is lowered.

  Here, in this embodiment, the “bonding area ratio” is a bonding defect (void or delamination) when the bonding film 12 which is a bonding surface between the support substrate 11 and the group III nitride film 13 is observed with an ultrasonic microscope. ) Is a value obtained by dividing the sum of the areas detected as) by the area of the main surface 11 m of the support substrate 11 and multiplying by 100. Such a bonding area ratio is more preferably 70% or more and 90% or less, and further preferably 80% or more and 86% or less. When the bonding area ratio occupies this range, the stress applied to the bonding film 12 is greatly relaxed, and the manufacturing yield of semiconductor devices can be further increased.

  As a method of setting the bonding area ratio to 60% or more and 99% or less, for example, a method of cleaning the surface of the bonding film 12 can be used. Specifically, a method of ultrasonically cleaning the surface of the bonding film 12 with water after removing dirt on the surface by CMP can be suitably used. Further, as a more preferable method, a method is used in which the stain on the surface of the bonding film 12 is removed by CMP, and then the stain is further removed by abrasive-free polishing cleaning using a chemical solution such as a potassium hydroxide (KOH) aqueous solution or water. You can also. For example, ultrasonic cleaning and abrasive-free polishing cleaning may be used in combination.

  Note that the bonding area ratio can be more precisely controlled by setting the thickness distribution of the bonding film 12 to 2% or more and 40% or less. That is, it is particularly preferable that the thickness distribution of the bonding film 12 is 2% or more and 40% or less and the bonding area ratio is 60% or more and 99% or less.

(Support substrate)
The support substrate 11 is not particularly limited as long as it can support the group III nitride film 13, but from the viewpoint of reducing the cost by reducing the amount of expensive group III nitride used, A different composition substrate having a different composition is preferable. The support substrate 11 may be transparent or opaque, and can be appropriately selected according to the semiconductor device to be used.

As a material constituting the support substrate 11, conventionally known ceramic materials, semiconductor materials, metal materials, polycrystalline materials, single crystal materials, and the like can be used. For example, sintered materials such as aluminum nitride (AlN), spinel (MgAl ₂ O ₄ ), mullite (3Al ₂ O ₃ .2SiO _{2 to} 2Al ₂ O ₃ .SiO ₂ ), alumina (Al ₂ O ₃ ), graphite, etc. Single crystal materials such as AlN and sapphire, metal materials such as molybdenum (Mo) and tungsten (W), and alloy materials such as copper-tungsten (Cu-W).

  Further, the support substrate 11 is preferably a substrate having corrosion resistance because it may be exposed to a high temperature corrosive gas such as ammonia gas during epitaxial growth. Therefore, for example, various surface protective coatings may be attached to increase the corrosion resistance of the surface.

(The thermal conductivity of the support substrate)
Thermal conductivity lambda _s of the supporting substrate 11 is preferably 3W · m ^-1 · K ^-1 or more 280W · m ^-1 · K ^-1 or less, 5W · m ^-1 · K ^-1 or more 210W · m ^-1 · K- ¹ or less is more preferable, and 10 W · m ⁻¹ · K ⁻¹ or more and 120 W · m ⁻¹ · K ⁻¹ or less is more preferable. Here, the thermal conductivity λ _s of the support substrate 11 can be measured by a laser flash method. Support substrate having a thermal conductivity λ _s of preferably 3 W · m ⁻¹ · K ⁻¹ or more, more preferably 5 W · m ⁻¹ · K ⁻¹ or more, more preferably 10 W · m ⁻¹ · K ⁻¹ or more. The group III nitride composite substrate 1 having the main surface 13m of the group III nitride film 13 of the group III nitride composite substrate 1 efficiently generates heat from the main surface of the susceptor when the group III nitride layer is grown. Can tell. Thermal conductivity lambda _s is preferably 280W · m ^-1 · K ^-1 or less, more preferably 210W · m ^-1 · K ^-1 or less, still more preferably not more than 120W · m ^-1 · K ^-1 support substrate In the group III nitride composite substrate 1 having 11, heat from the main surface of the susceptor is grown on the entire main surface of the group III nitride film 13 of the group III nitride composite substrate 1 when the group III nitride layer is grown. Can communicate evenly. Thermal conductivity lambda _s is 280W · m ^-1 · K ^-1 or less of the supporting substrate 11, than when the heat conductivity lambda _s is used SiC substrate of approximately 300W · m ^-1 · K ^-1 as a supporting substrate, When the group III nitride layer is grown, heat from the main surface of the susceptor can be uniformly transmitted to the entire main surface of the group III nitride film 13 of the group III nitride composite substrate 1. Note that the thermal conductivity of the support substrate 11 may be different from the thermal conductivity of the group III nitride film 13.

(Coefficient of thermal expansion of support substrate)
The support substrate 11 is preferably a substrate that is difficult to break. The thermal expansion coefficient of the support substrate 11 is preferably approximate to the thermal expansion coefficient of the group III nitride film 13. Since the support substrate 11 has such properties, the group III nitride composite substrate 1 is not easily broken even when the group III nitride composite substrate 1 is heated in an epitaxial growth process, a semiconductor device manufacturing process, or the like. is there.

Specifically, the ratio α _III-N / α _S of the thermal expansion coefficient α _III-N of the group III nitride film 13 to the thermal expansion coefficient α _S of the support substrate 11 is preferably 0.75 or more and 1.25 or less. 0.8 to 1.2, more preferably 0.9 to 1.1, and particularly preferably 0.95 to 1.05.

(Thickness of support substrate 11)
The thickness of the support substrate 11 is not particularly limited, but from the viewpoint of suppressing warping or cracking of the group III nitride film 13 during heating, the thickness of the group III nitride film 13 is as follows. It is preferable to satisfy the relationship. That is, the ratio t _III-N / t _S of the thickness t _III-N of the group III nitride film 13 to the thickness t _S of the support substrate 11 is preferably 0.02 or more and 1 or less. Here, the thermal expansion coefficient ratio α _III-N / α _S is 0.75 or more and 1.25 or less, and the thickness ratio t _III-N / t _S is 0.02 or more and 1 or less. As a result, the occurrence of defects due to warping or cracking of the group III nitride film 13 can be greatly reduced in all scenes such as a composite substrate manufacturing process, an epitaxial growth process, and a semiconductor device manufacturing process. The thickness ratio t _III-N / t _S is more preferably 0.07 or more and 0.5 or less.

(Young's modulus of support substrate)
Young's modulus E _s of the support substrate 11, from the viewpoint of suppressing the occurrence of warpage when the group III nitride composite substrate 1 is heated, it is preferred that E _S is less than or equal to 500GPa least 150 GPa. E _S is tend to warp is likely to occur during the heating is less than 150 GPa, E _S is not preferable because there is a tendency that cracks or cracks at the time of heating is likely to occur and more than 500 GPa. Here, a more preferred range of E _S is not less than 200 GPa 350 GPa or less. Note that the Young's modulus of the support substrate 11 may be different from that of the group III nitride film 13, but is preferably the same level.

Among materials constituting the support substrate 11, examples of materials having a thermal expansion coefficient and Young's modulus close to those of the group III nitride film 13 include mullite (3Al ₂ O ₃ .2SiO _{2 to} 2Al ₂ O ₃ .SiO _{2). 2} ), sintered body of mullite-YSZ (yttria stabilized zirconia), spinel (MgAl ₂ O ₄ ), Al ₂ O ₃ —SiO ₂ composite oxide, and oxides, nitrides, carbonates, etc. A substrate formed by the added sintered body, a molybdenum (Mo) substrate, a tungsten (W) substrate, and the like can be given. Here, the elements contained in oxide, nitride and carbonate are Ca, Mg, Sr, Ba, Al, Sc, Y, Ce, Pr, Si, Ti, Zr, V, Nb, Ta, Cr, Mn Fe, Co, Ni, Cu, Zn and the like are preferable.

(Group III nitride film)
The group III nitride film 13 is a film formed of group III nitride, and is an In _x Al _y Ga _1-xy N film (0 ≦ x, 0 ≦ y, x + y ≦ 1) such as a GaN film or an AlN film. Etc.

  The thickness of the group III nitride film 13 is not less than 10 μm and not more than 250 μm. When the thickness is less than 10 μm, sufficient semiconductor device characteristics tend not to be obtained. On the other hand, if the thickness exceeds 250 μm, the amount of expensive group III nitride used increases, making it difficult to increase the added value of the semiconductor device. The thickness of the group III nitride film 13 is preferably 30 μm or more, more preferably 80 μm or more, and particularly preferably 100 μm or more from the viewpoint of improving the semiconductor device characteristics. The thickness is preferably 200 μm or less, more preferably 180 μm or less, and particularly preferably 130 μm or less from the viewpoint of high added value of the semiconductor device.

  The crystal structure of the group III nitride film 13 is preferably a wurtzite structure from the viewpoint of obtaining a semiconductor device having good characteristics. The predetermined plane orientation that the principal surface of the group III nitride film 13 is closest to is not limited as long as it is suitable for a desired semiconductor device, and is {0001}, {10-10}, {11-20 }, {21-30}, {20-21}, {10-11}, {11-22}, {22-43}, and their respective plane orientations are shifted by an angle of 15 ° or less (15 It may be a plane orientation that was turned off below °. Further, the surface orientation of the back surface of each of these surface orientations and the surface orientation turned off at 15 ° or less from the surface orientation of the back surface may be used. That is, the group III nitride film 13 may be any of a polar surface, a nonpolar surface, and a semipolar surface. Further, the main surface of the group III nitride film 13 is preferably the {0001} plane and its back surface from the viewpoint that it is easy to increase the diameter, and {10-10 from the viewpoint of suppressing the blue shift of the resulting light emitting device. } Surface, {20-21} surface and their back surfaces are preferred.

From the viewpoint of improving the crystal quality of the group III nitride layer grown on the group III nitride film 13 and improving the characteristics of the semiconductor device to be formed, the impurity metal atoms in the main surface 13m of the group III nitride film 13 are 3 × 10 ¹² atoms / cm ² or less is preferable, 1 × 10 ¹² atoms / cm ² or less is more preferable, and 1 × 10 ¹¹ atoms / cm ² or less is more preferable. As the supporting substrate 11, mullite _{(3Al 2 O 3 · 2SiO 2} ~2Al 2 O 3 · SiO 2), mullite -YSZ (yttria stabilized zirconia), spinel _{(MgAl 2 O 4), Al} 2 O 3 -SiO 2 system The group III nitride composite substrate 1 including a substrate such as a composite oxide sintered body is cleaned while suppressing elution of metal atoms from the support substrate 11, for example, scrub cleaning using a surfactant and pure water, The concentration of impurity metal atoms on the main surface 13m of the group III nitride film 13 is preferably reduced by two-fluid cleaning, megasonic cleaning, single-sided single-wafer cleaning using a low concentration acid or alkali, and the like.

In addition, other impurities on the main surface 13m of the group III nitride film 13 improve the crystal quality of the group III nitride layer grown on the group III nitride film 13 and improve the characteristics of the semiconductor device to be formed. , Cl atoms are preferably 2 × 10 ¹⁴ atoms / cm ² or less, and Si atoms are preferably 9 × 10 ¹³ atoms / cm ² or less. The dislocation density of group III nitride film 13 is not particularly limited, but is preferably 1 × 10 ⁸ cm ⁻² or less from the viewpoint of reducing the leakage current of the semiconductor device. The carrier concentration of group III nitride film 13 is not particularly limited, but is preferably 1 × 10 ¹⁷ cm ⁻³ or more from the viewpoint of reducing the resistance of the semiconductor device.

  The group III nitride composite substrate described above can be manufactured by the following manufacturing method. That is, a group III nitride composite substrate obtained by the following manufacturing method can be manufactured at a low cost, and has a large diameter, a suitable thickness, and a high crystal quality Group III nitride film. It is a group III nitride composite substrate.

[Embodiment 2: Manufacturing Method of Group III Nitride Composite Substrate]
Hereinafter, with reference to FIGS. 5 and 6, a method for manufacturing the group III nitride composite substrate 1 according to the second embodiment will be described. The manufacturing method of the group III nitride composite substrate 1 is not particularly limited as long as the group III nitride film 13 is disposed on the main surface 11m side of the support substrate 11, and the following first and second methods are mentioned. It is done.

  In the first method, as shown in FIG. 5, after group III nitride film donor substrate 13D is bonded to main surface 11m of support substrate 11, group III nitride film donor substrate 13D is bonded to the predetermined surface from the bonded surface. In this method, the group III nitride film 13 is formed on the main surface 11m of the support substrate 11 by cutting at a depth of 3 mm.

  In the second method, as shown in FIG. 6, after the group III nitride film donor substrate 13D is bonded to the main surface 11m of the support substrate 11, the group III nitride film donor substrate 13D is opposite to the bonded surface. In this method, the group III nitride film 13 is formed on the main surface 11m of the support substrate 11 by adjusting the thickness from the main surface on the side by decreasing the thickness by at least one of grinding, polishing and etching.

  In the first and second methods described above, the group III nitride film donor substrate 13D is bonded to the support substrate 11 with a bonding film 12 interposed between the main surface 11m of the support substrate 11 and the group III nitride film. Examples thereof include a method of bonding the donor substrate 13D (see FIGS. 5 and 6).

  5 and 6 show a method of forming the bonding film 12a on the support substrate 11 and forming the bonding film 12b on the group III nitride film 13 and bonding them together. Even if the bonding film 12 is formed only on the substrate 11 and bonded to the group III nitride film 13, there is no problem.

(First method: cutting method)
The method of manufacturing the composite substrate by the first method shown in FIG. 5 is not particularly limited, but from the viewpoint of efficiently manufacturing the composite substrate, the support substrate 11 and the group III nitride film donor substrate 13D are pasted. In addition, the bonding substrate 1L is formed at a predetermined depth from the main surface 13n, which is a bonding surface of the group III nitride film donor substrate 13D of the bonding substrate 1L (FIG. 5A) and the step of forming the bonding substrate 1L. And a step of cutting along the plane (FIG. 5B).

Here, the support substrate 11 is not particularly limited. For example, MO _x that is an oxide containing the metal element M (x is an arbitrary positive real number), Al ₂ O ₃ that is an oxide containing Al, and Si It can be obtained by polishing a main surface of a substrate obtained by cutting a sintered body obtained by mixing and sintering SiO ₂ , which is an oxide containing, to a predetermined size.

  The group III nitride film donor substrate 13D is a donor substrate that provides the group III nitride film 13 by separation in a later step. The group III nitride film donor substrate 13D is formed by MOCVD (metal organic chemical vapor deposition), sputtering, MBE (molecular beam epitaxy), PLD (pulse laser deposition), HVPE (hydride). Vapor phase epitaxy) method, sublimation method, flux method, high nitrogen pressure solution method and the like can be suitably used.

  As shown in FIG. 5A, in the step of bonding the support substrate 11 and the group III nitride film donor substrate 13D to form the bonding substrate 1L, the bonding film 12a is formed on the main surface 11m of the support substrate 11. A sub-process (FIG. 5 (A1)), a sub-process (FIG. 5 (A2)) for forming the bonding film 12b on the main surface 13n of the group III nitride film donor substrate 13D, and a main surface 11m of the support substrate 11 A sub-process (FIG. 5 (A3)) for bonding the bonding film 12a formed thereon and the bonding film 12b formed on the main surface 13n of the group III nitride film donor substrate 13D. By these sub-processes, the bonding film 12a and the bonding film 12b bonded together are integrated by bonding to form the bonding film 12, and the support substrate 11 and the group III nitride film donor substrate 13D are bonded to the bonding film 12. The bonded substrate 1 </ b> L is formed by bonding with the substrate interposed therebetween.

Here, the method of forming the bonding films 12a and 12b is not particularly limited, but from the viewpoint of suppressing the film formation cost, a sputtering method, a vapor deposition method, a CVD (chemical vapor deposition) method, or the like is preferably performed. In addition, the method for bonding the bonding film 12a and the bonding film 12b is not particularly limited, and the bonding surface is washed and bonded as it is, and then heated to about 600 ° C. to 1200 ° C. for bonding, A surface activated bonding method in which the bonded surface is cleaned and activated with plasma or ions and then bonded in a low temperature atmosphere of room temperature (for example, 25 ° C.) to 400 ° C., and the bonded surface is cleaned with a chemical solution and pure water. After that, a high pressure bonding method in which a pressure of about 0.1 MPa to 10 MPa is applied and the bonded surface is washed with a chemical solution and pure water, and then in a high vacuum atmosphere of about 10 ⁻⁶ Pa to 10 ⁻³ Pa. An ultra-high vacuum bonding method for bonding is preferable. In any of the above bonding methods, the bonding strength can be further increased by raising the temperature to about 600 ° C. to 1200 ° C. after the bonding. In particular, in the surface activated bonding method, the high pressure bonding method, and the ultra-high vacuum bonding method, the effect of increasing the bonding strength by raising the temperature to about 600 ° C. to 1200 ° C. after the bonding is large.

  The step of cutting at a predetermined depth from the main surface 13n, which is a bonding surface of the group III nitride film donor substrate 13D of the bonding substrate 1L, shown in FIG. This is performed by cutting group III nitride film donor substrate 13D along a surface located at a predetermined depth from main surface 13n, which is a bonding surface of group III nitride film donor substrate 13D. The method for cutting the group III nitride film donor substrate 13D is not particularly limited, and a wire saw, an inner peripheral blade, an outer peripheral blade, or the like is preferably used.

  In this way, the bonding substrate 1L is cut at a predetermined depth from the main surface 13n, which is a bonding surface of the group III nitride film donor substrate 13D, to form the support substrate 11 and the support substrate 11 Thus, the group III nitride composite substrate 1 including the bonding film 12 disposed on the main surface 11m of the metal and the group III nitride film 13 disposed on the main surface of the bonding film 12 is obtained.

(Second method: grinding, polishing and etching method)
As shown in FIG. 6, the method of manufacturing the composite substrate by the second method is not particularly limited, but from the viewpoint of efficiently manufacturing the composite substrate, the support substrate 11 and the group III nitride film donor substrate 13D From the main surface 13m opposite to the main surface 13n which is the bonding surface of the group III nitride film donor substrate 13D of the bonding substrate 1L (FIG. 6A). And a step of performing at least one of grinding, polishing, and etching (FIG. 6B).

  As shown in FIG. 6A, in the step of bonding the supporting substrate 11 and the group III nitride film donor substrate 13D to form the bonding substrate 1L, the bonding film 12a is formed on the main surface 11m of the supporting substrate 11. A sub-process (FIG. 6 (A1)), a sub-process (FIG. 6 (A2)) for forming the bonding film 12b on the main surface 13n of the group III nitride film donor substrate 13D, and a main surface 11m of the support substrate 11 A sub-process (FIG. 6 (A3)) for bonding the bonding film 12a formed thereon and the bonding film 12b formed on the main surface 13n of the group III nitride film donor substrate 13D. By these sub-processes, the bonding film 12a and the bonding film 12b bonded together are integrated by bonding to form the bonding film 12, and the support substrate 11 and the group III nitride film donor substrate 13D are bonded to the bonding film 12. The bonded substrate 1 </ b> L is formed by bonding with the substrate interposed therebetween.

  The method for forming the group III nitride film donor substrate 13D is the same as the method for forming the group III nitride film donor substrate 13D in the first method. The method for forming the bonding films 12a and 12b is the same as the method for forming the bonding films 12a and 12b in the method of manufacturing the composite substrate by the first method. Further, the method of bonding the support substrate 11 and the group III nitride film donor substrate 13D is a method of bonding the support substrate 11 and the group III nitride film 13 in the method of manufacturing the composite substrate by the first method described above. It is the same.

  As shown in FIG. 6B, at least one of grinding, polishing, and etching is performed from the main surface 13m opposite to the main surface 13n that is the bonding surface of the group III nitride film donor substrate 13D of the bonding substrate 1L. Since the group III nitride film 13 having a desired thickness is formed by reducing the thickness of the group III nitride film donor substrate 13D by the process, the support substrate 11 and the main surface 11m of the support substrate 11 are arranged. Thus, the group III nitride composite substrate 1 including the bonded film 12 and the group III nitride film 13 disposed on the main surface of the bonding film 12 is obtained.

  Here, the method of grinding the group III nitride film donor substrate 13D is not particularly limited, and examples thereof include grinding with a grindstone (surface grinding) and shot blasting. The method for polishing the group III nitride film donor substrate 13D is not particularly limited, and examples thereof include mechanical polishing and chemical mechanical polishing. The method for etching the group III nitride film donor substrate 13D is not particularly limited, and examples include wet etching with a chemical solution and dry etching such as RIE (reactive ion etching).

  As described above, the group III nitride composite substrate 1 can be manufactured. The group III nitride composite substrate 1 manufactured as described above has an excellent effect that a high-quality epitaxial layer can be grown thereon and the manufacturing yield of semiconductor devices is improved.

[Embodiment 3: Laminated group III nitride composite substrate]
Hereinafter, with reference to FIG. 2, the laminated group III nitride composite substrate 2 which is another embodiment is demonstrated.

  The laminated group III nitride composite substrate 2 is arranged at least on the group III nitride composite substrate 1 of the first embodiment and the main surface 13m of the group III nitride composite substrate 1 on the group III nitride film 13 side. A group III-nitride layer 20.

  Thus, the group III nitride layer 20 is disposed on the main surface 13m on the group III nitride film 13 side of the group III nitride composite substrate 1, whereby the group III nitride layer 20 is a good quality epitaxial layer. Can grow as.

In the laminated group III nitride composite substrate 2 of the present embodiment, the group III nitride layer 20 disposed on the main surface 13m on the group III nitride film 13 side varies depending on the type of semiconductor device to be manufactured. When manufacturing a light emitting device as a semiconductor device, the group III nitride layer 20 includes, for example, an n-GaN layer 21, an n-In _0.05 Ga _0.95 N layer 22, an active layer 23 having a multiple quantum well structure, and p-Al. It can be composed of a _0.09 Ga _0.91 N layer 24 and a p-GaN layer 25. When a HEMT (High Electron Mobility Transistor), which is an example of an electronic device, is manufactured as a semiconductor device, the group III nitride layer can be composed of, for example, a GaN layer or an Al _0.2 Ga _0.8 N layer. When an SBD (Schottky barrier diode), which is another example of an electronic device, is manufactured as a semiconductor device, the group III nitride layer is, for example, an n ⁺ -GaN layer (with a carrier concentration of 2 × 10 ¹⁸ cm ^−3, for example). ), N ⁻ -GaN layer (carrier concentration is, for example, 5 × 10 ¹⁵ cm ⁻³ ).

[Embodiment 4: Group III nitride semiconductor device]
Hereinafter, with reference to FIGS. 3 and 4, a group III nitride semiconductor device 4 which is still another embodiment will be described.

  The group III nitride semiconductor device 4 includes a group III nitride film 13 in the group III nitride composite substrate of Embodiment 1 and at least one group III nitride layer disposed on the group III nitride film 13. 20 and.

  As described above, the group III nitride semiconductor device 4 of the present embodiment is arranged by growing on the group III nitride composite substrate 1 including the group III nitride film 13 having a thickness of 10 μm or more and 250 μm and growing thereon. And the group III nitride layer 20 having an extremely high crystal quality, and thus has high semiconductor characteristics.

The group III nitride layer 20 of the group III nitride semiconductor device 4 differs depending on the type of the group III nitride semiconductor device 4. As shown in FIG. 3, when the group III nitride semiconductor device 4 is a light emitting device, the group III nitride layer 20 includes, for example, an n-GaN layer 21, an n-In _0.05 Ga _0.95 N layer 22, a multiple quantum well. The active layer 23 having the structure, the p-Al _0.09 Ga _0.91 N layer 24, and the p-GaN layer 25 can be used. As shown in FIG. 4, when the group III nitride semiconductor device 4 is an HEMT that is an example of an electronic device, the group III nitride layer 20 includes, for example, a GaN layer 26 and an Al _0.2 Ga _0.8 N layer 27. The source electrode 60, the drain electrode 70, the gate electrode 80, and the like can be formed on the Al _0.2 Ga _0.8 N layer 27. When an SBD, which is another example of an electronic device, is manufactured as a semiconductor device, the group III nitride layer is, for example, an n ⁺ -GaN layer (carrier concentration is 2 × 10 ¹⁸ cm ⁻³ ), n ⁻ -GaN, for example. It can be composed of layers (carrier concentration is, for example, 5 × 10 ¹⁵ cm ⁻³ ).

  As shown in FIGS. 3 and 4, the group III nitride semiconductor device 4 preferably further includes at least one of a support substrate 11 and a device support substrate 40 for supporting the group III nitride layer 20. Here, the shape of the device support substrate 40 is not limited to a flat plate shape, and the group III nitride semiconductor device 4 can be formed by supporting the group III nitride film 13 and the group III nitride layer 20. As long as it can take any shape.

  The group III nitride semiconductor device of the embodiment described above can be manufactured by the following manufacturing method. That is, a group III nitride semiconductor device manufactured by the following manufacturing method is a semiconductor device that can be manufactured at a low cost and with a favorable yield and has extremely high semiconductor characteristics.

[Embodiment 5: Method for Producing Group III Nitride Semiconductor Device]
Hereinafter, with reference to FIG. 7, the manufacturing method of the group III nitride semiconductor device which is Embodiment 5 is demonstrated.

  In the method for manufacturing a group III nitride semiconductor device of the present embodiment, a step of preparing a group III nitride composite substrate 1 and a main surface 13m on the group III nitride film 13 side of the group III nitride composite substrate 1, Growing at least one group III-nitride layer 20.

  Here, the process of preparing the group III nitride composite substrate 1 is the same as the method for manufacturing the group III nitride composite substrate described as the second embodiment, and therefore the same description will not be repeated. Hereinafter, steps after the step of preparing the group III nitride composite substrate 1 will be described.

  As shown in FIG. 7, the manufacturing method of the group III nitride semiconductor device according to this embodiment includes at least one layer of III on the main surface 13m of the group III nitride composite substrate 1 on the group III nitride film 13 side. A step of growing group nitride layer 20 (FIG. 7A) is included. Since the group III nitride semiconductor device manufacturing method of this embodiment grows the group III nitride layer on the main surface 13m of the group III nitride composite substrate 1 during the growth of the group III nitride layer, the method is high. A high-performance group III nitride semiconductor device can be manufactured with a yield.

  In the method for manufacturing a group III nitride semiconductor device of this embodiment, a step of further bonding a device supporting substrate 40 on the group III nitride layer 20 (FIG. 7B) and supporting from the group III nitride composite substrate 1 And a step of removing the substrate 11 (FIG. 7C). By adding these steps, a group III nitride semiconductor device having high mechanical strength and high characteristics supported by the device support substrate 40 with high yield can be manufactured. Hereafter, each process is demonstrated concretely.

(Group III nitride layer growth process)
In the step of growing at least one group III nitride layer 20 on the main surface 13m on the group III nitride film 13 side of the group III nitride composite substrate 1 shown in FIG. The method for growing the layer 20 includes a vapor phase method such as a MOVPE method, an MBE method, an HVPE method, a sublimation method, and a liquid phase method such as a flux method from the viewpoint of epitaxially growing a group III nitride layer 20 having a high crystal quality. The MOVPE method is particularly preferable.

The configuration of group III nitride layer 20 differs depending on the type of group III nitride semiconductor device 4. When the group III nitride semiconductor device 4 is a light emitting device, the group III nitride layer 20 includes, for example, an n-GaN layer 21, an n-In _0.05 Ga _0.95 N layer 22, a multiple layer on the group III nitride film 13. An active layer 23 having a quantum well structure, a p-Al _0.09 Ga _0.91 N layer 24, and a p-GaN layer 25 can be grown in this order.

  As described above, the laminated group III nitride composite substrate 2 is obtained by growing at least one group III nitride layer 20 on the group III nitride film 13 of the group III nitride composite substrate 1. .

(Device support substrate bonding process)
The step of further bonding the device support substrate 40 on the group III nitride layer 20 shown in FIG. 7B includes the first electrode 30 and the group III nitride layer 20 of the laminated group III nitride composite substrate 2. The pad electrode 33 is formed, the pad electrode 43 and the bonding metal film 44 are formed on the device support substrate 40, and the bonding metal film 44 is bonded to the pad electrode 33. Through this process, the laminated substrate 3 is obtained. For the device support substrate 40, a Si substrate, a CuW substrate, or the like is used.

(Support substrate removal process)
The step of removing support substrate 11 from group III nitride composite substrate 1 shown in FIG. 7C is performed by removing support substrate 11 of group III nitride composite substrate 1 from laminated substrate 3. Thereby, the bonding film 12 interposed between the support substrate 11 and the group III nitride film 13 can also be removed at the same time.

  A method for removing the support substrate 11 and the bonding film 12 is not particularly limited, and grinding, etching, and the like are preferably used. For example, the support substrate 11 formed of a material that has low hardness, strength, and wear resistance and is easily cut can be removed by at least one of grinding and polishing from the viewpoint of reducing manufacturing costs. Further, the support substrate 11 formed of a material that dissolves in a chemical solution such as acid or alkali can be removed by etching with a chemical solution from the viewpoint of low manufacturing cost. From the viewpoint of easy removal of the support substrate 11, the support substrate 11 has a larger number of ceramics or the like than a support substrate formed of a single crystal material such as sapphire, SiC, or a group III nitride (for example, GaN). A support substrate made of a crystalline material is preferred.

(Electrode formation process)
A second electrode 50 is formed on the group III nitride film 13 exposed by removing the support substrate 11 and the bonding film 12 from the multilayer substrate 3 shown in FIG. 7D, and the device is formed on the device support substrate 40. A support substrate electrode 45 is formed.

  As described above, a group III nitride semiconductor device having extremely good characteristics with a high yield can be manufactured.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these.

[(1) Production of Group III Nitride Composite Substrate]
(Example A)
Hereinafter, the group III nitride composite substrate according to the example will be described with reference to FIG.

First, as shown in FIG. 5A1, as the support substrate 11, an Al ₂ O ₃ —SiO ₂ composite oxide substrate having a diameter of 75 mm and a thickness of 300 μm (Al ₂ O ₃ is 85% by mass with respect to the entire substrate). A composite oxide substrate having a SiO ₂ content of 15% by mass was prepared. This support substrate 11 had a thermal conductivity of 10 W · m ⁻¹ · K ⁻¹ and a Young's modulus of 250 GPa.

Next, the main surfaces 11m on both sides of the support substrate 11 were subjected to rough polishing with a copper-based surface plate, intermediate polishing with a tin-based surface plate, and final polishing with a non-woven polishing pad, using diamond slurry as an abrasive. In the final polishing, polishing was performed under the condition that the coefficient of action FE was 4 × 10 ⁻¹⁷ m ² / s or more and 1 × 10 ⁻¹⁶ m ² / s or less.

Next, an SiO ₂ film having a thickness of 800 nm is grown by PE-CVD (plasma assisted chemical vapor deposition) on the main surface 11 m of the support substrate 11 after the final polishing, and the SiO ₂ film is grown at 800 ° C. in a nitrogen atmosphere. Time annealing was performed.

  Next, the main surface 12am has a root mean square roughness (hereinafter also referred to as "RMS (Root-Mean-Square roughness)") by CMP using a slurry containing colloidal silica abrasive grains having an average particle diameter of 40 nm and a pH of 10. The 400 nm-thick bonding film 12a mirrored to 0.3 nm or less was formed. Next, in order to remove the colloidal silica abrasive used in CMP, abrasive-free polishing with KOH aqueous solution, polishing with pure water, and megasonic cleaning with pure water (frequency in the megasonic band of 500 kHz to 5 MHz) (Cleaning using ultrasonic waves).

Further, as shown in FIG. 5A2, a GaN crystal body having a diameter of 75 mm and a thickness of 8 mm was prepared as the group III nitride film donor substrate 13D. Next, the bonded surface of the group III nitride film donor substrate 13D is planarized by mechanical polishing and CMP to have an RMS of 2 nm or less, and an SiO ₂ film having a thickness of 800 nm is grown thereon by a PE-CVD method in a nitrogen atmosphere. Annealing was performed at 800 ° C. for 1 hour. Subsequently, a bonding film 12b having a thickness of 500 nm in which the main surface 12bn is mirror-polished to 0.3 nm or less by RMS is formed by CMP using a slurry having a colloidal silica abrasive particle having an average particle diameter of 40 nm and a pH of 10. did. Next, in order to remove the colloidal silica abrasive used in CMP, abrasive-free polishing with KOH aqueous solution, polishing with pure water, and megasonic cleaning with pure water were performed.

Here, the group III nitride film donor substrate 13D was grown by HVPE using a GaAs substrate as a base substrate. The group III nitride film donor substrate 13D was an n-type conductivity type, had a transition density of 1 × 10 ⁸ cm ⁻² and a carrier concentration of 1 × 10 ¹⁷ cm ⁻³ .

  Next, as shown in FIGS. 5A1 to 5A3, the main surface 12am of the bonding film 12a and the main surface 12bn of the bonding film 12b are bonded to each other, whereby the support substrate 11 and the group III nitride film 13 are bonded. A bonded substrate 1L was obtained by bonding together with a bonding film 12 interposed therebetween. After bonding, the bonding substrate 1L was annealed by raising the temperature to 800 ° C. in a nitrogen atmosphere to increase the bonding strength.

  Next, as shown in FIG. 5B, the group III nitride film donor substrate 13D of the bonding substrate 1L is a wire saw on the surface located at a depth of 40 μm from the bonding surface with the bonding film 12 to the inside. The group III nitride composite substrate 1 in which the support substrate 11 and the group III nitride film 13 which is a GaN thin film were bonded with the bonding film 12 interposed therebetween was obtained.

  Here, as the wire, a fixed abrasive wire having a wire diameter of 180 μm and electrodeposited with diamond abrasive grains was used. Further, in order to reduce the cutting resistance and increase the accuracy of thickness and the flatness of the cut surface, as a cutting method, a method of vibrating the wire and synchronizing the group III nitride film donor substrate 13D in synchronization therewith. It was adopted. And the resistance coefficient of wire saw cutting was 4200N.

Further, after the cutting, the group III nitride film 13 of the group III nitride composite substrate 1 was subjected to mechanical polishing and CMP. At this time, diamond slurry was used as an abrasive, and rough polishing was performed with a copper-based surface plate and intermediate polishing was performed with a tin-based surface plate. Further, finish polishing was performed with a nonwoven fabric polishing pad using a colloidal silica slurry having a pH of 11 (including a colloidal silica abrasive having an average particle diameter of 60 nm and having a pH of 11). In order to make the thickness of the group III nitride film 13 uniform, when attaching the composite substrate to the apparatus in CMP, the substrate shape is preliminarily corrected by vacuum chuck adsorption, and then the substrate is adsorbed and fixed to the apparatus. The method to do was adopted. The coefficient of action FE during final polishing was 7 × 10 ⁻¹⁴ m ² / s. The thickness of the group III nitride film 13 after finish polishing was 110 μm.

[(2) Production of Group III Nitride Semiconductor Device]
Hereinafter, an SBD (Schottky barrier diode) which is a group III nitride semiconductor device according to the embodiment will be described with reference to FIG.

First, as shown in FIG. 8A, a group III nitride layer 20 having a thickness of 2 μm is formed on the main surface 13m of the group III nitride composite substrate 1 on the group III nitride film 13 side by MOVPE. By epitaxially growing an n ⁺ -GaN layer 28 (carrier concentration 2 × 10 ¹⁸ cm ⁻³ ) and a 7 μm thick n ⁻ -GaN layer 29 (carrier concentration 5 × 10 ¹⁵ cm ⁻³ ) in this order. Thus, a laminated group III nitride composite substrate 2 was obtained.

Next, as shown in FIG. 8B, an electron beam evaporation method (hereinafter referred to as EB) is formed on the n ⁻ -GaN layer 29 that is the uppermost layer of the group III nitride layer 20 of the laminated group III nitride composite substrate 2. The first electrode 30 that is a Schottky electrode was formed by sequentially forming an Ni layer having a thickness of 4 nm and an Au layer having a thickness of 200 nm by alloying by (Electron Beam) evaporation method). At this time, the diameter of the first electrode 30 was set to 200 μm. Furthermore, a pad electrode 33 was formed on the first electrode 30 by sequentially forming a Ti layer having a thickness of 200 nm, a Pt layer having a thickness of 100 nm, and an Au layer having a thickness of 1000 nm by an EB vapor deposition method.

  Also, a Mo substrate is prepared as the device support substrate 40, and a 200 nm thick Ti layer, a 100 nm thick Pt layer, and a 1000 nm thick Au layer are sequentially formed on the device support substrate 40 by EB vapor deposition. Thus, the pad electrode 43 was formed. Then, an AuSn solder film was formed as the bonding metal film 44 on the pad electrode 43.

  Next, the laminated metal substrate 3 was obtained by bonding the bonding metal film 44 to the pad electrode 33.

  Next, as shown in FIG. 8C, the support substrate 11 and the bonding film 12 of the group III nitride composite substrate 1 were removed from the multilayer substrate 3 by etching using hydrofluoric acid.

  Next, as shown in FIG. 8D, a 20 nm-thickness is formed on the group III nitride film 13 exposed by removing the support substrate 11 and the bonding film 12 from the laminated substrate 3 by EB vapor deposition. A Ti layer, an Al layer with a thickness of 200 nm, and an Au layer with a thickness of 300 nm were sequentially formed and annealed to form a second electrode 50 that is an ohmic electrode. Further, a 20 nm thick Ti layer and a 300 nm thick Au layer were sequentially formed on the device support substrate 40 by EB vapor deposition, and annealed to form a device support substrate electrode 45. In this way, the group III nitride semiconductor device 4 which is SBD was obtained.

  The yield of the group III nitride semiconductor device 4 obtained as described above was calculated as follows. That is, the current-voltage characteristics in the reverse direction for SBD are measured, and those that conform to the standard with a withstand voltage of 250 V or more are regarded as non-defective products, those that do not conform are regarded as defective products, the number of good products, The percentage of the value divided by the total was used as the yield rate.

  By the method described above, a group III nitride composite substrate including a bonding film having a thickness distribution shown in Table 1 and a group III nitride semiconductor device using them were manufactured.

  These group III nitride composite substrates are composite substrates having a diameter of 75 mm (ie, 75 mm or more) in which a supporting substrate and a group III nitride film having a thickness of 110 μm (ie, 10 μm or more and 250 μm or less) are bonded together. It is.

  Table 1 shows the relationship between the thickness distribution of the bonding film and the yield rate of the group III nitride semiconductor device calculated by the above-described method.

  As is apparent from Table 1, the semiconductor device (A2 to A6) using the group III nitride composite substrate in which the thickness distribution of the bonding film is 2% or more and 40% or less is a group III nitride that does not satisfy such conditions. Compared with the semiconductor devices (A1 and A7) using the composite substrate, the yield was good.

(Example B)
In the same manner as in Example A, the group III nitride composite substrate in which the support substrate and the group III nitride film were bonded with the shear bonding strength and the bonding area ratio shown in Table 2, and the group III nitridation using them. A semiconductor device was fabricated.

  These group III nitride composite substrates are composite substrates having a diameter of 75 mm (ie, 75 mm or more) in which a supporting substrate and a group III nitride film having a thickness of 110 μm (ie, 10 μm or more and 250 μm or less) are bonded together. It is.

  Table 2 shows the relationship between the shear bonding strength and the bonding area ratio and the yield rate of the group III nitride semiconductor device calculated by the above-described method.

  As apparent from Table 2, the shear bonding strength between the support substrate and the group III nitride film is 4 MPa or more and 40 MPa or less, and the bonding area ratio between the support substrate and the group III nitride film is 60% or more and 99% or less. A semiconductor device (B2 to B5, B7, and B8) using a certain group III nitride composite substrate is compared with a semiconductor device (B1, B6, and B9) using a group III nitride composite substrate that does not satisfy such conditions. The yield rate was good.

(Example C)
Under the conditions other than the following (i) to (v), a Group III nitride composite substrate according to Example C and a Group III nitride semiconductor device using them were produced in the same manner as Example A.
(I) As the support substrate 11, an Al ₂ O ₃ —SiO ₂ composite oxide substrate (a composite oxide substrate in which Al ₂ O ₃ is 82% by mass and SiO ₂ is 18% by mass with respect to the entire substrate), The composite oxide substrate selected from mullite-YSZ and mullite was used. (Ii) The diameter was varied between 75 mm and 150 mm. (Iii) The bonding film 12 was AP-CVD (atmospheric pressure-chemical vapor). (Iv) The coefficient of action FE is 8.5 × 10 ⁻¹⁷ m ² / s or more and 1 × 10 ⁻¹⁶ m ² / s in the ^final polishing of the main surface 11m on the support substrate 11 side. (v) The thickness of the group III nitride film 13 after final polishing was varied between 10 μm and 250 μm, respectively. Note that the group III nitride composite substrate according to Example C The thickness distribution of all bonding films is 5% ( That is, 2% or more and 40% or less).

  Table 3 shows the relationship between the structure of the group III nitride composite substrate according to Example C and the yield rate of the group III semiconductor device using them.

In Table _{3, α III-N / α} S represents the ratio of the thermal expansion coefficient alpha _III-N III nitride film to the thermal expansion coefficient alpha _S of the supporting substrate, t _III-N / t _S is the support substrate The ratio of the thickness t _III-N of the group III nitride film to the thickness t _S is shown.

As is apparent from Table 3, the support substrate and the group III nitride film having a thickness of 10 μm or more and 250 μm or less are bonded to each other, and the thickness of the bonding film is a group III nitride composite substrate having a diameter of 75 mm or more. Among group III nitride composite substrates having a distribution of 5% (that is, 2% or more and 40% or less), group III nitride using a composite substrate having a t _III-N / t _S of 0.02 or more and 1 or less Semiconductor devices could be manufactured with a particularly high yield.

In addition to the above, the composite substrate having α _III-N / α _S of 0.75 or more and 1.25 or less had no cracks and good yield.

(Example D)
A group III nitride composite substrate and a group III nitride semiconductor device using the same were produced in the same manner as in Example A, except that a support substrate having a thermal conductivity λ _s shown in Table 4 was used.

Table 4 shows the relationship between the thermal conductivity λ _s of the support substrate and the yield of the group III nitride semiconductor device.

As apparent from Table 4, the III-nitride having a diameter of 75 mm (that is, 75 mm or more) obtained by bonding the supporting substrate and the group-III nitride film having a thickness of 110 μm (that is, 10 μm or more and 250 μm or less). Among group III nitride composite substrates that are composite substrates and have a bonding film thickness distribution of 5% (ie, 2% or more and 40% or less), the thermal conductivity λ _S is 3 W · m ⁻¹ · K ^−1. The group III nitride semiconductor device using the composite substrate having a 280 W · m ⁻¹ · K ⁻¹ or less was able to be manufactured with a particularly high yield.

  Although the embodiments and examples of the present invention have been described as described above, it is also planned from the beginning to appropriately combine the configurations of the above-described embodiments.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 1 Group III nitride composite substrate, 1L joint substrate, 2 laminated group III nitride composite substrate, 3 laminated substrate, 4 group III nitride semiconductor device, 11 support substrate, 11m, 12am, 12bn, 13m, 13n principal surface, 12 , 12a, 12b bonding film, 13 group III nitride film, 13D, 13Dr group III nitride film donor substrate, 20 group III nitride layer, 21 n-GaN layer, 22 n-In _0.05 Ga _0.95 N layer, 23 activity Layer, 24 p-Al _0.09 Ga _0.91 N layer, 25 p-GaN layer, 26 GaN layer, 27 Al _0.2 Ga _0.8 N layer, 28 n ⁺ -GaN layer, 29 n ⁻ -GaN layer, 33, 43 pad electrode, 40 device support substrate, 44 bonding metal film, 45 device support substrate electrode, 30 first electrode, 50 second electrode, 60 source electrode, 70 drain electrode, 80 gate electrode.

Claims (12)

A III-nitride composite substrate having a diameter of 75 mm or more obtained by laminating a supporting substrate and a III-nitride film having a thickness of 10 μm or more and 250 μm or less,
A bonding film that is interposed between the support substrate and the group III nitride film and bonds the support substrate and the group III nitride film;
The bonding film is a group III nitride composite substrate having a thickness distribution of 2% to 40%. A III-nitride composite substrate having a diameter of 75 mm or more obtained by laminating a supporting substrate and a III-nitride film having a thickness of 10 μm or more and 250 μm or less,
A bonding film that is interposed between the support substrate and the group III nitride film and bonds the support substrate and the group III nitride film;
The shear bonding strength between the support substrate and the group III nitride film is 4 MPa or more and 40 MPa or less,
A group III nitride composite substrate, wherein a bonding area ratio between the support substrate and the group III nitride film is 60% or more and 99% or less. The ratio α _III-N / α _S of the thermal expansion coefficient alpha _III-N of the III nitride film to the thermal expansion coefficient alpha _S of the support substrate is 0.75 to 1.25, the thickness of the support substrate the ratio t _III-N / t _S of thickness t _III-N of the III nitride film is 0.02 or more and 1 or less with respect to t _S, the group III nitride composite substrate according to claim 1 or 2 . The thermal conductivity lambda _S of the supporting substrate is not more than 3W · m ^-1 · K ^-1 or more ^{280W · m -1 · K -1,} III -nitride composite substrate according to any one of claims 1 to 3 . The Young's modulus E _S of the supporting substrate is not more than 500GPa least 150 GPa, III-nitride composite substrate according to any one of claims 1 to 4.   The group III nitride composite substrate according to claim 1, wherein the diameter is 125 mm or more and 300 mm or less.   The group III nitride composite substrate according to claim 1 or 2, and at least one group III nitride layer disposed on a main surface of the group III nitride composite substrate on the group III nitride film side; A laminated group III-nitride composite substrate.   The group III nitride film in the group III nitride composite substrate according to claim 1 or 2, and at least one group III nitride layer disposed on the group III nitride film, Group III nitride semiconductor device. A method for producing a group III nitride composite substrate according to claim 1 or 2,
Bonding the support substrate and the group III nitride film donor substrate to form a bonded substrate having a diameter of 75 mm or more;
The group III nitride composite substrate is cut by cutting the group III nitride film donor substrate at a surface located at a predetermined distance from the bonding main surface of the group III nitride film donor substrate of the bonding substrate. Forming a group III nitride composite substrate. A method for producing a group III nitride composite substrate according to claim 1 or 2,
Bonding the support substrate and the group III nitride film donor substrate to form a bonded substrate having a diameter of 75 mm or more;
Forming the group III nitride composite substrate by performing at least one of grinding, polishing and etching from the main surface opposite to the bonding main surface of the group III nitride film donor substrate of the bonding substrate; The manufacturing method of the group III nitride composite substrate containing these. Preparing a group III nitride composite substrate according to claim 1 or 2,
And a step of growing at least one group III nitride layer on the group III nitride film of the group III nitride composite substrate.   The group III nitride semiconductor according to claim 11, further comprising: bonding a device support substrate on the group III nitride layer; and removing the support substrate from the group III nitride composite substrate. Device manufacturing method.

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