JP2014157961A - Metallized film capacitor - Google Patents

Metallized film capacitor Download PDF

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JP2014157961A
JP2014157961A JP2013028690A JP2013028690A JP2014157961A JP 2014157961 A JP2014157961 A JP 2014157961A JP 2013028690 A JP2013028690 A JP 2013028690A JP 2013028690 A JP2013028690 A JP 2013028690A JP 2014157961 A JP2014157961 A JP 2014157961A
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metallized film
film capacitor
terminal
extraction electrode
present
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JP6074658B2 (en
JP2014157961A5 (en
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Masahito Sano
正仁 佐野
Shigeo Okuno
茂男 奥野
Masato Suenaga
真人 末永
Shogo Ogawa
昇吾 小川
Taiyo Tsukahara
太陽 塚原
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To improve capacitor characteristics of a metalized film capacitor.SOLUTION: In the present invention, a metallized film capacitor 1 is configured such that a terminal 6 is connected to an extraction electrode 5 so as to be perpendicular to a linear projecting part 7 floated on the extraction electrode 5 by a winding core 3, at least one junction between the terminal 6 and the extraction electrode 5 is provided at the upper part and the lower part of the projecting part 7, respectively, and the projecting part 7 is not joined to the terminal 6. By the configuration of the present invention, the terminal 6 and the extraction electrode 5 can be firmly connected with a sufficient area. Accordingly, the dielectric tangent of the metallized film capacitor 1 is decreased, so that capacitor characteristics thereof can be improved.

Description

本発明は例えば各種電子機器、電気機器、産業機器の電子、電気回路に搭載される金属化フィルムコンデンサに関するものである。   The present invention relates to a metallized film capacitor mounted on, for example, various electronic devices, electric devices, and electronic and electric circuits of industrial devices.

金属化フィルムコンデンサは、一般に金属箔を電極に用いるものと、誘電体フィルム上に設けた蒸着金属を電極に用いるものとに大別される。中でも、蒸着金属を電極(以下、蒸着電極)とする金属化フィルムコンデンサは、金属箔を用いるものに比べて電極の占める体積が小さく小型軽量化が図れることと、蒸着電極特有の自己回復性能(絶縁欠陥部で短絡が生じた場合に、短絡のエネルギーで欠陥部周辺の蒸着電極が蒸発・飛散して絶縁化し、コンデンサの機能が回復する性能)により絶縁破壊に対する信頼性が高いことから、従来から広く用いられている。   Generally, metallized film capacitors are roughly classified into those using a metal foil as an electrode and those using a deposited metal provided on a dielectric film as an electrode. Among these, metallized film capacitors using evaporated metal as an electrode (hereinafter referred to as “deposited electrode”) have a smaller volume occupied by the electrode than those using metal foil and can be reduced in size and weight. In the case where a short circuit occurs in an insulation defect part, the deposition electrode around the defect part is evaporated and scattered by the short circuit energy to insulate and insulate it, and the function of the capacitor is restored). Widely used.

この種の金属化フィルムコンデンサの構成を、特許文献1に記載された金属化フィルムコンデンサ100を例に図6を用いて説明する。図6は金属化フィルムコンデンサ100の透視斜視図である。   The structure of this type of metallized film capacitor will be described with reference to FIG. 6 using the metallized film capacitor 100 described in Patent Document 1 as an example. FIG. 6 is a perspective view of the metallized film capacitor 100.

図6に示すように、金属化フィルムコンデンサ100は、ポリプロピレンなどの誘電体フィルムの表面上にアルミニウム、亜鉛などの金属を蒸着して金属電極膜を形成した金属化フィルムを金属製の巻回軸101に巻回した後に熱プレスし、そしてその両端面に亜鉛などの金属を溶射して引出電極102を形成した構成となっている。そして、この金属化フィルムコンデンサ100はさらに引出電極102がリード線やバスバー等の端子(図示せず)と抵抗溶接や半田付けによって機械的に接続され、使用されるものである。   As shown in FIG. 6, the metallized film capacitor 100 includes a metal winding shaft in which a metal electrode film is formed by depositing a metal such as aluminum or zinc on the surface of a dielectric film such as polypropylene. The lead electrode 102 is formed by hot-pressing after being wound around 101 and thermally spraying a metal such as zinc on both end faces thereof. The metallized film capacitor 100 is used by further connecting the lead electrode 102 to a terminal (not shown) such as a lead wire or a bus bar by resistance welding or soldering.

なお、この特許文献1の金属化フィルムコンデンサ100では、金属製の巻回軸101が用いられており、巻回軸101を2分割して両端面の引出電極102どうしの短絡を防いでいる。   In the metallized film capacitor 100 of Patent Document 1, a metal winding shaft 101 is used, and the winding shaft 101 is divided into two parts to prevent short-circuiting between the extraction electrodes 102 on both end faces.

特開2008−21128号公報JP 2008-21128 A

金属化フィルムコンデンサにおいて、コンデンサ特性を優れたものとするためには、少しでも電力損失ひいては誘電正接(tanδ)を減少させることが望まれる。   In a metallized film capacitor, in order to improve the capacitor characteristics, it is desirable to reduce the power loss and thus the dielectric loss tangent (tan δ) as much as possible.

この誘電正接は誘電体フィルムの材料や、巻回体と引出電極との接続状態等、様々な要因によって変化するが、その中でも引出電極と端子との接続状態に大きく左右されるものである。   This dielectric loss tangent varies depending on various factors such as the material of the dielectric film and the connection state between the wound body and the extraction electrode, but among these, it depends greatly on the connection state between the extraction electrode and the terminal.

したがって、コンデンサ特性の高い金属化フィルムコンデンサを得るためにも、金属化フィルムコンデンサにとって引出電極と端子の最適な接続状態を見出すことは重要である。   Therefore, in order to obtain a metallized film capacitor having high capacitor characteristics, it is important for the metallized film capacitor to find an optimal connection state between the extraction electrode and the terminal.

上記目的を達成するために本発明者が鋭意検討を行った結果、端子を巻芯により引出電極上に浮き出た直線状の凸部に対して垂直となるように引出電極に接続し、端子と引出電極の接合部を、凸部の上方ならびに下方に少なくとも1つずつ設けるとともに、凸部は端子と接合されていない構成とすることで誘電正接の小さい金属化フィルムコンデンサを実現できることを見出した。   As a result of intensive studies by the present inventors to achieve the above object, the terminal is connected to the extraction electrode so as to be perpendicular to the linear convex portion that is raised on the extraction electrode by the winding core, and the terminal and It has been found that a metallized film capacitor having a small dielectric loss tangent can be realized by providing at least one lead electrode joining portion above and below the projecting portion, and having the projecting portion not joined to the terminal.

上記のような構成とすることで、本発明の金属化フィルムコンデンサは端子と引出電極とを十分な面積で強固に接続することができる。この結果、端子の接続不良等が発生することを抑制でき、誘電正接が小さくコンデンサ特性の優れた金属化フィルムコンデンサを提供することが可能となる。   By setting it as the above structures, the metallized film capacitor of this invention can connect a terminal and an extraction electrode firmly with sufficient area. As a result, it is possible to suppress the occurrence of terminal connection failure and the like, and it is possible to provide a metallized film capacitor having a small dielectric loss tangent and excellent capacitor characteristics.

(a)実施の形態1における素子の偏平加工前の透視斜視図、(b)同素子の偏平加工後の透視斜視図(A) Perspective perspective view before flattening of the element in Embodiment 1, (b) Perspective perspective view after flattening of the element 実施の形態1の金属化フィルムコンデンサの正面断面図Front sectional view of metallized film capacitor of Embodiment 1 (a)比較例1の金属化フィルムコンデンサの正面断面図、(b)比較例2の金属化フィルムコンデンサの正面断面図(A) Front sectional view of the metalized film capacitor of Comparative Example 1, (b) Front sectional view of the metalized film capacitor of Comparative Example 2 (a)実施の形態1の金属化フィルムコンデンサの誘電正接測定結果を示すグラフ、(b)比較例1の金属化フィルムコンデンサの誘電正接測定結果を示すグラフ、(c)比較例2の金属化フィルムコンデンサの誘電正接測定結果を示すグラフ(A) Graph showing dielectric tangent measurement result of metallized film capacitor of Embodiment 1, (b) Graph showing dielectric tangent measurement result of metalized film capacitor of Comparative Example 1, (c) Metallization of Comparative Example 2 Graph showing the dielectric loss tangent measurement results of film capacitors 実施の形態2の金属化フィルムコンデンサの正面断面図Front sectional view of metallized film capacitor of Embodiment 2 従来の金属化フィルムコンデンサの透視斜視図A perspective view of a conventional metallized film capacitor

(実施の形態1)
以下、図1ならびに図2を用いて、本実施の形態の金属化フィルムコンデンサ1の構成について説明する。図1(a)は本実施の形態の金属化フィルムコンデンサ1の素子2の偏平加工前の透視斜視図、図1(b)は本実施の形態の金属化フィルムコンデンサ1の素子2の偏平加工後の透視斜視図、図2は本実施の形態の金属化フィルムコンデンサ1の正面断面図である。
(Embodiment 1)
Hereinafter, the configuration of the metallized film capacitor 1 of the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1A is a perspective view of the element 2 of the metallized film capacitor 1 of the present embodiment before flattening, and FIG. 1B is the process of flattening the element 2 of the metalized film capacitor 1 of the present embodiment. FIG. 2 is a front perspective view of the metallized film capacitor 1 of the present embodiment.

まず、本実施の形態の金属化フィルムコンデンサ1に用いた素子2の説明をする。図1(a)に図示するように、本実施の形態の金属化フィルムコンデンサ1の素子2は巻芯3とこの巻芯3に巻回された金属化フィルム4で構成される。素子2は後述の如く押圧されることで図1(b)に図示するように偏平形状となるが、押圧前は図1(a)に図示するように、円筒状の形状をなしている。   First, the element 2 used for the metallized film capacitor 1 of the present embodiment will be described. As shown in FIG. 1A, the element 2 of the metallized film capacitor 1 of the present embodiment is composed of a core 3 and a metallized film 4 wound around the core 3. The element 2 is flattened as shown in FIG. 1B by being pressed as described later, but before pressing, it has a cylindrical shape as shown in FIG. 1A.

上記金属化フィルム4は、誘電体フィルム上に金属を所定のパターンに蒸着することで形成される。そして、2枚の金属化フィルム4を正負一対とし、蒸着にて形成された金属電極膜どうしが誘電体フィルムを介して対向するように巻芯3に巻回される。   The metallized film 4 is formed by depositing metal in a predetermined pattern on a dielectric film. Then, the two metallized films 4 are made into a positive and negative pair, and wound around the core 3 so that the metal electrode films formed by vapor deposition face each other through the dielectric film.

なお、本実施の形態の金属化フィルムコンデンサ1では誘電体フィルムとして幅30mm、厚み3.0μmのポリプロピレンフィルムを用いたが、これ以外にも適当な幅および厚みのポリエチレンテレフタレート、ポリエチレンナフタレート、ポリフェニルサルファイド、ポリスチレンなどの樹脂フィルムを用いてもよい。また、本実施の形態の金属化フィルムコンデンサ1では金属電極膜を、アルミニウムを蒸着することで形成したが、これ以外にも亜鉛やスズ、マグネシウム等の金属、あるいはこれらの合金を用いて金属電極膜を形成してもよい。   In the metallized film capacitor 1 of the present embodiment, a polypropylene film having a width of 30 mm and a thickness of 3.0 μm was used as the dielectric film, but other than this, polyethylene terephthalate, polyethylene naphthalate, poly Resin films such as phenyl sulfide and polystyrene may be used. Further, in the metallized film capacitor 1 of the present embodiment, the metal electrode film is formed by vapor-depositing aluminum, but in addition to this, a metal electrode such as zinc, tin, magnesium, or an alloy thereof is used. A film may be formed.

巻芯3は、金属化フィルムコンデンサ1の誘電体フィルムと同様に、ポリプロピレンフィルムを材料としている。この巻芯3は、厚さが10μm程度で、幅が誘電体フィルムと同等あるいは少し長いポリプロピレンフィルムを巻き取り装置の軸の上に5ターン程度巻回することで形成される。なお、上述した金属化フィルム4の巻芯3への巻回は、巻き取り装置の軸に巻芯3を作製後、そのまま引き続いて行われる。そして、金属化フィルム4の巻芯3への巻回が終了した後、金属化フィルム4と巻芯3は一緒に巻き取り装置の軸から抜き取られ、図1(a)に図示するような素子2が作製される。   The core 3 is made of a polypropylene film as in the case of the dielectric film of the metallized film capacitor 1. The core 3 is formed by winding a polypropylene film having a thickness of about 10 μm and a width equal to or slightly longer than the dielectric film on the shaft of the winding device for about 5 turns. Note that the winding of the metallized film 4 on the core 3 is performed as it is after the core 3 is formed on the shaft of the winding device. Then, after the winding of the metallized film 4 around the core 3 is completed, the metallized film 4 and the core 3 are extracted together from the shaft of the winding device, and the element as shown in FIG. 2 is produced.

そして、この図1(a)に図示する素子2は上方から冷間プレスにて押圧され、図1(b)に図示するような偏平形状となる。ここで、巻芯3は図1(a)で図示したように、中空の円筒状となっており、さらに巻芯3はポリプロピレンフィルムにて形成され機械的強度がそれほど高くないため、この偏平加工は容易に行われるものである。このように、素子2を偏平形状に加工することで製品としての金属化フィルムコンデンサ1の大型化を抑制できる。   The element 2 shown in FIG. 1 (a) is pressed from above by a cold press to have a flat shape as shown in FIG. 1 (b). Here, as shown in FIG. 1A, the winding core 3 has a hollow cylindrical shape, and the winding core 3 is formed of a polypropylene film and has a mechanical strength that is not so high. Is easy to do. Thus, by processing the element 2 into a flat shape, an increase in size of the metallized film capacitor 1 as a product can be suppressed.

巻芯3は上記偏平加工により、円筒状から偏平形状に圧潰され、その両端面は図1(b)に図示するように直線状となる。また、上述のように巻芯3はその幅が誘電体フィルムより少し長いポリプロピレンフィルムを用いているため、この偏平形状に圧潰された巻芯3の直線状の両端部は金属化フィルム4の両端面から僅かに外側に突出した状態となる。本実施の形態の素子2においては一方の端面につき0.5mm程度突出しているが、この突出の加減はある程度ばらついている。   The core 3 is crushed from a cylindrical shape to a flat shape by the above flattening process, and both end surfaces thereof are linear as shown in FIG. Further, since the core 3 is made of a polypropylene film whose width is slightly longer than that of the dielectric film as described above, both linear ends of the core 3 crushed into the flat shape are the ends of the metallized film 4. It will be in the state which protruded slightly outward from the surface. In the element 2 of the present embodiment, one end face protrudes by about 0.5 mm, but the amount of the protrusion varies somewhat.

そして、図2に図示するように、この素子2の両端面に金属を溶射し、引出電極5を形成した後、端子6を接続して金属化フィルムコンデンサ1が完成する。   Then, as shown in FIG. 2, after metal is sprayed on both end faces of the element 2 to form the extraction electrode 5, the terminal 6 is connected to complete the metallized film capacitor 1.

本実施の形態の金属化フィルムコンデンサ1においては、素子2の両端面に溶射する金属として亜鉛を用いており、厚さ0.8mm程度の引出電極5を形成している。なお、亜鉛以外にもアルミニウム等の金属を用いても構わない。ここで、引出電極5は非常に薄く形成されるため、図2に図示するように素子2の両端面から僅かに突出した巻芯3の直線状の両端部は引出電極5上に浮き出た状態となっており、引出電極5の表面はこの巻芯3の両端部にあたる部分が、巻芯3の両端部の形状と同様に直線状に突出した凸部7となっている。この凸部7は素子2の引出電極5の両方ともに形成され、引出電極5表面から0.5mm程度盛り上がっている。   In the metallized film capacitor 1 of the present embodiment, zinc is used as the metal sprayed on both end faces of the element 2, and the extraction electrode 5 having a thickness of about 0.8 mm is formed. In addition to zinc, a metal such as aluminum may be used. Here, since the extraction electrode 5 is formed to be very thin, as shown in FIG. 2, the linear end portions of the core 3 slightly protruding from both end surfaces of the element 2 are raised on the extraction electrode 5. In the surface of the extraction electrode 5, the portions corresponding to both ends of the core 3 are convex portions 7 protruding linearly in the same manner as the shapes of both ends of the core 3. The convex portion 7 is formed on both the extraction electrodes 5 of the element 2 and is raised from the surface of the extraction electrode 5 by about 0.5 mm.

そして、この素子2両端の引出電極5に端子6としてのリード線が抵抗溶接にて接続される。このリード線は直径0.8mmの錫メッキ軟銅線である。   And the lead wire as the terminal 6 is connected to the extraction electrode 5 at both ends of the element 2 by resistance welding. This lead wire is a tin-plated annealed copper wire having a diameter of 0.8 mm.

本実施の形態の金属化フィルムコンデンサ1における抵抗溶接では、1.2kAの電流を流し、発生した抵抗熱で端子6を溶融させ、同時に端子6を素子2方向に19.6N程度の圧力で押圧することで端子6と引出電極5を溶接している。   In resistance welding in the metallized film capacitor 1 of the present embodiment, a current of 1.2 kA is passed, the terminal 6 is melted by the generated resistance heat, and at the same time, the terminal 6 is pressed in the direction of the element 2 with a pressure of about 19.6 N. By doing so, the terminal 6 and the extraction electrode 5 are welded.

ここで端子6は直線状の凸部7に対して垂直になるように配設され、端子6は凸部7に一部接触している。また、図2において図示はしないが、端子6は凸部7の直線部の中心において垂直に重なっている。抵抗溶接の際に端子6は素子2方向に押圧されたため、引出電極5の表面に沿った形状に変形しており、図2に図示するように凸部7の位置で僅かに屈曲した形状となっている。   Here, the terminal 6 is disposed so as to be perpendicular to the linear convex portion 7, and the terminal 6 is partially in contact with the convex portion 7. Although not shown in FIG. 2, the terminal 6 overlaps vertically at the center of the straight portion of the convex portion 7. Since the terminal 6 was pressed in the direction of the element 2 during resistance welding, the terminal 6 is deformed into a shape along the surface of the extraction electrode 5 and is slightly bent at the position of the convex portion 7 as shown in FIG. It has become.

特に、本実施の形態の金属化フィルムコンデンサ1では抵抗溶接の接合部を、凸部7を跨いで素子2の一方の端面につき2ヶ所設け、かつ凸部7は端子6に接合されていないことを特徴としている。すなわち、図2に図示するように、素子2の一方の端面において、凸部7の上方に接合部8が、凸部7の下方に接合部9がそれぞれ1ヶ所ずつ設けられており、凸部7にあたる位置には接合部を設けてはいない。   In particular, in the metallized film capacitor 1 of this embodiment, two resistance welding joints are provided per one end face of the element 2 across the convex part 7, and the convex part 7 is not joined to the terminal 6. It is characterized by. That is, as shown in FIG. 2, on one end face of the element 2, a joint 8 is provided above the convex portion 7, and one joint 9 is provided below the convex portion 7. No joint is provided at a position corresponding to 7.

このように、本実施の形態の金属化フィルムコンデンサ1では抵抗溶接の接合部8、9が凸部7を跨いで設けられた構成により、誘電正接が小さくコンデンサ特性の優れたものとなっている。   As described above, in the metallized film capacitor 1 of the present embodiment, the joints 8 and 9 of resistance welding are provided across the convex portion 7, so that the dielectric loss tangent is small and the capacitor characteristics are excellent. .

この効果について、図3(a)、(b)に示す比較例1、2と比較して説明する。これら比較例1、2の金属化フィルムコンデンサ201、301は、本実施の形態の金属化フィルムコンデンサ1と接合部の配置のみを変更したものであり、その他の構成は本実施の形態の金属化フィルムコンデンサ1と同様である。   This effect will be described in comparison with Comparative Examples 1 and 2 shown in FIGS. These metallized film capacitors 201 and 301 of Comparative Examples 1 and 2 are obtained by changing only the arrangement of the joints with the metallized film capacitor 1 of the present embodiment, and other configurations are the metallized films of the present embodiment. The same as the film capacitor 1.

まず、比較例1の金属化フィルムコンデンサ201は図3(a)に図示するように、素子202の両端面において、接合部208を凸部207上に、接合部209を凸部207の下方に設けている。   First, as shown in FIG. 3A, the metallized film capacitor 201 of Comparative Example 1 has a joint portion 208 on the convex portion 207 and a joint portion 209 below the convex portion 207 on both end faces of the element 202. Provided.

次に、比較例2の金属化フィルムコンデンサ301は図3(b)に図示するように、素子302の両端面において、接合部308、309をともに凸部307の下方に隣接させて設けている。   Next, as shown in FIG. 3B, the metalized film capacitor 301 of Comparative Example 2 is provided with joint portions 308 and 309 adjacent to each other below the convex portion 307 on both end faces of the element 302. .

これら、本実施の形態、比較例1、比較例2の金属化フィルムコンデンサについて誘電正接の良否について検証した結果を図4に示す。この測定においては、それぞれの金属化フィルムコンデンサにつき20個の試料を準備し(N=20)、誘電正接のばらつきを評価したものである。誘電正接は測定電圧1VAC、周波数1kHzで常温にて測定を行った。図4のグラフにおいて縦軸は誘電正接(%)、横軸は金属化フィルムコンデンサの個数(個)であり、図4(a)、(b)、(c)のグラフはそれぞれ本実施の形態の金属化フィルムコンデンサ1、比較例1の金属化フィルムコンデンサ201、比較例2の金属化フィルムコンデンサ301における結果である。   FIG. 4 shows the results of verifying the quality of dielectric loss tangent for these metallized film capacitors of the present embodiment, Comparative Example 1 and Comparative Example 2. In this measurement, 20 samples were prepared for each metallized film capacitor (N = 20), and the dispersion of dielectric loss tangent was evaluated. The dielectric loss tangent was measured at room temperature with a measurement voltage of 1 VAC and a frequency of 1 kHz. In the graph of FIG. 4, the vertical axis represents the dielectric loss tangent (%), the horizontal axis represents the number of metallized film capacitors (pieces), and the graphs of FIGS. 4 (a), (b), and (c) are the present embodiment, respectively. These results are for metallized film capacitor 1, metallized film capacitor 201 of comparative example 1, and metallized film capacitor 301 of comparative example 2.

まず、図4(a)と図4(b)を比較した結果、本実施の形態の金属化フィルムコンデンサ1は比較例1の金属化フィルムコンデンサ201に比べ、誘電正接が全体的に低い結果となった。本実施の形態の金属化フィルムコンデンサ1の誘電正接の平均が0.126%であることに対し、比較例1の金属化フィルムコンデンサ201の誘電正接の平均は0.156%であった。これは、比較例1の金属化フィルムコンデンサ201の接合部208が凸部207上に形成されており、端子206と引出電極205が十分な接触面積および接着力にて接合されていないためと考えられる。また、図4(a)と図4(b)より比較例1の金属化フィルムコンデンサ201は本実施の形態の金属化フィルムコンデンサ1に比べ、誘電正接のばらつきが大きく一定の品質が保たれていないことがわかる。これは、比較例1の金属化フィルムコンデンサ201では接合部208を凸部207上に形成しているため、端子206と引出電極205の溶接が難しく、端子206と引出電極205を十分に密着させるのが困難なことや、端子206を引出電極205の所定の位置に位置決めするのが困難なことが原因であると考えられる。   First, as a result of comparing FIG. 4A and FIG. 4B, the metallized film capacitor 1 of the present embodiment has a lower overall dielectric loss tangent than the metallized film capacitor 201 of Comparative Example 1. became. The average dielectric loss tangent of the metallized film capacitor 1 of the present embodiment was 0.126%, whereas the average dielectric loss tangent of the metallized film capacitor 201 of Comparative Example 1 was 0.156%. This is considered because the joint portion 208 of the metalized film capacitor 201 of Comparative Example 1 is formed on the convex portion 207, and the terminal 206 and the extraction electrode 205 are not joined with a sufficient contact area and adhesive force. It is done. 4 (a) and 4 (b), the metallized film capacitor 201 of Comparative Example 1 has a large variation in dielectric loss tangent compared to the metallized film capacitor 1 of the present embodiment, and a constant quality is maintained. I understand that there is no. This is because, in the metallized film capacitor 201 of Comparative Example 1, since the joint portion 208 is formed on the convex portion 207, it is difficult to weld the terminal 206 and the extraction electrode 205, and the terminal 206 and the extraction electrode 205 are sufficiently adhered to each other. This is considered to be caused by the fact that it is difficult to position the terminal 206 at a predetermined position of the extraction electrode 205.

このように、本実施の形態の金属化フィルムコンデンサ1は比較例1の金属化フィルムコンデンサ201に比べ、優れたコンデンサ特性を有している。また、金属化フィルムコンデンサの品質をできるだけ一定に保つためには、上述の理由から凸部207上には接合部を設けないことが望ましいことがわかる。   Thus, the metallized film capacitor 1 of the present embodiment has superior capacitor characteristics as compared to the metallized film capacitor 201 of Comparative Example 1. In addition, it can be seen that it is desirable not to provide a joint on the convex portion 207 for the reason described above in order to keep the quality of the metalized film capacitor as constant as possible.

さらに、図4(a)と図4(c)を比較すると、本実施の形態の金属化フィルムコンデンサ1は比較例2の金属化フィルムコンデンサ301に比べ全体として僅かに誘電正接が低いことがわかる。具体的には誘電正接の平均が、本実施の形態の金属化フィルムコンデンサ1が0.1126%に対し、比較例2の金属化フィルムコンデンサ301が0.136%であった。このように本実施の形態の金属化フィルムコンデンサ1が比較例2の金属化フィルムコンデンサ301に対しても誘電正接が低い結果となっている。これは、本実施の形態の金属化フィルムコンデンサ1の接合部8、9が間隔を空けて離れた位置に設けられていることに対し、比較例2の金属化フィルムコンデンサ301では接合部308、309が隣接して設けられていることに起因するのではないかと推測される。つまり、図3(b)において図示するように、比較例2の金属化フィルムコンデンサ301においては、凸部307より上方は接合部が設けられておらず、この端子306の凸部307より上方の部分は引出電極305から外側方向に浮いてしまい易いことが考えられる。したがって、端子306が引出電極305に十分に密着できず、このため本実施の形態の金属化フィルムコンデンサ1の方が誘電正接が低い結果となったのではないかと推測される。   Furthermore, comparing FIG. 4A and FIG. 4C, it can be seen that the metallized film capacitor 1 of the present embodiment has a slightly lower dielectric loss tangent as a whole than the metallized film capacitor 301 of Comparative Example 2. . Specifically, the average of the dielectric loss tangent was 0.1126% for the metallized film capacitor 1 of the present embodiment and 0.136% for the metallized film capacitor 301 of Comparative Example 2. Thus, the metallized film capacitor 1 of the present embodiment has a lower dielectric loss tangent than the metallized film capacitor 301 of Comparative Example 2. This is because the joints 8 and 9 of the metallized film capacitor 1 of the present embodiment are provided at positions spaced apart from each other, whereas in the metallized film capacitor 301 of Comparative Example 2, the joints 308 and 308 are provided. It is presumed that this is caused by the fact that 309 is provided adjacently. That is, as illustrated in FIG. 3B, in the metallized film capacitor 301 of Comparative Example 2, no joint is provided above the convex portion 307, and the upper portion of the terminal 306 is higher than the convex portion 307. It is conceivable that the portion tends to float outward from the extraction electrode 305. Therefore, it is presumed that the terminal 306 cannot sufficiently adhere to the extraction electrode 305, and therefore the metallized film capacitor 1 of the present embodiment has a lower dielectric loss tangent.

以上、検証結果にて示されるように本実施の形態の金属化フィルムコンデンサ1は誘電正接が他の構成の金属化フィルムコンデンサに比べて低いものであり、優れたコンデンサ特性を有している。   As described above, as shown in the verification results, the metallized film capacitor 1 of the present embodiment has a low dielectric loss tangent compared to the metallized film capacitors of other configurations, and has excellent capacitor characteristics.

また、本実施の形態の金属化フィルムコンデンサ1によると端子6であるリード線が傾いたり、ずれたりして接合されることも無く、2本の端子6の間の寸法精度も優れたものとなっている。   Further, according to the metallized film capacitor 1 of the present embodiment, the lead wire as the terminal 6 is not tilted or displaced, and the dimensional accuracy between the two terminals 6 is excellent. It has become.

特に、本実施の形態の金属化フィルムコンデンサ1は、抵抗溶接以外にも半田付け等の接合手段を用いてもよいものであるが、種々ある接合手段のうち抵抗溶接が望ましい。これは、半田付け時の熱影響により金属化フィルム4端面が熱収縮し、誘電正接が悪化してしまうことを避けるためである。また、元々溶接する引出電極5の面積が狭い本実施の形態の金属化フィルムコンデンサ1のような場合、半田が広がり、引出電極5から半田がはみ出す虞もある。   In particular, the metallized film capacitor 1 of the present embodiment may use joining means such as soldering in addition to resistance welding, but resistance welding is desirable among various joining means. This is to prevent the end face of the metallized film 4 from being heat-shrinked due to the heat effect during soldering and the deterioration of the dielectric loss tangent. Further, in the case of the metallized film capacitor 1 of the present embodiment in which the area of the extraction electrode 5 originally welded is small, the solder spreads and the solder may protrude from the extraction electrode 5.

また、端子6と引出電極5の接合強度を向上させるために引出電極5を形成する溶射金属材料として合金線を用いることがあるが、コストの観点からは本実施の形態の金属化フィルムコンデンサ1のように亜鉛等の単金属で形成された線のみを使用することが望ましい。もちろん、このような単金属で形成された線は合金線に比べて接合強度が劣るものではあるが、本実施の形態の金属化フィルムコンデンサ1では単金属で形成された線にて引出電極5を形成した場合においても十分な接合強度を確保できるものである。したがって、本実施の形態の金属化フィルムコンデンサ1では十分な接合強度の確保と低コスト化を両立できる。   Moreover, in order to improve the joining strength of the terminal 6 and the extraction electrode 5, an alloy wire may be used as the thermal spray metal material for forming the extraction electrode 5, but from the viewpoint of cost, the metallized film capacitor 1 of the present embodiment. Thus, it is desirable to use only a wire formed of a single metal such as zinc. Of course, the wire formed of such a single metal is inferior in bonding strength to the alloy wire, but in the metallized film capacitor 1 of the present embodiment, the lead electrode 5 is formed of a wire formed of a single metal. Even when formed, sufficient bonding strength can be ensured. Therefore, the metallized film capacitor 1 of the present embodiment can achieve both sufficient bonding strength and cost reduction.

(実施の形態2)
本実施の形態の金属化フィルムコンデンサ21においては、図2を用いて示した実施の形態1の金属化フィルムコンデンサと端子の構成が異なる。この本実施の形態の端子26の構成について詳しく説明し、その他の構成については説明を省略する。
(Embodiment 2)
In the metallized film capacitor 21 of the present embodiment, the terminal configuration is different from that of the metallized film capacitor of the first embodiment shown in FIG. The configuration of the terminal 26 of this embodiment will be described in detail, and the description of the other configurations will be omitted.

図5を用いて、本実施の形態の金属化フィルムコンデンサ21の構成について説明する。図5は金属化フィルムコンデンサ21の構成を示す正面断面図である。   The configuration of the metallized film capacitor 21 according to the present embodiment will be described with reference to FIG. FIG. 5 is a front cross-sectional view showing the configuration of the metallized film capacitor 21.

図5にて図示するように、金属化フィルムコンデンサ21においては、端子26が凸部27の上部ならびに下部において金属化フィルムコンデンサ21とは反対方向に屈曲している。そして、この凸部27の上部ならびに下部の屈曲部分の間はアーチを描くように凸部27を跨いだ状態となっている。このため、凸部27とこの凸部27と対向するように配置された端子26のアーチ部30の間には隙間が存在し、凸部27と端子26は非接触状態となっている。なお、接合部28、29はそれぞれアーチ部30の上方向、下方向に設けられている。   As shown in FIG. 5, in the metallized film capacitor 21, the terminal 26 is bent in the opposite direction to the metallized film capacitor 21 at the upper part and the lower part of the convex part 27. And between the upper part and the lower bent part of this convex part 27, it has been in the state which straddled the convex part 27 so that an arch might be drawn. For this reason, a gap exists between the convex portion 27 and the arch portion 30 of the terminal 26 arranged so as to face the convex portion 27, and the convex portion 27 and the terminal 26 are in a non-contact state. The joint portions 28 and 29 are provided in the upward and downward directions of the arch portion 30, respectively.

このように、端子26が凸部27に接触しないように、端子26の形状を予め加工しておくと、溶接時に端子26を引出電極25に押圧した際に凸部27からの反力を受けることがない。したがって、端子26を引出電極25にさらに密着させて強固に溶接することが可能となり、誘電正接をさらに減少させることができる。   Thus, if the shape of the terminal 26 is processed in advance so that the terminal 26 does not come into contact with the convex portion 27, a reaction force from the convex portion 27 is received when the terminal 26 is pressed against the extraction electrode 25 during welding. There is nothing. Therefore, the terminal 26 can be further closely adhered to the extraction electrode 25 and firmly welded, and the dielectric loss tangent can be further reduced.

また、このアーチ部30を基準として端子26を引出電極25に対して位置決めすることが可能となり、位置決め精度も優れたものとなっている。   Further, the terminal 26 can be positioned with respect to the extraction electrode 25 with the arch portion 30 as a reference, and the positioning accuracy is excellent.

なお、アーチ部分の根元の屈曲部は折れ曲がった形状とするより、滑らかに湾曲した形状とすることが望ましい。湾曲した形状とすることにより溶接時の応力の集中を防ぐことができ、端子26の破損を抑制することができる。   Note that it is desirable that the bent portion at the base of the arch portion has a smoothly curved shape rather than a bent shape. By making it a curved shape, concentration of stress during welding can be prevented, and damage to the terminal 26 can be suppressed.

以上、実施の形態1および実施の形態2を用いて説明したように、本発明による金属化フィルムコンデンサは、誘電正接が小さく、コンデンサ特性の優れたものとなっている。   As described above with reference to the first and second embodiments, the metallized film capacitor according to the present invention has a small dielectric loss tangent and excellent capacitor characteristics.

なお、実施の形態1の金属化フィルムコンデンサ1ならびに実施の形態2の金属化フィルムコンデンサ21の説明において「上方」「下方」等の方向を示す用語は、構成部材の相対的な位置関係にのみ依存する相対的な方向を示すものであり、鉛直方向、水平方向等の絶対的な方向を示すものではない。したがって、金属化フィルムコンデンサ1や金属化フィルムコンデンサ21を実使用する際には、必ずしも図2や図5で図示したように端子6や端子26の延設方向が鉛直方向上向きとなるように配置する必要はなく、例えば鉛直方向下向きやあるいは水平方向に向くように配置しても構わない。   In the description of the metallized film capacitor 1 according to the first embodiment and the metallized film capacitor 21 according to the second embodiment, terms indicating directions such as “upward” and “downward” are only relative to the relative positional relationship of the constituent members. It indicates a relative direction depending on the direction, and does not indicate an absolute direction such as a vertical direction or a horizontal direction. Therefore, when the metallized film capacitor 1 or the metallized film capacitor 21 is actually used, the terminals 6 and 26 are arranged so that the extending direction of the terminals 6 and 26 is upward in the vertical direction as shown in FIGS. For example, it may be arranged so as to face vertically downward or horizontally.

また、この発明は実施の形態1の金属化フィルムコンデンサ1や実施の形態2の金属化フィルムコンデンサ21の構成に限定されるものではなく、発明の範囲内で種々変更して実施することが可能である。すなわち、上記の説明においては端子6、26をリード線とした構成を示したが、この構成以外にも端子6、26をバスバーとした構成においても本発明の効果を得ることができる。   Further, the present invention is not limited to the configuration of the metallized film capacitor 1 of the first embodiment and the metalized film capacitor 21 of the second embodiment, and can be implemented with various modifications within the scope of the invention. It is. That is, in the above description, the configuration in which the terminals 6 and 26 are lead wires is shown, but the present invention can be obtained in a configuration in which the terminals 6 and 26 are bus bars in addition to this configuration.

本発明による金属化フィルムコンデンサは、誘電正接が小さくコンデンサ特性に優れるものである。したがって、各種電子機器、電気機器、産業機器の電子、電気回路等、様々な分野において使用される金属化フィルムコンデンサとして有用である。   The metallized film capacitor according to the present invention has a small dielectric loss tangent and excellent capacitor characteristics. Therefore, it is useful as a metallized film capacitor used in various fields such as various electronic devices, electric devices, electronic devices of industrial devices, and electric circuits.

1、21 金属化フィルムコンデンサ
2 素子
3 巻芯
4 金属化フィルム
5、25 引出電極
6、26 端子
7、27 凸部
8、9、28、29 接合部
30 アーチ部
DESCRIPTION OF SYMBOLS 1, 21 Metallized film capacitor 2 Element 3 Core 4 Metallized film 5, 25 Extraction electrode 6, 26 Terminal 7, 27 Convex part 8, 9, 28, 29 Joint part 30 Arch part

Claims (3)

誘電体フィルム上に金属電極膜を有する一対の金属化フィルムを前記金属電極膜が前記誘電体フィルムを介して対向するように巻芯に巻回し、これを押圧することで偏平形状に形成された素子と、
前記素子の両端面に金属を溶射することで設けられた引出電極と、
前記引出電極に接続された端子とを備え、
前記端子は、前記巻芯により前記引出電極上に浮き出た直線状の凸部に対して垂直となるように前記引出電極と接続され、
前記端子と前記引出電極の接合部は、前記凸部の上方ならびに下方に少なくとも1つずつ設けられるとともに、前記凸部は端子と接合されていない金属化フィルムコンデンサ。
A pair of metallized films having a metal electrode film on a dielectric film was wound around a core so that the metal electrode film faced through the dielectric film, and pressed to form a flat shape. Elements,
An extraction electrode provided by spraying metal on both end faces of the element;
A terminal connected to the extraction electrode;
The terminal is connected to the extraction electrode so as to be perpendicular to a linear convex portion that is raised on the extraction electrode by the winding core,
At least one junction between the terminal and the extraction electrode is provided above and below the projection, and the projection is not joined to the terminal.
前記端子と前記引出電極は、抵抗溶接により接続された請求項1に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 1, wherein the terminal and the extraction electrode are connected by resistance welding. 前記端子と前記凸部を非接触状態とした請求項1に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 1, wherein the terminal and the convex portion are in a non-contact state.
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JP2008166457A (en) * 2006-12-28 2008-07-17 Showa Denki Kk Structure of lead terminal of electronic component
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