JP2014156601A5 - - Google Patents

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Publication number: JP2014156601A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2014028997A

Other languages

Japanese (ja)

Other versions

JP2014156601A (en

Filing date

2014-02-18

Publication date

2016-12-22

2014-02-18 Application filed filed Critical

2014-02-18 Priority to JP2014028997A priority Critical patent/JP2014156601A/en

2014-02-18 Priority claimed from JP2014028997A external-priority patent/JP2014156601A/en

2014-08-28 Publication of JP2014156601A publication Critical patent/JP2014156601A/en

2016-12-22 Publication of JP2014156601A5 publication Critical patent/JP2014156601A5/ja

Status Pending legal-status Critical Current

Description

JP2014028997A 2013-01-15 2014-02-18 Curable resin composition, dry film and cured product thereof, and printed wiring board using the same Pending JP2014156601A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2014028997A JP2014156601A (en)	2013-01-15	2014-02-18	Curable resin composition, dry film and cured product thereof, and printed wiring board using the same

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2013004948		2013-01-15
JP2013004948		2013-01-15
JP2014028997A JP2014156601A (en)	2013-01-15	2014-02-18	Curable resin composition, dry film and cured product thereof, and printed wiring board using the same

Related Parent Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2013236002A Division JP5564144B1 (en)	2013-01-15	2013-11-14	Curable resin composition, dry film and cured product thereof, and printed wiring board using them

Publications (2)

Publication Number	Publication Date
JP2014156601A JP2014156601A (en)	2014-08-28
JP2014156601A5 true JP2014156601A5 (en)	2016-12-22

Family

ID=51417090

Family Applications (3)

Application Number	Title	Priority Date	Filing Date
JP2013236002A Active JP5564144B1 (en)	2013-01-15	2013-11-14	Curable resin composition, dry film and cured product thereof, and printed wiring board using them
JP2014028996A Pending JP2014157356A (en)	2013-01-15	2014-02-18	Curable resin composition, dry film and cured product thereof, and printed wiring board using the same
JP2014028997A Pending JP2014156601A (en)	2013-01-15	2014-02-18	Curable resin composition, dry film and cured product thereof, and printed wiring board using the same

Family Applications Before (2)

Application Number	Title	Priority Date	Filing Date
JP2013236002A Active JP5564144B1 (en)	2013-01-15	2013-11-14	Curable resin composition, dry film and cured product thereof, and printed wiring board using them
JP2014028996A Pending JP2014157356A (en)	2013-01-15	2014-02-18	Curable resin composition, dry film and cured product thereof, and printed wiring board using the same

Country Status (2)

Country	Link
JP (3)	JP5564144B1 (en)
KR (2)	KR20140092252A (en)

Families Citing this family (27)

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JP5872650B2 (en) *	2013-09-30	2016-03-01	株式会社タムラ製作所	Photosensitive resin composition
JP5981505B2 (en) *	2013-09-30	2016-08-31	株式会社タムラ製作所	Photosensitive resin composition
JP6390143B2 (en) *	2014-04-08	2018-09-19	東洋インキＳｃホールディングス株式会社	Black composition, black coating film, and laminate
JP5797824B1 (en) *	2014-09-19	2015-10-21	太陽インキ製造株式会社	Curable resin composition for printed wiring board, dry film, cured product, and printed wiring board
JP6383621B2 (en) *	2014-09-24	2018-08-29	太陽インキ製造株式会社	Curable composition, dry film, cured product, printed wiring board and method for producing printed wiring board
JP6376927B2 (en) *	2014-09-30	2018-08-22	株式会社タムラ製作所	Black thermosetting resin composition and flexible substrate having a film obtained by curing the same
JP6704224B2 (en) *	2015-04-15	2020-06-03	太陽インキ製造株式会社	Curable resin composition, dry film, cured product and printed wiring board
JP7018168B2 (en) *	2015-12-22	2022-02-10	昭和電工マテリアルズ株式会社	A photosensitive resin composition, a dry film using the photosensitive resin composition, a printed wiring board, and a method for manufacturing the printed wiring board.
JP6107992B1 (en)	2016-03-02	2017-04-05	住友ベークライト株式会社	Resin sheet
WO2017168697A1 (en) *	2016-03-31	2017-10-05	日立化成株式会社	Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component
WO2017170958A1 (en) *	2016-03-31	2017-10-05	太陽インキ製造株式会社	Curable resin composition, dry film, cured product and printed wiring board
JP7003401B2 (en) *	2016-11-01	2022-02-10	三菱ケミカル株式会社	Active energy ray curable resin composition and coating agent
JP6478351B2 (en) *	2017-08-29	2019-03-06	互応化学工業株式会社	Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board
JP2019139091A (en) *	2018-02-13	2019-08-22	Jnc株式会社	Photosensitive composition
CN111801393B (en) *	2018-03-09	2022-10-18	Dic油墨株式会社	Active energy ray-curable ink, method for producing cured ink, and printed matter
KR20200140288A (en) *	2018-03-30	2020-12-15	다이요 잉키 세이조 가부시키가이샤	Curable resin composition, dry film, cured product, laminated structure, and electronic component
JP7130519B2 (en) *	2018-09-28	2022-09-05	太陽インキ製造株式会社	Curable resin compositions, dry films, cured products, and electronic components
TW202031811A (en) *	2018-12-05	2020-09-01	日商迪愛禧油墨股份有限公司	Active energy ray-curable ink, method for producing ink cured product, and printed matter
JP7405768B2 (en)	2018-12-19	2023-12-26	太陽ホールディングス株式会社	Curable resin compositions, dry films, cured products, and electronic components
JP7300619B2 (en) *	2019-01-11	2023-06-30	太陽ホールディングス株式会社	Laminated structures, dry films, cured products thereof, and electronic components
JP2020148971A (en) *	2019-03-14	2020-09-17	株式会社タムラ製作所	Photosensitive resin composition
JP2021038330A (en) *	2019-09-04	2021-03-11	Ｄｉｃグラフィックス株式会社	Active energy ray-curable ink for lithographic offset printing, method for producing ink cured product, and printed matter
KR20220065777A (en) *	2019-09-19	2022-05-20	헨켈 아게 운트 코. 카게아아	Photocurable (meth)acrylate composition
KR20220070200A (en) *	2019-09-27	2022-05-30	다이요 잉키 세이조 가부시키가이샤	Photocurable black composition, cured product of photocurable black composition, and black coated substrate
US20230221638A1 (en) *	2020-06-18	2023-07-13	Showa Denko Materials Co., Ltd.	Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board
JP2021089442A (en) *	2021-03-09	2021-06-10	昭和電工マテリアルズ株式会社	Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component
WO2023210756A1 (en) *	2022-04-28	2023-11-02	太陽ホールディングス株式会社	Photosensitive resin composition, dry film, cured object, and electronic component

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JP5027357B2 (en) *	2001-03-30	2012-09-19	太陽ホールディングス株式会社	Photo-curable thermosetting resin composition and printed wiring board
JP2003345008A (en) *	2002-05-23	2003-12-03	Mitsubishi Gas Chem Co Inc	Resist resin composition
JP2003345009A (en) *	2002-05-30	2003-12-03	Mitsubishi Gas Chem Co Inc	Resist resin composition
JP4257780B2 (en) *	2003-06-30	2009-04-22	日本化薬株式会社	Photosensitive resin composition, cured product thereof, and use thereof
EP2017307A4 (en) *	2006-04-28	2010-07-07	Showa Denko Kk	Thermosetting resin composition and use thereof
JP4738259B2 (en) *	2006-06-06	2011-08-03	日本化薬株式会社	Photosensitive resin composition and cured product thereof
JP4689553B2 (en) *	2006-08-11	2011-05-25	富士フイルム株式会社	Photocurable coloring composition and color filter using the same
JP2008089916A (en) *	2006-09-29	2008-04-17	Fujifilm Corp	Lithographic printing plate precursor, and lithographic printing plate precursor laminate
JP2008249851A (en) *	2007-03-29	2008-10-16	Fujifilm Corp	Lithographic printing plate precursor
JP2010201886A (en) *	2009-03-06	2010-09-16	Fujifilm Corp	Original plate packing body of planographic printing plate
JP5472692B2 (en) *	2009-07-06	2014-04-16	日立化成株式会社	Photosensitive resin composition capable of alkali development and photosensitive film using the same
JP5641293B2 (en) *	2010-05-28	2014-12-17	日立化成株式会社	Photosensitive resin composition, photosensitive film, permanent resist
JP5007453B2 (en) *	2010-06-11	2012-08-22	株式会社タムラ製作所	Black curable resin composition
JP2012114232A (en) *	2010-11-24	2012-06-14	Kaneka Corp	Flexible printed circuit board with built-in reinforcing plate and method of manufacturing flexible printed circuit board with built-in reinforcing plate
JP6134264B2 (en) *	2011-04-25	2017-05-24	株式会社カネカ	Novel photosensitive resin composition and use thereof
JP5767874B2 (en) *	2011-06-28	2015-08-26	株式会社カネカ	Photosensitive resin composition and use thereof
US9957390B2 (en) *	2012-01-25	2018-05-01	Kaneka Corporation	Resin composition for pigment-containing insulating film, and use thereof
JP2013205624A (en) *	2012-03-28	2013-10-07	Hitachi Chemical Co Ltd	Photosensitive resin composition, permanent mask resist using the same, and method of manufacturing the same
JP6061576B2 (en) *	2012-09-10	2017-01-18	株式会社タムラ製作所	Photosensitive resin composition and printed wiring board having cured film of photosensitive resin composition
JP6045872B2 (en) *	2012-10-04	2016-12-14	株式会社カネカ	Flexible printed wiring board

2013
- 2013-11-14 JP JP2013236002A patent/JP5564144B1/en active Active
2014
- 2014-01-13 KR KR1020140003815A patent/KR20140092252A/en active Search and Examination
- 2014-02-18 JP JP2014028996A patent/JP2014157356A/en active Pending
- 2014-02-18 JP JP2014028997A patent/JP2014156601A/en active Pending
2016
- 2016-04-21 KR KR1020160048785A patent/KR20160051705A/en not_active Application Discontinuation

Publication	Publication Date	Title
JP2015178437A5 (en)	2018-07-05
JP2016540530A5 (en)	2018-11-15
JP2017016753A5 (en)	2018-03-22
JP2014156601A5 (en)	2016-12-22
JP2014220238A5 (en)	2015-08-06
JP2017059339A5 (en)	2018-01-11
JP2014179090A5 (en)	2017-04-27
JP2015007765A5 (en)	2015-02-26
JP2016204575A5 (en)	2018-05-10
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