JP2014137836A - Substrate for suspension, suspension, suspension with head and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of mounting an actuator element in which a pair of electrodes are easily and inexpensively formed.SOLUTION: A substrate 1 for suspension according to the present invention includes: a metal support layer 20; an insulating layer 10 disposed on the metal support layer 20; and a wiring layer 40 disposed on the insulating layer 10. The wiring layer 40 includes a first element connection terminal 45 connected to an actuator element 104. The first element connection terminal 45 includes a connection surface 45a connected to one electrode 104a of the actuator element 104 disposed on the side opposite to the side of the insulating layer 10. The metal support layer 20 includes: a tongue part 21 for supporting a head slider 112; and a second element connection terminal 22 extended upward from the tongue part 21, and connected to the other electrode 104b of the actuator element 104.

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, and a hard disk drive. Regarding hard disk drives.

  Generally, a hard disk drive (HDD) includes a suspension substrate (flexure) on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate is formed to extend from a head region on which the magnetic head slider is mounted to a tail region connected to an FPC substrate (flexible printed circuit board), and a metal support layer and an insulating layer on the metal support layer And a wiring layer having a plurality of wirings stacked via each other, and by writing an electric signal through each wiring, data is written to or read from the disk.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (voice coil motor) that rotates an actuator arm that supports the magnetic head slider is provided by a servo control system. I have control.

  In recent years, there has been an increasing demand for an increase in disk capacity. In order to meet this demand, the density of the disk is increased and the width of the track is reduced. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

  In order to cope with this problem, there is known a dual actuator type suspension in which a VCM actuator and a PZT microactuator (Dual Stage Actuator: DSA) cooperate to move a magnetic head slider to a desired track. This PZT microactuator is composed of a piezo element (piezoelectric element) made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In such a dual actuator type suspension, one in which a piezo element is disposed in a head region of a suspension substrate together with a head slider is known (for example, see Patent Documents 1 to 3). In this case, the accuracy of displacement of the head slider by the piezo element can be improved.

JP 2010-146631 A U.S. Pat. No. 7,719,798 JP 2012-94237 A

  However, the pair of electrodes (piezo connection pads) of the piezoelectric element shown in Patent Document 1 is formed on the side surface. Further, the pair of electrodes of the piezoelectric element shown in Patent Documents 2 and 3 are formed on the same plane of the piezoelectric element.

  Here, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2010-182356, in general, a piezoelectric element is divided into individual pieces by a dicing blade after gold plating is performed on the entire surface of the piezoelectric material. Can be obtained.

  For this reason, as shown in Patent Document 1, when an electrode is formed on the side surface of a piezoelectric element, it is necessary to perform gold plating again on the side surface of the piezoelectric material after being separated into individual pieces. In this case, there arises a problem that the process of forming the electrodes of the piezoelectric element becomes complicated. Further, in this case, since the gold plating is applied to the side surface having a small surface area of the rectangular parallelepiped piezo element, the piezo element may be damaged during handling. Further, as shown in Patent Documents 1 to 3, when a pair of electrodes is formed on the same surface of a piezo element, gold plating is performed on the entire surface using a plating mask or the like to insulate the pair of electrodes. Must be partially removed by etching. Even in this case, there is a problem that the process of forming the electrodes of the piezoelectric element becomes complicated. As a result, there are problems that it is difficult to form an electrode of the piezo element and the piezo element is expensive.

  The present invention has been made in consideration of such points, and includes a suspension substrate, a suspension, a suspension with a head, and a hard disk drive on which an actuator element having a pair of electrodes formed easily and inexpensively can be mounted. The purpose is to provide.

  According to the present invention, as a first solution, an extendable rectangular parallelepiped actuator element for displacing the head slider, the actuator element including a pair of electrodes provided on surfaces facing each other, together with the head slider, A suspension substrate mounted in a region includes a metal support layer, an insulating layer provided on the metal support layer, and a wiring layer provided on the insulating layer, wherein the wiring layer includes the actuator A first element connection terminal connected to the element, wherein the first element connection terminal is provided on the side opposite to the insulating layer side and connected to one of the electrodes of the actuator element The metal support layer includes a tongue portion that supports the head slider, and extends upward from the tongue portion, and the other electrode of the actuator element. Providing suspension substrate, characterized in that it has a second element connection terminal to be connected, the.

  In the suspension substrate according to the first solving means described above, the tongue portion includes a tongue main body that supports the head slider via the actuator element, and the first element connection terminal is provided on the tongue main body. It may be arranged.

  In the suspension substrate according to the first solving means described above, the wiring layer has a slider connection terminal connected to the head slider, and the head slider is disposed on the tongue body via the actuator element. A first support pedestal portion and a second support pedestal portion are provided, the first support pedestal portion is disposed closer to the slider connection terminal than the second support pedestal portion, and an upper surface of the first support pedestal portion is The second support pedestal portion may be disposed on the opposite side of the tongue portion from the upper surface.

  In the suspension substrate according to the first solving means described above, the wiring layer has a plurality of wirings, and a protective layer is provided on the insulating layer to cover the wirings. A first protective layer pedestal forming a first support pedestal, and a second protective layer pedestal forming a second support pedestal, and the thickness of the first protective layer pedestal is You may make it thicker than the thickness of 2 protective layer base parts.

  In the suspension substrate according to the first solving means described above, the wiring layer has a plurality of wirings, and a protective layer is provided on the insulating layer to cover the wirings. A first protective layer pedestal forming a first support pedestal, and a second protective layer pedestal forming a second support pedestal, and a second protection layer on the first protective layer pedestal A layer may be provided.

  In the suspension substrate according to the first solving means described above, the wiring layer has a plurality of wirings, and a protective layer covering the wirings is provided on the insulating layer, and the protective layer is a protective layer. An opening may be included, and the first element connection terminal may be formed in the protective layer opening.

  In the suspension substrate according to the first solving means described above, the first element connection terminal is provided with a filling hole filled with a conductive adhesive that connects the actuator element to the first element connection terminal. You may make it.

  As a second solution, the present invention includes a load beam, the suspension substrate attached to the load beam, and the actuator element mounted on the suspension substrate. To provide a suspension.

  According to a third aspect of the present invention, there is provided a load beam, the above-described suspension substrate attached to the load beam, and the actuator element mounted on the suspension substrate. The beam has a dimple portion that swingably supports the tongue portion of the suspension substrate, and the dimple portion is one of the first support pedestal portion and the second support pedestal portion in plan view. A suspension is provided that is disposed at a position overlapping with the suspension.

  In the suspension according to the third solving means described above, the load beam may have a limiter portion that restricts the swing of the tongue portion within a predetermined range.

  In the suspension according to the third solving means described above, the tongue portion is a frame body portion formed in a frame shape, and connects the tongue main body and the second element connection terminal together with the tongue main body. A frame body part defining a metal support layer opening, and the limiter part of the load beam may be formed in a U shape so as to be folded back through the metal support layer opening. .

  Further, in the suspension according to the third solving means described above, the load beam has two limiter portions, and the second element connection terminal of the suspension substrate has the limiter of the load beam in a plan view. It may be arranged between the parts.

  The present invention provides a suspension with a head, comprising the above-described suspension and the head slider mounted on the suspension.

  The present invention provides a hard disk drive comprising the aforementioned suspension with a head.

  According to the present invention, it is possible to mount an actuator element in which a pair of electrodes is easily and inexpensively formed.

FIG. 1 is a plan view showing an example of a suspension with a head according to an embodiment of the present invention. FIG. 2 is an enlarged plan view showing a head region in the suspension according to the embodiment of the present invention. FIG. 3 is a side view showing the suspension with a head and the disk in the embodiment of the present invention. FIG. 4 is a cross-sectional view showing the head region of FIG. FIG. 5 is an enlarged plan view showing a head region in the suspension substrate according to the embodiment of the present invention. FIG. 6 is an enlarged plan view in which the protective layer is omitted in the head region of FIG. FIG. 7 is a plan view showing an example of a load beam in the suspension according to the embodiment of the present invention. FIG. 8 is an enlarged plan view in which the piezoelectric element is omitted in the head region of FIG. FIG. 9 is an enlarged perspective view showing a limiter portion of the load beam of FIG. FIG. 10 is a perspective view showing an example of the hard disk drive in the embodiment of the present invention. FIGS. 11A to 11C are cross-sectional views for explaining the operation of the load beam limiter in the embodiment of the present invention. FIG. 12 is a cross-sectional view showing a modified example (modified example 1) of FIG. FIG. 13 is a cross-sectional view showing another modification (modification 2) of FIG. FIG. 14 is a cross-sectional view showing another modification (modification 3) of FIG.

  A suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale and the vertical / horizontal dimensional ratio are appropriately changed and exaggerated from those of the actual ones.

  As shown in FIG. 1, the suspension with head 111 includes a suspension 101 and a head slider 112 mounted on the suspension substrate 1. Among them, the head slider 112 is for writing and reading data on a disk 123 (see FIG. 10) to be described later. The head slider 112 is mounted on the head region 2 of the suspension substrate 1 and is connected to a head terminal (slider connection). Terminal) 41. As shown in FIG. 1, the head slider 112 has a read / write unit 112a for writing and reading data, and data is transferred by the read / write unit 112a. The read / write unit 112 a is disposed on the head terminal 41 side of the head slider 112.

  As shown in FIGS. 1 and 2, the suspension 101 is mounted on a base plate 102, a load beam 103 attached on the base plate 102, a suspension substrate 1 attached on the load beam 103, and the suspension substrate 1. A pair of piezoelectric elements (actuator elements) 104. Of these, the base plate 102 and the load beam 103 are both preferably made of stainless steel and fixed to each other by welding. The load beam 103 is attached to the metal support layer 20 (described later) of the suspension substrate 1 by welding. In FIG. 2, the load beam 103 is omitted for the sake of clarity.

  The load beam 103 is provided with a beam jig hole (not shown) corresponding to each jig hole 5 of the suspension substrate 1, and when the load beam 103 is attached to the suspension substrate 1. The suspension substrate 1 and the load beam 103 can be aligned. The jig hole 5 of the suspension substrate 1 and the jig hole of the load beam 103 are arranged on the longitudinal axis (X) shown in FIG.

  As shown in FIGS. 1 and 3, the load beam 103 has a hinge portion 106. The hinge 106 is bent in advance so that the head slider 112 is close to the disk 123, and is formed so as to reduce the bending rigidity. As a result, when the disk 123 rotates in a hard disk drive (see FIG. 10) to be described later, the amount of deflection of the hinge portion 106 changes under the influence of the airflow generated by the rotation of the disk 123, and the head slider 112 moves to the disk. A desired flying height is maintained at 123 and floats.

  Each piezo element 104 is configured as a stretchable piezoelectric element that displaces the head slider 112. That is, the piezo element 104 can be expanded and contracted in the direction of arrow P in FIG. 1, and the head slider 112 is displaced in the sway direction (the turning direction, the direction of arrow Q in FIG. 1).

  As shown in FIG. 4, each piezo element 104 is interposed between a first electrode 104a and a second electrode 104b provided on surfaces facing each other, and between the first electrode 104a and the second electrode 104b, for example, PZT. And a piezoelectric material portion 104c made of a piezoelectric ceramic such as (lead zirconate titanate). Among these, the piezoelectric material portion 104c is formed in a rectangular parallelepiped shape, and the upper surface 104d and the lower surface 104e have a surface area larger than the other four surfaces. The first electrode 104a is provided on the entire lower surface 104e of the piezoelectric material portion 104c by gold plating, and the second electrode 104b is provided on the entire upper surface 104d of the piezoelectric material portion 104c by gold plating. In this case, the process of forming the electrodes 104a and 104b can be simplified, and the electrodes 104a and 104b can be formed easily and inexpensively.

  The piezoelectric material portions 104c of the pair of piezo elements 104 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 104 contracts and the other piezo element 104 104 extends. Thus, the piezo element 104 can be expanded and contracted in the direction of arrow P in FIG. 1 by applying a predetermined voltage between the first electrode 104a and the second electrode 104b.

  Such a piezoelectric element 104 is mounted on the head region 2 of the suspension substrate 1 together with the head slider 112. In the present embodiment, the piezo element 104 is disposed below the head slider 112. That is, as shown in FIG. 4, the piezo element 104 is disposed between a tongue main body 23 (more specifically, a protective layer 50 on the tongue main body 23) described later of the suspension substrate 1 and the head slider 112. Yes.

  Further, as shown in FIG. 1, the piezo element 104 is formed in an elongated shape along the longitudinal axis (X), and the expansion / contraction direction thereof is parallel to the longitudinal axis (X). The piezo elements 104 are arranged symmetrically with respect to the longitudinal axis (X) so that the expansion and contraction of each piezo element 104 is evenly transmitted to the head slider 112.

  Next, the suspension substrate 1 will be described.

  As shown in FIGS. 1 and 4, the suspension substrate 1 includes a head region 2 on which the head slider 112 is mounted and a tail region 3 to which an FPC substrate (external connection substrate) 131 is coupled. . The head region 2 is provided with a plurality of head terminals 41 connected to the slider terminals 112b of the head slider 112 via solder 113, and the tail region 3 is provided with a plurality of tail terminals (external) connected to the FPC board 131. Connection terminal) 42 is provided. The head terminal 41 and the tail terminal 42 are connected to each other via a signal wiring 43 described later.

  As shown in FIG. 4, the suspension substrate 1 includes a metal support layer 20, an insulating layer 10 provided on the metal support layer 20, and a wiring having a plurality of wirings 43 and 44 provided on the insulating layer 10. And a layer 40. That is, the wiring layer 40 is laminated on the metal support layer 20 via the insulating layer 10. A protective layer 50 that covers the wirings 43 and 44 of the wiring layer 40 is provided on the insulating layer 10, and the piezo element 104 is arranged above the protective layer 50.

  The wiring layer 40 includes a plurality of wirings, that is, a signal wiring 43 including a pair of reading wirings and a pair of writing wirings, and a pair of element wirings 44 connected to the first electrode 104a of the piezoelectric element 104. doing. Among these, the signal wiring 43 connects the head terminal 41 and the tail terminal 42, and when an electric signal is passed through the signal wiring 43, the read / write portion 112 a of the head slider 112 is connected to the disk 123 (see FIG. 10). ) Is written or read.

  The wiring layer 40 has a pair of first element connection terminals 45 connected to the element wiring 44. These first element connection terminals 45 are provided in the head region 2 and are connected to the first electrode 104 a of the piezo element 104. The element wiring 44 connects the first element connection terminal 45 and the tail terminal 42, and applies a predetermined voltage to the first electrode 104 a of the piezo element 104.

  The first element connection terminal 45 has a connection surface 45 a provided on the side opposite to the insulating layer 10 side. The connection surface 45a is connected to the first electrode 104a of the piezo element 104. That is, the piezo element 104 is arranged on the opposite side of the first element connection terminal 45 from the insulating layer 10 side. A gold (Au) plating layer 17 is provided on the connection surface 45a. The gold plating layer 70 and the first electrode 104a of the piezo element 104 are electrically connected by a conductive adhesive (for example, silver paste) 105a so that a predetermined voltage is applied to the first electrode 104a. Yes. The gold plating layer 70 is also provided on the head terminal 41 and the tail terminal 42.

  The metal support layer 20 includes a tongue portion 21 that supports the head slider 112, and a second element connection terminal 22 that extends upward from the tongue portion 21 and is connected to the second electrode 104 b of the piezo element 104. . Among these, as shown in FIGS. 2, 5, and 6, the tongue portion 21 includes a tongue main body 23 that supports the head slider 112 via the piezoelectric element 104, a frame body portion 24 that is formed in a frame shape, Is included. The frame body part 24 connects the tongue main body 23 and the second element connection terminal 22, and defines a rectangular metal support layer opening 25 together with the tongue main body 23. The frame portion 24 has flexibility, and is elastically deformed when the piezo element 104 expands and contracts. In this manner, the head slider 112 is displaced in the Q direction by the expansion and contraction of the piezo element 104 in the P direction (see FIG. 1).

  The second element connection terminal 22 extends upward from a portion on the tail region 3 side of the frame body portion 24 and is connected to the second electrode 104 b of the piezo element 104. The second element connection terminal 22 and the second electrode 104b of the piezo element 104 are electrically connected via a conductive adhesive (for example, silver paste) 105b, and the second electrode 104b is grounded. The second element connection terminal 22 can be formed by bending. In FIG. 4, the second element connection terminal 22 is bent at two locations.

  In the present embodiment, the first element connection terminal 45 of the wiring layer 40 is disposed on the tongue main body 23. That is, the first element connection terminal 45 is formed on the tongue main body 23 via the insulating layer 10.

  Further, as shown in FIG. 4, a first support pedestal portion 61 and a second support pedestal portion 62 that support the head slider 112 via the piezo elements 104 are provided on the tongue main body 23. Among these, the first support pedestal portion 61 is disposed closer to the head terminal 41 than the second support pedestal portion 62, and the upper surface 61 a of the first support pedestal portion 61 is more tongue-shaped than the upper surface 62 a of the second support pedestal portion 62. It is arranged on the side opposite to the side of the portion 21 (that is, the tongue main body 23).

  As shown in FIGS. 4 and 6, the insulating layer 10 includes a first insulating layer base part 11 that forms the first support base part 61, and a second insulating layer base part 12 that forms the second support base part 62. ,have. As shown in FIGS. 4 and 5, the protective layer 50 includes a first protective layer base portion 51 that forms the first support base portion 61, and a second protective layer base portion 52 that forms the second support base portion 62. ,have. That is, the first support pedestal portion 61 includes the first insulating layer pedestal portion 11 and the first protective layer pedestal portion 51, and the second support pedestal portion 62 includes the second insulating layer pedestal portion 12 and the second protective layer. And a pedestal 52. In the present embodiment, the thickness of the first protective layer pedestal 51 is thicker than the thickness of the second protective layer pedestal 52. In this case, for example, the second protective layer pedestal portion 52 can be formed by etching the protective layer 50 so as to partially leave the material of the protective layer 50 (for example, half etching).

  The piezo element 104 can be inclined with respect to the tongue main body 23 by the first support pedestal 61 and the second support pedestal 62. The piezo element 104 is mechanically joined to the tongue body 23 using a non-conductive adhesive (not shown). A head slider 112 is mechanically bonded onto the inclined piezo element 104 using a non-conductive adhesive (not shown). As a result, the head slider 112 can be tilted and supported with respect to the tongue main body 23. In this case, the read / write portion 112a of the head slider 112 can be brought close to the disk 123 side.

  In the present embodiment, the tip end portion 2a of the head region 2 is bent with respect to the tongue main body 23 by a folding line L shown in FIG. Since the metal support layer 20 is not formed on the bent front end portion 2a, it can be easily bent. In this way, the head terminal 41 is inclined with respect to the tongue main body 23 as shown in FIG.

  As shown in FIG. 4, the first protective layer pedestal 51 includes a protective layer opening 53. The first element connection terminal 45 is formed in the protective layer opening 53. The upper surface of the gold plating layer 70 provided on the first element connection terminal 45 is disposed below the upper surface of the first protective layer base portion 51.

  3 and 4, the load beam 103 includes a dimple portion 107 that supports the tongue main body 23 of the metal support layer 20 so as to be swingable. The dimple portion 107 is preferably arranged at a position overlapping one of the first support pedestal portion 61 and the second support pedestal portion 62 in plan view. In the present embodiment, the dimple portion 107 is It is arranged at a position overlapping the second support pedestal 62. Here, the term “plan view” is used to mean that the suspension substrate 1 is viewed from the stacking direction. More specifically, the suspension substrate 1 is viewed from the plan view shown in FIGS. It is used in the meaning. The dimple portion 107 is preferably formed so as to protrude toward the tongue main body 23 and has a spherical shape. As a result, the dimple portion 107 can smoothly swing the tongue main body 23. Such a dimple portion 107 is preferably formed by, for example, pressing.

  Next, the limiter unit 108 of the load beam 103 will be described with reference to FIGS.

  As shown in FIGS. 7 to 9, the load beam 103 has a limiter portion 108 that restricts the swing of the tongue portion 21 of the metal support layer 20 within a predetermined range. The limiter portion 108 is formed to be bent in a U shape so as to be folded back through the metal support layer opening 25 defined by the tongue main body 23 and the frame body portion 24. That is, the limiter part 108 includes a base part 108 a located below the frame body part 24, an opening penetrating part 108 b extending through the metal support layer opening part 25, and a folded part located above the frame body part 24 by being folded back. 108c. Among these, the base part 108a is disposed on the main body side of the load beam 103, and the folded part 108c is connected to the base part 108a via the opening penetrating part 108b. The range of regulation of the swing of the tongue portion 21 is defined by the interval between the base portion 108a and the folded portion 108c. In the present embodiment, the interval y between the base portion 108a and the folded portion 108c (FIG. 11). (See (a)) is larger than the thickness of the frame body portion 24 of the tongue portion 21. In this way, the limiter unit 108 regulates the swing of the tongue unit 21 within a predetermined range. In the present embodiment, the funnel beam 43 has three limiter portions 108, and the limiter portions 108 are disposed on both sides of the second element connection terminal 22. That is, the second element connection terminals 22 are arranged between the limiter sections 108 in plan view, and the limiter sections 108 and the second element connection terminals 22 are alternately arranged.

  Here, materials constituting each layer of the suspension substrate 1 will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, the insulation performance between the metal support layer 20 and the wirings 43 and 44 can be ensured, and loss of the rigidity of the suspension substrate 1 as a whole can be prevented.

  Each wiring 43 and 44 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 43 and 44 is not particularly limited as long as it is a material having desired conductivity. It is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 43 and 44 is 1 micrometer-18 micrometers, especially 9 micrometers-12 micrometers, for example. As a result, it is possible to ensure the transmission characteristics of the wirings 43 and 44 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The head terminal 41, the tail terminal 42, and the first element connection terminal 45 have the same material and the same thickness as the wirings 43 and 44.

  The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 20 is preferably 10 μm to 30 μm, more preferably 15 μm to 20 μm. Thereby, the conductivity, rigidity, and elasticity of the metal support layer 20 can be ensured.

  As a material of the protective layer 50, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 50 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 50 is preferably 2 μm to 30 μm, particularly 2 to 6 μm.

  Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. 10 includes a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Among them, the suspension with head 111 is attached to the case 122 so as to be movable, and the voice coil motor 125 for moving the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to a voice coil motor 125 via an arm 126 and is connected to an FPC board 131 (see FIG. 1) connected to a control unit (not shown) that controls the hard disk drive 121. It is connected. In this way, an electrical signal is transmitted between the control unit and the head slider 112 via the suspension board 1 and the FPC board 131.

  Next, a method for manufacturing the suspension substrate 1 in the above-described embodiment will be described.

  First, a laminate (not shown) having an insulating layer 10, a metal support layer 20 provided on one surface of the insulating layer 10, and a wiring layer 40 provided on the other surface of the insulating layer 10 is formed. prepare. Subsequently, the wiring layer 40 is etched into a desired shape, and the head terminal 41, the tail terminal 42, the wirings 43 and 44, and the first element connection terminal 45 are formed. Next, the protective layer 50 covering the wirings 43 and 44 is formed on the insulating layer 10 in a desired shape. Subsequently, the insulating layer 10 is etched into a desired shape. Thereafter, the metal support layer 20 is etched into a desired shape and is subjected to outer shape processing to form the tongue portion 21, the second element connection terminal 22, and the like. After the outer shape of the metal support layer 20 is processed, a part of the second element connection terminal 22 of the metal support layer 20 is bent upward. Moreover, the front-end | tip part 2a of the head area | region 2 is bend | folded along the folding line shown in FIG. Thus, the suspension substrate 1 in the present embodiment is obtained.

  Next, a method for manufacturing the suspension 101 in the present embodiment will be described.

  First, the suspension substrate 1 obtained as described above is attached to the base plate 102 via the load beam 103 by welding. In this case, first, the load beam 103 is fixed to the base plate 102 by welding. Subsequently, the load beam 103, the suspension substrate 1 and the beam jig hole (not shown) provided in the load beam 103 and the jig hole 5 (see FIG. 1) provided in the suspension substrate 1 are provided. The alignment is performed. At this time, the dimple portion 107 of the load beam 103 is disposed so as to overlap the second support pedestal portion 62 of the suspension substrate 1 in plan view. Next, the metal support layer 20 of the suspension substrate 1 is welded, and the load beam 103 and the suspension substrate 1 are joined and fixed to each other. Thereafter, the limiter portion 108 is formed to be folded in a U shape so as to be folded back through the metal support layer opening 25.

  Next, the piezo element 104 is mounted. In this case, first, conductive adhesives 105 a and 105 b are applied to the first element connection terminal 45 and the second element connection terminal 22 of the suspension substrate 1, and non-conductive adhesive is applied to a predetermined position of the tongue main body 23. An agent (not shown) is applied. Subsequently, the piezo element 104 is placed on the first support pedestal portion 61 and the second support pedestal portion 62. Accordingly, the first electrode 104a of the piezo element 104 is connected to the first element connection terminal 45 via the conductive adhesive 105a, and the second electrode 104b is connected to the second element connection terminal 22 via the conductive adhesive 105b. Connected to. The piezo element 104 is mechanically joined to the tongue main body 23 by a non-conductive adhesive. Thereafter, the conductive adhesives 105a and 105b and the non-conductive adhesive are heated and cured.

  In this way, the suspension 101 according to the present embodiment is obtained.

  Thereafter, the head slider 112 is mounted on the obtained suspension 101. In this case, first, a non-conductive adhesive (not shown) is applied on the piezoelectric element 104. Subsequently, the head slider 112 is placed on the piezo element 104. As a result, the head slider 112 is mechanically bonded to the piezo element 104 by a non-conductive adhesive. Thereafter, the solder 113 is supplied to the head terminal 41, and the slider terminal 112 b of the head slider 112 is electrically connected to the head terminal 41. Thus, the suspension with head 111 according to the present embodiment is obtained.

  The FPC board 131 is connected to the tail region 3 of the obtained suspension 111 with head, and then the suspension 111 with head is attached to the case 122 of the hard disk drive 121. In this way, the hard disk drive shown in FIG. 10 is obtained.

  When writing or reading data in the hard disk drive 121 shown in FIG. 10, first, the disk 123 is rotated by the spindle motor 124. Subsequently, the suspension with head 111 retracted to the retracted position turns together with the arm 126 by the voice coil motor 125, and the head slider 112 moves onto the rotating disk 123 (load). The head slider 112 moves along the disk 123 on the disk 123.

  When moving the head slider 112, the voice coil motor 125 roughly adjusts the position of the head slider 112, and the piezo element 104 finely adjusts the position of the head slider 112. That is, by applying a predetermined voltage to the first electrode 104a of the piezo element 104 via the one element wiring 44 and the first element connection terminal 45, a direction along the longitudinal axis (X) (in FIG. 1). In the direction of arrow P), the piezoelectric material portion 104c of one piezoelectric element 104 contracts and the other piezoelectric material portion 104c expands. In this case, the frame body portion 24 of the metal support layer 20 is elastically deformed, and the head slider 112 mechanically joined to the piezo element 104 can be displaced in the sway direction (arrow Q direction in FIG. 1). In this way, the head slider 112 can be quickly and accurately aligned with a desired track of the disk 123.

  When the head slider 112 is loaded, the amount of deflection of the hinge portion 106 (see FIG. 3) of the load beam 103 changes due to the influence of the airflow generated by the rotation of the disk 123. As a result, the head slider 112 can float on the rotating disk 123 while maintaining a desired flying height. Further, while the head slider 112 is positioned on the disk 123, the head slider 112 is swung while being supported by the dimple portion 107 of the load beam 103 under the influence of the airflow generated by the rotation of the disk 123. As a result, the head slider 112 can maintain the flying height with respect to the disk 123. In this manner, data is exchanged between the read / write unit 112 a of the head slider 112 and the disk 123 while the head slider 112 performs a gimbal motion on the disk 123.

  In addition, when the tongue part 21 has not received the strong wind disturbance (refer Fig.11 (a)), the frame part 24 of the metal support layer 20 does not contact | abut the limiter part 108, but the position of the tongue part 21 Is maintained. However, when receiving a strong turbulence, the tongue portion 21 can swing greatly. For example, when the read / write portion 112a of the head slider 112 swings toward the load beam 103 (see FIG. 11B), the frame portion 24 of the metal support layer 20 is the folded portion of the limiter portion 108 of the load beam 103. It is locked by 108c. Further, when the read / write portion 112a of the head slider 112 swings to the side opposite to the load beam 103 side due to the reaction after swinging as shown in FIG. 11B (see FIG. 11C), the metal The frame body portion 24 of the support layer 20 is locked by the base portion 108 a of the limiter portion 108 of the load beam 103. In this way, excessive swinging of the tongue portion 21 can be restricted.

  While data is being transferred, an electric signal is transmitted between the control unit (not shown) connected to the FPC board 131 and the head slider 112 via the suspension board 1 and the FPC board 131. The Such an electric signal is transmitted between the head terminal 41 and the tail terminal 42 by each signal wiring 43 in the suspension board 1.

  When the data transfer is completed, the suspension with head 111 is swung by the voice coil motor 125 together with the arm 126 and moves away from the disk 123 to the retracted position (unloading).

  As described above, according to the present embodiment, the second element connection terminal 22 of the metal support layer 20 is bent upward from the frame body portion 24 of the tongue portion 21 and extends. Thus, the second element connection terminal 22 can be connected to the second electrode 104b on the opposite side of the suspension substrate 1 side from the pair of electrodes 104a and 104b of the piezoelectric element 104. In this case, the first electrode 104a and the second electrode 104b of the piezoelectric element 104 can be formed on the upper surface 104d and the lower surface 104e facing each other of the piezoelectric material portion 104c, and the first electrode 104a and the second electrode 104b can be easily formed. And can be formed inexpensively. That is, the piezo element 104 in which the pair of electrodes 104 a and 104 b is easily and inexpensively formed can be mounted on the suspension substrate 1.

  Further, according to the present embodiment, the second electrode 104b of the piezo element 104 can be partially covered by the second element connection terminal 22 of the metal support layer 20 located above the second electrode 104b. Accordingly, it is possible to prevent other surrounding structures or the like from coming into direct contact with the piezoelectric element 104 and to prevent the piezoelectric element 104 from being damaged.

  Further, according to the present embodiment, the first element connection terminal 45 is disposed on the tongue main body 23. Thus, the head slider 112 can be mounted on the piezo element 104, and the read / write portion 112 a of the head slider 112 can be brought close to the disk 123. In this case, the accuracy of data transfer between the read / write unit 112a of the head slider 112 and the disk 123 can be improved. In this case, the transmission loss of the stretching force of the piezo element 104 can be reduced, and the head slider 112 can be displaced with high accuracy. Further, in this case, the amount of expansion / contraction of the piezo element 104 necessary for displacing the head slider 112 can be reduced, and the amount of power required for expansion / contraction of the piezo element 104 can be reduced. In particular, according to the present embodiment, since the head slider 112 is disposed on the piezo element 104, the head slider 112 can be displaced with higher accuracy and the amount of electric power required for the expansion and contraction of the piezo element 104 can be further increased. Further reduction can be achieved.

  Further, according to the present embodiment, the first support pedestal portion 61 that supports the head slider 112 via the piezo element 104 is disposed closer to the head terminal 41 than the second support pedestal portion 62. The upper surface 61 a of the portion 61 is disposed on the opposite side of the tongue portion 21 from the upper surface 62 a of the second support pedestal portion 62. Thus, the piezo element 104 and the head slider 112 can be tilted so that the read / write portion 112 a of the head slider 112 is close to the disk 123. Therefore, the accuracy of data transfer between the read / write unit 112a of the head slider 112 and the disk 123 can be further improved.

  Further, according to the present embodiment, the second protective layer pedestal portion 52 of the protective layer 50 that forms the second support pedestal portion 62 is etched so as to partially leave the material of the protective layer 50, and the second The thickness of the first protective layer pedestal 51 of the protective layer 50 that forms the first support pedestal 61 is greater than the thickness of the protective layer pedestal 52. Accordingly, the upper surface 61a of the first support pedestal portion 61 can be easily disposed on the opposite side of the tongue portion 21 from the upper surface 62a of the second support pedestal portion 62.

  Further, according to the present embodiment, the first element connection terminal 45 is formed in the protective layer opening 53 of the protective layer 50. Accordingly, it is possible to suppress the conductive adhesive 105a that connects the first element connection terminal 45 and the first electrode 104a of the piezo element 104 from leaking to the surrounding area and being contaminated.

  Further, according to the present embodiment, the dimple portion 107 of the load beam 103 is disposed at a position overlapping the second support pedestal portion 62 in plan view. As a result, the dimple portion 107 can support the head slider 112 in a swingable manner via a relatively rigid member. That is, it is possible to prevent the gimbal movement of the head slider 112 from being hindered by the low rigidity of the non-conductive adhesive for joining the piezo element 104 to the tongue main body 23. For this reason, even when the head slider 112 is supported by the tongue main body 23 via the piezo element 104, the gimbal motion of the head slider 112 can be prevented from being hindered.

  Further, according to the present embodiment, the load beam 103 has the limiter portion 108 that restricts the swinging of the tongue portion 21 of the metal support layer 20. Thus, even when a strong turbulence is generated by the airflow of the rotating disk 123, the swing of the tongue portion 21 can be restricted within a predetermined range, and the positional accuracy of the head slider 112 with respect to the disk 123 is improved. Can be suppressed. In particular, according to the present embodiment, the limiter portion 108 is formed in a U shape so as to be folded back through the metal support layer opening 25 defined by the tongue main body 23 and the frame body portion 24. In this case, by changing the bending position, it is possible to adjust the swing restriction range of the tongue portion 21. When the second element connection terminal 22 of the metal support layer 20 of the suspension substrate 1 is bent as described above, it is possible to form a portion having the same function as the limiter unit 108 in the metal support layer 20. Although it becomes difficult, by forming the limiter portion 108 in the load beam 103 as in the present embodiment, a structure for restricting the swing of the tongue portion 21 can be easily realized.

  Furthermore, according to the present embodiment, the second element connection terminal 22 of the metal support layer 20 is disposed between the limiter portions 108 of the load beam 103 in plan view. Thus, the limiter unit 108 can regulate not only the swinging of the tongue unit 21 but also the movement in the lateral direction (direction perpendicular to the longitudinal axis (X)). For this reason, it is possible to further suppress the deterioration of the positional accuracy of the head slider 112 with respect to the disk 123.

  In the embodiment described above, the thickness of the first protective layer pedestal 51 of the protective layer 50 that forms the first support pedestal 61 is equal to the second protective layer pedestal that forms the second support pedestal 62. The example where it is thicker than the thickness of the portion 52 has been described. However, the present invention is not limited to this. For example, as shown in FIG. 12, the thickness of the first protective layer base 51 is the same as the thickness of the second protective layer base 52, and the first protective layer base The second protective layer 80 may be provided on the portion 51, and the first support base portion 61 may be formed by the first protective layer base portion 51 and the second protective layer 80 (Modification 1). . Even in this case, the upper surface 61a of the first support pedestal portion 61 can be easily arranged on the side opposite to the tongue portion 21 side from the upper surface 62a of the second support pedestal portion 62. Such a second protective layer 80 can be similarly formed using the same material as the first protective layer pedestal 51 of the protective layer 50. Even when the second protective layer 80 is provided, the thickness of the first protective layer base 51 may be greater than the thickness of the second protective layer base 52. Here, “identical” is not limited to the meaning of exactly the same, but includes the case where it can be regarded as substantially the same including manufacturing errors and the like.

  Further, in the present embodiment described above, for example, as shown in FIG. 13, the first element connection terminal 45 is filled with a conductive adhesive that connects the piezo element 104 to the first element connection terminal 45. 90 may be provided (Modification 2). In this case, the contact area between the first element connection terminal 45 and the conductive adhesive can be increased, and the bonding strength between the first element connection terminal 45 and the conductive adhesive can be increased. Further, in this case, it is preferable that a gold plating layer 70 is also formed in the filling hole 90 as shown in FIG.

  Further, in the present embodiment described above, the upper surface 61a of the first support pedestal portion 61 is disposed on the opposite side of the upper surface 62a of the second support pedestal portion 62 from the tongue portion 21, and the piezoelectric element 104 and The example in which the head slider 112 is supported on the tongue body 23 while being inclined has been described. However, the present invention is not limited to this. For example, as shown in FIG. 14, the upper surface 61 a of the first support pedestal portion 61 is disposed on the same plane as the upper surface 62 a of the second support pedestal portion 62, and 104 and the head slider 112 may be arranged parallel to the tongue main body 23 (Modification 3). In this case, the manufacturing efficiency of the first support base 61 and the second support base 62 can be improved. Here, the term “parallel” is not limited to the meaning of being strictly parallel, but also includes the case where it can be regarded as substantially parallel including manufacturing errors and the like.

  In the above-described embodiment, the example in which the head slider 112 is supported on the tongue main body 23 via the piezo element 104 has been described. However, the present invention is not limited to this, and both sides of the head slider 112 (on both sides of the longitudinal axis (X) in plan view, as shown in FIG. 2) so that the piezo element 104 does not overlap the head slider 112 in plan view. It may be arranged on both the left and right sides. In this case, the thickness of the head region 2 where the piezo element 104 and the head slider 112 are mounted can be reduced.

  Further, in the above-described embodiment, an example in which a pair of (two) piezo elements 104 formed separately is mounted in the head region 2 has been described. However, the present invention is not limited to this, and a single piezoelectric element in which piezoelectric material portions having polarization directions different from each other by 180 ° are integrally formed can be mounted on the head region 2.

  As described above, the embodiments of the present invention have been described in detail. However, the suspension substrate, the suspension, the suspension with a head, and the hard disk drive according to the present invention are not limited to the above-described embodiments, and the gist of the present invention. Various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 10 Insulating layer 20 Metal support layer 21 Tongue part 22 2nd element connection terminal 23 Tongue body 24 Frame part 25 Metal support layer opening part 40 Wiring layer 41 Head terminal 43 Signal wiring 44 Element wiring 45 1st 1-element connection terminal 45a Connection surface 50 Protective layer 51 First protective layer pedestal portion 52 Second protective layer pedestal portion 53 Protective layer opening 61 First support pedestal portion 61a Upper surface 62 Second support pedestal portion 62a Upper surface 80 Second protection Layer 90 Filling hole 101 Suspension 103 Load beam 104 Piezo element 104a First electrode 104b Second electrodes 105a and 105b Conductive adhesive 107 Dimple part 108 Limiter part 111 Suspension with head 112 Head slider 121 Hard disk drive

Claims (14)

In a suspension substrate mounted in a head region together with the head slider, an actuator element including a pair of electrodes provided on mutually opposing surfaces, which is an extendable rectangular parallelepiped actuator element that displaces the head slider,
A metal support layer;
An insulating layer provided on the metal support layer;
A wiring layer provided on the insulating layer,
The wiring layer has a first element connection terminal connected to the actuator element,
The first element connection terminal includes a connection surface provided on the side opposite to the insulating layer side and connected to one of the electrodes of the actuator element,
The metal support layer includes a tongue portion that supports the head slider, and a second element connection terminal that extends upward from the tongue portion and is connected to the other electrode of the actuator element. Suspension board characterized. The tongue portion includes a tongue body that supports the head slider via the actuator element,
The suspension substrate according to claim 1, wherein the first element connection terminal is disposed on the tongue main body. The wiring layer has a slider connection terminal connected to the head slider,
A first support pedestal portion and a second support pedestal portion that support the head slider via the actuator element are provided on the tongue main body,
The first support pedestal portion is disposed closer to the slider connection terminal than the second support pedestal portion,
The suspension substrate according to claim 2, wherein an upper surface of the first support pedestal portion is disposed on a side opposite to the tongue portion side from an upper surface of the second support pedestal portion. The wiring layer has a plurality of wirings,
A protective layer covering the wiring is provided on the insulating layer,
The protective layer includes a first protective layer pedestal that forms the first support pedestal, and a second protective layer pedestal that forms the second support pedestal,
The suspension substrate according to claim 3, wherein a thickness of the first protective layer pedestal portion is larger than a thickness of the second protective layer pedestal portion. The wiring layer has a plurality of wirings,
A protective layer covering the wiring is provided on the insulating layer,
The protective layer includes a first protective layer pedestal that forms the first support pedestal, and a second protective layer pedestal that forms the second support pedestal,
The suspension substrate according to claim 3, wherein a second protective layer is provided on the first protective layer base portion. The wiring layer has a plurality of wirings,
A protective layer covering the wiring is provided on the insulating layer,
The protective layer includes a protective layer opening,
4. The suspension substrate according to claim 1, wherein the first element connection terminal is formed in the protective layer opening. 5.   The filling hole filled with the conductive adhesive which connects the said actuator element to the said 1st element connection terminal is provided in the said 1st element connection terminal in any one of the Claims 1 thru | or 6 characterized by the above-mentioned. The suspension substrate described. Load beam,
The suspension substrate according to any one of claims 1 to 7, attached to the load beam;
A suspension comprising the actuator element mounted on the suspension substrate. Load beam,
The suspension substrate according to any one of claims 3 to 5 attached to the load beam;
The actuator element mounted on the suspension substrate,
The load beam has a dimple portion that swingably supports the tongue portion of the suspension substrate,
The dimple portion is disposed at a position overlapping one of the first support pedestal portion and the second support pedestal portion in plan view.   The suspension according to claim 9, wherein the load beam has a limiter portion that restricts swinging of the tongue portion within a predetermined range. The tongue portion is a frame body portion formed in a frame shape, and includes a frame body portion that connects the tongue main body and the second element connection terminal and defines a metal support layer opening together with the tongue main body. ,
The suspension according to claim 10, wherein the limiter portion of the load beam is formed in a U shape so as to be folded back through the opening of the metal support layer. The load beam has two limiter parts,
The suspension according to claim 10 or 11, wherein the second element connection terminal of the suspension substrate is disposed between the limiter portions of the load beam in a plan view. The suspension according to any one of claims 8 to 12,
A suspension with a head, comprising: the head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 13.

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