JP2014136654A - Coated magnesium oxide powder and its manufacturing method - Google Patents

Coated magnesium oxide powder and its manufacturing method Download PDF

Info

Publication number
JP2014136654A
JP2014136654A JP2013004311A JP2013004311A JP2014136654A JP 2014136654 A JP2014136654 A JP 2014136654A JP 2013004311 A JP2013004311 A JP 2013004311A JP 2013004311 A JP2013004311 A JP 2013004311A JP 2014136654 A JP2014136654 A JP 2014136654A
Authority
JP
Japan
Prior art keywords
resin
magnesium oxide
oxide powder
phosphate
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013004311A
Other languages
Japanese (ja)
Other versions
JP2014136654A5 (en
JP5972179B2 (en
Inventor
Akira Kuroda
明 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tateho Chemical Industries Co Ltd
Original Assignee
Tateho Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateho Chemical Industries Co Ltd filed Critical Tateho Chemical Industries Co Ltd
Priority to JP2013004311A priority Critical patent/JP5972179B2/en
Priority to PCT/JP2014/000055 priority patent/WO2014112334A1/en
Priority to CN201480003982.8A priority patent/CN104903239B/en
Priority to KR1020157021608A priority patent/KR101751380B1/en
Priority to TW103101353A priority patent/TWI597312B/en
Publication of JP2014136654A publication Critical patent/JP2014136654A/en
Publication of JP2014136654A5 publication Critical patent/JP2014136654A5/ja
Application granted granted Critical
Publication of JP5972179B2 publication Critical patent/JP5972179B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01FCOMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00Compounds of magnesium
    • C01F5/02Magnesia
    • C01F5/06Magnesia by thermal decomposition of magnesium compounds
    • C01F5/08Magnesia by thermal decomposition of magnesium compounds by calcining magnesium hydroxide
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/02Compounds of alkaline earth metals or magnesium
    • C09C1/028Compounds containing only magnesium as metal
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/80Particles consisting of a mixture of two or more inorganic phases
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/14Pore volume
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/16Pore diameter
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/32Thermal properties
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/80Compositional purity
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/06Treatment with inorganic compounds
    • C09C3/063Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a coated magnesium oxide powder excellent in thermal conductivity and moisture resistance, filling property when used as a filler for a resin, high in flowability of a resin composition after filling, and excellent in moldability as a result.SOLUTION: There is provided a coated magnesium oxide powder having a magnesium oxide powder exhibiting a particle internal cavity amount of 0.3 to 0.8 cm/g, a mode diameter of 0.2 to 1.0 μm and an inflection point diameter of 0.9 μm or more in a mercury penetration-type pore distribution, and a coated layer consisting of a magnesium phosphate compound on at least a part of the surface of the powder, and having the content of phosphorus in the coated magnesium oxide powder of 0.1 to 10 mass%.

Description

本発明は、樹脂に対する充填材として使用可能な被覆酸化マグネシウム粉末、及びその製造方法に関する。また、本発明は、前記被覆酸化マグネシウム粉末を含む樹脂組成物、及び当該樹脂組成物からなる放熱性部材に関する。   The present invention relates to a coated magnesium oxide powder that can be used as a filler for a resin, and a method for producing the same. Moreover, this invention relates to the heat radiating member which consists of the resin composition containing the said covering magnesium oxide powder, and the said resin composition.

電子デバイスは、積層体、プリント配線板、多層配線板等の電子部品により構成されている。電子部品には、通常、樹脂組成物がプリプレグ、スペーサー、封止剤、接着性シート等に用いられており、当該樹脂組成物には、様々な性能又は特性が要求されている。例えば、最近の傾向として、電子デバイスにおける大容量パワー素子の搭載、高密度な実装が見られ、それに伴い樹脂組成物及びその応用品に対し従来よりも更に優れた放熱性、耐湿性が要求されている。   The electronic device is composed of electronic components such as a laminate, a printed wiring board, and a multilayer wiring board. In electronic parts, resin compositions are usually used for prepregs, spacers, sealants, adhesive sheets, and the like, and various performances or characteristics are required for the resin compositions. For example, as a recent trend, mounting of large-capacity power elements in electronic devices and high-density mounting are seen, and accordingly, heat dissipation and moisture resistance superior to conventional ones are required for resin compositions and their applications. ing.

半導体封止用の樹脂組成物に用いる充填材(フィラー)は、従来、二酸化ケイ素(以下、シリカという)、酸化アルミニウム(以下、アルミナという)が用いられてきた。しかし、シリカの熱伝導性は低く、高集積化、高電力化、高速化等による発熱量の増大に対応する放熱が充分ではないため、半導体の安定動作等に問題が生じていた。一方、シリカより熱伝導性が高いアルミナを使用すると、放熱性は改善されるが、アルミナは硬度が高いために、混練機や成型機及び金型の摩耗が激しくなるという問題点があった。   Conventionally, silicon dioxide (hereinafter referred to as silica) and aluminum oxide (hereinafter referred to as alumina) have been used as a filler (filler) used in a resin composition for semiconductor encapsulation. However, the thermal conductivity of silica is low, and heat dissipation corresponding to an increase in the amount of heat generated due to high integration, high power, high speed, etc. is insufficient, causing problems in stable operation of the semiconductor. On the other hand, when alumina having higher thermal conductivity than silica is used, the heat dissipation is improved, but since alumina has a high hardness, there has been a problem that the wear of the kneader, the molding machine and the mold becomes severe.

そこで、シリカに比べて熱伝導率が1桁高く、アルミナの約2倍の熱伝導率を有する酸化マグネシウムが半導体封止用樹脂充填材の材料として検討されている。しかし、酸化マグネシウム粉末は、シリカ粉末に比べ、吸湿性が大きい。そのため、半導体封止用樹脂充填材として酸化マグネシウム粉末を用いた場合、吸湿した水と酸化マグネシウムが水和して、充填材の体積が膨張し、これによるクラックの発生、熱伝導性の低下等の問題が発生していた。このため、半導体封止用樹脂充填材として用いる酸化マグネシウム粉末に耐湿性を付与することが、半導体の長期的な安定動作を保証する上で大きな課題となっていた。   Therefore, magnesium oxide, which has a thermal conductivity that is an order of magnitude higher than that of silica and approximately twice that of alumina, has been studied as a material for resin fillers for semiconductor encapsulation. However, the magnesium oxide powder has higher hygroscopicity than the silica powder. Therefore, when magnesium oxide powder is used as a resin filler for semiconductor encapsulation, the absorbed water and magnesium oxide are hydrated and the volume of the filler expands, resulting in cracks, reduced thermal conductivity, etc. The problem was occurring. For this reason, providing moisture resistance to the magnesium oxide powder used as the resin filler for semiconductor encapsulation has been a major issue in ensuring long-term stable operation of the semiconductor.

酸化マグネシウム粉末の耐湿性を改善させる方法として、特許文献1及び特許文献2にはアルミニウム塩又はケイ素化合物と酸化マグネシウム粉末を混合し、固体分をろ別し、乾燥させて、焼成することにより、該酸化マグネシウム粉末の表面を、アルミニウム又はケイ素とマグネシウムの複酸化物を含む被覆層で被覆することを特徴とする被覆酸化マグネシウム粉末の製造方法が開示されている。   As a method for improving the moisture resistance of magnesium oxide powder, Patent Document 1 and Patent Document 2 include mixing an aluminum salt or a silicon compound and magnesium oxide powder, filtering off solids, drying, and firing. There is disclosed a method for producing a coated magnesium oxide powder, wherein the surface of the magnesium oxide powder is coated with a coating layer containing aluminum or a double oxide of silicon and magnesium.

特開2003−34522号公報JP 2003-34522 A 特開2003−34523号公報JP 2003-34523 A

しかしながら、上述した方法により得られた被覆酸化マグネシウム粉末は耐湿性が改善されたものの、粉末粒子は角張った形状をしているため、樹脂への充填性が低く、さらに得られた樹脂組成物の流動性が低いという問題がある。   However, although the coated magnesium oxide powder obtained by the above-described method has improved moisture resistance, the powder particles have an angular shape, so that the filling property to the resin is low, and the obtained resin composition There is a problem of low fluidity.

本発明の目的は、上記の課題を解消し、熱伝導性に加えて耐湿性に優れると共に、さらに、樹脂への充填材として用いる際、充填後の樹脂組成物の流動性が高く、その結果、成形性に優れた被覆酸化マグネシウム粉末、及びその製造方法を提供することである。本発明の他の目的は、当該被覆酸化マグネシウム粉末を含む樹脂組成物、及び当該樹脂組成物からなる放熱性部材を提供することである。   The object of the present invention is to solve the above-mentioned problems, and is excellent in moisture resistance in addition to thermal conductivity. Further, when used as a filler for a resin, the fluidity of the resin composition after filling is high. An object of the present invention is to provide a coated magnesium oxide powder excellent in moldability and a method for producing the same. Another object of the present invention is to provide a resin composition containing the coated magnesium oxide powder and a heat dissipating member comprising the resin composition.

本発明は、水銀圧入式細孔分布において、粒子内空隙量が0.3〜0.8cm/g、モード径が0.2〜1.0μm、及び変曲点径が0.9μm以上を示す酸化マグネシウム粉末と、前記酸化マグネシウム粉末の表面の少なくとも一部に、リン酸マグネシウム系化合物よりなる被覆層と、を有し、被覆酸化マグネシウム粉末内のリンの含有量が0.1〜10質量%であることを特徴とする、被覆酸化マグネシウム粉末に関する。 In the mercury intrusion pore distribution, the present invention has an interparticle void amount of 0.3 to 0.8 cm 3 / g, a mode diameter of 0.2 to 1.0 μm, and an inflection point diameter of 0.9 μm or more. The magnesium oxide powder shown and a coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder, and the phosphorus content in the coated magnesium oxide powder is 0.1 to 10 mass % Of the coated magnesium oxide powder.

また本発明は、当該被覆酸化マグネシウム粉末からなる充填材にも関する。   The present invention also relates to a filler comprising the coated magnesium oxide powder.

さらに本発明は、樹脂と、当該充填材とを含有する樹脂組成物にも関する。当該樹脂組成物は、接着剤または半導体封止剤等の放熱性部材として使用することができる。   Furthermore, this invention relates also to the resin composition containing resin and the said filler. The said resin composition can be used as heat radiating members, such as an adhesive agent or a semiconductor sealing agent.

さらにまた、本発明は、Bを100〜1000ppm、Naを300ppm以下、Kを300ppm以下、Clを0.02〜0.5質量%含み、かつ、SiをSiOに換算して0.02〜0.5質量%、CaをCaOに換算して0.1〜0.8質量%含む、純度98%以上の水酸化マグネシウムを、1000℃〜1200℃で焼成することにより、酸化マグネシウム粉末を得た後、前記酸化マグネシウム粉末を、リン化合物と混合して、300℃以上で焼成することにより、前記酸化マグネシウム粉末の表面の少なくとも一部にリン酸マグネシウム系化合物よりなる被覆層を形成することを特徴とする、被覆酸化マグネシウム粉末の製造方法にも関する。 Furthermore, the present invention includes B in an amount of 100 to 1000 ppm, Na in an amount of 300 ppm or less, K in an amount of 300 ppm or less, Cl in an amount of 0.02 to 0.5% by mass, and Si in terms of SiO 2. Magnesium oxide powder is obtained by calcining magnesium hydroxide having a purity of 98% or more and containing 0.1 to 0.8% by mass of Ca in terms of CaO in an amount of 0.5% by mass at 1000 ° C to 1200 ° C. Then, the magnesium oxide powder is mixed with a phosphorus compound and fired at 300 ° C. or higher to form a coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder. The invention also relates to a method for producing a coated magnesium oxide powder.

本発明によれば、熱伝導性に加えて耐湿性に優れると共に、さらに、樹脂への充填材として用いる際の充填性に優れ、かつ、充填後の樹脂組成物の流動性が高く、その結果、成形性に優れた被覆酸化マグネシウム粉末を提供することができる。   According to the present invention, in addition to thermal conductivity, it is excellent in moisture resistance, and further, it has excellent filling properties when used as a filler for a resin, and the fluidity of the resin composition after filling is high. The coated magnesium oxide powder having excellent moldability can be provided.

実施例1で製造した被覆酸化マグネシウム粉末を撮影した電子顕微鏡写真Electron micrograph of the coated magnesium oxide powder produced in Example 1

以下、本発明を具体的に説明する。   Hereinafter, the present invention will be specifically described.

本発明の被覆酸化マグネシウム粉末は、特定の物性を示す酸化マグネシウム粉末と、その表面に形成された、リン酸マグネシウム系化合物よりなる被覆層と、を有するものである。リン酸マグネシウム系化合物からなる被覆層は、酸化マグネシウム粉末の全表面に形成されていてもよいし、酸化マグネシウム粉末の表面の一部のみに形成されていてもよい。リン酸マグネシウム系化合物からなる被覆層によって被覆されていない酸化マグネシウム粉末表面は露出していてよい。   The coated magnesium oxide powder of the present invention has a magnesium oxide powder having specific physical properties and a coating layer formed on the surface and made of a magnesium phosphate compound. The coating layer made of a magnesium phosphate compound may be formed on the entire surface of the magnesium oxide powder, or may be formed only on a part of the surface of the magnesium oxide powder. The surface of the magnesium oxide powder that is not covered with the coating layer made of the magnesium phosphate compound may be exposed.

本発明において、酸化マグネシウム粉末は、粒子内空隙量が0.3〜0.8cm/g、モード径が0.2〜1.0μm、及び変曲点径が0.9μm以上を満足する。このような酸化マグネシウム粉末の表面にリン酸マグネシウム系化合物よりなる被覆層を形成することによって、本発明の被覆酸化マグネシウム粉末を熱伝導性の充填材として好適に利用することが可能となる。 In the present invention, the magnesium oxide powder satisfies an inter-particle void amount of 0.3 to 0.8 cm 3 / g, a mode diameter of 0.2 to 1.0 μm, and an inflection point diameter of 0.9 μm or more. By forming a coating layer made of a magnesium phosphate compound on the surface of such magnesium oxide powder, the coated magnesium oxide powder of the present invention can be suitably used as a thermally conductive filler.

なお、各測定値は、水銀圧入式細孔分布測定装置において測定された数値である。   In addition, each measured value is a numerical value measured in the mercury intrusion type pore distribution measuring device.

変曲点径、及び粒子内空隙量は、累積細孔容積曲線から求めることができ、累積細孔容積曲線において、縦軸は、試料単位重量当たりの、大きな細孔から順に求めた粒子の細孔容積の累積値である累積細孔容積を表し、横軸は、細孔直径を表す。   The inflection point diameter and the amount of voids in the particle can be obtained from the cumulative pore volume curve. In the cumulative pore volume curve, the vertical axis represents the fine particle size obtained in order from the largest pore per unit weight of the sample. The cumulative pore volume, which is the cumulative value of the pore volume, is represented, and the horizontal axis represents the pore diameter.

変曲点とは、累積細孔容積曲線が急激に立ち上る点である。測定試料に応じて、変曲点の数は1個に限られず、複数個存在する場合があるが、細孔直径が最も大きい変曲点を、本発明の変曲点とした。変曲点径は、変曲点における細孔直径である。   The inflection point is the point at which the cumulative pore volume curve rises rapidly. Depending on the measurement sample, the number of inflection points is not limited to one, and there may be a plurality of inflection points, but the inflection point with the largest pore diameter is defined as the inflection point of the present invention. The inflection point diameter is the pore diameter at the inflection point.

変曲点径が0.9μm未満であると、細かい粒子の量が増加するため、樹脂に充填する際に急激な粘度の上昇が発生する。好ましくは、変曲点径は0.9〜1.5μmである。   If the inflection point diameter is less than 0.9 μm, the amount of fine particles increases, so that a sudden increase in viscosity occurs when filling the resin. Preferably, the inflection point diameter is 0.9 to 1.5 μm.

粒子内空隙量は、粒子内に存在する凝集粒子径よりも小さな空隙の量であり、粒子内空隙量は、細孔直径0.003×10−6〜100×10−6mにおける累積細孔容積で表される全細孔容積から、前記変曲点における累積細孔容積を減じた容積で表される。 The amount of voids in the particles is the amount of voids smaller than the aggregated particle diameter present in the particles, and the amount of voids in the particles is the cumulative pores at pore diameters of 0.003 × 10 −6 to 100 × 10 −6 m. The total pore volume represented by the volume is represented by a volume obtained by subtracting the cumulative pore volume at the inflection point.

酸化マグネシウム粉末の粒子内空隙量が0.3cm/g未満であると、粒子中の空隙が少なく、粒子中に十分な量の樹脂が浸透せず、樹脂組成物の機械的強度が悪化する。また、熱伝導性についても低下する。一方、粒子内空隙量が0.8cm/gを超えると、粒子内空隙が粒子奥深くまで存在するため、空隙内部まで樹脂が十分に行き渡らず、粒子と樹脂の間に気泡が発生し熱伝導性が低下する。好ましくは、粒子内空隙量は0.3〜0.7cm/gである。 When the void amount in the particle of the magnesium oxide powder is less than 0.3 cm 3 / g, the void in the particle is small, a sufficient amount of resin does not penetrate into the particle, and the mechanical strength of the resin composition deteriorates. . Moreover, thermal conductivity is also reduced. On the other hand, when the amount of voids in the particles exceeds 0.8 cm 3 / g, the voids in the particles exist deep inside the particles, so that the resin does not reach the inside of the voids sufficiently, and bubbles are generated between the particles and the resin to conduct heat. Sex is reduced. Preferably, the amount of voids in the particle is 0.3 to 0.7 cm 3 / g.

モード径は、水銀圧入式細孔分布測定から求めることができ、log微分細孔容積分布曲線の最大値に対応する細孔直径である。本発明の酸化マグネシウム粒子の細孔分布を、水銀圧入測定装置によって測定した場合、モード径は、酸化マグネシウム粒子同士の間の空隙の直径に対応する。酸化マグネシウム粉末のモード径が0.2μm未満であると、細かい粒子の量が増加するため、樹脂に充填する際に急激な粘度の上昇が発生する。一方、モード径が1.0μmを超えると、大きな粒子の量が増加するため、樹脂組成物の機械的強度が悪化する。また、熱伝導性についても低下する。好ましくは、モード径は0.3〜1.0μmである。   The mode diameter can be obtained from mercury intrusion pore distribution measurement, and is the pore diameter corresponding to the maximum value of the log differential pore volume distribution curve. When the pore distribution of the magnesium oxide particles of the present invention is measured by a mercury intrusion measuring apparatus, the mode diameter corresponds to the diameter of the gap between the magnesium oxide particles. When the mode diameter of the magnesium oxide powder is less than 0.2 μm, the amount of fine particles increases, so that a sudden increase in viscosity occurs when filling the resin. On the other hand, when the mode diameter exceeds 1.0 μm, the amount of large particles increases, so that the mechanical strength of the resin composition deteriorates. Moreover, thermal conductivity is also reduced. Preferably, the mode diameter is 0.3 to 1.0 μm.

このような酸化マグネシウム粉末に、リン酸マグネシウム系化合物よりなる被覆層を形成する。この被覆層により、酸化マグネシウム粉末の耐湿性を改善することができる。リン酸マグネシウム系化合物とは、例えば、組成式:Mg(x=1〜3、y=2、z=6〜8)で示される化合物である。 A coating layer made of a magnesium phosphate compound is formed on such magnesium oxide powder. With this coating layer, the moisture resistance of the magnesium oxide powder can be improved. The magnesium phosphate compound is, for example, a compound represented by a composition formula: Mg x P y O z (x = 1 to 3, y = 2, z = 6 to 8).

本発明の被覆酸化マグネシウム粉末は、リン酸マグネシウム系化合物よりなる被覆層を有するので、リンを構成元素として含有する。リンの含有量は、本発明の被覆酸化マグネシウム粉末に対して0.1〜10質量%である。リンがこのような範囲内において含まれることで、本発明の被覆酸化マグネシウム粉末を耐湿性に優れたものとすることができる。リンの含有量が0.1質量%未満であると、充分な耐湿性を発揮することができない。逆にリンの含有量が10質量%を超えると、リン酸マグネシウム系化合物が酸化マグネシウム粉末の表面を被覆するだけではなく、当該リン酸マグネシウム系化合物が単独で粒子を形成したり、または、被覆層が厚すぎたりするため、熱伝導性が低下する欠点がある。   Since the coated magnesium oxide powder of the present invention has a coating layer made of a magnesium phosphate compound, it contains phosphorus as a constituent element. Content of phosphorus is 0.1-10 mass% with respect to the covering magnesium oxide powder of this invention. By including phosphorus in such a range, the coated magnesium oxide powder of the present invention can be excellent in moisture resistance. If the phosphorus content is less than 0.1% by mass, sufficient moisture resistance cannot be exhibited. Conversely, when the phosphorus content exceeds 10% by mass, the magnesium phosphate compound not only coats the surface of the magnesium oxide powder, but the magnesium phosphate compound alone forms particles or is coated. Since the layer is too thick, there is a disadvantage that the thermal conductivity is lowered.

本発明の被覆酸化マグネシウム粉末は、樹脂に充填する際の充填性に優れており、かつ、充填後の樹脂組成物の流動性が高いという利点があるため、好適に、充填材として樹脂に配合することができる。本発明で使用可能な樹脂としては、例えば、熱硬化性樹脂、又は、熱可塑性樹脂が挙げられる。熱硬化性樹脂としては特に限定されないが、例えば、フェノール樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、ポリエステル樹脂、エポキシ樹脂、ジアリルフタレート樹脂、ポリウレタン樹脂、又はシリコーン樹脂が挙げられる。熱可塑性樹脂としては特に限定されないが、例えば、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリスルフォン樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポリフェニレンスルフィド樹脂、ポリエーテルエーテルケトン樹脂、フッ素樹脂、又は液晶ポリマーが挙げられる。   The coated magnesium oxide powder of the present invention is excellent in filling property when filling into a resin and has an advantage that the fluidity of the resin composition after filling is high. can do. As resin which can be used by this invention, a thermosetting resin or a thermoplastic resin is mentioned, for example. Although it does not specifically limit as a thermosetting resin, For example, a phenol resin, a urea resin, a melamine resin, an alkyd resin, a polyester resin, an epoxy resin, a diallyl phthalate resin, a polyurethane resin, or a silicone resin is mentioned. The thermoplastic resin is not particularly limited. For example, polyamide resin, polyacetal resin, polycarbonate resin, polybutylene terephthalate resin, polysulfone resin, polyamideimide resin, polyetherimide resin, polyarylate resin, polyphenylene sulfide resin, polyether ether Examples include ketone resins, fluororesins, and liquid crystal polymers.

本発明の樹脂組成物における被覆酸化マグネシウム粉末の配合量は、樹脂組成物に求められる特定に応じて適宜決定すればよく、特に限定されない。しかし、一例として樹脂100質量部に対し、被覆酸化マグネシウム粉末0.1〜100質量部の範囲で使用すればよい。   What is necessary is just to determine suitably the compounding quantity of the covering magnesium oxide powder in the resin composition of this invention according to the specification calculated | required by the resin composition, and it is not specifically limited. However, as an example, it may be used in the range of 0.1 to 100 parts by mass of the coated magnesium oxide powder with respect to 100 parts by mass of the resin.

本発明の被覆酸化マグネシウム粉末を含む樹脂組成物は、その樹脂の特性に応じて種々の分野で利用することができる。しかし、本発明の被覆酸化マグネシウム粉末は熱伝動性に優れているので、特に放熱性が要求される用途で好適に使用することができる。また、本発明の樹脂組成物は、熱伝導性及び耐湿性に優れた半導体封止材料として利用することができる。   The resin composition containing the coated magnesium oxide powder of the present invention can be used in various fields depending on the properties of the resin. However, since the coated magnesium oxide powder of the present invention is excellent in thermal conductivity, it can be suitably used particularly in applications where heat dissipation is required. Moreover, the resin composition of this invention can be utilized as a semiconductor sealing material excellent in thermal conductivity and moisture resistance.

次に、本発明の被覆酸化マグネシウム粉末を製造する方法について説明する。   Next, a method for producing the coated magnesium oxide powder of the present invention will be described.

まず、水酸化マグネシウムを焼成することにより、所定の物性を示す酸化マグネシウムを得る。焼成する水酸化マグネシウムに含まれる各不純物元素の濃度をあらかじめ所定の濃度に調節しておき、焼成時の温度を1000〜1200℃の範囲に設定することによって、所定の物性を示す酸化マグネシウムを得ることが可能になる。   First, magnesium hydroxide which shows a predetermined physical property is obtained by baking magnesium hydroxide. The concentration of each impurity element contained in the magnesium hydroxide to be fired is adjusted in advance to a predetermined concentration, and the temperature at the time of firing is set to a range of 1000 to 1200 ° C., thereby obtaining magnesium oxide exhibiting predetermined physical properties. It becomes possible.

水酸化マグネシウム中の異種元素は次のとおりである。B(ホウ素):100〜1000ppm(好ましくは300〜800ppm)、Na(ナトリウム):300ppm以下(好ましくは200ppm以下)、K(カリウム):300ppm以下(好ましくは200ppm以下)、Cl(塩素):0.02〜0.5質量%(好ましくは0.15〜0.3質量%)、Si(ケイ素):SiO換算で0.02〜0.5質量%(0.05〜0.15質量%)、Ca:CaO換算で0.1〜0.8質量%(好ましくは0.2〜0.5質量%)。なお、これら異種元素の濃度調整は従来法により行うことができる。例えば、Bが不足している場合はホウ酸、又はホウ酸マグネシウムを添加して調整できる。Clが不足している場合は、塩酸、又は塩化マグネシウム等を添加して調整できる。Siが不足している場合は珪酸ナトリウム、珪酸マグネシウム、又は珪酸カルシウム等を添加して調整できる。カルシウムが不足している場合は水酸化カルシウム、酸化カルシウム、又は炭酸カルシウム等を添加して調整できる。 The different elements in magnesium hydroxide are as follows. B (boron): 100 to 1000 ppm (preferably 300 to 800 ppm), Na (sodium): 300 ppm or less (preferably 200 ppm or less), K (potassium): 300 ppm or less (preferably 200 ppm or less), Cl (chlorine): 0 0.02 to 0.5% by mass (preferably 0.15 to 0.3% by mass), Si (silicon): 0.02 to 0.5% by mass (0.05 to 0.15% by mass in terms of SiO 2 ) ), Ca: 0.1 to 0.8 mass% (preferably 0.2 to 0.5 mass%) in terms of CaO. The concentration of these different elements can be adjusted by a conventional method. For example, when B is insufficient, it can be adjusted by adding boric acid or magnesium borate. When Cl is insufficient, it can be adjusted by adding hydrochloric acid or magnesium chloride. When Si is insufficient, it can be adjusted by adding sodium silicate, magnesium silicate, calcium silicate or the like. When calcium is insufficient, it can be adjusted by adding calcium hydroxide, calcium oxide, calcium carbonate or the like.

水酸化マグネシウム中のBが1000ppmを超えたり、NaもしくはKが300ppmを超えたりすると、得られる酸化マグネシウムが上述した粒子内空隙量及び/又は変曲点径の条件を満足しない。また、水酸化マグネシウム中のCaがCaO換算で0.1〜0.8質量%の範囲外の場合、または、SiがSiO換算で0.02〜0.5質量%の範囲外の場合は、得られる酸化マグネシウムが上述したモード径及び/又は変曲点径の条件を満足せず、形状も丸みを帯びた形状にならない。水酸化マグネシウムとしては、純度が98%以上のものを用いることが好ましい。 When B in magnesium hydroxide exceeds 1000 ppm, or Na or K exceeds 300 ppm, the obtained magnesium oxide does not satisfy the above-mentioned conditions for the void amount in the particle and / or the inflection point diameter. Moreover, when Ca in magnesium hydroxide is out of the range of 0.1 to 0.8% by mass in terms of CaO, or when Si is out of the range of 0.02 to 0.5% by mass in terms of SiO 2 The obtained magnesium oxide does not satisfy the conditions of the mode diameter and / or the inflection point diameter described above, and the shape is not rounded. It is preferable to use magnesium hydroxide having a purity of 98% or more.

さらに、水酸化マグネシウムを焼成する時の温度は1000〜1200℃の範囲であることが好ましい。焼成温度が1000℃未満であると、得られる酸化マグネシウムが上述した粒子内空隙量、モード径及び/又は変曲点径の条件を満足しない。また、焼成温度が1200℃を超えると、得られる酸化マグネシウムが上述したモード径及び/又は変曲点径の条件を満足しない。焼成炉、及び焼成時間は特に限定されず、前述した温度で水酸化マグネシウムが酸化マグネシウムに変換できる焼成炉、及び焼成時間であればよい。   Furthermore, it is preferable that the temperature at the time of baking magnesium hydroxide is the range of 1000-1200 degreeC. When the firing temperature is less than 1000 ° C., the obtained magnesium oxide does not satisfy the above-described conditions for the void amount in the particle, the mode diameter, and / or the inflection point diameter. Moreover, when a calcination temperature exceeds 1200 degreeC, the magnesium oxide obtained will not satisfy the conditions of the mode diameter and / or inflection point diameter mentioned above. The firing furnace and firing time are not particularly limited, and may be any firing furnace and firing time in which magnesium hydroxide can be converted to magnesium oxide at the temperature described above.

以上のように水酸化マグネシウムを焼成して得られた酸化マグネシウムを、必要に応じて粉砕機を使用して粗粉砕する。これにより酸化マグネシウム粉末が得られる。この酸化マグネシウム粉末をリン化合物と混合し、必要に応じ120℃〜200℃程度の温度で乾燥処理を行った後、ボールミル等を利用して粉砕して粉末を得る。この粉末を300℃以上で焼成することで、表面の少なくとも一部にリン酸マグネシウム系化合物よりなる被覆層が形成された酸化マグネシウム粉末を得ることができる。   The magnesium oxide obtained by firing magnesium hydroxide as described above is coarsely pulverized using a pulverizer as necessary. Thereby, a magnesium oxide powder is obtained. This magnesium oxide powder is mixed with a phosphorus compound and, if necessary, dried at a temperature of about 120 ° C. to 200 ° C., and then pulverized using a ball mill or the like to obtain a powder. By baking this powder at 300 ° C. or higher, a magnesium oxide powder in which a coating layer made of a magnesium phosphate compound is formed on at least a part of the surface can be obtained.

前記リン化合物としては、酸化マグネシウムと反応してリン酸マグネシウム系化合物を形成し得る化合物であれば特に限定されないが、例えば、リン酸、リン酸塩、酸性リン酸エステルが挙げられる。これらは単独で使用してもよいし、2種以上を併用してもよい。好ましくは酸性リン酸エステルである。酸性リン酸エステルとしては、イソプロピルアシッドホスフェート、2−エチルヘキシルアシッドホスフェート、オレイルアシッドホスフェート、メチルアシッドホスフェート、エチルアシッドホスフェート、プロピルアシッドホスフェート、ブチルアシッドホスフェート、ラウリルアシッドホスフェート、ステアリルアシッドホスフェートが挙げられる。   The phosphorus compound is not particularly limited as long as it is a compound that can react with magnesium oxide to form a magnesium phosphate compound, and examples thereof include phosphoric acid, phosphate, and acidic phosphate. These may be used alone or in combination of two or more. Preferably it is acidic phosphate ester. Examples of the acidic phosphate ester include isopropyl acid phosphate, 2-ethylhexyl acid phosphate, oleyl acid phosphate, methyl acid phosphate, ethyl acid phosphate, propyl acid phosphate, butyl acid phosphate, lauryl acid phosphate, and stearyl acid phosphate.

リン化合物の使用量は、最終産物たる被覆酸化マグネシウム粉末全体に対するリンの含有量が0.1〜10質量%となるように調節すればよい。例えば、リン化合物は酸化マグネシウム粉末に対して5〜10質量%程度の量を使用することができる。   What is necessary is just to adjust the usage-amount of a phosphorus compound so that content of phosphorus with respect to the whole covering magnesium oxide powder which is a final product may be 0.1-10 mass%. For example, the phosphorus compound can be used in an amount of about 5 to 10% by mass with respect to the magnesium oxide powder.

焼成時の温度は300℃以上であり、好ましくは300〜700℃程度である。一例として、500℃で1時間の焼成が挙げられる。この焼成により、リン化合物がリン酸マグネシウム系化合物に変換されることで、リン酸マグネシウム系化合物よりなる被覆層を酸化マグネシウム粉末表面に形成することができる。   The temperature at the time of baking is 300 degreeC or more, Preferably it is about 300-700 degreeC. An example is firing at 500 ° C. for 1 hour. By this firing, the phosphorous compound is converted into a magnesium phosphate compound, whereby a coating layer made of the magnesium phosphate compound can be formed on the surface of the magnesium oxide powder.

以下に実施例を掲げて本発明をさらに詳細に説明するが、本発明はこれら実施例に限定されるものではない。   The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

(不純物元素の濃度測定法)
Ba及びPについては、試料を酸に溶解した後、ICP発光分析装置(商品名:SPS−5100、セイコーインスツルメンツ製)を使用して質量を測定することで、試料中の濃度を算出した。
(Measurement method of impurity element concentration)
About Ba and P, after melt | dissolving a sample in an acid, the density | concentration in a sample was computed by measuring mass using an ICP emission spectrometer (brand name: SPS-5100, Seiko Instruments make).

Clについては、試料を酸に溶解した後、分光光度計(商品名:UV−2550、島津製作所製)を使用して質量を測定することで、試料中の濃度を算出した。   About Cl, after melt | dissolving a sample in an acid, the density | concentration in a sample was computed by measuring mass using a spectrophotometer (brand name: UV-2550, Shimadzu Corporation make).

Si及びCaについては、蛍光X線装置(商品名:SPS−5100、セイコーインスツルメンツ製)を使用して試料中の濃度を測定した。ただし、それぞれSiO換算及びCaO換算の濃度として示した。 About Si and Ca, the density | concentration in a sample was measured using the fluorescent-X-ray apparatus (brand name: SPS-5100, Seiko Instruments make). However, respectively shown as the concentration of SiO 2 in terms and terms of CaO.

Na及びKについては、原子吸光光度計(商品名:Z−2300、日立ハイテクノロジーズ製)を使用して試料中の濃度を測定した。   About Na and K, the density | concentration in a sample was measured using the atomic absorption photometer (brand name: Z-2300, Hitachi High-Technologies make).

(BET比表面積測定法)
比表面積測定装置(商品名:Macsorb1210、マウンテック社製)を使用して、ガス吸着法により比表面積を測定した。
(BET specific surface area measurement method)
The specific surface area was measured by a gas adsorption method using a specific surface area measurement apparatus (trade name: Macsorb 1210, manufactured by Mountec Co., Ltd.).

(細孔分布の測定)
細孔分布(変曲点径、粒子内空隙量、及びモード径)の測定
水銀圧入式細孔分布測定により得られる、変曲点径、粒子内空隙量、log微分細孔容積分布曲線の最大値に対応する細孔直径(モード径)は、以下の条件で求めた。水銀圧入式細孔分布測定装置は、マイクロメトリックス社製オートポア9410を使用し測定した。なお、水銀は、純度99.5mass%以上、密度13.5335×10kg/mである特級の水銀試薬を用いた。測定セルは、セル内容積5×10−6、ステム容積0.38×10−6の粉体試料用セルを用いた。測定試料は、あらかじめ330メッシュ標準篩(JIS−R8801−87)で粒径を揃えた試料を、質量0.10×10−3〜0.13×10−3kgの範囲で精密に秤量し、測定セルに充填した。測定セルを装置に装着した後、セル内部を圧力50μHg(6.67Pa)以下で20分間、減圧状態に保持した。次に、測定セル内に、圧力が1.5psia(10342Pa)になるまで水銀を充填した。その後、圧力が2psia(13790Pa)から60000psia(413.7MPa)の範囲で水銀を圧入して、細孔分布を測定した。
(Measurement of pore distribution)
Measurement of pore distribution (inflection point diameter, interstitial void volume, and mode diameter) Maximum inflection point diameter, interparticle void volume, and log differential pore volume distribution curve obtained by mercury intrusion pore distribution measurement The pore diameter (mode diameter) corresponding to the value was determined under the following conditions. The mercury intrusion pore distribution measuring device was measured using an Autopore 9410 manufactured by Micrometrics. As the mercury, a special grade mercury reagent having a purity of 99.5 mass% or more and a density of 13.5335 × 10 3 kg / m 3 was used. The measurement cell used was a powder sample cell having an internal volume of 5 × 10 −6 m 3 and a stem volume of 0.38 × 10 −6 m 3 . The measurement sample was precisely weighed in a mass range of 0.10 × 10 −3 to 0.13 × 10 −3 kg with a sample having a uniform particle size using a 330 mesh standard sieve (JIS-R8801-87) in advance. The measuring cell was filled. After mounting the measurement cell on the apparatus, the inside of the cell was kept under a reduced pressure at a pressure of 50 μHg (6.67 Pa) or less for 20 minutes. Next, mercury was filled in the measurement cell until the pressure became 1.5 psia (10342 Pa). Thereafter, mercury was injected in a pressure range of 2 psia (13790 Pa) to 60000 psia (413.7 MPa), and the pore distribution was measured.

水銀の圧入圧力を細孔直径に換算するには、下記(I)式(Washburnの式)を用いた。
D=−(1/P)・4γ・cosΨ(I)
ここで、D:細孔直径(m)、
P:水銀の圧入圧力(Pa)、
γ:水銀の表面張力(485dyne・cm−1(0.485Pa・m))、
Ψ:水銀の接触角(130°=2.26893rad)である。
The following formula (I) (Washburn's formula) was used to convert the intrusion pressure of mercury into the pore diameter.
D = − (1 / P) · 4γ · cosψ (I)
Where D: pore diameter (m),
P: mercury pressure (Pa)
γ: surface tension of mercury (485 dyne · cm −1 (0.485 Pa · m)),
Ψ: Mercury contact angle (130 ° = 2.26893 rad).

(耐湿性の測定方法)
試料10gをシャーレに秤量し、恒温恒湿機(85℃・85Rh%)内にセットした。その状態で1週間保持した後、120℃の乾燥機で一晩乾燥した。乾燥後、重量を量り、重量増加率を算出した。
(Method of measuring moisture resistance)
A 10 g sample was weighed in a petri dish and set in a constant temperature and humidity machine (85 ° C./85 Rh%). After being kept in that state for one week, it was dried overnight in a 120 ° C. dryer. After drying, the weight was measured and the weight increase rate was calculated.

(熱伝導率の測定方法)
本発明品を添加した樹脂を完全に硬化させたサイズが直径13mm、厚さ2mmである高熱伝導率樹脂組成物のサンプルを作製し、熱拡散率をレーザーフラッシュ法で30〜100℃の範囲で測定した。装置にはNETZSCH製LFA−457を用いた。比熱と、アルキメデス法により、比重を測定し、熱拡散率と比熱と密度の積としての熱伝導率を算出した。
(Measurement method of thermal conductivity)
A sample of a high thermal conductivity resin composition having a diameter of 13 mm and a thickness of 2 mm obtained by completely curing the resin added with the product of the present invention is prepared. It was measured. The apparatus used was LFA-457 manufactured by NETZSCH. Specific gravity was measured by the specific heat and Archimedes method, and the thermal conductivity was calculated as the product of thermal diffusivity, specific heat and density.

(メルトフローレートの測定方法)
樹脂組成物について、JIS−K7210に準拠し、測定温度230℃、荷重2.16Kgで測定した。
(Measuring method of melt flow rate)
The resin composition was measured at a measurement temperature of 230 ° C. and a load of 2.16 kg according to JIS-K7210.

(樹脂組成物の製造方法)
メルトフローレートの測定で使用した樹脂組成物は以下の手順で調製した。
EEA(エチレン・エチルアクリレート・コポリマー)100gを溶融後、フィラー333gを少量ずつ、混練状態を見ながら約10分かけて添加し、さらに10分間仕上げ混練を行った。この時のロール間隔0.5mmであった。
(Production method of resin composition)
The resin composition used in the measurement of the melt flow rate was prepared by the following procedure.
After melting 100 g of EEA (ethylene ethyl acrylate copolymer), 333 g of filler was added in small portions over about 10 minutes while observing the kneaded state, and finish kneading was further performed for 10 minutes. The roll interval at this time was 0.5 mm.

混練終了後、コンパウンドを引き剥がし、回収したコンパウンドを5mm角程度に裁断、真空乾燥機で90℃×1時間乾燥し、メルトフローレート測定用試料とした。   After completion of the kneading, the compound was peeled off, and the recovered compound was cut to about 5 mm square and dried in a vacuum dryer at 90 ° C. for 1 hour to obtain a sample for measuring melt flow rate.

(リン酸マグネシウム系化合物の組成の測定方法)
X線回折装置(商品名:RINT−Ultima III、リガク製)を使用して、Cu−Kα線を用いたX線回折法によりリン酸マグネシウム系化合物被覆層の組成を測定した。
(Method for measuring composition of magnesium phosphate compound)
Using an X-ray diffractometer (trade name: RINT-Ultima III, manufactured by Rigaku), the composition of the magnesium phosphate compound coating layer was measured by an X-ray diffraction method using Cu-Kα rays.

(実施例1)
焼成してできる酸化マグネシウム中のCaOを0.23質量%,SiOを0.07質量%,Clを0.16質量%,Bを402ppm,Naが11ppm,Kが9ppm,になるように調整した純度99.2%の水酸化マグネシウムを電気炉にて1100℃で1時間、焼成することにより酸化マグネシウムを作成した。
Example 1
Adjusted so that CaO in the magnesium oxide produced by firing is 0.23 mass%, SiO 2 is 0.07 mass%, Cl is 0.16 mass%, B is 402 ppm, Na is 11 ppm, and K is 9 ppm. The magnesium hydroxide having a purity of 99.2% was baked in an electric furnace at 1100 ° C. for 1 hour to prepare magnesium oxide.

この酸化マグネシウムをパワーミルで解砕した後、酸性リン酸エステルであるイソピロピル酸性リン酸エステルを酸化マグネシウムに対し5重量%添加した。その後、120℃で2時間乾燥した後、ボールミルで粉砕し、500℃で1時間焼成を行い、目的の被覆酸化マグネシウム粉末を得た。   After pulverizing this magnesium oxide with a power mill, 5% by weight of isopropylpyrophosphate, which is an acidic phosphate, was added to magnesium oxide. Then, after drying at 120 ° C. for 2 hours, the mixture was pulverized with a ball mill and fired at 500 ° C. for 1 hour to obtain a target coated magnesium oxide powder.

得られた被覆酸化マグネシウム粉末について、上述した方法に基づき不純物元素の濃度、BET比表面積、細孔分布、耐湿性、熱伝導率、及びメルトフローレートを測定し、結果を表1に示した。   The obtained coated magnesium oxide powder was measured for the impurity element concentration, BET specific surface area, pore distribution, moisture resistance, thermal conductivity, and melt flow rate based on the above-mentioned method, and the results are shown in Table 1.

また、上述した方法に基づき、得られた被覆酸化マグネシウム粉末表面の被覆層の組成を測定したところ、Mgであることが判明した。 Moreover, when the composition of the coating layer on the surface of the obtained coated magnesium oxide powder was measured based on the method described above, it was found to be Mg 2 P 2 O 7 .

図1は、得られた被覆酸化マグネシウム粉末の電子顕微鏡写真である。被覆酸化マグネシウム粉末の粒子形状は球状であった。ここで、球状の粉末とは、角のない丸みを帯びた形状の粒子からなる粉末を指し、これに対し、不定形の粉末とは、結晶粒子が複数結合した角の有る粒子からなる粉末を指す。   FIG. 1 is an electron micrograph of the obtained coated magnesium oxide powder. The particle shape of the coated magnesium oxide powder was spherical. Here, a spherical powder refers to a powder composed of rounded particles without corners, whereas an amorphous powder refers to a powder composed of angular particles in which a plurality of crystal particles are combined. Point to.

(実施例2)
水酸化マグネシウムの焼成温度を1175℃に変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 2)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 1175 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例3)
酸化マグネシウムのCaOが0.48質量%になるように調整した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 3)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1, except that the CaO of magnesium oxide was adjusted to 0.48% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例4)
酸化マグネシウムのSiOが0.12質量%になるように調整した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 4)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the SiO of magnesium oxide was adjusted to 0.12% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例5)
水酸化マグネシウムのB濃度を700ppmになるように調整した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 5)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the B concentration of magnesium hydroxide was adjusted to 700 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例6)
水酸化マグネシウムのNa濃度を200ppmになるように調整した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 6)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the Na concentration of magnesium hydroxide was adjusted to 200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例7)
水酸化マグネシウムのK濃度を200ppmになるように調整した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 7)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the K concentration of magnesium hydroxide was adjusted to 200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例8)
被覆酸化マグネシウム粉末中のリンの含有量が0.18質量%になるように酸性リン酸エステルの使用量を変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
(Example 8)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content in the coated magnesium oxide powder was 0.18% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(実施例9)
被覆酸化マグネシウム粉末中のリンの含有量が4.6質量%になるように酸性リン酸エステルの使用量を変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表1に示した。
Example 9
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content in the coated magnesium oxide powder was 4.6% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.

(比較例1)
水酸化マグネシウムの焼成温度を950℃に変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 1)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 950 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例2)
水酸化マグネシウムの焼成温度を1400℃に変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 2)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 1400 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例3)
水酸化マグネシウムのCaO濃度を1質量%に変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 3)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the CaO concentration of magnesium hydroxide was changed to 1% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例4)
水酸化マグネシウムのSiO濃度を4質量%に変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 4)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the SiO concentration of magnesium hydroxide was changed to 4% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例5)
水酸化マグネシウムのB濃度を1200ppmに変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 5)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the B concentration of magnesium hydroxide was changed to 1200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例6)
水酸化マグネシウムのNa濃度を400ppmに変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 6)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the Na concentration of magnesium hydroxide was changed to 400 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例7)
水酸化マグネシウムのK濃度を400ppmに変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 7)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the K concentration of magnesium hydroxide was changed to 400 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例8)
被覆酸化マグネシウム粉末全体に対するリンの含有量が0.058質量%になるように酸性リン酸エステルの使用量を変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 8)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content relative to the entire coated magnesium oxide powder was 0.058% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

(比較例9)
被覆酸化マグネシウム粉末全体に対するリンの含有量が12.1質量%になるように酸性リン酸エステルの使用量を変更した以外は実施例1と同じ条件で被覆酸化マグネシウム粉末を得た。実施例1と同様に各物性の測定を行い、結果を表2に示した。
(Comparative Example 9)
A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content relative to the entire coated magnesium oxide powder was 12.1% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.

Claims (13)

水銀圧入式細孔分布において、粒子内空隙量が0.3〜0.8cm/g、モード径が0.2〜1.0μm、及び変曲点径が0.9μm以上を示す酸化マグネシウム粉末と、
前記酸化マグネシウム粉末の表面の少なくとも一部に、リン酸マグネシウム系化合物よりなる被覆層と、を有し、
被覆酸化マグネシウム粉末中のリンの含有量が0.1〜10質量%であることを特徴とする、被覆酸化マグネシウム粉末。
Magnesium oxide powder showing an in-particle void amount of 0.3 to 0.8 cm 3 / g, a mode diameter of 0.2 to 1.0 μm, and an inflection point diameter of 0.9 μm or more in a mercury intrusion pore distribution When,
A coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder;
The coated magnesium oxide powder, wherein the content of phosphorus in the coated magnesium oxide powder is 0.1 to 10% by mass.
前記リン酸マグネシウム系化合物が、組成式:Mg(x=1〜3、y=2、z=6〜8)で示される、請求項1記載の被覆酸化マグネシウム粉末。 The magnesium phosphate compounds, composition formula: Mg x P y O z ( x = 1~3, y = 2, z = 6~8) represented by the coated magnesium oxide powder of claim 1, wherein. 請求項1又は2に記載の被覆酸化マグネシウム粉末からなる充填材。   A filler comprising the coated magnesium oxide powder according to claim 1. 樹脂と、請求項3記載の充填材と、を含有する、樹脂組成物。   A resin composition comprising a resin and the filler according to claim 3. 前記樹脂が熱硬化性樹脂である、請求項4記載の樹脂組成物。   The resin composition according to claim 4, wherein the resin is a thermosetting resin. 前記熱硬化性樹脂が、フェノール樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、ポリエステル樹脂、エポキシ樹脂、ジアリルフタレート樹脂、ポリウレタン樹脂、又はシリコーン樹脂である、請求項5記載の樹脂組成物。   The resin composition according to claim 5, wherein the thermosetting resin is a phenol resin, a urea resin, a melamine resin, an alkyd resin, a polyester resin, an epoxy resin, a diallyl phthalate resin, a polyurethane resin, or a silicone resin. 前記樹脂が熱可塑性樹脂である、請求項4記載の樹脂組成物。   The resin composition according to claim 4, wherein the resin is a thermoplastic resin. 前記熱可塑性樹脂が、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリスルフォン樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポリフェニレンスルフィド樹脂、ポリエーテルエーテルケトン樹脂、フッ素樹脂、又は液晶ポリマーである、請求項7記載の樹脂組成物。   The thermoplastic resin is polyamide resin, polyacetal resin, polycarbonate resin, polybutylene terephthalate resin, polysulfone resin, polyamideimide resin, polyetherimide resin, polyarylate resin, polyphenylene sulfide resin, polyetheretherketone resin, fluorine resin, Or the resin composition of Claim 7 which is a liquid crystal polymer. 請求項4〜8のいずれか1項に記載の樹脂組成物からなる放熱性部材。   A heat dissipating member comprising the resin composition according to any one of claims 4 to 8. Bを100〜1000ppm、Naを300ppm以下、Kを300ppm以下、Clを0.02〜0.5質量%含み、かつ、SiをSiOに換算して0.02〜0.5質量%、CaをCaOに換算して0.1〜0.8質量%含む、純度98%以上の水酸化マグネシウムを、1000℃〜1200℃で焼成することにより、酸化マグネシウム粉末を得た後、
前記酸化マグネシウム粉末を、リン化合物と混合して、300℃以上で焼成することにより、前記酸化マグネシウム粉末の表面の少なくとも一部にリン酸マグネシウム系化合物よりなる被覆層を形成することを特徴とする、被覆酸化マグネシウム粉末の製造方法。
B and 100 to 1000 ppm, 300ppm or less Na, K and 300ppm or less, includes a Cl 0.02-0.5 wt%, and 0.02 to 0.5 wt% in terms of Si to SiO 2, Ca After obtaining magnesium oxide powder by calcining magnesium hydroxide having a purity of 98% or more containing 0.1 to 0.8 mass% in terms of CaO at 1000 ° C to 1200 ° C,
The magnesium oxide powder is mixed with a phosphorus compound and fired at 300 ° C. or higher to form a coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder. The manufacturing method of a coated magnesium oxide powder.
前記リン化合物が、リン酸、リン酸塩、及び酸性リン酸エステルからなる群から選択される1種以上の化合物である、請求項10記載の製造方法。   The manufacturing method of Claim 10 whose said phosphorus compound is 1 or more types of compounds selected from the group which consists of phosphoric acid, a phosphate, and acidic phosphate ester. 前記リン化合物が、イソプロピルアシッドホスフェート、2−エチルヘキシルアシッドホスフェート、オレイルアシッドホスフェート、メチルアシッドホスフェート、エチルアシッドホスフェート、プロピルアシッドホスフェート、ブチルアシッドホスフェート、ラウリルアシッドホスフェート、及びステアリルアシッドホスフェートからなる群から選択される1種以上の酸性リン酸エステルである、請求項11記載の製造方法。   The phosphorus compound is selected from the group consisting of isopropyl acid phosphate, 2-ethylhexyl acid phosphate, oleyl acid phosphate, methyl acid phosphate, ethyl acid phosphate, propyl acid phosphate, butyl acid phosphate, lauryl acid phosphate, and stearyl acid phosphate The manufacturing method of Claim 11 which is 1 or more types of acidic phosphate ester. 前記リン化合物を、被覆酸化マグネシウム粉末中のリンの含有量が0.1〜10質量%となるように用いる、請求項10〜12のいずれか1項に記載の製造方法。   The manufacturing method of any one of Claims 10-12 which uses the said phosphorus compound so that content of phosphorus in a covering magnesium oxide powder may be 0.1-10 mass%.
JP2013004311A 2013-01-15 2013-01-15 Coated magnesium oxide powder and method for producing the same Active JP5972179B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013004311A JP5972179B2 (en) 2013-01-15 2013-01-15 Coated magnesium oxide powder and method for producing the same
PCT/JP2014/000055 WO2014112334A1 (en) 2013-01-15 2014-01-09 Coated magnesium oxide powder, and method for producing same
CN201480003982.8A CN104903239B (en) 2013-01-15 2014-01-09 It is wrapped by magnesium oxide powder and this is wrapped by the manufacture method of magnesium oxide powder
KR1020157021608A KR101751380B1 (en) 2013-01-15 2014-01-09 Coated magnesium oxide powder, and method for producing same
TW103101353A TWI597312B (en) 2013-01-15 2014-01-15 Coated magnesia powder and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013004311A JP5972179B2 (en) 2013-01-15 2013-01-15 Coated magnesium oxide powder and method for producing the same

Publications (3)

Publication Number Publication Date
JP2014136654A true JP2014136654A (en) 2014-07-28
JP2014136654A5 JP2014136654A5 (en) 2016-01-14
JP5972179B2 JP5972179B2 (en) 2016-08-17

Family

ID=51209433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013004311A Active JP5972179B2 (en) 2013-01-15 2013-01-15 Coated magnesium oxide powder and method for producing the same

Country Status (5)

Country Link
JP (1) JP5972179B2 (en)
KR (1) KR101751380B1 (en)
CN (1) CN104903239B (en)
TW (1) TWI597312B (en)
WO (1) WO2014112334A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041110A1 (en) * 2013-09-17 2015-03-26 宇部マテリアルズ株式会社 Thermally conductive filler and thermally conductive resin composition containing same
JP2018131378A (en) * 2017-02-17 2018-08-23 タテホ化学工業株式会社 Spherical magnesium oxide and method for producing the same
JPWO2018030225A1 (en) * 2016-08-09 2019-06-20 神島化学工業株式会社 Magnesium oxide granules
WO2022059660A1 (en) * 2020-09-15 2022-03-24 デンカ株式会社 Magnesium oxide powder, filler composition, resin composition, and heat-dissipating member
WO2024190205A1 (en) * 2023-03-10 2024-09-19 宇部マテリアルズ株式会社 Magnesium oxide particle fused body and method for producing same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111233012B (en) * 2018-11-28 2021-10-08 中国科学院大连化学物理研究所 Electrical-grade magnesium oxide powder and preparation method thereof
CN112752732B (en) * 2019-03-29 2023-03-17 达泰豪化学工业株式会社 Spherical magnesium oxide, method for producing same, thermally conductive filler, and resin composition
WO2024004736A1 (en) * 2022-06-28 2024-01-04 デンカ株式会社 Magnesium oxide powder and resin composition which uses same
WO2024004738A1 (en) * 2022-06-28 2024-01-04 デンカ株式会社 Magnesium oxide powder and resin composition using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006151778A (en) * 2004-12-01 2006-06-15 Tateho Chem Ind Co Ltd Phosphorus-containing coated magnesium oxide powder, production method therefor and resin composition containing the powder
JP2007217201A (en) * 2006-02-14 2007-08-30 Merck Ltd Porous magnesia and method for producing the same
JP2008074683A (en) * 2006-09-25 2008-04-03 Tateho Chem Ind Co Ltd Coated magnesium oxide powder, its production method, and resin composition comprising the same
JP2009215134A (en) * 2008-03-12 2009-09-24 Ube Ind Ltd Water resistant spherical particle, resin composition containing it, its producing method, filler being aggregation of the water resistant spherical particle and semiconductor resin sealing agent containing the filler
JP2011020870A (en) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd Magnesium oxide particle, method for producing the same, heat dissipating filler, resin composition, heat dissipating grease, and heat dissipating coating composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835250B2 (en) * 2000-05-01 2004-12-28 Tateho Chemical Industries Co., Ltd. Magnesium oxide particle aggregate
JP3850371B2 (en) * 2001-12-25 2006-11-29 タテホ化学工業株式会社 Resin composition containing magnesium oxide powder
JP5447355B2 (en) * 2010-12-02 2014-03-19 新神戸電機株式会社 Method for producing thermosetting resin composition, method for producing prepreg and laminate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006151778A (en) * 2004-12-01 2006-06-15 Tateho Chem Ind Co Ltd Phosphorus-containing coated magnesium oxide powder, production method therefor and resin composition containing the powder
JP2007217201A (en) * 2006-02-14 2007-08-30 Merck Ltd Porous magnesia and method for producing the same
JP2008074683A (en) * 2006-09-25 2008-04-03 Tateho Chem Ind Co Ltd Coated magnesium oxide powder, its production method, and resin composition comprising the same
JP2009215134A (en) * 2008-03-12 2009-09-24 Ube Ind Ltd Water resistant spherical particle, resin composition containing it, its producing method, filler being aggregation of the water resistant spherical particle and semiconductor resin sealing agent containing the filler
JP2011020870A (en) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd Magnesium oxide particle, method for producing the same, heat dissipating filler, resin composition, heat dissipating grease, and heat dissipating coating composition

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041110A1 (en) * 2013-09-17 2015-03-26 宇部マテリアルズ株式会社 Thermally conductive filler and thermally conductive resin composition containing same
US9828538B2 (en) 2013-09-17 2017-11-28 Ube Material Industries, Ltd. Thermally conductive filler and thermally conductive resin composition containing same
JPWO2018030225A1 (en) * 2016-08-09 2019-06-20 神島化学工業株式会社 Magnesium oxide granules
JP2018131378A (en) * 2017-02-17 2018-08-23 タテホ化学工業株式会社 Spherical magnesium oxide and method for producing the same
WO2018150826A1 (en) * 2017-02-17 2018-08-23 タテホ化学工業株式会社 Spherical magnesium oxide and production method therefor
KR20190117476A (en) * 2017-02-17 2019-10-16 다테호 가가쿠 고교 가부시키가이샤 Spherical magnesium oxide and its manufacturing method
US11180688B2 (en) 2017-02-17 2021-11-23 Tateho Chemical Industries Co., Ltd. Spherical magnesium oxide and production method therefor
KR102404942B1 (en) 2017-02-17 2022-06-02 다테호 가가쿠 고교 가부시키가이샤 Spherical magnesium oxide and its manufacturing method
WO2022059660A1 (en) * 2020-09-15 2022-03-24 デンカ株式会社 Magnesium oxide powder, filler composition, resin composition, and heat-dissipating member
JP2022048558A (en) * 2020-09-15 2022-03-28 デンカ株式会社 Magnesium oxide powder, filler composition, resin composition, and heat dissipating component
JP7478632B2 (en) 2020-09-15 2024-05-07 デンカ株式会社 Magnesium oxide powder, filler composition, resin composition, and heat dissipation part
WO2024190205A1 (en) * 2023-03-10 2024-09-19 宇部マテリアルズ株式会社 Magnesium oxide particle fused body and method for producing same

Also Published As

Publication number Publication date
CN104903239A (en) 2015-09-09
KR20150107797A (en) 2015-09-23
TW201431924A (en) 2014-08-16
WO2014112334A1 (en) 2014-07-24
KR101751380B1 (en) 2017-06-27
JP5972179B2 (en) 2016-08-17
TWI597312B (en) 2017-09-01
CN104903239B (en) 2016-08-31

Similar Documents

Publication Publication Date Title
JP5972179B2 (en) Coated magnesium oxide powder and method for producing the same
TWI743299B (en) Spherical magnesium oxide and method for manufactruing the same
JP4302690B2 (en) Spherical coated magnesium oxide powder, method for producing the same, and resin composition containing the powder
JP2014136654A5 (en)
TWI636958B (en) Low soda alpha alumina powder with excellent viscosity characteristics and preparation method thereof
JP3937494B2 (en) Alumina-filled resin or rubber composition
KR20210135922A (en) Spherical magnesium oxide, its manufacturing method, thermally conductive filler and resin composition
JP4237182B2 (en) Highly filled coated magnesium oxide powder and resin composition containing the powder
JP7550140B2 (en) Spherical magnesium oxide, its manufacturing method, thermally conductive filler, and resin composition
JP2016124908A (en) Resin molded body
JP4237181B2 (en) High fluidity coated magnesium oxide powder and resin composition containing the powder
CN112912447A (en) Magnesium oxide, method for producing same, highly thermally conductive magnesium oxide composition, and magnesium oxide ceramic using same
CN104755424A (en) Magnesium oxide powder
JP3572692B2 (en) α-Alumina powder-containing resin composition and rubber composition
JP2015193493A (en) High density alumina and manufacturing method thereof
WO2024190205A1 (en) Magnesium oxide particle fused body and method for producing same
JP7203290B2 (en) Sheet-like hexagonal boron nitride sintered body and method for producing the same
WO2023210493A1 (en) Resin composition and alumina powder for use therein
JP2024095000A (en) Alumina powder and resin composition
TW202426393A (en) Alumina particles and resin composition using same
TW202436230A (en) Alumina particles and resin composition using the same
TW202423838A (en) Alumina particles and resin composition using same

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151117

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160517

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160610

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160705

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160712

R150 Certificate of patent or registration of utility model

Ref document number: 5972179

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250