JP2014131327A - Vibration piece, vibrator, oscillator, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece for improving efficiency of bending vibration by restraining deterioration of a Q-value due to a loss of thermoelasticity.SOLUTION: Vibration arm parts 20, 21 have: first groove parts 24, 25 provided in a first direction of the vibration arm parts 20, 21 on each one of principal planes 22, 23; second groove parts 28, 29 aligned with the first groove parts 24, 25 in a second direction on other principal planes 26, 27; third groove parts 24', 25' aligned with the first groove parts 24, 25 in the first direction and provided nearer a base part 10 than the first groove parts 24, 25; and fourth groove parts 28', 29' aligned with the second groove parts 28, 29 in the first direction on the principal planes 22, 23, and provided nearer the base part 10 than the second groove parts 28, 29. A sum of depths of the first groove parts 24, 25 and depths of the second groove parts 28, 29, and a sum of depths of the third groove parts 24', 25' and depths of the fourth groove parts 28', 29' are larger than a distance between the principal planes 22, 23 and the other principal planes 26, 27.

Description

  The present invention relates to a resonator element, a vibrator, an oscillator, and an electronic device.

Conventionally, it is known that when a piezoelectric vibrating piece as an example of a vibrating piece is reduced in size, the Q value is reduced and vibration is inhibited.
More specifically, in the piezoelectric vibrating piece, the temperature of the contracting surface rises and the temperature of the expanding surface decreases due to the elastic deformation due to the bending vibration, so that a temperature difference is generated inside. As a result, a vibration called relaxation vibration is generated in the piezoelectric vibrating piece, which is inversely proportional to the required time (relaxation time) until the temperature difference is eliminated by heat conduction (heat transfer) (becomes a temperature equilibrium state).
As the piezoelectric vibrating piece is reduced in size, the relaxation vibration frequency and the original bending vibration frequency approach each other, so that the Q value decreases and the original bending vibration is inhibited.
This phenomenon is called a thermoelastic loss, a thermoelastic effect, or the like. In Patent Document 1, as a measure for improvement, a groove or a through hole is formed in a rectangular cross section of a piezoelectric vibrating piece, and a surface extending from a contracting surface is expanded. By suppressing the heat transfer, the reduction of the Q value due to the thermoelastic loss is suppressed.

Japanese Utility Model Publication No. 2-3322

However, when a through-hole is formed in a vibrating portion (hereinafter referred to as a vibrating arm portion) as in Patent Document 1, the piezoelectric vibrating piece has a problem that the rigidity of the vibrating arm portion is significantly reduced.
In addition, the piezoelectric vibrating reed does not suppress the heat transfer from the contracting surface to the expanding surface even if the vibrating arm portion is provided with a groove having an H-shaped cross section (hereinafter referred to as a groove portion) as in Patent Document 1. Since this is sufficient, there is room for improvement in suppressing the decrease in the Q value caused by the thermoelastic loss.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A piezoelectric vibrating piece according to this application example includes a base and a vibrating arm that extends from the base and vibrates flexibly. The vibrating arm includes one main surface and the one main. A first groove portion formed along the extending direction of the vibrating arm portion on the one main surface, and the first main surface on the other main surface. A second groove formed in parallel with the groove in plan view, and further formed on the other main surface in series with the first groove and on the base side from the first groove. 3 groove portions, the one main surface has a fourth groove portion formed in series with the second groove portion in a plan view and closer to the base side than the second groove portion, and the depth of the first groove portion The sum of the depth of the second groove portion, and the sum of the depth of the third groove portion and the depth of the fourth groove portion are the sum of the one main surface and the other main surface. Wherein the greater than the distance.

According to this configuration, the piezoelectric vibrating piece has the first groove portion on one main surface and the second groove portion formed in parallel with the first groove portion on the other main surface. Further, the piezoelectric vibrating piece has a third groove portion formed in series with the first groove portion on the other main surface and closer to the base side than the first groove portion, and has a second groove portion in series with the second groove portion on one main surface. It has the 4th groove part formed in the base side from the groove part.
In the piezoelectric vibrating piece, the sum of the depth of the first groove portion and the depth of the second groove portion, and the sum of the depth of the third groove portion and the depth of the fourth groove portion are the same between the one main surface and the other main surface. Greater than the distance between.

As a result, the piezoelectric vibrating piece extends from one of the pair of expansion / contraction surfaces, which are contraction surfaces in bending vibration, as compared with, for example, the conventional case where the vibration arm portion is provided with an H-shaped groove portion. Since the distance of the heat transfer to the other of the pair of expansion / contraction surfaces which are the surfaces to be extended becomes longer, the relaxation time until the temperature equilibrium state is reached becomes longer.
As a result, the piezoelectric vibrating reed can keep the relaxation vibration frequency away from the original bending vibration frequency, and therefore can suppress a decrease in the Q value caused by the thermoelastic loss. Therefore, the piezoelectric vibrating piece can be further reduced in size.

By the way, the piezoelectric vibrating piece includes a first groove portion and a second groove portion cut along a plane orthogonal to one main surface of the vibrating arm portion and orthogonal to the extending direction of the vibrating arm portion. Is between the one main surface and the other main surface, which is a straight line along one main surface (the other main surface) passing through the midpoint of the straight line connecting one main surface and the other main surface It does not have a line-symmetric shape with the center line as the axis of symmetry.
As a result, the piezoelectric vibrating reed causes a mass imbalance in the vibrating arm portion as it is, and the bending vibration connects the original bending vibration component along one main surface with one main surface and the other main surface. The vibration is a combination of the out-of-plane vibration component that vibrates in the thickness direction that is the direction.
As a result, in the piezoelectric vibrating piece, the vibration direction of the bending vibration does not follow the prescribed vibration direction, so that a loss of vibration energy occurs and the efficiency of the bending vibration decreases.

On the other hand, the piezoelectric vibrating piece includes a third groove portion and a fourth groove portion cut along a plane orthogonal to one main surface of the vibrating arm portion and orthogonal to the extending direction of the vibrating arm portion. The cross-sectional shape is a shape obtained by inverting the cross-sectional shape including the first groove portion and the second groove portion, and a surface in which the bending vibration is oscillated in the thickness direction along with the original bending vibration component along one main surface as described above. The vibration is a combination of the external vibration component.
At this time, in the piezoelectric vibrating piece, the cross-sectional shape including the third groove portion and the fourth groove portion is a shape obtained by inverting the cross-sectional shape including the first groove portion and the second groove portion. The direction of the out-of-plane vibration component due to the groove is opposite to the direction of the out-of-plane vibration component due to the first groove and the second groove.
As a result, the piezoelectric vibrating reed cancels out-of-plane vibration components caused by the first groove portion and the second groove portion and out-of-plane vibration components caused by the third groove portion and the fourth groove portion. Will approach the direction along one main surface which is the prescribed vibration direction.
Thereby, since the loss of vibration energy is suppressed in the piezoelectric vibrating piece, the efficiency of bending vibration is improved.

  As another aspect, the resonator element includes a base portion and a vibrating arm portion that extends in the first direction from the base portion and bends and vibrates. The vibrating arm portion includes one main surface, and the one Another main surface opposite to the main surface, the one main surface having a first groove portion provided along the first direction of the vibrating arm portion, and the other main surface Has a second groove portion provided side by side with the first groove portion in a second direction orthogonal to the first direction in plan view, and the other main surface has the second direction in the first direction in plan view. A third groove portion provided side by side with the first groove portion and provided on the base side from the first groove portion; and the second groove portion in the first direction in a plan view on the one main surface. And a fourth groove portion provided on the base side from the second groove portion, and a depth of the first groove portion and a depth of the second groove portion. Sum, and the sum of the depth of the third groove depth and the fourth groove, and greater than the distance between said one main surface and the other principal surface.

According to this configuration, the resonator element includes the first groove portion on one main surface and the second groove portion provided side by side in the second direction with the first groove portion on the other main surface. Furthermore, the resonator element includes a third groove provided on the other main surface side by side with the first groove in the first direction and provided on the base side from the first groove, and the second groove on the one main surface. It has the 4th groove part provided along with the 1st direction and provided in the base side from the 2nd groove part.
The vibrating piece includes a sum of the depth of the first groove and the depth of the second groove, and a sum of the depth of the third groove and the depth of the fourth groove between one main surface and the other main surface. Greater than the distance.

As a result, for example, the resonator element extends from one of the pair of expansion / contraction surfaces, which are contraction surfaces in bending vibration, as compared with a case where a groove portion having an H-shaped cross-section as in the past is provided in the vibration arm portion. Since the distance of heat transfer to the other of the pair of stretchable surfaces, which are surfaces, becomes long, the relaxation time until the temperature equilibrium state is reached becomes long.
As a result, since the vibration piece can keep the relaxation vibration frequency away from the original bending vibration frequency, it is possible to suppress a decrease in the Q value due to the thermoelastic loss. Therefore, the resonator element can be further reduced in size.

By the way, the vibration piece has a cross-sectional shape including a first groove portion and a second groove portion cut along a surface orthogonal to one main surface of the vibration arm portion and orthogonal to the first direction. The center line between one main surface and the other main surface, which is a straight line along one main surface (the other main surface), passes through the midpoint of the straight line connecting the main surface and the other main surface, and the axis of symmetry It does not become a line-symmetric shape.
As a result, the vibration piece causes a mass imbalance in the vibrating arm portion as it is, and the bending vibration connects the original bending vibration component along one main surface and the one main surface and the other main surface. This is the combined vibration of the out-of-plane vibration component that vibrates in the thickness direction.
As a result, in the resonator element, the vibration direction of the bending vibration does not follow the prescribed vibration direction, so that a loss of vibration energy occurs and the efficiency of the bending vibration decreases.

On the other hand, the resonator element has a cross-sectional shape including a third groove portion and a fourth groove portion cut along a plane orthogonal to one main surface of the vibrating arm portion and orthogonal to the first direction. The cross-sectional shape including the first groove and the second groove is inverted, and the original bending vibration component along one main surface and the out-of-plane vibration component that vibrates in the thickness direction are combined as described above. Vibration.
At this time, since the cross-sectional shape including the third groove portion and the fourth groove portion is a shape obtained by inverting the cross-sectional shape including the first groove portion and the second groove portion, the vibrating piece has the third groove portion and the fourth groove portion. The direction of the out-of-plane vibration component due to the above and the direction of the out-of-plane vibration component due to the first groove and the second groove are opposite to each other.
As a result, the vibration piece cancels out of the out-of-plane vibration component caused by the first groove portion and the second groove portion and the out-of-plane vibration component caused by the third groove portion and the fourth groove portion. The vibration direction approaches a direction along one main surface which is the prescribed vibration direction.
Thereby, since the vibration piece suppresses the loss of vibration energy, the efficiency of flexural vibration is improved.

  Application Example 2 In the resonator element according to the application example described above, the lengths of the first groove portion and the second groove portion in the first direction are RS, and the lengths of the third groove portion and the fourth groove portion in the first direction. When S is S, it is preferable that S: RS = 1: (2.2 to 2.8).

According to this configuration, since the resonator element is S: RS = 1: (2.2 to 2.8), the out-of-plane vibration component and the third groove portion due to the first groove portion and the second groove portion described above. In addition, the out-of-plane vibration component caused by the fourth groove is almost canceled out.
As a result, since the vibration piece further suppresses loss of vibration energy, the efficiency of bending vibration is further improved.
In addition, S: RS = 1: (2.2-2.8) is the knowledge which inventors derived by simulation and experiment.

Application Example 3 In the resonator element according to Application Example 1, the length of the first groove and the second groove in the first direction is RS, and the length of the third groove and the fourth groove is in the first direction. When the length is S, the length from the root to the tip of the vibrating arm is A, and the sum of RS and S is L, 8.8992 × (L / A) ² −3.3784 × It is preferable that (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² + 3.3784 × (L / A) +0.854.

According to this configuration, the resonator element is 8.8992 × (L / A) ² −3.3784 × (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² +3. Since 3784 × (L / A) +0.854, the out-of-plane vibration component due to the first groove portion and the second groove portion and the out-of-plane vibration component due to the third groove portion and the fourth groove portion are almost offset. Is done.
As a result, since the vibration piece further suppresses loss of vibration energy, the efficiency of bending vibration is further improved.
Note that 8.8992 × (L / A) ² −3.3784 × (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² + 3.3784 × (L / A) +0 .854 is a knowledge derived by the inventors through simulations and experiments.

Application Example 4 In the resonator element according to Application Example 3, it is preferable that RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3.

According to this configuration, since the resonator element is RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3, the first groove portion and The out-of-plane vibration component caused by the second groove portion and the out-of-plane vibration component caused by the third groove portion and the fourth groove portion are almost all canceled out.
As a result, since the vibration piece further suppresses the loss of vibration energy, the efficiency of bending vibration is further improved.
Note that RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3 is a knowledge derived by the inventors through simulations and experiments.

  Application Example 5 In the resonator element according to the application example described above, it is preferable that the resonator element includes quartz.

  According to this configuration, since the resonator element includes quartz, it is possible to provide a resonator element having excellent characteristics such as frequency-temperature characteristics and processing accuracy depending on the physical properties of the crystal.

  Application Example 6 A vibrator according to this application example is a vibrator using the resonator element according to any one of Application Examples 1 to 5, and includes the resonator element and a package that stores the resonator element. , Provided.

  According to this configuration, since the resonator element according to any one of the application examples 1 to 5 is housed in the package, the vibrator has the effect described in any one of the application examples. Can be provided.

  Application Example 7 An oscillator according to this application example is an oscillator that uses the resonator element according to any one of Application Examples 1 to 5, and includes the resonator element and a circuit element that drives the resonator element. It is provided with.

  According to this configuration, since the oscillator includes the resonator element according to any one of the application examples 1 to 5 and the circuit element, the oscillator having the effect described in any of the application examples is provided. Can be provided.

  Application Example 8 An electronic apparatus according to this application example uses the resonator element according to any one of Application Examples 1 to 5.

  According to this configuration, since the electronic device uses the resonator element according to any one of Application Examples 1 to 5, an electronic device that exhibits the effect described in any one of Application Examples 1 to 5 is provided. it can.

1 is a schematic perspective view showing a schematic configuration of a quartz crystal resonator element according to a first embodiment. The schematic plan view of FIG. (A) is sectional drawing and wiring diagram in the BB line of FIG. 2, (b) is sectional drawing and wiring diagram in the CC line of FIG. The graph showing the f / fm dependence of the Q value of a bending vibration piece. The graph which shows correlation with RS / S and UZ / UX (Z displacement / X displacement). The graph which shows the correlation of L / A and RS / S. FIG. 6 is a schematic plan view showing a quartz crystal resonator element according to a modification of the first embodiment. The schematic plan view which shows schematic structure of the crystal oscillator of 2nd Embodiment. The schematic cross section of FIG. FIG. 6 is a schematic cross-sectional view showing a schematic configuration of a crystal oscillator according to a third embodiment. The model perspective view which shows the mobile telephone of 4th Embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.
In the first embodiment, a quartz crystal vibrating piece including a quartz crystal that is a kind of piezoelectric body will be described as an example. In the second embodiment, the third embodiment, and the fourth embodiment, a crystal resonator, a crystal oscillator, and a mobile phone are taken as examples of a resonator, an oscillator, and an electronic device that use the crystal resonator element. Will be described.

In the following embodiments (excluding the fourth embodiment), the X-axis, the Y-axis, and the Z-axis will be described, and each axis is a crystal X as an electric axis that is a crystal axis of quartz. An axis, a crystal Y axis as a mechanical axis, and a crystal Z axis as an optical axis are shown.
In the following embodiments, the illustrated Z-axis is inclined by about 1 to 5 degrees with respect to the crystal Z-axis, and a plane defined by the Z-axis and the X-axis is inclined with the inclination. It shall be good.

(First embodiment)
FIG. 1 is a schematic perspective view illustrating a schematic configuration of the quartz crystal resonator element according to the first embodiment. FIG. 2 is a schematic plan view of FIG. 3 is a schematic cross-sectional view of FIG. 2, FIG. 3 (a) is a cross-sectional view and wiring diagram taken along line BB of FIG. 2, and FIG. 3 (b) is a cross-sectional view of FIG. It is sectional drawing and wiring diagram in the C line. In FIG. 1 and FIG. 2, electrodes are omitted for convenience.

As shown in FIGS. 1 and 2, the crystal resonator element 1 includes a base 10 and a pair of vibrating arms 20 and 21 that extend from the base 10 in the first direction (Y-axis direction) and bend and vibrate. ing.
In the quartz crystal resonator element 1, a base 10 and a pair of vibrating arm portions 20 and 21 constitute a tuning fork.
The pair of vibrating arm portions 20 and 21 are formed in a prismatic shape, and extend in parallel with each other in the Y-axis direction (first direction) from one end side of the base portion 10.
The base portion 10 and the vibrating arm portions 20 and 21 are cut out from a quartz crystal or the like and then polished into a flat plate shape having a predetermined thickness and formed into individual tuning fork shapes by etching or the like.

  The vibrating arms 20 and 21 have one main surface 22 and 23 along the X-axis direction as a vibration direction in which bending vibration is defined, and the other main surface 22 and 23 facing the one main surface 22 and 23 and along the X-axis direction. Main surfaces 26 and 27, one surface 20c and 21c as a pair of expansion and contraction surfaces that intersect the X-axis direction and alternately expand and contract by bending vibration, and the other surfaces 20d and 21d.

The vibrating arm portions 20 and 21 have first groove portions 24 and 25 provided on one main surface 22 and 23 along the extending direction (first direction) of the vibrating arm portions 20 and 21. The main surfaces 26 and 27 have second groove portions 28 and 29 provided side by side with the first groove portions 24 and 25 along a second direction (X-axis direction) orthogonal to the first direction in plan view. .
Furthermore, the vibrating arm portions 20 and 21 are provided on the other main surfaces 26 and 27 side by side with the first groove portions 24 and 25 along the first direction in a plan view, and the base portions are formed from the first groove portions 24 and 25. 10 has third groove portions 24 ′ and 25 ′ provided on one side, provided on one of the main surfaces 22 and 23 along with the second groove portions 28 and 29 along the first direction in plan view, and 4th groove part 28 ', 29' provided in the base 10 side rather than the 2nd groove part 28 and 29 is provided.
One main surface 22, 23 of the vibrating arm 20, 21 is integrated with one main surface 11 of the base 10, and the other main surface 26, 27 is integrated with the other main surface 12 of the base 10. It has become.

The third groove portions 24 ′, 25 ′ and the fourth groove portions 28 ′, 29 ′ are provided from the roots of the vibrating arm portions 20, 21 toward the tip side.
As shown in FIG. 2, a predetermined distance is provided between the third groove portions 24 ′, 25 ′ and the fourth groove portions 28 ′, 29 ′ and the first groove portions 24, 25 and the second groove portions 28, 29. G is provided.
As shown in FIG. 2, the quartz crystal resonator element 1 is configured such that the length of the first groove portions 24 and 25 and the second groove portions 28 and 29 in the extending direction (first direction) is RS, the third groove portions 24 ′ and 25 ′, and When the length in the extending direction (first direction) of the fourth groove portions 28 ′ and 29 ′ is S, it is preferable that S: RS = 1: (2.2 to 2.8), and S: It is more preferable that RS = 1: 2.5 (details will be described later).

Further, the quartz crystal resonator element 1 is 8.8992 × (L / A) ² −3 when the length from the root to the tip of the vibrating arm portions 20 and 21 is A and the sum of RS and S is L. 3784 × (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² + 3.3784 × (L / A) +0.854, preferably RS / S = 5. 1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3 is more preferable (details will be described later).

As shown in FIG. 3, the first groove portions 24 and 25, the second groove portions 28 and 29, the third groove portions 24 ′ and 25 ′, and the fourth groove portions 28 ′ and 29 ′ have a substantially rectangular cross-sectional shape. The sum of the depths 24a, 25a of the groove portions 24, 25 and the depths 28a, 29a of the second groove portions 28, 29, and the depths 24a ', 25a' of the third groove portions 24 ', 25' and the fourth groove portion 28 '. , 29 'is formed such that the sum of the depths 28a' and 29a 'is larger than the distances 20a and 21a between the one main surface 22 and 23 and the other main surface 26 and 27 ( (24a + 28a)> 20a, (25a + 29a)> 21a, (24a ′ + 28a ′)> 20a, (25a ′ + 29a ′)> 21a).
The first groove portions 24 and 25, the second groove portions 28 and 29, the third groove portions 24 ′ and 25 ′, and the fourth groove portions 28 ′ and 29 ′ are formed by etching, sandblasting, or the like.

As shown in FIG. 3, the excitation electrode 30 is provided on the outer side walls of the first groove portions 24 and 25 and the second groove portions 28 and 29 and the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′. , 31 are provided.
Specifically, in the vibrating arm portion 20, the excitation electrode 30 includes one surface 20 c that connects one main surface 22 and the other main surface 26, and the other that connects one main surface 22 and the other main surface 26. And 20d.
The excitation electrode 31 includes a surface 24b on the one surface 20c side in the first groove portion 24, a surface 28b on the other surface 20d side in the second groove portion 28, and a surface on the one surface 20c side in the third groove portion 24 ′. 24b 'and the surface 28b' on the other surface 20d side of the fourth groove 28 '.

On the other hand, in the vibrating arm portion 21, the excitation electrode 31 includes one surface 21 c that connects one main surface 23 and the other main surface 27, and the other surface that connects one main surface 23 and the other main surface 27. 21d.
The excitation electrode 30 includes a surface 25b on the one surface 21c side in the first groove portion 25, a surface 29b on the other surface 21d side in the second groove portion 29, and a surface on the one surface 21c side in the third groove portion 25 ′. 25b 'and a surface 29b' on the other surface 21d side of the fourth groove 29 '.

The excitation electrodes 30 and the excitation electrodes 31 are connected to each other, and each is extracted to the base 10 by an extraction electrode (not shown), and is connected to a fixed electrode (not shown).
An AC charge is applied between the excitation electrode 30 and the excitation electrode 31.
The excitation electrodes 30 and 31 include a base layer such as Cr and Ni and an electrode layer such as Au and Ag. Each layer is formed by vapor deposition, sputtering, or the like.

Here, the operation of the crystal vibrating piece 1 will be described.
When an alternating charge is applied as a drive signal between the excitation electrodes 30 and 31 to the vibrating arm portions 20 and 21 of the quartz crystal vibrating piece 1, as shown in FIG. 1, the arrow D direction and the arrow substantially along the X axis direction Bending vibration is alternately displaced in the E direction.

More specifically, when a positive charge is applied to the excitation electrode 30 and a negative charge is applied to the excitation electrode 31, one surface 20c, 21c contracts in the Y-axis direction and the other surface 20d, 21d expands in the Y-axis direction. To do. Thereby, the vibrating arm portions 20 and 21 are displaced in the arrow D direction.
On the other hand, when a negative charge is applied to the excitation electrode 30 and a positive charge is applied to the excitation electrode 31, one surface 20c, 21c expands in the Y-axis direction and the other surface 20d, 21d contracts in the Y-axis direction. As a result, the vibrating arm portions 20 and 21 are displaced in the direction of arrow E.
The vibrating arms 20 and 21 of the quartz crystal vibrating piece 1 are alternately expanded and contracted between the one surface 20c and 21c and the other surface 20d and 21d by alternately repeating the displacement in the direction of the arrow D and the direction of the arrow E.

At this time, as shown in FIG. 3A, the cross-sectional shapes ((24a + 28a)> 20a, (25a + 29a)> in which the first groove portions 24, 25 and the second groove portions 28, 29 of the vibrating arm portions 20, 21 are formed. 21a), the distance of heat transfer from one surface 20c, 21c to the other surface 20d, 21d, which repeats contraction and extension alternately with bending vibration, is provided with a groove section having an H-shaped cross section as in the prior art. It becomes longer compared with the case.
The distance of the heat transfer will be described in detail. In the vibrating arm portion 20, from one end on the opening side of the first groove portion 24 of the one surface 20c to the opening side of the second groove portion 28 on the other surface 20d along the cross-sectional shape. The distance to one end, and in the vibrating arm portion 21, from one end on the opening side of the first groove portion 25 of one surface 21c to one end on the opening side of the second groove portion 29 on the other surface 21d along the cross-sectional shape. Is the distance.

  Similarly, as shown in FIG. 3B, the cross-sectional shape ((24a ′ + 28a ′)) in which the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′ of the vibrating arm portions 20 and 21 are formed. > 20a, (25a ′ + 29a ′)> 21a), the distance of heat transfer from one surface 20c, 21c to the other surface 20d, 21d, which repeats contraction and expansion alternately with bending vibration, is The cross-sectional shape becomes longer as compared with the case where an H-shaped groove is provided.

Here, the frequency f _{0 of} relaxation oscillation and the relaxation time τ described above are represented by f ₀ = 1 / (2πτ).
Since the quartz crystal resonator element 1 has a longer heat transfer distance than the conventional (H-shaped groove), the relaxation time τ until the temperature equilibrium state is reached is longer than the conventional (H-shaped groove). As a result, in the crystal resonator element 1, the relaxation vibration frequency (relaxation vibration frequency) f ₀ is moved away from the original bending vibration frequency f.

In general, it is known that the relaxation oscillation frequency (thermal relaxation frequency) f ₀ is obtained by the following equation.
f ₀ = πk / (2ρCpa ² ) (1)
Here, π is the circumference ratio, k is the thermal conductivity in the vibration direction (bending vibration direction) of the vibrating arm, ρ is the mass density of the vibrating arm, Cp is the heat capacity of the vibrating arm, and a is the vibration arm. This is the width in the vibration direction (bending vibration direction).
When the constants of the vibration arm material itself are input to the thermal conductivity k, the mass density ρ, and the heat capacity Cp in Expression (1), the relaxation vibration frequency f ₀ obtained is the relaxation of the vibration arm when no groove is provided. It becomes the vibration frequency.

FIG. 4 is a graph showing the f / fm dependence of the Q value of a flexural vibration piece (quartz crystal piece). Here, fm is a relaxation vibration frequency when a groove portion is not provided in the vibrating arm portion (when the cross-sectional shape of the vibrating arm portion is substantially rectangular). The figure described on the right side of the graph of FIG. 4 schematically represents the cross-sectional shape of the vibrating arm portion.
In FIG. 4, the triangular marker is a plot in the case of the cross-sectional shape of the vibrating arm shown in FIG. 3, and the black square marker is the groove of the vibrating arm by providing grooves on both main surfaces of the vibrating arm. The plot in the case of the H type with the cross-sectional shape being “H” and the white diamond-shaped marker are plots in the case of a flat plate in which no groove portion is provided on any main surface of the vibrating arm portion. A thick solid line is an approximate straight line for the value of a triangular marker, a broken line is an interpolation straight line between square markers, and an alternate long and short dash line is an interpolation straight line between rhombus markers.
As shown in FIG. 4, in the flexural vibration piece, the cross-sectional shape of the vibrating arm portion is the shape shown in FIG. It became clear that a high Q value could be obtained.
Furthermore, the bending vibration piece (corresponding to the crystal vibration piece 1) can obtain a higher Q value than either of the H type and the flat plate by setting f / fm to a value larger than 0.25. If f / fm is larger than 1, it is possible to obtain a Q value that is markedly higher than in the case of either the H type or the flat plate.

  By the way, as shown in FIG. 3A, the quartz crystal vibrating piece 1 is orthogonal to one of the main surfaces 22 and 23 of the vibrating arm portions 20 and 21 and extends in the extending direction of the vibrating arm portions 20 and 21 (first The cross-sectional shape including the first groove portions 24, 25 and the second groove portions 28, 29 cut along a plane orthogonal to the direction) is a straight line connecting one main surface 22, 23 and the other main surface 26, 27. A center line F between one main surface 22, 23 and the other main surface 26, 27, which is a straight line passing through the intermediate point and along one main surface 22, 23 (the other main surface 26, 27). It does not have a line-symmetric shape with F1 as the axis of symmetry.

  As a result, the quartz crystal resonator element 1 causes a mass imbalance in the vibrating arm portions 20 and 21 as it is, and the bending vibration displacement U of the vibrating arm portion 20 is one of the main vibrations as shown in FIG. Due to the displacement component Ux of the original bending vibration that vibrates in the X-axis direction along the surfaces 22 and 23 (the other main surfaces 26 and 27) and the moment in the Z-axis direction, the one main surface 22 and 23 and the other main surface The displacement is a combination of the out-of-plane vibration displacement component Uz that vibrates in the Z-axis direction, which is the direction connecting the surfaces 26 and 27.

On the other hand, the bending vibration displacement U1 of the vibrating arm portion 21 includes an original bending vibration displacement component U1x that vibrates in the X-axis direction and an out-of-plane vibration displacement component U1z that vibrates in the Z-axis direction by a moment in the Z-axis direction. Are combined displacements.
At this time, the displacement component Uz and the displacement component U1z are displacement components in the same direction.

As a result, the crystal resonator element 1 loses vibration energy because the direction of the bending vibration displacements U and U1 does not follow one of the main surfaces 22 and 23 (it does not follow the X-axis direction). There is a risk that the efficiency may decrease.
3A shows the displacements U and U1 in one direction of bending vibration (corresponding to the direction of arrow D in FIG. 1) for convenience, the displacement in the opposite direction (corresponding to the direction of arrow E in FIG. 1). The same applies to.

On the other hand, as shown in FIG. 3B, the quartz crystal resonator element 1 is orthogonal to one of the main surfaces 22 and 23 of the vibrating arm portions 20 and 21 and extends in the extending direction of the vibrating arm portions 20 and 21. The cross-sectional shape including the third groove portions 24 ′, 25 ′ and the fourth groove portions 28 ′, 29 ′ cut along the plane orthogonal to the (first direction) is the first groove portions 24, 25 and the second groove portions 28, 29. It is the shape which reversed the cross-sectional shape containing.
As a result, the quartz crystal resonator element 1 has the flexural vibration displacements U ′ and U1 ′ in the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′. The displacement components Ux ′ and U1x ′ of the original bending vibration along the axis and the displacement components Uz ′ and U1z ′ of the out-of-plane vibration oscillating in the Z-axis direction are combined.

  At this time, the crystal resonator element 1 has a cross-sectional shape including the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′, and a cross-sectional shape including the first groove portions 24 and 25 and the second groove portions 28 and 29. Because of the inverted shape, the direction of the out-of-plane vibration displacement components Uz ′ and U1z ′ in the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′ and the first groove portions 24 and 25. And the direction of the displacement components Uz and U1z of the out-of-plane vibration in the second groove portions 28 and 29 is opposite.

As a result, the quartz crystal resonator element 1 includes the displacement components Uz and U1z of the out-of-plane vibration in the first groove portions 24 and 25 and the second groove portions 28 and 29, and the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29. Since the displacement components Uz 'and U1z' of the out-of-plane vibration at 'are canceled out, the direction of displacement of the bending vibration as a whole is the X-axis direction (along one main surface as the prescribed vibration direction). Direction).
Thereby, since the quartz vibrating piece 1 reduces the loss of vibration energy by reducing the moment in the Z-axis direction, the efficiency of flexural vibration is improved.

The above will be further described based on specific data.
FIG. 5 shows the length RS in the extending direction of the first groove portions 24 and 25 and the second groove portions 28 and 29 and the length in the extending direction of the third groove portions 24 ′ and 25 ′ and the fourth groove portions 28 ′ and 29 ′. The ratio with S (hereinafter also simply referred to as RS / S), the displacement component UZ of out-of-plane vibration (vibration in the Z-axis direction) in the bending vibration of the quartz crystal vibrating piece 1 as a whole, and the originally specified vibration direction 5 is a graph showing a correlation with a ratio (hereinafter also simply referred to as UZ / UX) with a displacement component UX in the X-axis direction.

FIG. 6 shows the ratio between the sum L (RS + S) of the lengths of the grooves on the tip side and the base side of the vibrating arm portions 20 and 21 and the length A from the root to the tip of the vibrating arm portions 20 and 21 (hereinafter, It is a graph showing a correlation between RS / S in which the loss of vibration energy at that time is within an allowable range.
5 and 6 are based on data derived by the inventors through simulations and experiments.

As shown in FIG. 5, when the crystal resonator element 1 has RS / S = 2.2 to 2.8, that is, S: RS = 1: (2.2 to 2.8), UZ / UX is Therefore, vibration leakage Δf as a measure of vibration energy loss in flexural vibration (frequency when base 10 is hung with a wire or fixed with a soft conductive adhesive, base 10 with solder or The value of the shift amount with respect to the frequency when fixed with a hard conductive adhesive is small. Specifically, the vibration leakage Δf reaches a mass production conformity level of about 500 ppm or less.
Furthermore, since the crystal resonator element 1 has RS / S = 2.5, that is, S: RS = 1: 2.5, UZ / UX is substantially 0, so that the value of the vibration leakage Δf is the smallest. (Approximately 0 ppm).
The minus sign of UZ / UX indicates that the displacement direction of out-of-plane vibration is reversed (from the positive direction of the Z axis to the negative direction of the Z axis).

As shown in FIG. 6, the quartz crystal resonator element 1 has a pitch of 8.8992 × (L / A) ² −3.3784 × (L / A) +1.746 (the bottom line on the paper surface) ≦ RS / S. ≦ 1.3102 × (L / A) ² + 3.3784 × (L / A) +0.854 (the uppermost line on the paper) Since UZ / UX becomes small, the value of vibration leakage Δf Becomes smaller. Specifically, the mass production level is about 500 ppm or less.
Further, when the crystal resonator element 1 is RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3 (line at the center of the paper surface), UZ / Since UX is substantially 0, the value of vibration leakage Δf is the smallest (approximately 0 ppm).

  In the simulation and experiment, a sample shown in FIG. 2 having a length A from the root to the tip of the vibrating arm portions 20 and 21 = about 1650 μm and a width W of the vibrating arm portions 20 and 21 in the X-axis direction = about 100 μm. The gap G is fixed at about 20 μm, and the values of RS, S, and L are appropriately set within the range of RS = about 200 μm to about 1100 μm, S = about 100 μm to about 600 μm, and L = about 400 μm to about 1200 μm. And evaluated.

As described above, the crystal resonator element 1 according to the first embodiment includes the sum of the depths 24a and 25a of the first grooves 24 and 25 and the depths 28a and 29a of the second grooves 28 and 29, and the third groove. The sum of the depths 24a 'and 25a' of 24 'and 25' and the depths 28a 'and 29a' of the fourth groove portions 28 'and 29' is one main surface 22 and 23 and the other main surface 26 and 27. ((24a + 28a)> 20a, (25a + 29a)> 21a, (24a ′ + 28a).
')> 20a, (25a' + 29a ')> 21a).

As a result, the quartz crystal resonator element 1 is changed from the contracting surface to the expanding surface in the bending vibration as compared with, for example, the conventional case where the vibrating arms 20 and 21 are provided with a groove portion having an H-shaped cross section. Since the distance of heat transfer (the distance of heat transfer from one surface 20c, 21c to the other surface 20d, 21d) becomes longer, the relaxation time τ until the temperature equilibrium state is reached becomes longer.
As a result, the quartz crystal resonator element 1 can keep the relaxation vibration frequency f ₀ away from the original bending vibration frequency f, and therefore can suppress a decrease in the Q value due to the thermoelastic loss. Therefore, the quartz crystal resonator element 1 can be further reduced in size.

Further, the quartz crystal resonator element 1 is cut along a plane orthogonal to one of the main surfaces 22 and 23 of the vibrating arm portions 20 and 21 and orthogonal to the extending direction (first direction) of the vibrating arm portions 20 and 21. The cross-sectional shape including the third groove portions 24 ′, 25 ′ and the fourth groove portions 28 ′, 29 ′ is a shape obtained by inverting the cross-sectional shape including the first groove portions 24, 25 and the second groove portions 28, 29 cut in the same manner. It has become.
From this, the crystal resonator element 1 includes the directions of the displacement components Uz and U1z of the out-of-plane vibration caused by the first groove portions 24 and 25 and the second groove portions 28 and 29 in the bending vibration, and the third groove portions 24 ′ and 25 ′. And the direction of the displacement components Uz ′ and U1z ′ of the out-of-plane vibration caused by the fourth groove portions 28 ′ and 29 ′ is opposite.

As a result, the quartz crystal resonator element 1 includes the out-of-plane vibration displacement components Uz and U1z caused by the first groove portions 24 and 25 and the second groove portions 28 and 29, and the third groove portions 24 ′ and 25 ′ and the fourth groove portion 28 ′. , 29 ′, the displacement components Uz ′ and U1z ′ of the out-of-plane vibration cancel each other, so that the vibration direction of the bending vibration as a whole is the X-axis direction (one main surface) which is the prescribed vibration direction. 22, 23).
Thereby, since the loss of vibration energy in bending vibration is suppressed in the crystal vibrating piece 1, the CI (crystal impedance) value and the like are lowered, and the bending vibration efficiency is improved.

Further, in the quartz crystal resonator element 1, if S: RS = 1: (2.2 to 2.8), the displacement component Uz of the out-of-plane vibration caused by the first groove portions 24 and 25 and the second groove portions 28 and 29 is obtained. , U1z and the displacement components Uz ′, U1z ′ of out-of-plane vibration caused by the third groove portions 24 ′, 25 ′ and the fourth groove portions 28 ′, 29 ′ are almost canceled.
As a result, since the UZ / UX becomes smaller in the quartz crystal resonator element 1, the value of the vibration leakage Δf as a loss of vibration energy becomes smaller (about 500 ppm or less), and the bending vibration efficiency is further improved.

Further, when S: RS = 1: 2.5, the quartz crystal resonator element 1 has displacement components Uz and U1z of out-of-plane vibration caused by the first groove portions 24 and 25 and the second groove portions 28 and 29, and third Almost all of the displacement components Uz ′ and U1z ′ of out-of-plane vibration caused by the grooves 24 ′ and 25 ′ and the fourth grooves 28 ′ and 29 ′ are canceled out.
As a result, since the UZ / UX of the quartz crystal resonator element 1 is substantially 0, the value of the vibration leakage Δf is minimized (approximately 0 ppm), and the bending vibration efficiency is further improved.

In addition, the quartz crystal resonator element 1 is 8.892 × (L / A) ² −3.3784 × (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² + 3.3784 × If (L / A) +0.854, the displacement components Uz, U1z of the out-of-plane vibration caused by the first groove portions 24, 25 and the second groove portions 28, 29, the third groove portions 24 ′, 25 ′, and the fourth Displacement components Uz ′ and U1z ′ of out-of-plane vibration caused by the grooves 28 ′ and 29 ′ are almost canceled out.
As a result, since the crystal vibrating piece 1 has a smaller UZ / UX, the value of the vibration leakage Δf becomes smaller (about 500 ppm or less), and the bending vibration efficiency is further improved.

Furthermore, if the crystal resonator element 1 has RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3, the first grooves 24 and 25 and the second groove Displacement components Uz and U1z of out-of-plane vibration caused by the grooves 28 and 29, and displacement components Uz ′ and U1z ′ of out-of-plane vibration caused by the third groove parts 24 ′ and 25 ′ and the fourth groove parts 28 ′ and 29 ′, and Is further offset.
As a result, since the UZ / UX of the quartz crystal resonator element 1 is substantially 0, the value of the vibration leakage Δf is minimized (approximately 0 ppm), and the bending vibration efficiency is further improved.

  Further, since the quartz crystal resonator element 1 includes quartz crystal, it can be provided as a resonator element having various characteristics such as frequency-temperature characteristics, frequency aging characteristics, and processing accuracy depending on the physical properties of the crystal.

(Modification)
Hereinafter, modifications of the quartz crystal resonator element according to the first embodiment will be described.
FIG. 7 is a schematic plan view showing a quartz crystal resonator element according to a modification of the first embodiment. In addition, about a common part with 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 7, the quartz crystal vibrating piece 101 has a quartz vibrating piece according to the above embodiment in which the first groove portion 25 and the second groove portion 29, and the third groove portion 25 ′ and the fourth groove portion 29 ′ are arranged in the vibrating arm portion 121. Compared with the first vibrating arm portion 21, it is reversed. In other words, in the crystal vibrating piece 101, the arrangement of the groove portions is the same between the vibrating arm portion 20 and the vibrating arm portion 121.
In this arrangement, the crystal resonator element 101 can achieve the same effect as that of the first embodiment by the same action as that of the first embodiment.

  In the above-described embodiment and modification, the tuning fork type crystal vibrating piece having a pair of vibrating arm portions has been described as an example. However, the present invention is not limited to this, and for example, has a single vibrating arm portion. It may be a rod-shaped crystal vibrating piece or a tuning-fork type crystal vibrating piece having three or more vibrating arms.

(Second Embodiment)
Hereinafter, a crystal resonator as a resonator according to the second embodiment will be described as an example.
FIG. 8 is a schematic plan view showing a schematic configuration of the crystal resonator according to the second embodiment. FIG. 9 is a schematic cross-sectional view taken along line JJ in FIG. In FIG. 8, the lid is omitted for convenience.
Also, common parts with the first embodiment are denoted by the same reference numerals and description thereof is omitted.

A crystal resonator 80 according to the second embodiment is a crystal resonator using the crystal resonator element according to the first embodiment or a modification of the first embodiment. Here, a description will be given using the crystal vibrating piece 1 of the first embodiment.
As shown in FIGS. 8 and 9, the crystal resonator 80 houses the crystal resonator element 1 in a package 51. Specifically, as shown in FIG. 9, the crystal resonator 80 includes an internal space of a package 51 including a first substrate 54, a second substrate 55 and a third substrate 56 stacked on the first substrate 54. The crystal vibrating piece 1 is accommodated in S.

The package 51 includes a first substrate 54, a second substrate 55, and a third substrate 56, and further includes a lid 57. The package 51 has an extended portion 55a in which the second substrate 55 is extended into the package 51, and two electrode portions 52 are formed on the extended portion 55a.
In the crystal unit 80, a fixed electrode (not shown) of the crystal vibrating piece 1 is fixed to the electrode unit 52 using a conductive adhesive 53 or the like, and the excitation electrodes 30 and 31 (see FIG. 3) and the electrode unit are connected via the fixed electrode. 52 is electrically connected. In addition, as the conductive adhesive 53, what added conductive particles, such as silver particle, to the binder component which consists of predetermined | prescribed synthetic resins can be used.

The first substrate 54, the second substrate 55, and the third substrate 56 are formed of an insulating material such as ceramic. In particular, a material having a linear expansion coefficient that is the same as or close to that of the crystal vibrating piece 1 or the lid 57 is selected as a preferable material.
In the present embodiment, for example, a ceramic green sheet is used. The green sheet is obtained, for example, by dispersing ceramic powder in a predetermined solution, forming a kneaded product formed by adding a binder into a long sheet, and cutting it into a predetermined length It is.

The first substrate 54, the second substrate 55, and the third substrate 56 can be formed by laminating and sintering green sheets molded into the illustrated shape. The first substrate 54 constitutes the bottom of the package 51, and the second substrate 55 and the third substrate 56 that are stacked on the first substrate 54 are formed in a frame shape, and the internal space S together with the first substrate 54, the lid 57, and the like. Forming.
A lid 57 made of a metal such as ceramic, glass or Kovar is bonded to the third substrate 56 via a bonding material 58 such as Kovar ring or low melting point glass. Thereby, the internal space S of the package 51 is hermetically sealed.

A conductive pattern (not shown) is formed on the first substrate 54 using, for example, a conductive paste such as Ag or Pd or a conductive paste such as tungsten metallization, and then the first substrate 54, the second substrate 55, and the third substrate are formed. After the sintering with 56, Ni, Au, Ag, or the like is sequentially plated to form the electrode portion 52 described above.
The electrode part 52 is electrically connected to a mounting terminal 59 formed on the outer bottom surface of the package 51 by a conductive pattern (not shown).

In the crystal resonator 80, an AC charge is applied between the excitation electrodes 30 and 31 of the crystal resonator element 1 via a fixed electrode (not shown) by applying a drive signal to the mounting terminal 59 (see FIG. 3).
Thereby, the quartz crystal vibrating piece 1 performs bending vibration as shown in FIG.

As described above, the crystal resonator 80 is similar to the first embodiment because the crystal resonator element 1 is housed in the internal space S of the package 51 and the internal space S of the package 51 is hermetically sealed. It is possible to provide a vibrator exhibiting the effects described above.
The crystal resonator 80 can provide a resonator having the same effect as that of the first embodiment even if the crystal resonator element 101 according to the modification of the first embodiment is used instead of the crystal resonator element 1. .

  In the crystal unit 80, the second substrate 55 and the third substrate 56 may be omitted by forming the lid 57 in a cap shape with a collar. According to this, since the crystal resonator 80 has fewer components, the package 51 can be easily manufactured.

(Third embodiment)
Hereinafter, a crystal oscillator as an oscillator according to the third embodiment will be described as an example.
FIG. 10 is a schematic cross-sectional view showing a schematic configuration of the crystal oscillator of the third embodiment.
A crystal oscillator 90 according to the third embodiment is a crystal oscillator using the crystal resonator element according to the first embodiment or a modification of the first embodiment. Here, a description will be given using the crystal vibrating piece 1 of the first embodiment. The crystal oscillator 90 according to the third embodiment includes an IC chip 87 as a circuit element for driving the crystal resonator element 1 in the crystal resonator 80 according to the second embodiment.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment and 2nd Embodiment, and description is abbreviate | omitted.

As shown in FIG. 10, the crystal oscillator 90 has an internal connection terminal 89 made of Au or the like formed on the upper surface of the first substrate 54 of the package 51.
The IC chip 87 incorporating the oscillation circuit is housed in the internal space S of the package 51 and fixed to the upper surface of the first substrate 54 using an adhesive or the like. An IC connection pad 82 made of Au or the like is formed on the upper surface of the IC chip 87.

The IC connection pad 82 is connected to the internal connection terminal 89 by a metal wire 88.
The internal connection terminals 89 are connected to mounting terminals 59 and electrode portions 52 formed on the outer bottom surface of the package 51 via a conductive pattern (not shown). Note that, for the connection between the IC chip 87 and the internal connection terminal 89, a connection method by flip chip mounting may be used in addition to the connection method by the metal wire 88.
The internal space S of the package 51 is hermetically sealed.

In the crystal oscillator 90, an AC charge is applied from the IC chip 87 to the excitation electrodes 30 and 31 of the crystal resonator element 1 through the electrode portion 52 and a fixed electrode (not shown) by an external input (see FIG. 3).
Thereby, the quartz crystal vibrating piece 1 performs bending vibration as shown in FIG. The crystal oscillator 90 outputs an oscillation signal obtained by this bending vibration to the outside through the IC chip 87 and the mounting terminal 59.

As described above, in the crystal oscillator 90 of the third embodiment, the crystal resonator element 1 and the IC chip 87 are accommodated in the internal space S of the package 51, and the internal space S of the package 51 is hermetically sealed. Therefore, an oscillator having the same effect as that of the first embodiment can be provided.
Note that the crystal oscillator 90 can provide an oscillator having the same effect as that of the first embodiment even if the crystal resonator element 101 of the modification of the first embodiment is used instead of the crystal resonator element 1.
The crystal oscillator 90 may have a configuration (module structure) in which the IC chip 87 is attached to the outside of the package 51.

  In the third embodiment, the crystal oscillator has been described as an example. However, the present invention is not limited to this. For example, a pressure sensor or a gyro sensor that further includes a detection circuit in the IC chip 87 may be used.

(Fourth embodiment)
Hereinafter, a mobile phone as an electronic apparatus according to the fourth embodiment will be described as an example.
FIG. 11 is a schematic perspective view showing a mobile phone according to the fourth embodiment.
A cellular phone 700 according to the fourth embodiment is a cellular phone using the crystal vibrating piece according to the first embodiment or a modification of the first embodiment.
A cellular phone 700 shown in FIG. 11 uses the above-described crystal resonator element 1 (101) as, for example, a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, an earpiece 703, and a mouthpiece 704. It is configured with.

  The above-mentioned quartz crystal resonator element 1 (101) is not limited to the above mobile phone, but is an electronic book, personal computer, television, digital still camera, video camera, video recorder, car navigation device, pager, electronic notebook, calculator, word processor, work Provided is an electronic device that can be suitably used as a reference clock oscillation source for a station, a video phone, a POS terminal, a device equipped with a touch panel, and the like, and in any case, an electronic device that exhibits the effects described in the above-described embodiments and modifications. be able to.

The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate Even a semiconductor such as silicon provided with a piezoelectric material such as lead (PZT), zinc oxide (ZnO), or aluminum nitride (AlN), or a piezoelectric material such as zinc oxide (ZnO) or aluminum nitride (AlN) as a coating. Good.

  DESCRIPTION OF SYMBOLS 1 ... Crystal vibrating piece, 10 ... Base, 11 ... One main surface, 12 ... The other main surface, 20 ... Vibrating arm part, 20c ... One surface, 20d ... The other surface, 21 ... Vibrating arm part, 21c ... One surface as an expansion / contraction surface, 21d ... the other surface as an expansion / contraction surface, 22, 23 ... one main surface, 24, 25 ... first groove, 24 ', 25' ... third groove, 26, 27 ... the other , 28, 29 ... second groove, 28 ', 29' ... fourth groove.

Claims (8)

A base portion, and a vibrating arm portion extending in a first direction from the base portion and bending-vibrating,
The vibrating arm portion includes one main surface and the other main surface facing the one main surface,
The one main surface has a first groove portion provided along the first direction of the vibrating arm portion,
The other main surface has a second groove portion provided side by side with the first groove portion in a second direction orthogonal to the first direction in plan view,
The other main surface has a third groove portion provided in line with the first groove portion in the first direction in a plan view, and provided on the base side from the first groove portion,
The one main surface has a fourth groove portion provided in line with the second groove portion in the first direction in a plan view, and provided on the base side from the second groove portion,
The sum of the depth of the first groove portion and the depth of the second groove portion, and the sum of the depth of the third groove portion and the depth of the fourth groove portion are between the one main surface and the other main surface. A vibrating piece characterized by being larger than the distance. 2. The resonator element according to claim 1, wherein RS is a length in the first direction of the first groove portion and the second groove portion, and S is a length in the first direction of the third groove portion and the fourth groove portion. When
S: RS = 1: (2.2 to 2.8). 2. The resonator element according to claim 1, wherein RS is a length in the first direction of the first groove portion and the second groove portion, and S is a length in the first direction of the third groove portion and the fourth groove portion. When the length from the root to the tip of the vibrating arm portion is A, and the sum of the RS and the S is L,
8.8992 × (L / A) ² −3.3784 × (L / A) + 1.746 ≦ RS / S ≦ 1.3102 × (L / A) ² + 3.3784 × (L / A) +0.854
A vibrating piece characterized by being. The resonator element according to claim 3,
RS / S = 5.1047 × (L / A) ² −9 × 10 ⁻¹⁴ × (L / A) +1.3
A vibrating piece characterized by being.   5. The resonator element according to claim 1, wherein the resonator element includes a crystal. A vibrator using the resonator element according to any one of claims 1 to 5,
The vibrating piece;
And a package containing the resonator element. An oscillator using the resonator element according to any one of claims 1 to 5,
The vibrating piece;
An oscillator comprising: a circuit element that drives the resonator element.   An electronic device using the resonator element according to claim 1.

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