JP2015041785A - Vibration piece, vibrator, oscillator, electronic apparatus, and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece capable of easily realizing downsizing and improving productivity and reliability.SOLUTION: A vibration piece 1 includes a base portion 10 and a plurality of vibration arms 11a, 11b, 11c extending from the base portion 10 in parallel. The plurality of vibration arms 11a, 11b, 11c consist of the driving vibration arms 11a, 11c as drive vibration arms and the non-driving vibration arm 11b as a non-drive vibration. First electrodes 12a1, 12c1 and a first lead-out wiring 15 lead out from the first electrodes 12a1, 12c1 to the base portion 10 are mounted on the vibration arms 11a, 11c. A piezoelectric body 13 for driving the vibration arms 11a, 11c is mounted above the first electrodes 12a1, 12c1, and second electrodes 12a2, 12c2 and second lead-out wiring 16 lead out from the second electrodes 12a2, 12c2 to the base portion 10 are mounted above the piezoelectric body.

Description

  The present invention relates to a resonator element, a vibrator including the resonator element, an oscillator, an electronic device, and a moving object.

Conventionally, as the resonator element, each of the arm portions includes three arm portions each having a first surface arranged in the first direction and arranged along a second direction intersecting the first direction. There is known a tuning fork type vibrator (hereinafter referred to as a vibrating piece) having a structure including a piezoelectric element provided on the first surface of each of the first piezoelectric element and a base part that connects one end of an arm part (for example, a vibrating piece) (for example, Patent Document 1).
Each of the piezoelectric elements includes a lower electrode film disposed on the first surface, a piezoelectric film disposed on the lower electrode film, and an upper electrode film disposed on the piezoelectric film. Among the piezoelectric elements, the lower electrode film of the piezoelectric element arranged outside and the upper electrode film of the piezoelectric element arranged inside are electrically connected to each other, and the outside The upper electrode film of the piezoelectric element disposed on the inside and the lower electrode film of the piezoelectric element disposed on the inner side are electrically connected to each other.

JP 2009-5022 A

The vibrating element is provided with a piezoelectric element in each arm portion, and the above-described electrical connection relationship between the upper electrode film and the lower electrode film of each piezoelectric element results in the wiring drawn from the upper electrode film and the lower part Wiring drawn from the electrode film intersects with each other on the base, and has a structure that reaches a pair of electrode pads through a complicated routing in which the vertical positional relationship is reversed.
In addition, the resonator element has a configuration that requires a plurality of joints that join the wiring drawn from the upper electrode film and the wiring drawn from the lower electrode film before the electrode pad.

For these reasons, the resonator element requires a considerable amount of wiring space on the base, and the base may be relatively large. Thereby, there exists a possibility that size reduction of the said vibration piece may be inhibited.
In addition, the vibration piece has a complicated wiring formation process and wiring bonding process, which may cause a decrease in productivity and a decrease in reliability.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A resonator element according to this application example includes a base portion and a plurality of vibrating arms extending in parallel from the base portion, and the plurality of vibrating arms are driven driving vibrating arms, A non-driven vibrating arm that is not driven, and the driving vibrating arm is provided with a first electrode and a first lead-out wiring led out from the first electrode to the base, and the driving is provided above the first electrode. A piezoelectric film for driving the vibrating arm is provided, and a second electrode and a second lead-out wiring led out from the second electrode to the base are provided above the piezoelectric film.

According to this, the resonator element includes a drive vibration arm that drives a plurality of vibration arms and a non-drive vibration arm that is not driven, and the first electrode and the first lead-out wiring and the piezoelectric film are provided only on the drive vibration arm. The second electrode and the second lead wiring are provided in this order.
As a result, compared to the case where the electrodes are provided on all the vibrating arms, the resonator element can simplify the wiring of each wiring, thereby reducing the wiring space and reducing the size of the base. Can be small.
Thereby, the plane size of the resonator element can be reduced.

In addition, since the vibrating piece is simple in routing each wiring, the wiring forming process is facilitated, and productivity and reliability can be improved.
The non-drive vibrating arm vibrates in a phase opposite to that of the driving vibrating arm due to a resonance action by matching or approximating the natural frequency with the vibration frequency of the driving vibrating arm.

  Application Example 2 In the resonator element according to the application example described above, a plurality of the drive vibration arms are provided, and the first electrodes provided in the drive vibration arms are electrically connected through the first lead wires, respectively. It is preferable that the second electrode provided in the drive vibrating arm is electrically connected via the second lead wiring.

According to this, in the resonator element, the first lead wires drawn from the first electrode are connected to each other, and the second lead wires drawn from the second electrode are connected to each other, as in the prior art (for example, Patent Document 1), The first extraction wiring (corresponding to the wiring extracted from the lower electrode film) and the second extraction wiring (corresponding to the wiring extracted from the upper electrode film) are not connected to each other.
As a result, since the vibrating piece can be simply routed, the wiring space can be reduced and the size of the base can be reduced.
Thereby, the plane size of the resonator element can be reduced.

  Application Example 3 In the resonator element according to the application example described above, it is preferable that three vibrating arms are provided, one at the center is the driving vibrating arm, and the other two are the non-driving vibrating arms.

According to this, since the vibrating piece includes three vibrating arms, one in the center is a driving vibrating arm and the remaining two are non-driving vibrating arms, the first lead wiring and the second lead wiring The routing at the base of the motor is simpler than when there are two drive vibrating arms.
As a result, the resonator element can further improve productivity and reliability.

  Application Example 4 In the resonator element according to the application example described above, the vibration arm includes three vibration arms, one at the center is the non-drive vibration arm, and the other two are driven in phase with each other. It is preferable that

  According to this, the vibrating piece includes three vibrating arms, one at the center is a non-driving vibrating arm, and the other two are driving vibrating arms that are driven in phase with each other. The vibration efficiency can be further improved as compared with the case where there is one drive vibrating arm.

  Application Example 5 A vibration piece according to this application example includes a base portion and a plurality of vibrating arms extending in parallel from the base portion, and the plurality of vibrating arms are driven driving vibrating arms, A non-driven vibrating arm that is not driven, wherein the base and the vibrating arm are electrically conductive, and a piezoelectric film that drives the driving vibrating arm is provided on the driving vibrating arm, above the piezoelectric film The second electrode and the second lead-out wiring led out from the second electrode are provided.

According to this, in the resonator element, the base portion and the vibrating arm have conductivity, and the first electrode and the first lead-out wiring are not required as in the above application example. It becomes only wiring and becomes simpler.
As a result, the resonator element further improves the productivity and reliability because the wiring forming process is further facilitated.

  Application Example 6 A vibrator according to this application example includes the resonator element according to any one of the application examples described above and a package that accommodates the resonator element.

  According to this, the vibrator according to this configuration includes the resonator element according to any one of the application examples described above and the package that accommodates the resonator element, and thus the effect according to any one of the application examples described above. Can be provided.

  Application Example 7 An oscillator according to this application example includes the resonator element according to any one of the application examples described above and a drive circuit that drives the resonator element.

  According to this, the oscillator according to this configuration includes the resonator element according to any one of the application examples described above and the drive circuit that drives the resonator element, and thus the effect according to any one of the application examples described above. An oscillator that achieves the above can be provided.

  Application Example 8 An electronic apparatus according to this application example includes the resonator element according to any one of the application examples.

  According to this, since the electronic device having this configuration includes the resonator element according to any one of the application examples, it is possible to provide an electronic device that exhibits the effect according to any of the application examples. .

  Application Example 9 A moving object according to this application example includes the resonator element according to any one of the application examples described above.

  According to this, since the moving body of this configuration includes the resonator element according to any one of the application examples, it is possible to provide a moving body that exhibits the effect according to any of the application examples. .

It is a schematic diagram which shows schematic structure of the resonator element of 1st Embodiment, (a) is a top view, (b) is sectional drawing in the AA of (a), (c) is B of (a). Sectional drawing in the -B line. Sectional drawing in CC line of Fig.1 (a), and the wiring diagram of each excitation part. It is a schematic diagram which shows schematic structure of the resonator element of 2nd Embodiment, (a) is a top view, (b) is sectional drawing in the AA of (a), (c) is B of (a). Sectional drawing in the -B line. Sectional drawing in CC line of Fig.3 (a), and the wiring diagram of an excitation part. It is a schematic diagram which shows schematic structure of the vibrator | oscillator of 3rd Embodiment, (a) is the top view seen from the lid (lid body) side, (b) is sectional drawing in the DD line of (a). It is a schematic diagram which shows schematic structure of the oscillator of 4th Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing in the DD line of (a). The model perspective view which shows the mobile telephone of 5th Embodiment. The model perspective view which shows the motor vehicle of 6th Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
Here, as an example of the resonator element, a resonator element in which Si (silicon) is used for a base material (a material constituting most part of the resonator element) will be described.
1A and 1B are schematic views illustrating a schematic configuration of the resonator element according to the first embodiment. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 1C is a cross-sectional view taken along line BB in FIG. In addition, the dimensional ratio of each component differs from actual.
FIG. 2 is a cross-sectional view taken along line CC in FIG. 1A and a wiring diagram of each excitation unit.
Note that the X-axis, Y-axis, and Z-axis in each figure are coordinate axes that are orthogonal to each other.

As shown in FIG. 1, the resonator element 1 includes a base portion 10 and three vibrating arms 11a, 11b, and 11c extending from the base portion 10 in the Y-axis direction. In the present embodiment, a Si substrate (for example, a Poly-Si substrate) is used for the three vibrating arms 11a, 11b, 11c and the base 10.
The vibrating arms 11a, 11b, and 11c are formed in a substantially prismatic shape, and are in a parallel state in the X-axis direction orthogonal to the Y-axis direction in plan view.
The vibrating arms 11a and 11c are driving vibrating arms driven by a piezoelectric body 13 as a piezoelectric film described later, and the central vibrating arm 11b is a non-driven vibrating arm that is not driven.
Of the two main surfaces 10a and 10b along the plane (XY plane) specified by the X-axis and the Y-axis of the vibrating arms 11a and 11c, excitation portions 12a and 12c are provided on the main surface 10a. . The main surface 10 a extends integrally to the vibrating arm 11 b and the outer edge of the base 10.

The vibrating arms 11a and 11c are bent in the same phase in the Z-axis direction (arrow direction in FIG. 1C) orthogonal to the main surface 10a by the excitation units 12a and 12c (out-of-plane vibration: direction intersecting the main surface 10a). Vibration).
The resonating arm 11b does not have an excitation part, but performs bending vibration in the opposite phase to the resonating arms 11a and 11c in the Z-axis direction (arrow direction in FIG. 1B) orthogonal to the main surface 10a due to resonance.
The base 10 and the vibrating arms 11a, 11b, and 11c, the excitation units 12a and 12c, and the like are formed with high accuracy using, for example, sputtering (sputtering) technology, photolithography technology, etching technology, and the like.

The excitation parts 12a and 12c are provided above the first electrode 12a1 and 12c1 provided on the main surface 10a side, the piezoelectric body 13 provided above the first electrodes 12a1 and 12c1, and the piezoelectric body 13. It has a laminated structure including the second electrodes 12 a 2 and 12 c 2 and the insulating film 14 provided between the first electrodes 12 a 1 and 12 c 1 and the piezoelectric body 13.
The piezoelectric body 13 has a function of driving (vibrating) the vibrating arms 11a and 11c by a piezoelectric effect (reverse piezoelectric effect).
The vibrating arm 11b is preferably provided with a first electrode 12b1, a piezoelectric body 13, and an insulating film 14 in order to match the vibrating arms 11a and 11c with characteristics such as Q value and natural frequency as much as possible.

The first lead wires 15 drawn from the first electrodes 12a1, 12b1, and 12c1 are connected to each other at the base 10 (here, covering the entire main surface 10a of the base 10).
In the present embodiment, the first electrodes 12 a 1, 12 b 1, 12 c 1 and the first lead wiring 15 are integrated to cover the entire surfaces of the vibrating arms 11 a, 11 b, 11 c and the main surface 10 a of the base 10. Yes.

On the other hand, the second lead wirings 16 led out from the second electrodes 12 a 2 and 12 c 2 are connected to each other at the base 10.
The first lead wiring 15 and the second lead wiring 16 are insulated from each other by an insulating film 14 extending to the base 10.
The piezoelectric bodies 13 provided on the vibrating arms 11a, 11b, and 11c extend to the base 10 and are connected to each other.

At the end of the base 10 on the − (minus) Y side in the Y-axis direction, the insulating film 14 is partially opened to expose the first lead wiring 15, thereby connecting to the first electrodes 12 a 1, 12 b 1, and 12 c 1. An electrode pad 17 is provided.
On the + (plus) Y side of the electrode pad 17, an electrode pad 18 connected to the second electrodes 12 a 2 and 12 c 2 is provided by partially expanding the second lead wiring 16 on the insulating film 14. Yes.

The first electrodes 12a1 and 12c1, the second electrodes 12a2 and 12c2 of the excitation units 12a and 12c, the first electrode 12b1 of the vibrating arm 11b, the first lead wiring 15 and the second lead wiring 16 include TiN (titanium nitride). A film is used, and the piezoelectric body 13 is a film containing AlN (aluminum nitride) that is excellent in reliability and insulation. The insulating film 14 is a film containing SiO ₂ (silicon dioxide) in an amorphous state.
The first electrodes 12a1 and 12c1, the second electrodes 12a2 and 12c2, the first electrode 12b1 of the vibrating arm 11b, the first lead wiring 15 and the second lead wiring 16 are different from TiN, for example, Mo, Ti, Pt A film containing Au, W, Ta, or the like may be used.
The piezoelectric body 13 is made of a film different from AlN, for example, containing ZnO (zinc oxide), PZT (lead zirconate titanate), LiNbO ₃ (lithium niobate), KNbO ₃ (potassium niobate), or the like. May be.

The excitation parts 12a and 12c extend from the base part (boundary part with the base part 10) of the vibrating arms 11a and 11c toward the tip part, and the entire length of the vibrating arms 11a and 11c (the length from the root to the tip in the Y-axis direction). ) Is preferably about half the length of the above) in order to obtain efficient vibration characteristics.
In addition, it is preferable that the length of the piezoelectric body 13 provided in the vibrating arm 11b which is the non-driving vibrating arm of the vibrating piece 1 conforms to the above.
Note that the first electrodes 12a1, 12b1, 12c1 and the insulating film 14 on the distal end side from the piezoelectric body 13 may be omitted.

As shown in FIG. 1B, the thickness of the base 10 in the Z-axis direction is formed to be thicker than the thickness of the vibrating arms 11a, 11b, and 11c in the Z-axis direction.
Further, as indicated by a two-dot chain line in FIG. 1A, on the main surface 10b side of both ends in the X-axis direction of the base portion 10, fixing portions 10c and 10d which are fixing regions to external members such as packages are provided. Is provided. In addition, it is preferable that the fixing | fixed part 10c, 10d is provided in the edge part on the opposite side to the vibrating arms 11a, 11b, 11c side of the base 10 in the Y-axis direction.

Here, the operation of the resonator element 1 will be described.
As shown in FIG. 2, the excitation parts 12a and 12c of the resonator element 1 are connected to an AC power source by a simple wiring in which the first electrodes 12a1 and 12c1 and the second electrodes 12a2 and 12c2 are connected to each other. An alternating voltage as a voltage is applied.
Specifically, the first electrode 12a1 of the vibrating arm 11a and the first electrode 12c1 of the vibrating arm 11c are connected to have the same potential, and the second electrode 12a2 of the vibrating arm 11a and the second electrode of the vibrating arm 11c. The electrode 12c2 is connected so as to have the same potential. The first electrode 12b1 of the vibrating arm 11b is also connected to the other first electrodes 12a1 and 12c1 for convenience.

In this state, when an alternating voltage is applied between the first electrodes 12a1, 12c1 and the second electrodes 12a2, 12c2, an electric field is generated between the first electrodes 12a1, 12c1 and the second electrodes 12a2, 12c2. Due to the inverse piezoelectric effect, the piezoelectric body 13 is distorted, and the piezoelectric body 13 expands and contracts in the Y-axis direction.
In the resonator element 1, the direction of the electric field generated in the excitation parts 12 a and 12 c by the wiring is the same, and the expansion and contraction of the piezoelectric body 13 is the same (in phase) in the vibration arm 11 a and the vibration arm 11 c. It is configured.
Specifically, when the piezoelectric body 13 of the vibrating arm 11a expands, the piezoelectric body 13 of the vibrating arm 11c also expands, and when the piezoelectric body 13 of the vibrating arm 11a contracts, the piezoelectric body 13 of the vibrating arm 11c also contracts. .

By such expansion and contraction of the piezoelectric body 13, the resonator element 1 vibrates when the alternating voltage is at one potential, and the vibrating arms 11 a, 11 b, and 11 c bend in the direction of the black arrow, and vibrates when the alternating voltage is at the other potential. The arms 11a, 11b, 11c are bent in the direction of the white arrow. Note that the bending of the vibrating arm 11b is due to the resonance action.
By repeating this, in the resonator element 1, the vibrating arms 11 a, 11 b, and 11 c undergo bending vibration (out-of-plane vibration) in the Z-axis direction. At this time, the vibrating arm 11a and the vibrating arm 11c bend and vibrate in the same direction (in-phase), and the vibrating arm 11b bends and vibrates in the opposite direction (reverse phase) to the vibrating arms 11a and 11c.

As described above, the resonator element 1 of the present embodiment includes the vibrating arms 11a and 11c that are driven vibrating arms that are driven and the vibrating arm 11b that is a non-driven vibrating arm that is not driven. Excitation parts 12a and 12c are provided only in 11c.
As a result, in the resonator element 1, the routing of the first lead-out wiring 15 and the second lead-out wiring 16 is simplified as compared with the conventional configuration in which all the vibrating arms have the excitation portion. The space can be reduced, and the size of the base 10 can be reduced. Thereby, the resonator element 1 can reduce the planar size.

The resonator element 1 includes vibrating arms 11a and 11c that are driven vibrating arms that are driven, and a vibrating arm 11b that is a non-driven vibrating arm that is not driven. The vibrating arms 11a and 11c are driven in phase with each other. (Bending vibration).
That is, in the resonator element 1, the potentials of the first electrodes 12 a 1 and 12 c 1 and the second electrodes 12 a 2 and 12 c 2 are always the same.
Thereby, the resonator element 1 is connected to the first lead wires 15 drawn from the first electrodes 12a1, 12c1, and (12b1) and the second lead wires 16 drawn from the second electrodes 12a2 and 12c2. As in (for example, Patent Document 1), the first lead-out wiring 15 and the second lead-out wiring 16 are not connected to each other.

As a result, in the resonator element 1, the routing of the first lead-out wiring 15 and the second lead-out wiring 16 is simpler than in the past (for example, Patent Document 1). It becomes possible, and the size of the base 10 can be reduced. Thereby, the resonator element 1 can reduce the planar size.
In addition, since the vibrating piece 1 can be easily routed between the first lead-out wiring 15 and the second lead-out wiring 16, the wiring forming process is easy (particularly, the first lead-out wiring 15 is a solid wiring, so that evaporation, sputtering, etc. are performed. In addition, it is not necessary to perform patterning after film formation by the above-described method, and the bonding process between the first lead-out wiring 15 and the second lead-out wiring 16 is not required, so that productivity and reliability can be improved.

  The vibrating piece 1 includes three vibrating arms 11a, 11b, and 11c, the central vibrating arm 11b is a non-driven vibrating arm, and the remaining two vibrating arms 11a and 11c are driven vibrating arms. Therefore, the vibration efficiency of the vibrating arms 11a, 11b, and 11c can be further improved as compared with a case where the number of driving vibrating arms described later is one.

Note that the resonator element 1 may be provided with a film containing SiO ₂ between the main surface 10a of the vibrating arms 11a, 11b, and 11c and the first electrodes 12a1, 12b1, and 12c1.
According to this, in the resonator element 1, the film containing SiO ₂ functions as a temperature characteristic correction film for the vibrating arms 11 a, 11 b, 11 c.
More specifically, in the resonator element 1, the slope of the frequency-temperature characteristics of the vibrating arms 11 a, 11 b, 11 c whose base material is Si is corrected (offset) by the slope of the frequency-temperature characteristics of the film containing SiO ₂ . Flat frequency-temperature characteristics.
As a result, the resonator element 1 can suppress frequency fluctuations caused by temperature changes, and can improve frequency-temperature characteristics.

The resonator element 1 is provided with a film containing SiO ₂ on the surface (main surface 10b) opposite to the first electrodes 12a1, 12b1, 12c1 side (main surface 10a side) of the vibrating arms 11a, 11b, 11c. May be.
According to this, the resonator element 1 can obtain the same effect as described above.

Note that the resonator element 1 can reduce the capacitance generated between the first lead-out wiring 15 and the second lead-out wiring 16 by increasing the thickness of the insulating film 14 on the base 10.
Thereby, the resonator element 1 can suppress an increase in the CI value due to the capacitance, and can improve the vibration characteristics.

(Second Embodiment)
Next, the resonator element according to the second embodiment will be described.
FIG. 3 is a schematic diagram illustrating a schematic configuration of the resonator element according to the second embodiment. FIG. 3A is a plan view, and FIG. 3B is an AA line in FIG. Sectional drawing and FIG.3 (c) are sectional drawings in the BB line of Fig.3 (a).
FIG. 4 is a cross-sectional view taken along line CC in FIG. 3A and a wiring diagram of the excitation unit. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

The resonator element 2 of the second embodiment is different from the first embodiment in the drive vibration arm and the non-drive vibration arm.
As shown in FIGS. 3 and 4, in the resonator element 2, the center vibrating arm 11 b is a driving vibrating arm, and the vibrating arms 11 a and 11 c are non-driving vibrating arms.
An excitation unit 12b is provided on the main surface 10a of the vibrating arm 11b.
The vibrating arm 11b performs bending vibration in the Z-axis direction orthogonal to the main surface 10a by the excitation unit 12b.
The resonating arms 11a and 11c do not have an excitation part, but bend and vibrate in a phase opposite to that of the resonating arm 11b in the Z-axis direction due to resonance.

The excitation unit 12b includes a first electrode 12b1 provided on the main surface 10a side, a piezoelectric body 13 provided above the first electrode 12b1, and a second electrode 12b2 provided above the piezoelectric body 13. And an insulating film 14 disposed between the first electrode 12 b 1 and the piezoelectric body 13.
The first lead wire 15 drawn from the first electrode 12b1 extends to the base 10 and is connected to the electrode pad 17.
The second lead wiring 16 led out from the second electrode 12b2 extends linearly to the base 10 and is connected to the electrode pad 18.

The vibrating arms 11 a and 11 c are preferably provided with first electrodes 12 a 1 and 12 c 1, a piezoelectric body 13, and an insulating film 14 in order to match characteristics such as the Q value and the natural frequency with the vibrating arm 11 b as much as possible.
Accordingly, in the present embodiment, as in the first embodiment, the first electrodes 12a1, 12b1, 12c1, the first lead wiring 15, and the electrode pad 17 are integrated to form the vibrating arms 11a, 11b, 11c and the base portion 10. The main surface 10a is covered.

Note that the vibrating arm 11b has an arm width (length along the X-axis direction) of the vibrating arm 11a from the viewpoint of improving the vibration efficiency and the dynamic balance of vibration in the three vibrating arms 11a, 11b, and 11c. 11c is preferably about 1.35 times to 1.9 times, more preferably about 1.6 times (see JP 2012-160996 A).
Note that the above contents can also be applied to the resonator element 1 of the first embodiment.

As described above, in the resonator element 2 of the second embodiment, the center one vibrating arm 11b is a driving vibrating arm, and the remaining two vibrating arms 11a and 11c are non-driving vibrating arms. The routing of the first lead-out wiring 15 and the second lead-out wiring 16 at the base 10 is further simplified as compared with the first embodiment in which the two vibrating arms 11a and 11c are driving vibrating arms.
As a result, the resonator element 2 can improve productivity and reliability compared to the first embodiment.

(Third embodiment)
Next, a vibrator including the resonator element described in the first embodiment and the second embodiment will be described.
FIG. 5 is a schematic diagram illustrating a schematic configuration of the vibrator according to the third embodiment. FIG. 5A is a plan view seen from the lid (lid) side, and FIG. 5B is a cross-sectional view taken along the line DD in FIG. In the plan view, the lid is omitted. Also, wiring in the package is omitted.
In addition, the same code | symbol is attached | subjected to the common part with the said 1st Embodiment and 2nd Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from the said 1st Embodiment and 2nd Embodiment. .

  As shown in FIG. 5, the vibrator 5 includes the vibrating piece 1 described in the first embodiment or the vibrating piece 2 described in the second embodiment (here, the vibrating piece 1), and the vibrating piece 1. And a package 20 that accommodates.

The package 20 includes a package base 21 having a substantially rectangular planar shape and a recess, and a lid 22 having a substantially rectangular planar shape covering the recess of the package base 21 and is formed in a substantially rectangular parallelepiped shape. Yes.
The package base 21 is made of an aluminum oxide sintered body, quartz, glass, Si, or the like formed by stacking and firing ceramic green sheets.
The lid 22 is made of the same material as the package base 21 or a metal such as Kovar or 42 alloy.

The package base 21 is provided with internal terminals 24 and 25 on an inner bottom surface (a bottom surface inside the recess) 23.
The internal terminals 24 and 25 are formed in a substantially rectangular shape at positions near the electrode pads 17 and 18 provided on the base 10 of the resonator element 1.

A pair of external terminals 27 and 28 used for mounting on an external member such as an electronic device are formed on the outer bottom surface (the surface opposite to the inner bottom surface 23, the outer bottom surface) 26 of the package base 21. .
The external terminals 27 and 28 are connected to the internal terminals 24 and 25 by internal wiring (not shown). For example, the external terminal 27 is connected to the internal terminal 24, and the external terminal 28 is connected to the internal terminal 25.
The internal terminals 24 and 25 and the external terminals 27 and 28 are made of a metal film in which films such as Ni and Au are laminated on a metallized layer such as W and Mo by a method such as plating.

In the vibrator 5, the fixing portions 10 c and 10 d of the base portion 10 of the resonator element 1 are fixed to the inner bottom surface 23 of the package base 21 through an adhesive 30 such as epoxy, silicone, or polyimide.
In the vibrator 5, the electrode pads 17 and 18 of the resonator element 1 are connected to the internal terminals 24 and 25 by metal wires 31 such as Au and Al.
In the vibrator 5, the concave portion of the package base 21 is covered with the lid 22 in a state where the resonator element 1 is connected to the internal terminals 24 and 25 of the package base 21, and the package base 21 and the lid 22 are seam ring and have a low melting point. The inside of the package 20 is hermetically sealed by being joined by a joining member 29 such as glass or adhesive.
Note that the inside of the package 20 is in a reduced pressure state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon.

The package may include a flat package base and a lid having a recess. The package may have a recess in both the package base and the lid.
Further, the base portion 10 of the resonator element 1 is replaced with the fixed portions 10c and 10d at one portion including a center other than the fixed portions 10c and 10d, for example, a straight line connecting the fixed portion 10c and the fixed portion 10d. It may be fixed with.
According to this, the vibration piece 1 can suppress distortion of the base 10 due to the thermal stress generated in the fixed portion by being fixed at one place.

  The vibrator 5 is driven by the resonator element 1 by a drive signal (alternating voltage) applied to the excitation units 12a and 12c via the external terminals 27 and 28, the internal terminals 24 and 25, the metal wire 31, and the electrode pads 17 and 18. The vibrating arms 11a, 11b, and 11c oscillate (resonate) in the thickness direction (the arrow direction in FIG. 5B) at a predetermined frequency (for example, about 32.768 kHz).

As described above, since the vibrator 5 of the third embodiment includes the resonator element 1, it is possible to provide a vibrator that exhibits the effects described in the first embodiment.
In addition, even when the vibrator 5 includes the vibrating piece 2 instead of the vibrating piece 1, it is possible to provide a vibrator having the same effects as described above and the effects specific to the vibrating piece 2.

(Fourth embodiment)
Next, an oscillator including the resonator element described in the first embodiment and the second embodiment will be described.
FIG. 6 is a schematic diagram illustrating a schematic configuration of the oscillator according to the fourth embodiment. 6A is a plan view seen from the lid side, and FIG. 6B is a cross-sectional view taken along the line DD in FIG. 6A. In the plan view, the lid and some components are omitted. Also, wiring in the package is omitted.
In addition, the same code | symbol is attached | subjected to the common part with the said 1st Embodiment-3rd Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from the said 1st Embodiment-3rd Embodiment. .

  As shown in FIG. 6, the oscillator 6 includes either the vibrating piece 1 described in the first embodiment or the vibrating piece 2 described in the second embodiment (here, the vibrating piece 1) and the vibrating piece 1. An IC chip 40 as a drive circuit (oscillation circuit) that drives (oscillates), and a package 20 that houses the resonator element 1 and the IC chip 40 are provided.

An internal connection terminal 23 a is provided on the inner bottom surface 23 of the package base 21.
The IC chip 40 incorporating the oscillation circuit is fixed to the inner bottom surface 23 of the package base 21 using an adhesive (not shown).
In the IC chip 40, a connection pad (not shown) is connected to the internal connection terminal 23a by a metal wire 41 such as Au or Al.

The internal connection terminal 23a is made of a metal film in which a film such as Ni or Au is laminated on a metallized layer such as W or Mo by plating or the like, and is connected to external terminals 27 and 28 of the package 20 via internal wiring (not shown). The internal terminals 24 and 25 are connected.
For connecting the connection pads of the IC chip 40 and the internal connection terminals 23a, a connection method by flip chip mounting by inverting the IC chip 40 is used in addition to a connection method by wire bonding using the metal wire 41. May be.

The oscillator 6 is connected to each of the resonator elements 1 by a drive signal applied from the IC chip 40 to the excitation units 12a and 12c via the internal connection terminals 23a, the internal terminals 24 and 25, the metal wires 31, and the electrode pads 17 and 18. The vibrating arms 11a, 11b, and 11c oscillate (resonate) at a predetermined frequency (for example, about 32.768 kHz).
The oscillator 6 outputs an oscillation signal generated along with the oscillation to the outside via the IC chip 40, the internal connection terminal 23a, the external terminals 27 and 28, and the like.

As described above, since the oscillator 6 according to the fourth embodiment includes the resonator element 1, it is possible to provide an oscillator that exhibits the effects described in the first embodiment.
In addition, even when the oscillator 6 includes the resonator element 2 in place of the resonator element 1, it is possible to provide an oscillator that exhibits the same effects as described above and effects unique to the resonator element 2.
The oscillator 6 has a module structure in which the IC chip 40 is not built in the package 20 but externally attached (for example, a structure in which the vibrator 5 and the IC chip 40 are individually mounted on one substrate). It is good.

(Fifth embodiment)
Next, a mobile phone as an electronic apparatus including the resonator element described in the first embodiment and the second embodiment will be described.
FIG. 7 is a schematic perspective view showing the mobile phone of the fifth embodiment.
A mobile phone 700 shown in FIG. 7 includes the resonator element 1 described in the first embodiment as a reference clock oscillation source and the like, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, an earpiece 703, and a mouthpiece. 704 is provided. Note that the mobile phone 700 may include the resonator element 2 instead of the resonator element 1.

  The above-mentioned vibrator element is not limited to the above mobile phone, but is an electronic book, personal computer, television, digital still camera, video camera, video recorder, navigation device, pager, electronic notebook, calculator, word processor, workstation, video phone, POS. Provided is an electronic device that can be suitably used as a reference clock oscillation source for a terminal, a device provided with a touch panel, etc., and that exhibits the effects described in the first and second embodiments in any case. it can.

(Sixth embodiment)
Next, an automobile as a moving body provided with the resonator element described in the first embodiment and the second embodiment will be described.
FIG. 8 is a schematic perspective view showing the automobile of the sixth embodiment.
In the automobile 800, the resonator element 1 described in the first embodiment is mounted on, for example, various electronically controlled devices (for example, an electronically controlled fuel injection device, an electronically controlled ABS device, an electronically controlled constant speed running). It is used as a reference clock oscillation source for devices). The automobile 800 may include the vibration piece 2 instead of the vibration piece 1.
According to this, since the automobile 800 includes the resonator element (1 or 2), the effects described in the first embodiment and the second embodiment can be achieved, and excellent performance can be exhibited.

  The above-described resonator element is not limited to the automobile 800 described above, and can be suitably used as a reference clock oscillation source for a mobile object including a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, an artificial satellite, and the like. In any case, it is possible to provide a moving body that exhibits the effects described in the first embodiment and the second embodiment.

Note that when the base and the vibrating arm are conductive (for example, when Si doped with an impurity such as B or P is used as a base material), the base and the vibrating arm are connected to the first electrode and the first electrode. Since it performs the function of the lead-out wiring, and the first electrode and the first lead-out wiring are not required, the routing of the wiring is only the second lead-out wiring, which is further simplified.
As a result, the resonator element further improves the productivity and reliability because the wiring forming process is further facilitated.

In addition, when using quartz instead of Si for the base material of the resonator element, for example, a Z-cut plate, an X-cut plate, or the like cut out from a quartz crystal or the like at a predetermined angle can be used. When a Z-cut plate is used, the etching process is easy due to the characteristics.
The base material of the resonator element 1 may be made of a material other than Si or quartz and having a Q value similar to that of Si or quartz.

Further, the number of vibrating arms of the vibrating piece is not limited to three, and may be five or n (n is an odd number of 7 or more).
Note that the thickness of the base of the resonator element may be the same as that of the vibrating arm. According to this, since the resonator element has a flat plate shape, the manufacture becomes easy.

  DESCRIPTION OF SYMBOLS 1, 2 ... Vibrating piece, 5 ... Vibrator, 6 ... Oscillator, 10 ... Base part, 10a, 10b ... Main surface, 10c, 10d ... Fixed part, 11a, 11b, 11c ... Vibrating arm, 12a, 12b, 12c ... Excitation 12a1, 12b1, 12c1 ... first electrode, 12a2, 12b2, 12c2 ... second electrode, 13 ... piezoelectric body as piezoelectric film, 14 ... insulating film, 15 ... first extraction wiring, 16 ... second extraction wiring, 17, 18 ... Electrode pads, 20 ... Package, 21 ... Package base, 22 ... Lid, 23 ... Inner bottom surface, 23a ... Internal connection terminal, 24, 25 ... Internal terminal, 26 ... Outer bottom surface, 27, 28 ... External terminal, DESCRIPTION OF SYMBOLS 29 ... Bonding member, 30 ... Adhesive agent, 31 ... Metal wire, 40 ... IC chip as an oscillation circuit, 41 ... Metal wire, 700 ... Cell-phone as an electronic device, 701 ... Liquid crystal display device, 02 ... operation button, 703 ... earpiece, 704 ... mouthpiece, 800 ... a motor vehicle as a moving body.

Claims (9)

The base,
A plurality of vibrating arms extending in parallel from the base,
The plurality of vibrating arms include a driven vibrating arm that is driven and a non-driven vibrating arm that is not driven,
A first electrode and a first lead-out wiring led out from the first electrode to the base are provided on the drive vibrating arm;
A piezoelectric film for driving the drive vibrating arm is provided above the first electrode;
A resonator element, comprising: a second electrode; and a second lead-out wiring led out from the second electrode to a base above the piezoelectric film. The resonator element according to claim 1,
A plurality of the drive vibration arms, each of the first electrodes provided in the drive vibration arms is conducted through the first lead wiring, and each of the second electrodes provided in the drive vibration arms is the A resonator element, wherein the resonator element is electrically connected via a second lead wiring. The resonator element according to claim 1,
Comprising three vibrating arms,
A vibrating piece characterized in that one at the center is the driving vibrating arm and the other two are the non-driving vibrating arms. The resonator element according to claim 2,
Comprising three vibrating arms,
1. The resonator element according to claim 1, wherein the center one is the non-drive vibration arm and the remaining two are the drive vibration arms driven in phase with each other. The base,
A plurality of vibrating arms extending in parallel from the base,
The plurality of vibrating arms include a driven vibrating arm that is driven and a non-driven vibrating arm that is not driven,
The base and the vibrating arm have conductivity,
A piezoelectric film for driving the drive vibration arm is provided on the drive vibration arm,
A vibrating piece comprising a second electrode and a second lead-out line led out from the second electrode above the piezoelectric film. A vibrating piece according to any one of claims 1 to 5,
And a package for housing the resonator element. A vibrating piece according to any one of claims 1 to 5,
An oscillator comprising: a drive circuit that drives the vibrating piece.   An electronic apparatus comprising the resonator element according to any one of claims 1 to 5.   A moving body comprising the resonator element according to any one of claims 1 to 5.

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