JP2014127647A5 - - Google Patents

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Publication number
JP2014127647A5
JP2014127647A5 JP2012284951A JP2012284951A JP2014127647A5 JP 2014127647 A5 JP2014127647 A5 JP 2014127647A5 JP 2012284951 A JP2012284951 A JP 2012284951A JP 2012284951 A JP2012284951 A JP 2012284951A JP 2014127647 A5 JP2014127647 A5 JP 2014127647A5
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JP
Japan
Prior art keywords
heat
contact
power conversion
portion provided
electrical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2012284951A
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Japanese (ja)
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JP5773976B2 (en
JP2014127647A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012284951A priority Critical patent/JP5773976B2/en
Priority claimed from JP2012284951A external-priority patent/JP5773976B2/en
Priority to CN201320638948.0U priority patent/CN203554260U/en
Publication of JP2014127647A publication Critical patent/JP2014127647A/en
Publication of JP2014127647A5 publication Critical patent/JP2014127647A5/ja
Application granted granted Critical
Publication of JP5773976B2 publication Critical patent/JP5773976B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (6)

電子プリント基板上に実装された一または複数の半導体デバイスが電気品箱に収納された電力変換装置であって、
前記半導体デバイスに接して設けられた受熱部、該受熱部に接して設けられた伝熱部、及び該伝熱部に接して設けられた放熱部を備えるヒートパイプを備え、
前記放熱部の放熱面は、電気品箱の外郭に沿って配され、
前記放熱部は前記受熱部よりも高い位置に配され、
前記ヒートパイプ中の冷媒は、重力と温度勾配によって自発的に循環する構造であることを特徴とする電力変換装置。 A power conversion device in which one or more semiconductor devices mounted on an electronic printed circuit board are housed in an electrical component box,
A heat pipe provided with a heat receiving portion provided in contact with the semiconductor device, a heat transfer portion provided in contact with the heat receiving portion, and a heat radiating portion provided in contact with the heat transfer portion;
The heat dissipating surface of the heat dissipating part is disposed along the outline of the electrical component box,
The heat dissipating part is arranged at a position higher than the heat receiving part,
The refrigerant in the heat pipe has a structure that circulates spontaneously by gravity and a temperature gradient. 電子プリント基板上に実装された一または複数の半導体デバイスが屈曲した形の電気品箱に収納された電力変換装置であって、
前記半導体デバイスに接して設けられた受熱部、該受熱部に接して設けられた屈曲型の伝熱部、及び該伝熱部に接して設けられた放熱部を備えるヒートパイプを備え、
前記放熱部の放熱面は、電気品箱の外郭の前記受熱部とは異なる方向の面に沿って配され、
前記放熱部は前記受熱部よりも高い位置に配され、
前記ヒートパイプ中の冷媒は、重力と温度勾配によって自発的に循環する構造であることを特徴とする電力変換装置。 A power conversion apparatus in which one or more semiconductor devices mounted on an electronic printed circuit board are housed in a bent electrical component box,
A heat pipe provided with a heat receiving portion provided in contact with the semiconductor device, a bent heat transfer portion provided in contact with the heat receiving portion, and a heat radiating portion provided in contact with the heat transfer portion;
The heat radiating surface of the heat radiating portion is arranged along a surface in a direction different from the heat receiving portion of the outer shell of the electrical component box,
The heat dissipating part is arranged at a position higher than the heat receiving part,
The refrigerant in the heat pipe has a structure that circulates spontaneously by gravity and a temperature gradient. 前記半導体デバイス及び前記電子プリント基板が、
絶縁性及び難燃性の樹脂により形成される外装材で覆われていることを特徴とする請求項１または請求項２に記載の電力変換装置。 The semiconductor device and the electronic printed circuit board are
The power converter according to claim 1 or 2, wherein the power converter is covered with an exterior material formed of an insulating and flame-retardant resin. 前記半導体デバイスを構成する半導体素子が、ワイドギャップ半導体であることを特徴とする請求項１から請求項３のいずれか一項に記載の電力変換装置。 The semiconductor elements constituting the semiconductor device, power conversion device according to any one of claims 1 to 3, characterized in that the wide gap semiconductor. 前記放熱部の放熱面が、凹凸加工されていない平坦な構造であることを特徴とする請求項１から請求項４のいずれか一項に記載の電力変換装置。 5. The power conversion device according to claim 1, wherein a heat dissipation surface of the heat dissipation portion has a flat structure that is not subjected to uneven processing. 請求項１から請求項５のいずれか一項に記載の電力変換装置を内部に含み、
前記放熱部がユニットの外郭に沿って配されていることを特徴とする冷蔵庫。 A power conversion device as claimed in any one of claims 5 comprises therein,
The refrigerator, wherein the heat dissipating part is arranged along an outer shell of the unit.
JP2012284951A 2012-12-27 2012-12-27 refrigerator Expired - Fee Related JP5773976B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012284951A JP5773976B2 (en) 2012-12-27 2012-12-27 refrigerator
CN201320638948.0U CN203554260U (en) 2012-12-27 2013-10-16 An electric power conversion device and a refrigerator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012284951A JP5773976B2 (en) 2012-12-27 2012-12-27 refrigerator

Publications (3)

Publication Number Publication Date
JP2014127647A JP2014127647A (en) 2014-07-07
JP2014127647A5 true JP2014127647A5 (en) 2014-08-14
JP5773976B2 JP5773976B2 (en) 2015-09-02

Family

ID=50472321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012284951A Expired - Fee Related JP5773976B2 (en) 2012-12-27 2012-12-27 refrigerator

Country Status (2)

Country Link
JP (1) JP5773976B2 (en)
CN (1) CN203554260U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104729182B (en) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 Semiconductor freezer

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211293A (en) * 1985-07-09 1987-01-20 株式会社日立製作所 Sealing of electronic circuit board
JPH0560455A (en) * 1991-08-29 1993-03-09 Toshiba Corp Refrigerator
JPH0579779A (en) * 1991-09-19 1993-03-30 Furukawa Electric Co Ltd:The Heat pipe type cooler
JP3504052B2 (en) * 1996-02-14 2004-03-08 株式会社日立製作所 Power converter for electric vehicles
JPH1079460A (en) * 1996-09-05 1998-03-24 Toshiba Transport Eng Kk Semiconductor control apparatus for vehicles
JPH11330758A (en) * 1998-05-13 1999-11-30 Fujikura Ltd Cooling device for card for outside installation communication equipment
JP2000234767A (en) * 1999-02-10 2000-08-29 Mitsubishi Electric Corp Cooling device and cooling device of air-conditioner
JP3704250B2 (en) * 1999-04-05 2005-10-12 三菱電機株式会社 refrigerator
JP2001289549A (en) * 2000-04-05 2001-10-19 Hitachi Ltd Refrigerator control device
JP2009024921A (en) * 2007-07-19 2009-02-05 Hitachi Appliances Inc Refrigerator
JP2009111310A (en) * 2007-11-01 2009-05-21 Fanuc Ltd Heat radiation structure of electronic device
JP5523454B2 (en) * 2009-06-08 2014-06-18 パナソニック株式会社 Manufacturing method of electronic component mounting structure
JP2011258761A (en) * 2010-06-09 2011-12-22 Mitsubishi Electric Corp Heat radiating structure of electronic apparatus and on-vehicle electronic apparatus
JP2012221969A (en) * 2011-04-04 2012-11-12 Panasonic Corp Electronic circuit device for compressor

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