JP2014127532A5 - - Google Patents

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Publication number
JP2014127532A5
JP2014127532A5 JP2012281837A JP2012281837A JP2014127532A5 JP 2014127532 A5 JP2014127532 A5 JP 2014127532A5 JP 2012281837 A JP2012281837 A JP 2012281837A JP 2012281837 A JP2012281837 A JP 2012281837A JP 2014127532 A5 JP2014127532 A5 JP 2014127532A5
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JP
Japan
Prior art keywords
vibration
substrate
processing apparatus
stage
substrate processing
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JP2012281837A
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English (en)
Japanese (ja)
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JP6160077B2 (ja
JP2014127532A (ja
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Priority to JP2012281837A priority Critical patent/JP6160077B2/ja
Priority claimed from JP2012281837A external-priority patent/JP6160077B2/ja
Publication of JP2014127532A publication Critical patent/JP2014127532A/ja
Publication of JP2014127532A5 publication Critical patent/JP2014127532A5/ja
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Publication of JP6160077B2 publication Critical patent/JP6160077B2/ja
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JP2012281837A 2012-12-25 2012-12-25 基板処理装置 Active JP6160077B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012281837A JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012281837A JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

Publications (3)

Publication Number Publication Date
JP2014127532A JP2014127532A (ja) 2014-07-07
JP2014127532A5 true JP2014127532A5 (https=) 2016-02-04
JP6160077B2 JP6160077B2 (ja) 2017-07-12

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ID=51406817

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JP2012281837A Active JP6160077B2 (ja) 2012-12-25 2012-12-25 基板処理装置

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JP (1) JP6160077B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134423B (zh) * 2016-02-29 2020-11-20 上海微电子装备（集团）股份有限公司 倒装芯片键合装置及其键合方法
JP7019975B2 (ja) * 2017-06-21 2022-02-16 株式会社ニコン 位置合わせ方法、位置合わせ装置およびプログラム
CN116913855B (zh) 2023-09-08 2023-12-19 广州市艾佛光通科技有限公司 一种芯片键合装置及其固定组件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040057817A1 (en) * 2002-09-24 2004-03-25 Hazelton Andrew J. Switchable damping mechanism for use in a stage apparatus
JP2009231671A (ja) * 2008-03-25 2009-10-08 Nikon Corp アラインメント装置
JP5540605B2 (ja) * 2009-08-28 2014-07-02 株式会社ニコン 位置合わせ装置および基板貼り合わせ装置
JP5845618B2 (ja) * 2011-04-27 2016-01-20 株式会社ニコン 基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板

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