JP2014124920A5

JP2014124920A5 -

Info

Publication number: JP2014124920A5
Application number: JP2012285437A
Authority: JP
Filing date: 2012-12-27
Publication date: 2016-02-18
Anticipated expiration: 2032-12-27

Description

上記目的を達成するために本発明は、基体と、該基体に配置されインクを加熱するために発熱する複数の発熱抵抗体と、前記複数の発熱抵抗体を覆い、通電可能な保護層と、を備えたインクジェットヘッド用基板において、前記保護層は、前記複数の発熱抵抗体をそれぞれ覆う個別部分と、複数の前記個別部分が共通して接続される共有部分と、前記複数の個別部分と前記共有部分とをそれぞれヒューズ素子を介して接続する接続部分と、を備え、前記ヒューズ素子の厚さは前記個別部分の厚さより薄いことを特徴とする。 In order to achieve the above object, the present invention comprises a substrate, a plurality of heating resistors that are arranged on the substrate and generate heat to heat ink, a protective layer that covers the plurality of heating resistors and can be energized, In the inkjet head substrate, the protective layer includes individual portions that respectively cover the plurality of heating resistors, a shared portion to which the plurality of individual portions are connected in common, the plurality of individual portions, and the And connecting portions for connecting the shared portions via the fuse elements, respectively, wherein the thickness of the fuse elements is smaller than the thickness of the individual portions.

Claims

In an inkjet head substrate comprising: a base; a plurality of heating resistors disposed on the base that generate heat to heat ink; and a protective layer that covers the plurality of heating resistors and is energized.
The protective layer includes an individual part covering each of the plurality of heating resistors, a shared part to which the plurality of individual parts are connected in common, and the plurality of individual parts and the shared part via a fuse element, respectively. An ink jet head substrate, wherein the fuse element is thinner than the individual portion.

2. The inkjet head substrate according to claim 1, wherein the individual portion has a thickness of 200 to 500 nm, and the fuse element has a thickness of 10 to 100 nm.

The inkjet head substrate according to claim 1, wherein the protective layer is formed of a single layer.

2. The protective layer is formed of a plurality of layers, the individual portion is formed of the plurality of layers, and the fuse element is formed of one of the plurality of layers. Or the board | substrate for inkjet heads of Claim 2.

The thickness of the one layer forming the fuse element among the plurality of layers is smaller than the thickness of the layer not forming the fuse element among the plurality of layers. 4. A substrate for an inkjet head according to 4.

Of the plurality of layers, the layer on the heating resistor side is a layer made of Ta, and the layer provided so as to cover the layer on the heating resistor side is a layer made of Ir. An ink jet head substrate according to claim 4 or 5.

The inkjet head substrate according to any one of claims 1 to 5, wherein the protective layer includes a layer made of Ta.

8. The ink jet head substrate according to claim 1, wherein the fuse element is formed of a layer made of Ta.

The inkjet head substrate according to claim 1, further comprising an insulating layer between the heating resistor and the protective layer.

10. The inkjet head substrate according to claim 1, wherein the protective layer is connected to an external electrode through the shared portion. 11.

11. A flow path formed by attaching the inkjet head substrate according to claim 1 and a side of the inkjet head substrate on which the protective layer is disposed to form a plurality of discharge ports. And an ink jet head.

An inkjet recording apparatus that performs recording on a recording medium using the inkjet head according to claim 11, wherein an external electrode is grounded through the inkjet recording apparatus.