JP2014124923A5

JP2014124923A5 -

Info

Publication number: JP2014124923A5
Application number: JP2012285449A
Authority: JP
Filing date: 2012-12-27
Publication date: 2016-02-12
Anticipated expiration: 2032-12-27

Description

本発明は、基体と、前記基体に配置され、通電されることによりインクを加熱するために発熱する複数の発熱抵抗体と、前記発熱抵抗体を覆い、電気を通すことが可能な保護層と、を備えたインクジェットヘッド用基板において、前記保護層は、前記複数の発熱抵抗体をそれぞれ覆う個別部と、複数の前記個別部が共通して接続される共通部と、を備え、前記保護層を形成する材料よりも融点の低い材料からなるヒューズ部形成層で形成されたヒューズ部を介して前記複数の個別部と前記共通部とが接続されていることを特徴とする。 The present invention includes a substrate, a plurality of heating resistors that are disposed on the substrate and generate heat to heat ink when energized, and a protective layer that covers the heating resistor and allows electricity to flow. In the inkjet head substrate, the protective layer includes an individual portion that covers each of the plurality of heating resistors, and a common portion to which the plurality of individual portions are connected in common, and the protective layer The plurality of individual portions and the common portion are connected through a fuse portion formed of a fuse portion forming layer made of a material having a melting point lower than that of the material forming the.

Claims

A substrate;
A plurality of heating resistors disposed on the substrate and generating heat to heat the ink when energized;
A protective layer covering the heating resistor and capable of conducting electricity;
In an inkjet head substrate comprising:
The protective layer includes individual parts that respectively cover the plurality of heating resistors, and a common part to which the plurality of individual parts are connected in common,
An ink jet head characterized in that the plurality of individual parts and the common part are connected via a fuse part formed of a fuse part forming layer made of a material having a lower melting point than the material forming the protective layer. Substrate.

The inkjet head substrate according to claim 1, wherein the melting point of the fuse portion forming layer is 1000 ° C. or more and 2000 ° C. or less.

The inkjet head substrate according to claim 2, wherein the fuse portion forming layer is formed to include at least one of Ni and Cr.

4. The inkjet head substrate according to claim 1, wherein the protective layer includes at least one of Ir, Ru, and Ta. 5.

5. The inkjet head substrate according to claim 1, wherein the fuse portion forming layer is in contact with a surface of the protective layer on a side of the heating resistor. 6.

5. The ink jet head substrate according to claim 1, wherein the fuse portion forming layer is in contact with a back surface of a surface of the protective layer on the heat generating resistor side. 6.

The inkjet head substrate according to claim 1, wherein the fuse portion forming layer is not formed on a surface side of the heating resistor.

8. The inkjet head substrate according to claim 1, wherein the individual portion and the common portion of the protective layer have the same thickness.

The inkjet head substrate according to claim 1, wherein the common portion is connected to a grounded electrode.

The inkjet head substrate according to any one of claims 1 to 9, wherein the protective layer is interrupted between the plurality of individual portions and the common portion.

11. The fuse part according to claim 1, wherein the fuse part has a fusing part with a narrow width, and no other layer is provided on a surface side of the fusing part. Substrate for inkjet head.

12. The protective layer and the fuse portion forming layer overlap each other at a connection portion of the fuse portion with the individual portion and a connection portion with the common portion. The board | substrate for inkjet heads of description.

The inkjet head substrate according to claim 1, further comprising an insulating layer between the heating resistor and the protective layer.

A substrate, a plurality of heating resistors that are disposed on the substrate and generate heat to heat ink when energized, and a protective layer that covers the heating resistor and allows electricity to pass therethrough. An inkjet head substrate;
A flow path forming member attached to the surface of the inkjet head substrate on which the protective layer is provided and having a discharge port;
A plurality of liquid chambers defined by the flow path forming member and the inkjet head substrate and capable of storing ink therein, wherein the plurality of heating resistors are arranged for each liquid chamber. And a liquid chamber of
An ink jet head that heats ink stored in the liquid chamber by the heating resistor and discharges ink droplets from the discharge port,
The protective layer includes a plurality of individual portions that respectively cover the plurality of heating resistors and are exposed in the liquid chamber, and a common portion to which the plurality of individual portions are connected in common.
An ink jet head characterized in that the plurality of individual parts and the common part are connected via a fuse part formed of a fuse part forming layer made of a material having a lower melting point than the material forming the protective layer. .

The inkjet head according to claim 14, wherein the protective layer is interrupted between the plurality of individual portions and the common portion.

16. The ink jet head according to claim 14, wherein the fuse part has a fusing part with a narrow width, and no other layer is provided on the surface side of the fusing part.

17. The protective layer and the fuse portion forming layer overlap each other at a connection portion of the fuse portion with the individual portion and a connection portion with the common portion. The inkjet head described in 1.

The inkjet head according to claim 14, further comprising an insulating layer between the heating resistor and the protective layer.

An inkjet recording apparatus that performs recording on a recording medium using the inkjet head according to any one of claims 14 to 18,
The inkjet recording apparatus, wherein the common unit is grounded through the inkjet recording apparatus.