JP2014124311A - Game machine and board unit used for the same, and method of producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a game machine which can reliably prevent illegal access to an electronic component that controls game content.SOLUTION: A game machine includes a board 41 having a circuit pattern region on which a plurality of electronic components 44, 46 are mounted, and substantially all of the circuit pattern region of the board 41 and all of the plurality of electronic components 44, 46 are molded with transparent or translucent synthetic resin. The board 41 of the game machine is a main control board or a put-out control board.

Description

  The present invention relates to a gaming machine such as a pachinko gaming machine, a board unit used therefor, and a method for manufacturing the same.

  Conventionally, a board unit including a main control board for controlling game contents is disposed on the back side of a gaming machine such as a pachinko gaming machine or a revolving type gaming machine. A game control MPU (so-called CPU with built-in ROM) is mounted on the main control board, and the game control MPU controls the probability and conditions for generating a special game state (big hit), the number of consecutive occurrences, etc. Has been written. When the game control MPU is illegally exchanged, the probability of generating a special game state is greatly changed, and there is a problem that game balls are illegally paid out.

  For this reason, this board unit is devised in various ways to prevent legitimate electronic components (such as a game control MPU) mounted on the main control board from being illegally replaced with illegal ones. As a typical example, one using a lock mechanism is known (see, for example, Patent Document 1).

  The board unit of this known gaming machine includes a first case that covers the front surface (the electronic component mounting side) of the main control board and a second case that covers the back surface of the main control board, and the first and second cases are locked. The main control board is fixed to the first case by a fixing screw while being fixed by a lock mechanism including a pin and a caulking cap. In this board unit, in order to access an electronic component (such as an MPU for game control) mounted on the main control board, the lock mechanism is broken to separate the first case and the second case, and then the fixing screw is used. It is necessary to separate the first case from the main control board, and it takes time and labor to remove these series of operations, and the electronic parts (such as MPU for game control) cannot be easily accessed. ing.

JP 2010-110474 A

  In the conventional gaming machine described above, it takes a great deal of time and time to access the electronic components (game control MPU, etc.) mounted on the main control board, so that the deterrent against unauthorized access to the electronic components is increased. However, unauthorized access to electronic components could not be completely prevented.

  An object of the present invention is to provide a gaming machine that can reliably prevent unauthorized access to an electronic component that controls game content.

  Another object of the present invention is to provide a board unit that can reliably prevent unauthorized access to electronic components mounted on the board, and a method for manufacturing the board unit.

The board unit according to claim 1 of the present invention is a board unit used in a gaming machine,
A circuit board having a circuit pattern region on which a plurality of electronic components are mounted; and substantially all of the circuit pattern region of the substrate and all of the plurality of electronic components are molded with a transparent or translucent synthetic resin. It is characterized by.

  In the substrate unit according to claim 2 of the present invention, the substrate includes a substrate body on which the plurality of electronic components are mounted, a surface circuit pattern region provided on a surface of the substrate body, and the substrate. A back circuit pattern region provided on the back surface of the main body, a part of the front circuit pattern region and a part of the back circuit pattern region are electrically connected through the substrate body, A substantially entire region of the front circuit pattern region and the back circuit pattern region of the substrate and all of the plurality of electronic components are molded with a synthetic resin.

  In the substrate unit according to claim 3 of the present invention, a mechanical component is further mounted on the substrate, and the mechanical component is disposed on the surface side of the substrate main body. It penetrates and is electrically connected to the back circuit pattern area, and the entire surface circuit pattern area and the back circuit pattern area of the substrate and all of the plurality of electronic components are molded with a synthetic resin. It is characterized by.

  Further, in the board unit according to claim 4 of the present invention, the board body, the entire area of the front circuit pattern area and the back circuit pattern area, all of the plurality of electronic parts and the lower part of the mechanism parts are made of synthetic resin. It is molded by.

  In the substrate unit according to claim 5 of the present invention, lead wires are electrically connected to the front circuit pattern region of the substrate, and the front circuit pattern region and the back circuit pattern region of the substrate. , All of the plurality of electronic components, and the base of the lead wire are molded with a synthetic resin.

  In the board unit according to claim 6 of the present invention, the plurality of electronic components include a specific electronic component with an identification display, and the identification display is enlarged in relation to the specific electronic component. A magnifying lens part is provided for visual recognition, and the magnifying lens part is formed simultaneously when molding the plurality of electronic components.

  In the board unit according to claim 7 of the present invention, the board is a main control board for controlling game contents or a payout control board for controlling payout of game balls. .

The board unit manufacturing method according to claim 8 of the present invention is a board unit manufacturing method used in a gaming machine,
A substrate manufacturing process for manufacturing a substrate having a circuit pattern region on which a plurality of electronic components are mounted, a substrate setting process for setting the substrate manufactured on one of a pair of mold dies, and the pair of mold dies Resin mold that molds all of the plurality of electronic components and substantially all of the circuit pattern region of the substrate by allowing a transparent or translucent synthetic resin to flow into the front surface side and back surface side of the substrate And a process.

  In the substrate unit manufacturing method according to claim 9 of the present invention, a plurality of lead wires are electrically connected to the circuit pattern in the circuit pattern region of the substrate, and the pair of molds is used. A lead wire accommodating space is defined in one of the molds, and a cover member having an insertion hole for inserting the plurality of lead wires into the lead wire accommodating space is formed in the opening of the lead wire accommodating space. In the substrate setting step, the substrate is set on one side of the pair of mold dies, and the plurality of lead wires pass through the insertion holes of the cover member and the lead wire accommodating space. It is characterized by being accommodated in.

  In the method for manufacturing a substrate unit according to claim 10 of the present invention, the plurality of lead wires include a specific lead wire with a specific indication and a normal lead wire different from the specific lead wire. Further, the insertion hole of the cover member includes a specific insertion hole corresponding to the specific lead wire and a normal insertion hole corresponding to the normal lead wire. In the substrate setting step, the specific lead wire is The cover member is accommodated in the lead wire accommodating space through the specific insertion hole, and the normal lead wire is accommodated in the lead wire accommodating space through the normal insertion hole of the cover member.

  Moreover, in the manufacturing method of the substrate unit according to claim 11 of the present invention, the plurality of electronic components include a specific electronic component having an identification display, and the pair of electronic components is related to the specific electronic component. A concave portion for a lens portion is provided at a predetermined portion of the mold for molding. When the pair of mold dies are clamped and a transparent or translucent synthetic resin flows in the resin molding step, the lens is A magnifying lens part for enlarging and visually recognizing the identification display is formed by the synthetic resin that has flowed into the concave part for part.

  Moreover, in the gaming machine according to claim 12 of the present invention, a gaming machine frame, a gaming board attached to the gaming machine frame, a display device attached to the gaming board, and claims 1 to And a board unit according to any one of claims 7 to 9.

Furthermore, in the gaming machine according to claim 13 of the present invention, a payout control board mounting area is provided at a predetermined portion on the back surface of the gaming machine frame, and a lower end area or an upper end area of the payout control board mounting area. A positioning contact member is provided, and a first connection connector is disposed at an upper end portion or a lower end portion of the payout control board mounting region, and the board unit includes a payout control board unit. A second connection connector is provided at the lower end or the upper end of the back surface of the control board unit,
When the upper end or the lower end of the payout control board unit is pressed toward the payout control board mounting area while the lower end or the upper end of the payout control board unit is in contact with the positioning contact member, the payout The second connection connector of the control board unit is electrically connected to the first connection connector on the payout control board attachment region side.

  According to the substrate unit of the first aspect of the present invention, substantially all of the circuit pattern region of the substrate and all of the plurality of electronic components are molded with the synthetic resin, so that the electronic component itself due to vibration during transportation or the like Damage to the electrical connection portion and the like are extremely small, and even if an electronic component is to be replaced, it cannot be replaced, and unauthorized access to the substrate can be reliably prevented. Further, if an attempt is made to exchange illegally, there is a very high possibility of damaging electronic components, circuit patterns, etc., and as a result, damage due to unauthorized access can be reliably prevented. In addition, since the resin to be molded is transparent or translucent, electronic components and the like can be easily confirmed from the outside.

  According to the substrate unit of claim 2 of the present invention, the substrate is provided on the substrate body on which a plurality of electronic components are mounted, the surface circuit pattern region provided on the surface of the substrate body, and the back surface thereof. The circuit pattern area of the printed circuit board, and substantially all of the front circuit pattern area and the back circuit pattern area of the substrate and all of the plurality of electronic components are molded with synthetic resin. Cannot be exchanged, and even if another electronic component is added to the front circuit pattern area and / or the back circuit pattern area, it cannot be added, and unauthorized access to the board can be prevented more reliably. it can.

  According to the board unit of the present invention, the mechanical parts (for example, the connection connector and the switch means) are arranged on the surface side of the board body, and the back circuit pattern region penetrates the board body. The connection connector and the switch means are exposed on the front side of the board because of being electrically connected to the board, but the entire area of the front circuit pattern area and the back circuit pattern area of the board and all of the plurality of electronic components are made of synthetic resin. Thus, unauthorized access to the substrate can be prevented more reliably.

  According to the substrate unit of claim 4 of the present invention, the substrate body, the entire area of the front circuit pattern area and the back circuit pattern area, all of the plurality of electronic components, and the lower part of the mechanical component are molded with synthetic resin. Therefore, it is very difficult to exchange electronic components or add other electronic components, and it is possible to prevent unauthorized access to the substrate more reliably.

  According to the substrate unit of claim 5 of the present invention, the lead wire is electrically connected to the front circuit pattern region of the substrate, the entire surface circuit pattern region and back circuit pattern region of the substrate, a plurality of electrons Since all of the components and the base of the lead wire are molded with synthetic resin, unauthorized access to the substrate including the lead wire can be prevented more reliably.

  According to the substrate unit of the sixth aspect of the present invention, since the magnifying lens portion for enlarging and visually identifying the identification display is provided in association with the specific electronic component, the specific electronic component is identified. The display (for example, model number, model code, etc.) can be easily recognized. In addition, since the magnifying lens portion is formed simultaneously when molding a plurality of electronic components, the resin mold can be provided with a function of enlarging the identification display without increasing the number of work steps.

  According to the board unit of the present invention, since the board is the main control board or the payout control board, the main control board (control of the big hit lottery probability, etc.) for performing important control of the gaming machine or Unauthorized modifications such as modification of the payout control board (game ball payout control) can be prevented to prevent damage in the pachinko hall.

  According to the method for manufacturing a substrate unit according to claim 8 of the present invention, the substrate is set on one side of the pair of mold dies, and then the pair of mold dies are clamped and the surface side of the substrate is placed. In addition, since a transparent or semi-transparent synthetic resin is allowed to flow into the back surface and substantially all of the circuit pattern area of the board and all of the plurality of electronic components are resin-molded, unauthorized access to the board is reliably prevented as described above. can do.

  According to the substrate unit manufacturing method of the ninth aspect of the present invention, the lead wire accommodating space is defined in one of the pair of mold dies, and the opening of the lead wire accommodating space is covered. Since the members are detachably provided and a plurality of lead wires are accommodated in the lead wire accommodating space through the insertion holes of the cover member in the substrate setting step, the leads connected to the circuit pattern of the substrate in the subsequent resin molding step It can protect from the resin flowing through the wire.

  Further, according to the method for manufacturing a substrate unit according to claim 10 of the present invention, the plurality of lead wires are constituted by specific lead wires and normal lead wires, and the insertion holes of the cover member are specified insertion holes and Including the normal insertion hole, the specific lead wire is accommodated in the lead wire accommodating space through the specific insertion hole of the cover member, and the normal lead wire is accommodated in the lead wire accommodating space through the normal insertion hole of the cover member. The wire and the normal lead wire can be easily identified, and erroneous connection in electrical connection after resin molding can be prevented. Further, since it is easy to identify a specific lead wire, it is easy to find unauthorized access.

  In the substrate unit manufacturing method according to claim 11 of the present invention, since the concave portion for the lens portion is provided at a predetermined portion of the pair of molds in relation to the specific electronic component, When the mold mold is clamped and transparent or semi-transparent synthetic resin is allowed to flow, a magnifying lens portion is formed by the synthetic resin that has flowed into the concave portion for the lens portion, and it can be specified without adding a special work process. A magnifying lens portion for visually recognizing the identification display of the electronic component can be formed.

  Moreover, according to the gaming machine according to claim 12 of the present invention, since the board unit according to any one of claims 1 to 7 is provided, unauthorized access to the board can be reliably prevented.

  Furthermore, according to the gaming machine of the thirteenth aspect of the present invention, the payout control board mounting area is provided at a predetermined portion on the back surface of the gaming machine frame, and the lower end (or the upper end) of the payout control board mounting area is provided. A positioning contact member is provided, and a first connection connector is disposed at the upper end (or lower end) of the payout control board mounting region, and the upper end (or lower end) of the rear surface of the payout control board unit. Since the second connection connector is provided, the dispensing control board unit is moved downward (or upward) so that its lower end (or upper end) is brought into contact with the positioning contact member. By pressing the upper end (or lower end) of the payout control board unit toward the payout control board attachment area, the second connection connector of the payout control board unit is electrically connected to the first connection connector on the payout control board attachment area. Connection Rukoto can, first and second connector with a simple mounting operation may be electrically connected to.

BRIEF DESCRIPTION OF THE DRAWINGS The front view which shows 1st Embodiment of the game machine according to this invention simply. The rear view which shows the game machine of FIG. 1 simply. The perspective view which shows simply the main control board unit with which the gaming machine of FIG. 1 was equipped. FIG. 4 is a cross-sectional view of the vicinity of the center showing a state where an electronic component or the like of the main control board unit of FIG. 3 is resin-molded. FIG. 4 is a cross-sectional view of the vicinity of a side portion showing a state where an electronic component or the like of the main control board unit of FIG. 3 is resin-molded. FIG. 4 is a cross-sectional view of the vicinity of the other side surface showing a state in which an electronic component or the like of the main control board unit of FIG. 3 is resin-molded. Sectional drawing by the VII-VII line in FIG. The perspective view which shows the lens member applied to the main control board unit of FIG. The perspective view which shows simply the payout control board unit with which the gaming machine of FIG. 1 was equipped. Sectional drawing of the side part vicinity which shows the state which carries out the resin molding of the electronic components of the payout control board unit of FIG. Sectional drawing of the other side part vicinity which shows the state which carries out the resin molding of the electronic components of the payout control board unit of FIG. The rear view which shows 2nd Embodiment of the game machine according to this invention simply. The perspective view which shows simply the payout control board unit of the gaming machine of FIG. The perspective view which shows the back side of the payout control board unit of FIG. The perspective view which shows the payout control board attachment area | region of the gaming machine of FIG. 12, and its vicinity. The perspective view which shows the other form of the main control board unit.

  Hereinafter, various embodiments of a gaming machine according to the present invention, a board unit used therefor, and a manufacturing method thereof will be described with reference to the accompanying drawings.

[Configuration of the entire gaming machine of the first embodiment]
With reference to FIG.1 and FIG.2, 1st Embodiment of a gaming machine is described. The illustrated gaming machine 2 includes a gaming machine frame 4 and a gaming board 6. In this embodiment, the gaming machine frame 4 includes an outer frame 8, an inner frame 10, and a front frame 12. The outer frame 8 is a frame body that is an outer portion of the gaming machine 2 and is configured by combining wooden frame materials arranged vertically and horizontally in a rectangular shape. The inner frame 10 is attached to the outer frame 8 so as to be openable and closable, and the game board 6 is attached to the inner frame 10 from the front side. The front frame 12 is for protecting the front surface (game board surface) of the game board 6, and is attached to the front side of the inner frame 10 so as to be opened and closed. A circular opening window 14 is formed in a substantially central portion of the front frame 12, and a glass plate is fitted on the back surface of the opening window 14, so that a game area 16 formed on the game board surface of the game board 6. Can be viewed from the front through the opening window 14 and the glass plate.

  A pair of left and right speakers 18 are provided at the upper end of the front frame 12 (specifically, above the opening window 14). In addition, at the lower part of the front frame 12 (specifically, below the opening window 14), an upper plate 20 for storing game balls, an effect button 22 for switching effects, and the remaining remaining game balls A digital display 24 for displaying the number, a card insertion slot 26 for inserting a membership card, a launching handle 28 for launching a game ball, and the like are provided. An opening 30 is formed in the approximate center of the game board 6, and a display device 32 is inserted and disposed in the opening 30. A first electrical decoration unit 31 is mounted from the bottom to the bottom of the display device 32, and a second electrical decoration unit 33 is mounted around the game board 6.

  Further, a main control board unit 34, a display control board unit 36, a payout control board unit 38, and a power supply board unit 40 are disposed on the back surface of the gaming machine 2. The main control board unit 34 is for controlling game contents, the display control board unit 36 is for controlling display contents on the display device 32, and the payout control board unit 38 is a game ball. This is for controlling the payout. The power supply board unit 40 is for supplying power to each part of the gaming machine 2 (for example, the main control board unit 34, the display control board unit 36, the payout control board unit 40, the display device 32, etc.). Various control board units 34, 36, and 38 are electrically connected to electrical / electronic components of each part of the gaming machine 2.

[Main control board unit]
Next, the illustrated main control board unit 34 will be described with reference to FIGS. 3 to 8 together with FIG. 2 and 3, the illustrated main control board unit 34 includes a main control board 41 (which constitutes a board) constituted by, for example, a printed wiring board. The main control board 41 includes a main board main body 42 (which constitutes the board main body) formed of, for example, glass epoxy, and a surface circuit pattern region (not shown) is provided on the surface side of the main board main body 42. A front circuit pattern (not shown) is formed in the front circuit pattern area, and a back circuit pattern area (not shown) is provided on the back side thereof, and a back circuit pattern (not shown) is provided in the back circuit pattern area. And a part of the front circuit pattern and a part of the back circuit pattern penetrate through the main board main body 42 and are electrically connected. The front circuit pattern area and the back circuit pattern area constitute a circuit pattern area of the main control board 41, and the front circuit pattern in the front circuit pattern area and the back circuit pattern in the back circuit pattern area constitute a circuit pattern in the circuit pattern area. .

  The main control board unit 34 mainly performs control related to game progress and game ball payout, such as jackpot lottery and game state transition, and includes an MPU 44, an IC 46, a capacitor 47, and a resistor (not shown). And a reset switch 48 as a mechanical component. All of the electronic components such as the MPU 44 are disposed in the surface circuit pattern area on the front side of the main control board 41 (front side with respect to the paper surface in FIG. 3), and a part of the surface circuit pattern in this table circuit pattern area is The main board main body 42 is penetrated and electrically connected to the back circuit pattern in the back circuit pattern region. The reset switch 48 is disposed in the non-circuit pattern area S1 outside the front circuit pattern area on the front surface side of the main control board 41, and passes through the main board main body 42 and is electrically connected to the back circuit pattern in the back circuit pattern area. It is connected to the.

  In this embodiment, the main control board 41 includes a plurality of lead wires 50 (50a to 50e) (so-called harness), and one end portion of these lead wires 50 is a surface circuit in a surface circuit pattern region of the main control board 41. It is electrically connected to a connection terminal portion (not shown) of the pattern. The main control board 41 is electrically connected to the display control board unit 36 and the payout control board unit 38 through these lead wires 50.

  In addition, a hologram sheet 52 is attached to one corner of the main control board 41 to prove that it is a genuine product. The hologram sheet 52 is provided in a non-circuit pattern region (that is, a region where a surface circuit pattern is not formed) on the surface of the main substrate body 42. An IC tag or the like may be attached instead of the hologram sheet 52.

  In the main control board unit 34, substantially the entire circuit pattern area (that is, the front circuit pattern area and the back circuit pattern area) of the main control board 41 and a plurality of electronic components (MPU 44, IC 46, capacitor 47, resistor, etc.) are provided. Molded and covered with a transparent or translucent synthetic resin. In this embodiment, as shown in FIG. 3, on the surface side of the main substrate main body 42, the entire surface circuit pattern region (that is, the entire surface circuit pattern) and all of the plurality of electronic components are integrated with synthetic resin. It is molded so that In addition, the entire hologram sheet 52 and all the bases (portions connected to the surface circuit pattern) of the plurality of lead wires 50 (50a to 50e) are molded so as to be integrated with a synthetic resin. Further, on the back surface side of the main board main body 42, the entire back circuit pattern region (that is, the entire back circuit pattern) is molded with synthetic resin, and the resin-molded mold layer is indicated by the symbol M. . By resin molding in this way, even if an electronic component is to be replaced, it becomes very difficult to replace it, and unauthorized access to the electronic component can be prevented. Also, it is very difficult to add other electronic parts to the front circuit pattern (and / or the back circuit pattern), and if it is added, the front circuit pattern (and / or the back circuit pattern) is damaged. Thus, the possibility that the main control board unit 34 will not function normally becomes very high, and unauthorized access to the main control board unit 34 can be reliably prevented.

  As the synthetic resin used for the resin mold, it is important to use a transparent or translucent synthetic resin material, and a thermoplastic synthetic resin such as polycarbonate (PC) can be used as such a synthetic resin material. By using such a synthetic resin material, various electronic components (such as MPU 44) mounted on the main board main body 42 can be visually confirmed from the outside, and the mounting check of the main control board unit 34 can be easily performed in the manufacturing process. Can be done.

  The main control board unit 34 is configured as follows in relation to the MPU 44 and the hologram sheet 52. The MPU 44 is for controlling the jackpot lottery and the like, and when the MPU 44 is different from a predetermined one, the probability of the jackpot lottery may change greatly. In general, the MPU 44 is provided with an identification display (for example, a model number, a model symbol, etc.) for distinguishing it from other things, and can be confirmed with this identification display. A lens member 54 is attached to make it easy to visually recognize the identification display of the MPU 44.

  In this embodiment, an identification display (not shown) is attached to one surface 56 of the MPU 44 (which constitutes a specific electronic component), and a rectangular mounting recess 58 is provided at a portion of the mold layer M facing the identification display. The lens member 54 is attached to the attachment recess 58. As shown in FIG. 8, the lens member 54 has an insertion mounting portion 60 corresponding to the shape of the mounting recess 58 and a lens portion 62 projecting upward from the insertion mounting portion 60 in a substantially semicircular shape. The part 60 is attached to the mold layer M by being inserted into and fixed to the attachment recess 58 (for example, fixed with an adhesive or the like). When the lens member 54 is provided in this way, the identification display of the MPU 44 can be viewed in an enlarged manner by viewing the identification display of the MPU 44 through the lens member 54 obliquely from above, and the display contents can be easily known. .

  Further, the hologram sheet 52 is used for proving a genuine product, and can be confirmed by the hologram display of the hologram sheet 52. For this reason, the hologram display of the hologram sheet 52 is easily visible. In order to do this, a magnifying lens unit 60 is provided. The magnifying lens portion 60 is formed at the same time as resin molding of an electronic component or the like, and can be easily provided without requiring a special process.

  Such a main control board unit 34 can be manufactured as follows. 4 to 7 together with FIG. 3, in order to manufacture the above-described main control board unit 34, first, the MPU 44, IC 46, capacitor 47, electronic components such as a resistor, reset switch 48, and the like as required. The attached main control board 41 (most of which is indicated by a one-dot chain line in FIG. 3) is manufactured (substrate manufacturing process). Then, the manufactured main control board 41 is molded with a synthetic resin using a pair of molding dies shown in FIGS. 4 to 7, that is, a first molding die 66 and a second molding die 68.

  At the time of resin molding, for example, support members 70 (two of them are shown in FIGS. 4 to 6) are attached to the back side square portion of the main control board 41, and this main control board 41 is attached to a predetermined mold of the first mold 66. Attach to the site (board setting process). A concave portion 72 corresponding to the shape of the main substrate main body 42 is provided on the upper surface of the first molding die 66, and the concave portion 72 is a lower cavity for resin molding the lower surface side of the main control substrate 41. The main control board 41 is positioned at a predetermined position of the first molding die 66 by defining 74 and positioning the support member 70 on the main control board 41 side at the square part of the concave portion 72.

  In this positioned state, the plurality of lead wires 50 (50a to 50e) extending from the main control board 41 are processed as required. A concave portion 76 having a predetermined shape is provided on the lower surface of the second mold 68, and a middle protrusion 77 (see FIG. 4) for forming the mounting concave portion 58 is provided in the concave portion 76. A concave portion for a lens portion (not shown) for forming the magnifying lens portion 60 is provided on the bottom surface. An accommodation recess 78 (see FIG. 5) for accommodating the reset switch 48 is provided on the lower surface of the second mold 68. The concave portion 76 of the second mold 68 defines an upper cavity 80 for resin-molding the upper surface side of the main control board 41, and the accommodating recess 78 defines an accommodation space 81 for allowing the reset switch 48 to escape. To do.

  Further, on one side surface (side surface where the plurality of lead wires 50 are located close to each other) defining the concave portion 76 of the second mold 68, as shown in FIGS. A lead wire accommodating space 82 for accommodating the wire 50 is provided, and a cover member 84 is detachably attached to an opening of the lead wire accommodating space 82. In this embodiment, the opening portion of the lead wire accommodating space 82 is formed to be somewhat larger than the other portions, and the cover member 84 is accommodated in the opening portion and positioned in contact with the shoulder portion of the opening portion. It is comprised so that.

  The cover member 84 is elongated in the arrangement direction of the plurality of lead wires 50, and in this embodiment, five insertion holes corresponding to each of the five sets of the plurality of lead wires 50 (50a to 50e). 86 (86a to 86e) are provided. For example, a first lead wire set (second lead wire set, third lead wire set) including 10 (6, 6, 2, 2) lead wires 50a (50b, 50c, 50d, 50e), The fourth lead wire set and the fifth lead wire set) pass through the first insertion hole 86a (the second insertion hole 86b, the third insertion hole 86c, the fourth insertion hole 86d, and the fifth insertion hole 86e). It is accommodated in the lead wire accommodating space 82. By accommodating the plurality of lead wires 50 in the lead wire accommodating space 82 in this way, handling of the plurality of lead wires 50 is facilitated, and erroneous connection can be reduced in later connection.

  In particular, in a gaming machine, a starting port 90 into which a game ball enters is provided below the game board 6 (below the display device 32), and a start switch (not shown) that detects the game ball that has entered the starting port 90 is provided. ), And the lead wire 50e (fifth lead wire set) (which constitutes a specific lead wire) for electrically connecting the start switch and the MPU 44 of the main control board unit 34 includes other A specific display (for example, color display by a specific color) for distinguishing from the lead wire 50 (50a to 50d) (which normally constitutes a lead wire) is attached, and erroneous connection of the lead wire 50e is surely prevented. There is a need. For this reason, at least the lead wire 50e (fifth lead wire set) is provided with a dedicated insertion hole, that is, a fifth insertion hole 86e (which constitutes a specific insertion hole), and the other lead wires 50 (50a to 50a). 50d) is preferably configured separately from the insertion hole 86 (first to fourth insertion holes 86a to 86d) (which normally constitutes the insertion hole), and the other lead wires 50 (50a to 50d). 50d) may be configured as separate insertion holes 86 (86a to 86d) as in the embodiment, or two to four lead wire sets may be configured as a common insertion hole.

  Further, in this embodiment, the lead wire accommodating space 82 is provided in the second mold 68, but on the contrary, it may be provided in the first mold 66. In this case, the shapes of the first and second mold dies 66 and 68 are modified, the lead wire accommodating space 82 is provided in the first mold die 66, and the opening of the lead wire accommodating space 82 is described above. The cover member 84 can be provided in the same manner as described above, and in this case, the lead wire receiving space 82 exists in the first mold die 66 to which the main control board 41 is attached. It becomes easy to accommodate the lead wire in the lead wire accommodating space 82.

  Thereafter, the second mold die 68 is moved relative to the first mold die 66 to perform mold clamping, and then a synthetic resin is injected to perform resin molding (resin molding step). When the first and second molding dies 66 and 68 are clamped, the state shown in FIGS. 4 to 7 is obtained, and the lower cavity 74 of the first molding die 66 and the upper cavity of the second molding die 68 are obtained. 80 constitutes a cavity for the resin mold.

  Then, synthetic resin is injected into the lower cavity 74 and the upper cavity 80 of the first and second mold dies 66 and 68, and the lower surface and the upper surface of the main control board 41 are covered with the synthetic resin and molded. At this time, since the main control substrate 41 exists in the middle of the cavity into which the synthetic resin is injected, the lower cavity 74 of the first mold die 66 is the first mold provided in the first mold die 66. It is desirable to inject through a flow path (not shown) and inject the upper cavity 80 of the second mold die 68 through a second flow path (not shown) provided in the second mold die 68. .

  In addition, in order to prevent the main control board 41 from floating during the injection, the lower cavity 74 of the first mold 66 after the injection of the synthetic resin into the upper cavity 80 of the second mold 68 is started. It is desirable to start the injection of the synthetic resin into the lower cavity 74, and the injection into the lower cavity 74 is somewhat shifted in time. In addition to this, the upper cavity 80 of the second mold 68 is further added. The inflow pressure (i.e., supply pressure) of the synthetic resin injected into the first mold is slightly higher than the inflow pressure (i.e., supply pressure) of the synthetic resin injected into the lower cavity 74 of the first mold die 66. Is desirable.

  When the injected synthetic resin is cooled and the first and second mold dies 66 and 68 are opened and the main control board 42 is taken out, the main control board unit 34 (with the lens member 54 mounted) as shown in FIG. After that, the lens member 54 may be attached to the attachment recess 58 of the main control board unit 34 as described above.

  In the main control board unit 34 manufactured in this way, the mold layers M are provided on both surfaces of the main control board 41. The mold layer M covers the entire lower surface (including the support member 70) of the main control board 41, and Covering almost the entire upper surface area (area excluding the non-circuit pattern area S1 provided with the reset switch 48), a mounting recess 58 is provided in a part of the mold layer M. In the mounting recess 58, FIG. As will be understood from the above, the thickness of the mold resin layer M is thin.

[Discharge control board unit]
Next, the payout control board unit 38 illustrated in FIG. 2 and 9, the payout control board unit 38 shown in the figure includes a payout control board 92 (which constitutes a board) made up of, for example, a printed wiring board. The payout control board 92 includes a payout board body 94 (which constitutes the board body). Like the main control board 41, a surface circuit pattern region (not shown) is provided on the surface side of the payout board body 94. A front circuit pattern (not shown) is formed in the front circuit pattern area, and a back circuit pattern area (not shown) is provided on the back side thereof, and a back circuit pattern (not shown) is provided in the back circuit pattern area. And a part of the front circuit pattern and a part of the back circuit pattern are electrically connected through the payout substrate body 94, and the front circuit pattern region and the back circuit pattern region are The circuit pattern area of the payout control board 92 is configured, and the front circuit pattern in the front circuit pattern area and the back circuit pattern in the back circuit pattern area form a circuit pattern in the circuit pattern area.

  The payout control board unit 38 controls the payout of game balls, and includes electronic parts such as an MPU 96, an IC 98, a capacitor 100, a segment indicator 102, and a resistor (not shown), and a mechanism. A reset switch 104 is provided as a component. In the payout control board 92, as with the main control board 41 described above, all of the electronic components such as the MPU 96 are placed in the surface circuit pattern area on the front side of the payout control board 92 (front side with respect to the paper surface in FIG. 9). A part of the front circuit pattern in the front circuit pattern region is disposed so as to penetrate the payout board main body 94 and be electrically connected to the back circuit pattern in the back circuit pattern region. The reset switch 104 is disposed in the non-circuit pattern area S2 outside the surface circuit pattern area on the surface side of the payout control board 92, and passes through the payout board main body 94 and is electrically connected to the back circuit pattern in the back circuit pattern area. It is connected to the.

  In this embodiment, the payout control board 92 further includes a plurality of (four in this embodiment) board-side connectors 106, 108, 110, 112 (connecting connectors as the mechanical parts, for example, female connectors). These board-side connectors 106 to 112 are arranged at intervals in the non-circuit pattern area S3 of the payout control board 92, and pass through the payout board main body 94 of the payout control board 92 to the back side thereof. Are electrically connected to a back circuit pattern (not shown) in the back circuit pattern area. The payout control board 92 is electrically connected to a main body side connector (not shown) (for example, composed of a male connector) on the gaming machine frame body 4 via these board side connectors 106 to 112.

  In the payout control board unit 38 as well as the main control board unit 34, substantially the entire circuit pattern area (that is, the front circuit pattern area and the back circuit pattern area) of the payout control board 92 and a plurality of electronic components (MPU 96, IC 98, capacitor 100, segment display 102, resistor, etc.) are molded and covered with a transparent or translucent synthetic resin. In this embodiment, as shown in FIG. 9, on the surface side of the payout board main body 94, the entire area of the surface circuit pattern area (that is, the entire surface circuit pattern) and all of the plurality of electronic components are integrated with synthetic resin. It is molded so that The resin-molded mold layer is indicated by symbol M1, and the above-described synthetic resin can be used. By resin molding in this way, even in the payout control board unit 38, it is very difficult to replace an electronic component, and unauthorized access to the electronic component can be prevented.

  The payout control board unit 38 is configured as follows in relation to the MPU 96 and the IC 98 (which constitutes a specific electronic component). The MPU 96 is for controlling the payout of game balls. If a different one from the predetermined one is mounted as the MPU 96, the number of game balls to be paid out may change. For this reason, the resin lens unit 114 is provided to make the identification display of the MPU 96 easy to see, and the resin lens unit 116 is also provided to make the identification display of the IC 98 easy to see. These resin lens portions 114 and 116 are formed simultaneously with resin molding of electronic parts and the like, and can be easily provided without requiring a special process.

  Such a payout control board unit 38 can be manufactured as follows. In order to manufacture the above-described payout control board unit 38 with reference to FIGS. 10 to 11 together with FIG. 9, first, MPU 96, IC 98, capacitor 100, segment display 102, electronic components such as resistors, reset switch 104, A payout control board 92 with the board-side connectors 106 to 112 attached as required is manufactured (board manufacturing process). Then, using the pair of molds shown in FIGS. 10 and 11, that is, the first mold 120 and the second mold 122, the manufactured dispensing control board 92 is molded with a synthetic resin.

  At the time of resin molding, for example, support members 124 (two of them are shown in FIGS. 10 and 11) are attached to the back side square portion of the payout control board 92, and this payout control board 92 is attached to a predetermined mold 120 for the first mold. Attach to the site (board setting process). A concave portion 126 corresponding to the shape of the payout substrate main body 94 is provided on the upper surface of the first mold 120, and the concave portion 126 defines a lower cavity 128. By positioning the support member 124 on the payout control board 92 side, the payout control board 92 is positioned at a predetermined position of the first mold 120.

  A concave portion 130 corresponding to the shape of the payout substrate body 94 is provided on the lower surface of the second mold 122, and the concave portion 130 defines the upper cavity 132. On the lower surface of the second mold 122, a first housing recess 134 (see FIG. 11) for housing the reset switch 104 and a second housing recess for housing the four board-side connectors 106-112. 136 (see FIG. 10), the first receiving recess 134 defines a first receiving space 138 for allowing the reset switch 104 to escape, and the second receiving recess 136 for allowing the board side connectors 106 to 112 to escape. A second accommodation space 140 is defined.

  Further, in this embodiment, lens concave portions 142 and 144 are provided in predetermined portions (portions corresponding to MPU 96 and IC 98) of the concave portion 130 of the second mold 122, and the lens concave portions 142 and 144 have a cross section. The shape is formed in an arc shape.

  Thereafter, the second mold 122 is moved relative to the first mold 120 to perform mold clamping, and then a synthetic resin is injected to perform resin molding (resin molding process). When the first and second mold dies 120 and 122 are clamped, the state shown in FIGS. 10 and 11 is obtained, and the lower cavity 128 of the first mold 120 and the upper cavity of the second mold 122 are obtained. 132 constitutes a cavity for the resin mold, the reset switch 104 is located in the first accommodating space 138 of the second mold 122, and the board-side connectors 106 to 112 of the second mold 122 Located in the second accommodation space 140.

  Then, a synthetic resin is injected into the lower cavity 128 and the upper cavity 132 of the first and second mold dies 120 and 122, and the lower surface and the upper surface of the dispensing control substrate 92 are covered with the synthetic resin and molded. In the resin molding of the payout control board 92, it is desirable that the synthetic resin is injected in the same manner as the resin molding of the main control board 41.

  When the injected synthetic resin is cooled and the first and second mold dies 120 and 122 are opened and the dispensing control board 92 is taken out, a dispensing control board unit 38 as shown in FIG. 9 is completed.

  In the dispensing control board unit 38 thus manufactured, the mold layers M1 are provided on both surfaces of the dispensing control board 92. The mold layer M1 covers the entire lower surface (including the support member 124) of the dispensing control board 92, and Covers almost the entire upper surface area (the area excluding the non-circuit pattern area S2 provided with the reset switch 104 and the non-circuit pattern area S3 provided with the board-side connectors 106 to 112) and accesses the dispensing control board unit 38. Becomes very difficult. In addition, resin lens portions 114 and 116 having a somewhat thicker arc shape are integrally provided at the same time as part of the mold layer M1 at the time of resin molding. It can be easily provided.

  In this embodiment, the non-circuit pattern area S2 (area where the reset switch 104 is provided) and the non-circuit pattern area S3 (area where the board-side connectors 106 to 112 are provided) of the payout control board 92 are resin-molded. However, it is preferable that these non-circuit pattern areas S2 and S3 are also covered with a synthetic resin layer. In such a case, the synthetic resin layer can be formed by spraying, painting, or the like. The lower part of the switch 104 and the lower part of the board-side connectors 106 to 112 are covered with a synthetic resin layer, so that it is very difficult to replace the reset switch 104 and the board-side connectors 106 to 112, thereby preventing unauthorized access to them. it can. This synthetic resin layer can also be formed by resin molding. In this case, the second molding die 122 is provided with a switch accommodating space that escapes only the upper portion corresponding to the reset switch 104, and each substrate side Corresponding to the connectors 106 to 112, four connector receiving spaces are provided to allow only the upper parts thereof to escape (the lower part of the reset switch 104 and the lower parts of the board side connectors 106 to 112 are located in the upper cavity 132). When the synthetic resin flows in, the lower part of the reset switch 104 and the lower parts of the board-side connectors 106 to 112 can be resin-molded at the same time.

[A gaming machine of the second embodiment]
Next, a gaming machine according to the second embodiment will be described with reference to FIGS. In the second embodiment, the payout control board unit and the configuration related thereto are modified. In the following embodiments, substantially the same members as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  12 to 15, a display device 32, a main control board unit 34, a display control board unit 36, a payout control board unit 38 </ b> A and a power supply board unit 40 are arranged on the back of the gaming machine 2 </ b> A. The payout control board unit 38A provided with the above and the configuration related thereto will be described.

  The payout control board unit 38A of this form includes a payout control board 92A (which constitutes a board) as a board, as in the above-described embodiment, and is provided on the surface side of the payout board main body 94A of the payout control board 92A. A front circuit pattern region (not shown) is provided, a front circuit pattern (not shown) is formed in the front circuit pattern region, and a back circuit pattern region (not shown) is provided on the back side thereof. A back circuit pattern (not shown) is formed in the back circuit pattern region.

  The payout control board unit 38A includes electronic parts such as an MPU 96, an IC 98, a capacitor 100, a segment indicator 102, and a resistor (not shown), as well as a reset switch 104 and board side connectors 106A and 108A as mechanical parts. , 110A, 112A (for example, a female connector) (which constitutes a second connector). In the payout control board 92A, all of the electronic components such as the MPU 96 are arranged in the surface circuit pattern area on the surface side of the payout control board 92A, and the surface circuit pattern and / or the payout board main body 94A in the surface circuit pattern area are arranged. It penetrates and is electrically connected to the back circuit pattern in the back circuit pattern region. The reset switch 104 is disposed in the non-circuit pattern area S4 outside the surface circuit pattern area on the surface side of the payout control board 94A, and passes through the payout board main body 94A and is electrically connected to the back circuit pattern in the back circuit pattern area. It is connected to the. Further, the board-side connectors 106A to 112A are provided at the upper end of the back surface of the payout control board 94A, disposed in the back circuit pattern region on the back surface side, and electrically connected to the back circuit pattern in the back circuit pattern region. Has been.

  In this embodiment, substantially the entire circuit pattern area (that is, the front circuit pattern area and the back circuit pattern area) of the payout control board 92A and a plurality of electronic components (MPU 96, IC 98, capacitor 100, segment display 102, resistance, etc.) Is molded and covered with a transparent or translucent synthetic resin (only the reset switch 104 is disposed in the non-circuit pattern region S4 and is not resin-molded). In addition, as shown in FIG. The entire lower perimeter of 106A to 112A is also molded with synthetic resin, and thus providing the mold layer M2 prevents unauthorized access to the dispensing control board 92A. Other configurations of the payout control board unit 38A are the same as those in the above-described embodiment.

  In addition, a payout control board mounting area R is provided in the lower right part of the back surface of the gaming machine 2A, and the gaming machine side mounting board 202 is attached to the payout control board mounting area R. The upper end portion of the payout control board mounting region R (that is, the upper end portion of the gaming machine side mounting board 202) corresponds to the board side connectors 106A to 112A on the payout control board unit 38A side. 206, 208, 210 (for example, comprising a male connector) (constituting a first connection connector) are provided. Further, a positioning contact member 212 is provided in a lower end region of the payout control board mounting region R (in this embodiment, a lower end portion of the gaming machine side mounting substrate 202), and protrudes upward from a distal end portion of the positioning contact member 212. The game machine side mounting board 202 and the positioning contact member 212 (including the receiving claw part 214) define a receiving part 216 that receives the payout control board unit 38A. The positioning contact member 212 may be provided on the back surface of the inner frame 10.

  In this gaming machine 2A, the payout control board unit 38A is attached to the payout control board attachment region R on the gaming machine side as follows. In order to attach the payout control board unit 38A, the board side connectors 106A to 112A are faced up to face the gaming machine side connectors 204 to 210. In this state, the payout control board unit 38A is moved downward to give the payout control. It is inserted into the receiving portion 216 of the board attachment region R and brought into contact with the positioning contact member 212. In this contact state, the upper end portion of the payout control board unit 38A is pressed toward the gaming machine side mounting board 202 side. Thus, the gaming machine side connectors 204 to 210 are inserted into and electrically connected to the board side connectors 106A to 112A of the payout control board unit 38A, and the payout control board unit 38A is mounted on the gaming machine side mounting board 202. Thus, the payout control board unit 38A can be attached to the gaming machine side mounting board 202 in the payout control board mounting area R by a simple operation of moving and pressing the payout control board unit 38A downward.

  In this embodiment, the positioning contact member 212 is provided at the lower end portion of the payout control board mounting region R. Instead of this configuration, the positioning contact member 212 is provided at the upper end of the payout control board mounting region R. You may make it provide in a part. In this case, the board-side connectors 106A to 112A are provided at the lower end of the payout control board 94A, and the board-side connectors 106A to 112A on the payout control board unit 38A side are provided at the lower end of the payout control board mounting region R. Gaming machine side connectors 204, 206, 208, 210 are provided. When configured in this manner, the board-side connectors 106A to 112A of the payout control board unit 38A are faced down to face the gaming machine side connectors 204 to 210, and in this state, the payout control board unit 38A is moved upward, It is inserted into the receiving portion 216 of the payout control board mounting region R and brought into contact with the positioning contact member 212. In this contact state, the lower end portion of the payout control board unit 38A is pressed toward the gaming machine side mounting board 202. In this way, the gaming machine side connectors 204 to 210 can be inserted into the board side connectors 106A to 112A of the payout control board unit 38A to be electrically connected. In this case, a support member may be provided at the lower end of the payout control board mounting region R in order to reliably support the payout control board unit 38A.

[Other Embodiments of Main Control Board Unit]
FIG. 16 shows another embodiment of the main control board unit. In this other embodiment, instead of the lead wire, a connection connector as a mechanical component is used. In FIG. 16, in this main control board unit 34B, first board side connectors 222, 224, and 226 as connection connectors are provided in the non-circuit pattern area S1B of the main control board 41B in which the reset switch 48 is disposed. Similarly to the reset switch 48, these first board side connectors 222 to 226 penetrate the main board body 42B and are electrically connected to the back circuit pattern in the back circuit pattern area on the back side. A non-circuit pattern area S5 is provided at the upper end of the main control board 41B, and second board-side connectors 228, 230, 232, 234, 236, and 238 as connection connectors are provided in the non-circuit pattern area S5. These second board side connectors 228 to 238 are electrically connected to the back circuit pattern in the back circuit pattern area on the back side thereof through the main board main body 42B, like the first board side connectors 222 to 226. The

  In the main control board unit 34B, as described above, the entire back surface (including the back circuit pattern area) of the main control board 41B and the entire front circuit pattern area (in other words, the non-circuit pattern area S1B). , All regions except S5) are resin-molded and covered with the mold layer M3. Other configurations of the main control board unit 34B are substantially the same as those of the above-described embodiment.

  Such a main control board unit 34B has the same basic configuration as that of the first embodiment described above, and therefore can achieve the same operational effects as described above. It can be used in place of the main control board unit 34.

  As mentioned above, although embodiment of the gaming machine (and board unit and its manufacturing method) according to this invention was described, this invention is not limited to this embodiment, Various deformation | transformation thru | or corrections do not deviate from the scope of this invention. Is possible.

  For example, in the above-described embodiments, the substrate unit has been described as applied to the main control board unit and the payout control board unit, but is not limited to these board units, and other board units such as a display control board unit, The present invention can be similarly applied to a power supply board unit or the like.

  Further, for example, in the above-described embodiments, description has been made by applying to a pachinko gaming machine as a gaming machine. However, the present invention is not limited to this, and similarly applies to gaming machines such as gaming machines installed in slot machines, arcades, and the like. Can be applied.

2 gaming machine frame 6 gaming board 32 display device 34, 34B main control board unit 36 display control board unit 38, 38A payout control board unit 41, 41B main control board 50, 50a, 50b, 50c, 50d, 50e lead wire 92 , 92A Discharge control board M, M1, M2, M3 Mold layer

Claims (13)

A board unit used in a gaming machine,
A circuit board having a circuit pattern region on which a plurality of electronic components are mounted; and substantially all of the circuit pattern region of the substrate and all of the plurality of electronic components are molded with a transparent or translucent synthetic resin. A board unit characterized by   The substrate has a substrate body on which the plurality of electronic components are mounted, a front circuit pattern region provided on the surface of the substrate body, and a back circuit pattern region provided on the back surface of the substrate body, A portion of the front circuit pattern region and a portion of the back circuit pattern region are electrically connected through the substrate body, and the surface circuit pattern region and the back circuit pattern region of the substrate are substantially connected. The board unit according to claim 1, wherein the entire upper area and all of the plurality of electronic components are molded with a synthetic resin.   A mechanical component is further mounted on the substrate, and the mechanical component is disposed on the front side of the substrate body, and is electrically connected to the back circuit pattern region through the substrate body. The board unit according to claim 2, wherein the entire front circuit pattern area and the back circuit pattern area of the board and all of the plurality of electronic components are molded with a synthetic resin.   The whole area of the substrate body, the front circuit pattern region and the back circuit pattern region, all of the plurality of electronic components and the lower part of the mechanism component are molded with a synthetic resin. Board unit.   Lead wires are electrically connected to the front circuit pattern region of the substrate, the entire surface circuit pattern region and the back circuit pattern region of the substrate, all of the plurality of electronic components, and the base of the lead wire The substrate unit according to claim 2, wherein the substrate unit is molded with a synthetic resin.   The plurality of electronic components include a specific electronic component with an identification display, and a magnifying lens unit for enlarging and visually identifying the identification display is provided in relation to the specific electronic component, and the magnifying lens unit The substrate unit according to claim 1, wherein the substrate unit is simultaneously formed when molding the plurality of electronic components.   The board unit according to claim 1, wherein the board is a main control board for controlling game contents or a payout control board for controlling payout of game balls. A method of manufacturing a board unit used in a gaming machine,
A substrate manufacturing process for manufacturing a substrate having a circuit pattern region on which a plurality of electronic components are mounted, a substrate setting process for setting the substrate manufactured on one of a pair of mold dies, and the pair of mold dies Resin mold that molds all of the plurality of electronic components and substantially all of the circuit pattern region of the substrate by allowing a transparent or translucent synthetic resin to flow into the front surface side and back surface side of the substrate And a step of manufacturing the substrate unit.   A plurality of lead wires are electrically connected to the circuit pattern in the circuit pattern region of the substrate, and a lead wire accommodating space is defined in one of the pair of mold dies, and the plurality of lead wires are defined. A cover member having an insertion hole for inserting a lead wire into the lead wire accommodating space is detachably provided in the opening of the lead wire accommodating space. 9. The board unit manufacturing method according to claim 8, wherein the plurality of lead wires are set in one of the mold dies, and are accommodated in the lead wire accommodating space through the insertion hole of the cover member. Method.   The plurality of lead wires include a specific lead wire with a specific indication and a normal lead wire different from the specific lead wire, and the insertion hole of the cover member has a specific insertion wire corresponding to the specific lead wire. A normal insertion hole corresponding to the normal lead wire, and in the substrate setting step, the specific lead wire is accommodated in the lead wire accommodating space through the specific insertion hole of the cover member. The method of manufacturing a substrate unit according to claim 9, wherein the lead wire is accommodated in the lead wire accommodating space through the normal insertion hole of the cover member.   The plurality of electronic components include a specific electronic component with an identification display, and in relation to the specific electronic component, a concave portion for a lens portion is provided in a predetermined portion of the pair of mold dies, In the resin molding step, when the pair of mold dies are clamped and a transparent or translucent synthetic resin flows in, the identification display is enlarged and visually recognized by the synthetic resin flowing into the concave portion for the lens portion. A magnifying lens portion for forming the substrate unit according to claim 8.     A gaming machine frame, a gaming board attached to the gaming machine frame, a display device attached to the gaming board, and the board unit according to claim 1 or 2. Gaming machine. A payout control board mounting area is provided at a predetermined portion on the back surface of the gaming machine frame, a positioning contact member is provided at a lower end area or an upper end area of the payout control board mounting area, and the payout control board mounting A first connection connector is disposed at the upper end or lower end of the region, the board unit is composed of a payout control board unit, and a second connection connector is provided at the lower end or upper end of the rear surface of the payout control board unit. Is provided,
When the upper end or the lower end of the payout control board unit is pressed toward the payout control board mounting area while the lower end or the upper end of the payout control board unit is in contact with the positioning contact member, the payout The gaming machine according to claim 12, wherein the second connection connector of the control board unit is electrically connected to the first connection connector on the payout control board attachment region side.

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