JP2014120604A5 - - Google Patents
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- JP2014120604A5 JP2014120604A5 JP2012274580A JP2012274580A JP2014120604A5 JP 2014120604 A5 JP2014120604 A5 JP 2014120604A5 JP 2012274580 A JP2012274580 A JP 2012274580A JP 2012274580 A JP2012274580 A JP 2012274580A JP 2014120604 A5 JP2014120604 A5 JP 2014120604A5
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- JP
- Japan
- Prior art keywords
- imprint
- imprint material
- mold
- region
- supply unit
- Prior art date
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- 239000000463 material Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 230000000875 corresponding Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Description
本発明のインプリント装置は、基板上のインプリント材に型を用いてパターンを形成するインプリント装置であって、前記型と接触した状態の前記インプリント材に該インプリント材を硬化させるエネルギーを供給する供給部と、前記型と前記インプリント材とが最初に離型する領域に供給するエネルギーよりも、前記型と前記インプリント材とが最後に離型する領域に供給するエネルギーが多くなるように、前記供給部から前記インプリント材に供給されるエネルギーを調整する調整部と、を備えることを特徴とする。 Imprint apparatus of the present invention is a imprint apparatus for forming a pattern using a mold imprint material on a substrate, energy curing the imprint material to the imprint material contact with the mold More energy is supplied to the area where the mold and the imprint material are finally released than the energy supplied to the area where the mold and the imprint material are released first. The adjustment part which adjusts the energy supplied to the said imprint material from the said supply part is provided.
モールドMには、ウエハWに対向する表面に凹凸形状のパターンPが形成されている。ウエハステージ4は、ウエハチャック3に保持されたウエハWをXY平面で移動させることができる。ウエハステージ4は、ウエハWをZ方向に移動させることができるようにしても良い。ディスペンサ5(塗布機構)はウエハW上に樹脂6(インプリント材)を供給する。ウエハWはウエハステージ4によってモールドMに形成されたパターンPの下方の所定の位置に移動したり、ディスペンサ5の下方に移動したりする。 In the mold M, an uneven pattern P is formed on the surface facing the wafer W. The wafer stage 4 can move the wafer W held by the wafer chuck 3 on the XY plane. The wafer stage 4 may be configured to move the wafer W in the Z direction. The dispenser 5 (application mechanism) supplies the resin 6 (imprint material) onto the wafer W. The wafer W moves to a predetermined position below the pattern P formed on the mold M by the wafer stage 4 or moves below the dispenser 5.
上述したいずれの実施形態のインプリント装置も、エネルギーを供給する供給部として紫外線を照射する光源を用い、樹脂(インプリント材)には光硬化樹脂を用いたインプリント装置について説明をした。しかし本発明は、熱を用いてインプリントを行うインプリント装置であっても良い。 The imprint apparatus according to any of the embodiments described above has described the imprint apparatus that uses a light source that emits ultraviolet rays as a supply unit that supplies energy, and uses a photo-curing resin as a resin (imprint material) . However, the present invention may be an imprint apparatus that performs imprint using heat.
樹脂(インプリント材)には熱硬化性樹脂を用いても良いし、熱可塑性樹脂を用いても良い。使用する樹脂に応じて最後に離型する領域31で発生する内部応力の大きさが、最初に離型する領域32の内部応力よりも大きくなるように熱エネルギーを供給する。 As the resin (imprint material) , a thermosetting resin may be used, or a thermoplastic resin may be used. Thermal energy is supplied so that the internal stress generated in the region 31 to be released last according to the resin to be used is larger than the internal stress in the region 32 to be released first.
Claims (14)
前記型と接触した状態の前記インプリント材に該インプリント材を硬化させるエネルギーを供給する供給部と、
前記型と前記インプリント材とが最初に離型する領域に供給するエネルギーよりも前記型と前記インプリント材とが最後に離型する領域に供給するエネルギーが多くなるように、前記供給部から前記インプリント材に供給されるエネルギーを調整する調整部と、
を備えることを特徴とするインプリント装置。 An imprint apparatus for forming a pattern using a mold on an imprint material on a substrate,
A supply unit for supplying energy for curing the imprint material to the imprint material in contact with the mold;
From the supply unit, the energy supplied to the area where the mold and the imprint material are finally released is larger than the energy supplied to the area where the mold and the imprint material are released first. An adjustment unit for adjusting energy supplied to the imprint material ;
An imprint apparatus comprising:
前記調整部は前記露光光による露光量を調整することを特徴とする請求項1に記載のインプリント装置。 The supply unit has a light source that emits exposure light that cures the imprint material ,
The imprint apparatus according to claim 1, wherein the adjustment unit adjusts an exposure amount by the exposure light.
前記露光光を遮光する遮光板を備え、
前記調整部は、前記最後に離型する領域に前記露光光を照射した状態で、前記最初に離型する領域を照射する露光光を遮光するように前記遮光板を駆動することで、前記最初に離型する領域にエネルギーを供給する時間よりも、前記最後に離型する領域にエネルギーを供給する時間が長くなるように前記供給部を調整することを特徴とする請求項5に記載のインプリント装置。 The supply unit has a light source that emits exposure light that cures the imprint material ,
A light shielding plate for shielding the exposure light;
The adjustment unit drives the light shielding plate so as to shield the exposure light that irradiates the first release region in a state where the exposure light is irradiated to the last release region. The infeed according to claim 5, wherein the supply unit is adjusted so that a time for supplying energy to the last region to be released becomes longer than a time for supplying energy to the region to be released. Printing device.
前記インプリント材に該インプリント材を硬化させるエネルギーを供給する供給部と、
前記型と前記インプリント材とが接触した状態で、前記型と前記インプリント材とが最初に離型する領域に供給するエネルギーよりも前記型と前記樹脂とが最後に離型する領域に供給するエネルギーが多くなるように、前記供給部から前記インプリント材にエネルギーを供給するよう制御する制御部と、
を備えることを特徴とするインプリント装置。 An imprint apparatus for forming a pattern using a mold on an imprint material on a substrate,
A supply unit for supplying energy to cure the imprint material to the imprint material,
When the mold and the imprint material are in contact with each other, the mold and the resin are supplied to the region where the mold and the resin are finally released rather than the energy supplied to the region where the mold and the imprint material are released first. A control unit that controls to supply energy from the supply unit to the imprint material so that more energy is generated;
An imprint apparatus comprising:
前記型と接触した状態の前記インプリント材に該インプリント材を硬化させるエネルギーを供給する供給部と、
前記基板上に形成される前記パターンの密度が低い領域よりも、前記基板上に形成される前記パターンの密度が高い領域に供給するエネルギーが多くなるように、前記供給部から前記インプリント材に供給されるエネルギーを調整する調整部と、
を備えることを特徴とするインプリント装置。 An imprint apparatus for forming a pattern using a mold on an imprint material on a substrate,
A supply unit for supplying energy for curing the imprint material to the imprint material in contact with the mold;
The imprint material is supplied from the supply unit so that more energy is supplied to a region where the density of the pattern formed on the substrate is higher than a region where the density of the pattern formed on the substrate is low. An adjustment unit for adjusting the supplied energy;
An imprint apparatus comprising:
前記インプリント材は前記熱源から供給される熱により硬化する熱硬化性樹脂または熱可塑性樹脂であり、
前記調整部は前記熱源による熱の供給量を調整することを特徴とする請求項1に記載のインプリント装置。 The supply unit has a heat source for supplying heat for curing the imprint material ,
The imprint material is a thermosetting resin or a thermoplastic resin that is cured by heat supplied from the heat source,
The imprint apparatus according to claim 1, wherein the adjustment unit adjusts an amount of heat supplied from the heat source.
前記工程で前記パターンが形成された前記基板を加工する工程と、
を含むことを特徴とするデバイス製造方法。 Forming the pattern on the substrate using the imprint apparatus according to any one of claims 1 to 12 ,
Processing the substrate on which the pattern is formed in the step;
A device manufacturing method comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2012274580A JP2014120604A (en) | 2012-12-17 | 2012-12-17 | Imprint device, method of manufacturing device and mold for use in imprint device |
Applications Claiming Priority (1)
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JP2012274580A JP2014120604A (en) | 2012-12-17 | 2012-12-17 | Imprint device, method of manufacturing device and mold for use in imprint device |
Publications (2)
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JP2014120604A JP2014120604A (en) | 2014-06-30 |
JP2014120604A5 true JP2014120604A5 (en) | 2016-02-12 |
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JP2012274580A Pending JP2014120604A (en) | 2012-12-17 | 2012-12-17 | Imprint device, method of manufacturing device and mold for use in imprint device |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6679328B2 (en) * | 2016-02-01 | 2020-04-15 | キヤノン株式会社 | Imprint apparatus, control method, and article manufacturing method |
JP6335948B2 (en) * | 2016-02-12 | 2018-05-30 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
US9971249B1 (en) | 2017-02-27 | 2018-05-15 | Canon Kabushiki Kaisha | Method and system for controlled ultraviolet light exposure |
JP6448741B2 (en) * | 2017-10-18 | 2019-01-09 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
US10663869B2 (en) * | 2017-12-11 | 2020-05-26 | Canon Kabushiki Kaisha | Imprint system and imprinting process with spatially non-uniform illumination |
JP7195789B2 (en) * | 2018-06-29 | 2022-12-26 | キヤノン株式会社 | Flattening device and method for manufacturing article |
US10976657B2 (en) * | 2018-08-31 | 2021-04-13 | Canon Kabushiki Kaisha | System and method for illuminating edges of an imprint field with a gradient dosage |
JP6660452B2 (en) * | 2018-12-06 | 2020-03-11 | キヤノン株式会社 | Forming apparatus, forming method and article manufacturing method |
US11181819B2 (en) * | 2019-05-31 | 2021-11-23 | Canon Kabushiki Kaisha | Frame curing method for extrusion control |
Family Cites Families (9)
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JP2008091782A (en) * | 2006-10-04 | 2008-04-17 | Toshiba Corp | Pattern forming template, pattern forming method and nano-imprinter |
JP4799575B2 (en) * | 2008-03-06 | 2011-10-26 | 株式会社東芝 | Imprint method |
JP4881403B2 (en) * | 2009-03-26 | 2012-02-22 | 株式会社東芝 | Pattern formation method |
JP5532854B2 (en) * | 2009-11-25 | 2014-06-25 | 大日本印刷株式会社 | PATTERN FORMING METHOD, PATTERN FORMING DEVICE, NANOIMPRINT MOLD, AND METHOD FOR PRODUCING NANOIMPRINT MOLD |
JP5392145B2 (en) * | 2010-02-26 | 2014-01-22 | 大日本印刷株式会社 | Imprint method and imprint apparatus |
JP4774125B2 (en) * | 2010-10-04 | 2011-09-14 | キヤノン株式会社 | Transfer apparatus, mold, and device manufacturing method |
JP2012114158A (en) * | 2010-11-22 | 2012-06-14 | Toshiba Corp | Imprinting method and imprinting apparatus |
JP5786152B2 (en) * | 2011-03-04 | 2015-09-30 | 公立大学法人大阪府立大学 | Design method of mold for nanoimprint |
JP2012236371A (en) * | 2011-05-13 | 2012-12-06 | Hoya Corp | Release method in imprint |
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