JP2014116515A - Liquid draining device and liquid draining method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid draining device and a liquid draining method for a semiconductor device, capable of preventing droplets from being scattered to the outside of the device.SOLUTION: A liquid draining device 20 comprises a fixed base 9, an air nozzle 3 for a casing, an air nozzle 4 for casing recess formation, a vertically movable cylinder 8, and an outer box 2 covering these components. A casing 1 is fixed to the fixed base 9, and liquid draining of the casing 1 is performed by the air nozzle 3 for the casing and the air nozzle 4 for casing recess formation. The air nozzle 3 for the casing and the air nozzle 4 for casing recess formation are fixed to a nozzle pedestal 7 and can be vertically moved by the vertically movable cylinder 8. Thus, in the state where air is jetted out, the air nozzle 3 for the casing and the air nozzle 4 for casing recess formation are slid while keeping an air jetting direction.

Description

  The present invention relates to a liquid draining device and a liquid draining method for a semiconductor device.

  Conventionally, as disclosed in, for example, Japanese Patent Application Laid-Open No. 58-81556, a liquid draining device that blows water droplets adhering to the surface by blowing an air jet against a semiconductor device is known. As shown in FIG. 4 of the publication, the liquid draining device according to this prior art includes a rotary air blow unit. This rotary air blow unit connects the rotary hollow shafts of upper and lower swivel pipes that are rotatably opposed across a conveyor, and the upper and lower air supply pipes. The upper and lower swirling pipes are provided with air nozzles slightly rearward with respect to the rotational direction. These upper and lower air nozzles rotate the swivel pipe by the reaction of the air jet while jetting air, and blow off water droplets adhering to the soldered article or the like by the air jet while rotating.

JP 58-81556 A JP-A-5-206348 JP-A-60-257968

  However, in the above conventional technique, the air injection direction circulates with the rotation of the upper and lower turning pipes. As a result, the droplets are inevitably scattered over a wide range. In the liquid draining step, it is not preferable that the liquid to be drained, such as a plating solution, is scattered in a wide range. For example, if the liquid is scattered outside the outer box (tank) of the apparatus, problems such as corrosion may occur.

  The present invention has been made to solve the above-described problems, and provides a liquid draining device and a liquid draining method for a semiconductor device capable of suppressing droplets from scattering outside the apparatus. Objective.

A liquid draining device for a semiconductor device according to the present invention is:
A fixing portion for removably fixing the semiconductor device;
A gas injection unit including one or more gas injection holes facing the semiconductor device fixed by the fixing unit;
Gas supply means for supplying gas to the gas injection unit so as to inject gas from the gas injection hole;
Movement for changing the relative position of the fixed part and the gas injection part so that the gas injection hole slides while keeping the injection direction of the gas injection part in a state where the gas is injected from the gas injection hole Means,
An outer box containing the fixed part and the gas injection part so as to surround at least a scattering position of a droplet blown off by the gas injected from the gas injection hole;
It is characterized by providing.

A method for draining a semiconductor device according to the present invention includes:

A step of fixing the semiconductor device after being immersed in the plating solution by the plating step;
Preparing a gas injection unit including one or more gas injection holes facing the fixed semiconductor device, and supplying gas to the gas injection unit so as to inject gas from the gas injection holes;
Movement for changing the relative position of the fixed part and the gas injection part so that the gas injection hole slides while keeping the injection direction of the gas injection part in a state where the gas is injected from the gas injection hole Process,
It is characterized by providing.

  According to the liquid draining apparatus and the liquid draining method of the semiconductor device according to the present invention, it is possible to limit the scattering direction of the liquid droplets blown by the gas.

It is a perspective view which shows the structure of the liquid draining device of the semiconductor device concerning Embodiment 1 of this invention. It is a front view which shows the structure of the liquid draining device of the semiconductor device concerning Embodiment 1 of this invention. It is a figure which shows the state which mounted the housing | casing with respect to the front view shown in FIG. It is a side view which shows the air nozzle for housing | casing concerning Embodiment 1 of this invention, the air nozzle for housing | casing recessed shape, and its periphery structure. FIG. 5 is a side view for explaining the operation of the apparatus and the liquid draining method of the first embodiment. It is a side view which shows the air nozzle for housing | casing concerning Embodiment 2 of this invention, the air nozzle for housing | casing recessed shape, and those peripheral structures. It is a side view which shows the air nozzle for housing | casing concerning Embodiment 3 of this invention, the air nozzle for housing | casing recessed shape, and those periphery structures. It is the side view to which the structure of the air nozzle for housing | casing concerning Embodiment 3 of this invention was expanded.

Embodiment 1 FIG.
[Configuration of Device of Embodiment 1]
(overall structure)
FIG. 1 is a perspective view showing a configuration of a liquid draining device 20 for a semiconductor device according to a first embodiment of the present invention. The liquid draining device 20 can be used for a process including a process using liquid and a cleaning process. In the perspective view of FIG. 1, for convenience of explanation, a notch is provided in the front corner portion of the outer box 2 to represent the internal configuration. However, in reality, the outer box 2 has a rectangular shape without this notch. FIG. 2 is a front view showing the configuration of the liquid draining device 20 of the semiconductor device according to the first embodiment of the present invention, and shows the front portion of the outer box 2 in a transparent manner. In the present embodiment, a liquid draining device 20 that performs liquid draining on the housing 1 that is a semiconductor device is provided. The housing 1 is a power semiconductor device (so-called power semiconductor module), particularly a transfer mold type semiconductor module. FIG. 3 is a diagram showing a state in which the housing 1 is mounted on the front view shown in FIG.

  The liquid draining device 20 includes an outer box 2. A fixed base 9 and a lifting cylinder 8 are provided inside the outer box 2. The outer box 2 has a bottom portion provided immediately below the fixed base 9 in the vertical direction, and a side surface portion covering the periphery of the fixed base 9. The outer box 2 is used for the fixing base 9 and the casing so as to surround the positions where droplets blown off by the air (air) ejected from the casing air injection port 10 and the casing recess-shaped air injection port 12 are scattered. The air nozzle 3 and the casing-recessed air nozzle 4 are accommodated. The outer box 2 has an opening vertically upward, and the housing 1 can be easily removed.

  The fixing base 9 fixes the housing 1 in a removable manner. The housing 1 has two main surfaces 1b and 1c facing each other and a side peripheral surface 1d connecting the two surfaces 1b and 1c. The fixed base 9 is fixed (supported) so that the side peripheral surface 1d faces the vertical direction. In the first embodiment, the two casings 1 connected by the frame 1a are fixed by the fixing base 9, but the present invention is not limited to such a form. The fixing base 9 may be configured so as to support and fix the frame 1a over the upper portion of the outer box 2. However, from the viewpoint of surely draining the side peripheral surface 1d of the housing 1, the fixing base 9 should be provided so as not to interrupt the space between the side peripheral surface 1d of the housing 1 and the housing air nozzle 3. Is preferred.

("Gas injection part" and "Gas supply means")
The liquid draining device 20 includes a nozzle base 7. The nozzle base 7 is connected to the housing air nozzle 3 and the housing recess shape air nozzle 4 via the housing air nozzle pipe 5 and the housing recess shape air nozzle pipe 6. The housing air nozzle 3 and the housing recess-shaped air nozzle 4 serve as a “gas injection part”.

  FIG. 4 is a side view showing the housing air nozzle 3 and the housing recess-shaped air nozzle 4 according to the first embodiment of the present invention, and the peripheral configuration thereof. FIG. 4 is a partially enlarged view of the periphery of the housing air nozzle 3 and the like from the right side in FIG. The housing air nozzle 3 includes a housing air injection port 10 facing the housing 1 side. The housing recess shape air nozzle 4 includes a housing recess shape air injection port 12 that faces the housing 1 side.

  The liquid draining device 20 includes a housing air nozzle pipe 5 and a housing recess-shaped air nozzle pipe 6. These pipes are connected to the nozzle base 7 and are connected to an air pump (not shown), and compressed gas (air) flows inside each. The air pump may be built in the elevating cylinder 8, or an air pump may be provided outside the outer box 2 and connected to the air pump by piping. Thus, air is supplied to the housing air nozzle 3 and the housing recess-shaped air nozzle 4 so that air is jetted from the housing air injection port 10 and the housing recess-shaped air injection port 12. The casing air nozzle pipe 5, the casing recess-shaped air nozzle pipe 6, and an air pump (not shown) correspond to the "gas supply means".

  The housing air nozzle 3 has a housing air injection port 10. The housing air injection port 10 is for injecting air so as to hit the entire main surface 1 b of the housing 1. The housing recess shape air nozzle 4 has a housing recess shape air injection port 12. The housing recess shape air injection port 12 is for injecting air with the housing recess shape portion 11 aimed. The housing air injection port 10 and the housing recess-shaped air injection port 12 air “air in one or more directions within a range from the horizontal direction facing the housing 1 fixed to the fixed base 9 to the vertically downward direction”. Inject. That is, the housing air injection port 10 and the housing recess-shaped air injection port 12 are respectively 0 when the direction directly below each air nozzle (vertically below) is 0 ° and the housing 1 side is 90 °. It is attached to the air nozzle at an angle θ within the range of from 0 ° to 90 ° (that is, an injection port is formed). Specifically, in the present embodiment, the housing air injection port 10 and the housing recess-shaped air injection port 12 are each provided at a position of θ = about 45 °.

  The casing air nozzle 3 and the casing recess-shaped air nozzle 4 have different air injection ranges. In the present embodiment, the air injection range is different in the width direction of the housing 1. That is, as shown in FIG. 2, the housing air nozzle 3 extends with a first length W <b> 1 in a direction intersecting the sliding direction. The case-indented air nozzle 4 extends in a direction intersecting the slide direction by a second length W2. The first length W1 is not less than the length of the outer shape of the housing 1. The second length W2 is less than the length of the outer shape of the housing 1. That is, the relationship of W1> W2 is established. The housing air injection port 10 and the housing recess-shaped air injection port 12 are composed of a plurality of injection holes provided side by side in the direction intersecting with the first and second nozzle portions, respectively. In the present embodiment, the housing air injection port 10 and the housing recess shape air injection port 12 are aligned in substantially the entire length direction of the housing air nozzle 3 and the housing recess shape air nozzle 4, respectively. Are arranged. Accordingly, the housing air nozzle 3 can inject air over the entire length in the width direction of the length W1, and the housing recess-shaped air nozzle 4 injects air over the entire length in the width direction of the length W2. Can do.

  Each of the housing air injection port 10 and the housing recess-shaped air injection port 12 includes at least one injection hole, but both the injection holes may have the same diameter or hole shape, or may be different. . For example, the casing air injection port 10 may have a shape and a diameter that allow gas injection over a wide range in order to drain the entire casing 1 uniformly. Further, the housing recess-shaped air injection port 12 may be provided with an injection hole that has a smaller diameter and a narrower injection range than the housing air injection port 10. This is because the air is limitedly ejected to the specific place with a stronger momentum than the housing air injection port 10. Depending on the role of each injection port, at least one of the air injection direction and the air injection range can be made different.

(transportation)
The liquid draining device 20 includes moving means for changing the relative positions of the fixed base 9, the housing air nozzle 3, and the housing recess-shaped air nozzle 4. The moving means changes the relative positions of the fixed base 9, the housing air nozzle 3, and the housing recess-shaped air nozzle 4 in the vertical direction. In the first embodiment, this moving means is realized by the elevating cylinder 8 that can move up and down in the vertical direction. As the elevating cylinder 8 moves up and down, the air nozzle can be advanced and retracted into the outer box 2 through the opening. Thereby, in a state where air is ejected from the housing air injection port 10 and the housing recess shape air injection port 12, the injection direction of the housing air nozzle 3 and the housing recess shape air nozzle 4 is maintained, The housing air injection port 10 and the housing recess-shaped air injection port 12 slide on the surface of the housing 1 fixed to the fixed base 9.

[Operation of Apparatus and Liquid Cutting Method of Embodiment 1]
FIG. 5 is a side view for explaining the operation of the apparatus and the liquid draining method of the first embodiment. The elevating cylinder 8 is lowered while injecting air from the housing air nozzle 3 and the housing recess-shaped air nozzle 4. The plating solution can be removed from the casing 1 by sliding in the vertical direction while maintaining the posture (injection direction) of the gas injection unit. Thereby, since the jet direction of gas can be limited to a fixed direction, the scattering direction of droplets such as plating solution blown off by the gas can be limited to a specific direction. As a result, it is possible to avoid the scattering of liquid droplets above the housing 1 (that is, above the liquid draining device 20).

  Further, in the liquid draining device 20, the casing 1 can be drained by an operation in one direction by the elevating cylinder 8, and a mechanism for applying a rotational centrifugal force is not necessary. It can be simplified and downsized.

  Further, as shown in FIG. 4, the housing air injection port 10 and the housing recess-shaped air injection port 12 are each perpendicular to the nozzle 1 and the case 1 mounted on the outer box 2 is perpendicular to the nozzle. When the direction is 90 °, the air nozzle is attached within an angle of 0 ° to 90 °. Thereby, when using an air nozzle, the injection angle can be fixed in accordance with the structure of the housing 1.

  By fixing the angle as described above, it is possible to selectively disperse the liquid adhering to the housing 1 to the lower side of the outer box 2, and by preventing the liquid droplets from splashing outside the outer box 2, the liquid is adhered to the case 1. Corrosion can be prevented. By sliding the housing air nozzle 3 and the housing recess-shaped air nozzle 4 in the vertical direction, the droplets blown off by the gas can be smoothly dropped in the vertical direction by gravity, and the droplets can be further scattered outside. It is possible to collect droplets in the outer box while suppressing them. Since the direction in which the gravity acts, the sliding direction of the housing air nozzle 3 and the housing recess-shaped air nozzle 4, and the gas injection direction can be made coincident with each other, droplets are not placed above the outer box 2 but in the outer box 2. Can be reliably blown to the bottom side.

  In addition, by using the housing air nozzle 3 and the housing recess-shaped air nozzle 4 having different air jet injection ranges in combination, it is possible to apply air to a target location of the housing 1. In other words, the entire casing 1 is completely drained by the wide casing air nozzle 3 having the length W1, and the droplets are likely to remain by the narrow casing-shaped air nozzle 4 having the length W2. It is possible to perform liquid draining intensively with respect to one recessed shape portion. Thereby, in addition to the liquid drainage of the entire surface of the housing 1, it is possible to reliably perform the liquid drainage of the recessed portion 11 of the housing 1, which is liable to generate a liquid residue. As a result, the liquid removal of the transfer mold type power module can be performed efficiently and reliably.

  In the liquid draining device in the plating process according to the prior art described in Japanese Patent Laid-Open No. 5-206348, the droplets in the transfer mold type power module housing are removed by a rotating machine. This rotating machine implements a liquid draining method in which droplets are blown off by centrifugal force by rotating the power module housing itself. However, the casing of the power module sometimes has a concave shape, and it has been difficult to remove the liquid remaining inside the concave. In addition, by using the rotation mechanism, the position of the terminal of the transfer mold type power module casing by the centrifugal force generated by the tilt of the casing in the rotating machine after draining and interfering with the transfer arm There was a problem with scratches. In addition, the use of a rotating machine has caused problems such as device corrosion due to chemical splashes. In this regard, according to the present embodiment, it is possible to obtain a device that efficiently removes the liquid that has entered the concave shape of the housing, prevents the frame shape from being deformed, and prevents device corrosion due to chemical splashing. .

[Modification of Embodiment 1]
In the first embodiment, by using the elevating cylinder 8 as the moving means, the gas injection unit (the housing air nozzle 3 and the housing recessed shape air nozzle 4) is moved up and down. However, the present invention is not limited to this. The moving means may move the fixed base 9 in the vertical vertical direction. Since the mechanism for raising and lowering the fixed base 9 may be a known drive mechanism as appropriate, a detailed description thereof is omitted. For example, a vertical operation unit that can operate in the vertical direction is provided below the elevation cylinder 8. You may make it connect the fixed stand 9 to this up-and-down moving part. That is, it is only necessary to move at least one of the housing air nozzle 3, the housing recess-shaped air nozzle 4, and the fixing base 9 in the vertical vertical direction to change the relative positions of them. If the fixed base 9 is configured to move up and down, the air injection position in the outer box 2 becomes constant, and the liquid adhering to the housing 1 can be scattered to a predetermined location in the outer box 2 by the air jet. As a result, it is easy to take measures to prevent droplets from splashing outside the outer box 2.

  Further, since the housing air nozzle 3 and the housing recess-shaped air nozzle 4 can be fixed in the outer box 2, it is easy to scatter liquid droplets to a predetermined location in the outer box. The housing air nozzle 3 and the housing recess-shaped air nozzle 4 are connected to a gas supply means and are supplied with a compressed fluid. Therefore, moving the housing air nozzle 3 and the housing recess-shaped air nozzle 4 inevitably increases design requirements such as a complicated structure. On the other hand, such a problem can be avoided if the fixing portion is moved so as to fix the housing air nozzle 3 and the housing recess-shaped air nozzle 4.

Embodiment 2.
The liquid draining apparatus according to the second embodiment of the present invention is the liquid draining apparatus according to the first embodiment except for the casing air nozzle 3, the casing recess-shaped air nozzle 4, the casing air nozzle 13 and their peripheral components. 20 is provided. In the following, the liquid draining device according to the second embodiment will be described focusing on the differences from the liquid draining device 20 according to the first embodiment, and the description of the same points as the liquid draining device 20 will be omitted.

  FIG. 6 is a side view showing the housing air nozzle 3, the housing recess-shaped air nozzle 4, the housing air nozzle 13 and their peripheral configurations according to the second embodiment of the present invention. As described in the first embodiment, the housing 1 has the two main surfaces 1b and 1c facing each other and the side peripheral surface 1d connecting the two surfaces 1b and 1c. The fixing base 9 fixes the casing 1 by holding the side peripheral surface 1d while exposing the two opposing surfaces 1b and 1c.

  The liquid draining device according to the second embodiment includes a housing air nozzle 3 facing the main surface 1b and a housing air nozzle 13 facing the main surface 1c so as to face the two opposing main surfaces 1b and 1c. Is provided. The housing air nozzle 13 includes a housing air injection port 14. The specifications (formation position, shape and number of injection holes, gas injection direction) of the housing air injection port 14 can be the same as the specifications of the housing air injection port 10. Further, the housing air nozzle 13 has the same length (length W1) as the housing air nozzle 3 in the depth direction in FIG. Accordingly, it is possible to drain the back surface (main surface 1 c) of the housing 1 with the same liquid draining performance as that of the housing air nozzle 3.

  Also in the second embodiment, an elevating cylinder 8 as a moving means is provided (not shown), and the nozzle base 7 is connected to the elevating cylinder 8. The lift cylinder 8 moves up and down in a state where gas is injected from the housing air injection port 10, the housing recess-shaped air injection port 12, and the housing air injection port 14. By doing so, a plurality of air ejection ports (the housing air ejection port 10 and the housing are formed on the main surfaces 1b and 1c of the housing 1 while maintaining the ejection direction of the housing air nozzle 3 and the housing air nozzle 13. Each of the body air injection ports 14) slides. As described in the first embodiment, the moving means for changing the relative positions of the fixing base 9 and the casing air nozzle 3, the casing recess-shaped air nozzle 4, and the casing air nozzle 13 is the same as that of the first embodiment. It may be moved up and down.

  In the second embodiment, unlike the first embodiment, the housing air nozzle 13 including the housing air injection port 14 is attached to the nozzle base 7. In the present embodiment, the housing air nozzle 3, the housing recess-shaped air nozzle 4, and the housing air nozzle 13 are arranged so as to sandwich the housing 1 from both sides, which is higher than in the first embodiment. A liquid draining effect can be obtained. That is, it is possible to perform liquid draining collectively on both sides of the semiconductor device while limiting the droplet scattering direction to a part of the direction.

Embodiment 3 FIG.
The liquid draining device according to the third embodiment of the present invention, except for the configuration relating to the housing air nozzle 3, the housing recess-shaped air nozzle 4, the housing air nozzle 13 and the housing air nozzle 17, and the peripheral configuration thereof, A configuration similar to that of the liquid draining device 20 according to the first embodiment is provided. In the following, the liquid draining device according to the third embodiment will be described focusing on the differences from the liquid draining device 20 according to the first embodiment, and the description of the same points as the liquid draining device 20 will be omitted.

  FIG. 7 is a side view showing the housing air nozzle 3, the housing recess-shaped air nozzle 4, the housing air nozzle 13, the housing air nozzle 17 and their peripheral configurations according to the third embodiment of the present invention. In order from the left side of the page, the first gas injection unit (the housing air nozzle 3 and the housing recess shape air nozzle 4) and the second gas injection unit (the housing air nozzle 17 and the housing recess shape) The air nozzle 4) and the third gas injection unit (housing air nozzle 13) are connected and integrated. Each gas injection unit is connected to a nozzle base 7 by a housing air nozzle pipe 5 and a housing recess-shaped air nozzle pipe 6 and is connected to an air pump (not shown). The vertical movement of the nozzle pedestal 7 by the elevating cylinder 8 allows these gas injection portions to move up and down integrally.

  FIG. 8 is an enlarged side view of the configuration of the housing air nozzle 17 according to the third embodiment of the present invention. The housing air nozzle 17 includes an air injection port 15 and an air injection port 16. The specifications of the air injection ports 15 and 16 (formation position, shape and number of injection holes, and gas injection direction) can be the same as those of the case air injection port 10. Further, the housing air nozzle 17 has the same length (length W1) as the housing air nozzle 3 in the depth direction of FIG. Thereby, it is possible to perform liquid draining of the back surface (main surface 1c) of one housing and the front surface (main surface 1b) of another housing 1 with the same liquid draining performance as the housing air nozzle 3. .

  The liquid draining device according to the third embodiment includes a plurality of fixing bases 9, and the outer box 2 is also of a size that can accommodate the plurality of fixing bases 9. Each of the fixing bases 9 fixes the casing 1 so as to be removable. In the third embodiment, the gas such as the housing air nozzle 3 and the housing recessed shape air nozzle 4 is provided so that the gas can be injected into the plurality of housings 1 to which the plurality of fixing bases 9 are respectively fixed. A plurality of injection parts are provided.

  Also in the third embodiment, as in the first embodiment, an elevating cylinder 8 is provided as a moving means (not shown), whereby the nozzle base 7 can be moved up and down. The nozzle pedestal 7 serves as a “connecting portion” that connects the housing air nozzle 3, the housing recess-shaped air nozzle 4, the housing air nozzle 13, and the housing air nozzle 17. According to such a configuration, the air nozzles can be slid while maintaining the ejection directions of the housing air nozzle 3 and the housing recess-shaped air nozzle 4 in a state where the gas is ejected from each.

  In addition to being able to perform liquid draining of a plurality of semiconductor devices in a batch while limiting the direction of droplet splashing, a structure in which a plurality of gas injection units are individually moved because a plurality of gas injection units are connected and moved Compared to (for example, a structure in which each is rotated), the overall configuration can be simplified. Since the connected individual gas injection units slide in the same manner with respect to the plurality of semiconductor devices to perform liquid drainage, uniform liquid drainage quality can be ensured.

  In the present embodiment, the configuration in which the casing air nozzle 3, the casing recess-shaped air nozzle 4, and the casing air nozzle 13 are arranged so as to sandwich one casing 1 is shown. Here, by using the housing air nozzle 17 of FIG. 7, it is possible to inject air jets to both sides of the housing air nozzle 17, and the liquid draining process in two directions can be performed simultaneously. As shown in FIG. 7, the casing air nozzle 3, the casing recessed air nozzle 4, the casing air nozzle 13, and the casing air nozzle 17 are arranged so that the liquid draining processes of the casings arranged in parallel are the same. It is possible to perform a plurality of processes at the same time while ensuring the liquid draining quality.

1 housing, 1a frame, 1b main surface, 1c main surface, 1d side peripheral surface, 2 outer box, 3 housing air nozzle, 4 shape air nozzle, 5 housing air nozzle piping, 6 housing recess shaped air nozzle piping , 7 Nozzle base, 8 Elevating cylinder, 9 Fixed base, 10 Housing air injection port, 11 Housing recessed shape part, 12 Housing recessed shape air injection port, 13 Housing air nozzle, 14 Housing air injection Port, 15 air injection port, 16 air injection port, 17 air nozzle for housing, 20 liquid draining device

Claims (9)

A fixing portion for removably fixing the semiconductor device;
A gas injection unit including one or more gas injection holes facing the semiconductor device fixed by the fixing unit;
Gas supply means for supplying gas to the gas injection unit so as to inject gas from the gas injection hole;
Movement for changing the relative position of the fixed part and the gas injection part so that the gas injection hole slides while keeping the injection direction of the gas injection part in a state where the gas is injected from the gas injection hole Means,
An outer box containing the fixed part and the gas injection part so as to surround at least a scattering position of a droplet blown off by the gas injected from the gas injection hole;
A liquid draining device for a semiconductor device, comprising: The outer box is
A bottom portion provided directly below the fixed portion in the vertical direction;
A side portion covering the periphery of the fixed portion;
Have
The moving means is a lifting cylinder that can be lifted and lowered in a vertical direction,
The gas supply means includes a gas nozzle attached to the elevating cylinder,
The outer box has an opening vertically upward;
2. The liquid draining device for a semiconductor device according to claim 1, wherein the gas nozzle is advanced and retracted into the outer box through the opening when the elevating cylinder moves up and down. The fixing portion fixes a semiconductor device having two opposing surfaces and a side peripheral surface connecting the two surfaces so that the side peripheral surface faces a vertical direction,
The moving means changes the relative position of the fixed part and the gas injection part in the vertical direction,
The gas injection hole injects gas in one or more directions within a range from a horizontal direction facing a side of the semiconductor device fixed by the fixing portion to a vertically lower side. A liquid draining device for a semiconductor device as described.   4. The liquid draining of a semiconductor device according to claim 1, wherein the gas injection unit includes a plurality of gas injection holes in which at least one of a gas injection direction and a gas injection range is different. 5. apparatus. The gas injection part is
A first nozzle portion extending by a first length in a direction intersecting the direction of the slide;
A second nozzle portion extending by a second length in a direction intersecting the direction of the slide;
With
The one or more gas injection holes are a plurality of holes provided side by side in the intersecting direction in the first and second nozzle portions, respectively.
5. The liquid draining device for a semiconductor device according to claim 1, wherein the first length is different from the second length. 6.   The said moving means includes the fixed part moving means to which the said fixed part is moved so that the said gas injection hole may slide in the state which fixed the said gas injection part. 2. A liquid draining device for a semiconductor device according to 1. A plurality of the fixing portions are provided so as to detachably fix a plurality of semiconductor devices,
A plurality of the gas injection parts are provided,
The moving means includes a connecting portion that connects the plurality of gas injection portions, and in a state where gas is injected from each of the gas injection holes provided in the plurality of gas injection portions, the injection direction of the gas injection portion The relative positions of the plurality of fixing portions and the plurality of gas injection portions are changed so that the gas injection holes slide on the semiconductor devices fixed to the plurality of fixing portions, respectively. The liquid draining apparatus for a semiconductor device according to claim 1, wherein the liquid draining apparatus is a semiconductor device. The semiconductor device has two opposing surfaces and a side peripheral surface connecting the two surfaces,
The fixing portion fixes the semiconductor device by holding the side peripheral surface while exposing the two opposing surfaces.
The gas injection unit includes a plurality of gas injection holes facing the two opposing surfaces,
The moving means is configured to cause the plurality of gas injection holes to slide while maintaining the injection direction of the gas injection unit in a state where gas is injected from the gas injection holes. The liquid draining device for a semiconductor device according to claim 1, wherein the relative position of the semiconductor device is changed. A step of fixing the semiconductor device after being immersed in the plating solution by the plating step;
Preparing a gas injection unit including one or more gas injection holes facing the fixed semiconductor device, and supplying gas to the gas injection unit so as to inject gas from the gas injection holes;
Movement for changing the relative position of the fixed part and the gas injection part so that the gas injection hole slides while keeping the injection direction of the gas injection part in a state where the gas is injected from the gas injection hole Process,
A liquid draining method for a semiconductor device, comprising:

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