JP2014116269A - Organic electroluminescent element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic electroluminescent element capable of restraining an extraction electrode from being damaged and having high connection reliability.SOLUTION: The present invention relates to an organic electroluminescent element in which an organic luminescent body 10 having a first electrode 7, an organic luminescent layer 8, and a second electrode 9 in that order is formed on the surface of a substrate 1, the organic luminescent body 10 being encapsulated by being covered with a sealing member 2 bonded to the substrate 1. An electrode lead-out part 11 is provided on an end-portion surface of the substrate 1 while being led out, in a plan view, to the exterior from the sealing member 2. An extraction electrode 3 for connecting to an external power supply is provided on the surface of the electrode lead-out part 11. An end portion of the sealing member 2 is provided with a substrate proximity structure 4 on both sides of an extension region 30 of the extraction electrode 3 being extended, in a plan view, to the interior side of the element, in which structure the sealing member 2 is closer to the substrate 1 side than the extension region 30.

Description

  The present invention relates to an organic electroluminescence element.

  In recent years, organic electroluminescence elements (hereinafter also referred to as “organic EL elements”) have been applied to uses such as lighting panels. As an organic EL element, a translucent first electrode, an organic layer composed of a plurality of layers including a light emitting layer, and a second electrode paired with the first electrode are arranged in this order. A laminate is formed on the surface, and the laminate is sealed with a sealing material. In the organic EL element, by applying a voltage between two electrodes, light emitted from the light emitting layer is extracted to the outside through the translucent electrode and the substrate.

  In the organic EL element, a method is known in which a plurality of organic EL elements are manufactured as a connected body of organic EL elements connected in a planar shape with a substrate, and then the substrate is divided to be individualized and manufactured. (For example, refer to Patent Document 1). This is a so-called multi-chamfer manufacturing method. By simultaneously producing a plurality of organic EL elements, an organic EL element can be obtained efficiently.

JP 2009-295370 A

  FIG. 8 is an example of manufacturing a conventional organic EL element, and shows a cross-sectional view of an end when the organic EL element is individualized. In an organic EL element, in order to facilitate connection with an external electrode, the end portion of the substrate 1 may protrude outwardly from the sealing material 2 and the extraction electrode 3 may be provided on the surface of the end portion of the substrate. In FIG. 8, the extraction electrode 3 is provided on the surface of the electrode lead portion 11 drawn from the inside of the seal to the outside of the seal. As described above, when the extraction electrode 3 is provided at the end of the substrate, the extraction electrode 3 is exposed to the outside, which facilitates connection to an external power source.

  In the organic EL element in which the extraction electrode 3 is provided at the end of the substrate, the positions of the outer edges of the end of the substrate 1 and the end of the sealing material 2 are not aligned, and the outer edge of the sealing material 2 is the substrate 1. It will be arranged inside the outer edge of. When manufacturing such an organic EL element, it is necessary to divide the sealing material 2 and the substrate 1 in steps in a method of individualizing from a connected body of a plurality of organic EL elements.

  For example, as shown in FIG. 8, after the sealing material 2 and the substrate 1 are cut at different edge positions, the organic material is removed by removing the end material 20 formed by the unnecessary portion of the sealing material 2. The EL element can be obtained separately. At this time, as indicated by a broken line in FIG. 8, another organic EL element connected by the substrate 1 may exist adjacent to the organic EL element from which the end material 20 is removed from the sealing material 2. And it does not have to exist. Moreover, the organic EL element to which the end material 20 is connected and the organic EL element to which the end material 20 is not connected may be formed by dividing, and then the end material 20 may be removed.

  Here, as shown in FIG. 8, in the division of the organic EL element assembly, when the end material 20 is removed, the end material 20 may hit the extraction electrode 3 and the extraction electrode 3 may be damaged. If the extraction electrode 3 is damaged, good electrical connection cannot be made, which may cause a light emission failure or destabilize the element. For example, when wire bonding is performed on the surface of the take-out electrode 3, there is a risk of causing a bonding failure. Further, if the end material 20 is to be removed so as not to come into contact with the take-out electrode 2, the accuracy of the removal work is required, and the manufacturing may become complicated. Further, even in a manufactured organic EL element, when the distance between the substrate 1 and the sealing material 2 becomes short due to deformation or the like, the sealing material 2 may come into contact with the take-out electrode 3 to easily cause power feeding failure. is there.

  Patent Document 1 discloses a technique for cutting a sealing material by providing a protective member on an opposing surface. However, in the method of this document, only the protective member is provided on the opposing surface, and there is a possibility that the electrode layer and the sealing material may come into contact with each other, so that the extraction electrode may not be sufficiently protected. . Moreover, although protection at the time of manufacture is considered, it cannot be said that the protection of the electrode layer after manufacture is sufficient.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an organic electroluminescence element having high connection reliability, which can prevent the extraction electrode from being damaged.

In the organic electroluminescence device according to the present invention, an organic light emitter having a first electrode, an organic light emitting layer, and a second electrode in this order is formed on the surface of the substrate, and the organic light emitter is bonded to the substrate. An organic electroluminescence element covered and sealed with a sealing material,
An electrode lead portion electrically connected to at least one of the first electrode and the second electrode is provided on the surface of the end portion of the substrate so as to be drawn outward in a plan view from the sealing material,
On the surface of the electrode lead portion, an extraction electrode for connection with an external power source is provided,
At the end portion of the sealing material, a substrate approach structure in which the sealing material is closer to the substrate side than the extended region on both sides of the extended region where the extraction electrode is extended to the inside of the element in a plan view. Is provided.

  In one preferred embodiment, the substrate approaching structure is formed in such a manner that the vicinity of the extended region is formed by being recessed at an end of the sealing material and by providing a recess in the sealing material.

  It is a preferable aspect that the substrate approaching structure is formed by projecting a part of the sealing material on both sides of the extended region and providing a convex portion.

  It is preferable that the concave portion has a maximum concave amount at the edge of the sealing material.

  The concave portion is preferably a curved surface having a concave or convex side surface.

  The recess preferably has a recess depth larger than the thickness of the extraction electrode.

  It is preferable that a buffer layer having a lower hardness than the extraction electrode is provided on the surface of the end portion of the sealing material on the substrate side. In this case, the buffer layer is preferably made of a resin.

  According to the present invention, since the sealing material is provided with the substrate approaching structure, it is possible to prevent the extraction electrode from being damaged, so that an organic electroluminescence element with high connection reliability can be obtained.

An example of embodiment of an organic electroluminescent element is shown, (a) is sectional drawing, (b) is a perspective view, (c) is the enlarged plan view which cut | disconnected a part. An example of the manufacturing method of an organic electroluminescent element is shown, (a) is sectional drawing before individualization, (b) is a partial sectional view at the time of manufacture, (c) is a partial perspective view at the time of manufacture. . An example of the organic electroluminescent element before individualization is shown, (a) and (b) are sectional views. An example of the organic electroluminescent element before individualization is shown, (a) is sectional drawing, (b) is (i)-(i) sectional drawing of (a). An example of embodiment of an organic electroluminescent element is shown, (a) is sectional drawing, (b) is a partial perspective view. An example of the manufacturing method of an organic electroluminescent element is shown, (a) is sectional drawing before individualization, (b) is a partial sectional view at the time of manufacture, (c) is a partial perspective view at the time of manufacture. . An example of the organic electroluminescent element before individualization is shown, (a) is sectional drawing, (b) is (i)-(i) sectional drawing of (a). It is sectional drawing which shows an example of the manufacturing method of the conventional organic electroluminescent element.

  FIG. 1 shows an example of an embodiment of an organic electroluminescence element (organic EL element). FIG. 1A is a cross-sectional view of an organic EL element. For easy understanding of the element configuration, an end on the first electrode lead portion 11a side is shown on the left side, and an end on the second electrode lead portion 11b side is shown on the right side. Shows the part. FIG. 1B is a perspective view. FIG. 1C is an enlarged plan view in which the sealing material 2 is cut in a direction parallel to the surface of the substrate 1 and the vicinity of the extraction electrode 3 is viewed from a direction perpendicular to the surface of the substrate 1.

  As shown in FIG. 1, the organic EL element has an organic light emitting body 10 having a first electrode 7, an organic light emitting layer 8, and a second electrode 9 in this order on the surface of a substrate 1. The body 10 is covered and sealed with a sealing material 2 bonded to the substrate 1. In the organic EL element, an electrode lead portion 11 electrically connected to at least one of the first electrode 7 and the second electrode 9 is drawn to the outer surface in a plan view from the sealing material 2 on the end surface of the substrate 1. Is provided. On the surface of the electrode lead-out portion 11, a lead-out electrode 3 for connecting to an external power source is provided. At the end of the sealing material 2, the sealing material 2 is closer to the substrate 1 side than the extension region 30 on both sides of the extension region 30 in which the extraction electrode 3 is extended to the inside of the element in plan view. The substrate approaching structure 4 is provided. The plan view refers to a case when viewed from a direction perpendicular to the surface of the substrate 1.

  In this embodiment, since the substrate approach structure 4 is provided in the sealing material 2, it is possible to prevent the extraction electrode 3 from being damaged. That is, when the organic EL element is individualized, when removing the end material 20 from the sealing material 2, the substrate approach structure 4 formed on both sides of the extraction electrode 3 hits the surface of the substrate 1, and the end material 20 is The contact with the surface of the extraction electrode 3 can be suppressed. Therefore, the end material 20 can be easily removed, and it is possible to prevent the take-out electrode 3 from being damaged when the end material 20 is removed, leading to a decrease in conductivity, poor power supply, and the like. Moreover, in the organic EL element after individualization, since the substrate approach structure 4 is provided outside the region of the extraction electrode 3, the sealing material 2 is deformed by bending or the like, and the sealing material 2 and the substrate are deformed. Even when the distance from 1 approaches, the substrate approaching structure 4 of the sealing material 2 hits the substrate 1 first, and the contact between the extraction electrode 3 and the sealing material 2 is suppressed. As a result, the organic EL element of this embodiment can be easily manufactured and has excellent connection reliability. Hereinafter, the organic EL element of this embodiment will be further described.

  The substrate 1 is preferably a transparent substrate 1 having optical transparency, and a glass substrate or the like can be used. When the substrate 1 is formed of a glass substrate, the glass has low moisture permeability, so that moisture can be prevented from entering the sealed region. A light extraction layer may be provided at the interface with the first electrode 7 on the surface of the substrate 1. By providing the light extraction layer, the light extraction performance can be improved. The light extraction layer can be formed of a resin layer having a higher refractive index than glass, a resin layer containing light scattering particles, high refractive index glass, or the like. In this embodiment, the substrate 1 has a rectangular shape.

  The organic light emitter 10 is a laminate of the first electrode 7, the organic light emitting layer 8, and the second electrode 9. The region where the organic light emitter 10 is provided is a central region of the substrate 1 in plan view (when viewed from a direction perpendicular to the substrate surface). In the organic EL element, a region where the organic light emitter 10 is provided in a plan view is a light emitting region.

  The 1st electrode 7 and the 2nd electrode 9 are electrodes which become a pair mutually, and one side comprises an anode and the other comprises a cathode. In this embodiment, the first electrode 7 can constitute an anode and the second electrode 9 can constitute a cathode, but the reverse may also be possible. The first electrode 7 preferably has light transparency. In this case, the first electrode 7 is an electrode on the light extraction side. The first electrode 7 can be constituted by a transparent conductive layer. Examples of the material for the conductive layer include ITO and IZO. The second electrode 9 may have light reflectivity. In that case, light from the light emitting layer emitted toward the second electrode 9 side can be reflected by the second electrode 9 and extracted from the substrate 1 side. The second electrode 9 may be a light transmissive electrode. When the second electrode 9 is light transmissive, it is possible to adopt a structure in which light is extracted from the surface on the sealing material 2 side. Alternatively, when the second electrode 9 is light transmissive, a light reflecting layer is provided on the surface of the second electrode 9 opposite to the organic light emitting layer 8 so that the light traveling in the direction of the second electrode 9 can be transmitted. It can be reflected and taken out from the substrate 1 side. The second electrode 9 can be formed of, for example, Al or Ag. Although the film thickness of the 1st electrode 7 and the 2nd electrode 9 is not specifically limited, For example, it can be about 10-300 nm.

  The organic light emitting layer 8 is a layer having a function of causing light emission, and is appropriately selected from a hole injection layer, a hole transport layer, a light emitting layer (a layer containing a light emitting material), an electron transport layer, an electron injection layer, an intermediate layer, and the like. And a plurality of functional layers. Although the thickness of the organic light emitting layer 8 is not specifically limited, For example, it can be set to about 60-300 nm.

  In the organic EL element, a voltage is applied to the first electrode 7 and the second electrode 9, and holes and electrons are combined in the organic light emitting layer 8 (light emitting material-containing layer) to cause light emission. Therefore, it is necessary to provide an electrode that is electrically connected to each of the first electrode 7 and the second electrode 9 so as to be drawn to the end portion of the substrate. The extracted electrode is electrically connected to the extraction electrode 3 which is a terminal for electrical connection with the external electrode. In this embodiment, an electrode lead portion 11 that is electrically connected to the first electrode 7 and the second electrode 9 is provided on the surface of the substrate 1 so that a voltage can be applied to the organic light emitting layer 8.

  The electrode lead portion 11 is formed on the end surface of the substrate 1. The electrode lead portion 11 includes a first electrode lead portion 11 a that is electrically connected to the first electrode 7 and a second electrode lead portion 11 b that is electrically connected to the second electrode 9. In the present embodiment, the electrode lead portion 11 is formed by a conductive layer that constitutes the first electrode 7.

  The first electrode lead portion 11a is formed by the conductive layer constituting the first electrode 7 being drawn out without being divided to the end portion side of the substrate 1 and extending outward. That is, the conductive layer constituting the first electrode 7 is formed so as to protrude from the sealing material 2 to the end portion of the substrate 1 at the end portion where the first electrode lead portion 11 a is provided. By extending the first electrode lead portion 11a that is electrically connected to the first electrode 7 to the outside of the sealing region, the outside of the sealing region and the inside of the element can be electrically connected. Thus, if the 1st electrode extraction part 11a is formed by extending the 1st electrode 7, the 1st electrode extraction part 11a can be formed easily.

  Further, in this embodiment, the second electrode lead portion 11b is separated from the first electrode 7 by a part of the conductive layer for forming the first electrode 7, and is drawn to the end side of the substrate 1 to the outside. It is formed by extending toward. That is, the conductive layer constituting the second electrode lead portion 11 b is separated from the first electrode 7 and protrudes from the sealing material 2 to the end portion of the substrate 1. By extending the second electrode lead portion 11b that is electrically connected to the second electrode 9 to the outside of the sealing region, the outside of the sealing region and the inside of the element can be electrically connected. Then, when the second electrode lead portion 11b is formed by the patterned conductive layer, the second electrode lead portion 11b can be easily formed. The second electrode lead portion 11b is in contact with the stacked second electrodes 9 inside the element, and the second electrode lead portion 11b and the second electrode 9 are thereby electrically connected.

  In the form of FIG. 1, the electrode lead portion 11 extends to the edge of the substrate 1. When the edge of the electrode lead-out portion 11 is located at the edge of the substrate 1, the device is manufactured using the large substrate 1 having the conductive layer formed on the entire surface when the organic EL device connection body is manufactured. Thus, the device can be easily manufactured. In addition, a plurality of organic EL elements after individualization can be arranged in a plane to form a lighting device. In this case, if the electrode lead-out portion 11 is formed up to the edge of the substrate 1, other This makes it easy to electrically connect the organic EL element at a required location. Further, a structure in which the electrode lead portion 11 is not formed up to the edge of the substrate 1 is also preferable. For example, the electrode lead portion 11 may be formed in a range slightly smaller than the outer peripheral edge of the substrate 1. If the electrode lead-out portion 11 is not formed up to the edge of the substrate 1, when organic EL elements are arranged in a planar shape, an insulation distance can be secured in adjacent organic EL elements, and short-circuit defects are suppressed. Can do.

  The first electrode 7, the first electrode lead portion 11a, and the second electrode lead portion 11b can be formed using the same conductive material. Thereby, an organic EL element can be manufactured easily. The conductive layer of the first electrode 7 can be formed of, for example, a transparent metal oxide. Specifically, for example, this conductive layer can be made of ITO. The thickness of the conductive layer is not particularly limited, but can be in the range of 0.01 to 0.5 μm. Preferably, for example, the thickness of the conductive layer can be about 0.1 to 0.2 μm.

  The extraction electrode 3 is provided on the surface of the electrode lead portion 11. The extraction electrode 3 is for connection with an external power source. The extraction electrode 3 may be formed as a terminal such as a so-called external electrode pad. Since an external power source can be connected by the extraction electrode 3, durability against electrical connection such as wire bonding can be enhanced, and connectivity with the external power source can be improved. Further, when the extraction electrode 3 is provided, it is possible to assist the energization of the electrode extraction portion 11.

  A plurality of extraction electrodes 3 are provided corresponding to the electrode lead-out portion 11 and are electrically connected to each of the first electrode 7 and the second electrode 9. Among the extraction electrodes 3, the one provided on the surface of the first electrode lead portion 11 a becomes the extraction electrode 3 that is electrically connected to the first electrode 7. Further, among the extraction electrodes 3, the one provided on the surface of the second electrode lead portion 11 b becomes the extraction electrode 3 that is electrically connected to the second electrode 9. The extraction electrode 3 conducting to the first electrode 7 and the extraction electrode 3 conducting to the second electrode 9 are not in contact with each other and are electrically insulated. As a result, it is possible to supply power without causing an electrical short circuit.

  The extraction electrode 3 can be formed of an appropriate metal layer. The extraction electrode 3 is formed in a non-light emitting region outside the sealing region, and does not have to be formed as a transparent layer. Therefore, an appropriate conductive material can be used and the thickness can be secured, so that high electrical conductivity can be obtained. Further, since the extraction electrode 3 can enhance the electrical conductivity, it can also provide a function as an auxiliary electrode. The material of the extraction electrode 3 may be copper, silver, gold, aluminum, nickel, molybdenum or the like. The take-out layer 3 may be made of MAM (molybdenum / aluminum / molybdenum laminate) or the like.

  The sealing material 2 is configured by a sealing substrate (sealing substrate) disposed to face the substrate 1. An accommodation recess 14 that is recessed inward in the thickness direction is formed in an inner region of the sealing material 2 in plan view. By providing the housing recess 14, a sealing side wall 15 protruding from the surface on the substrate 1 side is formed on the outer peripheral portion of the sealing material 2. The sealing side wall 15 may be provided so as to surround the outer periphery of the organic light emitter 10. Thus, by providing the accommodation recessed part 14, the organic light-emitting body 10 can be accommodated in the accommodation recessed part 14, and can be sealed. Moreover, by providing the sealing side wall 15, while being able to ensure the space for the thickness of the organic light-emitting body 10, the side sealing property can be improved and sealing can be performed with good sealing property.

  The sealing material 2 can be formed using a substrate material having low moisture permeability. For example, a glass substrate can be used as the sealing material 2. By using a glass substrate, it is possible to prevent moisture from entering. In the case where the sealing side wall 15 is provided integrally with the sealing material 2 as in this embodiment, since the sealing side wall 15 can be made of glass, moisture intrusion can be highly suppressed. . What the sealing side wall 15 is formed as a part of the sealing material 2 is a so-called cap-shaped sealing material 2. When a glass material is used, cap glass can be used as the sealing material 2.

  The sealing material 2 is bonded to the substrate 1 with an adhesive layer 13. The adhesive layer 13 can be made of an adhesive material. The adhesive material may be an appropriate material such as a fluid material or a tape material. As the adhesive material, for example, a resinous adhesive material can be used. The resinous adhesive material preferably has moisture resistance. For example, moisture resistance can be improved by containing a desiccant. The resinous adhesive material may be mainly composed of a thermosetting resin or an ultraviolet curable resin. The adhesive layer 13 is provided at the position of the sealing side wall 15.

  The thickness of the adhesive layer 13 may be larger than the thickness of the extraction electrode 3. In that case, it becomes easier to provide the extraction electrode 3 so as to overlap the sealing material 2 in plan view. Further, the thickness of the adhesive layer 13 may be smaller than the thickness of the extraction electrode 3. In that case, the thickness can be reduced.

  In the organic EL element, the sealing gap formed by the housing recess 14 may have a hollow structure formed as a sealed space that is a cavity. For example, when the cap glass-like sealing material 2 having the housing recess 14 is used, the sealing space can be formed by making the housing recess 14 hollow. When the sealing gap is used as a sealing space, a desiccant can be provided in the sealing space. Thereby, even if moisture enters the sealed space, the moisture that has entered can be absorbed.

  The sealing gap may be a filled and sealed structure filled with a sealing filler. When the sealing gap is filled with the sealing filler, a filler containing a desiccant can be used. Thereby, even if moisture enters the inside of the element, the penetrated moisture can be absorbed. The filler preferably contains a desiccant and has adhesiveness.

  In the organic EL element, the sealing material 2 having a flat surface may be used, and sealing may be performed with the thickness of the adhesive layer 13 larger than the thickness of the organic light emitter 10. In that case, the adhesive layer 13 forms a side wall for sealing. At this time, the sealing gap may have a filling structure. In that case, the adhesive layer 13 can function as a dam layer that clogs when filling with the filler. When the sealing material 2 having a flat surface is used, the housing recess 14 for sealing the organic light-emitting body 10 does not need to be provided, and sealing can be performed easily.

  The housing recess 14 of the sealing material 2 can be obtained by digging the surface of the sealing material 2. The digging process may be performed when the sealing material 2 is connected before individualizing the organic EL element. Thereby, the engraving process can be performed efficiently to form the housing recess 14.

  It is preferable that the sealing material 2 has a portion protruding outward from the adhesive layer 13. In that case, since the sealing material 2 can be cut at a portion outside the adhesive layer 13 when individualizing the organic EL element, it becomes difficult to remove the cut end material 20 or the adhesive layer at the time of cutting. 13 can be prevented from being damaged, workability can be improved, and sealing performance can be improved. When the sealing material 2 protrudes outward from the adhesive layer 13, a non-adhesive portion where the adhesive layer 13 is not provided is provided on the outer peripheral edge of the sealing material 2.

  The extraction electrode 3 is provided on the surface of the substrate 1 at a portion outside the sealing material 2, but the sealing material 2 and the extraction electrode 3 partially overlap when viewed in plan. It does not have to be duplicated. When the sealing material 2 and the extraction electrode 3 overlap, the extraction electrode 3 is provided on the surface of the electrode lead-out portion 11 including a position facing the non-adhered portion of the sealing material 2. In this way, by providing the extraction electrode 3 in a region overlapping with the sealing material 2 in plan view, the extraction electrode 3 can be provided in a wider range, so that the connectivity with the external electrode can be improved. In addition, it is possible to enhance the current-carrying assisting property for the electrode layer of the organic light emitter 10. In addition, since the position of the extraction electrode 3 can be further arranged on the inner side, the non-light emitting region can be narrowed to increase the ratio of the light emitting area. However, when the sealing material 2 and the extraction electrode 3 overlap, it is preferable that the sealing material 2 and the extraction electrode 3 do not contact each other. Thereby, it is possible to suppress the take-out electrode 3 from being damaged by the sealing material 2. For example, by making the thickness of the adhesive layer 13 larger than the thickness of the extraction electrode 3, it is possible to prevent the extraction electrode 3 and the sealing material 2 from contacting each other. In addition, as described below, the recess 5 is provided at the end of the sealing material 2 in a range larger than the range where the extraction electrode 3 overlaps the sealing material 2 in plan view, thereby sealing the extraction electrode 3 and the sealing electrode 2. It is possible to prevent the stopper material 2 from coming into contact. In this case, the thickness of the adhesive layer 13 may be made thinner than the thickness of the extraction electrode 3, and the length obtained by adding the depth of the recess 5 and the thickness of the adhesive layer 13 may be larger than the thickness of the extraction electrode 3. . If it does so, it will become possible to accommodate the taking-out electrode 3 in the recessed part 5 of the sealing material 2, and it can arrange | position the taking-out electrode 3 and the sealing material 2 overlappingly in planar view, reducing in thickness.

  Further, the sealing material 2 and the extraction electrode 3 may not overlap each other in plan view. In that case, since the extraction electrode 3 does not sink into the gap between the substrate 1 and the sealing material 2, there is a possibility that the connection of the external power supply becomes easy.

  In this embodiment, the sealing material 2 is closer to the substrate 1 side than the extension region 30 on both sides of the extension region 30 where the extraction electrode 3 is extended to the inside of the element in a plan view. The substrate approaching structure 4 is provided at the end of the sealing material 2. The substrate approach structure 4 is not provided at a position facing the extraction electrode 11 of the sealing material 2. That is, the substrate approaching structure 4 is provided at a position where the sealing material 2 does not face the extraction electrode 11. The substrate approach structure 4 may be a structure formed by shortening the separation distance between the sealing material 2 and the substrate 1. The substrate approach structure 4 may be provided along the outer edge of the extraction electrode 3 on the element inner side when the organic EL element is viewed in plan. When the substrate approaching structure 4 is provided, when the sealing material 2 approaches the substrate 1 side, the substrate approaching structure 4 first hits the substrate 1 and the sealing material 2 is prevented from directly contacting the take-out electrode 3. . Therefore, damage to the extraction electrode 3 can be suppressed.

  As shown in FIG. 1, in this embodiment, the substrate approach structure 4 is formed by recessing the vicinity of the extension region 30 at the end of the sealing material 2 and providing the recess 5 in the sealing material 2. When the concave portion 5 is provided, the periphery of the concave portion 5 protrudes, so that the substrate approaching structure 4 can be formed by the protruding portion outside the concave portion 5. As shown in FIG. 1C, the extended region 30 of the extraction electrode 3 is a region formed by extending the outer edge on the side of the extraction electrode 3 toward the inside of the element. The extension may be in a direction perpendicular to the edge of the sealing material 2. Thus, by providing the recess 5 at the end of the sealing material 2 in the vicinity of the extended region 30 of the extraction electrode 3, the substrate approaching structure 4 lifts the portions on both sides of the recess 5 toward the substrate 1. Will be formed. Therefore, when the sealing material 2 approaches the substrate 1 side, the substrate approaching structure 4 contacts the substrate 1 before it contacts the extraction electrode 3, so that the extraction electrode 3 and the sealing material 2 are in contact with each other. It can be suppressed.

  When the sealing material 2 and the extraction electrode 3 overlap in plan view, the recess 5 may be provided so as to include an area overlapping with the extraction electrode 3. When the sealing material 2 and the extraction electrode 3 do not overlap in plan view, the recess 5 may be provided in a shape along the outer edge of the extraction electrode 3 on the inner side of the element.

  In the organic EL element of this embodiment, by providing the substrate approach structure 4, it is possible to prevent the extraction electrode 3 from being damaged by the end material 20 generated from the sealing material 2 when the organic EL element is individualized. Can do. Hereinafter, the production of the organic EL element will be described.

  FIG. 2 shows an example of a method for manufacturing an organic EL element. FIG. 2 (a) shows a state before individualizing the organic EL element, and FIGS. 2 (b) and 2 (c) Some examples are shown. FIGS. 2B and 2C show a state in which the end material 20 generated from the sealing material 2 is removed. In FIG.2 (c), the sealing material 2 is removed and shown in figure so that the mode of manufacture may be understood easily.

  The organic EL element of this embodiment is obtained by individualizing an organic EL element coupling body in which a plurality of organic light emitters 10 are formed in a plane direction between a large substrate 31 and a large sealing material 32. Can do. As the organic EL element coupling body, a structure in which the recessed portion 33 is formed on the large-sized sealing material 32 including a region overlapping with the extraction electrode 3 in a plan view can be used. Individualization can be performed at the position of the recess 33. This will be further described below.

  In the manufacture of an organic EL element, a large substrate 31 having a plurality of substrates 1 and a large sealing material 32 having a plurality of sealing materials 2 are prepared.

  First, a transparent conductive layer is formed in a pattern on the surface of a large substrate 31 to which a plurality of substrates 1 are connected, and the first electrode 7 and the electrode lead portion 11 are formed. The transparent conductive layer may be formed so as to straddle the section of the organic EL element. The central portion of the transparent conductive layer in one section of the organic EL element is the first electrode 7. Moreover, the electrode lead-out part 11 is formed by the edge part of the transparent conductive layer in one division of an organic EL element. Next, a plurality of layers constituting the organic light emitting layer 8 are sequentially laminated on the surface of the first electrode 7, and then a second electrode layer 9 is laminated on the organic light emitting layer 8. Thereafter, the extraction electrode 3 is formed on the surface of the electrode lead portion 11. The extraction electrode 3 may be formed after the conductive layer constituting the first electrode 7 is laminated and before the organic light emitting layer 8 is laminated. Alternatively, the auxiliary electrode layer may be formed by laminating the material of the extraction electrode 3 on the surface of the transparent conductive layer outside the organic light emitter 10 in the sealing region. The organic light emitting layer 8 and the second electrode layer 9 can be laminated and formed for each section of the organic EL element in an appropriate pattern. The extraction electrode 3 can be formed at the end of one section of the organic EL element. Although FIG. 2 shows an example in which the extraction electrode 3 is formed separately for each organic EL element, the extraction electrode 3 may be formed across the section of adjacent organic EL elements. In that case, there is a possibility that the pattern of the extraction electrode 3 becomes simple and the manufacture becomes easy. However, if the extraction electrode 3 is formed across the sections, the extraction electrode 3 may be destroyed at the time of cutting. Therefore, it is preferable to form the extraction electrode 3 so as not to straddle the sections. preferable. Appropriate methods, such as vapor deposition, application | coating, sputtering, can be used for lamination | stacking of a layer. A laminated body in which the first electrode 7, the organic light emitting layer 8, and the second electrode 9 are laminated becomes the organic light emitting body 10.

  Next, the organic light emitting body 10 is sealed with a large-sized sealing material 32 in which a plurality of sealing materials 2 are connected. For sealing the organic light emitter 10, the adhesive layer 13 is provided on the surface of the large substrate 31 so as to surround each organic light emitter 10, or the adhesive layer 13 is provided at the outer periphery of each housing recess 14 of the large sealant 32. The large substrate 31 and the large sealing material 32 can be bonded to each other with the adhesive layer 13. The organic light emitter 10 is sealed by the curing of the adhesive layer 13.

  FIG. 2A shows the organic EL element after sealing and before individualization. The organic EL element is formed as a connection body (organic EL element connection body) in which a plurality of organic EL elements are connected by the substrate 1 and the sealing material 2. An organic EL element can be obtained by dividing and individualizing the substrate 1 and the sealing material 2 from such a combined organic EL element.

  In this embodiment, the large-sized encapsulant 32 can be provided with a depression whose surface is depressed in advance for each section of the organic EL element before sealing. The depression can be provided by digging. The digging process can be performed by etching, blasting, or the like. Etching can be performed with hydrofluoric acid or the like. The blast may be sand blast. Moreover, a hollow may be formed by denting the surface of the large sized sealing material 32 by a high temperature press.

  By providing a recess in the center of each section of the organic EL element, the housing recess 14 of the sealing material 2 can be formed. Moreover, the recessed part 5 in the edge part of the sealing material 2 is formed by providing the hollow part 33 as a hollow in the edge part (edge part of the sealing material 2) of the division of the organic EL element in the large-sized sealing material 32. be able to. By forming the recess 5 (the recess 33), the periphery of the recess 5 protrudes from the recess 5 and rises to form the substrate approaching structure 4.

  It is preferable to provide simultaneously the dent which comprises the accommodation recessed part 14, and the dent for forming the recessed part 5 (dent part 33). Thereby, the recessed part 33 can be formed efficiently.

  The housing recess 14 can be formed with a size larger than that of the organic light emitter 10. Thereby, the organic light emitter 10 can be accommodated and sealed. Moreover, the depth of the accommodation recessed part 14 can be made into the magnitude | size beyond the thickness of the organic light-emitting body 10, and when providing a desiccant, the magnitude | size more than the part which added the organic light-emitting body 10 and the thickness of the desiccant. Can be. Thereby, it can suppress that the sealing material 2 and a desiccant contact the organic light-emitting body 10. FIG.

  The depths of the housing recess 14 and the recess 5 (the recess 33) may be the same, or one of them may be deeper. In the case where the depths of the housing recess 14 and the recess 5 are substantially the same, the recess 33 constituting each can be formed under the same conditions, and the recess 33 can be easily formed. Moreover, when the depth of the accommodation recessed part 14 is deeper than the depth of the recessed part 5, the organic light-emitting body 10 can be sealed more safely. Moreover, when the depth of the recessed part 5 is deeper than the depth of the accommodation recessed part 14, the sealing material 2 can be cut | disconnected easily.

  The recess 33 constituting the recess 5 of the sealing material 2 may have a depth of about 10 to 50 μm. Thereby, while being able to produce the hollow part 33 easily, the contact of the taking-out electrode 3 and the end material 20 can be suppressed.

  As shown in FIG. 2 (a), between the sealing materials 2 of the adjacent organic EL elements, the end material 20 cut out and removed from the large-sized sealing material 32 at the time of division is integrally connected and disposed. doing. Here, the recess 33 constituting the recess 5 is also formed in the end material 20 across the end edge of the sealing material 2. And in the end material 20, the recessed part 22 of the end material 20 is formed from the hollow part 33. FIG.

  The dent 33 may be formed so as to straddle adjacent organic EL element sections. Thereby, the hollow part 33 can be formed easily. Moreover, the hollow part 33 may be one in which the end of the sealing material 2 is depressed for each section of each organic EL element. Thereby, the formation area of a hollow part can be reduced.

  The recess 33 constituting the recess 5 is preferably provided so as not to overlap with the extraction electrode 3 in plan view when the large substrate 31 and the large sealing material 32 are bonded together. Thereby, the contact between the extraction electrode 3 and the end material 20 can be further suppressed.

  As shown in FIG. 2A, the cutting can be performed along the cutting line L. In the substrate 1, the substrate 1 can be cut in adjacent organic EL elements along the cutting line L <b> 1. In the sealing material 2, the sealing material 2 can be cut by a cutting line L <b> 2 provided inside the element from the position of the outer edge of the substrate 1. Thereby, the extraction electrode 3 can be exposed at the end of each organic EL element. At this time, between the adjacent organic EL elements, the end material 20 is generated by being cut out from an unnecessary portion of the large-sized sealing material 32. In addition, when the sealing material 2 is cut so that the outer edge of the sealing material 2 is arranged on the inner side of the outer edge of the substrate 1 at the end portion of the organic EL element connector, the edge material 20 is generated. .

  At this time, as indicated by a broken line in FIG. 2B, there is another organic EL element connected by the substrate 1 adjacent to the organic EL element from which the end material 20 is removed from the sealing material 2. It does not have to be present. Moreover, the organic EL element to which the end material 20 is connected and the organic EL element to which the end material 20 is not connected may be formed by dividing, and then the end material 20 may be removed.

  The cutting can be performed by providing a groove-like cut on the surface of the base material constituting the large substrate 31 and the large sealing material 32 and dividing the base material at this portion. This is a so-called scribing method. In scribing, in the case of a glass substrate, it becomes possible to cut efficiently and easily. The scribing can be performed by an appropriate cutting means such as a cutting blade or a laser. The scribing can be performed by a scribing device.

  Then, the large substrate 31 is separated along the cut, and the large sealing material 32 is separated along the cut. By the separation, the substrate 1 and the sealing material 2 are separated in steps. At this time, the end material 20 is removed from a portion unnecessary as the sealing material 2 in the large-sized sealing material 32. Thereby, the sealing material 2 and the board | substrate 1 are parted from the adjacent organic EL element, and the individualized organic EL element as shown in FIG. 1 can be obtained. In an individualized organic EL element, an external power source can be taken out and connected to the electrode 3 by an appropriate wiring connection method such as wire bonding. At this time, in this embodiment, since damage to the extraction electrode 3 is suppressed, bonding connectivity can be improved, and occurrence of poor conduction due to bonding failure or the like can be reduced.

  In the organic EL element in the form of FIG. 1, the end material 20 is generated by cutting the substrate 1 and the sealing material 2 at different positions at the end where the extraction electrode 3 is provided. In the edge part which is not provided, the board | substrate 1 and the sealing material 2 may be cut | disconnected in the same position. In that case, the end material 20 does not have to be generated from the end portion where the extraction electrode 3 is not provided.

  As shown in FIG. 2, in this embodiment, the end material 20 is provided with a recess 22 of the end material 20 that communicates with the recess 5 of the sealing material 2 by a recess 33 of the large-size sealing material 32. . The recessed portion 33 of the large sealing material 32 constitutes the concave portion 22 of the end material 20 and the concave portion 5 of the sealing material 2. That is, a recess 33 is provided at the end of one section of the organic EL element on the surface of the large sealing material 32 connected with the sealing material 2 so as to straddle the end of the adjacent organic EL element. The material 20 is provided with a recess 22 in communication with the recess 5 of the adjacent organic EL element. Then, around the concave portion 22 of the end material 20, the substrate approaching structure 21 of the end material 20 in which the large sealing material 32 (end material 20) approaches the substrate 1 side on both sides of the region of the extraction electrode 3, It is provided in communication with the substrate approach structure 4 at the end of the sealing material 2. In this manner, the depression 33 that forms the recesses 5 and 22 is formed on the surface of the large sealing material 32 before the sealing material 2 is cut out, in a region including the region where the extraction electrode 3 is provided in plan view. It is preferable. Thereby, the board | substrate approach structures 4 and 21 can be formed along the outer edge of the extraction electrode 3, and the contact with the end material 20 and the extraction electrode 3 can be suppressed.

  FIGS. 2B and 2C show a state in which the cut end material 20 is removed from the organic EL element during individualization. In this embodiment, the recess 22 is provided in the center of the end material 20, so that the substrate approaching structure 21 of the end material 20 is provided at positions on both sides of the extraction electrode 3 in the end material 20. Therefore, when the end material 20 is removed, when the end of the end material 20 is inclined and approaches the substrate 1 side, the substrate approaching structure 21 is formed before the end material 20 contacts the take-out electrode 3. 1 can be contacted. In other words, the substrate approaching structure 21 is a bridge pier structure in which the end member 20 is erected in a bridge shape so as to straddle the extraction electrode 3. For this reason, it is possible to suppress the end material 20 from coming into contact with the extraction electrode 3 and to prevent the extraction electrode 3 from being damaged by the end material 20, so that the connection reliability of the organic EL element can be improved. The substrate approach structure 21 may be in direct contact with the substrate 1 or may be in contact with the electrode lead-out portion 11 provided on the surface of the substrate 1. Even if the electrode lead-out portion 11 is damaged due to contact with the substrate approaching structure 21, the electrode lead-out portion 11 is provided with the lead-out electrode 3 so that electrical conductivity is ensured. There is little risk of failure.

  In the organic EL element, it is preferable that the concave portion 5 has the maximum concave amount (depth) at the edge of the sealing material 2. Thereby, since the large-sized sealing material 32 can be cut | disconnected in the position where thickness is small, the sealing material 2 can be parted easily. Moreover, when the amount of dent becomes large in the position of the edge of the sealing material 2, it can suppress more efficiently that the sealing material 2 and the end material 20 contact the taking-out electrode 3. FIG.

  The concave portion 5 is formed at an end portion of the cut sealing material 2, but when the portion having the largest concave amount of the concave portion 5 is formed inside the end edge of the sealing material 2. When cutting, there is a possibility that the stress is concentrated on a portion having a large amount of dent and cutting becomes difficult. Therefore, it is preferable that the amount of recesses 5 is maximized at the edge of the sealing material 2. As a result, the stress can be concentrated at the cutting position and the cutting can be performed more easily.

  At this time, it is more preferable that the end material 20 and the sealing material 2 are divided at a position where the dent amount (depth) in the dent portion 33 constituting the dent portion 5 is the largest. Thereby, since it can cut | disconnect in a thin position, the division | segmentation of the sealing material 2 becomes easier. The depression 33 may be formed with an inclined side surface. In that case, if the large-sized sealing material 32 is divided at this inclined position, there is a risk that the stress concentrates at other than the cutting position and the cutting becomes difficult. is there. Therefore, it is preferable to cut the large sealing material 32 at the deepest position of the recess 33. As described above, stress can be easily concentrated on the thin portion of the large-sized sealing material 32 at the time of cutting. Therefore, when the cutting is performed on the thin portion, the sealing material 2 and the end material 20 are formed. It becomes easier to divide.

  As shown in FIG. 2A, the recess 5 preferably has a recess depth D larger than the thickness T of the extraction electrode 3. Thereby, it can further suppress that the taking-out electrode 3 is damaged. That is, when the depth of the recess 33 constituting the recesses 5 and 22 is larger than the thickness T of the extraction electrode 3, it is possible to further suppress the extraction electrode 3 from being damaged. As shown in FIG. 2B, when removing the end material 20, the substrate approaching structure 21 of the end material 20 may come into contact with the substrate 1. If the thickness is smaller than the thickness of the electrode 3, the bottom surface of the recess 22 may come into contact with the extraction electrode 3. However, if the depth of the concave portion 22 is larger than the thickness of the extraction electrode 3, as shown in FIG. 2B, when the substrate approaching structure 21 comes into contact, the bottom surface of the concave portion 22 of the end member 20 is the extraction electrode. 3 is suppressed. Therefore, it can suppress that the extraction electrode 3 is damaged.

  Further, in the organic EL element, the recess depth D of the recess 5 (the recess portion 33) is larger than the thickness T of the extraction electrode 3, whereby the extraction electrode when the large sealing material 32 is attached to the large substrate 31. 3 damage can be suppressed. Here, in this embodiment, the large-sized sealing material 32 can be attached to the large-sized substrate 31 by being superimposed on a fluid adhesive material (adhesive layer 13) that is not cured. At this time, when the large sealing material 32 is pressed and the adhesive layer 13 is pressed and deformed or contracted to reduce the thickness, the extraction electrode 3 and the large sealing material 32 may come into contact with each other. In particular, when the recess depth D of the recess 5 is smaller than the thickness T of the extraction electrode 3, the substrate approach structures 4 and 21 may come into contact with the bottom surface of the recess 33 before contacting the substrate 1. . However, if the recess depth D of the recess 5 (the recess 33) is made thicker than the thickness T of the take-out electrode 3, even if the large sealing material 32 approaches the substrate 1 side, the take-out electrode is placed in the recess 33. 3 can be stored and protected, so that the take-out electrode 3 can be prevented from being damaged.

  Moreover, in the organic EL element after individualization, when the depth D of the recess 5 is larger than the thickness T of the take-out electrode, the sealing material 2 may be bent and approach the substrate 1 side. Also, the contact between the sealing material 2 and the extraction electrode 3 can be suppressed. Therefore, it can suppress that the sealing material 2 and the taking-out electrode 3 contact, and can suppress the electric power feeding failure etc. and can improve reliability. Further, external wiring or the like can be connected to the extraction electrode 3, but if the depth D of the recess 5 is larger than the thickness T of the extraction electrode, the external wiring can be connected to the extraction electrode 3 with a larger area. Thus, connection reliability can be improved.

  The amount of recess in the recess 33 of the large-sized sealing material 32 may be the same as the amount of recess in the recess 5 of the sealing material 2 and the recess 22 of the end material 20. However, when the surface of the dent 33 is not flat, the dent amount may be different between the recess 5 and the recess 22, but even in that case, by providing the dent 33, the extraction electrode 3 and the end material 20 may be provided. And the contact between the extraction electrode 3 and the sealing material 2 can be suppressed.

  In this embodiment, the recessed portion 33 is formed as an inclined surface whose side surface is inclined with respect to the surface of the large-sized sealing material 32. In FIG. 2, the side surface of the recessed portion 33 is configured by an inclined flat surface. Therefore, in the organic EL element individualized from the form of FIG. 2, the side surface 5 a of the recess 5 is formed as an inclined surface inclined with respect to the surface of the sealing material 2. When the side surface 5a of the recess 5 (the recess 33) is an inclined surface, the recess 33 can be easily formed. Further, the side surface 5a of the recess 5 (the recessed portion 33) may be a surface substantially perpendicular to the surface of the sealing material 2 (large-size sealing material 32). In that case, the size of the portion where the sealing material 2 protrudes outside the adhesive layer 13 can be reduced, and the ratio of the light emitting area can be increased.

  When the side surface (5a) of the recess portion 33 (recess portion 5) is an inclined surface, the large sealing material 32 may be cut at a boundary portion between the side surface and the bottom surface of the recess portion 33. The boundary portion between the side surface and the bottom surface is a portion where the angle changes, and stress is easily concentrated. Therefore, the cutting line L2 is arranged at the boundary between the side surface and the bottom surface, and the large sealing material 32 is cut at the boundary portion, whereby the sealing material 2 and the end material 20 can be easily separated. When cut at the boundary portion between the side surface and the bottom surface, the concave portion 5 is configured by an inclined surface having a shape in which the edge of the sealing material 2 is obliquely cut off from the substrate 1 side.

  FIG. 3 shows an example of an organic EL element before individualization. The shape of the side surface 5a of the recess 5 is not limited to a flat surface. The side surface 5a of the recess 5 is more preferably a curved surface. Thereby, an organic EL element can be manufactured more easily. The side surface 5a of the recess 5 may be a concave curved surface or a convex curved surface.

  FIG. 3A shows a form in which the side surface 5a of the recess 5 is a concave curved surface. This form can be formed by making the side surface of the recessed portion 33 into a concave curved surface. In the case of this form, by performing the digging process of the dent portion 33 around the central portion of the dent portion 33, the dent portion 33 whose side surface is a concave curved surface can be obtained. The burden of processing accuracy of the edge can be reduced. Therefore, the recessed part 33 can be produced easily and manufacture of an organic EL element becomes easy. Further, when the side surface 5a is a concave curved surface to form the concave portion 5, the side surface 5a is not formed so as to jump out toward the extraction electrode 3, but is formed so as to wrap around the extraction electrode 3 and be accommodated. Therefore, the contact between the extraction electrode 3 and the sealing material 2 can be suppressed.

  FIG. 3B shows a form in which the side surface 5a of the recess 5 is a convex curved surface. This form can be formed by making the side surface of the recess 33 a convex curved surface. In the case of this form, as shown by the cutting line L2 in FIG. 3B, the large sealing material 32 can be cut at the boundary portion between the side surface and the bottom surface of the recessed portion 33. As a result, a large seal is formed at the boundary between the side surface of the recessed portion 33 that rises in a direction perpendicular to the bottom surface as a convex curved surface, and the bottom surface of the recessed portion 33 that is substantially parallel to the surface of the sealing material 2. The stop material 32 can be cut. Therefore, the sealing material 2 can be easily divided by concentrating more stress. Moreover, when the side surface 5a becomes a convex curved surface and the concave portion 5 is formed, it is possible to reduce the thickness of the outer edge of the end portion of the sealing material 2, so that the edge of the sealing material 2 can be reduced. Strength can be raised and it can control that this part is damaged.

  FIG. 4 is a cross-sectional view for explaining an example of the embodiment of the organic EL element. In FIG. 4, the organic EL element before individualization is illustrated.

  In the form of FIG. 4, a buffer layer 12 having a hardness lower than that of the extraction electrode 3 is provided on the surface of the end portion of the sealing material 2 on the substrate 1 side. As described above, when the buffer layer 12 is provided, even if the end material 20 or the sealing material 2 hits the extraction electrode 3, the force applied to the extraction electrode 3 when contacted by the soft buffer layer 12. Can be tempered. Therefore, it can further suppress that the extraction electrode 3 is damaged. The buffer layer 12 may be provided on the surface of the large sealing material 32 on the side facing the substrate 1 at the end of the partition of the organic EL element.

  As shown in FIG. 4B, the buffer layer 12 is preferably provided including the substrate approach structures 4 and 21. By providing the buffer layer 12 on the substrate approaching structures 4 and 21, a portion that is more easily contacted is covered with the buffer layer 12, and the extraction electrode 3 can be highly protected.

  Moreover, it is preferable that the buffer layer 12 is provided in the recessed part 5 (recessed part 33). Thereby, the buffer layer 12 can be provided in a wide range, and the contact between the extraction electrode 3 and the sealing material 2 can be further reduced.

  In the form shown in FIG. 4, the buffer layer 12 is provided on the surface of the large sealing material 32 on the outer periphery of the recess 33 so as to cover the recess 33. Thereby, since the area | region in which the buffer layer 12 is provided spreads, the damage of the extraction electrode 3 can further be suppressed. Moreover, since the buffer layer 12 should just be provided so that the hollow part 33 may be covered, formation of the buffer layer 12 can be performed easily.

  The region where the buffer layer 12 is provided can be set as appropriate. The buffer layer 12 may be provided on the entire surface of the large sealing material 32. Thereby, the buffer layer 12 can be easily formed. Further, the buffer layer 12 may be provided in a region outside the accommodating recess 14 of the sealing material 2. Thereby, even when the buffer layer 12 is made of a material such as a resin that easily enters moisture, the buffer layer 12 can be prevented from being formed inside the sealing gap, thereby suppressing deterioration of the organic layer due to moisture. can do. The buffer layer 12 may be provided at a position outside the adhesive layer 13. When the buffer layer 12 and the adhesive layer 13 are in contact with each other, the buffer layer 12 is formed between the substrate 1 and the sealing material 2, and the adhesiveness of the adhesive layer 13 may be reduced. Therefore, it is preferable to provide the buffer layer 12 in a region outside the adhesive layer 13. The buffer layer 12 may be made of an insulating material.

  The buffer layer 12 is preferably made of a resin. Thereby, the buffer layer 12 can be easily formed on the surface of the large-sized sealing material 32 (sealing material 2) by a method such as coating. Moreover, when comprised with resin, when the sealing material 2 is a glass material, the buffer layer 12 can be softened more easily than this glass material. The resin constituting the buffer layer 12 may be a thermosetting resin or a photocuring resin. Alternatively, a thermoplastic resin may be used as the resin for the buffer layer 12.

  The buffer layer 12 can be formed by, for example, application by an inkjet method. Thereby, the buffer layer 12 can be easily provided in a desired pattern. The buffer layer 12 may have a thickness in the range of 1 to 100 μm, and more preferably in the range of 5 to 20 μm.

  The end material 20 may be removed by being tilted in an oblique direction as shown in FIG. 2B, but the end material 20 may be pushed onto the substrate 1 side and placed on the substrate 1 during cutting. is there. At that time, the end material 20 is provided with the buffer layer 12, thereby preventing the extraction electrode 3 from being damaged. Further, since the buffer layer 12 is provided on the substrate approaching structure 21 of the end material 20, it is possible to further suppress the damage of the extraction electrode 3.

  FIG. 5 shows another example of the embodiment of the organic EL element. The same components as those in the embodiment of FIG. Although FIG. 1 shows an example in which the substrate approach structure 4 is formed by relatively projecting by providing the recess 5, the substrate approach structure 4 is not limited to this. In the form of FIG. 5, an example is shown in which the substrate approaching structure 4 is formed by projecting the surface of the sealing material 2 in a protruding shape to form the convex portion 6.

  FIG. 5A shows a cross section cut at a position before the extraction electrode 3 so that the structure of the element can be easily understood. Further, the end on the first electrode lead portion 11a side is shown on the left side, and the end portion on the second electrode lead portion 11b side is shown on the right side. FIG. 5B shows an enlarged perspective view of the end portion where the extraction electrode 3 is provided.

  The substrate approaching structure 4 is preferably formed by projecting part of the sealing material 2 and providing the convex portions 6 on both sides of the extended region 30 where the extraction electrode 3 is extended to the inside of the element. It is an aspect. Thereby, the board | substrate approach structure 4 can be formed easily and the damage of the extraction electrode 3 can be suppressed.

  In this embodiment, the convex portion 6 constituting the substrate approaching structure 4 is formed by a columnar protrusion. This columnar protrusion is not formed at the position of the extension region 30 on the element inner side of the extraction electrode 3. Thus, by providing the convex portion 6 so as not to overlap with the extraction electrode 3 in plan view, it is possible to suppress the sealing material 2 from coming into contact with the extraction electrode 3 when the organic EL element is individualized. it can.

  FIG. 6 shows an example of a method for manufacturing an organic EL element. FIG. 6A shows a state before individualizing the organic EL element, and FIGS. 6B and 6C show the state at the time of manufacturing. Some examples are shown. FIGS. 6B and 6C show a state in which the end material 20 generated from the sealing material 2 is removed. 6A and 6B show a cross section cut at a position before the extraction electrode 3 so that the structure of the element can be easily understood. Moreover, in FIG.6 (c), the sealing material 2 is removed and illustrated so that the mode of manufacture may be understood easily.

  In this embodiment, the convex portion 6 is constituted by a convex portion 34 provided in the large-sized sealing material 32. The end material 20 is provided with a convex portion 23 of the end material 20 as a part of the protruding portion 34 so as to be integrated with the convex portion 6. 2, when removing the end material 20, as shown in FIGS. 6B and 6C, the convex portion constituting the substrate approaching structure 21 of the end material 20. 23 is in contact with the substrate 1 before the end material 20 hits the extraction electrode 3, so that the extraction electrode 3 can be prevented from being damaged.

  The convex portion 6 is preferably provided at a position on the side of the corner portion of the extraction electrode 3 at the position of the outer edge in plan view of the extraction electrode 3. Thereby, the contact between the extraction electrode 3 and the end material 20 can be suppressed. Further, it is preferable that two protrusions 6 are provided so as to correspond to the sides of the two corners of the extraction electrode 3. Thereby, when removing the end material 20, the end material 20 can be removed by bringing the two protrusions 23 (substrate approach structure 21) straddling the extraction electrode 3 into contact with the substrate 1, and the end material 20 and the extraction electrode can be removed. It can further suppress that 3 contacts.

  The shape of the protruding portion 34 (the protruding portion 6) is not particularly limited as long as the substrate approaching structure 4 can be formed. The shape may be a polygonal column such as a quadrangular column, a triangular column, or a hexagonal column, or may be a columnar shape or a semi-columnar shape. Further, the convex portion 6 may have a shape that tapers toward the tip. For example, the shape may be a polygonal pyramid such as a quadrangular pyramid or a cone. Moreover, the hemispherical convex part 6 may be formed. Further, a protruding portion 34 protruding in a wall shape may be formed along the outer edge of the side portion in plan view of the extraction electrode 3. When the protruding portion 34 is formed in a wall shape, the end material 20 is formed with a wall-shaped convex portion 23, and the contact between the extraction electrode 3 and the end material 20 can be further reduced. . The plurality of protruding portions 34 are arranged in a straight line across the boundary between the sealing material 2 and the end material 20, and are formed at positions on both sides of the extraction electrode 3 in the large-sized sealing material 32. Also good.

  The cutting position of the large sealing material 32 may be the position of the protruding portion 34 as indicated by the cutting line L2. At this time, the end material 20 may be provided with the convex portion 23 of the end material 20 from the protruding portion 34 that communicates integrally with the convex portion 6. Thereby, when cutting off and removing the end material 20, the substrate approaching structure 21 of the end material 20 constituted by the convex portion 23 of the end material 20 can be brought into contact with the substrate 1. Contact can be suppressed.

  It is preferable that the protruding height of the protruding portion 6 (the protruding portion 34) is larger than the thickness of the extraction electrode 3. Thereby, when the end material 20 comes into contact with the substrate 1 at the convex portion 23, the extraction electrode 3 is separated from the surface of the end material 20 by the protrusion of the convex portion 23. And the contact with the extraction electrode 3 can be further suppressed.

  The thickness of the adhesive layer 13 is preferably equal to or greater than the height of the convex portion 6 (protruding portion 34). If the thickness of the adhesive layer 13 is smaller than the height of the convex portion 6, the adhesive layer 13 may not be able to sufficiently bond the substrate 1 and the sealing material 2. Further, the thickness of the adhesive layer 13 and the protruding height of the convex portion 6 may be substantially the same, and the tip of the convex portion 6 may be in contact with the surface layer of the substrate 1. Thereby, the fixing strength to the board | substrate 1 of the sealing material 2 can be raised.

  In this embodiment, the organic EL element can be manufactured by the same method as that described above except for the processing of the large sealing material 32. That is, the organic EL element of this embodiment is obtained by individualizing an organic EL element coupling body in which a plurality of organic light emitters 10 are formed in a plane direction between a large substrate 31 and a large sealing material 32. Can be obtained. As the organic EL element coupling body, a structure in which the protruding portions 34 are formed on the large sealing material 32 on both sides of the region overlapping with the extraction electrode 3 in plan view can be used. Individualization can be performed at the position of the protruding portion 34.

  In this embodiment, the recess processing of the large-sized sealing material 32 may be only at the position where the housing recess 14 is provided. The protruding portion 34 can be formed in the large-sized sealing material 32 by attaching the material of the protruding portion 34 (the protruding portion 6) to the outside of the position where the housing recess 14 is provided.

  The convex portion 6 may be made of the same material as the large-sized sealing material 32. Thereby, the protruding part 34 integrated easily can be provided in the large-sized sealing material 32. The protruding portion 34 may be provided by bonding members constituting the protruding portion 34. At this time, the adhesion of the protruding portion 34 may be welding. For example, when the large sealing material 32 is made of a glass material, the protruding portion 34 integrated by welding can be easily formed. Moreover, when comprising with glass material, even if the convex part 23 of the end material 20 is pressed, it becomes difficult to deform | transform, Therefore The damage of the extraction electrode 3 can be suppressed. Of course, you may adhere | attach the member of the protrusion part 34 with an adhesive agent.

  Further, the protruding portion 34 may be made of a material different from that of the large sealing material 32. For example, the protruding portion 34 (the protruding portion 6) can be formed of resin. In this case, the convex part 6 can be formed easily. At this time, it is preferable that the protrusion 34 (the protrusion 6) has a high hardness. Thereby, even when pressed when the end material 20 is removed, the convex portion 23 of the end material 20 becomes difficult to be deformed, and it is possible to prevent the extraction electrode 3 from being damaged.

  In addition, although the protruding part 34 can also be formed by etching a part other than the protruding part 34, in that case, the formation of the protruding part 34 may not be easy. Therefore, it is preferable that the protruding portion 34 is formed by sticking the material constituting the protruding portion 34 to the surface of the large-sized sealing material 32. Of course, the large-sized sealing material 32 may be formed by forming into an appropriate shape by press working or the like, and the protruding portion 34 may be formed at the time of press working.

  FIGS. 6B and 6C show a state in which the cut end material 20 is removed from the organic EL element during individualization. In the present embodiment, the protrusions 34 are provided on the large sealing material 32, so that the protrusions 23 are provided as the substrate approaching structure 21 of the end material 20 at positions on both sides of the extraction electrode 3 in the end material 20. ing. Therefore, when the end material 20 is removed, if the end portion of the end material 20 is inclined and approaches the substrate 1 side, the substrate approaching structure 21 (convex) is formed before the end material 20 contacts the extraction electrode 3. Part 23) can be brought into contact with the substrate 1. In other words, the substrate approaching structure 21 is a bridge pier structure in which the end member 20 is erected in a bridge shape so as to straddle the extraction electrode 3. For this reason, it is possible to suppress the end material 20 from coming into contact with the take-out electrode 3 and to suppress the take-out electrode 3 from being damaged by the end material 20, so that the connection reliability of the organic EL element can be improved.

  FIG. 7 is a cross-sectional view illustrating an example of an embodiment of an organic EL element. In FIG. 7, the organic EL element before individualization is illustrated. The form of FIG. 7 shows a form in which the buffer layer 12 is provided on the surface of the sealing material 2 in the form of FIG. The buffer layer 12 may be the same as that described in the form of FIG.

  In the form of FIG. 7, a buffer layer 12 having a lower hardness than the extraction electrode 3 is provided on the surface of the end portion of the sealing material 2 on the substrate 1 side. As described above, when the buffer layer 12 is provided, even when the end material 20 or the sealing material 2 hits the extraction electrode 3, the force applied to the extraction electrode 3 when the contact is made by the buffer layer 12 can be reduced. Therefore, damage to the extraction electrode 3 can be further suppressed.

  It is preferable that the buffer layer 12 is provided in the board | substrate approach structures 4 and 21 (projection part 34). By providing the buffer layer 12 in the substrate approach structures 4 and 21, the convex portion 23 of the end material 20 that is more easily contacted is covered with the buffer layer 12, and the extraction electrode 3 can be protected. When the buffer layer 12 is provided on the protruding portion 34, the buffer layer 12 is provided on the convex portions 6 and 23.

  Further, the buffer layer 12 may be formed integrally with the surface of the end material 20 including the protruding portion 34. Thereby, the buffer layer 12 can be provided in a wide range, and the contact between the extraction electrode 3 and the sealing material 2 can be further reduced. Moreover, since the buffer layer 12 should just be provided widely in the position in which the end material 20 was formed, formation of the buffer layer 12 can be performed easily.

  The buffer layer 12 is preferably made of a resin. Thereby, the buffer layer 12 can be easily formed on the surface of the large-sized sealing material 32 (sealing material 2) by a method such as coating. Moreover, when the sealing material 2 is a glass material, the buffer layer 12 can be softened more easily than this glass material. The resin constituting the buffer layer 12 may be a thermosetting resin or a photocuring resin. Alternatively, a thermoplastic resin may be used as the resin for the buffer layer 12.

  In addition, although the example in which the board | substrate approach structure 4 and 21 was formed by one of the recessed part 5 and the convex part 6 was shown above, in the organic EL element, while the recessed part 5 was provided, the convex part 6 was provided, Substrate approach structures 4 and 21 may be formed. Also in that case, the contact between the extraction electrode 3 and the end material 20 can be suppressed.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Sealing material 3 Extraction electrode 4 Substrate approach structure 5 Concave part 5a Side surface of concave part 6 Convex part 7 First electrode 8 Organic light emitting layer 9 Second electrode 10 Organic light emitter 11 Electrode lead part 12 Buffer layer 13 Adhesive layer 14 Accommodation Concave portion 15 Sealing sidewall 20 End material 21 End material substrate approach structure 22 End material concave portion 23 End material convex portion 31 Large substrate 32 Large sealing material 33 Depressed portion 34 Protruding portion

Claims (8)

An organic light emitter having a first electrode, an organic light emitting layer, and a second electrode in this order is formed on the surface of the substrate, and the organic light emitter is covered and sealed with a sealing material bonded to the substrate. An organic electroluminescence element that is
An electrode lead portion electrically connected to at least one of the first electrode and the second electrode is provided on the surface of the end portion of the substrate so as to be drawn outward in a plan view from the sealing material,
On the surface of the electrode lead portion, an extraction electrode for connection with an external power source is provided,
At the end portion of the sealing material, a substrate approach structure in which the sealing material is closer to the substrate side than the extended region on both sides of the extended region where the extraction electrode is extended to the inside of the element in a plan view. An organic electroluminescence element characterized by comprising:   2. The organic electro according to claim 1, wherein the substrate approaching structure is formed by recessing the vicinity of the extended region at an end of the sealing material and providing a recess in the sealing material. Luminescence element.   2. The organic electroluminescence device according to claim 1, wherein the substrate approaching structure is formed by projecting a part of a sealing material on both sides of the extension region to provide a convex portion.   The organic electroluminescence element according to claim 2, wherein the concave portion has a maximum concave amount at a position of an edge of the sealing material.   The organic electroluminescence element according to claim 2, wherein the concave portion is a curved surface having a concave or convex side surface.   The organic electroluminescence device according to claim 2, wherein the recess has a recess depth larger than a thickness of the extraction electrode.   The organic electroluminescence according to any one of claims 1 to 6, wherein a buffer layer having a hardness lower than that of the extraction electrode is provided on the surface of the end portion of the sealing material on the substrate side. element.   The organic electroluminescence element according to claim 7, wherein the buffer layer is made of a resin.

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