JP2014113350A - Endoscope and endoscope system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope system capable of effectively cooling an illuminating light source while avoiding large-scaling of an endoscope body, in a configuration in which the light source is provided in the endoscope body.SOLUTION: An endoscope system includes: an endoscope body having an insertion part inserted into an observation target, and a plug part 6 connected with a rear part of the insertion part; and a video processor having a socket part 7 connected with the plug part 6. The plug part 6 is provided with: an illumination LED 22; and a heat radiation unit transferring heat generated by the LED 22 to the outside. The socket part 7 is provided with a heat sink 85 promoting heat radiation of the heat radiation unit in a state that the plug part 6 is connected to the socket part 7.

Description

  The present invention relates to an endoscope and an endoscope system for imaging the inside of an observation target that cannot be directly observed from the outside.

  2. Description of the Related Art Conventionally, endoscopes that include an illuminating device configured to guide light from a light source disposed at the rear to the distal end of an insertion portion that is inserted into an observation target have become widespread. With this illumination device, the practitioner can perform observation and photographing with an endoscope while illuminating the inside of the observation target (inside the body cavity or the like).

  As an endoscope system including this type of endoscope, for example, an endoscope main body in which an illumination lens (illumination window) is provided at the distal end of an insertion portion, and a processor device in which an illumination light source is provided The light source connection sleeve provided in the endoscope body is connected to the processor device, so that light from the light source in the processor device passes through the light source connection sleeve. What is led into the body is known (see Patent Document 1). In the case where the light source is provided in the processor device as in this conventional endoscope system, when the endoscope and the processor device are separated, the light path (the light source connection sleeve and the connection hole of the sleeve) Etc.) are exposed to the outside, and dust or the like may enter the light path and the illuminance of the illumination light may be extremely reduced.

  On the other hand, for example, a small light source (white LED) is built in a grip portion provided behind the insertion portion in the endoscope body, and illumination light from this light source is transmitted through the optical fiber to the tip of the insertion portion. An endoscope system that can secure stable illuminance while avoiding an increase in the diameter of the insertion portion is known (see Patent Document 2).

JP 2012-120746 A

  By the way, the prior art described in the above-mentioned Patent Document 2 has a problem of downsizing the endoscope (insertion unit), and assumes a light source output (wattage) that does not require a cooling device. . Therefore, in this prior art, if the output of the light source is increased in order to obtain a larger illuminance (that is, using a higher brightness LED, using a plurality of lower brightness LEDs, etc.), the gripping part becomes hot. In order to avoid this, it is necessary to provide a cooling device in the grip portion, resulting in an increase in the size of the endoscope body.

  The present invention has been devised in view of the above-described problems of the prior art, and in an arrangement in which an illumination light source is provided on an endoscope body, an endoscope while achieving high output of the light source. It is a main object to provide an endoscope and an endoscope system capable of effectively cooling a light source that can avoid an increase in size of a main body.

  An endoscope according to the present invention includes an endoscope main body having an insertion portion to be inserted into an observation target and a connecting portion to which a rear portion of the insertion portion is connected, and a connected portion to which the connecting portion is connected. A heat radiating device, and the connecting part is provided with a light source for illumination and a heat radiating unit for transmitting heat generated by the light source to the outside, and the connected part is connected to the connected part. The present invention is characterized in that a heat dissipation promoting means for promoting heat dissipation of the heat dissipation unit is provided in a state where the connecting portion is connected.

Overall configuration diagram of an endoscope system according to an embodiment The principal part disassembled perspective view of the plug part of the endoscope main body which concerns on embodiment Assembly explanatory diagram of the heat radiating unit 30 in the plug portion shown in FIG. The perspective view of the bottom face side of the plug part in the endoscope body according to the embodiment Sectional drawing of the principal part of the internal structure of the plug part in the endoscope main body which concerns on embodiment. The principal part perspective view of the internal structure of the video processor which concerns on embodiment The perspective view of the bottom face side of the socket part in the video processor concerning an embodiment Sectional drawing of the principal part which shows the connection state of the plug part and socket part which concern on embodiment Explanatory drawing which shows the thermal connection of the thermal radiation unit and heat sink by connection of the plug part and socket part which concern on embodiment Explanatory drawing which shows the change of the fitting state of the leaf | plate spring and fixing plate at the time of the connection of the plug part and socket part which concern on embodiment. Explanatory drawing which shows the flow of the cooling air of the cooling fan in the video processor which concerns on embodiment

  The first invention made to solve the above-described problem is that an endoscope main body having an insertion portion to be inserted into an observation target and a connection portion to which a rear portion of the insertion portion is connected, and the connection portion are connected. A heat dissipating device having a connected portion to be connected, and the connecting portion is provided with a light source for illumination and a heat dissipating unit for transmitting heat generated by the light source to the outside, In the state where the connecting part is connected to the connected part, a heat dissipation promoting means for promoting heat dissipation of the heat radiating unit is provided.

  According to the endoscope system according to the first aspect of the present invention, the heat dissipation of the heat dissipation unit (that is, the heat dissipation of the light source) is promoted by connecting the connecting portion of the endoscope main body to the connected portion of the heat dissipation device. Therefore, in the configuration in which the light source for illumination is provided in the endoscope main body, it is possible to effectively cool the light source that can avoid the enlargement of the endoscope main body while increasing the output of the light source.

  According to a second aspect, in the first aspect, the heat dissipation accelerating means includes a heat sink that contacts the heat dissipation unit when the connecting portion is connected to the connected portion.

  According to the endoscope system according to the second aspect of the present invention, the endoscope has a simple configuration in which the heat radiating unit of the endoscope body and the heat sink of the heat radiating device are in contact with each other while increasing the output of the light source. It is possible to effectively cool the light source that can avoid the enlargement of the mirror body.

  According to a third aspect, in the second aspect, the heat dissipation unit includes a first heat transfer plate exposed from an outer shell of the connecting portion, and the heat sink is connected to the connected portion by the connecting portion. Are connected to the first heat transfer plate when connected to each other.

  According to the endoscope system according to the third aspect of the present invention, the heat radiating device is applied to the first heat transfer plate (that is, the outer surface of the endoscope body) exposed from the outer shell (housing) of the connecting portion. Since the heat sink is in contact, the light source can be effectively cooled while preventing dust and the like from entering the endoscope main body.

  According to a fourth invention, in the third invention, the first heat transfer plate comprises a leaf spring provided so as to be elastically deformed when contacting the heat sink, and the elastic deformation restoring force. Acts in the direction of contact with the heat sink.

  According to the endoscope system according to the fourth aspect of the present invention, since the contact state with the heat sink is well maintained by the restoring force of the elastic deformation of the first heat transfer plate, the light source can be cooled more stably. It becomes.

  According to a fifth aspect, in the third or fourth aspect, the heat radiating unit includes a second heat transfer plate disposed inside the first heat transfer plate, the first and second portions. It further includes a flexible heat transfer sheet disposed between the heat transfer plates.

  According to the endoscope system according to the fifth aspect of the present invention, in the heat dissipation unit including a plurality of heat transfer plates, even when the first heat transfer plate is displaced inward by contact with the heat sink, the heat transfer sheet is deformed. As a result, the heat transfer between the first and second heat transfer plates (that is, the heat transfer in the heat dissipation unit) is well maintained, so that the light source can be cooled more stably.

  According to a sixth aspect of the present invention, in any one of the second to fifth aspects, the heat radiation promoting means further includes a blower capable of cooling at least one of the heat radiation unit and the heat sink.

  According to the endoscope system according to the sixth aspect of the present invention, since the heat radiation amount of the heat radiation unit and the heat sink is increased by the blower, it is possible to cool the light source more effectively while avoiding the enlargement of the endoscope body. Become.

  In the seventh invention, in any one of the first to sixth inventions, the heat dissipation device is a processor device for image processing, and the endoscope body is connected to the connected portion by the connecting portion. Are connected to the processor device when connected to each other.

  According to the endoscope system according to the seventh aspect of the invention, since the processor device is used as a heat radiating device, the electrical connection relating to the imaging device of the endoscope body and the thermal connection relating to the cooling of the light source Can be performed simultaneously.

  The eighth invention is characterized in that, in the seventh invention, the processor device has a substantially sealed internal space, and the cooling air from the blower is circulated along a peripheral wall of the processor device.

  According to the eighth endoscope system, since the processor device is substantially sealed and the cooling air from the blower is circulated along the peripheral wall of the processor device, at least one of the heat radiating unit and the heat sink. There is no need to introduce air from outside the processor unit for cooling.

  The ninth invention is an endoscope having an insertion portion to be inserted into an observation target and a connection portion to which a rear portion of the insertion portion is connected, and the connection portion includes a light source for illumination and And a heat radiating unit for transmitting heat generated by the light source to the outside, and the heat radiating unit includes a heat transfer plate exposed from an outer shell of the connecting portion.

  According to the endoscope according to the ninth aspect of the present invention, the heat radiating unit that transmits heat generated by the light source to the outside is provided, and the heat radiating unit includes the heat transfer plate exposed from the outer shell (housing) of the connecting portion. Therefore, in the configuration in which the light source for illumination is provided in the endoscope main body, it is possible to effectively cool the light source while avoiding the enlargement of the endoscope main body.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the directions in the description follow the description of directions in FIG. 1 in principle. Here, “upper” and “lower” respectively correspond to the upper and lower sides of the video processor 3, and “front (front)” and “rear” correspond to the insertion portion side and the plug portion side of the endoscope body 2, respectively. .

  FIG. 1 is an overall configuration diagram of an endoscope according to an embodiment of the present invention. The endoscope system 1 includes an endoscope main body 2 that is a medical flexible endoscope, and a video processor (heat dissipation) that performs known image processing and the like on still images and moving images obtained by photographing the inside of an observation target. And a processor device 3). The endoscope body 2 includes an insertion portion 5 that is inserted into an observation target (here, a human body), and a plug portion (connection portion) 6 to which the rear portion of the insertion portion 5 is connected.

  The video processor 3 has a metal casing having a substantially rectangular parallelepiped shape, and a socket section (connected section) 7 to which the plug section 6 is connected is accommodated in the casing. The socket part 7 has an opening 8 that opens in a substantially rectangular shape on the front wall 3 a of the housing of the video processor 3, and the plug part 6 is inserted into the opening 8 so that the plug 6 is plugged. The part 6 is connected to the socket part 7. Thereby, the endoscope body 2 can receive power and transmit / receive various signals (video signal, control signal, etc.) to and from the video processor 3. The plug portion 6 is a part that is gripped when the user handles the endoscope main body 2 such as a connection operation between the endoscope main body 2 and the video processor 3 or a connection release operation thereof.

  The insertion portion 5 has a circular cross section and an appropriate length for the observation target. The insertion part 5 has a flexible soft part 11 whose rear end is connected to the plug part 6 and a hard part 12 which is connected to the front end of the soft part 11 and forms the distal end of the insertion part. The outer peripheral part of the soft part 11 is formed from a flexible material, and the outer peripheral part of the hard part 12 is formed from a highly rigid member. The internal space of the insertion portion 5 is in a sealed state except for communication with the plug portion 6, and entry of dust and the like is prevented. The rigid portion 12 accommodates an imaging unit (not shown) used for imaging the observation site. This imaging unit has a known configuration including a lens unit that forms an objective optical system, a solid-state imaging device, and the like. The front end portion 12a of the rigid portion 12 is made of a translucent optical material, and functions as an illumination lens from which illumination light of an illumination device described later is emitted.

  2 is an exploded perspective view of the main part of the plug portion of the endoscope body, FIG. 3 is an assembly explanatory view of the heat dissipation unit 30 in the plug portion shown in FIG. 2, and FIG. 4 is a perspective view of the bottom surface side of the plug portion. FIG. 5 is a cross-sectional view of the main part of the internal structure of the plug portion.

  As shown in FIG. 2, the plug portion 6 includes an upper plug cover 20 that forms the upper side of the casing (outer shell), and a lower plug cover that combines with the upper plug cover 20 and forms the lower side of the casing. 21. Further, in the housing of the plug unit 6, an LED board 23 having an LED (light source) 22 that emits white illumination light with high luminance (here, output 2 W), and an upper side that overlaps with the lower side of the LED board 23. The heat transfer sheet 24, the lower heat transfer sheet 26 that overlaps the lower side of the upper heat transfer sheet 24, and the fixing plate 25 (second heat transfer plate) that fixes the LED substrate 23, and the lower side of the fixing plate 25. A leaf spring (first heat transfer plate) 27 that overlaps the lower side of the lower heat transfer sheet 26 and a holder member 28 that holds each component or member in the housing are housed.

  The upper heat transfer sheet 24, the fixed plate 25, the lower heat transfer sheet 26, and the leaf spring 27 that overlap the lower side of the LED substrate 23 constitute a heat radiating unit 30 for transferring heat generated by the LEDs 22 to the outside. Although not shown here (see FIG. 5), in the housing of the plug portion 6, the emitted light of the LED 22 is transmitted to the distal end of the insertion portion 5 of the endoscope body 2 (the front end portion 12a of the rigid portion 12). ), The rear end side of the transmission cable 36 for receiving power and transmitting / receiving various signals between the LED substrate 23 and the solid-state imaging device on the endoscope main body 2 side, and the like. A fiber holder 37 that holds the optical fiber and guides it from the vicinity of the LED 22 to the insertion portion 5 side is further accommodated.

  The upper and lower plug covers 20, 21 are made of a resin material (here, polypropylene), and in their combined state, the front portions 20a, 21a that form a tapered internal space S1 (see FIG. 5) toward the front are formed. Have. The optical fiber 35 and the transmission cable 36 from the insertion portion 5 are passed through the opening 2a (see FIG. 5) formed at the front ends of the front portions 20a and 21a. In addition, the upper and lower plug covers 20, 21 have rear portions 20b, 21b that form a substantially rectangular parallelepiped internal space S2 (see FIG. 5) in the coupled state. Each part or member such as the LED board 23 and the heat dissipation unit 30 shown in FIG. 2 is accommodated in the internal space S2.

  The bottom wall 39 of the lower plug cover 21 that defines the internal space S2 is formed with a substantially rectangular notch 40 that exposes the leaf spring 27, as shown in FIG. The configuration of the notch 40 can be variously changed as long as the leaf spring 27 can be exposed. For example, one or more openings can be provided instead of the notch 40.

  The LED board 23 has a well-known configuration in which copper foil is arranged in a predetermined pattern on an insulating base material. The video processor 3 and the electric circuit board are electrically connected to the rear end of the main body having a rectangular shape in plan view. A terminal portion 41 is provided for connection. Although not shown here, the LED board 23 is further provided with a temperature sensor for monitoring the temperature of the LED 22, a non-volatile memory for storing data, control information, and the like. The illumination device of the endoscope system 1 is substantially constituted by the LED substrate 23, the above-described optical fiber 35, an illumination lens, and the like.

  The upper heat transfer sheet 24 is made of a material having high thermal conductivity (here, thermally conductive silicone rubber), and has a rectangular shape slightly smaller than the LED substrate 23 in plan view. The upper heat transfer sheet 24 is flexible enough to be deformable according to a change in the distance between the LED substrate 23 and the fixing plate 25, so that the upper and lower surfaces thereof, the lower surface of the LED substrate 23, and the upper surface of the fixing plate 25 Can maintain good adhesion. The upper heat transfer sheet 24 is provided with three relatively large positioning holes 42 and two relatively small positioning holes 43. Furthermore, the upper heat transfer sheet 24 is provided with a through hole 44 arranged in the front-rear direction.

  The fixing plate 25 is made of a metal material (here, aluminum) and has a substantially rectangular shape in plan view. On the front edge and the rear edge of the fixing plate 25, convex portions 46 and 47 projecting forward and rearward are formed, respectively. Further, on the left and right side edges of the fixing plate 25, a pair of convex portions 48 and 49 are formed extending toward the side at the front end and the rear end, respectively. In addition, circular protrusions 50 and 51 are provided on the upper surface of the fixed plate 25 at positions corresponding to the diameters of the positioning holes 42 and 43 of the upper heat transfer sheet 24. Further, one (rear side) of the two attachment holes 52 provided in the fixing plate 25 is disposed at a position corresponding to the through hole 44 of the upper heat transfer sheet 24.

  The lower heat transfer sheet 26 is made of a material having high thermal conductivity like the upper heat transfer sheet 24 and has a rectangular shape in plan view. The lower heat transfer sheet 26 has flexibility so that it can be deformed according to a change in the distance between the fixing plate 25 and the leaf spring 27, which will be described in detail later. Adhesion with the upper surface of the spring 27 can be maintained well. More specifically, the lower heat transfer sheet 26 has a thickness larger than that of the upper heat transfer sheet 24, and follows the deformation or displacement when the leaf spring 27 described later is elastically deformed or displaced. It is possible to transform itself.

  The upper and lower heat transfer sheets 24 and 26 are not limited to a single material (single layer) as long as good thermal conductivity can be ensured, and a plurality of materials are combined (multi-layer). It may be formed. Moreover, in order to improve adhesiveness with an upper and lower member more, the layer which has adhesiveness may be arrange | positioned at the upper limit surface of the upper side and the lower side heat transfer sheets 24 and 26. FIG.

  The leaf spring 27 is made of a thin metal material (here, having a thickness of 0.1 mm) (here, stainless steel), and has a bottom wall 27a having a substantially rectangular shape in plan view, and a front edge of the bottom wall 27a. It has a front wall 27b extending upward, and a rear wall 27c extending upward from the rear edge of the bottom wall 27a. At the center in the width direction of the front wall 27b and the rear wall 27c, rectangular attachment holes 60 and 61 for attaching the fixing plate 25 are formed, respectively. The upper part of the front wall 27b is bent so as to incline upward and obliquely upward, and the upper part of the rear wall 27c is bent forward so as to be substantially horizontal. On the rear end side of the bottom wall 27a, as shown in FIG. 5, an inclined surface 62 that is inclined upward toward the lower edge side of the rear wall 27c is formed. Thereby, the bottom wall 27 a has a step in the vertical direction via the inclined surface 62.

  The holder member 28 is made of a metal material (here, aluminum), and has an upper wall 28a disposed so as to face the upper wall of the upper plug cover 20, and a front portion and a rear portion of the upper wall 28a with a space therebetween. A pair of leg pieces 28b and 28c are formed so as to extend downward from the left and right edges, respectively. Notch portions 64 and 65 into which the convex portions 48 and 49 of the fixing plate 25 are fitted are provided at the lower portions of the leg pieces 28b and 28c, respectively.

  When the heat radiating unit 30 is assembled, first, as shown in FIG. 3A, the lower heat transfer sheet 26 is overlaid on the upper surface of the bottom wall 27 a of the leaf spring 27. At this time, the front end of the lower heat transfer sheet 26 contacts the front wall 27b of the leaf spring 27, and the lower heat transfer sheet 26 does not overlap the rear end portion including the inclined surface 62 of the bottom wall 27a. is there.

  Next, as shown in FIG. 3B, the fixing plate 25 is overlaid on the upper surface of the lower heat transfer sheet 26. At this time, the front and rear convex portions 46 and 47 of the fixed plate 25 are inserted into the mounting holes 60 and 61 of the front wall 27b and the rear wall 27c of the leaf spring 27, respectively. The front mounting hole 60 has substantially the same lateral width as that of the convex portion 46 and has a width in the vertical direction that is about twice the thickness of the convex portion 46. The rear mounting hole 61 has substantially the same lateral width as that of the convex portion 47 and has a width in the vertical direction that is slightly larger than the thickness of the convex portion 47.

  Next, as shown in FIG. 3C, the upper heat transfer sheet 24 is overlaid on the upper surface of the fixed plate 25. At this time, the circular protrusions 50 and 51 of the fixing plate 25 are inserted into the corresponding positioning holes 42 and 43 of the upper heat transfer sheet 24, respectively. One of the attachment holes 52 of the fixing plate 25 does not overlap the upper heat transfer sheet 24, and the other of the attachment holes 52 is exposed through the through hole 44 of the upper heat transfer sheet 24. Two leg portions 70 protruding from the bottom surface of the fiber holder 37 (see FIG. 5) are inserted into these two mounting holes 52.

  In the heat radiating unit 30, heat radiating grease may be interposed in order to fill minute gaps between the constituent elements. Moreover, the heat radiating unit 30 should just be provided to the heat radiation of LED22 by contacting with LED22 directly or indirectly, and it is not restricted to the said structure, A part of the component is abbreviate | omitted or high It is possible to add a new component having thermal conductivity. Furthermore, the material and shape of each component of the heat dissipation unit 30 can be changed as necessary. A part of the LED substrate 23 can also be regarded as a component of the heat dissipation unit 30.

  As shown in FIG. 5, a potting agent 71 is injected into the internal space S2 of the plug portion 6 in which the LED substrate 23 and the heat dissipation unit 30 are arranged. Thereby, as shown in FIG. 4, the opening 72 in the rear part of the plug part 6 is closed by the potting agent 71 except for the exposure of the terminal part 41 of the LED substrate 23. Further, the notch 40 in the bottom wall 39 of the lower plug cover 21 is closed by the bottom wall 27 a of the leaf spring 27. With such a configuration, the internal spaces S1 and S2 of the plug part 6 are in a sealed state except for the communication with the insertion part 5, and intrusion of dust or the like during use or during high-temperature sterilization processing of the endoscope body 2 Intrusion of high-temperature steam or the like in is prevented. Further, due to the heat insulating effect of the potting agent 71, it is avoided that the housing of the plug portion 6 held by the user becomes hot.

  6 is a perspective view of the main part of the internal structure of the video processor, FIG. 7 is a perspective view of the bottom side of the socket part, and FIG. 8 is a cross-sectional view of the main part showing a connection state between the plug part and the socket part. . FIG. 6 shows a state in which a part (cover member) of the casing constituting the upper wall and the side wall of the video processor 3 is removed. Note that illustration and description of a known hardware configuration for the video processor 3 to perform image processing and the like are omitted.

  As shown in FIG. 6, in the video processor 3, the socket portion 7 is fixed to the front wall 3a and the bottom wall 3b by screws or the like. The metal plate 81 serves as a shield connected to the ground portion. As shown in FIG. 7, the main body of the socket portion 7 is configured by combining a plurality of resin members. An opening 8 is provided in the front wall 7 a of the socket portion 7, and the internal space S 3 connected to the opening 8 can receive the rear portion 6 a of the plug portion 6 inserted from the opening 8. As shown in FIG. 8, an opening 82 is provided on the upper wall of the socket portion 7 that defines the internal space S <b> 3, and a leaf spring 83 for fixing the plug portion 6 from the opening 82 is provided. It protrudes downward. The leaf spring 83 presses the upper wall of the plug portion 6 by the biasing force when the plug portion 6 is inserted into the internal space S3. A connector 84 to which the terminal portion 41 of the LED board 23 inserted into the internal space S3 is connected is provided at the rear portion of the socket portion 7, and the endoscope main body 2 and the connector main body 2 are connected via the terminal portion 41 and the connector 84. The video processor 3 is electrically connected.

  In addition, a metal heat sink 85 for promoting heat dissipation of the heat radiating unit 30 is provided at the front lower portion of the socket portion 7. The heat sink 85 is provided in such a manner that the plug portion 6 is in contact with the bottom surface of the leaf spring 28 of the heat dissipation unit 30 in a state where the plug portion 6 is connected to the socket portion 7 and protrudes downward from the flat plate portion 86. 6 and a plurality of fin portions 87 exposed from the bottom. An opening 88 is provided in the lower wall of the socket portion 7 that defines the internal space S3, and the upper surface of the flat plate portion 86 is exposed to the internal space S3 (see FIG. 7) through the opening 88. is there. Each fin portion 87 has a flat plate shape that is substantially perpendicular to the front-rear direction, and is disposed at a predetermined interval in the front-rear direction. Thereby, each fin part 87 is exhibiting the comb-tooth shape in the side view of FIG.

  The shape of the heat sink 85 can be variously changed as long as it has a portion that can contact (thermally connect) the leaf spring 27. The heat sink 85 is not limited to the air cooling type, and may be a water cooling type. In that case, instead of the cooling fan 101 (or together with the cooling fan 101), a water cooling pump or radiator can be provided in the video processor 3.

  As shown in FIG. 7, a front rectifying wall 91 disposed on the front side of the fin portion 87 of the heat sink 85 and a rear rectifying wall 92 disposed on the rear side of the fin portion 87 are provided at the bottom of the socket portion 7. A cooling air passage 94 extending in the left-right direction is defined between the rectifying walls 91, 92.

  In the video processor 3, as shown in FIG. 6, a cooling fan (blower) 101 is provided on the side of the socket portion 7. The cooling fan 101 functions as a heat radiation promoting means for promoting heat radiation of the heat radiation unit 30 in cooperation with the heat sink 85. A duct 102 communicating with the cooling air passage 94 is attached to the cooling fan 101. When the cooling fan 101 is driven, air is blown so as to suck out air from the cooling air passage 94 through the duct 102.

  FIG. 9 is an explanatory view showing the thermal connection between the heat radiating unit and the heat sink by connecting the plug portion and the socket portion, and FIG. 10 is a state in which the leaf spring and the fixing plate are fitted when the plug portion and the socket portion are connected. It is explanatory drawing which shows the change of. More specifically, FIG. 9 shows (A) when the connection of the plug portion 6 and the socket portion 7 is started, (B) during the connection of the plug portion 6 and the socket portion 7 (when thermal connection is started), and (C) the plug portion. 6 and the connection of the socket part 7 (in the middle of thermal connection) and (D) when the connection of the plug part 6 and the socket part 7 is completed (when the thermal connection is completed), respectively. FIG. 10 shows (A) before connection between the plug portion 6 and the socket portion 7 and (B) after connection between the plug portion 6 and the socket portion 7. In FIG. 9, the illustration of the upper heat transfer sheet 24 in the heat dissipation unit 30 is omitted.

  When the insertion of the plug portion 6 into the socket portion 7 is started, as shown in FIG. 9A, the vertical position of the upper surface 86a of the flat plate portion 86 in the heat sink 85 is aligned with the inclined surface 62 of the leaf spring 27 in the heat radiating unit 30. It almost coincides with the position.

  Subsequently, when the plug portion 6 is pushed into the socket portion 7 side, as shown in FIG. 9B, the heat dissipation unit 30 moves rearward (rightward in FIG. 9), and the front of the flat plate portion 86 of the heat sink 85. The upper corner 86b is in contact with the inclined surface 62 of the leaf spring 27 from below.

  Subsequently, when the plug portion 6 is further pushed into the socket portion 7 side, the heat radiating unit 30 further moves rearward as shown in FIG. 9C. At this time, the leaf spring 27 is elastically deformed by being pressed against the flat plate portion 86 of the heat sink 85, and the rear end side of the bottom wall 27 a is displaced upward to ride on the upper surface 86 a of the flat plate portion 86 of the heat sink 85. It becomes. At the same time, the rear end side of the lower heat transfer sheet 26 is pressed between the bottom wall 27a of the leaf spring 27 and the fixed plate 25 and elastically deforms so as to reduce the thickness in the vertical direction.

  Finally, when the plug portion 6 is completely inserted into the socket portion 7, the heat radiating unit 30 moves above the heat sink 85 as shown in FIG. At this time, the bottom wall 27a of the leaf spring 27 is displaced upward, and substantially the entire bottom wall 27a (excluding the inclined surface 62 and the upper portion on the rear end side of the inclined surface 62) is the upper surface 86a of the flat plate portion 86 in the heat sink 85. It will be in the state where it got on. That is, the lower surface of the bottom wall 27 a of the leaf spring 27 and the upper surface 86 a of the flat plate portion 86 of the heat sink 85 are in close contact with each other. At the same time, the entire lower heat transfer sheet 26 is pressed between the bottom wall 27a of the leaf spring 27 and the fixed plate 25, and is elastically deformed so as to reduce the thickness in the vertical direction. In addition, when the plug part 6 is pulled out from the socket part 7, it returns to the state shown to FIG. 9 (A) again.

  The upward displacement of the bottom wall 27a in the leaf spring 27 as described above is due to the elastic deformation of the leaf spring 27 and the upward movement of the front wall 27b as shown in FIG. In the leaf spring 27 shown in FIG. 9A, the convex portion 46 of the fixing plate 25 inserted into the attachment hole 60 of the front wall 27b is formed on the lower edge side of the attachment hole 60 as shown in FIG. In the lower position. On the other hand, in the leaf spring 27 shown in FIG. 9 (D), the front wall 27b is displaced upward from the position of FIG. 9 (A), so that the convex portion 46 of the fixed plate 25 is as shown in FIG. 10 (B). In addition, it is at an upper position on the upper edge side of the mounting hole 60.

  That is, in the leaf spring 27, since the vertical width of the mounting hole 60 is set to be larger than the thickness of the convex portion 46, the upward movement of the front wall 27b is allowed and a good close contact with the heat sink 85 is achieved. Realized. Note that the rear wall 27a extends from the upper side of the inclined surface of the bottom wall 27a, and thus does not necessarily need to move upward like the front wall 27b, but the mounting hole 61 (see FIG. 3). Is set to be slightly larger than the thickness of the convex portion 46, so that a slight upward movement is allowed.

  In the thermal connection state between the heat radiating unit 30 and the heat sink 85 shown in FIG. 9D, the heat from the LED 22 (see FIG. 8) (more strictly, the heat from the LED substrate 23) is the heat radiating unit 30 side. The upper heat transfer sheet 24 (see FIG. 8), the fixed plate 25, the lower heat transfer sheet 26, and the leaf spring 27 are sequentially transmitted to the lower side sequentially, and then the flat plate of the heat sink 85 from the bottom wall 27a of the leaf spring 27. Is transmitted to the unit 86. The heat transmitted to the heat sink 85 is radiated from the fin portion 87 to the atmosphere in the video processor 3. Since the cooling air of the cooling fan 101 which will be described later passes through the gap G between the plurality of fin portions 87 having a comb shape, effective heat dissipation is possible.

  FIG. 11 is an explanatory diagram showing the flow of cooling air from the cooling fan in the video processor. The air blowing direction of the cooling fan 101 is set so as to incline backward with respect to the right side wall 3c of the video processor 3 as indicated by an arrow A, whereby the cooling air from the cooling fan 101 is As shown by the arrow B, it flows backward along the right side wall 3c. In this case, since the blowing direction of the cooling fan 101 is inclined with respect to the extending direction (front-rear direction) of the peripheral wall (here, the right side wall 3 c) of the video processor 3, the space on the blowing port side of the cooling fan 101. Is efficiently ensured, and an increase in the size of the casing of the video processor 3 can be avoided.

  Thereafter, the cooling air flows along the rear wall 3d and the left side wall 3e of the video processor 3 as indicated by arrows C and D, and thereafter, from the left to the right as indicated by the arrow E. It is circulated by entering the duct 102 through the passage 94 (see FIG. 7). As described above, in the video processor 3, the cooling air is circulated along the peripheral walls (the right side wall 3c, the rear wall 3d, the left side wall 3e, and the like), so that a part of the casing of the video processor 3 is used as a heat sink. A large heat dissipation area to the outside can be secured. Therefore, in the video processor 3, it is not necessary to provide an exhaust port for exhausting the cooling air to the outside in the housing. As a result, in the video processor 3, the internal space can be substantially sealed, and entry of dust and the like can be prevented.

  In order to circulate the cooling air more smoothly along the peripheral wall, for example, an inner wall that is disposed to be opposed to the right side wall 3c, the rear wall 3d, and the left side wall 3e at a predetermined interval is provided. A cooling air passage may be defined with the peripheral wall.

  Thus, in the endoscope system 1, the heat radiating unit 30 for the LED 22 is provided in the plug portion 6 of the endoscope main body 2, and the heat sink 85 that promotes the heat radiating of the heat radiating unit 30 in the socket portion 7 of the video processor 3. Therefore, the LED 22 can be effectively cooled while avoiding an increase in the size of the endoscope body 2 even when the LED 22 has a high brightness or a large number of low brightness LEDs are arranged. The disadvantage that the plug portion 6 becomes large and cannot be gripped with one hand can be avoided.

  As a light source of the endoscope system 1, a relatively small LED is preferable, but not limited to this, other known light sources may be used. Moreover, although it is preferable that the thermal radiation unit 30 contains the some component which has high heat conductivity, depending on the case, you may be comprised only from one member which has high heat conductivity. In addition, as a means for promoting the heat radiation of the heat radiating unit 30, the heat sink 85 is preferable from the viewpoint of avoiding the complexity of the configuration, but as long as it can be thermally connected to at least the heat radiating unit 30, other well-known Means may be used. For example, a configuration in which the heat sink 85 is omitted and the heat radiating unit 30 is directly cooled by the cooling air of the cooling fan 101 is also possible. When the air-cooled heat sink 85 is used, the heat radiation of the heat radiating unit 30 is further promoted by adding the cooling fan 101 that promotes the air cooling. The cooling fan 101 is always driven, but a configuration in which driving is controlled (turned on and off) in accordance with a value of a temperature sensor provided on the LED substrate 23 is also possible.

  In addition, as a heat radiating device connected to the endoscope main body 2, the video processor 3 is preferable for convenience of being able to perform electrical connection and thermal connection at the same time, but is not necessarily limited thereto. is not. For example, in the endoscope system 1, a dedicated heat dissipation device that is thermally connected to the endoscope body 2 separately from the video processor 3 that is electrically connected to the endoscope body 2 via a cable or the like. May be provided.

  Further, since the heat dissipation unit 30 of the endoscope system 1 includes the leaf spring 27 that elastically deforms when it comes into contact with the heat sink 85, contact with the heat sink 85 using the restoring force of the elastic deformation of the leaf spring 27. The state can be maintained well, and the LED 22 can be cooled more stably. Further, the use of the leaf spring 27 also has an advantage that an error in the positions of both contact surfaces of the heat dissipation unit 30 and the heat sink 85 is allowed to some extent.

  Further, since the heat radiating unit 30 of the endoscope system 1 includes the flexible lower heat transfer sheet 26 disposed between the leaf spring 27 and the fixed plate 25, the plate is brought into contact with the heat sink 85. Even when the spring 27 is displaced inward, the heat transfer between the heat sink 85 and the leaf spring 27 (that is, heat transfer in the heat dissipation unit 30) is favorably maintained by the deformation of the lower heat transfer sheet 26. Further, the restoring force of the deformed lower heat transfer sheet 26 contributes to maintaining a good contact state between the heat dissipation unit 30 and the heat sink 85, similarly to the restoring force of the leaf spring 27. The member that contacts the heat sink 85 is not necessarily limited to the leaf spring 27, and a metallic flat plate having high thermal conductivity may be used instead of the leaf spring 27.

  As mentioned above, although this invention was demonstrated based on specific embodiment, these embodiment is an illustration to the last, Comprising: This invention is not limited by these embodiment. For example, the endoscope system according to the present invention can be applied not only to a flexible endoscope but also to a rigid endoscope, and its use (observation target) is not limited to medical use. It should be noted that not all the constituent elements of the endoscope according to the present invention shown in the above embodiment are necessarily essential, and can be appropriately selected as long as they do not depart from the scope of the present invention.

  An endoscope and an endoscope system according to the present invention have a configuration in which a light source for illumination is provided in an endoscope body, and a light source capable of avoiding an increase in size of the endoscope body while achieving high output of the light source Therefore, it is useful as an endoscope and an endoscope system for imaging the inside of an observation object that cannot be directly observed from the outside.

DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope body 3 Video processor (heat dissipation device, processor device)
5 Insertion part 6 Plug part (connection part)
7 Socket part (connected part)
20 Upper plug cover 21 Lower plug cover 22 LED (light source)
23 LED board 24 Upper heat transfer sheet 25 Fixed plate (second heat transfer plate)
27 Leaf spring 27 (first heat transfer plate)
28 Holder member 35 Optical fiber 39 Bottom wall 27a
40 notch portion 41 terminal portion 85 heat sink 30 heat dissipation unit 85 heat sink (heat dissipation promoting means)
101 Cooling fan (blower, heat dissipation promotion means)

Claims (9)

An endoscope body having an insertion portion to be inserted into the observation target and a connecting portion to which the rear portion of the insertion portion is connected;
A heat dissipating device having a connected portion to which the connecting portion is connected;
The connection portion is provided with a light source for illumination and a heat radiating unit that transmits heat generated by the light source to the outside.
The endoscope system according to claim 1, wherein the connected portion is provided with a heat dissipation accelerating means for accelerating heat dissipation of the heat radiating unit in a state where the connecting portion is connected to the connected portion.   The endoscope system according to claim 1, wherein the heat dissipation promoting means includes a heat sink that contacts the heat dissipation unit when the connecting portion is connected to the connected portion. The heat radiating unit includes a first heat transfer plate exposed from an outer shell of the connecting portion,
The endoscope system according to claim 2, wherein the heat sink is in contact with the first heat transfer plate when the connecting portion is connected to the connected portion.   The first heat transfer plate includes a leaf spring provided so as to be elastically deformed when being in contact with the heat sink, and a restoring force of the elastic deformation acts in a contact direction with the heat sink. The endoscope system according to claim 3.   The heat radiating unit further includes a second heat transfer plate disposed inside the first heat transfer plate and a flexible heat transfer sheet disposed between the first and second heat transfer plates. The endoscope system according to claim 3 or 4, characterized by the above.   The endoscope system according to any one of claims 2 to 5, wherein the heat radiation promoting means further includes a blower capable of cooling at least one of the heat radiation unit and the heat sink. The heat dissipation device is a processor device for image processing,
7. The endoscope according to claim 1, wherein the endoscope body is electrically connected to the processor device when the connecting portion is connected to the connected portion. Endoscopic system. The processor device has a substantially sealed internal space,
The endoscope system according to claim 7, wherein cooling air from the blower is circulated along a peripheral wall of the processor device. An endoscope having an insertion portion to be inserted into an observation target and a connecting portion to which a rear portion of the insertion portion is connected,
The connection portion is provided with a light source for illumination and a heat radiating unit that transmits heat generated by the light source to the outside.
The endoscope, wherein the heat dissipation unit includes a heat transfer plate exposed from an outer shell of the connecting portion.

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