JP2014110428A - Conditioning and wafer retaining ring, and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer retaining ring for use in a chemical mechanical polishing (CMP) process as a part of a semiconductor device manufacturing process.SOLUTION: A wafer retaining ring 100 for preventing a wafer from slipping during polishing in a CMP process has a structure including many cutting tips 110 comprising many protrusions, the cutting tips formed to be spaced at a predetermined distance on the surface of the ring to function as a conditioner.

Description

  The present invention relates to a wafer retainer ring used in a chemical mechanical polishing (CMP) process, which is a part of a semiconductor device manufacturing process, and more specifically, prevents a wafer from being detached during a CMP (chemical mechanical polishing) process. In addition, the present invention relates to a conditioner / wafer retainer ring and a method for manufacturing the same, which are designed so that the pad can be uniformly conditioned.

  CMP is a chemical mechanical polishing process, which is a polishing process for obtaining flatness of a semiconductor wafer by simultaneously using a polishing removal process and a chemical solution dissolving action.

  The CMP process is performed in the process of supplying a polishing liquid (slurry) composed of polishing particles and a chemical liquid onto the polishing pad while relatively moving the polishing pad and the wafer in a state where they are pressurized with each other. At this time, a large number of foam pores on the surface of the polishing pad made of polyurethane material serve to keep a new polishing liquid, and a certain polishing efficiency and polishing uniformity over the entire wafer surface can be obtained.

  Next, a polishing head of a conventional CMP apparatus will be briefly described with reference to FIG.

  As shown in FIG. 1, a polishing head 10 of a CMP apparatus includes a wafer holder 22 that supports a wafer 24 during a CMP process, a retainer ring 26 that prevents the wafer 24 from being detached during polishing, and these A head main body 28 is provided to support the portion and apply polishing pressure. Since the polishing head 10 needs a pressurizing function and a rotating function, the polishing head 10 has a rotation driving shaft 30 at the center, and a method of applying a load along this axis is general. Here, the retainer ring 26 is installed to prevent the wafer 24 adsorbed by surface tension or vacuum. The retainer ring 26 also functions as a means for ensuring the uniformity of polishing.

  The CMP process will be briefly described as follows. The wafer 24 is set on the wafer holder 22, and the slurry 34 is formed on the polishing pad 32 while the wafer holder 22 is rotated by the rotary drive shaft 30 while the wafer 24 is in surface contact with the polishing pad 32. Then, the slurry 34 is supplied to the wafer 24 through the gap between the retainer ring 26 and the polishing pad 32, and CMP is performed.

  As shown in FIG. 2, the retainer ring 26 has a plurality of grooves 36 having predetermined widths and depths formed at regular intervals so as to penetrate from the outer peripheral surface of the ring to the inner peripheral surface. Has been. This prevents the wafer 24 held in the wafer holder 22 from slipping during the chemical mechanical polishing of the wafer 24, and friction with the polishing pad 32 causes the slurry 34 to adhere to the wafer 24. Make the supply uniform. Then, the surface of the polishing pad 32 is conditioned so that the wafer 24 is uniformly polished.

  However, since pressure and relative speed are applied during polishing, the surface of the polishing pad deforms unevenly over time and the pores on the polishing pad are clogged with polishing residues, resulting in a normal polishing pad. Can no longer play a role. This makes it impossible to achieve wide area planarization over the entire surface of the wafer and polishing uniformity between the wafers over the entire processing time.

  In order to solve the uneven deformation of the CMP polishing pad and the clogging of the pores, the CMP pad conditioning is performed so that new fine pores are formed by finely polishing the surface of the polishing pad using a CMP pad conditioner. Do work.

  Therefore, typical consumable parts used in the CMP process can include pads, slurry, wafer retainer rings, conditioners, and the like. Among these, the wafer retainer ring serves to prevent the wafer from being detached during the CMP process and to improve the uniformity of the wafer. Further, the CMP pad conditioner serves to improve the flowability of the slurry supplied to the pad and to scrape the pad little by little to maintain the same state as the initial state.

  As described above, in the existing CMP process, the wafer retainer ring is used to prevent the wafer from being detached, and the CMP pad conditioner for conditioning the pad is used to maintain the initial pad state. .

  As a result of diligent research efforts, the present inventor has completed the present invention by developing a component having a structure combining a wafer retainer ring and a CMP pad conditioner.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a wafer retainer ring with a conditioner function having a structure capable of increasing the material removal rate of the wafer by setting the pads on the entire surface of the wafer immediately before polishing the wafer, and a method for manufacturing the same. Is to provide.

  Another object of the present invention is to provide a wafer retainer ring with a conditioner function having a structure capable of reducing wafer scratching and contamination by eliminating the use of a chemically unstable CMP pad conditioner, and a method of manufacturing the same. It is in.

  Another object of the present invention is to increase the polishing uniformity of the wafer by sufficiently widening the width of the outer peripheral surface side of the groove penetrating the wafer retainer ring so that the slurry is efficiently supplied to the wafer. It is an object of the present invention to provide a wafer retainer ring with a conditioner function and a method of manufacturing the same that can reduce costs by reducing the amount of slurry that is wasted without being supplied to the wafer.

  Another object of the present invention is to provide a wafer retainer ring with a conditioner function and a CMP apparatus including the same that can reduce the cost of consumable materials by eliminating the use of a CMP pad conditioner.

  Another object of the present invention is to eliminate the need for an apparatus for driving the CMP pad conditioner, so that the space utilization of the CMP equipment can be increased and a wafer polishing apparatus can be added, thereby increasing the productivity of wafer polishing. It is an object to provide a wafer retainer ring with a conditioner function and a CMP apparatus including the same.

  Another object of the present invention is to provide a wafer retainer ring with a conditioner function and a CMP apparatus including the same that can reduce the cost of CMP equipment and can greatly reduce the productivity and cost of the CMP process. It is in.

  The object of the present invention is not limited to the object described above, and other objects not described above will be clearly understood by those skilled in the art from the following description.

  In order to achieve the above object, the present invention provides a wafer retainer ring that prevents a wafer from being detached during polishing during a CMP process, and the wafer retainer ring includes a plurality of spacers spaced on the surface thereof. There is provided a conditioner / wafer retainer ring characterized in that it has a structure including a large number of cutting tip portions made of protrusions at regular intervals and can act as a conditioner.

  In a preferred embodiment, a predetermined interval between a plurality of cutting tip portions formed on the surface of the retainer ring has a predetermined width and depth so as to penetrate from the outer peripheral surface to the inner peripheral surface of the wafer retainer ring. It has a groove.

  In a preferred embodiment, the width of the groove on the outer peripheral surface side is formed wider than the width on the inner peripheral surface side.

  In a preferred embodiment, the retainer ring is formed of any one of a reinforced polymer composite material, a cemented carbide material, and a ceramic material.

  In a preferred embodiment, a diamond coat layer is further formed on the surfaces of a plurality of protrusions constituting the cutting tip portion.

  In a preferred embodiment, the side cross-sectional shape of the projecting portion constituting the cutting tip portion is a polygon.

  In a preferred embodiment, the planar shape of the projecting portion constituting the cutting tip portion is any one of a polygon, a circle, and an ellipse.

  In a preferred embodiment, the cutting tip portion is provided with a plurality of protrusions spaced from the inner peripheral surface of the retainer ring at a constant width.

  The present invention also provides a step of preparing a ring-shaped substrate having a certain thickness and width, and penetrates the surface of the ring-shaped substrate from the outer peripheral surface to the inner peripheral surface of the ring-shaped substrate. A groove forming step of forming a large number of grooves having a predetermined width and depth at a constant interval; and a cutting tip portion forming step of separating a large number of protrusions on the surface between the formed grooves. A method for manufacturing a conditioner / wafer retainer ring is provided.

  In a preferred embodiment, the groove forming step is performed such that a width on the outer peripheral surface side of the groove is wider than a width on the inner peripheral surface side.

  In a preferred embodiment, the cutting tip portion forming step is performed such that a side cross-sectional shape of the plurality of protrusions has a polygonal shape.

  In a preferred embodiment, the cutting tip portion forming step is performed such that the planar shape of the plurality of protrusions is any one of a polygon, a circle, and an ellipse.

  In a preferred embodiment, the cutting tip portion forming step is performed such that a plurality of protrusions are provided at a constant width from the inner peripheral surface side of the ring-shaped substrate.

  In a preferred embodiment, the method further includes a diamond layer forming step of forming a diamond coat layer on the surface of a plurality of protrusions constituting the cutting tip portion.

  The present invention also provides a CMP apparatus including any one of the conditioner / wafer retainer rings described above or the conditioner / wafer retainer ring manufactured by any one of the manufacturing methods described above.

  In a preferred embodiment, the CMP apparatus does not include a separate conditioning means.

  The present invention has the following excellent effects.

  First, according to the present invention, the pad on the entire surface of the wafer can be in an initial state immediately before polishing the wafer, and the material removal rate of the wafer can be increased.

Further, according to the present invention, it is possible to reduce the scratches and contamination of the wafer by eliminating the use of a chemically unstable CMP pad conditioner.
In addition, according to the present invention, the width of the outer peripheral surface of the groove penetrating the wafer retainer ring is sufficiently widened so that the slurry can be efficiently supplied to the wafer, thereby improving the polishing uniformity of the wafer. The cost savings can be realized by improving and minimizing the amount of slurry that is wasted without being supplied to the wafer.

  Further, according to the present invention, it is possible to reduce the cost of consumable materials by eliminating the use of the CMP pad conditioner.

  Further, according to the present invention, since an apparatus for driving the CMP pad conditioner is not required, the space utilization of the CMP equipment can be increased and a wafer polishing apparatus can be added, thereby increasing the productivity of wafer polishing. Can do.

  In addition, according to the present invention, the cost of the CMP equipment can be reduced, and the productivity and cost of the CMP process can be greatly reduced.

It is a block diagram which shows the polishing head of the conventional chemical mechanical polishing apparatus. It is a top view which expands and shows the wafer retainer ring of FIG. It is the top view and partial enlarged view of the conditioner and wafer retainer ring which concern on one Example of this invention. It is a partial top view of the conditioner and wafer retainer ring which shows the form of the groove | channel of the retainer ring which concerns on the other Example of this invention. It is a partial top view of the conditioner and wafer retainer ring which shows the form of the groove | channel of the retainer ring which concerns on the other Example of this invention. It is a partial perspective view which shows many protrusion parts of various shapes which comprise the cutting tip formed in the surface of the wafer retainer ring which concerns on another Example of this invention. It is a partial perspective view which shows many protrusion parts of various shapes which comprise the cutting tip formed in the surface of the wafer retainer ring which concerns on another Example of this invention. It is a partial perspective view which shows many protrusion parts of various shapes which comprise the cutting tip formed in the surface of the wafer retainer ring which concerns on another Example of this invention. It is a partial perspective view which shows many protrusion parts of various shapes which comprise the cutting tip formed in the surface of the wafer retainer ring which concerns on another Example of this invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention. 3 is a photograph showing the morphology of a polishing pad conditioned by a conventional method and a conditioner and retainer ring according to an embodiment of the present invention.

  For the terms in the present invention, general terms that are currently widely used are selected as much as possible. However, in certain cases, there are terms arbitrarily selected by the applicant, but in this case, the meaning is not considered a simple term name but is understood in consideration of the meaning described or used in the detailed description of the invention. Should be done.

  Hereinafter, the technical configuration of the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

  However, the present invention is not limited to the embodiments described herein, and can be embodied in other forms. The same reference numbers used to describe the invention throughout the specification denote the same components.

  A technical feature of the present invention resides in a conditioner / wafer retainer ring having a structure capable of acting as a wafer retainer ring and at the same time as a conditioner by forming a cutting tip portion on the surface of the wafer retainer ring.

  Therefore, the conditioner and wafer retainer ring 100 of the present invention is a wafer retainer ring that prevents the wafer from being detached during polishing during the CMP process, as shown in FIG. It has a structure that includes a large number of cutting tip portions 110 made up of a large number of protrusions spaced on the surface at regular intervals, and can act as a conditioner.

  Further, the conditioner and wafer retainer ring 100 according to the present invention is configured such that a certain distance between the many cutting tip portions 110 formed on the surface penetrates from the outer peripheral surface 130 to the inner peripheral surface 140 of the wafer retainer ring 100. The groove 120 has a predetermined width and depth. In particular, as shown in FIGS. 4a and 4b, the width on the outer peripheral surface 130 side of the groove 120 is wider than the width on the inner peripheral surface 140 side. Preferably it is formed. This is because when the groove 120 has such a configuration, the slurry is efficiently supplied to the wafer to improve the polishing uniformity of the wafer and minimize the amount of slurry that is wasted without being supplied to the wafer. This is because cost savings can be realized.

On the other hand, the conditioner / wafer retainer ring according to the present invention is preferably made of a material excellent in chemical resistance, but can be formed of any one of a reinforced polymer composite material, a cemented carbide material, and a ceramic material. . At this time, the reinforced polymer composite material includes a known polymer material including a reinforced plastic and having a significantly increased strength. Cemented carbide materials include tungsten carbide-cobalt (WC-Co), tungsten carbide-titanium carbide-cobalt (WC-TiC-Co), tungsten carbide-titanium carbide-tantalum carbide-cobalt (WC-TiC-TaC). It includes cermet (TiC), boron carbide (B ₄ C) -based, titanium borate (TiB ₂ ) -based cemented carbide, including tungsten carbide (WC) -based cemented carbide such as —Co). Ceramic materials include silicon nitride (Si ₃ N ₄ ), silicon (Si), aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), titanium oxide (TiO ₂ ), zirconium oxide (ZrO _x ), Silicon oxide (SiO ₂ ), silicon carbide (SiC), silicon oxynitride (SiO _x N _y ), tungsten nitride (WN _x ), tungsten oxide (WO _x ), DLC (Diamond Like Coating), boron nitride (BN), Alternatively, chromium oxide (Cr ₂ O ₃ ) or the like is included.

  Further, by further forming a diamond coat layer on the surface of a large number of protrusions constituting the cutting tip portion 110 formed on the surface of the conditioner and wafer retainer ring 100 of the present invention, the polishing performance can be improved. Can enhance chemical resistance, wear resistance and durability.

  At this time, the large number of cutting tip portions 110 can be formed by forming a large number of protruding portions designed according to a predetermined cutting tip pattern. For example, as shown in FIG. 3, FIG. 5a and FIG. 5b, it is composed of a large number of protrusions formed in a square cross-sectional shape spaced apart from each other, or formed in a triangular cross-sectional shape as shown in FIG. 5c. It may consist of a number of protrusions. Further, the planar shape of the multiple protrusions constituting the multiple cutting tip portions 110 may be a polygonal shape, a circular shape, or an elliptical shape. The cross-sectional shape and planar shape of such a protrusion are not shown, but when the protrusion is viewed three-dimensionally, the shape of the protrusion is a polygonal pyramid, a polygonal column, a cone, an elliptical cone, a cylinder It can also be seen that it may be elliptical.

  In addition, as shown in FIG. 5d, a large number of cutting tips 110 may be provided with a large number of protrusions spaced from the inner peripheral surface 140 side of the wafer retainer ring 100 at a constant width. With such a structure, the by-product (sludge) generated after pad conditioning by the cutting tip part 110 can be prevented from entering the wafer, and the scratch of the wafer can be reduced.

  Next, a method of manufacturing a conditioner and wafer retainer ring according to the present invention includes a step of preparing a ring-shaped substrate having a certain thickness and width, and an outer periphery of the ring-shaped substrate on the surface of the ring-shaped substrate. A groove forming step of forming a plurality of grooves having a predetermined width and depth at regular intervals so as to penetrate from the surface to the inner peripheral surface, and a plurality of protrusions on a surface between the plurality of grooves formed The groove forming step and the cutting tip portion forming step can be performed by a method such as mechanical processing, laser processing, or etching of the ring-shaped substrate. At this time, it is preferable that the depth of the groove formed in the groove forming stage is deeper than the height of the protruding portion constituting the cutting tip portion.

  In some cases, the method may further include a diamond layer forming step of forming a diamond coat layer on the surface of a large number of protrusions constituting the cutting tip portion. The diamond coat layer may be formed using a CVD (chemical vapor deposition) method. The cutting tip portion 110 may be entirely coated, or may be formed so as to be coated only on the upper portions of a large number of protrusions constituting the cutting tip portion 110. Before forming the diamond coat layer, it is preferable to ultrasonically pretreat the ring-shaped substrate on which the cutting tip portion 110 is formed. This is because the cutting tip portion is formed using fine diamond particles in the ultrasonic pretreatment process. This is to form a fine scratch on 110 so that the coating state of the diamond coat layer 3 becomes hard.

Example 1
The conditioner / wafer retainer ring 100 having the configuration shown in FIG. 3 was manufactured as follows by the grinding wheel processing method so as to have the cutting tip portion 110 shown in FIG. 5a. First, after preparing a ring-shaped substrate having a thickness of 6 mm and a width of 24 mm (a diameter of 301 mm up to the inner peripheral surface and a diameter of 349 mm up to the outer peripheral surface), a groove 120 having a depth of 3 mm and a width of 3 mm is formed on the substrate as a polishing wheel. Formed by processing. After that, the tip of the protruding portion is formed in a planar shape on the substrate surface between the grooves, the size of the protruding portion is 200 μm × 200 μm, the height of the protruding portion is 1000 μm, and the interval between the protruding portions is 2000 μm. Conditioner and wafer retainer ring 1 was manufactured by forming the cutting tip portion 110 by grinding a wheel.

Example 2
A conditioner / wafer retainer ring 2 was manufactured in the same manner as in Example 1 except that the cutting tip portion 110 was formed in the shape shown in FIG. Here, the cutting tip portion 110 was formed with the tip portion of the protruding portion having a planar shape, the size of the protruding portion being 100 μm × 100 μm, the height of the protruding portion being 1000 μm, and the interval between the protruding portions being 1000 μm.

Example 3
A conditioner / wafer retainer ring 3 was manufactured in the same manner as in Example 1 except that the cutting tip portion 110 was formed in the shape shown in FIG. 5c. Here, the cutting tip portion 110 has a protruding portion made in a pyramid shape (cone shape), the size of the lower end portion of the protruding portion is 200 μm × 200 μm, the height of the protruding portion is 1000 μm, and the interval between the protruding portions is 2000 μm. Formed.

Example 4
A conditioner / wafer retainer ring 4 was manufactured in the same manner as in Example 1 except that the cutting tip portion 110 was formed in the shape shown in FIG. 5d. Here, the cutting tip portion 110 was formed in the same manner as in Example 1, but the protruding portion was formed with an interval of 3 mm from the inner peripheral surface 140 of the ring-shaped substrate.

Comparative Example A conventional wafer retainer ring shown in FIG. 2 was prepared.

Experimental Examples 1-6
The morphology of the pad surface after performing the CMP process using only the conventional wafer retainer ring obtained in the comparative example, and the CMP using the conventional wafer retainer ring obtained in the comparative example and the conditioning means in combination. The morphology of the pad surface after the process was observed, and the results are shown in FIGS. 6a and 6 and Table 1 (Experimental Examples 1 and 2). Moreover, after performing a CMP process using the conditioner and wafer retainer ring obtained in Examples 1 to 4 without any additional conditioning means, the morphology of the pad surface was observed, and the results were shown in FIGS. The results are shown in Table 1 (Experimental Examples 3 to 6). At this time, the equipment used was a 300 mm CMP tester, and the slurry was silica slurry.

  From Table 1, it was confirmed that when the conditioner and wafer retainer rings 1 to 4 obtained in the examples of the present invention were used, the pad was worn even if the CMP process was performed without any additional conditioning means. . Referring to FIGS. 6c-6f, the pad surface can also form a pad morphology similar to that obtained in a CMP process using a conventional diamond conditioner with a conventional wafer retainer ring, as shown in FIG. 6b. I understand that I can do it. On the other hand, only the conventional wafer retainer ring is used, and the result of FIG. 6a showing the result of Experimental Example 1 in which no separate conditioner is used shows that the pad wear is completely absent when only the conventional wafer retainer ring is used. This indicates that a lot of wafer clutches are generated and the CMP process is not normally performed.

  On the other hand, in Experimental Example 6 using the conditioner and wafer retainer ring 4, the result of reducing the wafer clutch was obtained by not forming the chip inside the wafer retainer ring. This is presumed to be because the by-product (sludge) generated after the pad conditioning is prevented from entering the wafer.

  From the above-described experimental results, even if the CMP pad conditioning means is excluded from the conventional CMP equipment, if the conditioner / wafer retaining ring according to the present invention including the conditioning function is included in the wafer retaining ring, a normal CMP process is performed. Can be confirmed.

  Accordingly, when the conditioner and wafer retainer ring of the present invention is employed, it is predicted that a CMP pad conditioner is not required, so that the CMP equipment can be simplified and many advantages can be obtained.

  Although the present invention has been illustrated and described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and is within the scope of the spirit of the present invention, and is generally used in the technical field to which the present invention belongs. It will be possible to make various variations and modifications by those who have knowledge of the above.

100 Conditioner and wafer retainer ring 110 Cutting tip portion 120 Groove 130 Outer peripheral surface of wafer retainer ring 140 Inner peripheral surface of wafer retainer ring

Claims (16)

Wafer retainer ring that prevents the wafer from being detached during polishing during the CMP process,
The wafer retainer ring has a structure that includes a large number of cutting tip portions formed of a large number of protrusions spaced on the surface at a constant interval, and can function as a conditioner. Wafer retainer ring.   The wafer retainer ring is formed of grooves having a predetermined width and depth so that a predetermined interval between a plurality of cutting tip portions formed on the surface of the wafer retainer ring penetrates from the outer peripheral surface to the inner peripheral surface of the wafer retainer ring. The conditioner / wafer retainer ring according to claim 1, wherein:   The conditioner / wafer retainer ring according to claim 2, wherein a width of the groove on the outer peripheral surface side is wider than that on the inner peripheral surface side.   The conditioner and wafer retainer ring according to claim 1, wherein the wafer retainer ring is formed of any one of a reinforced polymer composite material, a cemented carbide material, and a ceramic material.   The conditioner and wafer retainer ring according to claim 1, wherein a diamond coat layer is further formed on the surfaces of a plurality of protrusions constituting the cutting tip part.   The conditioner and wafer retainer ring according to claim 1, wherein a side cross-sectional shape of the projecting portion constituting the cutting tip portion is a polygon.   2. The conditioner and wafer retainer ring according to claim 1, wherein a planar shape of the projecting portion constituting the cutting tip portion is any one of a polygon, a circle and an ellipse.   The conditioner and wafer retainer ring according to claim 1, wherein the cutting tip portion is provided with a plurality of protrusions spaced from the inner peripheral surface side of the retainer ring at a constant width. Providing a ring-shaped substrate having a constant thickness and width;
A groove forming step of forming a large number of grooves having a predetermined width and depth at regular intervals on the surface of the ring-shaped substrate so as to penetrate from the outer peripheral surface of the ring-shaped substrate to the inner peripheral surface;
A manufacturing method of a conditioner / wafer retainer ring, comprising: a cutting tip portion forming step of providing a plurality of protrusions on a surface between the plurality of grooves.   The conditioner and wafer retainer ring manufacturing method according to claim 9, wherein the groove forming step is performed such that a width of an outer peripheral surface side of the groove is wider than a width of the inner peripheral surface side. Method.   The method of manufacturing a conditioner and wafer retainer ring according to claim 9, wherein the cutting tip portion forming step is performed such that a side cross-sectional shape of the plurality of protrusions has a polygonal shape.   10. The conditioner / cumulator according to claim 9, wherein the cutting tip portion forming step is performed such that the planar shape of the plurality of protrusions has any one of a polygonal shape, a circular shape, and an elliptical shape. Manufacturing method of wafer retainer ring.   The conditioner according to claim 9, wherein the cutting tip portion forming step is performed such that a plurality of protrusions are provided at a constant width from an inner peripheral surface side of the ring-shaped substrate. Also a method for manufacturing wafer retainer rings.   The method for manufacturing a conditioner / wafer retainer ring according to claim 9, further comprising a diamond layer forming step of forming a diamond coat layer on the surface of a plurality of protrusions constituting the cutting tip portion.   A CMP apparatus comprising the conditioner / wafer retainer ring according to any one of claims 1 to 8, or the conditioner / wafer retainer ring manufactured by the manufacturing method according to any one of claims 9 to 14. The CMP apparatus according to claim 15, wherein the CMP apparatus does not include a separate conditioning unit.