JP2014106012A - Magnetic sensor apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic sensor apparatus fabricated by a process in which a magnetic sensor device is connected to a substrate easily.SOLUTION: A magnetic sensor apparatus 5 comprises: a case 10; a sensor unit 8 having a magnetic sensor device 13; a first substrate 12A; and a second substrate 12B. The second substrate 12B is horizontally fixed to the case 10. The first substrate 12A is vertically positioned in a direction perpendicular to the second substrate 12B by fitting a connector 50 onto the first substrate 12A. After the positioning, the first substrate 12A is parallel to the direction in which a terminal pin 38 of the magnetic sensor device 13 extends. A land 62 soldering the terminal pin 38 is provided on a surface 61 of the first substrate 12A. A metal layer 65, which is joined to the land 62, is provided on the inner periphery of a through-hole 63 provided in the first substrate 12A.

Description

  The present invention relates to a magnetic sensor device that detects a magnetic pattern of a medium such as a banknote printed with magnetic ink.

  As a device for detecting a magnetic pattern of a medium conveyed along a medium conveying surface, a magnetic sensor device is known which magnetizes a medium with a magnet and reads the magnetic pattern of the magnetized medium. A magnetic sensor device mounted on a magnetic pattern detection device described in Patent Document 1 includes an excitation coil for generating a bias magnetic field by winding a coil wire around a plate-like sensor core made of amorphous or permalloy, and a magnetic pattern. The magnetic sensor element which comprises the coil for detection for detecting this is provided. Three circuit boards that are electrically connected to the magnetic sensor element are disposed outside the magnetic shield case that houses the magnetic sensor element. A signal processing circuit for processing an output signal from the magnetic sensor element is configured on these circuit boards.

JP 2009-163336 A

  In the configuration of Patent Document 1, a sensor surface is provided on one end side of the magnetic sensor element, and the sensor surface is arranged on the same plane as the medium conveyance surface in order to detect the magnetic pattern of the medium with high accuracy. On the other hand, the circuit board is arranged in two steps parallel to the sensor surface (laterally) on the other end side (the side opposite to the sensor surface) of the magnetic sensor element, and along the side surface of the case housing the magnetic sensor element. Another sheet is arranged vertically. Connection between these substrates is performed by soldering through terminal pins into through holes provided in the substrate.

  However, in this configuration, all the connections between the three boards are made by terminal pins and through holes. Therefore, in the connection process between the boards, it is necessary to perform position adjustment work for putting all the pins into the through holes. It was. Therefore, there is a problem that the work load is large.

  In view of these points, an object of the present invention is to provide a magnetic sensor device that can easily perform a connection process between a magnetic sensor element and a substrate and a connection process between substrates.

In order to solve the above-described problems, a magnetic sensor device of the present invention includes:
A magnetic sensor element for detecting a change in the magnetic field;
A first substrate electrically connected to the magnetic sensor element;
A second substrate electrically connected to the first substrate;
The first substrate is disposed in parallel with a direction in which the terminal pin of the magnetic sensor element extends,
The second substrate is orthogonal to the first substrate.

  With this arrangement, the present invention arranges the terminal pins on the substrate surface without performing the step of passing the terminal pins through the through holes of the first substrate in the connection step between the magnetic sensor element and the first substrate. Can be connected to the wiring pattern. Therefore, the connection work between the magnetic sensor element and the substrate is simple.

  In the present invention, it is preferable that the terminal pin is disposed on the substrate surface of the first substrate and soldered. Since the soldering operation of the terminal pins arranged on the substrate surface is simple, the connection operation between the magnetic sensor element and the first substrate can be easily performed.

  In the present invention, the first substrate is formed with a through hole or a recess opening in the substrate surface, and a conductive member is disposed on the substrate surface around the through hole or the recess. It is desirable that a retaining portion integrated with the conducting member is formed in the hole or in the recess. If it does in this way, in order to peel off a conduction member from a substrate, it is necessary to peel from a substrate also to a retaining part integrated with a conduction member. Accordingly, it is possible to make it difficult for the conductive member to be peeled off from the substrate surface. Therefore, the terminal pin can be connected to the first substrate more reliably.

  In this case, it is preferable that the through hole is formed in the first substrate, and the retaining portion is provided along an inner peripheral surface of the through hole and a surface of the first substrate opposite to the substrate surface. . If it does in this way, since the retaining part provided in the surface on the opposite side to the substrate surface is caught by the edge of the through hole, the conductive member can be made more difficult to peel off. Further, a metal layer formed on the inner peripheral surface of the through hole or the inner peripheral surface of the recess can be used as the retaining portion. Alternatively, a metal layer formed along the inner peripheral surface of the through hole and the surface of the first substrate opposite to the substrate surface can be used as the retaining portion. Thus, by using a metal layer formed by plating or the like, it is possible to form a retaining portion that is difficult to peel off.

  Here, in the present invention, a connector for electrically connecting the first substrate and the second substrate is provided, and the connector is connected to the first connector provided on the first substrate and the second substrate. A second connector provided; and fitting the first connector and the second connector to electrically connect the first substrate and the second substrate; and the first substrate and the second substrate It is desirable to position the substrate in an orthogonal state. If it does in this way, electrical connection and positioning of substrates can be performed by the same process and the same component. Therefore, it is not necessary to separately perform a substrate positioning step for connecting the terminal pins, and jigs and parts for that are not necessary.

  In this case, it is desirable to have a case member that holds the magnetic sensor element, and the second substrate is fixed to the case member. If it does in this way, a 1st board | substrate can be positioned with respect to a case member via a 2nd board | substrate, and a 1st board | substrate can be positioned with respect to the magnetic sensor element hold | maintained at the case member. Therefore, the substrate can be positioned with a simple structure, and the positioning operation is easy. Further, in the configuration in which the first substrate is directly attached to the case member, the first substrate is deformed due to the heat generated from the circuit elements mounted on the first substrate due to the difference in the linear expansion coefficient between the case member and the first substrate. There is a risk that output fluctuations will occur. In the structure in which the first substrate is fixed via the second substrate as in the present invention, since the materials of the substrates are the same, deformation of the first substrate due to a difference in linear expansion coefficient can be prevented. Therefore, output fluctuations caused by deformation can be prevented.

  In the present invention, the case member protrudes from the case bottom surface in which a through hole through which the terminal pin passes is formed, a wall portion surrounding the through hole and protruding from the case bottom surface, and the case bottom surface. A board fixing part having a larger protruding dimension from the case bottom than the wall part, and the second board is fixed to a tip of the board fixing part in a posture orthogonal to the terminal pin, and the first board is It can be set as the structure arrange | positioned between the said 2nd board | substrate and the said case bottom face. If it does in this way, most 1st board | substrates and the 2nd board | substrate whole can be arrange | positioned outside a case member, and arrangement | positioning with the high heat dissipation effect from a board | substrate is realizable. Therefore, the temperature rise of the substrate and its surroundings can be suppressed, and the sensor characteristics can be stabilized.

  In the present invention, it is preferable that the magnetic sensor element has a sensor surface facing the same side as a medium conveyance surface on which a medium is conveyed, and the terminal pin protrudes on the opposite side to the sensor surface. . In this way, the two substrates can be arranged perpendicular to each other on the back side of the sensor surface. Therefore, the two substrates can be installed in a space-saving and heat dissipating arrangement on the back side of the sensor surface.

  In this case, it is preferable that the terminal pins and the first substrate are orthogonal to the sensor surface, and the second substrate is disposed in parallel with the sensor surface. If it does in this way, while arranging the 1st substrate in the direction perpendicular to the sensor surface, the 2nd substrate can be arranged in the direction parallel to the sensor surface. Therefore, the apparatus dimension in the direction perpendicular to the sensor surface can be reduced.

  According to the present invention, the terminal pins can be arranged on the substrate surface and connected to the wiring pattern without performing the process of passing the terminal pins of the magnetic sensor element through the through holes of the first substrate. Therefore, the connection work between the magnetic sensor element and the first substrate can be easily performed.

It is explanatory drawing which shows typically the magnetic sensor apparatus of this invention, and the magnetic pattern detection apparatus which mounts this. It is the front view, side view, and top view of a magnetic sensor element. It is the perspective view which looked at the magnetic sensor apparatus from diagonally upper side. It is a disassembled perspective view of a magnetic sensor apparatus. It is sectional drawing of a magnetic sensor apparatus. It is the fragmentary top view and sectional drawing which show the junction part of a 1st board | substrate and a terminal pin. It is the excitation waveform and detection waveform of a magnetic sensor element.

  Hereinafter, a magnetic pattern detection device equipped with a magnetic sensor device to which the present invention is applied will be described with reference to the drawings. In the following description, for convenience, the upper and lower parts of each member will be described according to the upper and lower parts of the figure.

(overall structure)
FIGS. 1A and 1B are explanatory views of a magnetic sensor device to which the present invention is applied and a magnetic pattern detection device equipped with the magnetic sensor device, and FIG. 1A is a schematic configuration of a main part of the magnetic pattern detection device. FIG. 1B is an explanatory diagram schematically showing a main part configuration of a portion excluding the substrate of the magnetic sensor device. As shown in FIG. 1A, the magnetic pattern detection device 1 includes a medium conveyance mechanism 4 that conveys a sheet-like medium 2 such as banknotes and securities along a medium conveyance path 3, and a medium conveyance path 3. The magnetic sensor device 5 that detects the magnetic pattern of the medium 2 at the provided magnetic reading position A is provided.

(Magnetic sensor device)
The magnetic sensor device 5 includes a plurality of first magnetizing magnets 6 for magnetizing the medium 2 passing through the magnetic reading position A from the first direction X1 in the medium conveying direction X, and the magnetic reading position A in the first direction X1. Is magnetized by a plurality of second magnetizing magnets 7 that magnetize the medium 2 passing from the second direction X2 opposite to that of the first magnetizing magnet 6 or the second magnetizing magnet 7. The sensor unit 8 for reading the magnetic pattern of the medium 2 passing through the magnetic reading position A is provided. The sensor unit 8 includes a plurality of magnetic sensor elements 13 arranged at a predetermined pitch in a direction Y orthogonal to the medium transport direction X. The magnetic sensor element 13 detects a magnetic flux as a bias magnetic field is applied to the magnetized medium 2. The magnetic pattern detection device 1 determines the authenticity and type of the medium 2 by collating the detection waveform from the magnetic sensor element 13 with the reference waveform.

  The magnetic sensor device 5 includes a case member (hereinafter referred to as a case 10) that holds the sensor unit 8 including the magnetic sensor element 13, a rectangular cover plate 11 that is attached to the upper end portion of the case 10, and the sensor unit 8. The first substrate 12A electrically connected to each of the magnetic sensor elements 13 and the second substrate 12B electrically connected to the first substrate 12A are provided. The first substrate 12A and the second substrate 12B are configured with a signal processing circuit that performs processing for detecting the presence / absence of a preset magnetic pattern and a formation position in the medium 2 based on signals output from the magnetic sensor elements 13. ing.

  A medium transport surface 11 a for transporting the medium 2 is formed on the surface of the cover plate 11. The cover plate 11 holds the first magnetizing magnet 6 and the second magnetizing magnet 7, and the medium 2 through which the first magnetizing magnet 6 and the second magnetizing magnet 7 pass the magnetic reading position A. Therefore, the upper surfaces of the first and second magnetizing magnets 6 and 7 are covered so as not to be worn out. The cover plate 11 is a composite plate in which two stainless steel metal plates 14 and 15 are laminated. The first and second magnetizing magnets 6 and 7 are fitted into mounting holes formed in the metal plate 15 arranged on the back side of the cover plate 11 and are attached to the back surface of the metal plate 14 arranged on the front side. It is in contact. For this reason, the gap between the first and second magnetizing magnets 6 and 7 and the medium transport surface 11a is defined by the thickness of the metal plate 14 on the front side. The first and second magnetizing magnets 6 and 7 are permanent magnets such as ferrite and neodymium magnets, and are mounted so that the portion on the medium transport surface 11a side and the portion on the back side thereof have different magnetic poles.

  2A to 2C are a front view, a side view, and a top view of the magnetic sensor element 13, respectively. As shown in this figure, the magnetic sensor element 13 includes a core body 33 having a three-layer structure including first and second protective plates 30 and 31 made of a non-magnetic material such as ceramics, and a sensor core 32 sandwiched therebetween. I have. The sensor core 32 is made of a magnetic material such as ferrite, amorphous, permalloy, or silicon steel plate. The magnetic sensor element 13 includes an excitation coil 34 for generating a bias magnetic field and a detection coil 35 for detecting the magnetic pattern of the medium 2. The exciting coil 34 is configured by winding a coil wire around a body portion 331 of the core body 33 via a first coil bobbin 36. The detection coil 35 is configured by winding a coil wire through a second coil bobbin 37 around a protrusion 332 that protrudes from the body 331 of the core body 33. The core body 33 has a shape in which three protrusions protrude from the upper end and the lower end of the body 331, and the detection coil 35 is formed in a central protrusion 332 protruding upward. The tip surface of the protrusion 332 on which the detection coil 35 is configured constitutes the sensor surface 13 a of the magnetic sensor element 13. Four terminal pins 38 protruding to the side opposite to the sensor surface 13a are attached to the first coil bobbin 36.

  3 is a perspective view of the magnetic sensor device 5 as viewed obliquely from above, and FIG. 4 is an exploded perspective view thereof. FIG. 5 is a sectional view of the magnetic sensor device 5 (a sectional view taken along line BB in FIG. 3). As shown in FIG. 4, the sensor unit 8 includes a frame 20 having an elongated rectangular parallelepiped shape as a whole. A plurality of mounting holes 23 for mounting the magnetic sensor elements 13 are formed in the frame 20 at a predetermined pitch in a direction Y orthogonal to the medium transport direction X. As shown in FIG. 5, each magnetic sensor element 13 is inserted into each mounting hole 23 with the thickness direction of the core body 33 facing the medium transport direction X and the sensor surface 13a facing upward. In a state where each magnetic sensor element 13 is inserted into the mounting hole 23, the four terminal pins 38 protrude downward from the bottom surface 20 a of the frame 20. Each mounting hole 23 is filled with a resin 29, and each magnetic sensor element 13 is fixed to the frame 20 by the resin 29.

  The case 10 has a substantially rectangular parallelepiped shape that is slightly larger than the sensor unit 8. The case 10 is formed with a substantially rectangular parallelepiped groove 41 extending in a direction Y orthogonal to the medium transport direction X. The groove 41 opens in the upper end surface 10 a of the case 10. Further, as shown in FIG. 5, a through hole 42 that opens to the bottom surface 10 b of the case 10 is formed at the protruding position of the terminal pin 38 at the bottom of the groove 41. The sensor unit 8 is held by the case 10 so that the sensor surface 13a of the magnetic sensor element 13 faces upward (the same side as the medium transport surface 11a), and the terminal pin 38 protrudes downward from the through hole 42. ing. The terminal pin 38 extends linearly in a direction perpendicular to the medium transport surface 11a. The tip of the terminal pin 38 protrudes toward the opposite side (lower side) of the sensor surface 13a, and the terminal pin 38 extends in a direction orthogonal to the sensor surface 13a.

  As shown in FIGS. 4 and 5, the outer peripheral portion of the lower end portion of the case 10 protrudes below the bottom surface 10 b of the case 10. Of the lower end portion of the case 10, wall portions 43 </ b> A and 43 </ b> B projecting downward are formed at both edge portions extending in parallel with the medium transport direction X. In addition, flange portions 44A and 44B projecting laterally toward the outer peripheral side are formed at projecting portions of the wall portions 43A and 43B on the outer peripheral surface of the case 10. The flange portions 44A and 44B are provided at positions above the lower ends of the wall portions 43A and 43B. Further, wall portions 45 </ b> A and 45 </ b> B are formed at the edge portion extending in the direction Y orthogonal to the medium transport direction X in the lower end portion of the case 10. The wall portions 45A and 45B have a lower projecting dimension than the wall portions 43A and 43B, and the lower end surface 45C thereof is substantially at the same position as the lower side surface 44C of the flange portions 44A and 44B. The wall portions 43 </ b> A and 43 </ b> B and the wall portions 45 </ b> A and 45 </ b> B constitute a peripheral wall that surrounds the through hole 42 that opens in the bottom surface 10 b of the case 10. The terminal pin 83 protrudes downward into a space surrounded by the wall portions 43A, 43B, 45A, 45B, and the upper end portion of the first substrate 12A is inserted into this space. In addition, columnar substrate fixing portions 46A and 46B that protrude downward from the bottom surface 10b of the case 10 are integrally formed on the wall portion 45A. The board fixing parts 46A and 46B are larger than the wall parts 43A and 43B and the wall parts 45A and 45B, and the tips of the board fixing parts 46A and 46B are below the wall parts 43A and 43B. It protrudes further below the end face 43C. That is, in the case 10, the portion that protrudes downward is the tip of the substrate fixing portions 46 </ b> A and 46 </ b> B. A fixing hole 48 for fixing the substrate is opened at the front end surfaces (lower end surfaces) 47 of the substrate fixing portions 46A and 46B.

(Board connection structure)
As shown in FIGS. 3 and 5, the second substrate 12B is fixed to the tips of the substrate fixing portions 46A and 46B by fixing members (not shown) such as screws. The second substrate 12B is in contact with the front end surface 47 of the substrate fixing portions 46A and 46B, and has a lateral posture extending in a direction along the upper end surface 10a of the case 10 and the medium transport surface 11a. On the other hand, the first substrate 12A is disposed above the second substrate 12B and has a vertically oriented posture orthogonal to the second substrate 12B. The first substrate 12A is connected to the second substrate 12B via the connector 50. The connector 50 includes a first connector 51 fixed to the first substrate 12A and a second connector 52 fixed to the second substrate 12B. When the first connector 51 and the second connector 52 are fitted, the first board 12A is electrically connected to the second board 12B and is orthogonal to the second board 12B via the connector 50. Positioned. Accordingly, when the second substrate 12B is fixed to the substrate fixing portions 46A and 46B of the case 10 and the connector 50 is brought into the fitted state, the first substrate 12A is fixed to the case 10 via the connector 50 and the second substrate 12B. The

  When the connector 50 is fitted, the first substrate 12A is arranged in parallel with the direction in which the tip portion of the terminal pin 38 (the portion fixed to the first substrate 12A in the terminal pin 38) extends, and the first substrate 12A. Is positioned at a height that overlaps the front end portion of the terminal pin 38 protruding from the through hole 42 of the case 10 in the vertical direction. As shown in FIG. 4, terminal pins 38 arranged in a line in a direction orthogonal to the medium transport direction X protrude downward from the lower end of the sensor unit 8. On the other hand, the same number of lands 62 as the terminal pins 38 are formed at the same arrangement pitch as the terminal pins 38 on the upper end portion of the substrate surface 61 of the first substrate 12A facing the terminal pins 38 side. Each terminal pin 38 is disposed on the board surface 61 of the first board 12A and soldered to the corresponding land 62.

  FIG. 6A is a partial plan view showing a joint portion of the terminal pin 38 to the first substrate 12A, and FIG. 6B is a cross-sectional view thereof (CC cross-sectional view of FIG. 6A). As shown in this figure, each land 62 formed on the substrate surface 61 of the first substrate 12 </ b> A is a conductive member disposed on the substrate surface 61. The conductive member forming the land 62 is connected (joined) to the terminal pin 38 by solder. In the first substrate 12A, a through hole 63 penetrating the first substrate 12A is formed, and a land 62 is formed around the through hole 63 in the substrate surface 61. A conductive metal layer 65 such as copper is formed on the inner peripheral surface of the through hole 63 by plating. The metal layer 65 is connected to and integrated with the land 62 disposed on the substrate surface 61 on the substrate surface 61. If the land 62 and the metal layer 65 are integrated, the metal layer 65 must be peeled from the inner peripheral surface of the through hole 63 in order to peel the land 62 from the substrate surface 61. For this reason, when the metal layer 65 is present, the land 62 does not easily peel off from the substrate surface 61, and the metal layer 65 functions as a retaining portion that prevents the land 62 from peeling off from the substrate surface 61. The metal layer 65 is also formed around the through hole 63 on the surface of the first substrate 12A opposite to the substrate surface 61. By extending the metal layer 65 to the surface opposite to the substrate surface 61, an anchor effect in which the metal layer 65 is caught on the edge of the through hole 63 is obtained. Therefore, it is more difficult to peel off the metal layer 65, and the structure that can effectively prevent the land 62 from peeling off is obtained.

  Here, as the retaining portion, a material other than the metal layer 65 by plating can be used. For example, a resin layer formed on the inner peripheral surface of the through hole 63 or a layer of another material may be used. In this embodiment, a metal layer 65 (a retaining portion) is formed in the through-hole 63, but is recessed from the substrate surface 61 of the first substrate 12A toward the opposite surface instead of the through-hole 63. A recess may be formed, and a retaining portion such as a metal layer or a resin layer may be formed on the inner peripheral surface of the recess. Even with such a configuration, the same effect can be obtained. In this embodiment, the metal layer 65 is formed up to the surface of the first substrate 12A opposite to the substrate surface 61. However, a retaining portion such as a metal layer or a resin layer is provided in the through-hole 63 or in the recess. The provision of the metal layer 65 on the surface opposite to the substrate surface 61 can be omitted since the effect of making it difficult to peel off the land 62 can be obtained simply by providing the land.

  The connecting process between the first substrate 12A and the second substrate 12B and the connecting process between the first substrate 12A and the magnetic sensor element 13 in the magnetic sensor device 5 are performed as follows. First, the first connector 51 and the second connector 52 are fitted together, and the first substrate 12A and the second substrate 12B are assembled to be orthogonal to each other. Next, the second substrate 12B is brought into contact with the front end surfaces 47 of the substrate fixing portions 46A and 46B of the case 10, and the second substrate 12B is fixed to the case 10 using a fixing member such as a screw. Thus, the first substrate 12A is positioned so that each land 62 formed at the upper end of the substrate surface 61 and the terminal pin 38 of the magnetic sensor element 13 are in contact with each other. Subsequently, each terminal pin 38 is soldered to the corresponding land 62. Thereby, the fixing of the first substrate 12A and the second substrate 12B to the case 10 is completed, and the connecting step between the substrates and the connecting step between the first substrate 12A and the magnetic sensor element 13 are completed.

(Magnetic pattern detection operation of magnetic pattern detector)
FIG. 7A shows an excitation waveform of the magnetic sensor element 13, and FIG. 7B shows a detection waveform from the magnetic sensor element 13. As shown in FIG. 1, when the medium 2 is conveyed in the first direction X1 or the second direction X2 in the magnetic pattern detection device 1, the medium 2 is first attached before reaching the magnetic reading position A. Magnetized by the magnet 6 or the second magnet 7. The magnetized medium 2 passes through the magnetic reading position A by the magnetic sensor device 5.

  In the magnetic sensor device 5, as shown in FIG. 7A, an alternating current is applied to the exciting coil 34 at a constant current, and a bias indicated by a one-dot chain line in FIG. A magnetic field is formed. When the medium 2 is conveyed at the magnetic reading position A, the detection coil 35 outputs a signal having a detection waveform shown in FIG. The detected waveform is a differential signal with respect to the bias magnetic field and time.

  The shape, peak value, and bottom value of the detected waveform from the magnetic sensor element 13 vary depending on the type of magnetic ink used to form the magnetic pattern, the position of the magnetic pattern, and the density of the formed magnetic pattern. . Therefore, by comparing the detected waveform with a reference waveform stored and held in advance, the authenticity of the medium 2 and the type of the medium 2 can be determined.

(Function and effect)
According to the present embodiment, the terminal pin 38 can be disposed on the substrate surface 61 and soldered to the land 62 without performing the process of passing the terminal pin 38 through the through hole of the first substrate 12A. Therefore, the connection process between the magnetic sensor element 13 and the first substrate 12A can be easily performed. Moreover, since the surrounding space of 1st board | substrate 12A and 2nd board | substrate 12B is large and heat dissipation is good, each substrate and its surrounding temperature rise can be suppressed and a sensor characteristic can be stabilized. In addition, with such a substrate arrangement, the dimensions from the sensor surface 13a to the second substrate 12B can be reduced while ensuring the circuit mounting area and heat dissipation. Therefore, it is advantageous for miniaturization of the magnetic sensor device 5. In particular, since the first substrate 12A is arranged in a direction perpendicular to the sensor surface 13a, and the second substrate 12B is arranged in a direction parallel to the sensor surface 13a, the two substrates are placed on the back side of the sensor surface 13a. It can be installed in a space-saving and heat-dissipating arrangement. Therefore, the apparatus dimension in the direction perpendicular to the sensor surface 13a can be reduced.

  In the present embodiment, the metal layer 65 integrated with the land 62 (conducting member) disposed on the substrate surface 61 of the first substrate 12 </ b> A is formed on the inner peripheral surface of the through-hole 63 and the surface opposite to the substrate surface 61. Therefore, the metal layer 65 functions as a retaining portion and can prevent the land 62 from peeling off from the substrate surface 61. Therefore, the terminal pin 38 can be more reliably connected to the first substrate 12A.

  Further, in the present embodiment, the connection between the first substrate 12A and the second substrate 12B is performed by fitting the connector 50 that can perform electrical connection and positioning at the same time. Therefore, electrical connection and positioning of the substrates can be performed in the same process and the same parts. Therefore, it is not necessary to separately perform the positioning process of the first substrate 12A for connecting the terminal pins 38, and jigs and parts for that purpose are not required. Further, the first substrate 12A is positioned via the case 10 and the second substrate 12B, and the first substrate 12A is not directly fixed to the case 10 having a different linear expansion coefficient. For this reason, when heat is generated from the circuit elements on the first substrate 12A, it is possible to prevent the first substrate 12A from being deformed due to a difference in linear expansion coefficient. Therefore, it is possible to prevent output fluctuations caused by the deformation of the first substrate 12A.

  In addition, in the present embodiment, at the lower end of the case 10, walls 43A, 43B, 45A, 45B surrounding the through-holes 42 through which the terminal pins 38 are passed, and a substrate having a larger protruding dimension below these walls. Fixed portions 46A and 46B are provided. Therefore, the second substrate 12B can be fixed in a lateral orientation orthogonal to the terminal pins 38 at a position away from the case 10. Further, the first substrate 12A can be arranged in a vertical orientation parallel to the terminal pins 38 in the space between the second substrate 12B and the bottom surface 10b of the case 10. In this way, most of the first substrate 12A and the entire second substrate 12B can be disposed outside the case 10, so that the heat dissipation effect is high. Therefore, temperature rises of the first and second substrates 12A and 12B and their surroundings can be suppressed, and sensor characteristics can be stabilized.

  In the above embodiment, the first substrate 12A and the second substrate 12B are connected by the connector 50. However, a terminal pin is provided on one of these two substrates, and a terminal pin is provided on a through hole provided on the other substrate. You may make it the structure inserted and connected.

  Moreover, in the said form, although the linear terminal pin 38 provided in the magnetic sensor element 13 is being fixed to the board | substrate surface 61 of 12 A of 1st board | substrates, the terminal pin 38 can also be made into the shape bent in the middle. In this case, the first substrate 12A may be disposed in parallel to the direction in which the portion of the bent terminal pin fixed to the substrate (for example, the tip portion of the terminal pin) extends. Thereby, like the said form, the connection operation | work with a terminal pin and a board | substrate can be performed easily. In this way, the first substrate 12 </ b> A can be disposed horizontally on the lower side of the case 10, and the second substrate 12 </ b> B can be disposed vertically on the side of the case 10.

(Other embodiments)
In the above embodiment, the present invention is applied to the magnetic sensor device 5 of the magnetic pattern detection device 1 that detects the magnetic pattern of the medium 2. However, the present invention is applicable to various applications for detecting changes in the magnetic field. Application to the sensor device 5 is possible.

DESCRIPTION OF SYMBOLS 1 ... Magnetic pattern detection apparatus 2 ... Medium 3 ... Medium conveyance path 4 ... Medium conveyance mechanism 5 ... Magnetic sensor apparatus 6 ... Magnetization magnet 7 ... Magnetization magnet 8 ... Sensor unit 10 ... Case 10a ... Upper end surface 10b ... Bottom surface DESCRIPTION OF SYMBOLS 11 ... Cover board 11a ... Medium conveyance surface 12A ... 1st board | substrate 12B ... 2nd board | substrate 13 ... Magnetic sensor element 13a ... Sensor surface 14 ... Metal plate 15 ... Metal plate 20 ... Frame 20a ... Bottom 23 ... Mounting hole 29 ... Resin 30 ... 1st protection board 31 ... 2nd protection board 32 ... Sensor core 33 ... Core body 331 ... Body part 332 ... Projection part 34 ... Excitation coil 35 ... Detection coil 36 ... Coil bobbin 37 ... Coil bobbin 38 ... Terminal pin 41 ... Groove 42 ... Through Hole 43A, 43B ... Wall 43C ... Lower end surface 44A, 44B ... Flange 44C ... Lower side surface 45A, 45B ... Wall portion 45C ... Lower end surface 46A, 46B ... Substrate fixing Portion 47 ... Tip surface 48 ... Fixing hole 50 ... Connector 51 ... First connector 52 ... Second connector 61 ... Substrate surface 62 ... Land 63 ... Through hole 65 ... Metal layer A ... Magnetic reading position X ... Medium transport direction X1 ... First 1 direction X2 ... 2nd direction Y ... direction orthogonal to medium conveyance direction

Claims (11)

A magnetic sensor element for detecting a change in the magnetic field;
A first substrate electrically connected to the magnetic sensor element;
A second substrate electrically connected to the first substrate;
The first substrate is disposed in parallel with a direction in which the terminal pin of the magnetic sensor element extends,
The magnetic sensor device according to claim 1, wherein the second substrate is orthogonal to the first substrate. In claim 1,
The magnetic sensor device according to claim 1, wherein the terminal pin is disposed on the substrate surface of the first substrate and soldered. In claim 1 or 2,
In the first substrate, a through hole or a recess opening in the substrate surface is formed, and a conductive member is disposed on the substrate surface around the through hole or the recess,
A magnetic sensor device, wherein a retaining portion integrated with the conducting member is formed in the through hole or in the recess. In claim 3,
The through hole is formed in the first substrate,
The magnetic sensor device according to claim 1, wherein the retaining portion is provided along an inner peripheral surface of the through hole and a surface of the first substrate opposite to the substrate surface. In claim 3,
The magnetic sensor device, wherein the retaining portion is a metal layer formed on an inner peripheral surface of the through hole or an inner peripheral surface of the recess. In claim 4,
The magnetic sensor device, wherein the retaining portion is a metal layer formed along an inner peripheral surface of the through hole and a surface of the first substrate opposite to the substrate surface. In any one of claims 1 to 6,
A connector for electrically connecting the first substrate and the second substrate;
The connector includes a first connector provided on the first substrate, and a second connector provided on the second substrate,
The first connector and the second connector are fitted to electrically connect the first substrate and the second substrate, and the first substrate and the second substrate are positioned to be orthogonal to each other. A magnetic sensor device. In claim 7,
A case member for holding the magnetic sensor element;
The magnetic sensor device, wherein the second substrate is fixed to the case member. In claim 8,
The case member is
A bottom surface of the case in which a through hole through which the terminal pin passes is formed;
A wall that surrounds the through hole and protrudes from the bottom of the case;
A board fixing portion that protrudes from the bottom surface of the case and has a larger protruding dimension from the bottom surface of the case than the wall portion;
The second substrate is fixed to the tip of the substrate fixing portion in a posture orthogonal to the terminal pins,
The magnetic sensor device according to claim 1, wherein the first substrate is disposed between the second substrate and the bottom surface of the case. In any one of claims 1 to 9,
The magnetic sensor element includes a sensor surface facing the same side as a medium conveyance surface on which a medium is conveyed,
The magnetic sensor device according to claim 1, wherein the terminal pin protrudes on a side opposite to the sensor surface. In claim 10,
The terminal pins and the first substrate are orthogonal to the sensor surface,
The magnetic sensor device, wherein the second substrate is arranged in parallel with the sensor surface.

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