JP2014103356A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device enabling a visually easy-to-understand operation.SOLUTION: In the processing device, input display means displays a cassette display indicative of a cassette, a retention table display indicative of a retention table, a cleaning table display indicative of a cleaning table, a first carriage path display indicative of a first carriage path, a second carriage path display indicative of a second carriage path, and a third carriage path display indicative of a third carriage path. By the depression operation of the first carriage path display, a work piece is transferred from the cassette to the retention table by first carriage means. By the depression operation of the second carriage path display, the work piece is transferred from the retention table to the cleaning table by second carriage means. By the depression operation of the third carriage path display, the work piece is transferred from the cleaning table to the cassette by third carriage means.

Description

  The present invention includes a holding table for holding a workpiece, a cleaning mechanism for cleaning the workpiece, a cassette mounting table on which a cassette capable of storing a plurality of workpieces is placed, a holding table for the workpiece, The present invention relates to a processing apparatus including at least a cleaning mechanism and a transport unit that moves between cassettes.

  2. Description of the Related Art Conventionally, as disclosed in, for example, Patent Document 1, a configuration is known in which an operation command is given to a machining apparatus using an operation panel and the content of the operation command is displayed on a display monitor.

  Furthermore, in recent years, in consideration of downsizing and appearance of processing devices, touch panel type input display monitors capable of inputting and displaying information as disclosed in Patent Document 2 have been widely adopted.

JP 2001-084015 A JP 2009-194326 A

  A touch panel type input display monitor as disclosed in Patent Document 2 can display a figure and a captured image and can display an operation command input key and the like, so that a conventional display as disclosed in Patent Document 1 can be displayed. Compared to a processing apparatus in which the monitor and the operation panel are separated from each other, a configuration with excellent operability is realized.

  However, even when a touch panel type input display monitor can be used, there is a current situation in which further improvement in operability is desired.

  For example, when only the character information is displayed on the input display monitor, the character information must be checked to understand the meaning, and there is room for improvement to reduce the burden on the operator. Think.

  In addition, for example, when there are a plurality of processes and it is necessary to grasp the relationship before and after each process, it is relatively less likely to cause a problem if an operator is familiar with the relationship. it is conceivable that.

  However, in the case of an operator who does not know the relationship between before and after each process, it is difficult to understand only by using character information, and there is a concern that an accurate operation cannot be performed or an operation is wrong.

  As can be seen from the above, it is required to improve the workability for all workers and to realize an interface that enables the work to be accurately performed.

  The present invention has been made in view of the above points, and the purpose of the present invention is to perform operations in various processes using a touch panel type input display monitor, and to make operations easier to understand visually. The present invention provides a processing apparatus that enables this.

According to the invention of claim 1,
A processing device,
A mounting table on which a cassette capable of accommodating a plurality of workpieces is mounted;
A holding table for holding the workpiece;
Processing means for processing the workpiece held by the holding table;
Cleaning means for holding and cleaning the workpiece processed by the processing means on the cleaning table;
First transport means for transporting the workpiece on a first transport path for moving the workpiece from the cassette mounted on the mounting table to the holding table;
A second conveying means for conveying the workpiece in a second conveying path for moving the workpiece from the holding table to the cleaning table;
A third conveying means for conveying the workpiece by a third path for moving the workpiece from the cleaning table to the cassette;
Touch panel type input display means for operating the first to third transport means,
The input display means indicates a cassette display indicating a cassette, a holding table display indicating a holding table, a cleaning table display indicating a cleaning table, a first transfer path display indicating a first transfer path, and a second transfer path. Displaying a second transport path display and a third transport path display indicating a third transport path;
When the first conveyance path display is pressed, the workpiece is moved from the cassette to the holding table by the first conveyance means,
When the second conveyance path display is pressed, the workpiece is moved from the holding table to the cleaning table by the second conveyance means,
A processing device is provided in which the workpiece is moved from the cleaning table to the cassette by the third transport means by pressing the third transport path display.

  ADVANTAGE OF THE INVENTION According to this invention, in the processing apparatus provided with a touch-panel type input display means, the processing apparatus which enables operation which is easy to understand visually is provided.

  Specifically, a cassette display, a holding table display, a cleaning table display, and a transport path display connecting the respective displays are displayed on the touch panel type input display means.

  And it is comprised so that the movement of the workpiece in the pressed conveyance path | route may be performed by pressing a specific conveyance path | route display. In this pressing operation, since the conveyance path displaying the conveyance source and the conveyance destination of the workpiece can be visually confirmed, an operation that is easier to understand visually becomes possible.

  In addition, since the conveyance source and the conveyance destination of the workpiece are displayed, it is possible to prevent an erroneous operation such as conveyance in the reverse direction.

It is an external appearance perspective view of the front side of a cutting device. It is an external appearance perspective view of the back side of a cutting device. It is a perspective view shown about the wafer which is a workpiece. It is a figure shown about an example of the display screen of a display monitor. It is a block diagram explaining the control in a control apparatus. It is an external appearance perspective view shown about the structure of a grinding device. It is a figure shown about an example of the display screen of a display monitor.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As an example of the processing apparatus, an external perspective view of a cutting apparatus 2 for cutting a workpiece such as a semiconductor wafer is shown in FIG. The cutting device 2 includes a processing device main body 4 in which processing means such as a cutting unit 10 having a cutting blade is accommodated in an outer cover 8, a display monitor 6 attached to the outer cover 8 of the processing device main body 4, and the like. Configured.

  A holding table 12 is disposed so as to be movable in the X-axis direction adjacent to the cutting unit 10 configured to be movable in the Y-axis direction. Reference numeral 14 denotes a mounting table (elevator) on which a cassette 24 capable of accommodating a plurality of wafer units 22 is mounted, and is configured to be movable in the vertical direction.

  In addition, as a holding means for holding the wafer unit 22 during processing, it is conceivable that a holding means using an edge clamp (a form in which the end is clamped) is used in addition to a table like the holding table 12.

  FIG. 2 is a perspective view of the cutting device 2 from another direction. Reference numeral 8 denotes an exterior cover of the cutting apparatus 2, and a processing region 16 shown in FIG. FIG. 2 shows a state in which the holding table 12 that appears on the processing means side in FIG. 1 is at a workpiece loading / unloading position (home position). In FIG. 2, a part of the outer cover is omitted to show the holding table 12 and various transport devices.

  A touch panel display monitor 6 is disposed on the front surface 8 a of the exterior cover 8. With this display monitor 6, the operator inputs an operation command for the apparatus, and the operating status of the apparatus is displayed on the display monitor 6.

  Reference numeral 14 denotes a cassette mounting table for mounting a cassette 24 (FIG. 1) containing a plurality of wafer units 22 therein, and is configured to be movable in the vertical direction (Z-axis direction).

  Adjacent to the mounting table 14, a temporary placement area 26 for temporarily placing the wafer unit 22 taken out from the cassette 24 (FIG. 1) is provided.

  A loading / unloading unit (loading / unloading means) 28 for loading / unloading the wafer unit 22 to / from the cassette 24 (FIG. 1) mounted on the mounting table 14 is disposed adjacent to the mounting table 14.

  The carry-in / out unit 28 has a clamp 27 attached to the tip of the support member 29. The annular frame F shown in FIG. 3 is clamped by the clamp 27, and the wafer unit 22 is unloaded from or loaded into the cassette.

  As shown in FIG. 3, a wafer 11 such as a semiconductor wafer or an optical device wafer has a plurality of regions partitioned by a plurality of division lines 13 formed in a lattice pattern on the surface thereof. A device 15 is formed.

  The wafer 11 is attached to a dicing tape T that is an adhesive tape, and the outer peripheral edge of the dicing tape T is attached to an annular frame F to constitute a wafer unit 22. As a result, the wafer 11 is supported by the annular frame F via the dicing tape T, and is accommodated in the cassette 24 (FIG. 1) in this state.

  As shown in FIG. 2, the support member 29 is fixed to the block 40, and a nut that engages with the ball screw 44 is built in the block 40. One end of the ball screw 44 is connected to a pulse motor 46, and the ball screw 44 and the pulse motor 46 constitute a carry-in / out unit moving mechanism 41 that moves the carry-in / out unit 28 in the Y-axis direction.

  When the pulse motor 46 of the carry-in / out unit moving mechanism 41 is driven, the ball screw 44 is rotated, and the block 40 is moved in the Y-axis direction accordingly, and the clamp 27 connected to the block 40 via the support member 29 is moved. Move in the Y-axis direction.

  The wafer unit 22 with the annular frame F clamped by the clamp 27 and pulled out of the cassette is placed on a pair of centering guides 50 disposed in the temporary placement region 26, and the centering guides 50 move in a direction approaching each other. Thus, centering of the wafer unit 22 is performed.

  Below the temporary storage area 26, the holding table 12 positioned at the home position is disposed. The holding table 12 is provided with a plurality of clamps 12a for clamping the annular frame F.

  The holding table 12 shown in FIG. 2 is positioned at the home position. As shown in FIG. 1, the holding table 12 is moved in the X-axis direction to be positioned in the machining area 16 and the machining area 16. Is moved in the X-axis direction, and the wafer being cut is processed and fed.

  An opening 52 is formed in the lower portion of the side surface 8b of the exterior cover 8, and the wafer 11 held on the holding table 12 is connected to the home position shown in FIG. 2 and the processing region 16 shown in FIG. Moved between.

  An upper arm 54 is movable in the Y-axis direction and the Z-axis direction. An H-shaped plate member 60 is fixed to the lower end of the upper arm 54, and the annular frame F is sucked into the plate member 60 by vacuum suction. Four suction pads 62 to be held are attached.

  Reference numeral 66 denotes a cleaning apparatus including a rotatable cleaning table (spinner table) 64 for cleaning the processed wafer.

  The Y-axis moving member 68 has a built-in nut, and this nut is screwed into a ball screw 72 extending in the Y-axis direction. A pulse motor 74 is connected to one end of the ball screw 72, and the ball screw 72 and the pulse motor 74 constitute a Y axis moving mechanism 76 of the upper arm 54. When the pulse motor 74 is driven, the ball screw 72 is rotated, and the Y-axis moving member 68 is moved in the Y-axis direction along a pair of guides 78 fixed to the side surface 8b of the exterior cover 8.

  Reference numeral 82 denotes a lower arm. An H-shaped plate member 80 is fixed to the lower end of the lower arm 82, and four suction pads 84 for sucking and holding the annular frame F by vacuum suction are arranged on the H-shaped plate member 80. It is installed.

  The lower arm 82 is attached to the Y-axis moving member 86 so as to be movable in the vertical direction (Z-axis direction) by a moving mechanism (not shown). As the moving mechanism, a combination of a ball screw and a pulse motor, an air cylinder, or the like can be adopted.

  A nut (not shown) is built in the Y-axis moving member 86, and this nut is screwed into a ball screw 92 extending in the Y-axis direction. A pulse motor 94 is connected to one end of the ball screw 92, and the ball screw 92 and the pulse motor 94 constitute a Y-axis moving mechanism 90 of the lower arm 82.

  When the pulse motor 94 of the Y-axis moving mechanism 90 is driven, the ball screw 92 rotates, and the lower arm 82 connected to the Y-axis moving member 86 moves along the Y-axis along a pair of guides 96 attached to the side surface 8b of the exterior cover 8. Moved in the direction.

  In the cutting device 2 having the above configuration, a characteristic configuration in the present invention will be described. The cutting apparatus 2 shown in FIGS. 1 and 2 includes a mounting table 14 on which a cassette 24 that can store a plurality of wafers 11 that are workpieces is mounted, a holding table 12 that holds the wafers 11, and a holding table 12. A cutting unit 10 as a processing means for processing the held wafer 11, and a cleaning device 66 as a cleaning means for cleaning the wafer 11 processed by the cutting unit 10 by holding the cleaning table 64. Configured.

  In the cutting apparatus 2, a first transport unit that transports the wafer 11 through the first transport path for moving the wafer 11 from the cassette 24 mounted on the mounting table 14 to the holding table 12 is configured.

  As shown in FIG. 4, this first transport path is conceptually shown as a first transport path display K1 on the display monitor 6, and the path from the cassette 24 to the holding table 12 is the first transport path. Become.

  Further, as shown in FIG. 2, the first transport unit includes a carry-in / out unit (carry-in / out unit) 28 including a clamp 27 and a lower arm 82 including a plate member 80.

  In the first transfer path, the wafer unit 22 is pulled out from the cassette 24 to the temporary placement region 26 by the clamp 27 of the carry-in / out unit 28, centered by the centering guide 50, and then held by the lower arm 82. It is conveyed to.

  Further, the cutting apparatus 2 includes a second transport unit that transports the workpiece along a second transport path that moves the wafer 11 from the holding table 12 to the cleaning table 64.

  As shown in FIG. 4, this second transport path is conceptually shown on the display monitor 6 as a second transport path display K2, and the path from the holding table 12 to the cleaning table 64 is the second transport path. It becomes.

  Moreover, this 2nd conveyance means is comprised by the upper arm 54 provided with the plate member 60, as shown in FIG.

  In the second transfer path, the wafer unit 22 is transferred to the cleaning table 64 by the upper arm 54.

  Further, in the cutting apparatus 2, third transport means for transporting the wafer 11 through a third path for moving the wafer 11 from the cleaning table 64 to the cassette 24 is configured.

  As shown in FIG. 4, this third transport path is conceptually shown as a third transport path display K3 on the display monitor 6, and the path from the cleaning table 64 to the cassette 24 is the third transport path. Become.

  Further, as shown in FIG. 2, the third transport unit includes an upper arm 54 having a plate member 60 and a carry-in / out unit (carry-in / out unit) 28 having a clamp 27.

  In the third transport path, the wafer unit 22 is transported from the cleaning table 64 to the centering guide 50 in the temporary placement area 26 by the upper arm 54 and centered, and then is clamped in the cassette 24 by the clamp 27 of the carry-in / out unit 28. It is carried in.

  Further, as shown in FIG. 2, the cutting device 2 is configured to include a display monitor 6 as a touch panel type input display means for operating the first to third transport means.

  As shown in FIG. 4, the display monitor 6 shows a cassette display H124 indicating the cassette 24, a holding table display H12 indicating the holding table 12, a cleaning table display H64 indicating the cleaning table 64, and a first transport path. A first transport path display K1, a second transport path display K2 indicating the second transport path, and a third transport path display K3 indicating the third transport path are displayed.

  In addition, as shown in FIG. 5, the cutting device 2 receives information to be pressed (touch input) on the display monitor 6 and performs operation control of various drive units of the cutting device based on the input. The control device S is provided.

  In the present embodiment, when each display of the first transport path display K1, the second transport path display K2, and the third transport path display K3 is pressed on the display monitor 6, the operation information is input to the control device S. Is done.

  The control device S controls the operation of the first transfer means D1 so that the wafer 11 is moved from the cassette 24 to the holding table 12 by the first transfer means D1 when the first transfer path display K1 is pressed. carry out.

  Similarly, in the control device S, the operation of the second transfer unit D2 is performed so that the second transfer unit D2 moves the wafer 11 from the holding table 12 to the cleaning table 64 by pressing the second transfer path display K2. Implement control.

  Similarly, in the control device S, the operation control of the third transport unit D3 is performed so that the third transport unit D3 moves the wafer 11 from the cleaning table 64 to the cassette 24 by pressing the third transport path display K3. To implement.

  With the above configuration, the cassette display H124, the holding table display H12, the cleaning table display H64, and the first to third transport path displays K1 to K3 that connect the displays are displayed on the touch-panel display monitor 6.

  And the movement of the wafer 11 in the pressed conveyance path | route is performed by pressing a specific conveyance path | route display. In this pressing operation, since the transfer path (transfer path displays K1 to K3) on which the transfer source and transfer destination of the wafer 11 are displayed can be visually confirmed, an operation that is easier to understand visually becomes possible.

  Moreover, since it becomes possible to implement desired conveyance only by pressing each conveyance path display K1-K3, the structure excellent in operativity can be implement | achieved and an operator's burden is related in connection with pressing operation. Can be reduced.

  Further, by using the arrow display that displays the concept of the transport direction for each of the transport path displays K1 to K3, the transport direction can be intuitively grasped, so that the operator can read the cassette, the holding table, and the cleaning table. Even if the relationship between before and after each process is not fully understood, the conveyance direction is not mistaken.

  In addition, in the apparatus structure of the cutting apparatus 2 demonstrated above, it is set as the structure by which the 1st cassette which accommodates the unprocessed wafer 11 and the 2nd cassette which accommodates the processed wafer 11 are provided about the cassette 24. About the mounting base 14, it is good also as a structure provided with the 1st mounting base in which a 1st cassette is mounted, and the 2nd mounting base in which a 2nd cassette is mounted.

  Moreover, in the apparatus structure of the cutting apparatus 2 demonstrated above, it is good also as a structure provided with the 1st cassette which accommodates the unprocessed wafer 11 and the 2nd cassette which accommodates the processed wafer 11 about the cassette 24. Further, the mounting table 14 may be configured such that the first cassette and the second cassette are stacked (arranged in the vertical direction) or arranged in parallel (arranged in the horizontal direction).

  Further, in the control device S shown in FIG. 5, in a predetermined situation, even when each of the transport path displays K1 to K3 is pressed, the operations of the transport means D1 to D3 are restricted.

  Specifically, for example, in the state where the holding table 12 holds the wafer 11, even if the first transfer path display K1 is pressed, the transfer of the wafer 11 by the first transfer means D1 is restricted. This prevents the wafer 11 from being supplied to the holding table 12 in an overlapping manner.

  Similarly, in a state where the wafer 11 is on the cleaning table 64 of the cleaning device 66, even if the second transfer path display K2 is pressed, the transfer of the wafer 11 by the second transfer means D2 is restricted. This prevents the wafer 11 from being supplied to the cleaning table 64 in an overlapping manner.

  6 and 7 show an example in which the present invention is applied to a grinding apparatus 30 as another example of the processing apparatus.

  As shown in FIG. 6, the grinding device 3 includes a first cassette 31 for storing a wafer before processing, a centering device 32, a loading arm 33, a turntable 34 including holding tables 34a, 34b, and 34c, a grinding unit (grinding means). ) 35a and 35b, an unloading arm 36, a cleaning device 37, a second cassette 38 for storing processed wafers, a carry-in / out device 39, a display monitor 30, and the like.

  FIG. 7 is an example of a display screen of the display monitor 30, and displays corresponding to various devices constituting the grinding device 3 are made.

  Specifically, first cassette display H31, centering device display H32, holding table display H34a, H34b, H34c, turntable display H34, grinding device display H35a, H35b, cleaning device display H37, second cassette display H38, loading / unloading The device display H39 is displayed respectively.

  In the grinding apparatus 3 shown in FIG. 6, the path from the first cassette 31 to the holding table 34a is the first transport path, the path from the holding table 34a to the cleaning apparatus 37 is the second transport path, and the cleaning apparatus 37 to the second A path to the cassette 38 is defined as a third transport path.

  Then, on the display monitor 30 shown in FIG. 7, the first transport path display Ka from the first cassette display H31 to the holding table display H34a and the holding table display H34a to the cleaning device display H37 are displayed so as to correspond to the respective transport paths. The first transport path display Kb and the first transport path display Kc from the cleaning device display H37 to the second cassette display H38 are displayed.

  In the above display, when the first transfer path display Ka is pressed, the wafer is unloaded from the first cassette 31 to the centering device 32 by the loading / unloading device 39 and from the centering device 32 by the loading arm 33. The wafer is transferred to the holding table 34a.

  Similarly, when the second transfer path display Kb is pressed, the wafer is transferred from the holding table 34 a to the cleaning device 37 by the unloading arm 36.

  Similarly, when the third transfer path display Kc is pressed, the wafer is transferred from the cleaning device 37 to the second cassette 38 by the carry-in / out device 39.

  As described above, the grinding apparatus 3 can similarly carry out a desired conveyance by pressing operation, so that a configuration with excellent operability can be realized, and the burden on the operator is reduced in relation to the pressing operation. can do.

  The processing apparatus to which the present invention can be applied is not limited to the grinding apparatus or cutting apparatus described above. For example, the present invention can be applied to a laser processing apparatus, a cutting tool, a water jet processing apparatus, a dividing apparatus, etc. The invention is applicable.

2 Cutting device 6 Display monitor 10 Cutting unit 11 Wafer H24 Cassette display H22 Holding table display H64 Cleaning table display K1 First transport path display K2 Second transport path display K3 Third transport path display

Claims (1)

A processing device,
A mounting table on which a cassette capable of accommodating a plurality of workpieces is mounted;
A holding table for holding the workpiece;
Processing means for processing the workpiece held by the holding table;
Cleaning means for holding and cleaning the workpiece processed by the processing means on a cleaning table;
First transport means for transporting the workpiece on a first transport path for moving the workpiece from a cassette mounted on the mounting table to the holding table;
A second conveying means for conveying the workpiece on a second conveying path for moving the workpiece from the holding table to the cleaning table;
A third conveying means for conveying the workpiece in a third path for moving the workpiece from the cleaning table to the cassette;
Touch panel type input display means for operating the first to third transport means,
The input display means includes a cassette display indicating the cassette, a holding table display indicating the holding table, a cleaning table display indicating the cleaning table, a first transport path display indicating the first transport path, Displaying a second transport path display indicating the second transport path and a third transport path display indicating the third transport path;
The workpiece is moved from the cassette to the holding table by the first conveying means by pressing the first conveying path display,
When the second transport path display is pressed, the workpiece is moved from the holding table to the cleaning table by the second transport means,
A processing apparatus that moves the workpiece from the cleaning table to the cassette by the third transport means when the third transport path display is pressed.

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