すなわち本発明の賦形成形方法は、複数本の強化繊維束を含む織物基材の少なくとも一方の表面に熱硬化性樹脂を主成分とする樹脂材料が付着された成形原反材を裁断し積層した積層成形材を成形型に投入配置し、加圧、加熱して複数本の強化繊維束を含む織物基材に付着している樹脂材料を硬化して繊維間及び成形原反材の層間を接着する賦形成形方法において、積層成形材を予熱して成形型へ投入配置する予熱工程と、成形型を型締し加圧する工程と、上下型の分割線近傍領域の上下型のうち少なくとも１方を前記熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する工程と、成形型を硬化温度に昇温して型を開き離型する工程とを有することを特徴とする。
この本発明の賦形成形方法によって、成形型を熱硬化性樹脂材の硬化温度に加熱することによって熱硬化性樹脂を強化繊維に含侵させた状態で硬化し、繊維積層によって強化して十分な成形品強度の熱硬化性樹脂材を成形することが可能となる。しかも長い昇温時間によってサイクルタイムが過長になることを予熱することによって防止することができる。
That is, the forming method of the present invention cuts and laminates a forming raw material in which a resin material mainly composed of a thermosetting resin is attached to at least one surface of a textile base material including a plurality of reinforcing fiber bundles. The laminated molding material is placed in a molding die, pressed and heated to cure the resin material adhering to the fabric substrate including a plurality of reinforcing fiber bundles, and between the fibers and the interlayer of the molding raw material. In the forming method for bonding, at least one of a preheating step of preheating the laminated molding material and placing it in the molding die, a step of clamping and pressurizing the molding die, and an upper and lower die in the vicinity of the dividing line of the upper and lower die The method has a step of raising the temperature to a required temperature higher than the mold at the curing temperature of the thermosetting resin, and a step of raising the mold to the curing temperature and opening the mold to release the mold. .
By this forming method of the present invention, the mold is heated to the curing temperature of the thermosetting resin material so that the thermosetting resin is impregnated in the reinforcing fibers, and is sufficiently reinforced by fiber lamination. It becomes possible to mold a thermosetting resin material having a strong molded product strength. In addition, it can be prevented by preheating that the cycle time becomes excessive due to the long heating time.
そこで本発明の賦形成形方法によれば上下型の分割線近傍領域の上下型のうち少なくとも１方を前記熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する工程を備える。
この上下型のうち少なくとも１方を前記熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する工程によって部分的に昇温した部分の熱硬化性樹脂が硬化されることによって、外部へのはみ出しが阻止され、樹脂流出をふせぐことができる。この成形型より高い所要の温度とは、外部へのはみ出しを阻止するに充分な程度に昇温した部分の熱硬化性樹脂が短時間に硬化される温度である。
Therefore, according to the forming method of the present invention, there is provided a step of heating at least one of the upper and lower molds in the vicinity of the dividing line of the upper and lower molds to a required temperature higher than that of the mold at the curing temperature of the thermosetting resin. .
By curing at least one of the upper and lower molds at a part of the thermosetting resin that has been partially heated by the process of raising the temperature to a required temperature higher than that of the mold at the curing temperature of the thermosetting resin, Protrusion to the outside is prevented and resin spillage can be prevented. The required temperature higher than that of the mold is a temperature at which the portion of the thermosetting resin whose temperature has been raised enough to prevent the protrusion to the outside is cured in a short time.
この賦形成形方法は、上部型１０ａと下部型１０ｂの分割線近傍領域の上部型１０ａと下部型１０ｂのうち少なくとも１方を前記熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する昇温手段ＰＭを用いて行う。この昇温手段ＰＭは図８（ａ）（ｂ）に示すように、上部型１０ａの縁部にのみ対向して下部型１０ｂに載置した積層成形材５の縁部外側の下部型１０ｂ上に入れ駒型として配置される。入れ駒型ＰＭは上部型１０ａと下部型１０ｂとの型合わせ面の形状もしくは下部型１０ｂに載置する積層成形材５外形と一致する内側形状を有して形成される。その入れ駒型ＰＭの内側に上部型１０ａが嵌入して上部型１０ａと下部型１０ｂとが型合わせされることによって下部型１０ｂに載置する積層成形材５の成形が行われる。
In this forming method, at least one of the upper mold 10a and the lower mold 10b in the vicinity of the dividing line of the upper mold 10a and the lower mold 10b is set to a required temperature higher than that of the molding mold at the curing temperature of the thermosetting resin. This is performed using a temperature raising means PM for raising the temperature. As shown in FIGS. 8A and 8B, the temperature raising means PM is arranged on the lower mold 10b outside the edge of the laminated molding material 5 placed on the lower mold 10b so as to face only the edge of the upper mold 10a. It is arranged as a frame type. The insert piece type PM is formed to have a shape of a mating surface of the upper die 10a and the lower die 10b or an inner shape that matches the outer shape of the laminated molding material 5 placed on the lower die 10b. The upper mold 10a is fitted inside the insert piece mold PM, and the upper mold 10a and the lower mold 10b are mated to form the laminated molding material 5 to be placed on the lower mold 10b.
積層成形材５を予熱して成形型９へ投入配置する予熱工程の後に、上部型１０ａと下部型１０ｂとが型合わせされることによって製品の成型が行われる。その過程で上部型１０ａと下部型１０ｂとの型合わせによる圧縮成型と同時に上部型１０ａと下部型１０ｂの分割線近傍領域の上部型１０ａと下部型１０ｂを熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する昇温工程が入れ駒型ＰＭを用いて行われる。このように、入れ駒型ＰＭを用いた昇温工程を行わない場合には、上部型１０ａと下部型１０ｂの分割部分から成型課程における温度上昇による膨張圧で積層成形材５の表面の樹脂の一部が金型合わせ目部分にはみ出しバリを形成する。しかし入れ駒型ＰＭを用いた昇温工程を行うことによって積層成形材５の表面の樹脂は、金型合わせ目部分において昇温硬化し、それが障壁となって樹脂流出が抑止されてバリの形成が最小化される。
After the preheating process in which the laminated molding material 5 is preheated and placed in the molding die 9, the upper die 10a and the lower die 10b are matched with each other to mold the product. In the process, the upper mold 10a and the lower mold 10b in the vicinity of the dividing line of the upper mold 10a and the lower mold 10b are molded simultaneously with the compression molding by matching the upper mold 10a and the lower mold 10b at the curing temperature of the thermosetting resin. A temperature raising step for raising the temperature to a higher required temperature is performed using the insert piece type PM. Thus, in the case where the temperature raising process using the insert piece type PM is not performed, the resin on the surface of the laminated molding material 5 is expanded by the expansion pressure due to the temperature rise in the molding process from the divided part of the upper mold 10a and the lower mold 10b. A part protrudes into the mold joint part to form a burr. However, by performing the temperature raising process using the insert piece type PM, the resin on the surface of the laminated molding material 5 is heated and cured at the mold joint portion, which acts as a barrier to prevent the resin from flowing out. Formation is minimized.
次に本発明の第二の実施の形態の賦形成形方法を図２８（ａ）〜（ｃ）を参照して詳述する。
第二の実施の形態の賦形成形方法では上部型１０ａと下部型１０ｂの分割線近傍領域の上部型１０ａと下部型１０ｂのうち少なくとも1方を近赤外線放射装置２０によって近赤外線で加熱し、遠赤外線温度センサ−で温度を検知し、近赤外線の強度を調整し所要の温度に昇温させることによって、上部型１０ａと下部型１０ｂの分割線近傍領域の前記熱硬化性樹脂の硬化温度に昇温する。この第二の実施の形態でも積層成形材１４を予熱して成形型９へ投入配置する予熱工程の後に、上部型１０ａと下部型１０ｂとが型合わせされることによって製品の成型が行われる。その成形型を型締し加圧する過程で上部型１０ａと下部型１０ｂとの型合わせによる圧縮成型と同時に上部型１０ａと下部型１０ｂの分割線近傍領域の上部型１０ａと下部型１０ｂを熱硬化性樹脂の硬化温度で成形型より高い所要の温度に昇温する工程が近赤外線放射装置２０を用いて行われる。
Next, the forming method according to the second embodiment of the present invention will be described in detail with reference to FIGS.
In the forming method of the second embodiment, at least one of the upper mold 10a and the lower mold 10b in the region near the dividing line of the upper mold 10a and the lower mold 10b is heated with near infrared radiation by the near infrared radiation device 20, By detecting the temperature with a far-infrared temperature sensor, adjusting the intensity of near-infrared light and raising the temperature to a required temperature, the temperature of the thermosetting resin in the region near the dividing line of the upper mold 10a and the lower mold 10b is set. Raise the temperature. Also in the second embodiment, after the preheating process in which the laminated molding material 14 is preheated and placed in the molding die 9, the upper mold 10a and the lower mold 10b are matched with each other to mold the product. The upper mold 10a and the lower mold 10b in the region near the dividing line of the upper mold 10a and the lower mold 10b are thermoset simultaneously with the compression molding by the mold matching of the upper mold 10a and the lower mold 10b in the process of clamping and pressurizing the mold. The step of raising the temperature to a required temperature higher than that of the mold at the curing temperature of the conductive resin is performed using the near infrared radiation device 20.