JP2014095041A - Sealing material and sealing method - Google Patents
Sealing material and sealing method Download PDFInfo
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- JP2014095041A JP2014095041A JP2012247791A JP2012247791A JP2014095041A JP 2014095041 A JP2014095041 A JP 2014095041A JP 2012247791 A JP2012247791 A JP 2012247791A JP 2012247791 A JP2012247791 A JP 2012247791A JP 2014095041 A JP2014095041 A JP 2014095041A
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- sealing material
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- acid ester
- acrylic acid
- thermoplastic elastomer
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- 239000003566 sealing material Substances 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000007789 sealing Methods 0.000 title claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 93
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 53
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 41
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 13
- 239000010935 stainless steel Substances 0.000 claims abstract description 13
- 238000002834 transmittance Methods 0.000 claims description 16
- 239000003999 initiator Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- UHKPXKGJFOKCGG-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical group CC(C)=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 UHKPXKGJFOKCGG-UHFFFAOYSA-N 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 5
- 229920006132 styrene block copolymer Polymers 0.000 claims description 5
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 230000000704 physical effect Effects 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 230000035699 permeability Effects 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 6
- 229920006397 acrylic thermoplastic Polymers 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920006465 Styrenic thermoplastic elastomer Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- -1 acrylic ester Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ZMTBGVBNTHTBEC-UHFFFAOYSA-N (3,3,5-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1CC(OC(=O)C=C)CC(C)(C)C1 ZMTBGVBNTHTBEC-UHFFFAOYSA-N 0.000 description 1
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- YMZIFDLWYUSZCC-UHFFFAOYSA-N 2,6-dibromo-4-nitroaniline Chemical compound NC1=C(Br)C=C([N+]([O-])=O)C=C1Br YMZIFDLWYUSZCC-UHFFFAOYSA-N 0.000 description 1
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
本発明は、電子基板等に設けた電子素子や、金属が露出した部分に塗布して、それらを覆うことで電子機器を水分などから保護する封止材および封止方法に関する。 The present invention relates to a sealing material and a sealing method for protecting an electronic device from moisture or the like by coating an electronic element provided on an electronic substrate or the like or a portion where a metal is exposed, and covering them.
従来の塗布型の封止材は、電子素子を完全に覆って強固に固化する形態で使われていた。こうした封止材は、電子素子を保護する点については問題はなかったが、不透明であることから電子素子が破損したときに破損箇所の特定が難しく、また一度硬化した後は強固に固着するため、剥離が困難で破損した電子素子を交換することができなかった。そのため、封止された電子素子が破損した場合には、電子基板一式を交換する必要があった。そうした一方で、近年では多くの製品に防水性が望まれており電子素子を封止する必要性が高まってきた。そのため、封止された電子素子が破損することも多くなり、電子基板を交換すると費用が高くなることから、破損した電子素子の修理を行うために、剥がすことができる封止材への要望が高まってきた。 Conventional coating-type sealing materials have been used in a form that completely covers the electronic element and solidifies firmly. Such a sealing material has no problem with respect to protecting the electronic element, but because it is opaque, it is difficult to identify the damaged part when the electronic element is damaged, and it is firmly fixed after being cured. The electronic device which was difficult to peel off and was damaged could not be replaced. Therefore, when the sealed electronic element is damaged, it is necessary to replace the set of electronic substrates. On the other hand, in recent years, waterproofness is desired for many products, and the necessity of sealing electronic elements has increased. For this reason, the sealed electronic element is often damaged, and it is expensive to replace the electronic substrate. Therefore, there is a demand for a sealing material that can be peeled off in order to repair the damaged electronic element. It has increased.
また、電子基板は電子素子が密集して配置されていることが多く、封止材は電子基板において破損した電子素子以外の電子素子の間にも入り込んで複数の電子素子を覆っていることが多い。そのため、封止材を剥すときに、他の電子素子を破損させ難いことが要求される。ところが封止材が硬質であると、封止材を剥がす際に封止材が覆っている他の素子も剥離してしまうおそれがある。このように複雑に入り込んだ封止材を剥がすためには、封止材は柔軟に伸びる性質が求められる。しかし、柔軟性を高めると機械的強度が低下し、封止材を剥す際にちぎれやすいという問題があり、これらを両立することは難しかった。 In addition, the electronic substrate is often arranged with electronic elements densely, and the sealing material may enter between electronic elements other than the damaged electronic elements on the electronic substrate to cover the plurality of electronic elements. Many. Therefore, when peeling off a sealing material, it is requested | required that it is hard to damage another electronic element. However, if the sealing material is hard, other elements covered by the sealing material may be peeled off when the sealing material is peeled off. In order to peel off the encapsulating material that has entered in such a complicated manner, the encapsulating material is required to be flexible. However, when the flexibility is increased, the mechanical strength is lowered, and there is a problem that it is easily broken when the sealing material is peeled off, and it has been difficult to achieve both.
本発明は、上記課題を解決するためになされたものであり、所定の接着力、機械的強度、柔軟性を有する剥離しやすい封止材とその封止材を用いた封止方法とを提供するものである。
さらに本発明は、透明性の高い封止材とその封止材を用いた封止方法とを提供するものである。
The present invention has been made to solve the above-described problems, and provides a sealing material having a predetermined adhesive force, mechanical strength, and flexibility, and a sealing method using the sealing material. To do.
Furthermore, the present invention provides a highly transparent sealing material and a sealing method using the sealing material.
本発明の封止材は、電子基板に塗布した後に光を照射することで硬化し、電子素子を覆うことで前記電子素子を水分や異物から保護するものであり、単官能脂肪族(メタ)アクリル酸エステルモノマーと、光重合開始剤と、これら(メタ)アクリル酸エステルモノマーに溶解した熱可塑性エラストマーと、を主成分とし、硬化後のステンレスとの接着強さ(F)に対する引張強さ(H)の比(H/F)が2以上であり、切断時伸びが300%以上であることを特徴とする。
この封止材は、熱可塑性エラストマーを主成分の1つとして含むため、柔軟であるとともにその強度が高い。したがって、電子基板から剥がすときにちぎれ難い。また、細部に侵入して硬化した部分があっても伸張させながら容易に剥がすことができる。
The encapsulant of the present invention is cured by irradiating light after being applied to an electronic substrate and covering the electronic element to protect the electronic element from moisture and foreign matter. Tensile strength with respect to adhesive strength (F) with stainless steel after curing, comprising as main components an acrylic ester monomer, a photopolymerization initiator, and a thermoplastic elastomer dissolved in these (meth) acrylic ester monomers. The ratio (H / F) of H) is 2 or more, and the elongation at break is 300% or more.
Since this sealing material contains a thermoplastic elastomer as one of the main components, it is flexible and has high strength. Therefore, it is difficult to tear off when peeling from the electronic substrate. Moreover, even if there is a hardened part that penetrates into the details, it can be easily peeled off while being stretched.
また、単官能脂環式(メタ)アクリル酸エステルモノマーを主成分の1つとして含む。単官能脂環式(メタ)アクリル酸エステルモノマーは液状であり、熱可塑性エラストマーを溶解することができる。また、封止材の接着性および防湿性を高めることができ、封止材を剥したときの糊残りを防止することができる。 Moreover, a monofunctional alicyclic (meth) acrylic acid ester monomer is included as one of the main components. The monofunctional alicyclic (meth) acrylic acid ester monomer is in a liquid state and can dissolve the thermoplastic elastomer. Moreover, the adhesiveness and moisture-proof property of a sealing material can be improved, and the adhesive residue when peeling a sealing material can be prevented.
さらに、単官能脂肪族(メタ)アクリル酸エステルモノマーを主成分の1つとして含む。単官能脂肪族(メタ)アクリル酸エステルモノマーも単官能脂環式(メタ)アクリル酸エステルモノマーと同様に液状であり、熱可塑性エラストマーの溶解に寄与する。そして、封止材の柔軟性を向上させることができ、接着性を適度に調整することができる。 Furthermore, a monofunctional aliphatic (meth) acrylic acid ester monomer is included as one of the main components. The monofunctional aliphatic (meth) acrylic acid ester monomer is also in a liquid state like the monofunctional alicyclic (meth) acrylic acid ester monomer, and contributes to the dissolution of the thermoplastic elastomer. And the softness | flexibility of a sealing material can be improved and adhesiveness can be adjusted moderately.
硬化後のステンレスとの接着強さ(F)に対する引張強さ(H)の比(H/F)が2以上であるため、封止材を電子素子から剥がす際に封止材の破断を起こさずに封止材を電子基板上からきれいに取り除くことができる。また、切断時伸びが300%以上であるため、電子素子のリードフレームや電子素子と電子基板の隙間などに浸入して硬化した封止材も、伸張させながら剥すことでリードフレームの間などに残さずに取り除くことができる。 Since the ratio (H / F) of the tensile strength (H) to the adhesive strength (F) with the stainless steel after curing is 2 or more, the sealing material is broken when the sealing material is peeled off from the electronic element. Without removing the sealing material from the electronic substrate. In addition, since the elongation at the time of cutting is 300% or more, the sealing material that has entered and hardened into the lead frame of the electronic element or the gap between the electronic element and the electronic substrate can also be removed between the lead frame by peeling it off while stretching. It can be removed without leaving.
接着強さ(F)は、ステンレス基板に封止材を所定の厚みで塗布した後に、JIS K6854−2と同様の180°引き剥がし試験を行ったときの接着強さの値であり、引張り強さ(H)と、切断時伸びは、JIS K6251規定の方法で測定したものである。また、切断時伸びは実質的に700%以下である。
そして、接着強さ(F)と引張強さ(H)の比(H/F)は、幅を同幅として封止材を設けたときの、N/cmの単位で表される接着強さの値を、MPaの単位で表される引張強さの値で割った値である。
Adhesive strength (F) is a value of adhesive strength when a 180 ° peel test similar to JIS K6854-2 is performed after applying a sealing material to a stainless steel substrate with a predetermined thickness, and tensile strength. (H) and elongation at break are measured by the method defined in JIS K6251. Further, the elongation at break is substantially 700% or less.
The ratio (H / F) of the adhesive strength (F) and the tensile strength (H) is the adhesive strength expressed in units of N / cm when the sealing material is provided with the same width. Divided by the value of tensile strength expressed in units of MPa.
熱可塑性エラストマーと、単官能脂環式(メタ)アクリル酸エステルモノマーと、単官能脂肪族(メタ)アクリル酸エステルモノマーの合計重量に対する熱可塑性エラストマーの含有量を20重量%〜60重量%とすることができる。熱可塑性エラストマーの含有量を20重量%以上とすることで封止材の引張り強度を高めることができる。熱可塑性エラストマーの含有量を60重量%以下とすることで、塗工に適した粘度とすることができる。
熱可塑性エラストマーの含有量は35重量%以上とすることが好ましい。熱可塑性エラストマーの含有量を35重量%以上とすることで、封止材の透明性を高めることができる。封止材が透明であれば、封止した状態でも、例えば物理的な破損や、配線の短絡による焼けなど、破損による外観の変化を容易に認識することができ、電子素子の破損を目視または光学的な装置で検査することができる。
The content of the thermoplastic elastomer with respect to the total weight of the thermoplastic elastomer, the monofunctional alicyclic (meth) acrylic acid ester monomer, and the monofunctional aliphatic (meth) acrylic acid ester monomer is 20% by weight to 60% by weight. be able to. By setting the content of the thermoplastic elastomer to 20% by weight or more, the tensile strength of the sealing material can be increased. By setting the content of the thermoplastic elastomer to 60% by weight or less, the viscosity suitable for coating can be obtained.
The content of the thermoplastic elastomer is preferably 35% by weight or more. By setting the content of the thermoplastic elastomer to 35% by weight or more, the transparency of the sealing material can be increased. If the sealing material is transparent, even in a sealed state, it is possible to easily recognize changes in appearance due to damage, such as physical damage or burnt due to a short circuit of the wiring, and visual or It can be inspected with an optical device.
また、切断時伸びが400%以上とすることは好ましい。JIS K6251規定の切断時伸びが400%以上であると、特に電子素子が複雑に入り組んだ電子基板や、電子素子がリードフレームを有していても、封止材が柔軟で破断し難く電子基板からきれいに剥がすことができる。 Moreover, it is preferable that elongation at the time of cutting shall be 400% or more. When the elongation at break stipulated in JIS K6251 is 400% or more, an electronic board in which an electronic element is particularly complicated and an electronic board that is flexible and difficult to break even if the electronic element has a lead frame Can be removed cleanly.
熱可塑性エラストマーとしてスチレン系熱可塑性エラストマーを用いることができる。スチレン系熱可塑性エラストマーを用いることで、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーに溶解させることができる。
スチレン系熱可塑性エラストマーの中でもスチレン−イソブチレン−スチレンブロック共重合体を用いることができる。スチレン−イソブチレン−スチレンブロック共重合体を用いることで、封止材の防湿性を高めることができる。
Styrenic thermoplastic elastomer can be used as the thermoplastic elastomer. By using a styrenic thermoplastic elastomer, it can be dissolved in a monofunctional alicyclic (meth) acrylic acid ester monomer and a monofunctional aliphatic (meth) acrylic acid ester monomer.
Among the styrenic thermoplastic elastomers, a styrene-isobutylene-styrene block copolymer can be used. By using a styrene-isobutylene-styrene block copolymer, the moisture resistance of the sealing material can be enhanced.
また、熱可塑性エラストマーとして、(メタ)アクリル酸エステル共重合体を用いることができる。熱可塑性エラストマーとして(メタ)アクリル酸エステル共重合体を用いると封止材の透明性を高めることができる。 A (meth) acrylic acid ester copolymer can be used as the thermoplastic elastomer. When a (meth) acrylic acid ester copolymer is used as the thermoplastic elastomer, the transparency of the sealing material can be increased.
さらに、前記何れかの封止材を、電子素子を覆うように電子基板に塗布し光を照射して硬化することで、硬化後のステンレスとの接着強さ(F)に対する引張強さ(H)の比(H/F)が2以上であり、切断時伸びが300%以上である封止層を形成する封止方法を提供する。
このような封止方法を採用すれば、電子素子や電子基板に固着した封止材を剥がすことができることから、電子素子が破損したときに封止材を剥して、破損した電子素子を交換することできる。
Further, any of the above-mentioned sealing materials is applied to an electronic substrate so as to cover the electronic element, and is cured by irradiating light, whereby the tensile strength (H) relative to the adhesive strength (F) with the cured stainless steel (H) ) Ratio (H / F) is 2 or more, and a sealing method for forming a sealing layer having an elongation at break of 300% or more is provided.
If such a sealing method is adopted, the sealing material fixed to the electronic element or the electronic substrate can be peeled off. Therefore, when the electronic element is damaged, the sealing material is removed and the damaged electronic element is replaced. I can.
また、前記封止方法において、封止材の透過率を70%以上とすることができる。封止材の透過率を70%以上としたことで、例えば、物理的な破損や、配線の短絡による焼けなど、破損による概観変化を封止材で覆われていても容易に認識することができ、電子素子の破損を目視または光学的な装置で検査することができる。なお、上記透過率は、厚み1mmの試料について、分光光度計で平行光線透過率を測定し、波長400〜800nmの透過率の平均値で示したものである。また、透過率は実質的には100%未満である。 In the sealing method, the transmittance of the sealing material can be 70% or more. By setting the transmittance of the sealing material to 70% or more, it is possible to easily recognize an appearance change due to damage, such as physical damage or burnt due to a short circuit of the wiring, even if the sealing material is covered with the sealing material. The electronic device can be inspected visually or with an optical device. In addition, the said transmittance | permeability measured the parallel light transmittance with the spectrophotometer about the sample of thickness 1mm, and showed it with the average value of the transmittance | permeability of wavelength 400-800 nm. Further, the transmittance is substantially less than 100%.
本発明の封止材によれば、機械的強度と柔軟性とを併せ持ち、既に電子素子を封止して後から引き剥がす際にも容易に剥がすことができる。
また、本発明の封止方法によれば、電子素子を封止材で封止した後でも容易に封止材を引き剥がすことができる。
According to the sealing material of the present invention, it has both mechanical strength and flexibility, and can be easily peeled off when the electronic device is already sealed and then peeled off.
Moreover, according to the sealing method of this invention, even after sealing an electronic element with a sealing material, a sealing material can be peeled off easily.
本発明について実施形態に基づきさらに詳細に説明する。本発明の封止材は、電子基板に塗布した後に光を照射することで硬化し、電子素子を覆うことで電子素子を水分や異物から保護する液状の封止材である。
そしてその成分として、単官能脂環式(メタ)アクリル酸エステルモノマーと、単官能脂肪族(メタ)アクリル酸エステルモノマーと、これら(メタ)アクリル酸エステルモノマーに溶解した熱可塑性エラストマーと、光重合開始剤とを主成分として含んでいる。
The present invention will be described in more detail based on embodiments. The encapsulant of the present invention is a liquid encapsulant that is cured by irradiating light after being applied to an electronic substrate and protecting the electronic element from moisture and foreign matter by covering the electronic element.
And as its components, monofunctional alicyclic (meth) acrylic acid ester monomers, monofunctional aliphatic (meth) acrylic acid ester monomers, thermoplastic elastomers dissolved in these (meth) acrylic acid ester monomers, and photopolymerization It contains an initiator as a main component.
(1)熱可塑性エラストマー:
熱可塑性エラストマーは、封止材の機械的強度を向上させ、封止材を剥がすときにちぎれないようにするための成分である。熱可塑性エラストマー単独では固体のため液状封止材として塗布できない。そのため、主成分である単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーとの合計量に対して可溶である必要がある。また、ある程度のタックを有しているものの、接着性は有していない。
(1) Thermoplastic elastomer:
The thermoplastic elastomer is a component for improving the mechanical strength of the encapsulant and preventing it from being broken when the encapsulant is peeled off. A thermoplastic elastomer alone cannot be applied as a liquid sealing material because it is solid. Therefore, it is necessary to be soluble with respect to the total amount of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer as the main component. Moreover, although it has a certain amount of tack, it does not have adhesiveness.
熱可塑性エラストマーの配合量は、熱可塑性エラストマーと、単官能脂環式(メタ)アクリル酸エステルモノマーと、単官能脂肪族(メタ)アクリル酸エステルモノマーの合計重量に対して20重量%〜60重量%とすることができる。
熱可塑性エラストマーの配合量が、60重量%よりも多くなると封止材の粘度が高くなり、塗布が困難になる。一方、20重量%未満になると、機械的強度が十分でなく引張強さが弱くなるため剥がす際にちぎれるおそれがある。
The blending amount of the thermoplastic elastomer is 20% by weight to 60% by weight based on the total weight of the thermoplastic elastomer, the monofunctional alicyclic (meth) acrylic acid ester monomer, and the monofunctional aliphatic (meth) acrylic acid ester monomer. %.
When the blending amount of the thermoplastic elastomer is more than 60% by weight, the viscosity of the sealing material becomes high and application becomes difficult. On the other hand, if it is less than 20% by weight, the mechanical strength is not sufficient and the tensile strength is weakened, so there is a possibility of tearing off when peeling off.
熱可塑性エラストマーの配合量が、30重量%以上であると、特に封止材の機械的強度を高めることができるため、接着力を高めた封止材であっても、剥離するときにちぎれ難くすることができる。
さらに、熱可塑性エラストマーの配合量が、35重量%以上であると、封止材の機械的強度に加えて透明性を高めることができる。
When the blending amount of the thermoplastic elastomer is 30% by weight or more, the mechanical strength of the sealing material can be particularly increased. Therefore, even when the sealing material has an increased adhesive force, it is difficult to tear off when peeling. can do.
Furthermore, in addition to the mechanical strength of a sealing material, transparency can be improved as the compounding quantity of a thermoplastic elastomer is 35 weight% or more.
熱可塑性エラストマーの具体例としては、アクリル系熱可塑性エラストマーとスチレン系熱可塑性エラストマーの単独または混合物を挙げることができる。これらの熱可塑性エラストマーであればアクリル酸エステルモノマーに溶解することができ、所定の引張り強さ、接着強さを発現させることができる。 Specific examples of the thermoplastic elastomer include an acrylic thermoplastic elastomer and a styrene thermoplastic elastomer alone or as a mixture. These thermoplastic elastomers can be dissolved in the acrylate monomer and can exhibit a predetermined tensile strength and adhesive strength.
アクリル系熱可塑性エラストマーは、特に透明性に優れた封止材とすることができる。このことは、アクリル系熱可塑性エラストマーを構成するハードセグメントおよびソフトセグメントと、アクリル系熱可塑性エラストマーを溶解するアクリル酸エステルモノマーの屈折率の値が近いことが理由であると考えられる。こうしたアクリル系熱可塑性エラストマーとしては、具体的には(メタ)アクリル酸エステル共重合体を用いることができ、例えばハードセグメントとしてはメチルメタクリレート、ソフトセグメントとしてはブチルアクリレートの構造を有する(メタ)アクリル酸エステル共重合体を例示することができる。 The acrylic thermoplastic elastomer can be used as a sealing material particularly excellent in transparency. This is considered to be because the refractive index values of the hard and soft segments constituting the acrylic thermoplastic elastomer are close to those of the acrylate monomer that dissolves the acrylic thermoplastic elastomer. As such an acrylic thermoplastic elastomer, specifically, a (meth) acrylic ester copolymer can be used. For example, (meth) acrylic having a structure of methyl methacrylate as a hard segment and butyl acrylate as a soft segment. An acid ester copolymer can be illustrated.
スチレン系熱可塑性エラストマーは、特に透湿性の低い封止材とすることができる。そのため、特に湿気に弱い部材の保護や、高湿度の環境で用いる電子機器に適している。
スチレン系熱可塑性エラストマーの中でもスチレン−イソブチレン−スチレンブロック共重合体を用いることが好ましい。スチレン−イソブチレン−スチレンブロック共重合体は、イソブチレン骨格を有していることから、耐候性、耐熱性に優れるとともに、特に透湿度を低くすることができる。
Styrenic thermoplastic elastomer can be used as a sealing material with particularly low moisture permeability. Therefore, it is particularly suitable for protection of members sensitive to moisture and electronic devices used in a high humidity environment.
Among styrene thermoplastic elastomers, it is preferable to use a styrene-isobutylene-styrene block copolymer. Since the styrene-isobutylene-styrene block copolymer has an isobutylene skeleton, it is excellent in weather resistance and heat resistance, and in particular, moisture permeability can be lowered.
(2)単官能脂環式(メタ)アクリル酸エステルモノマー:
単官能脂環式(メタ)アクリル酸エステルモノマーは、液状組成物であり、後述の単官能脂肪族(メタ)アクリル酸エステルモノマーと共に熱可塑性エラストマーを溶解する成分である。また、単官能脂環式(メタ)アクリル酸エステルモノマーを配合することで、封止材の接着力を高めつつ、封止材を剥したときに糊残りを少なくすることができる。また、硬化後の封止材を強靭にして引張強さを高める効果がある。加えて、この成分の割合を多くすると防湿性と透明性を高めることができる。
(2) Monofunctional alicyclic (meth) acrylic acid ester monomer:
The monofunctional alicyclic (meth) acrylic acid ester monomer is a liquid composition and is a component that dissolves the thermoplastic elastomer together with the monofunctional aliphatic (meth) acrylic acid ester monomer described later. In addition, by adding the monofunctional alicyclic (meth) acrylic acid ester monomer, the adhesive residue of the sealing material can be increased, and the adhesive residue can be reduced when the sealing material is peeled off. Moreover, there exists an effect which makes the sealing material after hardening tough and raises tensile strength. In addition, when the proportion of this component is increased, moisture resistance and transparency can be improved.
単官能脂環式(メタ)アクリル酸エステルモノマーとして具体的には、イソボロニルアクリレート、シクロヘキシルアクリレート、ジシクロペンタニルアクリレート、3,3,5−トリメチルシクロヘキシルアクリレート、4−tert−ブチルシクロヘキシルアクリレート等を挙げることができる。 Specific examples of monofunctional alicyclic (meth) acrylic acid ester monomers include isobornyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 3,3,5-trimethylcyclohexyl acrylate, 4-tert-butylcyclohexyl acrylate, etc. Can be mentioned.
(3)単官能脂肪族(メタ)アクリル酸エステルモノマー:
単官能脂肪族(メタ)アクリル酸エステルモノマーもまた液状組成物であり、前記単官能脂環式(メタ)アクリル酸エステルモノマーと共に熱可塑性エラストマーを溶解するための成分である。単官能脂肪族(メタ)アクリル酸エステルモノマーを配合することで、封止材の柔軟性を高め切断時伸びを大きく向上させることができる。
(3) Monofunctional aliphatic (meth) acrylic acid ester monomer:
A monofunctional aliphatic (meth) acrylic acid ester monomer is also a liquid composition, and is a component for dissolving a thermoplastic elastomer together with the monofunctional alicyclic (meth) acrylic acid ester monomer. By blending the monofunctional aliphatic (meth) acrylic acid ester monomer, the flexibility of the sealing material can be increased and the elongation at cutting can be greatly improved.
単官能脂肪族(メタ)アクリル酸エステルモノマーとして具体的には、エトキシジエチレングリコールアクリレート、2−エチルヘキシルジグリコールアクリレート、ブトキシエチルアクリレート、フェノキシエチルアクリレート、ノニルフェノールエチレンオキシド変性アクリレートなどの脂肪族エーテル系(メタ)アクリル酸エステルモノマーや、ラウリルアクリレート、ステアリルアクリレート、イソステアリルアクリレート、デシルアクリレート、イソデシルアクリレートなどの脂肪族炭化水素系(メタ)アクリル酸エステルモノマーを挙げることができる。 Specific examples of monofunctional aliphatic (meth) acrylic acid ester monomers include aliphatic ether-based (meth) acrylic such as ethoxydiethylene glycol acrylate, 2-ethylhexyl diglycol acrylate, butoxyethyl acrylate, phenoxyethyl acrylate, and nonylphenol ethylene oxide-modified acrylate. Examples include acid ester monomers and aliphatic hydrocarbon (meth) acrylic acid ester monomers such as lauryl acrylate, stearyl acrylate, isostearyl acrylate, decyl acrylate, and isodecyl acrylate.
単官能脂環式および単官能脂肪族(メタ)アクリル酸エステルモノマーを合わせた配合量は、熱可塑性エラストマー、単官能脂環式(メタ)アクリル酸エステルモノマーおよび単官能脂肪族(メタ)アクリル酸エステルモノマーの合計重量に対して40重量%〜80重量%とすることができる。そして、脂環式(メタ)アクリル酸エステルモノマーと、脂肪族(メタ)アクリル酸エステルモノマーの重量比は、3:2〜1:4となるようにすることができる。 The combined amount of monofunctional alicyclic and monofunctional aliphatic (meth) acrylic acid ester monomers is thermoplastic elastomer, monofunctional alicyclic (meth) acrylic acid ester monomer and monofunctional aliphatic (meth) acrylic acid. It can be 40 to 80% by weight based on the total weight of the ester monomers. And the weight ratio of an alicyclic (meth) acrylic acid ester monomer and an aliphatic (meth) acrylic acid ester monomer can be made into 3: 2 to 1: 4.
単官能脂肪族(メタ)アクリル酸エステルモノマーが脂環式(メタ)アクリル酸エステルモノマーの4重量倍を超える場合には、封止材を剥したときに糊残りが発生するおそれがあり、接着強さ、防湿性が不十分となるおそれがある。逆に3分の2未満の場合には、封止材が硬くなりやすく、さらに経時変化で必要以上に接着性が増大し剥離が困難になるおそれがある。そして、脂環式(メタ)アクリル酸エステルモノマーと、脂肪族(メタ)アクリル酸エステルモノマーの重量比が3:2〜1:4の範囲であれば、特に切断時伸びが大きく、剥離しやすい封止材とすることができる。 If the monofunctional aliphatic (meth) acrylic acid ester monomer exceeds 4 times the weight of the alicyclic (meth) acrylic acid ester monomer, there is a possibility that adhesive residue may be generated when the sealing material is peeled off. The strength and moisture resistance may be insufficient. On the other hand, if it is less than two-thirds, the sealing material tends to be hard, and the adhesiveness may increase more than necessary due to changes over time, which may make peeling difficult. If the weight ratio of the alicyclic (meth) acrylic acid ester monomer and the aliphatic (meth) acrylic acid ester monomer is in the range of 3: 2 to 1: 4, the elongation at the time of cutting is particularly large, and it is easy to peel off. It can be used as a sealing material.
(4)光重合開始剤:
光重合開始剤としては、ベンゾフェノン系、チオキサントン系、アセトフェノン系、アシルフォスフィン系等の光重合開始剤を用いることができる。光重合開始剤の使用量は、単官能脂環式および脂肪族(メタ)アクリル酸エステルモノマーの合計量100重量部に対して、0.1〜10重量部が好ましく、1〜8重量部がより好ましい。
(4) Photopolymerization initiator:
As the photopolymerization initiator, benzophenone-based, thioxanthone-based, acetophenone-based, acylphosphine-based photopolymerization initiators can be used. The amount of the photopolymerization initiator used is preferably 0.1 to 10 parts by weight, and 1 to 8 parts by weight based on 100 parts by weight of the total amount of monofunctional alicyclic and aliphatic (meth) acrylic acid ester monomers. More preferred.
(5)その他の成分:
本発明の趣旨を逸脱しない範囲で添加剤を適宜配合することができる。例えば単官能脂環式および単官能脂肪族(メタ)アクリル酸エステルモノマー以外のアクリル酸エステルモノマーや、シランカップリング剤、重合禁止剤、消泡剤、光安定剤、酸化防止剤、帯電防止剤及び充填剤等を配合しても良い。
(5) Other ingredients:
Additives can be appropriately blended without departing from the spirit of the present invention. For example, acrylate monomers other than monofunctional alicyclic and monofunctional aliphatic (meth) acrylate monomers, silane coupling agents, polymerization inhibitors, antifoaming agents, light stabilizers, antioxidants, antistatic agents In addition, a filler or the like may be blended.
(6)封止材
上記成分からなる封止材は、熱可塑性エラストマーを単官能脂環式(メタ)アクリル酸エステルモノマーおよび単官能脂肪族(メタ)アクリル酸エステルモノマーに溶解させるとともにその他の上記成分を混合することで液状組成物として得られる。この液状組成物は、所定の電子素子上に塗布して覆い、紫外線等を照射して硬化する。こうして、ステンレスとの接着強さ(F)に対する引張強さ(H)の比(H/F)が2以上であり、切断時伸びが300%以上である硬化した封止材が得られる。
(6) Sealing material The sealing material comprising the above components dissolves the thermoplastic elastomer in a monofunctional alicyclic (meth) acrylic acid ester monomer and a monofunctional aliphatic (meth) acrylic acid ester monomer, and the above other It is obtained as a liquid composition by mixing the components. This liquid composition is applied and covered on a predetermined electronic element, and cured by irradiating with ultraviolet rays or the like. In this way, a cured encapsulant having a ratio (H / F) of tensile strength (H) to adhesive strength (F) with stainless steel of 2 or more and elongation at break of 300% or more is obtained.
(A)試料の作製:
以下の表1〜表3で示す配合からなる試料1〜試料17の封止材を作製した。
まず、熱可塑性エラストマー、単官能脂環式アクリル酸エステルモノマー、単官能脂肪族アクリル酸エステルモノマーを混合して、熱可塑性エラストマーがアクリルモノマーに均一に溶解するまで攪拌して液状混合物を得た。その後に、前記液状混合物に光重合開始剤を所定量添加した。
(A) Preparation of sample:
The sealing materials of Sample 1 to Sample 17 having the formulations shown in Tables 1 to 3 below were produced.
First, a thermoplastic elastomer, a monofunctional alicyclic acrylic acid ester monomer, and a monofunctional aliphatic acrylic acid ester monomer were mixed and stirred until the thermoplastic elastomer was uniformly dissolved in the acrylic monomer to obtain a liquid mixture. Thereafter, a predetermined amount of a photopolymerization initiator was added to the liquid mixture.
試料1〜試料6を対比すると、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの配合比を1:1に固定した中で熱可塑性エラストマーの配合量を変化させている。
試料3、試料7〜試料13を対比すると、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの合計配合量を固定した中で、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの配合比を変化させている。
試料1と試料14を対比すると、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの配合比を変化させている。
そして、試料3、試料15〜試料17を対比すると、単官能脂環式(メタ)アクリル酸エステルモノマーの種類を変化させている。
Comparing Sample 1 to Sample 6, when the compounding ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer is fixed to 1: 1, the thermoplastic elastomer is compounded. The amount is changing.
When Sample 3 and Sample 7 to Sample 13 are compared, the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer are combined in a fixed amount. The compounding ratio of the formula (meth) acrylate monomer and the monofunctional aliphatic (meth) acrylate monomer is changed.
When Sample 1 and Sample 14 are compared, the compounding ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer is changed.
And when the sample 3 and the sample 15-the sample 17 are contrasted, the kind of monofunctional alicyclic (meth) acrylic acid ester monomer is changed.
(B)試験および評価方法:
各試料については、接着強さ、引張強さ、切断時伸び、透過率、透湿度について試験し、リワーク性について評価した。以下に各試験および評価方法について詳しく説明する。
(B) Test and evaluation method:
Each sample was tested for adhesive strength, tensile strength, elongation at break, transmittance, and moisture permeability and evaluated for reworkability. Each test and evaluation method will be described in detail below.
a.接着強さ(N/cm):
各試料の接着強さはJIS K6854−2規定の180度剥離試験方法を一部変更して測定した。まず、幅25mm、厚さ1.5mm、長さ200mmのステンレス板を準備し、その片面について端から120mmまで厚さ10μmの微粘着性保護フィルムを貼り付けた。次にステンレス板の外形と同じ大きさの掘り込みを有する治具に保護フィルム面を上にしてステンレス板を装着し、ステンレス板の上に各試料の封止材を塗布した。そして、紫外線を照射して各試料を硬化することで試験片を作成した。このとき、硬化後の厚みが1mmになるように封止材の塗布厚みを調製した。
a. Adhesive strength (N / cm):
The adhesion strength of each sample was measured by partially changing the 180 degree peel test method defined in JIS K6854-2. First, a stainless steel plate having a width of 25 mm, a thickness of 1.5 mm, and a length of 200 mm was prepared, and a slightly adhesive protective film having a thickness of 10 μm was attached from one end to 120 mm on one side. Next, the stainless steel plate was mounted on a jig having a digging of the same size as the outer shape of the stainless steel plate with the protective film face up, and the sealing material of each sample was applied on the stainless steel plate. And the test piece was created by irradiating an ultraviolet-ray and hardening | curing each sample. At this time, the coating thickness of the sealing material was adjusted so that the thickness after curing was 1 mm.
微粘着性保護フィルムを設けた端から封止材を引き剥がし、封止材を引き剥がした方のステンレス板をつかみに取り付ける一方で、引き剥がした封止材をもう一方のつかみに取り付けてストログラフ(東洋精機製作所社製「ストログラフVE5D」)を用いて300mm/minの速度で引張る180度剥離試験を行う。
本方法で作成した試験片は、接着箇所の境界に保護フィルムの厚み分の段差ができていたが、段差の部分が剥れるときも接着力はかわらず、また段差がきっかけとなり封止材が切断されることもなかった。
また、本試験はステンレス板を対象に行ったが、電子基板に用いられているエポキシ樹脂基板に対しても、接着力は同様の傾向を示した。
Peel off the sealing material from the edge where the slightly adhesive protective film is provided, and attach the stainless steel plate from which the sealing material has been peeled off to the grip, while attaching the peeled sealing material to the other grip. Using a graph (“Strograph VE5D” manufactured by Toyo Seiki Seisakusho Co., Ltd.), a 180 degree peel test is performed by pulling at a speed of 300 mm / min.
The test piece created by this method had a step corresponding to the thickness of the protective film at the boundary of the adhesion point, but even when the step part peeled off, the adhesive force was not affected, and the step became a trigger and the sealing material was It was not cut.
Moreover, although this test was performed on the stainless steel plate, the adhesive force showed the same tendency with respect to the epoxy resin substrate used for the electronic substrate.
b.引張強さ(MPa)および切断時伸び(%):
引張強さはJIS K6251規定の方法に基づき測定した。より具体的には、各試料の封止材を2枚の剥離フィルムの間に塗布して硬化した後に、剥離フィルムを剥して厚みが2mmのシートを作製した。そして、そのシートをダンベル状3号形に打ち抜くことで、各試料の試験片を得た。そして、各試験片をストログラフ(東洋精機製作所社製「ストログラフVE5D」)を用いて500mm/minの速度で引張ることで、引張強さおよび切断時伸びの値を測定した。
b. Tensile strength (MPa) and elongation at break (%):
The tensile strength was measured based on the method defined in JIS K6251. More specifically, the sealing material of each sample was applied between two release films and cured, and then the release film was peeled off to produce a sheet having a thickness of 2 mm. And the test piece of each sample was obtained by punching the sheet | seat into the dumbbell-shaped No. 3 form. Then, each test piece was pulled at a speed of 500 mm / min using a strograph (“Strograph VE5D” manufactured by Toyo Seiki Seisakusho Co., Ltd.), and the tensile strength and elongation at break were measured.
c.透過率(%):
各試料の封止材を2枚の剥離フィルムの間に塗布して硬化した後に、剥離フィルムを剥して厚みが1mmのシートを作製した。この各シートについて、分光光度計(島津製作所社製「UV−1600PC」)を用いて、平行光線透過率を測定し、波長400〜800nmの透過率の平均値を算出した。
c. Transmittance (%):
After applying and hardening the sealing material of each sample between two peeling films, the peeling film was peeled off and the sheet | seat with a thickness of 1 mm was produced. About each of these sheets, parallel light transmittance was measured using a spectrophotometer (“UV-1600PC” manufactured by Shimadzu Corporation), and an average value of transmittance at a wavelength of 400 to 800 nm was calculated.
d.透湿度(%):
透過率の測定で用いたシートと同様の方法で作製した厚さ1mmのシートを用いて、JIS Z0208に従って、温度40℃、相対湿度90%RHでの透湿度を測定した。
d. Moisture permeability (%):
The moisture permeability at a temperature of 40 ° C. and a relative humidity of 90% RH was measured according to JIS Z0208 using a sheet having a thickness of 1 mm produced by the same method as the sheet used in the measurement of transmittance.
e.リワーク性:
電子基板に約30mm×30mmの範囲で封止材を塗布した後に、紫外線を照射して硬化した。次いで、硬化した封止材を角から剥したときの剥がし易さの指標をリワーク性として評価した。
具体的には、「糊残りの有無」、「封止材の破断の有無」、「電子素子のリードフレームや隙間などの細部における封止材の破断残りの有無」、「電子素子への影響」の4つの観点から見た結果を総合的に評価した。
e. Reworkability:
After the sealing material was applied to the electronic substrate in a range of about 30 mm × 30 mm, it was cured by irradiation with ultraviolet rays. Next, an index of ease of peeling when the cured sealing material was peeled from the corner was evaluated as reworkability.
More specifically, “presence / absence of adhesive residue”, “presence / absence of encapsulant breakage”, “presence / absence of encapsulant breakage in details such as lead frames and gaps of electronic elements”, “effect on electronic elements” The results seen from the four viewpoints were comprehensively evaluated.
「糊残りの有無」: 封止材を剥がすときに、電子基板の表面に、液状または固体の異物が何も残らないものを“A”とし、異物が残るものを“C”とした。また、慎重に剥離せずに素早く引きはがす等の場合に異物が残るときがあるものを“B”とした。表では“糊残り”の項目で表記した。 “Presence / absence of adhesive residue”: When the sealing material was peeled off, “A” was defined as “A” when no liquid or solid foreign matter remained on the surface of the electronic substrate, and “C” was defined as residual residue. In addition, “B” is a case where foreign matter may remain in the case of quick peeling without carefully peeling. In the table, it is indicated by the item “Remaining glue”.
「封止材の破断の有無」: 封止材を剥がすときに封止材が破断せずに剥離したものを“A”とし、封止材が破断したものを“C”とした。また、慎重に剥離せずに素早く引き剥がす等の場合に破断するときがあるものを“B”とした。表では“破断”の項目で表記した。 “Presence / absence of breakage of sealing material”: When the sealing material was peeled off, the sealing material was peeled without breaking, and “A” was given, and the sealing material was broken as “C”. In addition, “B” indicates that the material may break when it is quickly peeled off without carefully peeling. In the table, the item “Break” is used.
「電子素子のリードフレームや隙間などの細部における封止材の破断残りの有無」: 電子素子のリードフレームや電子素子と基板の隙間などの細部にも液状の封止材は浸入して硬化するが、封止材を剥離する際にこうした部分は特に破断しやすい。本評価では、リードフレームの間に封止材が残ったかどうかを確認して評価した。封止材が残らずに剥離できたものを“A”とし、リードフレーム間に封止材が残るものを“C”とした。また、慎重に剥離せずに素早く引き剥がす等の場合にリードフレーム間に封止材が残るときがあるものを“B”とした。表では“細部破断残り”の項目で表記した。 "Establishment of sealing material remaining in details such as lead frames and gaps in electronic elements": Liquid sealing material penetrates and cures in details such as lead frames in electronic elements and gaps between electronic elements and substrates. However, such a part is particularly easily broken when the sealing material is peeled off. In this evaluation, it was evaluated by checking whether or not the sealing material remained between the lead frames. The case where the sealing material was peeled off without leaving the residue was designated as “A”, and the case where the sealing material remained between the lead frames was designated as “C”. Also, “B” is the case where the sealing material may remain between the lead frames in the case where it is quickly peeled off without carefully peeling. In the table, it is indicated by the item “Remaining details broken”.
「電子素子への影響」: 封止材を剥がすときに電子素子に何の影響も見られないものを“A”とし、電子素子が封止材とともに剥れたものを“C”とした。また、慎重に剥離せずに素早く引き剥がす等の場合に電子素子が傾く、伸びる、剥離する等の影響が出るときがあるものを“B”とした。表では“電子素子への影響”の項目で表記した。 “Effect on the electronic device”: When the sealing material was peeled off, “A” was given when the electronic device had no effect, and “C” was given when the electronic device was peeled off together with the sealing material. In addition, “B” indicates that the electronic element may be tilted, stretched, or peeled off when it is quickly peeled off without being carefully peeled off. In the table, it is indicated by the item “Effects on electronic elements”.
リワーク性は上記の4項目を総合的に判断し、1つでも“C”があったものを「×」とし、1つでも“B”があったものを「△」とし、“A”のみのものを「○」とした。また、主観的ではあるが特に剥離しやすかったものを「◎」とした。 Reworkability is judged comprehensively based on the above four items. If there is at least one “C”, “X” indicates that there is at least one “B”. Were marked with “○”. Moreover, although it was subjective, the thing which was especially easy to peel was set as "(double-circle)".
(C)評価結果:
試料1は、細部における封止材の破断残りが生じたため、リワーク性は「×」であった。試料1の物性は、引張強さが1.1MPaと低く封止材の機械的強度が弱い一方で、接着強さが0.46N/cmと比較的高く、切断時伸びが262%と低かった。電子基板や電子素子への接着力に対して、材料強度が弱く伸張しにくい性質が相まって、剥離する前に細部で破断したものと考えられる。なお、熱可塑性エラストマーと単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの主要3成分中の熱可塑性エラストマーの配合量は15重量%である。
(C) Evaluation result:
Sample 1 had a reworkability of “×” because the sealing material was broken in detail. The physical properties of Sample 1 were as follows: the tensile strength was as low as 1.1 MPa and the mechanical strength of the sealing material was weak, while the adhesive strength was relatively high at 0.46 N / cm and the elongation at break was as low as 262%. . It is considered that the material was weak and difficult to stretch with respect to the adhesive strength to the electronic substrate and the electronic element, and was broken in detail before peeling. In addition, the compounding quantity of the thermoplastic elastomer in three main components of a thermoplastic elastomer, a monofunctional alicyclic (meth) acrylic acid ester monomer, and a monofunctional aliphatic (meth) acrylic acid ester monomer is 15 weight%.
試料2は、引き剥がしの仕方によっては細部における封止材の破断残りが生じる場合もあるため、リワーク性は「△」であった。試料2の物性は、接着強さは試料1と同程度であったものの、引張強さが2.2MPaへと大きくなり、また切断時伸びも352%へと向上していた。そして、接着強さと引張強さの比も4倍を超えて大きくなった。試料1と試料2の対比から、切断時伸びは300%以上あることが好ましいことがわかった。上記主要3成分中の熱可塑性エラストマーの配合量は20重量%である。 Sample 2 had a reworkability of “Δ” because there was a case where the breakage of the sealing material in detail was generated depending on the method of peeling. Regarding the physical properties of Sample 2, although the adhesive strength was similar to that of Sample 1, the tensile strength was increased to 2.2 MPa, and the elongation at break was also improved to 352%. And the ratio of adhesive strength to tensile strength also increased more than four times. From comparison between Sample 1 and Sample 2, it was found that the elongation at break is preferably 300% or more. The blending amount of the thermoplastic elastomer in the three main components is 20% by weight.
試料3は、リワーク性が試料1や試料2より優れ、「○」であった。試料3の物性は切断時伸びが481%と大きく向上した。また、透過率は55%であり、34%であった試料2から大きく向上した。試料3は糊残りもなく、適度な接着強さと引張強さを有しているとともに、透明性が高く透湿度が低かった。上記主要3成分中の熱可塑性エラストマーの配合量は30重量%である。 Sample 3 was superior to Sample 1 and Sample 2 in reworkability, and was “◯”. The physical properties of Sample 3 were greatly improved by 481% elongation at break. Further, the transmittance was 55%, which was a great improvement over Sample 2 which was 34%. Sample 3 had no adhesive residue, moderate adhesive strength and tensile strength, and had high transparency and low moisture permeability. The blending amount of the thermoplastic elastomer in the three main components is 30% by weight.
試料4は、リワーク性を判断する評価項目が何れも“A”であることに加え、他の何れの試料よりも引き剥がし易く何の問題も生じそうになかったため、リワーク性の評価を「◎」とした。試料4の物性は、引張強さと切断時伸びがさらに向上するとともに、透過率が72%と大幅に向上した。上記3成分中の熱可塑性エラストマーの配合量は35重量%である。 In Sample 4, the evaluation item for judging the reworkability was “A” in all cases, and it was easier to peel off than any other sample, and no problem was likely to occur. " Regarding the physical properties of Sample 4, the tensile strength and elongation at break were further improved, and the transmittance was greatly improved to 72%. The blending amount of the thermoplastic elastomer in the three components is 35% by weight.
試料5は、試料4と同様の理由によりリワーク性の評価を「◎」とした。試料5の物性は、引張強さと切断時伸び、透過率がさらに向上し、接着強さと引張強さの比も大きくなった。上記3成分中の熱可塑性エラストマーの配合量は50重量%である。 For sample 5, the reworkability was evaluated as “◎” for the same reason as sample 4. The physical properties of Sample 5 were further improved in tensile strength, elongation at break, and transmittance, and the ratio of adhesive strength to tensile strength was increased. The blending amount of the thermoplastic elastomer in the three components is 50% by weight.
試料6は、アクリルモノマーに熱可塑性エラストマーを溶解することができず、封止材を得られなかった。このことは、熱可塑性エラストマーの量が相対的に多すぎたためであると考えられる。上記3成分中の熱可塑性エラストマーの配合量は60重量%である。 In Sample 6, the thermoplastic elastomer could not be dissolved in the acrylic monomer, and the sealing material could not be obtained. This is considered to be because the amount of the thermoplastic elastomer was relatively large. The blending amount of the thermoplastic elastomer in the three components is 60% by weight.
試料7は、硬く脆い封止材となりリワークすることができなった。また、硬く脆いため物性評価のための試験片を作製できなった。試料7には、単官能脂肪族(メタ)アクリル酸エステルモノマーが含まれていない。 Sample 7 became a hard and brittle sealing material and could not be reworked. Moreover, since it was hard and brittle, the test piece for physical property evaluation was not able to be produced. Sample 7 does not contain a monofunctional aliphatic (meth) acrylic acid ester monomer.
試料8は、リワーク性が「×」であった。これは、接着強度が大きかったためか、電子素子を覆ったまま電子素子ごと剥離したからである。試料8の物性は、接着強度は19N/cmと大きく、また引張強さも9.2MPaと大きかった。そして、引張強さが9.2MPaと大きいにもかかわらず切断時伸びは336%と、それほど大きくはなかった。こうした物性から、変形しにくく伸びにくい性質であることがわかる。透明性では、試料3等と比較して透過率が極めて高かった。試料8では、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比が4:1である。 Sample 8 had a reworkability of “x”. This is because the adhesive strength was high or the entire electronic device was peeled off while covering the electronic device. As for the physical properties of Sample 8, the adhesive strength was as large as 19 N / cm, and the tensile strength was as large as 9.2 MPa. And although tensile strength was as large as 9.2 MPa, elongation at the time of cutting was not so large as 336%. From these physical properties, it can be seen that the material is hard to be deformed and hardly stretched. In terms of transparency, the transmittance was extremely high compared to Sample 3 and the like. In sample 8, the weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer to the monofunctional aliphatic (meth) acrylic acid ester monomer is 4: 1.
試料9も試料8と同様に電子素子への影響の観点からリワーク性が「×」であった。物性では、切断時伸びが試料8よりも向上して374%に上がったが、それでもあまり大きくない数字である。試料9の単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比は3:1である。 Sample 9 also had a reworkability of “x” from the viewpoint of the influence on the electronic device, as in Sample 8. In terms of physical properties, the elongation at break improved from that of sample 8 and increased to 374%, but it is still not a large number. The weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer of Sample 9 is 3: 1.
試料10は、リワーク性が「○」であった。試料9と比較すると、接着強さ、引張強さとも弱いが切断時伸びが502%と大きく向上している。試料10は糊残りもなく、適度な接着強さと引張強さを有しているとともに、透明性が高く透湿度が低かった。試料10の単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比は3:2である。 Sample 10 had a rework property of “◯”. Compared to Sample 9, the bond strength and tensile strength are both weak, but the elongation at break is greatly improved to 502%. Sample 10 had no adhesive residue, moderate adhesive strength and tensile strength, and had high transparency and low moisture permeability. The weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer of Sample 10 is 3: 2.
試料11は、リワーク性が「○」であった。試料11の物性は試料10と比べると接着強さも引張強さも弱まったが切断時伸びはほぼ同様であった。また、接着強さと引張強さの比は試料10と比べてもかなり大きくなった。試料11の単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比は1:2である。 Sample 11 had a rework property of “◯”. The physical properties of Sample 11 were lower than those of Sample 10 in terms of adhesion strength and tensile strength, but the elongation at break was almost the same. In addition, the ratio between the adhesive strength and the tensile strength was considerably larger than that of the sample 10. The weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer of Sample 11 is 1: 2.
試料12はリワーク性は「△」であった。引張強さが1.2MPaと低い値となっている。試料12の単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比は1:3である。 Sample 12 had a reworkability of “Δ”. The tensile strength is as low as 1.2 MPa. The weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer of Sample 12 is 1: 3.
試料13は、リワーク性は「○」であった。しかしながら、接着力が弱まっており、慎重に剥離せずに素早く引き剥がす等の場合に異物が残る「糊残り」を生じる場合があり、グレード的にはやや劣るものであった。試料13の単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比は1:4である。 Sample 13 had a rework property of “◯”. However, the adhesive strength is weakened, and there is a case where “glue residue” is left, in which foreign matter remains in the case of quick peeling without careful peeling, which is somewhat inferior in terms of grade. The weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer and the monofunctional aliphatic (meth) acrylic acid ester monomer of Sample 13 is 1: 4.
試料14は、封止材が破断し、リワーク性は「×」となった。試料14の物性は、引張強さがかなり弱まり、接着強さと引張強さの比も1.9となり2倍を下回った。 In Sample 14, the sealing material was broken, and the reworkability was “x”. As for the physical properties of Sample 14, the tensile strength was considerably weakened, and the ratio of the adhesive strength to the tensile strength was 1.9, which was less than twice.
試料15〜試料17もリワーク性は「○」であった。試料3との比較で単官能脂環式(メタ)アクリル酸エステルモノマーをイソボロニルアクリレートから、試料15の3,5,5−トリメチルシクロヘキシルアクリレート、試料16のシクロヘキシルアクリレート、試料17のジシクロペンタニルアクリレートに代えても物性への影響は少なかった。 Samples 15 to 17 also had a rework property of “◯”. In comparison with sample 3, the monofunctional alicyclic (meth) acrylic acid ester monomer is converted from isobornyl acrylate, sample 15, 3,5,5-trimethylcyclohexyl acrylate, sample 16 cyclohexyl acrylate, sample 17 dicyclopenta Even if it replaced with nyl acrylate, there was little influence on a physical property.
熱可塑性エラストマー、単官能脂環式(メタ)アクリル酸エステルモノマー、単官能脂肪族(メタ)アクリル酸エステルモノマーの主要3成分の合計量を100重量%としたうちの熱可塑性エラストマーの配合量を30重量%とした場合に、単官能脂環式(メタ)アクリル酸エステルモノマーと単官能脂肪族(メタ)アクリル酸エステルモノマーの重量比が3:2〜1:4の範囲でリワーク性に優れていた。また、単官能脂環式(メタ)アクリル酸エステルモノマーの多い方が硬く伸びにくく、単官能脂肪族(メタ)アクリル酸エステルモノマーの多い方が柔軟で伸び易い傾向にあった。
透湿度および透明性については、単官能脂環式(メタ)アクリル酸エステルモノマーの多い方が優れており、一方で、単官能脂肪族(メタ)アクリル酸エステルモノマーの多い方が接着強さ(F)に対する引張強さ(H)の比が大きくなる傾向が見られた。
The blending amount of thermoplastic elastomer out of the total amount of the three main components of thermoplastic elastomer, monofunctional alicyclic (meth) acrylic acid ester monomer, and monofunctional aliphatic (meth) acrylic acid ester monomer is 100% by weight. Excellent reworkability when the weight ratio of the monofunctional alicyclic (meth) acrylic acid ester monomer to the monofunctional aliphatic (meth) acrylic acid ester monomer is in the range of 3: 2 to 1: 4. It was. Further, the more monofunctional alicyclic (meth) acrylic acid ester monomer was harder and less likely to be stretched, and the more monofunctional aliphatic (meth) acrylic acid ester monomer was apt to be more flexible and easy to stretch.
For moisture permeability and transparency, the more monofunctional alicyclic (meth) acrylate monomer is better, while the more monofunctional aliphatic (meth) acrylate monomer has better adhesion strength ( There was a tendency for the ratio of tensile strength (H) to F) to increase.
上記実施形態は本発明の一例であり、こうした形態に限定されるものではなく、本発明の趣旨に反しない他の任意の変更形態を含むものである。 The above-described embodiment is an example of the present invention, and is not limited to such a form, and includes other arbitrary modifications that are not contrary to the gist of the present invention.
Claims (8)
単官能脂環式(メタ)アクリル酸エステルモノマーと、単官能脂肪族(メタ)アクリル酸エステルモノマーと、これら(メタ)アクリル酸エステルモノマーに溶解した熱可塑性エラストマーと、光重合開始剤と、を主成分とし、
硬化後のステンレスとの接着強さ(F)に対する引張強さ(H)の比(H/F)が2以上であり、切断時伸びが300%以上である封止材。 It is a liquid sealing material that is cured by irradiating light after being applied to the electronic substrate, and protecting the electronic element from moisture and foreign matter by covering the electronic element,
A monofunctional alicyclic (meth) acrylic acid ester monomer, a monofunctional aliphatic (meth) acrylic acid ester monomer, a thermoplastic elastomer dissolved in these (meth) acrylic acid ester monomers, and a photopolymerization initiator, As the main component,
A sealing material having a ratio (H / F) of tensile strength (H) to adhesive strength (F) with stainless steel after curing of 2 or more and elongation at break of 300% or more.
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JPWO2018008257A1 (en) * | 2016-07-05 | 2019-04-04 | 積水ポリマテック株式会社 | SEALING MATERIAL COMPOSITION AND SEALING MATERIAL |
JP2019121719A (en) * | 2018-01-09 | 2019-07-22 | 住友ベークライト株式会社 | Sealing film and sealing film-covering electronic component-mounted substrate |
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WO2020184110A1 (en) * | 2019-03-12 | 2020-09-17 | 積水ポリマテック株式会社 | Photocurable composition and electronic board |
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JPWO2018008257A1 (en) * | 2016-07-05 | 2019-04-04 | 積水ポリマテック株式会社 | SEALING MATERIAL COMPOSITION AND SEALING MATERIAL |
JP2018199796A (en) * | 2017-05-29 | 2018-12-20 | 積水ポリマテック株式会社 | Sealing material composition and sealing material |
JP2019121719A (en) * | 2018-01-09 | 2019-07-22 | 住友ベークライト株式会社 | Sealing film and sealing film-covering electronic component-mounted substrate |
WO2020137658A1 (en) * | 2018-12-26 | 2020-07-02 | 積水ポリマテック株式会社 | Photocurable composition, sealing material, waterproof structure, and method for manufacturing gasket |
CN113227179A (en) * | 2018-12-26 | 2021-08-06 | 积水保力马科技株式会社 | Photocurable composition, sealing material, waterproof structure, and method for producing gasket |
TWI739232B (en) * | 2018-12-26 | 2021-09-11 | 日商積水保力馬科技股份有限公司 | Photocurable composition, sealing material, waterproof structure and manufacturing method of gasket |
WO2020184110A1 (en) * | 2019-03-12 | 2020-09-17 | 積水ポリマテック株式会社 | Photocurable composition and electronic board |
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