JP2014094469A - Method of manufacturing liquid ejection head and liquid ejection head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid ejection head by which even though a base material is warped, misalignment of a position onto which an adhesive is applied is minimized relative to a liquid supply port, and the adhesive entering the liquid supply port is thereby reduced.SOLUTION: There is provided the method of manufacturing a liquid ejection head having a base material 1 in which an array of liquid supply ports is formed and a liquid ejection device that is connected to the base material 1 with an adhesive 30. The method includes the steps of: defining a first virtual reference line along a longitudinal direction of the base material 1 and measuring distance between the first virtual reference line and at least two liquid supply ports of the array of liquid supply ports; defining a second virtual reference line 23 that is disposed between two virtual straight lines parallel to the first virtual reference line and that passes through each of the liquid supply port having the measured shortest distance and the liquid supply port having the measured longest distance; applying the adhesive 30 onto the base material 1 based on the second virtual reference line 23; and joining the liquid ejection device to the base material 1.

Description

  The present invention relates to a method for manufacturing a liquid discharge head and a liquid discharge head.

  2. Description of the Related Art Liquid discharge recording apparatuses that discharge liquids such as ink (hereinafter also simply referred to as recording apparatuses) are widely used and commercialized for computer-related output devices and the like. In recent years, in order to output a high-quality image at a higher speed, a liquid discharge head having a longer print width (hereinafter also simply referred to as a head) has been desired.

  As a general recording apparatus, a method of performing printing by scanning a head with respect to a recording medium such as paper while ejecting ink is widely known. In addition, a head having a long print width corresponding to the width of the recording medium is fixed above a conveying belt that conveys the recording medium, and scanning is performed on the recording medium so that printing can be performed at high speed. A line type recording apparatus is also known.

  As the full-line type head, a plurality of liquid ejection devices having an appropriate length (having an appropriate number of nozzles) as described in Patent Document 1 are arranged on a substrate, and the entire print width is long. A configuration for realizing this head has been proposed.

  In the head having such a configuration, in order to join the liquid ejection device to a predetermined position in the base material, a reference point is formed on the base material, and an adhesive is applied to the reference point or the liquid ejection device is joined. The method of performing is used.

JP 2007-55071 A

  However, if the base material is lengthened in order to obtain a longer print width, the base material may be warped in the lateral direction. That is, the reference point formed on the base material is also shifted in the lateral direction, and when an adhesive is applied based on such a shifted reference point, the liquid supply port portion for supplying ink to the liquid ejection device is used. There arises a problem that the adhesive enters. As a countermeasure, a method of detecting the amount of warpage of the base material and changing the application position of the adhesive individually for each liquid supply port according to the amount of warpage can be considered. It will decrease.

  An object of the present invention is to provide a liquid ejection head capable of suppressing the shift of the adhesive application position with respect to the liquid supply port portion and reducing the entry of the adhesive into the liquid supply port portion even when the substrate is warped. And a liquid discharge head.

  In order to achieve the above-described object, a method for manufacturing a liquid discharge head according to an aspect of the present invention includes a substrate on which a liquid supply port array including a plurality of liquid supply port portions for supplying a liquid is formed in a longitudinal direction. And a plurality of liquid ejection devices, each of which is disposed at a position corresponding to the liquid supply port portion and bonded to the base material by an adhesive, and is along the longitudinal direction of the base material Defining a first virtual reference line, measuring a distance between the first virtual reference line and at least two liquid supply ports of the liquid supply port array, and at least two liquid supply ports The second virtual reference line between the two virtual straight lines that pass through the liquid supply port part with the shortest distance and the liquid supply port part with the longest distance and parallel to the first virtual reference line. Based on the defining process and the second virtual reference line Te, a step of applying an adhesive to a substrate, the adhesive applied to a substrate, and a step for joining the liquid discharge device to the substrate, the.

  According to another aspect of the present invention, there is provided a method for manufacturing a liquid discharge head, comprising: a base material in which a liquid supply port array including a plurality of liquid supply port portions for supplying a liquid is formed in a longitudinal direction; A liquid ejection head manufacturing method including a plurality of liquid ejection devices arranged at positions corresponding to mouth portions and bonded to a base material by an adhesive, the first virtual extending along the longitudinal direction of the base material Along the first virtual reference line between the reference line and the reference point having the largest distance from the first virtual reference line among the plurality of reference points formed on the substrate along the longitudinal direction The step of defining the second virtual reference line, the step of applying the adhesive to the base material based on the second virtual reference line, and the liquid ejection device on the base material by the adhesive applied to the base material Bonding.

  According to still another aspect of the present invention, there is provided a method for manufacturing a liquid ejection head, comprising: a base material in which a liquid supply port array including a plurality of liquid supply port portions for supplying liquid is formed in a longitudinal direction; A liquid discharge head manufacturing method including a plurality of liquid discharge devices arranged at positions corresponding to supply ports and bonded to a base material by an adhesive, the first method extending along the longitudinal direction of the base material The first virtual reference line is between the virtual reference line and the liquid supply port having the largest distance from the first virtual reference line among the plurality of liquid supply ports formed along the longitudinal direction. A step of defining a second virtual reference line along the line, a step of applying an adhesive to the base material based on the second virtual reference line, and an adhesive applied to the base material. Joining to the material.

  The liquid discharge head according to one aspect of the present invention includes a base material in which a liquid supply port array including a plurality of liquid supply port portions for supplying a liquid is arranged in the longitudinal direction, and each corresponds to the liquid supply port portion. A liquid discharge head having a plurality of liquid discharge devices that are arranged at positions to be bonded to a base material by an adhesive formed around the liquid supply port portion, and arranged among the plurality of liquid supply port portions The first liquid supply port portion formed on one end side in the direction of the first opening end in the first short direction perpendicular to the longitudinal direction and the adhesive formed on the outside of the first opening end The distance from the outer peripheral end is the outer peripheral side of the adhesive formed on the outer side of the second open end and the second open end in the second short direction opposite to the first short direction. Of the plurality of liquid supply port portions at the central portion in the arrangement direction. The distance between the third opening end of the second liquid supply port formed in the first short direction and the outer peripheral end of the adhesive formed outside the third opening end is as follows: It is smaller than the distance between the fourth opening end in the second short side direction and the outer peripheral end portion of the adhesive formed outside the fourth opening end.

  According to the present invention, even when the substrate is warped, the liquid ejection head that can suppress the shift of the adhesive application position with respect to the liquid supply port and reduce the entry of the adhesive into the liquid supply port. And a liquid discharge head can be provided.

It is a schematic perspective view of the base material used with the manufacturing method of 1st Embodiment. It is a disassembled perspective view of the base material shown in FIG. It is a schematic perspective view which shows the measuring apparatus which measures the position of the reference point on a base material. It is a plot which shows the positional relationship of the reference point formed in the base material of FIG. It is a figure explaining the process of prescribing | regulating the reference line for apply | coating the adhesive agent of 1st Embodiment. It is the perspective view and top view which show a mode that the adhesive agent was apply | coated to the base material of FIG. FIG. 2 is a schematic perspective view of a liquid discharge head according to the first embodiment. FIG. 5 is a schematic plan view of a liquid ejection head according to a second embodiment. It is a schematic perspective view of the base material used with the manufacturing method of 4th Embodiment. 10 is a plot showing the positional relationship of reference points formed on the substrate of FIG. It is a figure explaining the process of prescribing | regulating the reference line for apply | coating the adhesive agent of 4th Embodiment. It is a top view which shows a mode that the adhesive agent was apply | coated to the base material of FIG. It is the schematic of the liquid discharge head which concerns on 4th Embodiment. It is a figure explaining the process of prescribing | regulating the reference line for apply | coating the adhesive agent of 5th Embodiment. FIG. 10 is a schematic plan view of a liquid ejection head according to a fifth embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
The liquid discharge head manufactured by the manufacturing method according to the present embodiment is arranged at a position corresponding to the liquid supply port portion and a base material on which one row of liquid supply port rows composed of a plurality of liquid supply port portions is formed in the longitudinal direction. A liquid ejection device.

  FIG. 1 is a schematic perspective view of a base material that is a base material that is used in the manufacturing method of the present embodiment and is a support member that supports a liquid ejection device 4 to be described later. As the material of the substrate 1, an alumina material having insulating properties, thermal conductivity, and mechanical strength is used. The substrate 1 is provided with a liquid supply port 2 that is formed in a straight line in the longitudinal direction and supplies ink to a liquid ejection device (not shown in FIG. 1). In the present embodiment, the liquid supply port portion 2 is composed of two openings that are through holes, but is not limited thereto, and may be composed of an arbitrary number of openings. Further, as will be described later, reference points 3 a to 3 e for measuring the position of the liquid supply port 2 are formed on the base material 1.

  Here, with reference to FIG. 2, the manufacturing method of the base material 1 is demonstrated. In this embodiment, as shown in FIG. 2, the substrate 1 is formed by laminating and integrating a plurality of layers 1 a to 1 e. In the first layer 1a, the reference point 3 (3a to 3e) is formed by laser processing together with the opening of the liquid supply port portion 2. At this time, the laser processing apparatus (not shown) controls the first layer 1a before laser processing to be positioned and fixed, and then processes the opening of the liquid supply port 2 and the reference point 3 by a series of processes. Is done. For this reason, the relative position between the opening of the liquid supply port 2 and the reference point 3 is extremely high, and the reference point 3 is formed in a straight line. Only the opening of the liquid supply port 2 is formed in the second layer 1b, and a flow path (not shown) for supplying ink to the liquid supply port 2 is formed in the third layer 1c. Thereafter, when all the layers 1a to 1e are laminated and fired at about 1200 ° C., the layers 1a to 1e are sintered to form the integrated base material 1. In addition, formation of the opening of the liquid supply port portion 2 and the reference point 3 in each of the layers 1a to 1e can be performed by punching with a mold.

  The base material 1 that has been sintered in this way has a slight shrinkage during sintering, but at the same time warps. This warpage occurs in both the thickness direction (mainly the longitudinal direction) and the in-plane direction (mainly the short direction) of the substrate 1. The warp in the thickness direction (mainly the longitudinal direction) of the substrate 1 can be reduced by polishing later, but there is no means for reducing the warp in the in-plane direction (mainly the short direction), and sintering. The warp of time remains.

  Next, the process flow of the manufacturing method of this embodiment will be described.

  First, the process of measuring the position of the reference point 3 is performed using the measuring apparatus shown in FIG. In this step, the substrate 1 is placed on the plate 10 with the surface where the liquid supply port 2 (not shown in FIG. 3) opens upward. The plate 10 is disposed on a stage 11 that drives the base material 1 in the longitudinal direction of the base material 1 and a stage 12 that drives the base material 1 in the short direction. A camera 13 for photographing the reference point 3 is installed above the substrate 1, and the camera 13 and the stages 11 and 12 are connected to the control device 14. The position of the reference point 3 is measured by the control device 14 from the positions of the stages 11 and 12 and the captured image captured by the camera 13. FIG. 4 shows the positional relationship of the reference points thus measured, and plots 20a to 20e corresponding to the respective reference points 3a to 3e are shown. As described above, the plots 20a to 20e are arranged in a curved line reflecting the warp in the short-side direction of the base material 1 generated when the base material 1 is manufactured.

  Next, a step of defining a reference line for applying the adhesive is performed based on the measured position of the reference point. FIG. 5 is a diagram for explaining this process, and corresponds to FIG.

  As shown in FIG. 5A, a virtual straight line connecting the plots 20 a and 20 e at both ends is set as an inclination reference line (first virtual reference line) 21. Next, distances (intervals) a to e (in this embodiment, a = e = 0) from the inclination reference line 21 to the plots 20a to 20e are calculated. In the present embodiment, the plot 20c is farthest from the inclination reference line 21, and the distance is c. Then, as shown in FIG. 5B, a virtual straight line that is parallel to the inclination reference line 21, and a virtual straight line that satisfies the range 0 <A <c when the shift amount from the inclination reference line 21 is A. Is defined as a reference line (second virtual reference line) 23 for applying the adhesive. The reference line 23 for applying the adhesive may be defined so that the shift amount A from the inclination reference line 21 is half of the distance c from the farthest plot 20c (A = c / 2). Most preferred. Thereby, the maximum distance among the distances between the reference line for applying the adhesive and each plot can be minimized.

  Next, the process of applying the adhesive 30 is performed. In this step, the adhesive 30 is applied using the application needle 31 as shown in FIG. 6A, and the liquid is aligned with the second virtual reference line 23 as shown in FIG. 6B. It is applied to the substrate 1 so as to surround the periphery of the supply port 2. Thereby, the value of the maximum deviation amount among the positional deviation amounts of the respective liquid supply ports with respect to the second virtual reference line 23, that is, the position where the adhesive is applied can be reduced. In the present embodiment, as a method for applying the adhesive 30, a method using the application needle 31 is shown, but other methods such as a transfer method are also possible.

  Next, the process of joining the liquid discharge device 4 to the base material 1 to which the adhesive has been applied as described above is performed. In this step, as shown in FIG. 7, the liquid ejection device 4 that is a recording element substrate that ejects liquid is bonded to the base material 1 in accordance with the position of the adhesive, that is, the second virtual reference line 23.

  In the liquid discharge head thus obtained, in addition to being able to apply the adhesive at an effective position capable of suppressing the entry of the adhesive into the liquid supply port, the bonding area between the adhesive and the liquid discharge device Can get more. Therefore, high adhesive strength of the liquid ejection device can be obtained. Note that in this case, since the position of the liquid discharge device is different for each liquid discharge head, it is necessary to individually control the ink discharge timing when the head is mounted on the main body.

  In the liquid discharge head obtained by the above manufacturing method, the relationship between the opening end and the adhesive is the first liquid supply port portion on the outermost side (one end side in the arrangement direction) among the plurality of liquid supply port portions. It is a form that satisfies the following relationship. That is, the distance between the first opening end determined by the direction orthogonal to the longitudinal direction of the substrate and the outer peripheral end of the adhesive applied to the outside of the first opening end is the first opening end. And the distance between the second opening end opposite to the outer opening and the outer peripheral end of the adhesive applied to the outside of the second opening end. And the magnitude relationship of those intervals differs from the case of the 2nd liquid supply port part located in the center part of the longitudinal direction of a base material, and the difference of the absolute value of these intervals is 2nd liquid supply. It is equal to the mouth.

  In the present embodiment, the reference point 3 is measured instead of measuring the position of each liquid supply port 2 in the liquid supply port array, but the position of the liquid supply port 2 can also be directly measured. However, in the case where the substrate 1 is formed of a laminate and the liquid supply port portion is also formed over a plurality of layers, the liquid supply port portion is affected by an interlayer shift when image processing is performed on the liquid supply port portion. There is a risk of misdetecting the position. Therefore, it is preferable to measure the reference point 3 as in this embodiment. In that case, it is preferable that the reference point is formed only in the first layer of the base material in order to prevent erroneous detection of the reference point position due to the interlayer displacement. In the present embodiment, five reference points are provided, but at least three reference points, that is, both ends in the longitudinal direction and the central portion of the base material may be provided. It is preferable that the reference points at both ends of the substrate are provided outside the liquid supply port located on the outermost side among the plurality of liquid supply ports. Also, the shape of the reference point can be arbitrarily selected from the viewpoint that the position can be accurately measured.

(Second Embodiment)
In the present embodiment, the liquid ejection device that is bonded to the base material in accordance with the reference line (second virtual reference line) for applying the adhesive in the first embodiment is displayed with respect to the base point of the base material. This is different from the first embodiment in that they are joined together. Accordingly, the most preferable position of the second virtual reference line is also changed. The rest is the same as in the first embodiment. Hereinafter, only steps different from those of the first embodiment will be described, and descriptions of other steps will be omitted.

  With reference to FIG. 6, the process of defining the second virtual reference line of the present embodiment will be described. From the viewpoint of suppressing the entry of the adhesive into the liquid supply port, the second virtual reference line 23 is a virtual straight line parallel to the tilt reference line (first virtual reference line) 21 and the tilt reference line 21. When the shift amount from A is A, it is defined as an imaginary straight line in a range of 0 <A <c. This is the same as in the first embodiment. However, when the shift amount A increases, the liquid discharge device joined on the virtual straight line connecting the reference points at both ends of the base material, that is, the tilt reference line 21, and the adhesion applied in accordance with the second virtual reference line 23. The amount of positional deviation from the agent increases. If the liquid ejection device is displaced from the adhesive, the adhesive adhering to the back surface of the liquid ejection device is biased, and the position of the liquid ejection device may change due to curing shrinkage of the adhesive or the like. As a countermeasure against the entry of the adhesive into the liquid supply port, the same effect is obtained when the shift amount A of the second virtual reference line 23 is 0 <A <c / 2 and when c / 2 <A <c. can get. Therefore, from the viewpoint of reducing the shift amount A, the second virtual reference line 23 is preferably defined as an imaginary straight line in which the shift amount is in the range of 0 <A <c / 2.

  Thereafter, in the step of joining the liquid ejection device of the present embodiment to the base material, the liquid ejection device 4 is joined on the tilt reference line 21 connecting the reference points at both ends of the base material 1 as shown in FIG. Therefore, it is deviated from the second virtual reference line 23 and joined.

  In the liquid discharge head thus obtained, in addition to being able to reduce the entry of the adhesive into the liquid supply port, the position of the liquid discharge device is set at both ends of the substrate 1 with respect to all the substrates. It can be defined by the position from the virtual straight line connecting the reference points. As a result, according to the manufacturing method of the present embodiment, it is easy to control the ejection when mounting other head components or mounting the head body.

(Third embodiment)
In the present embodiment, the bonding method of the liquid ejection device of the first embodiment is performed by a specific method. That is, in this embodiment, after joining the 1st liquid discharge device according to the adhesive application position, the 2nd liquid discharge device is positioned using the liquid discharge device. In this way, the liquid discharge device bonded before is used for positioning the liquid discharge device bonded thereafter, and the liquid discharge devices are sequentially bonded. In the present embodiment, the first liquid ejection device is bonded in accordance with the adhesive application position, but it can also be bonded in accordance with the reference point of the substrate as in the second embodiment.

  In the liquid discharge head thus obtained, the entry of the adhesive into the liquid supply port can be reduced. In addition, since adjacent liquid ejection devices can be positioned with high accuracy, it is effective for deterioration of a printed image at a joint portion between the liquid ejection devices.

(Fourth embodiment)
The liquid discharge head manufactured by the manufacturing method according to the present embodiment is arranged at a position corresponding to the liquid supply port portion and a base material in which a plurality of liquid supply port arrays each including a plurality of liquid supply port portions are arranged in the short direction. A liquid ejection device.

  FIG. 9 is a schematic perspective view of a substrate used in the manufacturing method of the present embodiment. The substrate 1 is provided with liquid supply ports 2 that are formed in a staggered pattern and that form two rows of ink discharge ports extending in the longitudinal direction. Furthermore, reference points 3 a to 3 j are formed on the base material 1. In the present embodiment, five reference points are provided for each liquid supply port row, that is, the outside of the liquid supply port portion located at both ends of the liquid supply port row and the intermediate point of each liquid supply port portion. However, the present invention is not limited to this. It is sufficient that at least three reference points are provided for each liquid supply port array, that is, both ends and the center of the liquid supply port array.

  Next, the process flow of the manufacturing method of this embodiment will be described.

  First, similarly to the first embodiment, the step of measuring the position of the reference point is performed using the measuring apparatus shown in FIG. FIG. 10 shows the positional relationship of the measured reference points, and plots 20a to 20j corresponding to the reference points 3a to 3j, respectively.

  Next, a step of defining a reference line (second virtual reference line) for applying the adhesive is performed based on the measured position of the reference point. FIG. 11 is a diagram for explaining this process, and corresponds to FIG.

  As shown in FIG. 11A, a straight line connecting the plots 20a and 20e at both ends of the lower liquid supply port array is used as a lower reference slope line 50, and plots 20f and 20j at both ends of the upper liquid supply port array are used. A straight line connecting the two lines is defined as an upper-level inclination reference line 51. Thereafter, distances a to j (a = e = f = j = 0 in the present embodiment) from the respective inclination reference lines 50 and 51 to the respective plots are calculated. In the lower liquid supply line, the plot 20c is farthest from the lower inclination reference line 50, and the distance is c. In the upper liquid supply line, the plot 20h is separated from the upper inclination reference line 51. The farthest away, the distance is h. In this embodiment, h> c, that is, the upper and lower liquid supply port arrays have different warpage states. When the reference line 60 for applying the lower-stage adhesive is an imaginary straight line parallel to the lower-stage inclination reference line 50 and the shift amount from the lower-stage inclination reference line 50 is B, 0 < It is defined as a virtual straight line in the range of B <c. The lower second virtual reference line 60 is defined such that the shift amount B from the lower inclination reference line 50 is half the distance c from the farthest plot 20c (B = c / 2). Most preferably. Thereby, in the lower liquid supply port array, the maximum one of the distances between the second virtual reference line 60 and all the plots 20a to 20e can be made smaller. Therefore, the reference line 60 for applying the adhesive, that is, the maximum amount of positional deviation between the adhesive application position and the liquid supply port array can be set to a small value. Therefore, this embodiment is the most advantageous form with respect to reducing the entry of the adhesive into the liquid supply port portion 2. Similarly, the reference line 61 for applying the adhesive is defined so that the shift amount C from the upper reference inclination reference line 51 is in the range of 0 <C <h. When the shift amount C is half the distance h (C = h / 2), it is most effective for the adhesive entering the liquid supply port 2.

  Next, the process of applying the adhesive 30 is performed. In this step, the adhesive 30 is applied to the substrate 1 so as to surround the periphery of the liquid supply port 2 in accordance with the reference lines 60 and 61 for applying the upper and lower adhesives, as shown in FIG. Is done.

  Next, the process of joining the liquid discharge device 4 to the base material 1 to which the adhesive has been applied as described above is performed. In this step, as shown in FIGS. 13A and 13B, the liquid ejection device 4 is bonded to the adhesive applied in accordance with the upper and lower second virtual reference lines 60 and 61. The

  In the liquid discharge head obtained in this manner, the adhesive is applied at the most effective position in all the liquid supply port arrays, so that the entry of the adhesive into the liquid supply port portion can be reduced. it can. Furthermore, it is possible to obtain a large bonding area between the adhesive and the liquid ejection device, thereby obtaining a high adhesive strength of the liquid ejection device. In this embodiment, as in the first embodiment, since the position of the liquid ejection device is different for each head, it is necessary to control the ink ejection timing individually when mounting the head body.

(Fifth embodiment)
The present embodiment is a modification in which the position of the second virtual reference line is changed with respect to the fourth embodiment. Specifically, as in the fourth embodiment, a reference line (second virtual reference line) for applying an adhesive is defined for one liquid supply port array, and the defined second Based on the virtual reference line, the position of the reference line of the other liquid supply port array is determined. The rest is the same as in the fourth embodiment. Hereinafter, only steps different from those of the fourth embodiment will be described, and description of other steps will be omitted.

  First, with reference to FIG. 14, a process of defining a reference line for applying the adhesive of the present embodiment will be described. FIG. 14 is a diagram for explaining this process, and plots 20a to 20j corresponding to the respective reference points on the substrate are shown. In FIG. 14, for convenience of explanation, plots are shown for both the upper and lower liquid supply port arrays (the position of the reference point is measured). It is only necessary to measure the liquid supply port row in which the second virtual reference line is defined in the supply port row.

  In the present embodiment, the second virtual reference line 60 is defined for the plots 20a to 20e of the lower liquid supply port array by the method shown in the third embodiment. The shift amount B of the lower second virtual reference line 60 from the lower tilt reference line 50 is half of the distance c from the farthest plot 20c. Then, an imaginary straight line obtained by translating the lower second virtual reference line 60 by the pitch of the liquid supply port array is referred to as an upper second virtual reference line 62.

  After defining the second virtual reference line, similarly to the fourth embodiment, a step of applying an adhesive and a step of bonding a liquid discharge device are performed to complete the liquid discharge head shown in FIG.

  In such a liquid discharge head, it is possible to apply the adhesive at a position most effective for reducing the entry of the adhesive into the liquid supply port portion in the lower liquid supply port array. Further, with respect to the upper liquid supply port array, it is possible to reduce the entry of the adhesive into the liquid supply port portion. Further, since the pitch between the columns of the liquid ejection devices can be made uniform, ejection control when the head is mounted on the main body becomes easy.

(Sixth embodiment)
In this embodiment, after the positions of the respective second virtual reference lines are determined by the method shown in the fifth embodiment, the liquid ejection device is joined to the tilt reference line in the same manner as in the second embodiment. To do.

  In the liquid discharge head obtained in the present embodiment, the position of the adhesive and the position of the liquid discharge device are shifted as in the second embodiment. Therefore, preferred embodiments in the present embodiment are as follows. That is, among the plurality of liquid supply port arrays, the liquid supply port array having the smallest positional deviation of each reference point with respect to a virtual straight line (inclination reference line) connecting the reference points at both ends of the liquid supply port array is used. Two virtual reference lines are defined. For the other liquid supply port arrays, the second virtual reference line defined as described above is translated by the pitch of the liquid supply port arrays, and the second virtual reference lines of the other liquid supply port arrays are translated. Use as a reference line.

  In the liquid discharge head thus obtained, in all the liquid supply port arrays, the distance between the virtual straight line connecting the reference points at both ends of each liquid supply port array and the adhesive is the reference farthest from the virtual straight line. It can be less than half the distance to the point. As a result, in all the liquid supply port arrays, it is possible to reduce the entry of ink into the liquid supply port array and to reduce the influence on the movement of the liquid discharge device due to the positional deviation between the adhesive and the liquid discharge device. it can.

1 Base Material 2 Liquid Supply Port 3 Reference Point 4 Liquid Discharge Device

Claims (14)

A base material in which a liquid supply port array composed of a plurality of liquid supply port parts for supplying a liquid is formed in the longitudinal direction, and each base material is disposed at a position corresponding to the liquid supply port part, and the base material is formed by an adhesive. A liquid ejection head having a plurality of liquid ejection devices bonded to each other,
A first virtual reference line is defined along the longitudinal direction of the base material, and a distance between the first virtual reference line and at least two liquid supply port portions of the liquid supply port array is measured. Process,
Of the at least two liquid supply port portions, two virtual straight lines that pass through the liquid supply port portion with the shortest distance and the liquid supply port portion with the longest distance and are parallel to the first virtual reference line, respectively. Defining a second virtual reference line between:
Applying the adhesive to the substrate based on the second virtual reference line;
Bonding the liquid ejection device to the substrate with the adhesive applied to the substrate;
A method of manufacturing a liquid discharge head including:   The method of manufacturing a liquid ejection head according to claim 1, wherein the distance between the at least two liquid supply ports is measured based on a plurality of reference points provided on the base material.   The plurality of reference points include two reference points provided at both ends of the base material in the longitudinal direction and one reference point provided at a central portion of the base material in the longitudinal direction. 3. A method for producing a liquid ejection head according to 2.   4. The method of manufacturing a liquid ejection head according to claim 3, wherein the two reference points are respectively formed on the outer sides of the two liquid supply port portions positioned on the outermost side among the plurality of liquid supply port portions.   5. The device according to claim 1, wherein the first virtual reference line is defined so as to connect two liquid supply ports located on the outermost side among the plurality of liquid supply ports. 6. Manufacturing method of liquid discharge head.   6. The method of manufacturing a liquid ejection head according to claim 1, wherein the second virtual reference line is parallel to the first virtual reference line.   The method of manufacturing a liquid ejection head according to claim 6, wherein the second virtual reference line is at an equal distance from the two virtual straight lines.   9. The method of manufacturing a liquid ejection head according to claim 1, wherein the liquid supply port portion includes a plurality of openings. A base material in which a liquid supply port array composed of a plurality of liquid supply port parts for supplying a liquid is formed in the longitudinal direction, and each base material is disposed at a position corresponding to the liquid supply port part, and the base material is formed by an adhesive. A liquid ejection head having a plurality of liquid ejection devices bonded to each other,
The distance between the first virtual reference line extending along the longitudinal direction of the base material and the first virtual reference line among the plurality of reference points formed on the base material along the longitudinal direction is the largest. Defining a second virtual reference line along the first virtual reference line between a large reference point;
Applying the adhesive to the substrate based on the second virtual reference line;
Bonding the liquid ejection device to the substrate with the adhesive applied to the substrate;
A method of manufacturing a liquid discharge head including:   The method of manufacturing a liquid ejection head according to claim 9, wherein the first virtual reference line is defined so as to connect reference points at both ends of the plurality of reference points.   The said 2nd virtual reference line is prescribed | regulated between the reference point provided in the center part of the said longitudinal direction of the said base material among the said several reference points, and a said 1st virtual reference line. A method for manufacturing a liquid discharge head according to 9 or 10.   12. The method of manufacturing a liquid ejection head according to claim 9, wherein the reference point is formed between the liquid supply ports adjacent to each other in the longitudinal direction. A base material in which a liquid supply port array composed of a plurality of liquid supply port parts for supplying a liquid is formed in the longitudinal direction, and each base material is disposed at a position corresponding to the liquid supply port part, and the base material is formed by an adhesive. A liquid ejection head having a plurality of liquid ejection devices bonded to each other,
The distance between the first virtual reference line extending along the longitudinal direction of the base material and the first virtual reference line among the plurality of liquid supply port portions formed along the longitudinal direction is the largest. Defining a second virtual reference line along the first virtual reference line between the liquid supply port portion;
Applying the adhesive to the substrate based on the second virtual reference line;
Bonding the liquid ejection device to the substrate with the adhesive applied to the substrate;
A method of manufacturing a liquid discharge head including: A substrate in which a liquid supply port array composed of a plurality of liquid supply port portions for supplying a liquid is arranged in the longitudinal direction, and each is disposed at a position corresponding to the liquid supply port portion, and the liquid supply port portion A liquid discharge head having a plurality of liquid discharge devices bonded to the substrate by an adhesive formed around the periphery,
Of the plurality of liquid supply ports, a first liquid supply port formed on one end side in the arrangement direction and a first opening end in a first short direction perpendicular to the longitudinal direction and the first liquid supply port The distance from the outer peripheral end of the adhesive formed outside the opening end of the first opening is the second opening end in the second short direction opposite to the first short direction and the second end. Larger than the gap between the outer edge of the adhesive formed on the outer edge of the opening,
Of the plurality of liquid supply ports, a second liquid supply port formed at the center in the arrangement direction of the third opening end and the third opening end in the first short direction. The distance between the outer edge of the adhesive formed on the outer side and the outer edge of the adhesive formed on the outer side of the fourth opening end in the second short side direction is as follows. A liquid discharge head having a smaller distance from the end.

Images