JP2014004713A - Method for manufacturing liquid discharge jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a plurality of pressure chambers arranged two-dimensionally with high density and high accuracy.SOLUTION: A method for manufacturing a liquid discharge jet head includes a process for forming alignment marks 19 and 20 on first main surfaces 1aa and 1ba of a plurality of piezoelectric substrates 1 and 2, a process for forming an alignment mark 21 on a first main surface 1ca of a support substrate 3, and a process for sequentially positioning the plurality of piezoelectric substrates 1 and 2 to be joined to the support substrate 3. The alignment 21 is formed by patterns having the narrower pitch than that of a plurality of grooves 11 in a direction crossing longitudinal directions of grooves 11, 12 and 131 of the piezoelectric substrates 1 and 2. After a laminate is formed by joining the second main surface 1cb of the support substrate 3 to the first main surface 1ba of the piezoelectric substrate 2 in a state of an alignment mark 20 positioned relative to the alignment mark 21, the piezoelectric substrate 1 is joined to the side of the piezoelectric substrate 2 of the laminate in a positioned state of an alignment mark 19 by specifying the alignment mark 21 as a reference.

Description

  The present invention relates to a method for manufacturing a liquid discharge head including a piezoelectric substrate having a pressure chamber for discharging a liquid.

2. Related Art Ink jet heads including a piezoelectric substrate including a piezoelectric material such as PZT (Pb (Zr, Ti) O ₃ : lead zirconate titanate) are known.

  In an inkjet head including a piezoelectric substrate, a groove is formed in the piezoelectric substrate, and a pressure chamber for applying a discharge pressure to the ink is formed by a groove wall and a member covering the opening of the groove. Electrodes electrically connected to the circuit board of the ink jet head are provided on the inner wall surface and the outer wall surface of the groove. By applying a voltage from the circuit board to the electrode, the wall of the groove is deformed to change the volume of the pressure chamber, the ejection pressure is applied to the ink in the pressure chamber, and ink droplets are ejected from the ejection port connected to the pressure chamber. Discharged.

  In order to perform high-density discharge, it is necessary to arrange a plurality of discharge ports at a higher density. Accordingly, it is necessary to arrange the pressure chambers corresponding to the respective discharge ports with high density. Patent Document 1 discloses a method for manufacturing an ink jet head in which pressure chambers can be arranged with high density. In the manufacturing method disclosed in Patent Document 1, first, a plurality of grooves extending in the same direction are formed in each of a plurality of piezoelectric substrates. The grooves are formed as pressure chambers by laminating and arranging the plurality of piezoelectric substrates between a pair of upper and lower support substrates. Also, in this laminating step, by stacking the piezoelectric substrates while shifting the position in a direction perpendicular to the longitudinal direction of the grooves, it is possible to form a two-dimensionally arranged pressure chamber capable of discharging at a higher density. Is possible. In addition, the pressure chambers can be densified by further reducing the thickness of the laminated piezoelectric substrate.

  Further, as a method of laminating and bonding a plurality of piezoelectric substrates, a method of positioning one of the laminated components as a through hole is disclosed (Patent Document 2). As a method of stacking and bonding, in order to position and stack using the pattern of the same substrate, two types of alignment marks are provided adjacent to one substrate, and alignment marks are used during stacking. A positioning method is disclosed (Patent Document 3).

JP 2007-168319 A Japanese Patent No. 4699345 JP-A-10-239700

  As described above, as a method of manufacturing a high-density multilayer inkjet head, the piezoelectric substrate is thinned, and the piezoelectric substrate is positioned and bonded in a direction perpendicular to the longitudinal direction of the groove in each lamination process. A method is conceivable.

  In this case, in the manufacturing method described in Patent Document 1, it is necessary to provide a through hole as an alignment mark in the piezoelectric substrate, and when a fragile piezoelectric substrate is used, cracks are likely to occur, and the position as the alignment mark There is a problem that sufficient accuracy cannot be secured.

  In addition, the manufacturing method described in Patent Document 2 is based on the premise that alignment marks at the time of positioning can be detected simultaneously, and cannot be applied to an opaque piezoelectric substrate. In addition, since there are irregularities on the surface of the piezoelectric substrate, it is difficult to form a fine and highly accurate alignment mark. Therefore, when a plurality of grooves are formed in the piezoelectric substrate at high density, and the pressure chamber is formed by repeating the lamination process of the plurality of piezoelectric substrates while positioning the piezoelectric substrate with respect to the direction orthogonal to the longitudinal direction of the grooves, It was difficult to ensure the positional accuracy of the pressure chamber in the entire inkjet head.

  Accordingly, the present invention provides a method for manufacturing a liquid discharge head capable of forming a plurality of pressure chambers arranged two-dimensionally with high density and high accuracy even when an opaque and fragile piezoelectric substrate is used. The purpose is to do.

  In order to achieve the above object, a method of manufacturing a liquid discharge head according to the present invention includes a pressure chamber that communicates with a discharge port that discharges liquid and stores liquid discharged from the discharge port. In a cross section that includes a piezoelectric substrate that discharges liquid from the discharge port by extending and contracting the wall, and the pressure chamber is configured by a groove provided in the piezoelectric substrate, and intersects the liquid supply direction in the pressure chamber. A method of manufacturing a liquid discharge head in which electrodes are provided on inner surfaces of opposing walls of a pressure chamber in each of a first direction and a second direction intersecting the first direction, the method comprising: Forming a first alignment mark on the first main surface; forming a plurality of grooves on the first main surface; and forming an electrode on the first main surface including the inner surface of the groove wall. And a first support substrate for supporting the piezoelectric substrate Forming a second alignment mark on a main surface, a plurality of piezoelectric substrate to the supporting substrate successively, and a step of joining is positioned. At least one of the first alignment mark and the second alignment mark is formed in a pattern having an interval narrower than the pitch of the plurality of grooves in the direction intersecting the longitudinal direction of the grooves of the piezoelectric substrate. The step of positioning and bonding is performed by bonding the second main surface of the support substrate and the first main surface of the piezoelectric substrate with the first alignment mark of the piezoelectric substrate positioned relative to the second alignment mark. The first alignment mark of the other piezoelectric substrate is positioned on the piezoelectric substrate side of the laminate with the second alignment mark as a reference on the piezoelectric substrate side of the laminate. And a second step of bonding.

  According to the present invention, by positioning the support substrate and the plurality of piezoelectric substrates based on the first and second alignment marks, the position of each piezoelectric substrate can be easily shifted with respect to the support substrate, and positioned and bonded. It becomes possible to do. As a result, the present invention can form the pressure chambers of each piezoelectric substrate stacked on the support substrate with high density and high accuracy.

It is sectional drawing which shows the support substrate which concerns on 1st Embodiment, and the 1st and 2nd piezoelectric substrate. It is a top view which shows the alignment mark which concerns on 1st Embodiment. It is a top view which shows the alignment mark which concerns on 1st Embodiment. It is the schematic which shows the positioning joining apparatus which concerns on 1st Embodiment. It is a figure for demonstrating the flow of the process of positioning and joining which concerns on a 1st Example. It is a figure for demonstrating the flow of the process of positioning and joining which concerns on a 1st Example. It is sectional drawing of the laminated body which shows the pressure chamber formed of the support substrate and piezoelectric substrate which concern on a 1st Example. It is sectional drawing which shows the pressure chamber of the laminated body formed with the support substrate and piezoelectric substrate which concern on a 1st Example. It is sectional drawing of the laminated body which shows the pressure chamber of the lamination | stacking pair formed with the support substrate and piezoelectric substrate which concern on a 1st Example. It is a figure for demonstrating the flow of the process of positioning and joining which concerns on a 2nd Example.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A, 1B, and 1C are cross-sectional views of a first piezoelectric substrate, a second piezoelectric substrate, and a support substrate according to the embodiment, respectively.

(First piezoelectric substrate 1)
Examples of the first piezoelectric substrate 1 include a PZT substrate which is an opaque substrate having an outer dimension of 50 mm × 50 mm × 0.2 mm. As shown in FIG. 1A, the first piezoelectric substrate 1 is connected to an ejection port that ejects ink as a liquid and stores ink ejected from the ejection port on the first main surface 1aa side. A plurality of grooves 11 serving as pressure chambers are formed. The first piezoelectric substrate 1 has a plurality of grooves 12 serving as air chambers on the first main surface 1aa side so as to sandwich the grooves 11 therebetween. The plurality of grooves 11 and the plurality of grooves 12 are formed with their longitudinal directions aligned in the same direction. After the first and second piezoelectric substrates 1 and 2 and the support substrate 3 are laminated (hereinafter simply referred to as “laminated”), the groove 11 forms a pressure chamber, and the groove 12 forms an air chamber. . The first piezoelectric substrate 1 causes ink to be ejected from the ejection port by extending and contracting the walls constituting the pressure chamber.

  As a method for forming the grooves 11 and 12, grinding (dicing) using a superabrasive wheel is suitable. As an example, the groove 11 has a width of 0.12 mm, a depth of 0.12 mm, and the pitch of each groove 11 is 0.378 mm. The grooves 12 had a width of 0.22 mm, a depth of 0.12 mm, and a pitch of each groove 12 of 0.378 mm.

  An alignment mark 19 as a first alignment mark for positioning at the time of stacking is formed outside the groove 12 of the first piezoelectric substrate 1. A plan view of the shape of the alignment mark 19 is shown in FIG. As shown in FIG. 2A, the alignment mark 19 is configured as a cross-shaped pattern formed by combining a plurality of L-shaped patterns.

  By using the alignment mark 19, as shown by dotted lines 201 and 202 in FIG. 2B, it is possible to detect the center of the pattern constituting the alignment mark 19 in each of the X and Y axis directions. become.

  The alignment mark 19 is formed using a lift-off method of photolithography. After laminating a film resist on the first piezoelectric substrate 1, exposing and developing, a metal film is formed in vacuum. As a metal film, a Cr film by sputtering was formed with a thickness of about 20 nm, and a Pd film was formed with a thickness of about 150 nm, and the film resist was peeled off and lifted off to form alignment marks 19.

  As shown in FIG. 1A, electrodes 14, 15, and 16 are provided on the inner surfaces of the grooves 11 and 12 for polarization processing and driving of walls that become pressure chambers after lamination. In the cross section intersecting with the ink supply direction in the pressure chamber, the electrodes 14, 15, 16 are formed on the inner surfaces of the opposing walls of the pressure chamber in each of the first direction and the second direction intersecting the first direction. Is provided.

  These electrodes 14, 15 and 16 can be formed simultaneously with the alignment mark 19. After the metal film pattern is formed by using the lift-off method, the Pd film can be used as a seed layer to form Ni plating with a thickness of about 1000 nm, and the surface Ni can be formed by substitution plating with Au.

  Subsequently, polarization treatment was performed using the electrodes 14, 15, and 16. The electrode 14 was used as the positive electrode and the electrodes 15 and 16 were used as the negative electrode, and polarization treatment was performed with the electric field strength set at 1.5 kV / mm in a state maintained at 100 ° C. in the insulating liquid. As a result, the three walls constituting the pressure chamber are polarized in the direction indicated by the arrow 22.

(Second piezoelectric substrate 2)
Next, the second piezoelectric substrate 2 will be described. A sectional view of the second piezoelectric substrate 2 is shown in FIG. Similar to the first piezoelectric substrate 1, the second piezoelectric substrate 2 was a PZT substrate that is an opaque substrate having an outer dimension of 50 mm × 50 mm × 0.2 mm. On the first main surface 1ba side of the second piezoelectric substrate 2, a groove 13 constituting an air chamber after lamination is formed extending in parallel with the longitudinal direction of the grooves 11 and 12 of the first piezoelectric substrate 1. Yes. The grooves 13 had a width of 0.22 mm, a depth of 0.12 mm, and a pitch of each groove 13 of 0.378 mm. The floor wall (thickness 80 μm) of the groove 13 becomes one wall constituting the pressure chamber after lamination. An alignment mark 20 as a first alignment mark for positioning at the time of stacking is formed outside the groove 13 of the second piezoelectric substrate 2. The alignment mark 20 was formed in the same shape as the alignment mark 19 of the first piezoelectric substrate 1 shown in FIG. Similarly to the first piezoelectric substrate 1, electrodes 17 and 18 were formed on the second piezoelectric substrate 2. The second piezoelectric substrate 2 was also polarized in the direction indicated by the arrow 23 in FIG. 1B by performing polarization processing using the electrodes 17 and 18 in the same manner as the first piezoelectric substrate 1.

(Support substrate 3)
Next, the support substrate 3 will be described. A cross-sectional view of the support substrate 3 is shown in FIG. The support substrate 3 is a substrate laminated on the uppermost part of the laminate, and has a function of correcting the warp of the entire laminate constituted by being laminated. The size of the support substrate 3 may be equal to or larger than that of the first and second piezoelectric substrates 1 and 2. The material of the support substrate 3 is not necessarily the same as that of the first and second piezoelectric substrates 1 and 2, but a PZT substrate having an outer dimension of 50 mm × 50 mm × 5 mm is taken into consideration in consideration of thermal expansion during heating. Using.

  As shown in FIG. 1C, an alignment mark 21 as a second alignment mark is formed on the first main surface 1ca side of the support substrate 3, and the alignment mark 19 of the first piezoelectric substrate 1 and the second piezoelectric element. It was formed by the same formation method as the alignment mark 20 of the substrate 2. As shown in FIGS. 3A and 3B, the alignment mark 21 has a Y axis perpendicular to (crossing) the longitudinal direction of the grooves 11, 12, 13 of the first and second piezoelectric substrates 1, 2. It has a linear pattern extending in the direction. The alignment mark 21 has a pair of comb-like patterns extending in the X-axis direction parallel to the longitudinal direction of the grooves 11, 12, and 13. The alignment mark 21 is configured by combining a linear pattern and a comb-like pattern.

  A pair of comb-like patterns extending on both sides in the X-axis direction with respect to the center line 301 of the linear pattern extending in the Y-axis direction is a position where the pitches of the comb-like patterns are shifted from each other by a half pitch. Is formed. For example, when the pitch of each comb tooth in the Y-axis direction is 84.7 μm, there is a pattern shifted by 42.3 μm, which is a half pitch, so that the positions in the Y-axis direction are continuously spaced at intervals of 42.3 μm. Can be detected.

  Further, the comb-like patterns are narrower than the pitch of the grooves 11, 12, and 13 and are formed at equal intervals. By using a comb-like pattern, the position of the first piezoelectric substrate 1 is shifted in a direction perpendicular to the longitudinal direction of the grooves 11, 12, 13 by an interval narrower than the pitch of the grooves 11, 12, 13. It becomes possible to position. Thereby, the arrangement of the pressure chambers in the stacking direction of the first piezoelectric substrate 1 is narrower than the pitch of the grooves 11, 12, 13 of the piezoelectric substrates 1, 2 with respect to the longitudinal direction of the grooves 11, 12, 13. Thus, a plurality of pressure chambers whose positions are shifted are formed.

  There are irregularities on the surfaces of the piezoelectric substrates 1 and 2, and when the resist line width is narrowed, the pattern edge portion of the pattern is disturbed and the resist is peeled off, making it difficult to thin the line width. It is. However, by using the alignment mark 21 composed of the comb-like pattern described above, it is possible to detect the positions at intervals of 50 μm or less without causing the above-described problems.

  In this embodiment, the alignment mark 21 as shown in FIG. 3A is formed on the support substrate 3 which is the uppermost part of the laminate. However, the alignment marks 19 and 20 of the first and second piezoelectric substrates 1 and 2 may be configured by such a comb-like pattern, and at least one of the alignment marks is a comb-teeth shape. As long as the pattern is adopted.

(Positioning and joining process)
A method of positioning and bonding the support substrate 3 and the plurality of first and second piezoelectric substrates 1 and 2 formed by the above method will be described.

  FIG. 4 shows a schematic diagram of a positioning and joining apparatus used in the present embodiment. FIG. 5 is a schematic diagram for explaining the flow of the process of positioning and joining. As shown in FIG. 4, the positioning and joining apparatus has a camera unit 401 as a detection mechanism unit for enlarging and detecting the alignment marks 19, 20, and 21. The camera unit 401 includes a mechanism capable of adjusting the position in the X, Y, and Z axis directions. Further, the upper substrate suction stage 402 as the first stage has a notch 404 formed at a position corresponding to the alignment marks 19, 20, 21 in order to detect the alignment marks 19, 20, 21 from above. Yes. The upper substrate suction stage 402 is movable in parallel to the horizontal direction with respect to the Y-axis direction, and includes a mechanism capable of adjusting an angle θ inclined with respect to the XY plane. The lower substrate suction stage 403 as the second stage includes a mechanism capable of adjusting the position in the X, Y, and Z axis directions and the angle θ with respect to the XY plane.

  FIG. 5 shows a schematic diagram of each step in the process of positioning and joining.

  [1] As shown in FIG. 5A, first, the first main surface 1 ca side of the support substrate 3 on which the alignment mark 21 is formed is suction fixed to the upper substrate suction stage 402. At that time, the support substrate 3 is fixed to the upper substrate suction stage 402 so that the alignment marks 21 respectively arranged on the left and right in FIG. 5 are positioned inside the notch 404.

  [2] In this state, the X, Y, and Z axes of the camera unit 401 are set so that the intersection of the dotted line 302 and the center line 301 shown in FIG. The camera unit 401 is fixed by adjusting the position with respect to the direction.

  [3] Subsequently, as shown in FIG. 5B, the upper substrate suction stage 402 is moved in the horizontal direction (Y-axis direction) and separated from the camera unit 401.

  [4] For example, an epoxy adhesive (not shown) serving as an adhesive layer enters the groove 13 on the first main surface 1ba on which the groove 13 and the alignment mark 20 of the second piezoelectric substrate 2 are formed. Apply using flexographic printing method. At this time, it is desirable that the adhesive is not applied on the alignment mark 20. Next, as shown in FIG. 5C, the second main surface 1 bb side of the second piezoelectric substrate 2 is sucked and fixed to the lower substrate suction stage 403. Subsequently, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the first main surface 1ba of the second piezoelectric substrate 2 is moved with respect to the Z-axis direction so as to move to the focal position of the camera unit 401. adjust.

  [5] In this state, the angle θ with respect to the X and Y axes of the lower substrate suction stage 403 is adjusted, and the center position of the alignment mark 20 shown in FIG. 2B, that is, the intersection of the dotted line 201 and the dotted line 202 is the camera. It matches with the center position of the captured image of the unit 401.

  [6] As shown in FIG. 6A, the lower substrate suction stage 403 is lowered with respect to the Z-axis direction.

  [7] As shown in FIG. 6B, the upper substrate suction stage 402 is moved in the horizontal direction, and the position of the alignment mark 21 is returned to the adjusted position as shown in FIG. At this time, it is confirmed that the intersection of the dotted line 302 and the center line 301 of the alignment mark 21 matches the center position of the captured image of the camera unit 401. When the position of the alignment mark 21 is shifted, the angle θ with respect to the X and Y axes of the upper substrate suction stage 402 is adjusted so that the intersection of the dotted line 302 and the center line 301 coincides with the center position of the captured image.

  [8] As shown in FIG. 6C, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, the second piezoelectric substrate 2 is brought close to the support substrate 3, and the second substrate The main surface 1cb and the first main surface 1ba of the second piezoelectric substrate 2 are joined. Thereby, a laminated body in which the support substrate 3 and the second piezoelectric substrate 2 are laminated is formed. Subsequently, the first main surface 1 ca side of the support substrate 3 of this laminate is sucked and fixed to the upper substrate suction stage 402, and the second main surface 1 ab side of the first piezoelectric substrate 1 is attached to the lower substrate suction stage 403. Adsorption and fixation were performed in the same manner as the steps shown in [1] to [8]. As a result, as shown in FIG. 7, a laminated body was formed in which the support substrate 3, the second piezoelectric substrate 2, and the first piezoelectric substrate 1 were laminated in this order. The groove 11 of the first piezoelectric substrate 1 in this laminated body functions as a pressure chamber 801 surrounded by four polarized walls.

  [9] Next, the first main surface 1ca side of the support substrate 3 of this laminate is sucked and fixed to the upper substrate suction stage 402, and the camera is used in the same manner as the steps shown in [1] and [2]. The position of the unit 401 is adjusted. At this time, the intersection of the dotted line 303 and the center line 301 shown in FIG. 3B in the alignment mark 21 of the support substrate 3 which is the uppermost layer of the laminated body coincides with the center position of the photographed image of the camera unit 401. Adjustments were made.

  [10] Subsequently, the second main surface 1bb side of another prepared second piezoelectric substrate 2 is suction fixed to the lower substrate suction stage 403, and the same steps as described in [3] to [8] are performed. Then, a laminated body was formed in the order of the support substrate 3, the second piezoelectric substrate 2, the first piezoelectric substrate 1, and the second piezoelectric substrate 2.

  [11] Next, the first main surface 1ca side of the support substrate 3 of this laminate is sucked and fixed to the upper substrate suction stage 402, and the camera unit 401 is similar to the steps shown in [1] and [2]. Adjust the position of. At this time, adjustment is performed so that the intersection of the dotted line 303 and the center line 301 shown in FIG. 3B in the alignment mark 21 of the support substrate 3 which is the uppermost layer of the laminate coincides with the center position of the photographed image. It was.

  [12] Finally, the second main surface 1ab side of a plurality of different first piezoelectric substrates 1 prepared by suction is fixed to the lower substrate suction stage 403, and the same steps as described in [3] to [8] are performed. Went to. As a result, as shown in FIG. 8, the first piezoelectric substrate 1 in the order of the support substrate 3, the second piezoelectric substrate 2, the first piezoelectric substrate 1, the second piezoelectric substrate 2, and the first piezoelectric substrate 1. And the second piezoelectric substrate 2 were alternately stacked.

  The pressure chamber 802 newly formed by laminating the first and second piezoelectric substrates 1 and 2 on the laminate is a direction perpendicular to the longitudinal direction of the groove 11 with respect to the pressure chamber 801 of the upper layer. In this case, it is formed at a position shifted by 42.3 μm.

  Further, the steps shown in [9] to [12] are sequentially shifted from the steps shown in [9] and [11] and the positioning positions, that is, the alignment mark 21 is used to show the steps shown in FIG. It repeated 7 times, positioning at the intersection of the center line 301 and the dotted lines 304-310, respectively. Further, one second piezoelectric substrate 2 is stacked below, and another support substrate 3 is bonded as the lowermost layer to form an ink jet head as a liquid discharge head composed of the stacked body as shown in FIG. did. The pressure chambers 801 to 809 formed in the stacked layers are formed at positions shifted by 42.3 μm with respect to the direction orthogonal to the longitudinal direction of the groove 11. When the center positions of the pressure chambers 801 to 809 were measured using a length measuring device, they were accurately formed in a range of ± 3 μm. The inkjet head manufactured in this way can be ejected at a high density of 600 dpi (dots per inch).

(Second embodiment)
First and second piezoelectric substrates 1 and 2 and a support substrate 3 similar to those in the first embodiment were prepared. Also, the positioning and joining apparatus similar to that of the first example was used for the step of positioning and joining. Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and only a brief description is given.

(Positioning and joining process)
A method for positioning and bonding the support substrate 3 and the plurality of first and second piezoelectric substrates 1 and 2 will be described. FIG. 10 shows the flow of the process of positioning and joining performed in this embodiment.

  [1] An adhesive was applied to the surface 1ba of the second piezoelectric substrate 2 in the same manner as in the first example. Next, as shown in FIG. 10A, the second main surface 1bb side of the second piezoelectric substrate 2 is suction fixed to the lower substrate suction stage 403. Then, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, and is positioned with respect to the Z-axis direction so that the second main surface 1bb of the second piezoelectric substrate 2 is located at the focal position of the camera unit 401. . In this state, the angle θ with respect to the X and Y axes of the lower substrate suction stage 403 or the position of the camera unit 401 with respect to the X, Y and Z axes is adjusted. This adjustment position is positioned so that the center position of the alignment mark 20 shown in FIG. 2B, that is, the intersection of the dotted line 201 and the dotted line 202 coincides with the center position of the captured image of the camera unit 401. In this state, after fixing the camera unit 401, the lower substrate suction stage 403 is lowered with respect to the Z-axis direction.

  [2] Next, the first main surface 1 ca side of the support substrate 3 is suction fixed to the upper substrate suction stage 402. At that time, the pair of left and right alignment marks 21 are fixed so as to be positioned inside the notch 404. Subsequently, as shown in FIG. 10B, the upper substrate suction stage 402 is moved horizontally with respect to the Y-axis direction, and the alignment mark 21 is detected by the camera unit 401. In this state, the angle θ with respect to the X and Y axes of the upper substrate suction stage 402 is adjusted so that the intersection of the dotted line 302 and the center line 301 shown in FIG. .

  [3] Thereafter, as shown in FIG. 10C, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, the second piezoelectric substrate 2 is brought close to the support substrate 3, and the second of the support substrate 3 is The main surface 1cb of the second piezoelectric substrate 2 and the first main surface 1ba of the second piezoelectric substrate 2 were joined. Thereby, a laminated body in which the support substrate 3 and the second piezoelectric substrate 2 are laminated is formed.

  [4] Next, an adhesive was applied to the first main surface 1aa of the first piezoelectric substrate 1. Subsequently, the second main surface 1ab of the first piezoelectric substrate 1 is sucked to the lower substrate suction stage 403, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the first main surface 1aa is Adjustment was made with respect to the Z-axis direction so as to be positioned at the focal position of the unit 401. In this state, the angle θ with respect to the X and Y axes of the lower substrate suction stage 403 or the position of the camera unit 401 with respect to the X, Y, and Z axis directions is adjusted. This adjustment position is adjusted so that the center position of the alignment mark 20 shown in FIG. 2B, that is, the intersection of the dotted line 201 and the dotted line 202 coincides with the center position of the captured image of the camera unit 401. In this state, after fixing the camera unit 401, the lower substrate suction stage 403 is lowered with respect to the Z-axis direction.

  [5] Next, the first main surface 1 ca of the support substrate 3 of the laminate of the support substrate 3 and the second piezoelectric substrate 2 formed in the step shown in the above [3] is adsorbed to the upper substrate adsorption stage 402. Fix it. At that time, the pair of left and right alignment marks 21 are fixed so as to be positioned inside the notch 404. Subsequently, the upper substrate suction stage 402 is moved horizontally with respect to the Y-axis direction, and the alignment mark 21 is detected by the camera unit 401. In this state, the angle θ with respect to the X and Y axes of the upper substrate suction stage 402 so that the intersection of the dotted line 302 and the center line 301 shown in FIG. 3B matches the center position of the captured image of the camera unit 401. Adjusted.

  [6] In this state, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the second main surface 1bb of the second piezoelectric substrate 2 of the multilayer body and the first main surface of the first piezoelectric substrate 1 are set. The main surface 1aa is joined. As a result, the support substrate 3, the second piezoelectric substrate 2, and the first piezoelectric substrate 1 were laminated in this order to form a laminate.

  [7] Next, after an adhesive was applied to the first main surface 1ba of another second piezoelectric substrate 2, the second main surface 1bb was sucked and fixed to the lower substrate suction stage 403. Then, the lower substrate suction stage 403 was lifted with respect to the Z-axis direction, and adjusted with respect to the Z-axis direction so that the first main surface 1ba was positioned at the focal position of the camera unit 401. In this state, the angle θ with respect to the X and Y axes of the lower substrate suction stage 403 or the position of the camera unit 401 with respect to the X, Y, and Z axis directions is adjusted. The adjustment position is adjusted so that the center position of the alignment mark 20 shown in FIG. 2B, that is, the intersection of the dotted line 201 and the dotted line 202 coincides with the center position of the captured image of the camera unit 401. In this state, after fixing the camera unit 401, the lower substrate suction stage 403 is lowered with respect to the Z-axis direction.

  [8] Next, the first main surface of the support substrate 3 included in the laminate (support substrate 3, second piezoelectric substrate 2, and first piezoelectric substrate 1) formed in the step shown in [6] above. 1 ca is suction fixed to the upper substrate suction stage 402. At that time, the pair of left and right alignment marks 21 are fixed so as to be positioned inside the notch 404.

  [9] The upper substrate suction stage 402 is moved horizontally with respect to the Y-axis direction, and the alignment mark 21 is detected by the camera unit 401 from the side opposite to the side on which the support substrate 3 is fixed with respect to the upper substrate suction stage 402. To do. In this state, the angle θ with respect to the X and Y axes of the upper substrate suction stage 402 so that the intersection of the dotted line 303 and the center line 301 shown in FIG. 3B matches the center position of the captured image of the camera unit 401. Adjusted.

  [10] The lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the laminate and the second piezoelectric substrate 2 are joined.

  [11] Next, an adhesive was applied to the first main surface 1aa of another first piezoelectric substrate 1. Then, the second main surface 1ab is sucked and fixed to the lower substrate suction stage 403, the lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the first main surface 1aa of the first piezoelectric substrate 1 is moved to the camera. The position with respect to the Z-axis direction is adjusted so as to coincide with the focal position of the unit 401. In this state, the angle θ with respect to the X and Y axes of the lower substrate suction stage 403 or the position of the camera unit 401 with respect to the X, Y, and Z axis directions is adjusted. This adjustment position is adjusted so that the center position of the alignment mark 20 shown in FIG. 2B, that is, the intersection of the dotted line 201 and the dotted line 202 coincides with the center position of the captured image of the camera unit 401. In this state, after fixing the camera unit 401, the lower substrate suction stage 403 is lowered with respect to the Z-axis direction.

  [12] The first of the support substrate 3 in the laminated body (support substrate 3, second piezoelectric substrate 2, first piezoelectric substrate 1, second piezoelectric substrate 2) formed in the step shown in [9] above. The main surface 1 ca is fixed to the upper substrate suction stage 402 by suction. At that time, the pair of left and right alignment marks 21 are fixed so as to be positioned inside the notch 404. Next, the upper substrate suction stage 402 is moved horizontally with respect to the Y-axis direction, and the alignment mark 21 is detected by the camera unit 401. In this state, the angle θ with respect to the X and Y axes of the upper substrate suction stage 402 is adjusted so that the intersection of the dotted line 303 and the center line 301 shown in FIG. 3B matches the center position of the captured image of the camera unit 401. did.

  [13] The lower substrate suction stage 403 is raised with respect to the Z-axis direction, and the laminate and the first piezoelectric substrate 1 are joined. Thereby, the laminated body of the support substrate 3, the 2nd piezoelectric substrate 2, the 1st piezoelectric substrate 1, the 2nd piezoelectric substrate 2, and the 1st piezoelectric substrate 1 was formed.

  Further, the steps shown in [7] to [13] were performed while sequentially shifting the positioning positions from the steps shown in [9] and [11]. That is, the alignment mark 21 was used, and the process was repeated seven times while adjusting the position at each intersection of the center line 301 and the dotted lines 304 to 310 shown in FIG. Further, one second piezoelectric substrate 2 is laminated below the laminated body, and another supporting substrate 3 is bonded as the lowermost layer to form an inkjet head laminated body in which nine pressure chambers are laminated. . The pressure chambers formed in the stacked layers are formed at positions shifted by 42.3 μm with respect to the direction orthogonal to the longitudinal direction of the groove 11. When the center position of each pressure chamber in each layer was measured using a length measuring device, it was accurately formed within a range of ± 3 μm. The ink jet head manufactured in this way can be ejected at a high density of 600 dpi.

  As described above, according to the embodiment, the support substrate 3 and the plurality of first and second piezoelectric substrates 1 and 2 are positioned with respect to the support substrate 3 by using the alignment marks 19, 20, and 21 as a reference. Thus, the position of each piezoelectric substrate 1 can be easily shifted, positioned and joined. As a result, the pressure chambers 801 to 809 of each piezoelectric substrate 1 stacked on the support substrate 3 can be formed with high density and high accuracy.

DESCRIPTION OF SYMBOLS 1 1st piezoelectric substrate 2 2nd piezoelectric substrate 3 Support substrate 1aa 1st main surface of 1st piezoelectric substrate 1ab 2nd main surface of 1st piezoelectric substrate 1ba 1st main surface of 2nd piezoelectric substrate Surface 1bb Second main surface of second piezoelectric substrate 1ca First main surface of support substrate 1cb Second main surface of support substrate 11 groove 12 groove 13 groove 14 electrode 15 electrode 16 electrode 17 electrode 18 electrode 19 alignment mark 20 Alignment Mark 21 Alignment Mark 801-809 Pressure Chamber

Claims (5)

There is a pressure chamber that communicates with the discharge port that discharges the liquid and stores the liquid discharged from the discharge port, and the wall constituting the pressure chamber expands and contracts to discharge the liquid from the discharge port. The pressure chamber is configured by a groove provided in the piezoelectric substrate, and the first direction intersects the first direction in a cross section intersecting the liquid supply direction in the pressure chamber. In each of the second directions, a method of manufacturing a liquid discharge head in which an electrode is provided on the inner surface of the opposing wall of the pressure chamber,
Including a step of forming a first alignment mark on a first main surface of the plurality of piezoelectric substrates, a step of forming a plurality of grooves on the first main surface, and an inner surface of the wall of the groove Forming the electrodes on a first main surface; forming a second alignment mark on a first main surface of a support substrate supporting the piezoelectric substrate; and a plurality of the piezoelectric substrates on the support substrate. Sequentially positioning and joining,
At least one of the first alignment mark and the second alignment mark is formed in a pattern having an interval narrower than the pitch of the plurality of grooves with respect to a direction intersecting the longitudinal direction of the grooves of the piezoelectric substrate. ,
The step of positioning and bonding includes the step of positioning the first alignment mark of the piezoelectric substrate with respect to the second alignment mark, and the second main surface of the support substrate and the piezoelectric substrate. A first step of joining the first main surfaces to form a laminate;
A second step of bonding the other piezoelectric substrate to the piezoelectric substrate side of the multilayer body in a state where the first alignment mark of the other piezoelectric substrate is positioned with reference to the second alignment mark. A method for manufacturing a liquid discharge head, comprising:   In the second step, with the pattern of the second alignment mark as a reference, the piezoelectric substrate is positioned by shifting the position in a direction intersecting the longitudinal direction of the groove at an interval narrower than the pitch of the groove. The arrangement of the pressure chambers with respect to the stacking direction forms a plurality of the pressure chambers whose positions are shifted with respect to the longitudinal direction of the grooves at an interval narrower than the pitch of the grooves of the piezoelectric substrate. A manufacturing method of a liquid discharge head given in 2.   At least one of the first alignment mark and the second alignment mark is intersected with the center line with respect to a center line extending in a direction intersecting the longitudinal direction of the groove of the piezoelectric substrate. A pair of comb-like patterns extending on both sides, the comb-like patterns on both sides being narrower than the pitch of the grooves of the piezoelectric substrate and intersecting the longitudinal direction of the grooves at equal intervals The method of manufacturing a liquid discharge head according to claim 1, wherein the liquid discharge head is formed in a shape shifted to an angle. A first stage to which the first main surface of the support substrate is fixed, a detection mechanism unit that is provided so as to be adjustable in position and detects the first and second alignment marks, and the first stage The piezoelectric substrate is fixed to a surface facing the second stage, and a second stage provided so that the position can be adjusted,
In the positioning and joining step, the support substrate is fixed to the first stage by the detection mechanism unit with the second alignment mark of the support substrate fixed to the first stage. After detecting from the opposite side to positioning the detection mechanism portion, the step of separating the first stage from the detection mechanism portion with the detection mechanism portion fixed, and the piezoelectric substrate being fixed After the second stage is brought close to the detection mechanism unit, the first alignment mark on the piezoelectric substrate is detected by the detection mechanism unit, and the second stage is positioned. Separating the second stage from the detection mechanism, and the first stage at a position where the detection mechanism detects the second alignment mark. Returning, detecting the second alignment mark by the detection mechanism and positioning the first stage; bringing the second stage close to the first stage; and the supporting substrate and the piezoelectric A method of manufacturing a liquid discharge head, comprising the steps of bonding substrates:
The step of positioning and bonding fixes the first main surface of the support substrate of the laminated body in which the support substrate and the piezoelectric substrate are bonded to the first stage, and the second of the support substrate. Detecting the alignment mark by the detection mechanism, positioning the detection mechanism, and separating the first stage from the detection mechanism with the detection mechanism fixed.
The second stage to which the other piezoelectric substrate is fixed is brought close to the detection mechanism unit, the first alignment mark of the other piezoelectric substrate is detected by the detection mechanism unit, and the second stage is After adjusting, separating the second stage from the detection mechanism;
The first stage is returned to the position where the second alignment mark is detected by the detection mechanism, the second alignment mark on the support substrate is detected by the detection mechanism, and the first stage is detected. Positioning the step;
4. The liquid ejection head according to claim 1, further comprising: bringing the second stage close to the positioned first stage and bonding the piezoelectric substrate to the stacked body. 5. Production method. The first main surface of the support substrate is fixed, the first stage is provided so that the position can be adjusted, and the detection mechanism is provided so that the position can be adjusted, and detects the first and second alignment marks. And a second stage provided with the piezoelectric substrate fixed to the side facing the first stage and having a position adjustable.
In the positioning and joining step, the second stage to which the piezoelectric substrate is fixed is brought close to the detection mechanism unit, and the first alignment mark of the piezoelectric substrate is detected by the detection mechanism unit, Positioning the detection mechanism unit or the second stage, and separating the second stage from the detection mechanism unit in a state where the detection mechanism unit is fixed; and the first stage on which the support substrate is fixed And the second alignment mark on the support substrate is detected by the detection mechanism unit from the side opposite to the side on which the support substrate is fixed with respect to the first stage. After adjusting the first stage, bringing the second stage close to the first stage and joining the support substrate and the piezoelectric substrate. , The method of manufacturing a liquid discharge head,
In the positioning and joining step, the second stage to which the other piezoelectric substrate is fixed is brought close to the detection mechanism unit, and the first alignment mark of the other piezoelectric substrate is moved by the detection mechanism unit. Detecting, adjusting the position of the detection mechanism unit or the second stage, fixing the detection mechanism unit, and then separating the second stage from the detection mechanism unit;
The first main surface of the support substrate of the laminate in which the support substrate and the piezoelectric substrate are joined is fixed to the first stage, and the second alignment mark of the support substrate is fixed to the detection mechanism unit. Detecting from the opposite side of the side on which the support substrate is fixed to the first stage, and positioning the first stage;
4. The liquid ejection according to claim 1, further comprising: bringing the second stage close to the positioned first stage and joining the stacked body and the other piezoelectric substrate. 5. Manufacturing method of the head.

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