JP2014093507A - Process liquid supply device and substrate processing apparatus including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process liquid supply device which can supply process liquid to a plurality of processing sections while minimizing significant decrease in substrate processing capacity of the processing section, and to provide a substrate processing apparatus including the same.SOLUTION: A process liquid supply device 11 for supplying process liquid to a plurality of processing sections 5, 6 having processing units 8, 9 includes pumps 22, 27 provided in relation to respective processing sections 5, 6 and pressure feeding process liquid toward corresponding processing sections 5, 6, and a plurality of valve members 23, 28 for opening and closing the flow path of process liquid on the primary of the pumps 22, 27, for each processing section 5, 6.

Description

  The present invention relates to a processing liquid supply device for processing a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk (hereinafter simply referred to as a substrate), and a substrate processing apparatus provided with the same. About.

  Conventionally, as illustrated in FIG. 10A, there is a processing liquid supply device 91 that supplies a processing liquid to a plurality of processing units 85 and 86. The processing liquid supply device 91 includes a tank 93, pipes 94 to 96, pumps 97 and 98, and the like. One end of a pipe 94 is connected to the tank 93 in communication. The other end of the pipe 94 is branched into pipes 95 and 96. The pipe 95 communicates with the processing unit 85, and the pipe 96 communicates with the processing unit 86. Pumps 97 and 98 are provided in the middle of the pipes 95 and 96, respectively. When the pumps 97 and 98 are operated, the processing liquid in the tank 93 is supplied to both the processing units 85 and 86.

  The processing units 85 and 86 include processing units 88 and 89 that perform processing on the substrate, respectively. Each of the processing units 88 and 89 uses the processing liquid supplied by the processing liquid supply device 91. According to this, the substrate processing can be performed in parallel in each of the processing units 85 and 86, and the substrate processing capability (throughput) can be improved (for example, see Patent Document 1).

  The processing liquid supply device 91 may be provided outside or inside the substrate processing apparatus including the processing units 85 and 86. In the former case, an apparatus including the processing units 85 and 86 is referred to as a “substrate processing apparatus” or “apparatus body”, and a processing liquid supply apparatus 91 is referred to as a “processing liquid supply apparatus”, “separate cabinet”, or “accompanying equipment” Call them to distinguish them (see, for example, Patent Documents 2 and 3). In the latter case, the entire apparatus including the processing units 85 and 86 and the processing liquid supply apparatus 91 is collectively referred to as a “substrate processing apparatus”.

JP 2009-10291 A JP 2000-173902 A JP 2000-182926 A

However, the conventional example having such a configuration has the following problems.
When inspection, repair or repair (hereinafter referred to as “maintenance”) is performed on the pumps 97 and 98, the pumps 97 and 98 are stopped.

  For example, as shown in FIG. 10B, when only the pump 97 is removed from the pipe 95, the inside of the pipe 95 is open to the atmosphere. At this time, if the pump 98 is operated, air is sucked into the pipe 95 and flows into the pump 98, and the pump 98 pumps the processing liquid containing bubbles. As a result, a processing liquid ejection failure or the like occurs in the processing unit 89, and the processing unit 86 cannot appropriately process the substrate. Therefore, both the pumps 97 and 98 are stopped and the processing units 85 and 86 are stopped even if the maintenance target is not only the pumps 97 and 98 but only one of them.

  As described above, when performing maintenance on at least one of the pumps 97 and 98, all the processing units 85 and 86 are suspended at the same time, so that there is a disadvantage in that the substrate processing capacity is significantly reduced.

  The present invention has been made in view of such circumstances, can supply a processing liquid to a plurality of processing units, and can suppress a significant decrease in substrate processing capability of the processing units. It is an object of the present invention to provide a processing liquid supply apparatus and a substrate processing apparatus including the same.

In order to achieve such an object, the present invention has the following configuration.
That is, the present invention is a processing liquid supply apparatus that supplies a processing liquid to a plurality of processing units having processing units, provided in association with each processing unit, and supplying the processing liquid to the corresponding processing unit. A processing liquid supply apparatus including a pump for pumping and a plurality of valve members for opening and closing a flow path of a processing liquid on a primary side of the pump for each processing unit.

  [Operation / Effect] The processing liquid supply apparatus according to the present invention has a plurality of pumps associated with each processing unit. Each pump supplies processing to a single processing unit. When the pumps corresponding to the plurality of processing units are respectively operated, the processing liquid is supplied to the plurality of processing units. Thereby, each process part can process a board | substrate simultaneously, and can improve a substrate processing capability.

  Further, when pumps corresponding to some of the processing units (hereinafter, abbreviated as “partial pumps” as appropriate) are stopped, supply of the processing liquid to some of the processing units is stopped. In this case, if only the flow path on the primary side of some pumps is closed by the valve member, the flow path of the processing liquid passing through some pumps and the flow path of the processing liquid passing through other pumps may be separated. it can. For this reason, even if maintenance is performed on some pumps, the other pumps can appropriately supply the processing liquid, and the other processing units can appropriately perform the substrate processing. In this way, since the valve member that individually opens and closes the flow path on the primary side of the pump corresponding to the processing unit is provided, even when maintenance is performed on some pumps, the processing unit is partially operated Can be made. Therefore, it can suppress that a substrate processing capability falls remarkably.

  In the above-described invention, it is preferable that one valve member is provided for each processing unit. According to this, even when there are a plurality of pumps provided in association with a single processing unit, the flow paths on the primary side of those pumps are collectively closed by a single valve member. Can do. Moreover, the number of parts of the valve member can be reduced, and the device configuration can be simplified.

  In the above-described invention, it is preferable that one valve member is provided for each pump. According to this, even when there are a plurality of pumps provided in association with a single processing unit, the flow paths on the primary side of those pumps can be individually closed by the plurality of valve members. . Therefore, maintenance for each pump can be performed flexibly.

  In the above-mentioned invention, it is preferable that the primary side of the valve member corresponding to a different processing part is connected to the same tank. The processing liquid supply device can be suitably applied to a tank shared by two or more processing units.

  In the above-described invention, each processing unit is configured to be able to be turned on and off individually, and when the power of the processing unit is shut off, the valve member corresponding to the processing unit is preferably closed. According to this, it is possible to close only the flow path on the primary side of the pump corresponding to the processing unit in conjunction with the power-off of the processing unit. That is, the primary side of the pump can be closed at an appropriate timing.

  In the above-described invention, the valve member has a function of being closed when the power is cut off. When the power of the processing unit is cut off, the power of the valve member corresponding to the processing unit is cut off. It is preferable to do. That is, the valve member is a valve member that is in a closed state when the power is lost, and it is preferable that the power supply of the valve member corresponding to the processing unit is cut off in conjunction with the cutoff of the power supply of the processing unit. According to this, the flow path on the primary side of the pump can be reliably closed.

  In the above-described invention, a plurality of valve member wirings for individually supplying power to the valve members corresponding to the processing units are provided, and the power of each processing unit is individually turned on and off by the plurality of processing unit switches. Each valve member wiring is preferably electrically connected to the secondary side of the corresponding processing unit switch. Since the valve member wiring is provided, the valve member corresponding to each processing unit can be individually closed. Further, since these valve member wirings are opened and closed by the corresponding processing unit switches, the power source of the processing unit and the power source of the valve member corresponding to the processing unit can be turned on and off collectively.

  In the above-described invention, it is preferable that the valve member wiring further supplies power to pumps corresponding to the same processing unit. According to this, each power supply of the valve member and pump provided in relation to the same processing unit can be turned on / off collectively.

  In the above-described invention, it is preferable that pumps corresponding to different processing units are installed in different installation spaces. According to this, even when any of the processing units is suspended, the stopped pump and the operating pump do not coexist in the same installation space. Therefore, maintenance can be suitably performed on the pump and the like.

  In the above-described invention, the pumps corresponding to the same processing unit are preferably installed in the same installation space. According to this, since the pumps corresponding to the same processing unit are concentrated in one installation space, maintenance can be performed efficiently. Moreover, it can suppress suitably that an installation space increases.

  In the above-described invention, it is preferable that the installation spaces are separated from each other. Since each installation space is separated, when performing maintenance on the stopped pump, it is possible to suitably prevent being affected by the operating pump or affecting the operating pump. Therefore, maintenance can be suitably performed on the stopped pump, and the operating pump can continue to supply the processing liquid appropriately even during maintenance.

  In the above-described invention, it is preferable that a plurality of opening / closing mechanisms capable of individually opening each installation space are provided. Since only the installation space in which the maintenance target pump is arranged can be opened, maintenance can be suitably performed.

  In the above-described invention, each open / close mechanism is preferably capable of moving a pump disposed in a corresponding installation space to the outside of the casing of the processing liquid supply apparatus. Maintenance can be performed while the pump is out of the housing, so maintenance workability can be improved. Moreover, it can avoid suitably that the vibration which generate | occur | produced by the maintenance is transmitted to the pump in operation | movement, and it can suppress that the pumping quality of a pump fluctuates. Thereby, it is possible to prevent the discharge of the processing liquid from being disturbed in the operating processing unit, and to prevent the processing quality performed by the operating processing unit from being deteriorated.

  Moreover, this invention is a substrate processing apparatus provided with the some process part which has a process unit, and the process liquid supply apparatus in any one of Claim 1 to 13 which supplies a process liquid with respect to each process part. It is.

  [Operation / Effect] According to the substrate processing apparatus of the present invention, since the processing section and the processing liquid supply apparatus are provided in the same apparatus, both can be suitably linked.

  The present specification also discloses an invention relating to the following processing liquid supply apparatus and a substrate processing apparatus including the processing liquid supply apparatus.

  (1) It is preferable that the primary side of the valve member corresponding to a different process part is mutually connected. Moreover, it is preferable to provide the collecting pipe with which the primary side of the valve member corresponding to a different process part is connecting together. According to this, since a part of the flow path of the processing liquid corresponding to different processing units is shared, the configuration of the processing liquid supply apparatus can be simplified.

  (2) Each open / close mechanism is preferably a drawer unit that moves the pump between the inside and the outside of the housing. According to this, while being able to accommodate a pump in a housing | casing, a pump can be easily pulled out of a housing | casing.

  (3) It is preferable that the valve member corresponding to the same process part is further installed in each installation space. Since the pumps and valve members corresponding to the same processing unit are concentrated in one installation space, maintenance can be suitably performed.

  (4) It is preferable that each installation space is mutually separated by the partition. Since the installation space is partitioned by the partition wall, maintenance can be performed more suitably for the stopped pump, and the operating pump supplies the processing liquid more appropriately even during maintenance. Can do.

  (5) It is preferable that the plurality of installation spaces are arranged below the plurality of processing units. According to this, since each process part and the process liquid supply apparatus are arrange | positioned closely, both can be made to cooperate suitably. The plurality of processing units are preferably provided so as to be aligned in the vertical direction. According to this, the installation area of the process part in planar view can be made compact. Further, the plurality of installation spaces are preferably provided so as to be aligned in the vertical direction. According to this, the installation area of the installation space in plan view can be made compact.

  (6) It is preferable that the processing unit further includes a main transport mechanism that transports the substrate to the processing unit in the processing unit. According to such a processing unit, it is possible to suitably perform processing on the substrate. In this specification, a processing unit having a processing unit and a main transport mechanism is particularly referred to as a “substrate processing row”.

  (7) It is preferable that at least two of the plurality of processing units perform the same processing on the substrate. Moreover, it is preferable that at least two or more processing units among the plurality of processing units have processing units that use the same type of processing liquid. According to these, at least two or more processing units can perform the same processing in parallel.

  (8) The processing liquid supply apparatus preferably supplies the processing liquid to a plurality of processing units included in the substrate processing apparatus provided outside the processing liquid supply apparatus. Since the processing liquid supply apparatus is provided separately from the substrate processing apparatus including the processing unit, the degree of freedom of arrangement of the processing liquid supply apparatus can be increased.

  According to the processing liquid supply apparatus and the substrate processing apparatus of the present invention, the valve member can individually close the flow path on the primary side of the pump for each processing unit. Therefore, even when maintenance is performed on pumps corresponding to some processing units, pumps corresponding to other processing units can be suitably operated. Thereby, a process part can be operated partially and it can suppress that a substrate processing capability falls remarkably.

1 is a diagram illustrating a schematic configuration of a substrate processing apparatus according to a first embodiment. 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to a first embodiment. It is a schematic side view which shows arrangement | positioning of a processing unit and installation space. It is a schematic side view which shows arrangement | positioning of a processing unit. It is each vertical sectional drawing of the aa arrow in FIG. It is a figure which shows an example of a structure of a process liquid supply system. It is an external appearance perspective view of the substrate processing apparatus which shows operation | movement of a drawer unit. FIG. 6 is a diagram illustrating a schematic configuration of a substrate processing apparatus according to a second embodiment. FIGS. 9A and 9B are diagrams showing a schematic configuration of a processing liquid supply apparatus according to a modified embodiment. 10A and 10B are diagrams showing a schematic configuration of a conventional substrate processing apparatus.

  Embodiment 1 of the present invention will be described below with reference to the drawings. First, the outline | summary of the present Example 1 is demonstrated. FIG. 1 is a diagram illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment.

[Summary of Example 1]
The substrate processing apparatus 1 includes a plurality of processing units 5 and 6. The processing units 5 and 6 include processing units 8 and 9 that perform processing on a substrate (for example, a semiconductor wafer), respectively.

  The substrate processing apparatus 1 further includes a processing liquid supply device 11. The processing liquid supply device 11 supplies the processing liquid to the plurality of processing units 5 and 6.

  The processing liquid supply apparatus 11 includes a tank 12 that stores the processing liquid. One end of a pipe 17 is connected to the tank 12 in communication. The other end of the pipe 17 is branched into pipes 21 and 26. The pipes 21 and 26 communicate with the processing units 5 and 6, respectively. The pipe 17 corresponds to the collecting pipe in the present invention.

  A pump 22 and a valve member 23 are interposed in the pipe 21. The pump 22 pumps the processing liquid toward the secondary side (processing unit 5). The valve member 23 is disposed on the primary side of the pump 22 and opens and closes the flow path of the processing liquid on the primary side of the pump 22. Similarly, a pump 27 and a valve member 28 are provided in the middle of the pipe 26.

  The substrate processing apparatus 1 described above operates as follows.

  When the pumps 22 and 27 are operated with the valve members 23 and 28 opened, the processing liquid in the tank 12 flows into both the pipes 21 and 26 via the pipe 17. The processing liquid flowing into each pipe 21/26 is supplied to the processing unit 5/6 by the pump 22/27. Each processing part 5 and 6 can perform substrate processing in parallel, and can raise processing efficiency of a substrate.

  When the pump 22 is stopped and only the pump 27 is operated, the processing liquid in the tank 12 flows only into the pipe 26 via the pipe 17 and is supplied to the processing unit 6. At this time, when the valve member 23 is closed, the flow path of the processing liquid passing through the pump 22 and the flow path of the processing liquid passing through the pump 27 are separated. In this case, even if the inside of the pipe 21 is opened to the atmosphere by removing the pump 22 from the pipe 21 or the like, air (bubbles) is not mixed into the pump 27. Therefore, maintenance can be suitably performed on the pump 22, and the pump 27 can stably supply the processing liquid. Therefore, only the processing unit 6 can appropriately perform the substrate processing.

  Conversely, even when maintenance is performed on the pump 27, only the pump 22 is operated with the valve member 23 opened and the valve member 28 closed. Thereby, it is possible to suitably perform maintenance on the pump 27 while favorably operating only the processing unit 5.

  As described above, according to the first embodiment, since the valve member 23/28 for individually closing the flow path on the primary side of the pump 22/27 is provided, maintenance is performed on one of the pumps 22/27. Even in this case, the other of the pumps 22/27 can be operated properly. Thereby, any one of the processing units 5 and 6 corresponding to the other of the pumps 22/27 can be appropriately operated, and it is possible to suitably suppress a significant decrease in the substrate processing capacity.

  Further, since the primary sides of the valve members 23 and 28 are connected to the same tank 12, the tank 12 can be shared by the processing units 5 and 6. Therefore, the configuration related to the processing liquid supply source can be simplified.

  Moreover, since the primary side of the valve members 23 and 28 is provided with the piping 17 which communicates together, the structure relevant to a pipe line can be simplified.

  Below, the specific structure of the substrate processing apparatus 1 which concerns on the present Example 1 is illustrated. FIG. 2 is a plan view illustrating a schematic configuration of the substrate processing apparatus 1 according to the first embodiment, FIG. 3 is a schematic side view illustrating an arrangement of processing units and installation spaces included in the substrate processing apparatus 1, and FIG. It is a schematic side view which shows arrangement | positioning of the processing unit which the substrate processing apparatus 1 has, and FIG. 5 is each vertical sectional view of the aa arrow in FIG.

[ID section 3, processing section 5/6, IF section 7]
Please refer to FIG. The substrate processing apparatus 1 includes an indexer unit (hereinafter referred to as “ID unit”) 3, a plurality of processing units 5 and 6, and an interface unit (hereinafter referred to as “IF unit”) 7. As shown in FIGS. 3 to 5, the processing units 5 and 6 are stacked so as to be aligned in the vertical direction. The ID unit 3 is provided adjacent to one side of the processing units 5 and 6. The IF unit 7 is provided adjacent to the other sides of the processing units 5 and 6. As shown in FIG. 2, the IF unit 7 is further adjacent to an exposure machine EXP that is an external device separate from the substrate processing apparatus 1. Hereinafter, the ID unit 3, the processing units 5 and 6, and the IF unit 7 will be described in order.

The ID unit 3 transports the substrate W between the cassette C and the processing units 5 and 6. The ID unit 3 includes a mounting table 4 and an ID transport mechanism T _ID . The mounting table 4 can mount a plurality (four) of cassettes C. The cassette C accommodates a plurality of substrates W. The ID transport mechanism T _ID is configured to be movable in the horizontal direction and the vertical direction, and transports the substrate W to the cassette C and the processing units 5 and 6 mounted on the cassette mounting table 4.

  Each processing unit 5 and 6 performs the same processing while reciprocating the substrate W between the ID unit 3 and the IF unit 7 (specifically, a resist film or the like is formed on the substrate W and exposure is performed). The developed substrate W is developed). Since the processing units 5 and 6 have substantially the same configuration, the processing unit 5 will be described, and the processing unit 6 will be denoted by the same reference numerals and description thereof will be omitted.

In addition to the processing unit 8, the processing unit 5 includes main transport mechanisms T ₁ and T ₂ that transport the substrate W to the processing unit 8. The main transport mechanisms T ₁ and T ₂ are arranged in a direction connecting the ID unit 3 and the IF unit 7. Each main transport mechanism T ₁ , T ₂ is movable in the horizontal direction and the vertical direction. Each of the main transport mechanisms T ₁ and T ₂ delivers the substrate W in both directions. The main transport mechanism _{T 1} receiving and transferring the substrates W between the _ID transport mechanism _{T ID.} The main transport mechanism _{T 2} receiving and transferring the substrates W between the IF section 7 (IF's transport mechanisms _{T IF1} described later).

  In the present specification, a processing unit having a processing unit and a main transport mechanism is particularly referred to as a “substrate processing row”. Hereinafter, the processing units 5 and 6 are appropriately referred to as “substrate processing rows 5 and 6”.

Between the ID transport mechanism T _ID and the main transport mechanism T ₁ , a placement unit PASS ₁ for placing the substrate W is disposed. Similarly, between the main transport mechanism _{T 1} and the main transport mechanism _{T 2,} and between the main transport mechanism _{T 2} and IF's transport mechanisms _{T IF1,} respectively, the mounting portion PASS ₂ and mounting part PASS ₃ Has been placed. Each of the placement units PASS _{1 to} PASS ₃ is used when the transport mechanism delivers the substrate W to each other.

Please refer to FIG. The placement unit PASS ₁ includes a placement unit PASS _1A and a placement unit PASS _1B . The placement units PASS _1A and PASS _1B are selectively used depending on the transport direction of the substrate W. For example, the mounting portion PASS _1A, is placed the substrate W is transported from the _ID transport mechanism _{T ID} to the main transport mechanism _{T 1,} the mounting portion PASS _1B, conveying ID from the main transport mechanism _{T 1} A substrate W to be transported to the mechanism T _ID is placed. The same applies to the placement unit PASS ₂ and the placement unit PASS ₃ .

Please refer to FIG. Processing unit 8 having a substrate treatment line 5 is greater, a processing unit main transport mechanism T ₁ is to bear the transportation of the substrate W, the main transport mechanism T ₂ is divided into a processing unit to bear the transportation of the substrate W. The former is the liquid processing unit Uc and the heat treatment unit Uh1. The latter is a development processing unit DEV, a heat treatment unit Uh2, and an edge exposure unit EEW (see FIG. 4 for the edge exposure unit EEW).

First, the main transport mechanism T ₁ is described processing units bear the transport of the substrate W. Liquid processing unit Uc is disposed on one side of the main transport mechanism T _1, the thermal processing unit Uh1 is disposed on the other side of the main transport mechanism T _1.

  As shown in FIG. 3, the liquid processing unit Uc is specifically two anti-reflection film coating processing units BARC and two resist film coating processing units RESIST. The antireflection film coating processing unit BARC performs a process of applying an antireflection film material to the substrate W to form an antireflection film. The resist film application processing unit RESIST performs a process of applying a resist to the substrate W to form a resist film.

  Please refer to FIG. Each liquid processing unit Uc is a so-called rotary coating processing unit, and includes a nozzle 31 and a scattering prevention cup 32. The nozzle 31 discharges the processing liquid onto the substrate W. The splash prevention cup 32 receives and collects the processing liquid splashed from the substrate W. Further, each liquid processing unit Uc includes a holding unit (not shown) that holds a single substrate W rotatably in a substantially horizontal posture. Each coating processing unit BARC / RESIST uses a solvent and a rinse liquid in addition to the antireflection film material / resist. Examples of the rinse liquid include pure water and a surfactant.

  As shown in FIG. 4, the heat treatment unit Uh1 is specifically a heating unit HP, a cooling unit CP, a heating / cooling unit PHP, and an adhesion processing unit AHL. The heating unit HP heats the substrate W. The cooling unit CP cools the substrate W. The heating / cooling unit PHP performs the heating process and the cooling process continuously. The adhesion processing unit AHL performs heat treatment in a steam atmosphere of HMDS (hexamethylsilazane) in order to improve the adhesion between the substrate W and the coating. Each heat treatment unit Uh1 basically includes a mounting table on which the substrate W is mounted, an electric heater, and the like. The adhesion processing unit AHL uses HMDS.

Referring to FIG. 2, the main transport mechanism T ₂ will be described the processing units bear the transport of the substrate W. Developing units DEV are arranged at one side of the main transport mechanism T _2, the heat-treating units Uh2 and edge exposing unit EEW are arranged in the other side of the main transport mechanism T _2.

  The development processing unit DEV performs development processing on the substrate W. The development processing unit DEV is a kind of liquid processing unit. The development processing unit DEV includes a nozzle 33 and a scattering prevention cup 34. The nozzle 33 discharges the processing liquid onto the substrate W. The anti-scattering cup 34 receives and collects the processing liquid scattered from the substrate W. Further, the development processing unit DEV includes a holding unit (not shown) that holds a single substrate W rotatably in a substantially horizontal posture. The development processing unit DEV uses a surfactant and a rinse solution in addition to the developer. Examples of the rinsing liquid include pure water.

As shown in FIG. 4, the heat treatment unit Uh2 is a heating unit HP and a cooling unit CP. For the heating / cooling unit PHP, the IF transport mechanism _TIF1 bears the transport of the substrate W. The edge exposure unit EEW exposes the periphery of the substrate W. Although not shown, the edge exposure unit EEW includes a holding unit that holds the substrate W, a motor that rotates the holding unit, a light irradiation unit that irradiates the substrate W with light, and the like.

Please refer to FIG. The IF unit 7 transports the substrate W to the substrate processing rows 5 and 6 and the exposure machine EXP. The IF unit 7 includes a plurality of IF transport mechanisms T _IF1 and T _IF2 that transport the substrate W. The IF transport mechanism _TIF1 and the IF transport mechanism _TIF2 deliver the substrate W to each other. The IF transport mechanism _TIF1 further transports the substrate W between the substrate processing rows 5 and 6. The IF transport mechanism _TIF2 further transports the substrate W to and from the exposure machine EXP.

Between the IF transport mechanisms T _IF1 and T _IF2 , a placement unit PASS-CP for placing and cooling the substrate W is disposed. Below the placement unit PASS-CP, although not shown, a placement unit for placing the substrate W and a buffer unit for temporarily accommodating the substrate W are stacked. The substrate W to be transported from the IF transport mechanism _TIF1 to the IF transport mechanism _TIF2 is placed on the placement unit PASS-CP. A substrate W that is transported from the IF transport mechanism _TIF2 to the IF transport mechanism _TIF1 is placed on a placement unit (not shown). A buffer unit (not shown) is used when the substrate W cannot be mounted on the mounting unit PASS-CP or the like as scheduled.

[Processing liquid supply device 11]
The processing liquid supply device 11 supplies at least one processing liquid appropriately selected from the resist, antireflection film material, solvent, rinsing liquid, pure water, surfactant, HMDS, and developer described above. To do. In the first embodiment, the resist and the antireflection film material are respectively supplied to the substrate processing rows 5 and 6 by the processing liquid supply device 11. That is, the processing liquid supply apparatus 11 includes a processing liquid supply apparatus 11R for resist and a processing liquid supply apparatus 11N for antireflection film material.

  In the present embodiment, for convenience of explanation, it is assumed that the processing liquid supply devices 11R and 11N have substantially the same configuration. Further, the mechanism for supplying other processing liquid has a configuration different from that of the processing liquid supply apparatus 11, and thus detailed description thereof is omitted.

  With reference to FIG. 6, the detailed structure of the process liquid supply apparatus 11 is demonstrated. FIG. 6 is a diagram illustrating an example of a configuration of a processing liquid supply apparatus 11R that supplies a resist.

  As illustrated, the tank 12 includes two bottles 12a and 12b. A resist is stored in each bottle 12a, 12b.

  One end of each of the pipes 13a and 13b is connected to each bottle 12a and 12b. The other ends of the pipes 13 a and 13 b are connected to one end of the pipe 17 via the three-way valve 14. The three-way valve 14 switches the pipe connected to the pipe 17 between the pipe 13a and the pipe 13b.

  Trap tanks 15a and 15b are provided in the middle of the pipes 13a and 13b. Each of the trap tanks 15a and 15b temporarily stores a resist and separates and collects air from the resist. When the bottles 12a and 12b are emptied, the amount of resist stored in the corresponding trap tanks 15a and 15b decreases. Therefore, a sensor (for example, a liquid level sensor) for detecting the amount of resist in the trap tanks 15a and 15b is provided, and it is possible to determine whether or not the bottles 12a and 12b are empty based on the detection result of the sensor. It is configured.

  The trap tanks 15a and 15b are connected to vent pipes 16a and 16b for opening the inside thereof to the atmosphere. The vent pipes 16a and 16b are opened and closed by a relief valve (not shown).

  For example, when it is determined that the bottle 12 a is empty, the three-way valve 14 is switched to connect the pipe 13 b to the pipe 17. Thereby, the resist is supplied from the bottle 12b through the trap tank 15b. Meanwhile, the bottle 12a is replaced with a new bottle 12a. At that time, the vent pipe 16a is opened, and the inside of the trap tank 15a is opened to the atmosphere. Eventually, when the bottle 12b becomes empty, the three-way valve 14 is switched to supply the resist from the bottle 12a instead of the bolt 12b. Meanwhile, the bolt 12b is replaced.

  Pipes 21 and 26 are connected to the other end of the pipe 17.

  A single valve member 23 is provided in the middle of the pipe 21. The pipe 21 is further branched into pipes 21 a and 21 b on the secondary side of the valve member 23. The pipes 21 a and 21 b individually supply the processing liquid to the two resist film coating processing units RESIST provided in the substrate processing row 5. Pumps 22a and 22b are provided in the middle of the pipes 21a and 21b, respectively. The flow paths on the primary side of these pumps 22 a and 22 b are collectively opened and closed by the valve member 23.

  Similarly, the pipe 26 is further branched into pipes 26 a and 26 b, and the pipes 26 a and 26 b respectively flow the processing liquid toward the two resist film coating processing units RESIST in the substrate processing row 6. A single valve member 28 is interposed in the pipe 26, and pumps 27a and 27b are interposed in the pipes 26a and 26b, respectively.

  Note that the configuration of the processing liquid supply apparatus 11R described above is merely an example, and the configuration of the tank 12, the configurations of the pipes 21 and 26, and the like may be appropriately selected.

  In the case of the processing liquid supply apparatus 11N, the processing liquid stored in the tank 12 is the antireflection film material, and the units to be supplied are the antireflection film coating processing unit BARC. Since the other configuration is basically the same as that of the processing liquid supply device 11R, detailed description thereof is omitted.

  Next, the layout of the pumps 22 and 27 will be described with reference to FIGS. FIG. 7 is a perspective view of the apparatus showing the movement of the drawer unit.

  As illustrated, drawer units 41 and 42 are provided below the substrate processing rows 5 and 6 (more specifically, the liquid processing unit Uc). The drawer units 41 and 42 are stacked so as to be aligned in the vertical direction.

  The drawer unit 41 holds a pump 22 provided in association with the substrate processing row 5. In FIG. 3, pumps included in the processing liquid supply device 11R are denoted by reference signs “22Ra” and “22Rb”, and pumps included in the processing liquid supply apparatus 11N are denoted by reference signs “22Na” and “22Nb”. Similarly, the drawer unit 42 holds pumps 27Ra, 27Rb, 27Na, and 27Nb provided in association with the substrate processing row 6. Thus, the drawer units 41 and 42 define installation spaces S1 and S2 that are separated from each other for installing the pumps 22 and 27.

  A partition wall 43 is provided between the drawer unit 41 and the drawer unit 42. The partition wall 43 separates the installation spaces S1 and S2.

  As shown in FIG. 7, the drawer unit 41 is provided so as to be slidable in a substantially horizontal direction with respect to the housing 44 of the processing liquid supply apparatus 11 (substrate processing apparatus 1). By this drawer unit 41, the pumps 22R and 22N can be moved between the inside and the outside of the housing 44. Similarly, the drawer unit 42 is provided so as to be movable with respect to the housing 44. The drawer units 41 and 42 correspond to the opening / closing mechanism in this invention.

  Next, the operation of the substrate processing apparatus 1 according to the first embodiment will be described. The following description will be divided into an operation in which both the substrate processing rows 5 and 6 are operated and an operation in which only one of the substrate processing rows 5 and 6 is operated. Further, the processing liquid supply devices 11R and 11N will be described without distinction.

[Operation in which the substrate processing rows 5 and 6 are operated]
The pumps 22a, 22b, 27a, 27b are operated with the valve members 23, 28 opened. Thereby, the processing liquid supply apparatus 11 supplies the processing liquid to the substrate processing rows 5 and 6. Each substrate processing row 5/6 performs processing on the substrate W.

  Here, processing performed on the substrate W will be described separately for conveyance from the ID unit 3 to the IF unit 7 and conveyance from the IF unit 7 to the ID unit 3.

<Transport from ID section 3 to IF section 7>
The ID transport mechanism T _ID unloads the substrate W from the cassette C and transports it alternately to the substrate processing rows 5 and 6.

Each substrate processing row 5/6 operates as follows. The main transport mechanism T _1, a wafer W received from the ID unit 3 is conveyed in a predetermined order to the liquid processing units Uc and thermal processing unit UH1. Various processing units perform predetermined processing, whereby a coating process for forming an antireflection film and a resist film is performed on the substrate W. At this time, each coating processing unit BARC / RESIST in the substrate processing row 5/6 uses the antireflection film material and the resist supplied from the processing liquid supply device 11. The main transport mechanism T _1, and passes the wafer W series of processing is performed in the main transport mechanism T _2. The main transport mechanism T ₂ transports the wafer W received in the edge exposing unit EEW. The edge exposure unit EEW exposes the peripheral edge of the substrate W. The main transport mechanism T < _b > ₂ carries the substrate W that has been subjected to the edge exposure process to the IF unit 7.

The IF transport mechanism _TIF1 alternately receives the substrates W from the substrate processing rows 5 and 6, and passes them to the IF transport mechanism _TIF2 . The IF transport mechanism _TIF2 carries the received substrate W out to the exposure apparatus EXP.

<Transfer from IF section 7 to ID section 3>
The IF transport mechanism _TIF2 receives the exposed substrate W from the exposure apparatus EXP and passes it to the IF transport mechanism _TIF1 . The IF transport mechanism _TIF1 transports the received substrate W to the heating / cooling unit PHP. The heating / cooling unit PHP performs a post-exposure bake on the substrate W. The IF transport mechanism _{TIF1 unloads} the substrate W that has been subjected to post-exposure heat treatment to the substrate processing rows 5 and 6.

Each substrate processing row 5/6 operates as follows. That is, the main transport mechanism _{T 2} is, receives the substrate W from the IF section 7, to convey a predetermined order to the developing units DEV and thermal processing unit UH2. Thereby, a developing process for developing the substrate W is performed. The main transport mechanism T _2, and passes the wafer W development process has been performed to the main transport mechanism T _1. The main transport mechanism T ₁ transports the received substrate W to the ID unit 3.

The ID transport mechanism T _ID alternately receives the substrates W from the substrate processing rows 5 and 6 and carries them into the cassette C.

[Operation in which only one of substrate processing rows 5 and 6 operates]
The case where only the substrate processing line 5 operates will be exemplified. Only the pumps 22a and 22b are operated with the valve member 23 opened and the valve member 28 closed. Thereby, the processing liquid supply apparatus 11 supplies the processing liquid only to the substrate processing row 5.

  The substrate processing apparatus 1 reciprocates the substrate W between the ID unit 3 and the IF unit 7 only through the substrate processing row 5, and only the substrate processing row 5 processes the substrate W. The substrate W is not transported to the substrate processing row 6 and the substrate processing row 6 is at rest.

  Here, when maintenance is performed on the pump 27 corresponding to the substrate processing row 6, only the drawer unit 42 is slid. As a result, only the stopped pumps 27 a and 27 b are pulled out of the housing 44. In this state, maintenance can be suitably performed on the pumps 27a and 27b. The maintenance is, for example, replacement of the pumps 27a and 27b.

  Thus, according to the first embodiment, as described above, the flow paths on the primary side of the pumps 22 and 27 can be closed for each substrate processing row 5/6 by the valve members 23 and 28. Therefore, even when maintenance is performed on one of the pumps 22/27, the other of the pumps 22/27 can be preferably operated, and any one of the substrate processing rows 5/6 can be operated. . Therefore, it can suppress that a substrate processing capability falls remarkably.

  Moreover, since the valve member 23 provided in relation to each substrate processing row 5 is single, the flow path on the primary side of the pumps 22a and 22b can be collectively closed by the valve member 23. Similarly, the flow paths on the primary side of the pumps 27a and 27b can be collectively closed by the single valve member 28. Therefore, the number of parts of the valve members 23 and 28 can be reduced, and the device configuration can be simplified.

  In addition, since the pumps 22/27 are installed in different installation spaces S1 and S2, when any of the pumps 22/27 is stopped, the pumps stopped in the same installation space S1 / S2 There is no coexistence with operating pumps. Therefore, maintenance can be suitably performed on the pump and the like.

  Further, the pumps 22a and 22b corresponding to the substrate processing row 5 are installed in the same installation space S1, and the pumps 27a and 27b corresponding to the substrate processing row 6 are also installed in the same installation space S2. Therefore, maintenance can be performed efficiently. Moreover, it can suppress suitably that installation space S1, S2 increases.

  Moreover, since each installation space S1, S2 is separated and formed by the drawer units 41, 42, when performing maintenance on one of the pumps 22/27, the other of the pumps 22/27 may be affected, It can prevent suitably affecting the other of pump 22/27. Therefore, maintenance can be suitably performed on one of the pumps 22/27, and the other of the pumps 22/27 can appropriately supply the processing liquid even during maintenance. Furthermore, since the installation spaces S1 and S2 are separated from each other by the partition wall 43, it is possible to further prevent the maintenance work and the pump operation from interfering with each other.

  Moreover, since the drawer units 41 and 42 can open each installation space S1 / S2 individually, a maintenance can be performed suitably.

  Further, since the drawer units 41 and 42 can move the pumps 22 and 27 outside the housing 44, maintenance can be performed with the pumps 22 and 27 being out of the housing 44. Thereby, there is no possibility of vibrating the operating pump 22/27 by maintenance or moving the piping 21/26 connected to the operating pump 22/27. For this reason, it is possible to accurately stabilize the flow rate of the processing liquid pumped by the operating pump 22/27. As a result, it is possible to suitably suppress the occurrence of processing liquid ejection failure or the like in the substrate processing row 5/6.

  Further, since the drawer units 41 and 42 are provided so as to be slidable with respect to the housing 44, the pump 22/27 can be preferably moved out of the housing 44.

  Further, since the installation space S1 / S2 is arranged below the substrate processing row 5/6, the substrate processing row 5/6 and the processing liquid supply apparatus 11 can be suitably linked.

Further, since each substrate processing row 5/6 includes the processing unit 8/9 and the main transport mechanisms T ₁ and T ₂ , a series of processing can be suitably performed on the substrate W.

  Embodiment 2 of the present invention will be described below with reference to the drawings. FIG. 8 is a diagram illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. The processing liquid supply apparatus 11 according to the second embodiment is characterized in that the corresponding valve member 23/28 is closed in conjunction with the interruption of the power supply of each processing unit 5/6. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  The substrate processing apparatus 1 according to the second embodiment is configured to be able to supply power to each processing unit 5/6 individually. Specifically, the power of each processing unit 5/6 is turned on and off by the processing unit switch 51/56, respectively. The primary side of the processing unit switch 51/56 is electrically connected to the external power supply 50.

  The processing liquid supply apparatus 11 includes valve member wirings 61 and 66 and valve members 63 and 68. The valve member wires 61 and 66 are electrically connected to the secondary side of the processing unit switches 51 and 56. The valve member wirings 61 and 66 individually supply electric power to the valve members 63 and 68, respectively. The valve members 63 and 68 are provided in the middle of the pipes 21 and 26, respectively. The valve members 63 and 68 are operated by electric power.

  Although the detailed configuration of the valve member 63/68 is not shown, various configurations can be adopted. For example, each valve member 63/68 may include an air control valve, an air pipe, and an electromagnetic valve. Here, the air control valve is interposed in the pipe 21/26, and opens and closes the pipe 21/26 according to the air pressure. The air pipe is connected in communication with the air control valve and applies air pressure to the air control valve. The electromagnetic valve is interposed in the middle of the air pipe and adjusts the air pressure applied to the air control valve. In the valve member 63/68 configured as described above, the air control valve can be operated and the pipe 21/26 can be opened and closed by opening and closing the electromagnetic valve with electric power. Alternatively, the valve member 63/68 may be an electromagnetic valve interposed in the pipe 21/26. In the valve member 63/68 configured as described above, the piping 21/26 can be directly opened and closed by operating the electromagnetic valve with electric power.

  Further, each valve member 63/68 has a function of being closed when its power source is cut off. When the power supply of each valve member 63/68 is lost, the pipe 21/26 is closed.

  The valve member wiring 61 further supplies power to the pump 22. Similarly, the valve member wiring 66 further supplies power to the pump 27. The pumps 22 and 27 are operated by electric power supplied by the valve member wires 61 and 66.

  For example, when only the power supply of the processing unit 5 is shut off, the processing unit switch 51 is opened. Thereby, the power supply of the process part 5, the valve member 63, and the pump 22 is interrupted | blocked collectively. The valve member 63 is closed and closes the flow path on the primary side of the pump 22. Thereby, the flow path including the pump 22 is separated from the flow path including the pump 27. The pump 22 enters a no-voltage state. In this way, the pump 22 can be suitably maintained. On the other hand, since the power of the processing unit 6, the valve member 68, and the pump 27 is kept on, only the processing unit 6 can be suitably operated. On the other hand, the same applies when only the power supply of the processing unit 6 is shut off.

  Thus, according to the second embodiment, when the power source of the processing unit 5/6 is individually shut off, only the valve member 63/68 provided in association with the processing unit 5/6 connects the pipe 21/26. Close. As a result, only the flow path on the primary side of the pump 22/27 corresponding to the processing unit 5/6 whose power is cut off is closed. Therefore, maintenance for the pump 22/27 can be started smoothly.

  Further, the valve member 63/68 is a valve member that is closed when the power supply is cut off, and the power supply of the corresponding valve member 63/68 is interlocked with the cut-off of the power supply of the processing unit 5/6. Is cut off. For this reason, the primary side of the pump 22/27 can be accurately closed.

  Further, since the valve member wiring 61/66 is provided, the valve members 63/68 can be individually operated.

  Further, since each valve member wiring 61/66 is opened and closed by the processing section switch 51/56, the power supply of the processing section 5/6 and the power supply of the corresponding valve member 63/68 are shut off. It can be suitably linked. Furthermore, according to each wiring 61/66 for valve members, the interruption | blocking of the power supply of the process part 5/6 and the interruption | blocking of the power supply of corresponding pump 22/27 can be linked appropriately.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the first and second embodiments described above, one valve member 23/28 is provided for each processing unit 5/6. However, the present invention is not limited to this. For example, you may change so that one valve member may be provided with respect to each pump 22a, 22b, 27a, 27b.

  Reference is made to FIG. FIG. 9 is a diagram illustrating a schematic configuration of a processing liquid supply apparatus according to a modification. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol. As illustrated, valve members 73a and 73b are provided in the middle of the pipes 21a and 21b, and valve members 78a and 78b are provided in the middle of the pipes 26a and 26b. According to such a modification, each flow path passing through each pump 22a, 22b, 27a, 27b can be individually separated, and maintenance for each pump can be performed finely and flexibly.

  (2) In the above-described first embodiment, one pump 22a, 22b, 27a, and 27b is provided for each coating processing unit RESIST. However, the present invention is not limited to this. For example, you may change so that a pump may be provided 1 each with respect to the process part 5/6.

  Reference is made to FIG. As shown in the figure, a single pump 22 and a single valve member 23 are provided in the middle of the pipe 21, and a single pump 27 and a single valve member 28 are provided in the middle of the pipe 26. . The pump 22 pumps the processing liquid toward the plurality of processing units 8 included in the processing unit 5, and the pump 27 pumps the processing liquid toward the plurality of processing units 9 included in the processing liquid. According to this, the structure relevant to the pumps 22 and 27 can be simplified.

  (3) In the first and second embodiments described above, the common pipe 17 communicating with the primary side of the valve members 23 and 28 (63 and 68) is provided, but the present invention is not limited to this. The pipe 17 may be omitted as shown in FIG. In this case, the pipes 21 and 26 may be changed to communicate with the tank 12 in parallel.

  (4) In the first and second embodiments described above, the tank 12 is exemplified as the processing liquid supply source, but the present invention is not limited to this. The tank 12 may be changed to a facility (utility) facility provided in a factory. In the first and second embodiments, the processing liquid supply apparatus 11 includes the tank 12, but may be changed to a processing liquid supply apparatus that does not include the tank 12.

  (5) In the first embodiment described above, the pumps 22Ra, 22Rb, 22Na, and 22Nb corresponding to the same processing unit 5 are installed in the same installation space S1, but the present invention is not limited thereto. For example, the pumps 22Ra, 22Rb, 22Na, and 22Nb may be arranged in different installation spaces S, respectively. The pumps 27Ra, 27Rb, 27Na, and 27Nb may be similarly changed. According to this, maintenance can be flexibly performed for each pump.

  (6) In the above-described first embodiment, the arrangement of only the pumps 22 and 27 has been described in detail. However, other configurations may be appropriately arranged.

  For example, the pump 22 and the valve member 23 provided in association with the substrate processing row 5 may be arranged in the same installation space S1. Similarly, the pump 27 and the valve member 28 provided in association with the substrate processing row 6 may be arranged in the same installation space S2. According to this, since the pumps and valve members related to each other are concentrated in one installation space S, maintenance can be suitably performed.

  Further, the tank 12 or the like shared by the substrate processing rows 5/6 may be arranged in a space different from the installation spaces S1 and S2.

  (7) In the first embodiment described above, the drawer units 41 and 42 that can move the pumps 22 and 27 to the outside of the housing 44 are exemplified, but the present invention is not limited thereto. For example, instead of the drawer units 41 and 42, doors or lids that can open the installation spaces S1 and S2 individually may be employed. In this modification, the pumps 22 and 27 cannot be pulled out of the housing 44. However, even in this case, even when maintenance is performed on one of the pumps 22/27, the other of the pumps 22/27 can operate suitably.

  (8) In the first and second embodiments described above, the substrate processing apparatus 1 includes the processing liquid supply apparatus 11, but is not limited thereto. That is, it may be changed to a processing liquid supply apparatus provided separately from the substrate processing apparatus 1. In this case, the processing liquid supply apparatus supplies the processing liquid to the processing units 5 and 6 in the substrate processing apparatus 1 provided outside.

  (9) In the above-described second embodiment, power is supplied to the pump 22/27 through the valve member wiring 61/66, but is not limited thereto. That is, it may be changed so that electric power is supplied to the pump 22/27 by a wiring separate from the valve member wiring 61/66.

  (10) In the second embodiment described above, the valve member wiring 61/66 is opened and closed by the processing unit switches 51 and 56, but is not limited thereto. For example, the valve member wiring 61 may be changed to be opened and closed by a valve member switch provided separately from the processing unit switch 51. Even in this modified embodiment, the power supply to the substrate processing row 5 and the power supply to the valve member 63 are cut off by providing a relay circuit or the like that links the operation of the processing unit switch 51 and the valve member switch. Can be linked appropriately. The valve member wiring 66 may be similarly changed.

  (11) In the above-described second embodiment, the valve member 63/68 has a function of automatically closing when power is lost, but is not limited thereto. That is, you may change to the valve member which does not have such a function. Even in this modified embodiment, by controlling the valve member 63/68 to be closed in conjunction with the operation of the processing unit switch 51/56, the power supply to the processing unit 5/6 is cut off and the pump is operated. The closing of the flow path on the primary side of 22/27 can be suitably interlocked.

  (12) In the first embodiment described above, the valve members 23 and 28 have not been described in detail, but valve members having various specifications can be selected. For example, the valve members 23 and 28 operated by electric power may be used, or the valve members 23 and 28 operated manually may be used.

  (13) Although the processing unit switches 51 and 56 are not particularly described in the above-described second embodiment, various switches for opening and closing the electrical wiring can be applied. For example, the processing unit switches 51 and 56 may be magnet contactors, electromagnetic switches, breakers, or the like.

(14) In the first embodiment described above, the substrate processing rows 5 and 6 are provided with the _two main transport mechanisms T ₁ and T ₂ , but are not limited thereto. For example, it may be changed to a substrate processing row provided with one main transfer mechanism, or may be changed to a substrate processing row provided with three or more main transfer mechanisms.

  (15) In the above-described first embodiment, the processing units 5 and 6 are the substrate processing rows 5 and 6, but are not limited thereto, and may not be the substrate processing row. That is, the processing units 5 and 6 include only one or two or more processing units 8 and 9 and do not need to include a main transport mechanism that transports the substrate W to the processing units 8 and 9.

  (16) In the first and second embodiments described above, the processing units 8 and 9 are processing units (so-called “single-wafer processing units”) that process the substrates W one by one, but are not limited thereto. . For example, the processing unit may be changed to a processing unit (so-called “batch processing unit”) that processes a plurality of substrates W at once.

  (17) In the first and second embodiments described above, the processing units 5 and 6 perform the same processing, but the present invention is not limited to this. That is, the processing units 5 and 6 may be changed to perform different processes. Further, according to this change, the type of processing liquid supplied by the processing liquid supply device 11 may be changed as appropriate.

  (18) In the first and second embodiments described above, the processing units 5 and 6 perform a process of forming a resist film or the like on the substrate W and developing the substrate W. However, the processing units 5 and 6 The processing content is not limited to this. For example, the processing contents of the processing units 5 and 6 can be changed to various processing contents according to the substrate W to be processed.

  (19) In the first and second embodiments described above, the substrate processing apparatus 1 includes the two processing units 5 and 6, but is not limited thereto. That is, you may change so that three or more process parts may be provided.

  (20) You may change so that each structure of each Example mentioned above and each modification may be combined suitably.

DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus 3 ... Indexer part (ID part)
5, 6 ... processing section (substrate processing line)
7 ... Interface part (IF part)
8, 9... Processing unit 11... Processing liquid supply device 11, 11R, 11N... Processing liquid supply device 12, 12a, 12b.
13a, 13b, 17, 21, 21a, 21b, 26, 26a, 26b ... piping 17 ... collecting pipe 22, 22a, 22b, 27, 27a, 27b ... pump 23, 28, 63, 68, 73a, 73b, 78a, 78b ... Valve members 41, 42 ... Drawer unit (opening / closing mechanism)
43 ... partition wall 44 ... casing 51, 56 ... switch for processing section 61, 66 ... wiring for valve member S1, S2 ... installation space T ₁ , T ₂ ... main transport mechanism W ... substrate

Claims (14)

A processing liquid supply apparatus for supplying a processing liquid to a plurality of processing units having a processing unit,
A pump provided in association with each processing unit, for pumping the processing liquid toward the corresponding processing unit;
A plurality of valve members for opening and closing the flow path of the processing liquid on the primary side of the pump for each processing unit;
A processing liquid supply apparatus comprising: The processing liquid supply apparatus according to claim 1,
A processing liquid supply apparatus is provided with one valve member for each processing unit. The processing liquid supply apparatus according to claim 1,
The processing liquid supply apparatus is provided with one valve member for each pump. In the processing liquid supply apparatus in any one of Claim 1 to 3,
The primary side of the valve member corresponding to a different process part is the process liquid supply apparatus connected in communication with the same tank. The processing liquid supply apparatus according to any one of claims 1 to 4,
Each processing unit is configured so that it can be turned on and off individually.
A processing liquid supply apparatus that closes a valve member corresponding to a processing section when the power of the processing section is shut off. In the processing liquid supply apparatus in any one of Claim 1 to 5,
The valve member has a function of being in a closed state when the power is shut off,
A processing liquid supply apparatus that shuts off the power of a valve member corresponding to a processing unit when the power of the processing unit is shut off. In the processing liquid supply apparatus in any one of Claim 1 to 6,
Provided with a plurality of valve member wires for individually supplying power to the valve member according to the processing unit,
The power of each processing unit is individually turned on and off by a plurality of processing unit switches,
Each valve member wiring is a processing liquid supply apparatus electrically connected to the secondary side of the corresponding processing unit switch. In the processing liquid supply apparatus according to claim 7,
The valve member wiring is a processing liquid supply device that further supplies power to a pump corresponding to the same processing unit. In the processing liquid supply apparatus according to any one of claims 1 to 8,
Pumps corresponding to different processing units are processing liquid supply devices installed in different installation spaces. In the processing liquid supply apparatus in any one of Claim 1 to 9,
Pumps corresponding to the same processing unit are processing liquid supply devices installed in the same installation space. In the processing liquid supply apparatus according to claim 9 or 10,
Each processing space is a processing liquid supply device separated from each other. The processing liquid supply apparatus according to any one of claims 9 to 11,
A treatment liquid supply apparatus provided with a plurality of opening / closing mechanisms capable of individually opening each installation space. The processing liquid supply apparatus according to claim 12,
Each of the open / close mechanisms is a processing liquid supply apparatus capable of moving a pump disposed in a corresponding installation space to the outside of the casing of the processing liquid supply apparatus. A plurality of processing units having processing units;
The processing liquid supply apparatus according to any one of claims 1 to 13, wherein a processing liquid is supplied to each processing unit.
A substrate processing apparatus comprising:

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