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また、本発明のはんだフラックスは、鉛フリーはんだペースト用のはんだフラックスであって、前記常温域が２５〜４０℃であり、前記高温域が１８０〜２３０℃であるとよい。 本発明のはんだフラックスにおいて、前記イオン伝導率は、イオン伝導率測定装置によって測定されたものであり、前記イオン伝導率測定装置は、加熱したフラックスの温度及びイオン伝導率を連続的に測定可能な熱電対及び電気伝導率計とが備えられているとよい。Moreover, the solder flux of this invention is a solder flux for lead-free solder pastes, Comprising: It is good in the said normal temperature range being 25-40 degreeC and the said high temperature range being 180-230 degreeC. In the solder flux of the present invention, the ionic conductivity is measured by an ionic conductivity measuring device, and the ionic conductivity measuring device can continuously measure the temperature and ionic conductivity of the heated flux. A thermocouple and an electrical conductivity meter may be provided.
Claims (5)
作製するはんだペーストが保管ないし取扱われる常温域のイオン伝導率が０．０５ｍＳ／ｍ以下であり、且つリフローされる高温域のイオン伝導率が１．０ｍＳ／ｍ以上であることを特徴とするはんだフラックス。
Solder characterized in that the ionic conductivity in the normal temperature range where the solder paste to be produced is stored or handled is 0.05 mS / m or less and the ionic conductivity in the high temperature range to be reflowed is 1.0 mS / m or more. flux.
鉛フリーはんだペースト用のはんだフラックスであって、前記常温域が２５〜４０℃であり、前記高温域が１８０〜２３０℃であることを特徴とする請求項１記載のはんだフラックス。
The solder flux for a lead-free solder paste, wherein the normal temperature range is 25 to 40 ° C and the high temperature range is 180 to 230 ° C.
前記イオン伝導率は、イオン伝導率測定装置によって測定されたものであり、前記イオン伝導率測定装置は、加熱したフラックスの温度及びイオン伝導率を連続的に測定可能な熱電対及び電気伝導率計が備えられていることを特徴とする請求項１又は２記載のはんだフラックス。The ion conductivity is measured by an ion conductivity measuring device, and the ion conductivity measuring device is a thermocouple and an electric conductivity meter capable of continuously measuring the temperature of the heated flux and the ion conductivity. The solder flux according to claim 1, wherein the solder flux is provided.
請求項１から３のいずれか一項記載の前記はんだフラックスとＳｎを９５質量％以上含みＰｂを含まないはんだ合金粉末とを混合し、ペースト化したことを特徴とする鉛フリーはんだペースト。
A lead-free solder paste, wherein the solder flux according to any one of claims 1 to 3 and a solder alloy powder containing 95% by mass or more of Sn and not containing Pb are mixed to form a paste.
請求項４記載の前記はんだペーストを用いて電子部品を実装することを特徴とする実装基板の製造方法。
An electronic component is mounted using the solder paste according to claim 4 .
Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment
Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment